TWI827833B - 電連接器組合 - Google Patents

電連接器組合 Download PDF

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TWI827833B
TWI827833B TW109111756A TW109111756A TWI827833B TW I827833 B TWI827833 B TW I827833B TW 109111756 A TW109111756 A TW 109111756A TW 109111756 A TW109111756 A TW 109111756A TW I827833 B TWI827833 B TW I827833B
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frame
electrical connector
connector assembly
tail
insulating body
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TW202109982A (zh
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鄔恒康
彭付金
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英屬開曼群島商鴻騰精密科技股份有限公司
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H01R12/7011—Locking or fixing a connector to a PCB
    • H01R12/7058—Locking or fixing a connector to a PCB characterised by the movement, e.g. pivoting, camming or translating parallel to the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/639—Additional means for holding or locking coupling parts together, after engagement, e.g. separate keylock, retainer strap
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

一種電連接器組合，包括絕緣本體、固持於所述絕緣本體的導電端子、框設於所述絕緣本體四周的框架以及設置於所述絕緣本體上以夾持一晶片模組的夾持件，所述框架設有位於四個角落且向上凸伸的定位柱，所述夾持件包括呈中空狀的塑膠框體部以及形成於所述框體部內以收容所述晶片模組的收容空間，所述夾持件還包括位於其四個角落的金屬環，所述金屬環包括與所述定位柱對應設置的通孔，所述定位柱穿過所述通孔，所述框體部包覆成型在所述金屬環外，金屬環可增強所述夾持件的強度，反復拆裝時不易損壞。

Description

電連接器組合
本發明係關於一種電連接器組合，尤其涉及一種組裝於電路板上以連接一晶片模組的電連接器組合。
相關現有技術請參中國大陸實用新型專利第CN206401563U號所揭示的一種用於安裝在電連接器上以電性連接電路板和晶片模組的電連接器組件，該電連接器組件具有絕緣本體、用於夾持晶片模組的夾持片以及設置在絕緣本體週邊的定位柱，夾持片設有定位孔，當夾持片蓋設於絕緣本體上時定位柱與定位孔對位配合，晶片模組與導電端子電性連接，所述夾持片通過塑膠材質一體成型以構成所述定位孔，該定位孔周邊的的結構較為薄弱，可能會在用戶進行多次拆裝後由於強度不足而造成損壞。
是以，鑒於以上問題，實有必要提供一種改良的電連接器組合來解決以上的問題。
本發明所要達成之目的係提供一種電連接器組合，其結構強度較大。
為解決前述問題，本發明可採用如下技術方案：一種電連接器組合，包括絕緣本體、固持於所述絕緣本體的導電端子、框設於所述絕緣本體四周的框架以及設置於所述絕緣本體上以夾持一晶片模組的夾持件，所述框架設有位於四個角落且向上凸伸的定位柱，所述夾持件包括呈中空狀的塑膠框體部以及形成於所述框體部內以收容所述晶片模組的收容空間，所述夾持件還包括 位於其四個角落的金屬環，所述金屬環包括與所述定位柱對應設置的通孔，所述定位柱穿過所述通孔，所述框體部包覆成型在所述金屬環外。
與先前技術相比，本發明電連接器組合之夾持件通過鑲嵌的金屬環而形成用於定位的通孔，其強度較大，反復拆裝時不易被損壞。
100:電連接器組合
1:絕緣本體
11:擋牆
2:導電端子
200:晶片模組
201:底板
202:凸起部
203:缺口
3:框架
30:定位柱
300:電路板
4:夾持件
40:收容空間
41:框體部
411:第一側邊
4110:內側緣
4111:卡勾
4112:勾部
4113:導引斜面
4114:定位塊
412:第二側邊
413:引導牆
414:卡持柱
42:金屬環
420:通孔
421:環狀部
422:尾部
4220:沉頭孔
4221:凸片
4222:定位孔
第一圖係本發明之電連接器組合夾持晶片模組安裝於電路板上之立體圖；第二圖係第一圖之部分分解圖；第三圖係第二圖另一角度之部分分解圖；第四圖係將第一圖中晶片模組分離的部分分解圖；第五圖係將第一圖中晶片模組移除後的部分分解圖；第六圖係第五圖另一角度之部分分解圖；第七圖係本發明之夾持件的立體圖；第八圖係第七圖之部分分解圖；第九圖係第七圖另一角度之立體圖；及第十圖係第九圖之部分分解圖。
以下，將結合第一圖至第十圖介紹本發明的電連接器組合的具體實施方式。
如第一圖至第六圖所示，本發明提供了一種電連接器組合100，其用於夾持一晶片模組200安裝於電路板300上，所述電連接器組合100包括絕緣本體1、固持於所述絕緣本體1的導電端子2、框設於所述絕緣本體1四周的框架3以及設置於所述絕緣本體1上以夾持所述晶片模組200的夾持件4。所述框架3設有位於四個角落且向上凸伸的定位柱30，所述夾持件4包括呈中空狀的塑膠框體部 41以及形成於所述框體部41內以收容所述晶片模組200的收容空間40，所述夾持件4還包括位於其四個角落的金屬環42，所述金屬環42包括與所述定位柱30對應設置的通孔420，所述定位柱30穿過所述通孔420，所述框體部41包覆成型在所述金屬環42外。
參照第七圖至第十圖，所述金屬環42包括形成所述通孔420的環狀部421以及自所述環狀部421一側延伸的尾部422，所述環狀部421的上表面與所述框體部41的上表面平齊。通過通孔420與定位柱30的對位配合，能夠實現夾持件4與所述框架3之間的準確對位，在本實施例中，所述通孔420與所述定位柱30的截面均設置為圓形，在其他實施例中亦可將所述通孔420與所述定位柱30設置為其他對應的形狀，只要能起到將所述夾持件4與所述框架3定位配對的效果即可。結合第七圖與第九圖可知，所述環狀部421的上下表面均裸露於所述框體部41外，當所述夾持件4向下與所述定位柱30組裝時，通孔420周圍全部由金屬材質製成，可保證夾持件4的結構強度，不會在對位時由於定位柱30的碰撞而造成夾持件4塑膠部分的損壞。在較佳的實施例中，所述金屬環42由不銹鋼材質製成，有利於實現所述電連接器組合100在長期處於溫度濕度較高的使用環境下仍可進行拆裝而不損壞。
重點參照第七圖至第十圖，所述夾持件4的尾部422設有向下凸伸的沉頭孔4220，沉頭孔4220凸伸出所述尾部422的下表面，所述框體部41由熱熔塑膠材料成型並填充至所述沉頭孔4220內以增加所述框體部41與所述金屬環42之間的結合力。所述尾部422還設有自其側邊延伸的複數凸片4221，所述凸片4221的厚度小於所述尾部422的厚度，所述凸片4221的上下表面位於所述尾部422的上下表面之間以使所述凸片4221埋設於所述框體部41中。在本實施例中，複數所述凸片4221交錯設置於所述尾部422的不同側邊。埋設於框體部41中的凸片4221可進一步增強所述框體部41與所述金屬環42之間的結合力，提高夾持件4 的整體強度。所述尾部422自所述環狀部421水平延伸，所述尾部422的上表面暴露在所述框體部41外並與所述框體部41的上表面平齊，所述尾部422的下表面埋設於所述框體部41中，本發明之環狀部421與尾部422水平設置且彼此之間沒有進行彎折，能夠有效防止框體部41成型在所述金屬環42周圍時在彎折處發生漏膠，可降低生產工藝的難度。
所述框體部41包括相對的兩第一側邊411及連接兩第一側邊411的兩第二側邊412，所述第一側邊411的長度小於所述第二側邊412的長度，所述第一側邊411的寬度大於所述第二側邊412的寬度。所述環狀部421設置於所述第一側邊411的兩側，設置於同一所述第一側邊411兩側的兩個金屬環42的尾部422朝所述收容空間40相向傾斜延伸，如此設置可在不改變所述夾持件4的體積的同時儘量延長所述尾部422的長度，同時也能夠在所述尾部422上盡可能多的設置所述凸片4221，從而進一步增加所述金屬環42與所述框體部41之間的固持力，有利於增加所述夾持件4的整體強度。
所述框體部41的第一側邊411設有自其內側緣4110豎直向下延伸的卡勾4111，所述卡勾4111設有位於其末端且朝向收容空間40延伸的勾部4112，所述勾部4112的下方設有導引斜面4113，所述第一側邊411還設有自其內側緣4110向所述收容空間40凸伸且與所述卡勾4111間隔設置的定位塊4114。所述晶片模組200包括底板201以及設置於所述底板201上的凸起部202，所述凸起部202的側邊設有向內凹的缺口203，的所述晶片模組自下而上地組裝於所述夾持件4，所述卡勾4111用於夾持所述晶片模組200，所述勾部4112卡持於所述底板201，所述定位塊4114嵌入所述缺口203中，所述導引斜面4113有利於所述晶片模組200的順利組裝。
所述絕緣本體1的四個角落設有向上凸伸且呈「L」型設置的擋牆11，所述框體部41的四個角落設有向下凸伸的引導牆413，所述引導牆413貼合 組裝於所述擋牆11的外側，從而確定所述夾持件4與所述絕緣本體1的相對位置以將所述夾持件4準確地定位安裝於所述絕緣本體1上。所述框體部41的四個角落進一步包括向上延伸的卡持柱414，所述卡持柱414用於與一散熱器(未圖示)卡持組裝。
所述金屬環42的尾部422還包括用於與一治具(未圖示)定位的定位孔4222，所述夾持件4的製造步驟如下：首先將四個所述金屬環42分別通過通孔420與所述定位孔4222固定於所述治具上，再將組成所述框體部41的熱熔塑膠一體包覆成型於所述金屬環42外並填充於所述沉頭孔4220內以形成完整的夾持件4。本發明電連接器組合100之夾持件4的整體性好，環狀部421的強度大，可保證多次拆裝而不易損壞。
上述實施例為本發明的較佳實施方式，而非全部之實施方式。本領域普通技術人員通過閱讀本新型說明書而對本發明技術方案採取的任何等效的變化，均為本新型之申請專利範圍所涵蓋。
1:絕緣本體
11:擋牆
200:晶片模組
3:框架
30:定位柱
300:電路板
41:框體部
411:第一側邊
412:第二側邊
413:引導牆
42:金屬環
420:通孔
421:環狀部

Claims (10)

  1. 一種電連接器組合，包括：絕緣本體；導電端子，係固持於所述絕緣本體；框架，係框設於所述絕緣本體四周，所述框架設有位於四個角落且向上凸伸的定位柱；及夾持件，係設置於所述絕緣本體上以夾持一晶片模組，所述夾持件包括呈中空狀的塑膠框體部以及形成於所述框體部內以收容所述晶片模組的收容空間；其中，所述夾持件還包括位於其四個角落的金屬環，所述金屬環包括與所述定位柱對應設置的通孔，所述定位柱穿過所述通孔，所述框體部包覆成型在所述金屬環外。
  2. 如請求項1所述之電連接器組合，其中所述金屬環包括形成所述通孔的環狀部以及自所述環狀部一側延伸的尾部，所述環狀部的上表面與所述框體部的上表面平齊。
  3. 如請求項2所述之電連接器組合，其中所述環狀部的上下表面均裸露於所述框體部外。
  4. 如請求項2所述之電連接器組合，其中所述尾部設有向下凸伸的沉頭孔，所述框體部由熱熔塑膠材料成型並填充至所述沉頭孔內。
  5. 如請求項4所述之電連接器組合，其中所述尾部設有自其側邊延伸的複數凸片，所述凸片的厚度小於所述尾部的厚度，所述凸片埋設於所述框體部中。
  6. 如請求項5所述之電連接器組合，其中複數所述凸片交錯設置於所述尾部的不同側邊。
  7. 如請求項2至請求項6中任一項所述之電連接器組合，其中所述尾部自所述環狀部水平延伸，所述尾部的上表面暴露在所述框體部外並與所述框體部的上表面平齊，所述尾部的下表面埋設於所述框體部中。
  8. 如請求項7所述之電連接器組合，其中所述金屬環由不銹鋼材質製成。
  9. 如請求項7所述之電連接器組合，其中所述框體部包括相對的兩第一側邊及連接兩第一側邊的兩第二側邊，所述第一側邊的長度小於所述第二側邊的長度，所述第一側邊的寬度大於所述第二側邊的寬度，所述環狀部設置於所述第一側邊的兩側，設置於同一所述第一側邊兩側的兩個金屬環的尾部朝所述收容空間相向傾斜延伸，所述金屬環的尾部還包括用於與一治具定位的定位孔。
  10. 如請求項9所述之電連接器組合，其中所述第一側邊設有自其內側緣豎直向下延伸的卡勾，所述卡勾設有位於其末端且朝向收容空間延伸的勾部，所述勾部的下方設有導引斜面，所述第一側邊還設有自其內側緣向所述收容空間凸伸且與所述卡勾間隔設置的定位塊，所述絕緣本體的四個角落設有向上凸伸且呈「L」型設置的擋牆，所述框體部的四個角落設有向下凸伸的引導牆，所述引導牆貼合組裝於所述擋牆的外側。
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