TWI907695B - 暫時固定組合物、暫時固定接著劑、接著體、硬化體、半導體晶圓之製造方法、構造體、及構造體之製造方法 - Google Patents

暫時固定組合物、暫時固定接著劑、接著體、硬化體、半導體晶圓之製造方法、構造體、及構造體之製造方法

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Publication number
TWI907695B
TWI907695B TW111115901A TW111115901A TWI907695B TW I907695 B TWI907695 B TW I907695B TW 111115901 A TW111115901 A TW 111115901A TW 111115901 A TW111115901 A TW 111115901A TW I907695 B TWI907695 B TW I907695B
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Taiwan
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component
composition
meth
temporary
mass
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TW111115901A
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Chinese (zh)
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TW202248231A (zh
Inventor
内田濱口留智
谷川星野貴子
稲葉恵
奥村広美
吉田準
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日商電化股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J135/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least another carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J135/02—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/12—Esters of phenols or saturated alcohols
    • C08F222/20—Esters containing oxygen in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5397—Phosphine oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2800/00—Copolymer characterised by the proportions of the comonomers expressed
    • C08F2800/20—Copolymer characterised by the proportions of the comonomers expressed as weight or mass percentages
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW111115901A 2021-04-26 2022-04-26 暫時固定組合物、暫時固定接著劑、接著體、硬化體、半導體晶圓之製造方法、構造體、及構造體之製造方法 TWI907695B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021074443 2021-04-26
JP2021-074443 2021-04-26

Publications (2)

Publication Number Publication Date
TW202248231A TW202248231A (zh) 2022-12-16
TWI907695B true TWI907695B (zh) 2025-12-11

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TW111115901A TWI907695B (zh) 2021-04-26 2022-04-26 暫時固定組合物、暫時固定接著劑、接著體、硬化體、半導體晶圓之製造方法、構造體、及構造體之製造方法

Country Status (7)

Country Link
US (1) US20240218215A1 (https=)
EP (1) EP4328279A4 (https=)
JP (2) JP7434666B2 (https=)
KR (1) KR102835889B1 (https=)
CN (1) CN117242146A (https=)
TW (1) TWI907695B (https=)
WO (1) WO2022230874A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023008789A (ja) * 2021-07-02 2023-01-19 日鉄ケミカル＆マテリアル株式会社 接着剤層形成用組成物、積層体、積層体の製造方法および積層体の処理方法
WO2023181609A1 (ja) * 2022-03-24 2023-09-28 デンカ株式会社 仮固定用組成物
WO2023181635A1 (ja) * 2022-03-24 2023-09-28 デンカ株式会社 仮固定用組成物
JPWO2024162049A1 (https=) * 2023-01-31 2024-08-08
CN120641516A (zh) * 2023-01-31 2025-09-12 电化株式会社 临时固定用组合物、临时固定用粘接剂以及薄型晶片的制造方法
CN120641517A (zh) * 2023-01-31 2025-09-12 电化株式会社 抑制气泡残留的临时固定用组合物
KR20250144436A (ko) * 2023-03-10 2025-10-10 덴카 주식회사 판형 기재의 가공 방법
TW202602960A (zh) * 2024-03-14 2026-01-16 日商電化股份有限公司 組合物、暫時固定用組合物、及使用其之晶圓之製造方法
KR102851651B1 (ko) * 2024-12-05 2025-08-28 솔루스첨단소재 주식회사 광경화성 아크릴 수지 조성물 및 이의 경화물
CN121343546A (zh) * 2025-12-18 2026-01-16 深圳好电科技有限公司 临时键合胶及其应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010079958A (ja) * 2008-09-24 2010-04-08 Sekisui Chem Co Ltd 仮接着用接着剤
JP2014091774A (ja) * 2012-11-02 2014-05-19 Denki Kagaku Kogyo Kk （メタ）アクリル系樹脂組成物及び接着・解体方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4565804B2 (ja) * 2002-06-03 2010-10-20 スリーエム イノベイティブ プロパティズ カンパニー 被研削基材を含む積層体、その製造方法並びに積層体を用いた極薄基材の製造方法及びそのための装置
JP4593328B2 (ja) * 2005-03-18 2010-12-08 電気化学工業株式会社 仮固定用接着剤組成物及び仮固定方法
US8187411B2 (en) * 2005-03-18 2012-05-29 Denki Kagaku Kogyo Kabushiki Kaisha Adherent composition and method of temporarily fixing member therewith
JP2006328104A (ja) 2005-05-23 2006-12-07 Jsr Corp 接着剤組成物
JP2007197517A (ja) 2006-01-24 2007-08-09 Three M Innovative Properties Co 接着性封止組成物、封止フィルム及び有機ｅｌ素子
JP5404992B2 (ja) 2006-03-20 2014-02-05 電気化学工業株式会社 仮固定用組成物、部材の仮固定方法とそれに用いる基材
WO2009148722A2 (en) 2008-06-02 2009-12-10 3M Innovative Properties Company Adhesive encapsulating composition and electronic devices made therewith
JP5675355B2 (ja) * 2008-07-22 2015-02-25 電気化学工業株式会社 部材の仮固定・剥離方法及びそれに好適な仮固定用接着剤
JP5362291B2 (ja) 2008-08-26 2013-12-11 日東電工株式会社 アクリル系粘着剤組成物、アクリル系粘着剤層およびアクリル系粘着テープ又はシート
JP5350055B2 (ja) * 2009-04-14 2013-11-27 電気化学工業株式会社 接着剤用（メタ）アクリル系樹脂組成物
US8366873B2 (en) 2010-04-15 2013-02-05 Suss Microtec Lithography, Gmbh Debonding equipment and methods for debonding temporary bonded wafers
JP5570832B2 (ja) 2010-01-29 2014-08-13 富士フイルム株式会社 着色硬化性組成物、カラーフィルタ及びその製造方法、並びに固体撮像素子
JP5731137B2 (ja) 2010-06-15 2015-06-10 電気化学工業株式会社 エキシマ光照射による接着体の解体方法
TW201317315A (zh) * 2011-08-26 2013-05-01 Denki Kagaku Kogyo Kk 固化性樹脂組成物
KR101381118B1 (ko) * 2011-11-04 2014-04-04 제일모직주식회사 이방 전도성 접착 필름용 조성물 및 이를 이용한 이방 전도성 접착 필름
JP6140441B2 (ja) 2012-12-27 2017-05-31 富士フイルム株式会社 半導体装置製造用仮接着剤、並びに、それを用いた接着性支持体、及び、半導体装置の製造方法
JP6377956B2 (ja) 2013-05-24 2018-08-22 タツモ株式会社 剥離装置
JP2016030702A (ja) * 2014-07-25 2016-03-07 サンライズ・エム・エス・アイ株式会社 タッチパネル等に用いるガラス基盤の製造方法
JP6156443B2 (ja) 2014-08-13 2017-07-05 Jsr株式会社 積層体および基材の処理方法
CN107428890B (zh) * 2015-04-22 2020-12-22 电化株式会社 组合物
JP2017226785A (ja) 2016-06-23 2017-12-28 東ソー株式会社 活性エネルギー線硬化型複合樹脂組成物、及び該組成物を用いた活性エネルギー線硬化型複合樹脂接着剤、又は光学部材接合用粘着テープ
CN112789305B (zh) 2018-10-18 2023-08-15 三键有限公司 光固性组合物
EP3651182A1 (en) 2018-11-12 2020-05-13 FEI Company Charged particle microscope for examining a specimen, and method of determining an aberration of said charged particle microscope
CN113056533B (zh) * 2018-11-14 2022-10-11 电化株式会社 组合物
WO2021132049A1 (ja) * 2019-12-27 2021-07-01 ホヤ レンズ タイランド リミテッド フォトクロミック物品の保護層形成用重合性組成物、フォトクロミック物品および眼鏡
WO2021235406A1 (ja) * 2020-05-21 2021-11-25 デンカ株式会社 組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010079958A (ja) * 2008-09-24 2010-04-08 Sekisui Chem Co Ltd 仮接着用接着剤
JP2014091774A (ja) * 2012-11-02 2014-05-19 Denki Kagaku Kogyo Kk （メタ）アクリル系樹脂組成物及び接着・解体方法

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JP2024009973A (ja) 2024-01-23
KR20230156137A (ko) 2023-11-13
EP4328279A1 (en) 2024-02-28
JPWO2022230874A1 (https=) 2022-11-03
WO2022230874A1 (ja) 2022-11-03
TW202248231A (zh) 2022-12-16
US20240218215A1 (en) 2024-07-04
KR102835889B1 (ko) 2025-07-21
CN117242146A (zh) 2023-12-15
JP7717769B2 (ja) 2025-08-04
JP7434666B2 (ja) 2024-02-20
EP4328279A4 (en) 2024-10-23

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