TWI805881B - 壓印用光硬化性組成物 - Google Patents

壓印用光硬化性組成物 Download PDF

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Publication number
TWI805881B
TWI805881B TW108146556A TW108146556A TWI805881B TW I805881 B TWI805881 B TW I805881B TW 108146556 A TW108146556 A TW 108146556A TW 108146556 A TW108146556 A TW 108146556A TW I805881 B TWI805881 B TW I805881B
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TW
Taiwan
Prior art keywords
component
meth
photocurable composition
following
acrylate
Prior art date
Application number
TW108146556A
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English (en)
Chinese (zh)
Other versions
TW202039606A (zh
Inventor
今井翔太
長澤偉大
加藤拓
Original Assignee
日商日產化學股份有限公司
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Application filed by 日商日產化學股份有限公司 filed Critical 日商日產化學股份有限公司
Publication of TW202039606A publication Critical patent/TW202039606A/zh
Application granted granted Critical
Publication of TWI805881B publication Critical patent/TWI805881B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F251/00—Macromolecular compounds obtained by polymerising monomers on to polysaccharides or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37—Thiols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37—Thiols
    • C08K5/372—Sulfides, e.g. R-(S)x-R'
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G02B1/041—Lenses
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
TW108146556A 2018-12-21 2019-12-19 壓印用光硬化性組成物 TWI805881B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018240319 2018-12-21
JP2018-240319 2018-12-21

Publications (2)

Publication Number Publication Date
TW202039606A TW202039606A (zh) 2020-11-01
TWI805881B true TWI805881B (zh) 2023-06-21

Family

ID=71101301

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108146556A TWI805881B (zh) 2018-12-21 2019-12-19 壓印用光硬化性組成物

Country Status (6)

Country Link
JP (1) JP7021710B2 (ja)
KR (1) KR102496908B1 (ja)
CN (1) CN113195547B (ja)
SG (1) SG11202106695XA (ja)
TW (1) TWI805881B (ja)
WO (1) WO2020129902A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023157024A (ja) * 2020-09-14 2023-10-26 日産化学株式会社 インプリント用プライマー層形成組成物
JPWO2022210664A1 (ja) * 2021-03-30 2022-10-06

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201704370A (zh) * 2015-04-21 2017-02-01 住友化學股份有限公司 光硬化性樹脂組成物，使用該組成物之硬化膜之製造方法以及含有該硬化膜之積層體
TW201819556A (zh) * 2016-09-16 2018-06-01 日商住友精化股份有限公司 含有聚輪烷之組成物及其硬化物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101784568B (zh) * 2008-05-07 2014-03-26 高级软质材料株式会社 聚轮烷、聚轮烷与聚合物的交联体以及它们的制造方法
JP2010000612A (ja) * 2008-06-18 2010-01-07 Fujifilm Corp ナノインプリント用硬化性組成物、パターン形成方法
JP5281710B2 (ja) 2010-02-26 2013-09-04 新日鉄住金化学株式会社 硬化性樹脂組成物、その硬化物並びに光学材料
JP2014234458A (ja) 2013-06-03 2014-12-15 昭和電工株式会社 硬化性組成物およびその硬化物
JP2015071741A (ja) * 2013-09-04 2015-04-16 Jsr株式会社 硬化性組成物、ナノインプリント材料、硬化膜、積層体、硬化膜の製造方法、パターン形成方法及び半導体発光素子用基板
KR102387237B1 (ko) 2014-11-04 2022-04-18 가부시키가이샤 에이에스엠 광경화성 조성물, 광경화성 조성물로 형성되는 경화체, 및 해당 경화체의 제조 방법
JP2016121277A (ja) 2014-12-25 2016-07-07 日東電工株式会社 光硬化性樹脂組成物およびそれを用いた光学材料
WO2018155013A1 (ja) * 2017-02-22 2018-08-30 日産化学工業株式会社 インプリント用光硬化性組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201704370A (zh) * 2015-04-21 2017-02-01 住友化學股份有限公司 光硬化性樹脂組成物，使用該組成物之硬化膜之製造方法以及含有該硬化膜之積層體
TW201819556A (zh) * 2016-09-16 2018-06-01 日商住友精化股份有限公司 含有聚輪烷之組成物及其硬化物

Also Published As

Publication number Publication date
JP7021710B2 (ja) 2022-02-17
KR20210106459A (ko) 2021-08-30
WO2020129902A1 (ja) 2020-06-25
CN113195547B (zh) 2023-08-11
TW202039606A (zh) 2020-11-01
JPWO2020129902A1 (ja) 2021-11-04
KR102496908B1 (ko) 2023-02-07
CN113195547A (zh) 2021-07-30
SG11202106695XA (en) 2021-07-29

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