TWI830823B - 聚醯亞胺樹脂、聚醯亞胺清漆以及聚醯亞胺薄膜 - Google Patents

聚醯亞胺樹脂、聚醯亞胺清漆以及聚醯亞胺薄膜 Download PDF

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TWI830823B
TWI830823B TW108142835A TW108142835A TWI830823B TW I830823 B TWI830823 B TW I830823B TW 108142835 A TW108142835 A TW 108142835A TW 108142835 A TW108142835 A TW 108142835A TW I830823 B TWI830823 B TW I830823B
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polyimide
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formula
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TW108142835A
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TW202031727A (zh
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安孫子洋平
星野舜
村谷孝博
関口慎司
高田貴文
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日商三菱瓦斯化學股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075Partially aromatic polyimides
    • C08G73/1078Partially aromatic polyimides wholly aromatic in the diamino moiety
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW108142835A 2018-11-28 2019-11-26 聚醯亞胺樹脂、聚醯亞胺清漆以及聚醯亞胺薄膜 TWI830823B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-222895 2018-11-28
JP2018222895 2018-11-28

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TW202031727A TW202031727A (zh) 2020-09-01
TWI830823B true TWI830823B (zh) 2024-02-01

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TW108142835A TWI830823B (zh) 2018-11-28 2019-11-26 聚醯亞胺樹脂、聚醯亞胺清漆以及聚醯亞胺薄膜

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JP (1) JP7367699B2 (ja)
KR (1) KR20210096064A (ja)
CN (1) CN113166411A (ja)
TW (1) TWI830823B (ja)
WO (1) WO2020110948A1 (ja)

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* Cited by examiner, † Cited by third party
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JP7471888B2 (ja) * 2020-03-26 2024-04-22 日鉄ケミカル&マテリアル株式会社 ポリイミドフィルム及びそれを用いた表示装置並びにポリイミド前駆体
KR20230038474A (ko) * 2020-07-16 2023-03-20 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 적층체
KR20230041689A (ko) * 2020-07-21 2023-03-24 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 폴리이미드 수지, 폴리이미드 바니시 및 폴리이미드 필름
JPWO2022019226A1 (ja) * 2020-07-21 2022-01-27
KR20220032905A (ko) * 2020-09-08 2022-03-15 주식회사 엘지화학 폴리이미드계 수지 필름 및 이를 이용한 디스플레이 장치용 기판, 및 광학 장치

Citations (1)

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Publication number Priority date Publication date Assignee Title
TW201920369A (zh) * 2017-09-19 2019-06-01 美商杜邦股份有限公司 用於電子裝置中之低色度聚合物

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JP3687988B2 (ja) * 1993-09-03 2005-08-24 日立化成工業株式会社 i線ステッパ用感光性樹脂組成物
EP1235099A1 (en) * 1999-11-30 2002-08-28 Hitachi, Ltd. Liquid-crystal display and resin composition
JP5092426B2 (ja) * 2006-07-21 2012-12-05 東レ株式会社 位相差薄膜用樹脂組成物、液晶表示装置用カラーフィルター基板、および液晶表示装置、並びに位相差薄膜付き液晶表示装置用カラーフィルター基板の製造方法
JP6020129B2 (ja) * 2012-12-19 2016-11-02 Jnc株式会社 ポリアミド酸組成物
KR102052150B1 (ko) * 2015-03-31 2019-12-05 아사히 가세이 가부시키가이샤 폴리이미드 필름, 폴리이미드 바니시, 폴리이미드 필름을 이용한 제품 및 적층체
WO2017073782A1 (ja) * 2015-10-30 2017-05-04 株式会社アイ.エス.テイ ポリイミド膜
WO2018029766A1 (ja) * 2016-08-09 2018-02-15 東レ株式会社 樹脂積層膜、それを含む積層体、tft基板、有機el素子カラーフィルターならびにそれらの製造方法
JP2018162340A (ja) * 2017-03-24 2018-10-18 東レ株式会社 着色樹脂組成物、カラーフィルタ基板および液晶表示装置
KR20210097095A (ko) * 2018-11-28 2021-08-06 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 폴리이미드 수지, 폴리이미드 바니시 및 폴리이미드 필름

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201920369A (zh) * 2017-09-19 2019-06-01 美商杜邦股份有限公司 用於電子裝置中之低色度聚合物

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KR20210096064A (ko) 2021-08-04
JP7367699B2 (ja) 2023-10-24
TW202031727A (zh) 2020-09-01
CN113166411A (zh) 2021-07-23
WO2020110948A1 (ja) 2020-06-04
JPWO2020110948A1 (ja) 2021-10-21

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