KR102731815B1 - 프로버 제어 장치, 프로버 제어 방법, 및 프로버 - Google Patents

프로버 제어 장치, 프로버 제어 방법, 및 프로버 Download PDF

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Publication number
KR102731815B1
KR102731815B1 KR1020237041608A KR20237041608A KR102731815B1 KR 102731815 B1 KR102731815 B1 KR 102731815B1 KR 1020237041608 A KR1020237041608 A KR 1020237041608A KR 20237041608 A KR20237041608 A KR 20237041608A KR 102731815 B1 KR102731815 B1 KR 102731815B1
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South Korea
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input data
unit
probe needle
prediction
prober
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Korean (ko)
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KR20230170802A (ko
Inventor
데츠오 요시다
슌스케 오타케
šœ스케 오타케
다츠야 마츠오카
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가부시키가이샤 도교 세이미쓰
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Publication of KR102731815B1 publication Critical patent/KR102731815B1/ko
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/0675—Needle-like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Software Systems (AREA)
  • Medical Informatics (AREA)
  • Evolutionary Computation (AREA)
  • Data Mining & Analysis (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Computing Systems (AREA)
  • Mathematical Physics (AREA)
  • Artificial Intelligence (AREA)
  • Geometry (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Robotics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1020237041608A 2021-06-04 2022-05-09 프로버 제어 장치, 프로버 제어 방법, 및 프로버 Active KR102731815B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-094056 2021-06-04
JP2021094056A JP7727169B2 (ja) 2021-06-04 2021-06-04 プローバ制御装置、プローバ制御方法、及びプローバ
PCT/JP2022/019630 WO2022255030A1 (ja) 2021-06-04 2022-05-09 プローバ制御装置、プローバ制御方法、及びプローバ

Publications (2)

Publication Number Publication Date
KR20230170802A KR20230170802A (ko) 2023-12-19
KR102731815B1 true KR102731815B1 (ko) 2024-11-20

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KR1020237041608A Active KR102731815B1 (ko) 2021-06-04 2022-05-09 프로버 제어 장치, 프로버 제어 방법, 및 프로버

Country Status (6)

Country Link
US (1) US12007413B2 (https=)
JP (2) JP7727169B2 (https=)
KR (1) KR102731815B1 (https=)
CN (1) CN117425953B (https=)
TW (1) TWI834180B (https=)
WO (1) WO2022255030A1 (https=)

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Publication number Priority date Publication date Assignee Title
JP7422340B1 (ja) 2022-11-21 2024-01-26 パナソニックＩｐマネジメント株式会社 文字認識装置、文字認識方法
JP7467824B1 (ja) * 2022-12-06 2024-04-16 株式会社東京精密 温度制御装置、温度制御方法、プログラム、プローバ及び学習モデル生成方法
CN116504664A (zh) * 2023-06-28 2023-07-28 东莞市兆恒机械有限公司 一种晶圆检测方法、检测装置及检测系统
CN116500426B (zh) * 2023-06-28 2023-09-05 东莞市兆恒机械有限公司 一种半导体检测设备高温测试标定的方法
JP2025034908A (ja) * 2023-08-31 2025-03-13 株式会社アドバンテスト 半導体ウェハハンドリング装置及び半導体ウェハ試験システム
CN118625098A (zh) * 2024-05-29 2024-09-10 深圳米飞泰克科技股份有限公司 测试系统、测试方法、测试设备及存储介质
CN119536207B (zh) * 2024-10-21 2026-04-10 中国第一汽车股份有限公司 车辆芯片测试方法、装置、电子设备及存储介质

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JP2009524050A (ja) 2006-01-18 2009-06-25 エレクトログラス・インコーポレーテッド 動的なプローブ調節の方法及び装置
KR101169830B1 (ko) 2005-09-22 2012-07-30 도쿄엘렉트론가부시키가이샤 웨이퍼 검사 장치와 웨이퍼 검사 방법, 및 컴퓨터 판독가능한 기록 매체
US20150192616A1 (en) 2012-06-13 2015-07-09 Taiwan Semiconductor Manufacturing Company, Ltd. Method of Test Probe Alignment Control
US20190277913A1 (en) 2018-03-09 2019-09-12 Streammosaic, Inc. Failure detection and classsification using sensor data and/or measurement data
US20200388545A1 (en) 2018-03-27 2020-12-10 Pdf Solutions, Inc. Maintenance scheduling for semiconductor manufacturing equipment

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US6096567A (en) * 1997-12-01 2000-08-01 Electroglas, Inc. Method and apparatus for direct probe sensing
JP2005228788A (ja) 2004-02-10 2005-08-25 Seiko Epson Corp ウエーハとプローブカードとの位置合わせ方法、プローブ検査方法及びプローブ検査装置
JP4589710B2 (ja) 2004-12-13 2010-12-01 株式会社日本マイクロニクス プローバ
JP4936788B2 (ja) 2006-05-16 2012-05-23 株式会社東京精密 プローバ及びプローブ接触方法
JP4744382B2 (ja) * 2006-07-20 2011-08-10 株式会社東京精密 プローバ及びプローブ接触方法
CN101996856A (zh) * 2009-08-26 2011-03-30 中芯国际集成电路制造(上海)有限公司 晶圆可接受测试的实时监控方法
JP6462296B2 (ja) * 2014-09-30 2019-01-30 東京エレクトロン株式会社 位置精度検査方法、位置精度検査装置及び位置検査ユニット
JP6821910B2 (ja) * 2017-01-20 2021-01-27 株式会社東京精密 プローバ及びプローブ針の接触方法
WO2019008726A1 (ja) 2017-07-06 2019-01-10 オリンパス株式会社 管状挿入装置
KR102132785B1 (ko) 2017-08-31 2020-07-13 가부시끼가이샤 히다치 세이사꾸쇼 계산기, 처리의 제어 파라미터의 결정 방법, 대용 시료, 계측 시스템, 및 계측 방법
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JP7090517B2 (ja) * 2018-09-20 2022-06-24 東京エレクトロン株式会社 検査装置及び検査方法
CN111223786B (zh) * 2018-11-27 2023-10-27 东京毅力科创株式会社 检查装置系统
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CN112735967A (zh) * 2020-12-29 2021-04-30 上海集成电路研发中心有限公司 晶圆变温测试的测试方法

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KR101169830B1 (ko) 2005-09-22 2012-07-30 도쿄엘렉트론가부시키가이샤 웨이퍼 검사 장치와 웨이퍼 검사 방법, 및 컴퓨터 판독가능한 기록 매체
JP2009524050A (ja) 2006-01-18 2009-06-25 エレクトログラス・インコーポレーテッド 動的なプローブ調節の方法及び装置
US20150192616A1 (en) 2012-06-13 2015-07-09 Taiwan Semiconductor Manufacturing Company, Ltd. Method of Test Probe Alignment Control
US20190277913A1 (en) 2018-03-09 2019-09-12 Streammosaic, Inc. Failure detection and classsification using sensor data and/or measurement data
US20200388545A1 (en) 2018-03-27 2020-12-10 Pdf Solutions, Inc. Maintenance scheduling for semiconductor manufacturing equipment

Also Published As

Publication number Publication date
JP7727169B2 (ja) 2025-08-21
JP2022186039A (ja) 2022-12-15
TWI834180B (zh) 2024-03-01
TW202303791A (zh) 2023-01-16
JP2025160453A (ja) 2025-10-22
CN117425953A (zh) 2024-01-19
US20240094254A1 (en) 2024-03-21
WO2022255030A1 (ja) 2022-12-08
CN117425953B (zh) 2024-11-08
KR20230170802A (ko) 2023-12-19
US12007413B2 (en) 2024-06-11

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