KR20230008105A - 에폭시아크릴레이트 수지, 알칼리 가용성 수지, 그것을 포함하는 수지 조성물 및 그 경화물 - Google Patents
에폭시아크릴레이트 수지, 알칼리 가용성 수지, 그것을 포함하는 수지 조성물 및 그 경화물 Download PDFInfo
- Publication number
- KR20230008105A KR20230008105A KR1020227040044A KR20227040044A KR20230008105A KR 20230008105 A KR20230008105 A KR 20230008105A KR 1020227040044 A KR1020227040044 A KR 1020227040044A KR 20227040044 A KR20227040044 A KR 20227040044A KR 20230008105 A KR20230008105 A KR 20230008105A
- Authority
- KR
- South Korea
- Prior art keywords
- group
- resin
- parts
- alkali
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
- C08F290/144—Polymers containing more than one epoxy group per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Chemical & Material Sciences (AREA)
- Epoxy Resins (AREA)
- Materials For Photolithography (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Polymerisation Methods In General (AREA)
- Polymerization Catalysts (AREA)
- Graft Or Block Polymers (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020083923 | 2020-05-12 | ||
| JPJP-P-2020-083923 | 2020-05-12 | ||
| PCT/JP2021/017135 WO2021230097A1 (ja) | 2020-05-12 | 2021-04-30 | エポキシアクリレート樹脂、アルカリ可溶性樹脂、それを含む樹脂組成物及びその硬化物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20230008105A true KR20230008105A (ko) | 2023-01-13 |
Family
ID=78525743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020227040044A Ceased KR20230008105A (ko) | 2020-05-12 | 2021-04-30 | 에폭시아크릴레이트 수지, 알칼리 가용성 수지, 그것을 포함하는 수지 조성물 및 그 경화물 |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JPWO2021230097A1 (https=) |
| KR (1) | KR20230008105A (https=) |
| CN (1) | CN115551914B (https=) |
| TW (1) | TWI889814B (https=) |
| WO (1) | WO2021230097A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20250042120A (ko) * | 2022-07-22 | 2025-03-26 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | 다관능 비닐 수지, 그 제조 방법, 다관능 비닐 수지 조성물 및 그 경화물 |
| CN116887527A (zh) * | 2023-05-09 | 2023-10-13 | 深圳市撒比斯科技有限公司 | 一种感光型集成电路堆积绝缘膜的制备方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61243869A (ja) | 1985-04-19 | 1986-10-30 | Taiyo Ink Seizo Kk | レジストインキ組成物 |
| JPH04340965A (ja) | 1991-05-17 | 1992-11-27 | Nippon Kayaku Co Ltd | カラーフィルター用光重合組成物 |
| JPH09325494A (ja) | 1996-06-07 | 1997-12-16 | Nippon Steel Chem Co Ltd | アルカリ現像性不飽和樹脂組成物及びこれを用いた高感度ネガ型パターン形成材料 |
| JP2003026762A (ja) | 2001-07-12 | 2003-01-29 | Nippon Steel Chem Co Ltd | 硬化性樹脂、硬化性樹脂組成物及びその硬化物 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6289719A (ja) * | 1985-10-15 | 1987-04-24 | Sanyo Kokusaku Pulp Co Ltd | 新規ビニルエステル樹脂およびその製造法 |
| JP2931860B2 (ja) * | 1992-01-31 | 1999-08-09 | 日石三菱株式会社 | 光硬化性樹脂組成物およびソルダーレジスト用光硬化性樹脂組成物 |
| JPH101596A (ja) * | 1996-06-19 | 1998-01-06 | Dainippon Ink & Chem Inc | 多層プリント配線板用層間電気絶縁材料 |
| JP2002220425A (ja) * | 2001-01-25 | 2002-08-09 | Nippon Kayaku Co Ltd | 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物 |
| JP4426123B2 (ja) * | 2001-01-31 | 2010-03-03 | 昭和高分子株式会社 | 硬化性樹脂および硬化性樹脂組成物 |
| CN101017324A (zh) * | 2003-03-12 | 2007-08-15 | 三菱化学株式会社 | 光敏组合物、光敏着色组合物、滤色器和液晶显示设备 |
| JP3938375B2 (ja) * | 2003-03-12 | 2007-06-27 | 三菱化学株式会社 | 感光性着色組成物、カラーフィルタ、及び液晶表示装置 |
| JP2005239817A (ja) * | 2004-02-25 | 2005-09-08 | Dainippon Ink & Chem Inc | 酸ペンダント型エポキシアクリレート樹脂の製造方法および硬化性樹脂組成物 |
| JP2006350153A (ja) * | 2005-06-20 | 2006-12-28 | Mitsubishi Chemicals Corp | 感光性組成物、感光性着色成物、カラーフィルタ、及び液晶表示装置 |
| JP5142175B2 (ja) * | 2005-07-07 | 2013-02-13 | 日本化薬株式会社 | エポキシ樹脂、感光性樹脂及び感光性樹脂組成物 |
| JP5255813B2 (ja) * | 2007-10-19 | 2013-08-07 | Jfeケミカル株式会社 | ジシクロペンタジエン類変性フェノール樹脂の製造方法および未反応フェノール類の再利用方法 |
| CN107540816B (zh) * | 2016-06-23 | 2020-09-22 | 南亚塑胶工业股份有限公司 | 二环戊二烯-酚与2,6-二甲基苯酚的共聚物环氧树脂的制备与应用 |
| JP7132784B2 (ja) * | 2018-07-26 | 2022-09-07 | 日鉄ケミカル&マテリアル株式会社 | エポキシ樹脂組成物、プリプレグ、積層板およびプリント配線板 |
| US11884773B2 (en) * | 2018-12-19 | 2024-01-30 | Nippon Steel Chemical & Material Co., Ltd. | Phenolic resin, epoxy resin, epoxy resin composition and cured product of same |
| JP7479130B2 (ja) * | 2019-09-20 | 2024-05-08 | 日鉄ケミカル&マテリアル株式会社 | エポキシアクリレート樹脂、アルカリ可溶性樹脂、それを含む樹脂組成物及びその硬化物 |
-
2021
- 2021-04-30 JP JP2022521835A patent/JPWO2021230097A1/ja active Pending
- 2021-04-30 KR KR1020227040044A patent/KR20230008105A/ko not_active Ceased
- 2021-04-30 WO PCT/JP2021/017135 patent/WO2021230097A1/ja not_active Ceased
- 2021-04-30 CN CN202180034251.XA patent/CN115551914B/zh active Active
- 2021-05-03 TW TW110115838A patent/TWI889814B/zh active
-
2024
- 2024-10-31 JP JP2024191969A patent/JP2025020271A/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61243869A (ja) | 1985-04-19 | 1986-10-30 | Taiyo Ink Seizo Kk | レジストインキ組成物 |
| JPH04340965A (ja) | 1991-05-17 | 1992-11-27 | Nippon Kayaku Co Ltd | カラーフィルター用光重合組成物 |
| JPH09325494A (ja) | 1996-06-07 | 1997-12-16 | Nippon Steel Chem Co Ltd | アルカリ現像性不飽和樹脂組成物及びこれを用いた高感度ネガ型パターン形成材料 |
| JP2003026762A (ja) | 2001-07-12 | 2003-01-29 | Nippon Steel Chem Co Ltd | 硬化性樹脂、硬化性樹脂組成物及びその硬化物 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2025020271A (ja) | 2025-02-12 |
| WO2021230097A1 (ja) | 2021-11-18 |
| TWI889814B (zh) | 2025-07-11 |
| CN115551914B (zh) | 2025-06-27 |
| JPWO2021230097A1 (https=) | 2021-11-18 |
| TW202146505A (zh) | 2021-12-16 |
| CN115551914A (zh) | 2022-12-30 |
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