TWI924719B - 配線電路基板及配線電路基板之製造方法 - Google Patents

配線電路基板及配線電路基板之製造方法

Info

Publication number
TWI924719B
TWI924719B TW110141331A TW110141331A TWI924719B TW I924719 B TWI924719 B TW I924719B TW 110141331 A TW110141331 A TW 110141331A TW 110141331 A TW110141331 A TW 110141331A TW I924719 B TWI924719 B TW I924719B
Authority
TW
Taiwan
Prior art keywords
metal
layer
metal support
thin film
thickness direction
Prior art date
Application number
TW110141331A
Other languages
English (en)
Chinese (zh)
Other versions
TW202226908A (zh
Inventor
柴田周作
池田敬裕
新納鉄平
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW202226908A publication Critical patent/TW202226908A/zh
Application granted granted Critical
Publication of TWI924719B publication Critical patent/TWI924719B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4076—Through-connections; Vertical interconnect access [VIA] connections by thin-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
TW110141331A 2020-11-13 2021-11-05 配線電路基板及配線電路基板之製造方法 TWI924719B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-189117 2020-11-13
JP2020189117A JP7289602B2 (ja) 2020-11-13 2020-11-13 配線回路基板、および配線回路基板の製造方法

Publications (2)

Publication Number Publication Date
TW202226908A TW202226908A (zh) 2022-07-01
TWI924719B true TWI924719B (zh) 2026-05-11

Family

ID=81601082

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110141331A TWI924719B (zh) 2020-11-13 2021-11-05 配線電路基板及配線電路基板之製造方法

Country Status (6)

Country Link
US (1) US20240015884A1 (enExample)
JP (2) JP7289602B2 (enExample)
KR (1) KR20230106601A (enExample)
CN (1) CN116420431A (enExample)
TW (1) TWI924719B (enExample)
WO (1) WO2022102416A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7515339B2 (ja) * 2020-08-07 2024-07-12 日東電工株式会社 配線回路基板の製造方法、および配線回路基板
JP7870609B2 (ja) * 2021-10-29 2026-06-05 日東電工株式会社 配線回路基板およびその製造方法
US12464642B2 (en) 2022-06-15 2025-11-04 Nitto Denko Corporation Wiring circuit board and method of producing the wiring circuit board
JP2023183356A (ja) * 2022-06-15 2023-12-27 日東電工株式会社 配線回路基板、および、配線回路基板の製造方法
JP7875743B2 (ja) * 2022-06-23 2026-06-18 日東電工株式会社 配線回路基板
JP2024085656A (ja) 2022-12-15 2024-06-27 日東電工株式会社 配線回路基板
CN119364644B (zh) * 2024-12-24 2025-03-18 深圳市鑫荣进绝缘材料有限公司 铝基电路板制作方法及铝基电路板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01169990A (ja) * 1987-12-24 1989-07-05 Hitachi Cable Ltd 表面実装用基板
JPH0258899A (ja) * 1988-08-25 1990-02-28 Matsushita Electric Works Ltd プリント配線板
JPH1169990A (ja) 1997-06-19 1999-03-16 Givaudan Roure Internatl Sa バニリンの製造法
JP2016045971A (ja) * 2014-08-21 2016-04-04 日東電工株式会社 回路付サスペンション基板の製造方法
TW202005494A (zh) * 2018-05-31 2020-01-16 日商日東電工股份有限公司 配線電路基板、其製造方法及配線電路片材

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03133633A (ja) * 1989-10-20 1991-06-06 Nippon Steel Corp 鉄系プリント基板に適した鋼板
JP3953252B2 (ja) * 1999-02-23 2007-08-08 三井化学株式会社 クロメート系防錆膜の除去方法および配線基板の製造方法
JP3756041B2 (ja) * 1999-05-27 2006-03-15 Ｈｏｙａ株式会社 多層プリント配線板の製造方法
JP4448610B2 (ja) * 2000-10-18 2010-04-14 日東電工株式会社 回路基板の製造方法
JP3674927B2 (ja) * 2003-06-13 2005-07-27 Ｔｄｋ株式会社 電子部品の製造方法および電子部品
CN1771772B (zh) * 2004-02-04 2010-08-25 揖斐电株式会社 多层印刷电路板
JP4403090B2 (ja) * 2005-03-02 2010-01-20 日東電工株式会社 配線回路基板
JP4615427B2 (ja) 2005-12-01 2011-01-19 日東電工株式会社 配線回路基板
JP2009164492A (ja) * 2008-01-09 2009-07-23 Shinko Electric Ind Co Ltd 配線基板の製造方法
JP2009259357A (ja) * 2008-04-18 2009-11-05 Nitto Denko Corp 回路付サスペンション基板の製造方法
JP2012114217A (ja) * 2010-11-24 2012-06-14 Nitto Denko Corp 配線回路基板の製造方法
JP5335023B2 (ja) * 2011-04-05 2013-11-06 住友電気工業株式会社 プリント配線板の製造方法
JP5781877B2 (ja) * 2011-09-22 2015-09-24 日本特殊陶業株式会社 配線基板の製造方法
JP6324876B2 (ja) * 2014-07-16 2018-05-16 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
KR102608521B1 (ko) * 2016-05-27 2023-12-04 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
JP6621781B2 (ja) * 2017-08-10 2019-12-18 太陽誘電株式会社 集合プリント基板、プリント配線板の製造方法
JP7085328B2 (ja) * 2017-09-29 2022-06-16 日東電工株式会社 配線回路基板、その製造方法および撮像装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01169990A (ja) * 1987-12-24 1989-07-05 Hitachi Cable Ltd 表面実装用基板
JPH0258899A (ja) * 1988-08-25 1990-02-28 Matsushita Electric Works Ltd プリント配線板
JPH1169990A (ja) 1997-06-19 1999-03-16 Givaudan Roure Internatl Sa バニリンの製造法
JP2016045971A (ja) * 2014-08-21 2016-04-04 日東電工株式会社 回路付サスペンション基板の製造方法
TW202005494A (zh) * 2018-05-31 2020-01-16 日商日東電工股份有限公司 配線電路基板、其製造方法及配線電路片材

Also Published As

Publication number Publication date
JP7289602B2 (ja) 2023-06-12
KR20230106601A (ko) 2023-07-13
CN116420431A (zh) 2023-07-11
JP2023073270A (ja) 2023-05-25
JP2022078438A (ja) 2022-05-25
TW202226908A (zh) 2022-07-01
JP7538912B2 (ja) 2024-08-22
WO2022102416A1 (ja) 2022-05-19
US20240015884A1 (en) 2024-01-11

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