TWI834180B - 探針器控制裝置、探針器控制方法及探針器 - Google Patents

探針器控制裝置、探針器控制方法及探針器 Download PDF

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Publication number
TWI834180B
TWI834180B TW111120393A TW111120393A TWI834180B TW I834180 B TWI834180 B TW I834180B TW 111120393 A TW111120393 A TW 111120393A TW 111120393 A TW111120393 A TW 111120393A TW I834180 B TWI834180 B TW I834180B
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TW
Taiwan
Prior art keywords
probe
input data
aforementioned
unit
wafer
Prior art date
Application number
TW111120393A
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English (en)
Chinese (zh)
Other versions
TW202303791A (zh
Inventor
吉田徹夫
大竹俊輔
松岡達也
Original Assignee
日商東京精密股份有限公司
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Application filed by 日商東京精密股份有限公司 filed Critical 日商東京精密股份有限公司
Publication of TW202303791A publication Critical patent/TW202303791A/zh
Application granted granted Critical
Publication of TWI834180B publication Critical patent/TWI834180B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/0675—Needle-like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Software Systems (AREA)
  • Medical Informatics (AREA)
  • Evolutionary Computation (AREA)
  • Data Mining & Analysis (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Computing Systems (AREA)
  • Mathematical Physics (AREA)
  • Artificial Intelligence (AREA)
  • Geometry (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Robotics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW111120393A 2021-06-04 2022-06-01 探針器控制裝置、探針器控制方法及探針器 TWI834180B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-094056 2021-06-04
JP2021094056A JP7727169B2 (ja) 2021-06-04 2021-06-04 プローバ制御装置、プローバ制御方法、及びプローバ

Publications (2)

Publication Number Publication Date
TW202303791A TW202303791A (zh) 2023-01-16
TWI834180B true TWI834180B (zh) 2024-03-01

Family

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Family Applications (1)

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TW111120393A TWI834180B (zh) 2021-06-04 2022-06-01 探針器控制裝置、探針器控制方法及探針器

Country Status (6)

Country Link
US (1) US12007413B2 (https=)
JP (2) JP7727169B2 (https=)
KR (1) KR102731815B1 (https=)
CN (1) CN117425953B (https=)
TW (1) TWI834180B (https=)
WO (1) WO2022255030A1 (https=)

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JP7422340B1 (ja) 2022-11-21 2024-01-26 パナソニックＩｐマネジメント株式会社 文字認識装置、文字認識方法
JP7467824B1 (ja) * 2022-12-06 2024-04-16 株式会社東京精密 温度制御装置、温度制御方法、プログラム、プローバ及び学習モデル生成方法
CN116504664A (zh) * 2023-06-28 2023-07-28 东莞市兆恒机械有限公司 一种晶圆检测方法、检测装置及检测系统
CN116500426B (zh) * 2023-06-28 2023-09-05 东莞市兆恒机械有限公司 一种半导体检测设备高温测试标定的方法
JP2025034908A (ja) * 2023-08-31 2025-03-13 株式会社アドバンテスト 半導体ウェハハンドリング装置及び半導体ウェハ試験システム
CN118625098A (zh) * 2024-05-29 2024-09-10 深圳米飞泰克科技股份有限公司 测试系统、测试方法、测试设备及存储介质
CN119536207B (zh) * 2024-10-21 2026-04-10 中国第一汽车股份有限公司 车辆芯片测试方法、装置、电子设备及存储介质

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JP2007311389A (ja) * 2006-05-16 2007-11-29 Tokyo Seimitsu Co Ltd プローバ及びプローブ接触方法
US20150192616A1 (en) * 2012-06-13 2015-07-09 Taiwan Semiconductor Manufacturing Company, Ltd. Method of Test Probe Alignment Control
JP2018117095A (ja) * 2017-01-20 2018-07-26 株式会社東京精密 プローバ及びプローブ針の接触方法

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JP2007311389A (ja) * 2006-05-16 2007-11-29 Tokyo Seimitsu Co Ltd プローバ及びプローブ接触方法
US20150192616A1 (en) * 2012-06-13 2015-07-09 Taiwan Semiconductor Manufacturing Company, Ltd. Method of Test Probe Alignment Control
JP2018117095A (ja) * 2017-01-20 2018-07-26 株式会社東京精密 プローバ及びプローブ針の接触方法

Also Published As

Publication number Publication date
JP7727169B2 (ja) 2025-08-21
JP2022186039A (ja) 2022-12-15
KR102731815B1 (ko) 2024-11-20
TW202303791A (zh) 2023-01-16
JP2025160453A (ja) 2025-10-22
CN117425953A (zh) 2024-01-19
US20240094254A1 (en) 2024-03-21
WO2022255030A1 (ja) 2022-12-08
CN117425953B (zh) 2024-11-08
KR20230170802A (ko) 2023-12-19
US12007413B2 (en) 2024-06-11

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