CN117425953B - 探测器控制装置、探测器控制方法以及探测器 - Google Patents

探测器控制装置、探测器控制方法以及探测器 Download PDF

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Publication number
CN117425953B
CN117425953B CN202280039695.7A CN202280039695A CN117425953B CN 117425953 B CN117425953 B CN 117425953B CN 202280039695 A CN202280039695 A CN 202280039695A CN 117425953 B CN117425953 B CN 117425953B
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China
Prior art keywords
probe
input data
unit
prediction
wafer
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CN202280039695.7A
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English (en)
Chinese (zh)
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CN117425953A (zh
Inventor
吉田彻夫
大竹俊辅
松冈达也
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Tokyo Seimitsu Co Ltd
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Tokyo Seimitsu Co Ltd
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Publication of CN117425953A publication Critical patent/CN117425953A/zh
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/0675—Needle-like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Software Systems (AREA)
  • Medical Informatics (AREA)
  • Evolutionary Computation (AREA)
  • Data Mining & Analysis (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Computing Systems (AREA)
  • Mathematical Physics (AREA)
  • Artificial Intelligence (AREA)
  • Geometry (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Robotics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
CN202280039695.7A 2021-06-04 2022-05-09 探测器控制装置、探测器控制方法以及探测器 Active CN117425953B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-094056 2021-06-04
JP2021094056A JP7727169B2 (ja) 2021-06-04 2021-06-04 プローバ制御装置、プローバ制御方法、及びプローバ
PCT/JP2022/019630 WO2022255030A1 (ja) 2021-06-04 2022-05-09 プローバ制御装置、プローバ制御方法、及びプローバ

Publications (2)

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CN117425953A CN117425953A (zh) 2024-01-19
CN117425953B true CN117425953B (zh) 2024-11-08

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Country Link
US (1) US12007413B2 (https=)
JP (2) JP7727169B2 (https=)
KR (1) KR102731815B1 (https=)
CN (1) CN117425953B (https=)
TW (1) TWI834180B (https=)
WO (1) WO2022255030A1 (https=)

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JP7422340B1 (ja) 2022-11-21 2024-01-26 パナソニックＩｐマネジメント株式会社 文字認識装置、文字認識方法
JP7467824B1 (ja) * 2022-12-06 2024-04-16 株式会社東京精密 温度制御装置、温度制御方法、プログラム、プローバ及び学習モデル生成方法
CN116504664A (zh) * 2023-06-28 2023-07-28 东莞市兆恒机械有限公司 一种晶圆检测方法、检测装置及检测系统
CN116500426B (zh) * 2023-06-28 2023-09-05 东莞市兆恒机械有限公司 一种半导体检测设备高温测试标定的方法
JP2025034908A (ja) * 2023-08-31 2025-03-13 株式会社アドバンテスト 半導体ウェハハンドリング装置及び半導体ウェハ試験システム
CN118625098A (zh) * 2024-05-29 2024-09-10 深圳米飞泰克科技股份有限公司 测试系统、测试方法、测试设备及存储介质
CN119536207B (zh) * 2024-10-21 2026-04-10 中国第一汽车股份有限公司 车辆芯片测试方法、装置、电子设备及存储介质

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Also Published As

Publication number Publication date
JP7727169B2 (ja) 2025-08-21
JP2022186039A (ja) 2022-12-15
KR102731815B1 (ko) 2024-11-20
TWI834180B (zh) 2024-03-01
TW202303791A (zh) 2023-01-16
JP2025160453A (ja) 2025-10-22
CN117425953A (zh) 2024-01-19
US20240094254A1 (en) 2024-03-21
WO2022255030A1 (ja) 2022-12-08
KR20230170802A (ko) 2023-12-19
US12007413B2 (en) 2024-06-11

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