TWI866997B - 樹脂膜、覆金屬積層體及其製造方法 - Google Patents
樹脂膜、覆金屬積層體及其製造方法 Download PDFInfo
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- TWI866997B TWI866997B TW109121530A TW109121530A TWI866997B TW I866997 B TWI866997 B TW I866997B TW 109121530 A TW109121530 A TW 109121530A TW 109121530 A TW109121530 A TW 109121530A TW I866997 B TWI866997 B TW I866997B
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| KR20230098789A (ko) * | 2020-11-10 | 2023-07-04 | 도요보 가부시키가이샤 | 폴리이미드 필름 및 그 제조 방법 |
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| JP2023020715A (ja) * | 2021-07-30 | 2023-02-09 | 日鉄ケミカル＆マテリアル株式会社 | 金属張積層体及びその製造方法並びに回路基板 |
| JP2023097389A (ja) | 2021-12-27 | 2023-07-07 | 日鉄ケミカル＆マテリアル株式会社 | 樹脂積層体、金属張積層板、回路基板、電子デバイス及び電子機器 |
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| JP6016561B2 (ja) * | 2012-09-28 | 2016-10-26 | 旭化成株式会社 | ポリイミド前駆体及びそれを含有する樹脂組成物、ポリイミドフィルム及びその製造方法、並びに、積層体及びその製造方法 |
| JP2017014380A (ja) * | 2015-06-30 | 2017-01-19 | Ｊｘエネルギー株式会社 | ポリイミドフィルム、有機エレクトロルミネッセンス素子、透明導電性積層体、タッチパネル、太陽電池、及び、表示装置 |
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| US10844175B2 (en) * | 2016-03-17 | 2020-11-24 | Nippon Steel Chemical & Material Co., Ltd. | Polyamide acid, thermoplastic polyimide, resin film, metal-clad laminate and circuit board |
| JP6890999B2 (ja) * | 2016-08-10 | 2021-06-18 | 日鉄ケミカル＆マテリアル株式会社 | ポリイミド前駆体及びポリイミド |
| KR101899902B1 (ko) * | 2016-08-23 | 2018-09-18 | 주식회사 대림코퍼레이션 | 수지안정성, 내열성이 향상되고 투명성을 갖는 폴리이미드 전구체 수지 조성물, 이를 이용한 폴리이미드 필름 제조방법, 및 이에 의해 제조된 폴리이미드 필름 |
| JP6936239B2 (ja) * | 2016-09-29 | 2021-09-15 | 日鉄ケミカル＆マテリアル株式会社 | ポリイミドフィルム、銅張積層板及び回路基板 |
| JP7039214B2 (ja) * | 2017-02-03 | 2022-03-22 | 東京応化工業株式会社 | ポリイミド前駆体組成物 |
| WO2018221607A1 (ja) * | 2017-05-31 | 2018-12-06 | 宇部興産株式会社 | ポリイミドフィルム |
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