TWI829738B - 收納裝置及基板加工裝置 - Google Patents
收納裝置及基板加工裝置 Download PDFInfo
- Publication number
- TWI829738B TWI829738B TW108128525A TW108128525A TWI829738B TW I829738 B TWI829738 B TW I829738B TW 108128525 A TW108128525 A TW 108128525A TW 108128525 A TW108128525 A TW 108128525A TW I829738 B TWI829738 B TW I829738B
- Authority
- TW
- Taiwan
- Prior art keywords
- cassette
- storage
- storage device
- wafer
- substrate
- Prior art date
Links
- 238000003860 storage Methods 0.000 title claims abstract description 235
- 239000000758 substrate Substances 0.000 title claims abstract description 126
- 238000012545 processing Methods 0.000 title claims abstract description 32
- 238000012546 transfer Methods 0.000 claims abstract description 52
- 230000007246 mechanism Effects 0.000 claims description 131
- 230000032258 transport Effects 0.000 claims description 35
- 238000001514 detection method Methods 0.000 claims description 18
- 230000008878 coupling Effects 0.000 claims description 14
- 238000010168 coupling process Methods 0.000 claims description 14
- 238000005859 coupling reaction Methods 0.000 claims description 14
- 239000000284 extract Substances 0.000 claims description 12
- 230000003028 elevating effect Effects 0.000 claims description 6
- 238000003475 lamination Methods 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 175
- 238000000605 extraction Methods 0.000 description 52
- 239000004065 semiconductor Substances 0.000 description 10
- 239000010408 film Substances 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
- Warehouses Or Storage Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP2018-205630 | 2018-10-31 | ||
| JP2018205630 | 2018-10-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202017833A TW202017833A (zh) | 2020-05-16 |
| TWI829738B true TWI829738B (zh) | 2024-01-21 |
Family
ID=70464473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108128525A TWI829738B (zh) | 2018-10-31 | 2019-08-12 | 收納裝置及基板加工裝置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7432242B2 (ja) |
| CN (1) | CN112889143A (ja) |
| TW (1) | TWI829738B (ja) |
| WO (1) | WO2020090517A1 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021086913A (ja) * | 2019-11-27 | 2021-06-03 | 株式会社ディスコ | カセット |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000269294A (ja) * | 1999-03-17 | 2000-09-29 | Fujitsu Ltd | ワーク搬送移載装置及び容器の検査方法及びワーク及び容器の処理方法 |
| JP2002064136A (ja) * | 2000-08-22 | 2002-02-28 | Sharp Corp | 基板搬送用カセット |
| JP2003012146A (ja) * | 2001-07-05 | 2003-01-15 | Micronics Japan Co Ltd | 基板用カセットの搬送装置 |
| JP2004301290A (ja) * | 2003-03-31 | 2004-10-28 | Fujitsu Display Technologies Corp | 防振機構及び搬送装置 |
| CN1951164A (zh) * | 2004-05-13 | 2007-04-18 | 松下电器产业株式会社 | 元件供给板收容体及元件供给装置 |
| JP2009200201A (ja) * | 2008-02-21 | 2009-09-03 | Panasonic Corp | チップ供給パレット |
| JP2013161972A (ja) * | 2012-02-06 | 2013-08-19 | Disco Abrasive Syst Ltd | 収容カセット |
| JP2014078656A (ja) * | 2012-10-12 | 2014-05-01 | Disco Abrasive Syst Ltd | 収容カセット |
| KR101739850B1 (ko) * | 2016-07-04 | 2017-06-08 | 에버테크노 주식회사 | 듀얼 스토커 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6347036A (ja) * | 1986-08-15 | 1988-02-27 | Toshiba Corp | 物品の移載装置 |
| JPH0778794A (ja) * | 1993-06-22 | 1995-03-20 | Disco Abrasive Syst Ltd | ダイシング装置のカセットテーブル |
| JP2015138856A (ja) * | 2014-01-22 | 2015-07-30 | 株式会社ディスコ | 切削装置 |
| JP6347036B2 (ja) | 2014-02-07 | 2018-06-27 | アドバンストマテリアルテクノロジーズ株式会社 | ローラ式プラズマ装置 |
-
2019
- 2019-08-12 TW TW108128525A patent/TWI829738B/zh active
- 2019-10-18 JP JP2020553784A patent/JP7432242B2/ja active Active
- 2019-10-18 WO PCT/JP2019/041057 patent/WO2020090517A1/ja active Application Filing
- 2019-10-18 CN CN201980036027.7A patent/CN112889143A/zh active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000269294A (ja) * | 1999-03-17 | 2000-09-29 | Fujitsu Ltd | ワーク搬送移載装置及び容器の検査方法及びワーク及び容器の処理方法 |
| JP2002064136A (ja) * | 2000-08-22 | 2002-02-28 | Sharp Corp | 基板搬送用カセット |
| JP2003012146A (ja) * | 2001-07-05 | 2003-01-15 | Micronics Japan Co Ltd | 基板用カセットの搬送装置 |
| JP2004301290A (ja) * | 2003-03-31 | 2004-10-28 | Fujitsu Display Technologies Corp | 防振機構及び搬送装置 |
| CN1951164A (zh) * | 2004-05-13 | 2007-04-18 | 松下电器产业株式会社 | 元件供给板收容体及元件供给装置 |
| JP2009200201A (ja) * | 2008-02-21 | 2009-09-03 | Panasonic Corp | チップ供給パレット |
| JP2013161972A (ja) * | 2012-02-06 | 2013-08-19 | Disco Abrasive Syst Ltd | 収容カセット |
| JP2014078656A (ja) * | 2012-10-12 | 2014-05-01 | Disco Abrasive Syst Ltd | 収容カセット |
| KR101739850B1 (ko) * | 2016-07-04 | 2017-06-08 | 에버테크노 주식회사 | 듀얼 스토커 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112889143A (zh) | 2021-06-01 |
| JP7432242B2 (ja) | 2024-02-16 |
| WO2020090517A1 (ja) | 2020-05-07 |
| JPWO2020090517A1 (ja) | 2021-09-16 |
| TW202017833A (zh) | 2020-05-16 |
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