TWI889814B - 環氧丙烯酸酯樹脂、鹼可溶性樹脂、含有其的樹脂組成物及其固化物 - Google Patents

環氧丙烯酸酯樹脂、鹼可溶性樹脂、含有其的樹脂組成物及其固化物

Info

Publication number
TWI889814B
TWI889814B TW110115838A TW110115838A TWI889814B TW I889814 B TWI889814 B TW I889814B TW 110115838 A TW110115838 A TW 110115838A TW 110115838 A TW110115838 A TW 110115838A TW I889814 B TWI889814 B TW I889814B
Authority
TW
Taiwan
Prior art keywords
resin
parts
group
resin composition
alkali
Prior art date
Application number
TW110115838A
Other languages
English (en)
Chinese (zh)
Other versions
TW202146505A (zh
Inventor
宗正浩
石原一男
煥
林淸來
Original Assignee
日商日鐵化學材料股份有限公司
南韓商國都化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日鐵化學材料股份有限公司, 南韓商國都化學股份有限公司 filed Critical 日商日鐵化學材料股份有限公司
Publication of TW202146505A publication Critical patent/TW202146505A/zh
Application granted granted Critical
Publication of TWI889814B publication Critical patent/TWI889814B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C08F290/144—Polymers containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)
  • Polymerization Catalysts (AREA)
  • Graft Or Block Polymers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW110115838A 2020-05-12 2021-05-03 環氧丙烯酸酯樹脂、鹼可溶性樹脂、含有其的樹脂組成物及其固化物 TWI889814B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020083923 2020-05-12
JP2020-083923 2020-05-12

Publications (2)

Publication Number Publication Date
TW202146505A TW202146505A (zh) 2021-12-16
TWI889814B true TWI889814B (zh) 2025-07-11

Family

ID=78525743

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110115838A TWI889814B (zh) 2020-05-12 2021-05-03 環氧丙烯酸酯樹脂、鹼可溶性樹脂、含有其的樹脂組成物及其固化物

Country Status (5)

Country Link
JP (2) JPWO2021230097A1 (https=)
KR (1) KR20230008105A (https=)
CN (1) CN115551914B (https=)
TW (1) TWI889814B (https=)
WO (1) WO2021230097A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250042120A (ko) * 2022-07-22 2025-03-26 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 다관능 비닐 수지, 그 제조 방법, 다관능 비닐 수지 조성물 및 그 경화물
CN116887527A (zh) * 2023-05-09 2023-10-13 深圳市撒比斯科技有限公司 一种感光型集成电路堆积绝缘膜的制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05214048A (ja) * 1992-01-31 1993-08-24 Nippon Oil Co Ltd 光硬化性樹脂組成物およびソルダーレジスト用光硬化性樹脂組成物
TW200424773A (en) * 2003-03-12 2004-11-16 Mitsubishi Chem Corp Photosensitive composition, photosensitive colored compositions, color filters, and liquid crystal displays

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61243869A (ja) 1985-04-19 1986-10-30 Taiyo Ink Seizo Kk レジストインキ組成物
JPS6289719A (ja) * 1985-10-15 1987-04-24 Sanyo Kokusaku Pulp Co Ltd 新規ビニルエステル樹脂およびその製造法
JP2764480B2 (ja) 1991-05-17 1998-06-11 日本化薬株式会社 カラーフィルター用光重合組成物
JP3813244B2 (ja) 1996-06-07 2006-08-23 新日鐵化学株式会社 アルカリ現像性不飽和樹脂組成物及びこれを用いた高感度ネガ型パターン形成材料
JPH101596A (ja) * 1996-06-19 1998-01-06 Dainippon Ink & Chem Inc 多層プリント配線板用層間電気絶縁材料
JP2002220425A (ja) * 2001-01-25 2002-08-09 Nippon Kayaku Co Ltd 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
JP4426123B2 (ja) * 2001-01-31 2010-03-03 昭和高分子株式会社 硬化性樹脂および硬化性樹脂組成物
JP4812974B2 (ja) 2001-07-12 2011-11-09 新日鐵化学株式会社 硬化性樹脂、硬化性樹脂組成物及びその硬化物
CN101017324A (zh) * 2003-03-12 2007-08-15 三菱化学株式会社 光敏组合物、光敏着色组合物、滤色器和液晶显示设备
JP2005239817A (ja) * 2004-02-25 2005-09-08 Dainippon Ink & Chem Inc 酸ペンダント型エポキシアクリレート樹脂の製造方法および硬化性樹脂組成物
JP2006350153A (ja) * 2005-06-20 2006-12-28 Mitsubishi Chemicals Corp 感光性組成物、感光性着色成物、カラーフィルタ、及び液晶表示装置
JP5142175B2 (ja) * 2005-07-07 2013-02-13 日本化薬株式会社 エポキシ樹脂、感光性樹脂及び感光性樹脂組成物
JP5255813B2 (ja) * 2007-10-19 2013-08-07 Ｊｆｅケミカル株式会社 ジシクロペンタジエン類変性フェノール樹脂の製造方法および未反応フェノール類の再利用方法
CN107540816B (zh) * 2016-06-23 2020-09-22 南亚塑胶工业股份有限公司 二环戊二烯-酚与2,6-二甲基苯酚的共聚物环氧树脂的制备与应用
JP7132784B2 (ja) * 2018-07-26 2022-09-07 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂組成物、プリプレグ、積層板およびプリント配線板
US11884773B2 (en) * 2018-12-19 2024-01-30 Nippon Steel Chemical & Material Co., Ltd. Phenolic resin, epoxy resin, epoxy resin composition and cured product of same
JP7479130B2 (ja) * 2019-09-20 2024-05-08 日鉄ケミカル＆マテリアル株式会社 エポキシアクリレート樹脂、アルカリ可溶性樹脂、それを含む樹脂組成物及びその硬化物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05214048A (ja) * 1992-01-31 1993-08-24 Nippon Oil Co Ltd 光硬化性樹脂組成物およびソルダーレジスト用光硬化性樹脂組成物
TW200424773A (en) * 2003-03-12 2004-11-16 Mitsubishi Chem Corp Photosensitive composition, photosensitive colored compositions, color filters, and liquid crystal displays

Also Published As

Publication number Publication date
JP2025020271A (ja) 2025-02-12
WO2021230097A1 (ja) 2021-11-18
CN115551914B (zh) 2025-06-27
JPWO2021230097A1 (https=) 2021-11-18
KR20230008105A (ko) 2023-01-13
TW202146505A (zh) 2021-12-16
CN115551914A (zh) 2022-12-30

Similar Documents

Publication Publication Date Title
JP6482176B2 (ja) 絶縁膜用感光性樹脂組成物及び硬化物
JP7479130B2 (ja) エポキシアクリレート樹脂、アルカリ可溶性樹脂、それを含む樹脂組成物及びその硬化物
CN115551915B (zh) 含有聚合性不饱和基的碱可溶性树脂及其制造方法、以及感光性树脂组合物及其硬化物
JP2025020271A (ja) エポキシアクリレート樹脂、アルカリ可溶性樹脂、それを含む樹脂組成物及びその硬化物
JP5875519B2 (ja) 感光性樹脂及び該感光性樹脂を含む感光性樹脂組成物の製造方法
CN104059217A (zh) 环氧丙烯酸酯树脂及其制造方法、酸酐加成物、组合物及硬化物
TWI863902B (zh) 含有不飽和基的鹼可溶性樹脂、以其作為必須成分的感光性樹脂組成物及其硬化物
TWI793289B (zh) 含有聚合性不飽和基的鹼可溶性樹脂的製造方法、含有聚合性不飽和基的鹼可溶性樹脂、以其作為必須成分的感光性樹脂組成物以及其硬化膜
JP5356211B2 (ja) 感光性樹脂の製造方法、その製造方法から得られる感光性樹脂および感光性樹脂組成物
TWI864106B (zh) 環氧丙烯酸酯樹脂、鹼可溶性樹脂、鹼可溶性樹脂的製造方法、含有鹼可溶性樹脂的樹脂組成物及其硬化物
JP7368162B2 (ja) 重合性不飽和基含有アルカリ可溶性樹脂、その製造方法、感光性樹脂組成物、及びその硬化膜。
KR102162595B1 (ko) 절연막용 감광성 수지 조성물 및 경화물
JPWO2002018313A1 (ja) オキセタン変性化合物とそれから誘導される光硬化性化合物、それらの製造方法及びそれらを含有する硬化性組成物
JP2015010122A (ja) エポキシアクリレート樹脂、その製造方法、その酸無水物付加体、これらを含む樹脂組成物、及びこの硬化物
CN115877660A (zh) 感光性树脂组合物、树脂硬化膜、半导体封装及印刷配线基板