CN113166411A - 聚酰亚胺树脂、聚酰亚胺清漆及聚酰亚胺薄膜 - Google Patents

聚酰亚胺树脂、聚酰亚胺清漆及聚酰亚胺薄膜 Download PDF

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Publication number
CN113166411A
CN113166411A CN201980077586.2A CN201980077586A CN113166411A CN 113166411 A CN113166411 A CN 113166411A CN 201980077586 A CN201980077586 A CN 201980077586A CN 113166411 A CN113166411 A CN 113166411A
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structural unit
mol
polyimide
derived
compound represented
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CN201980077586.2A
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Chinese (zh)
Inventor
安孙子洋平
星野舜
村谷孝博
关口慎司
高田贵文
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Mitsubishi Gas Chemical Co Inc
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Mitsubishi Gas Chemical Co Inc
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Publication of CN113166411A publication Critical patent/CN113166411A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1078—Partially aromatic polyimides wholly aromatic in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
CN201980077586.2A 2018-11-28 2019-11-22 聚酰亚胺树脂、聚酰亚胺清漆及聚酰亚胺薄膜 Pending CN113166411A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018-222895 2018-11-28
JP2018222895 2018-11-28
PCT/JP2019/045815 WO2020110948A1 (ja) 2018-11-28 2019-11-22 ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム

Publications (1)

Publication Number Publication Date
CN113166411A true CN113166411A (zh) 2021-07-23

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CN201980077586.2A Pending CN113166411A (zh) 2018-11-28 2019-11-22 聚酰亚胺树脂、聚酰亚胺清漆及聚酰亚胺薄膜

Country Status (5)

Country Link
JP (1) JP7367699B2 (ja)
KR (1) KR20210096064A (ja)
CN (1) CN113166411A (ja)
TW (1) TWI830823B (ja)
WO (1) WO2020110948A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7471888B2 (ja) * 2020-03-26 2024-04-22 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルム及びそれを用いた表示装置並びにポリイミド前駆体
KR20230038474A (ko) * 2020-07-16 2023-03-20 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 적층체
KR20230041689A (ko) * 2020-07-21 2023-03-24 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 폴리이미드 수지, 폴리이미드 바니시 및 폴리이미드 필름
JPWO2022019226A1 (ja) * 2020-07-21 2022-01-27
KR20220032905A (ko) * 2020-09-08 2022-03-15 주식회사 엘지화학 폴리이미드계 수지 필름 및 이를 이용한 디스플레이 장치용 기판, 및 광학 장치

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5856059A (en) * 1993-09-03 1999-01-05 Hitachi Chemical Co., Ltd. Photosensitive resin composition
CN1328655A (zh) * 1999-11-30 2001-12-26 株式会社日立制作所 液晶显示器和塑料组合物
JP2014118532A (ja) * 2012-12-19 2014-06-30 Jnc Corp ポリアミド酸組成物
WO2017073782A1 (ja) * 2015-10-30 2017-05-04 株式会社アイ．エス．テイ ポリイミド膜
CN107428934A (zh) * 2015-03-31 2017-12-01 旭化成株式会社 聚酰亚胺膜、聚酰亚胺清漆、使用了聚酰亚胺膜的制品、以及层积体
JP2018162340A (ja) * 2017-03-24 2018-10-18 東レ株式会社 着色樹脂組成物、カラーフィルタ基板および液晶表示装置
CN111386299A (zh) * 2017-09-19 2020-07-07 E.I.内穆尔杜邦公司 用于电子装置中的低色聚合物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5092426B2 (ja) * 2006-07-21 2012-12-05 東レ株式会社 位相差薄膜用樹脂組成物、液晶表示装置用カラーフィルター基板、および液晶表示装置、並びに位相差薄膜付き液晶表示装置用カラーフィルター基板の製造方法
WO2018029766A1 (ja) * 2016-08-09 2018-02-15 東レ株式会社 樹脂積層膜、それを含む積層体、ｔｆｔ基板、有機ｅｌ素子カラーフィルターならびにそれらの製造方法
KR20210097095A (ko) * 2018-11-28 2021-08-06 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 폴리이미드 수지, 폴리이미드 바니시 및 폴리이미드 필름

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5856059A (en) * 1993-09-03 1999-01-05 Hitachi Chemical Co., Ltd. Photosensitive resin composition
US20020004177A1 (en) * 1993-09-03 2002-01-10 Hideo Hagiwara Photosensitive resin composition
CN1328655A (zh) * 1999-11-30 2001-12-26 株式会社日立制作所 液晶显示器和塑料组合物
JP2014118532A (ja) * 2012-12-19 2014-06-30 Jnc Corp ポリアミド酸組成物
CN107428934A (zh) * 2015-03-31 2017-12-01 旭化成株式会社 聚酰亚胺膜、聚酰亚胺清漆、使用了聚酰亚胺膜的制品、以及层积体
WO2017073782A1 (ja) * 2015-10-30 2017-05-04 株式会社アイ．エス．テイ ポリイミド膜
JP2018162340A (ja) * 2017-03-24 2018-10-18 東レ株式会社 着色樹脂組成物、カラーフィルタ基板および液晶表示装置
CN111386299A (zh) * 2017-09-19 2020-07-07 E.I.内穆尔杜邦公司 用于电子装置中的低色聚合物

Also Published As

Publication number Publication date
KR20210096064A (ko) 2021-08-04
JP7367699B2 (ja) 2023-10-24
TW202031727A (zh) 2020-09-01
WO2020110948A1 (ja) 2020-06-04
JPWO2020110948A1 (ja) 2021-10-21
TWI830823B (zh) 2024-02-01

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