JP7727169B2 - プローバ制御装置、プローバ制御方法、及びプローバ - Google Patents

プローバ制御装置、プローバ制御方法、及びプローバ

Info

Publication number
JP7727169B2
JP7727169B2 JP2021094056A JP2021094056A JP7727169B2 JP 7727169 B2 JP7727169 B2 JP 7727169B2 JP 2021094056 A JP2021094056 A JP 2021094056A JP 2021094056 A JP2021094056 A JP 2021094056A JP 7727169 B2 JP7727169 B2 JP 7727169B2
Authority
JP
Japan
Prior art keywords
unit
input data
probe
prediction
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021094056A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022186039A5 (https=
JP2022186039A (ja
Inventor
徹夫 吉田
俊輔 大竹
達也 松岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Priority to JP2021094056A priority Critical patent/JP7727169B2/ja
Priority to PCT/JP2022/019630 priority patent/WO2022255030A1/ja
Priority to CN202280039695.7A priority patent/CN117425953B/zh
Priority to KR1020237041608A priority patent/KR102731815B1/ko
Priority to TW111120393A priority patent/TWI834180B/zh
Publication of JP2022186039A publication Critical patent/JP2022186039A/ja
Priority to US18/527,013 priority patent/US12007413B2/en
Publication of JP2022186039A5 publication Critical patent/JP2022186039A5/ja
Priority to JP2025129946A priority patent/JP2025160453A/ja
Application granted granted Critical
Publication of JP7727169B2 publication Critical patent/JP7727169B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/0675—Needle-like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Software Systems (AREA)
  • Medical Informatics (AREA)
  • Evolutionary Computation (AREA)
  • Data Mining & Analysis (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Computing Systems (AREA)
  • Mathematical Physics (AREA)
  • Artificial Intelligence (AREA)
  • Geometry (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Robotics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2021094056A 2021-06-04 2021-06-04 プローバ制御装置、プローバ制御方法、及びプローバ Active JP7727169B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2021094056A JP7727169B2 (ja) 2021-06-04 2021-06-04 プローバ制御装置、プローバ制御方法、及びプローバ
CN202280039695.7A CN117425953B (zh) 2021-06-04 2022-05-09 探测器控制装置、探测器控制方法以及探测器
KR1020237041608A KR102731815B1 (ko) 2021-06-04 2022-05-09 프로버 제어 장치, 프로버 제어 방법, 및 프로버
PCT/JP2022/019630 WO2022255030A1 (ja) 2021-06-04 2022-05-09 プローバ制御装置、プローバ制御方法、及びプローバ
TW111120393A TWI834180B (zh) 2021-06-04 2022-06-01 探針器控制裝置、探針器控制方法及探針器
US18/527,013 US12007413B2 (en) 2021-06-04 2023-12-01 Prober controlling device, prober controlling method, and prober
JP2025129946A JP2025160453A (ja) 2021-06-04 2025-08-04 プローバ制御装置及びプローバ制御方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021094056A JP7727169B2 (ja) 2021-06-04 2021-06-04 プローバ制御装置、プローバ制御方法、及びプローバ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025129946A Division JP2025160453A (ja) 2021-06-04 2025-08-04 プローバ制御装置及びプローバ制御方法

Publications (3)

Publication Number Publication Date
JP2022186039A JP2022186039A (ja) 2022-12-15
JP2022186039A5 JP2022186039A5 (https=) 2024-05-30
JP7727169B2 true JP7727169B2 (ja) 2025-08-21

Family

ID=84324243

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021094056A Active JP7727169B2 (ja) 2021-06-04 2021-06-04 プローバ制御装置、プローバ制御方法、及びプローバ
JP2025129946A Pending JP2025160453A (ja) 2021-06-04 2025-08-04 プローバ制御装置及びプローバ制御方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025129946A Pending JP2025160453A (ja) 2021-06-04 2025-08-04 プローバ制御装置及びプローバ制御方法

Country Status (6)

Country Link
US (1) US12007413B2 (https=)
JP (2) JP7727169B2 (https=)
KR (1) KR102731815B1 (https=)
CN (1) CN117425953B (https=)
TW (1) TWI834180B (https=)
WO (1) WO2022255030A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7422340B1 (ja) 2022-11-21 2024-01-26 パナソニックＩｐマネジメント株式会社 文字認識装置、文字認識方法
JP7467824B1 (ja) * 2022-12-06 2024-04-16 株式会社東京精密 温度制御装置、温度制御方法、プログラム、プローバ及び学習モデル生成方法
CN116504664A (zh) * 2023-06-28 2023-07-28 东莞市兆恒机械有限公司 一种晶圆检测方法、检测装置及检测系统
CN116500426B (zh) * 2023-06-28 2023-09-05 东莞市兆恒机械有限公司 一种半导体检测设备高温测试标定的方法
JP2025034908A (ja) * 2023-08-31 2025-03-13 株式会社アドバンテスト 半導体ウェハハンドリング装置及び半導体ウェハ試験システム
CN118625098A (zh) * 2024-05-29 2024-09-10 深圳米飞泰克科技股份有限公司 测试系统、测试方法、测试设备及存储介质
CN119536207B (zh) * 2024-10-21 2026-04-10 中国第一汽车股份有限公司 车辆芯片测试方法、装置、电子设备及存储介质

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007311389A (ja) 2006-05-16 2007-11-29 Tokyo Seimitsu Co Ltd プローバ及びプローブ接触方法
JP2009524050A (ja) 2006-01-18 2009-06-25 エレクトログラス・インコーポレーテッド 動的なプローブ調節の方法及び装置
US20150192616A1 (en) 2012-06-13 2015-07-09 Taiwan Semiconductor Manufacturing Company, Ltd. Method of Test Probe Alignment Control
JP2018117095A (ja) 2017-01-20 2018-07-26 株式会社東京精密 プローバ及びプローブ針の接触方法
WO2019008726A1 (ja) 2017-07-06 2019-01-10 オリンパス株式会社 管状挿入装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0192630A (ja) * 1987-10-02 1989-04-11 Nippon Steel Corp 放射温度計用変換器
US6096567A (en) * 1997-12-01 2000-08-01 Electroglas, Inc. Method and apparatus for direct probe sensing
JP2005228788A (ja) 2004-02-10 2005-08-25 Seiko Epson Corp ウエーハとプローブカードとの位置合わせ方法、プローブ検査方法及びプローブ検査装置
JP4589710B2 (ja) 2004-12-13 2010-12-01 株式会社日本マイクロニクス プローバ
JP2007088203A (ja) * 2005-09-22 2007-04-05 Tokyo Electron Ltd ウエハ検査装置およびウエハ検査方法、ならびにコンピュータプログラム
JP4744382B2 (ja) * 2006-07-20 2011-08-10 株式会社東京精密 プローバ及びプローブ接触方法
CN101996856A (zh) * 2009-08-26 2011-03-30 中芯国际集成电路制造(上海)有限公司 晶圆可接受测试的实时监控方法
JP6462296B2 (ja) * 2014-09-30 2019-01-30 東京エレクトロン株式会社 位置精度検査方法、位置精度検査装置及び位置検査ユニット
KR102132785B1 (ko) 2017-08-31 2020-07-13 가부시끼가이샤 히다치 세이사꾸쇼 계산기, 처리의 제어 파라미터의 결정 방법, 대용 시료, 계측 시스템, 및 계측 방법
JP6959831B2 (ja) * 2017-08-31 2021-11-05 株式会社日立製作所 計算機、処理の制御パラメータの決定方法、代用試料、計測システム、及び計測方法
US11029359B2 (en) * 2018-03-09 2021-06-08 Pdf Solutions, Inc. Failure detection and classsification using sensor data and/or measurement data
US10777470B2 (en) * 2018-03-27 2020-09-15 Pdf Solutions, Inc. Selective inclusion/exclusion of semiconductor chips in accelerated failure tests
JP7090517B2 (ja) * 2018-09-20 2022-06-24 東京エレクトロン株式会社 検査装置及び検査方法
CN111223786B (zh) * 2018-11-27 2023-10-27 东京毅力科创株式会社 检查装置系统
JP7175171B2 (ja) * 2018-12-12 2022-11-18 東京エレクトロン株式会社 プローブカード管理システムおよびプローブカード管理方法
KR102434460B1 (ko) * 2019-07-26 2022-08-22 한국전자통신연구원 기계학습 기반 예측 모델 재학습 장치 및 그 방법
CN112735967A (zh) * 2020-12-29 2021-04-30 上海集成电路研发中心有限公司 晶圆变温测试的测试方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009524050A (ja) 2006-01-18 2009-06-25 エレクトログラス・インコーポレーテッド 動的なプローブ調節の方法及び装置
JP2007311389A (ja) 2006-05-16 2007-11-29 Tokyo Seimitsu Co Ltd プローバ及びプローブ接触方法
US20150192616A1 (en) 2012-06-13 2015-07-09 Taiwan Semiconductor Manufacturing Company, Ltd. Method of Test Probe Alignment Control
JP2018117095A (ja) 2017-01-20 2018-07-26 株式会社東京精密 プローバ及びプローブ針の接触方法
WO2019008726A1 (ja) 2017-07-06 2019-01-10 オリンパス株式会社 管状挿入装置

Also Published As

Publication number Publication date
JP2022186039A (ja) 2022-12-15
KR102731815B1 (ko) 2024-11-20
TWI834180B (zh) 2024-03-01
TW202303791A (zh) 2023-01-16
JP2025160453A (ja) 2025-10-22
CN117425953A (zh) 2024-01-19
US20240094254A1 (en) 2024-03-21
WO2022255030A1 (ja) 2022-12-08
CN117425953B (zh) 2024-11-08
KR20230170802A (ko) 2023-12-19
US12007413B2 (en) 2024-06-11

Similar Documents

Publication Publication Date Title
JP7727169B2 (ja) プローバ制御装置、プローバ制御方法、及びプローバ
US7405584B2 (en) Prober and probe contact method
JP6821910B2 (ja) プローバ及びプローブ針の接触方法
KR100858153B1 (ko) 프로버 및 탐침 접촉 방법
TWI431703B (zh) A method of detecting the leading position of the probe, and a recording medium and a probe device for recording the method
CN101498764B (zh) 探测装置和检测方法
JP7467824B1 (ja) 温度制御装置、温度制御方法、プログラム、プローバ及び学習モデル生成方法
KR20210124046A (ko) 검사 장치 및 검사 장치 제어 방법
JP7004935B2 (ja) プローバ及びプローブ針の接触方法
US20250172609A1 (en) Probe testing apparatus, probe testing system and probe card
CN119535162B (zh) 芯片倒装互连连通情况的批量自动测试方法及系统
US20250208203A1 (en) Inspection method, inspection device, and program
JP7749765B1 (ja) 検査装置
JP2007234645A (ja) プローバ温度制御装置、及び、方法
JPH10115667A (ja) プローブ装置
CN117762084A (zh) 一种热误差补偿方法及装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240522

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240522

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20250708

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250721

R150 Certificate of patent or registration of utility model

Ref document number: 7727169

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150