KR102496908B1 - 임프린트용 광경화성 조성물 - Google Patents

임프린트용 광경화성 조성물 Download PDF

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KR102496908B1
KR102496908B1 KR1020217020074A KR20217020074A KR102496908B1 KR 102496908 B1 KR102496908 B1 KR 102496908B1 KR 1020217020074 A KR1020217020074 A KR 1020217020074A KR 20217020074 A KR20217020074 A KR 20217020074A KR 102496908 B1 KR102496908 B1 KR 102496908B1
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South Korea
Prior art keywords
component
meth
photocurable composition
acrylate
ethylenically unsaturated
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KR1020217020074A
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English (en)
Korean (ko)
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KR20210106459A (ko
Inventor
쇼타 이마이
타케히로 나가사와
타쿠 카토
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닛산 가가쿠 가부시키가이샤
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Publication of KR20210106459A publication Critical patent/KR20210106459A/ko
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F251/00Macromolecular compounds obtained by polymerising monomers on to polysaccharides or derivatives thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/44Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/12Esters of monohydric alcohols or phenols
    • C08F220/16Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/13Phenols; Phenolates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/36Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37Thiols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/36Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37Thiols
    • C08K5/372Sulfides, e.g. R-(S)x-R'
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/04Ingredients treated with organic substances
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G02B1/041Lenses
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
KR1020217020074A 2018-12-21 2019-12-16 임프린트용 광경화성 조성물 KR102496908B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2018-240319 2018-12-21
JP2018240319 2018-12-21
PCT/JP2019/049184 WO2020129902A1 (ja) 2018-12-21 2019-12-16 インプリント用光硬化性組成物

Publications (2)

Publication Number Publication Date
KR20210106459A KR20210106459A (ko) 2021-08-30
KR102496908B1 true KR102496908B1 (ko) 2023-02-07

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KR1020217020074A KR102496908B1 (ko) 2018-12-21 2019-12-16 임프린트용 광경화성 조성물

Country Status (6)

Country Link
JP (1) JP7021710B2 (ja)
KR (1) KR102496908B1 (ja)
CN (1) CN113195547B (ja)
SG (1) SG11202106695XA (ja)
TW (1) TWI805881B (ja)
WO (1) WO2020129902A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023157024A (ja) * 2020-09-14 2023-10-26 日産化学株式会社 インプリント用プライマー層形成組成物
CN116940456A (zh) * 2021-03-30 2023-10-24 东洋合成工业株式会社 压印用固化性组合物、图案形成方法及零件制造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015071741A (ja) 2013-09-04 2015-04-16 Jsr株式会社 硬化性組成物、ナノインプリント材料、硬化膜、積層体、硬化膜の製造方法、パターン形成方法及び半導体発光素子用基板
WO2018052008A1 (ja) 2016-09-16 2018-03-22 住友精化株式会社 ポリロタキサン含有組成物及びその硬化物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5470246B2 (ja) * 2008-05-07 2014-04-16 アドバンスト・ソフトマテリアルズ株式会社 ポリロタキサン、及びポリロタキサンとポリマーとの架橋体、並びにこれらの製造方法
JP2010000612A (ja) * 2008-06-18 2010-01-07 Fujifilm Corp ナノインプリント用硬化性組成物、パターン形成方法
KR101779531B1 (ko) 2010-02-26 2017-09-18 신닛테츠 수미킨 가가쿠 가부시키가이샤 경화성 수지 조성물, 그 경화물 및 광학 재료
JP2014234458A (ja) 2013-06-03 2014-12-15 昭和電工株式会社 硬化性組成物およびその硬化物
KR102387237B1 (ko) 2014-11-04 2022-04-18 가부시키가이샤 에이에스엠 광경화성 조성물, 광경화성 조성물로 형성되는 경화체, 및 해당 경화체의 제조 방법
JP2016121277A (ja) 2014-12-25 2016-07-07 日東電工株式会社 光硬化性樹脂組成物およびそれを用いた光学材料
JPWO2016171187A1 (ja) * 2015-04-21 2018-02-15 住友化学株式会社 光硬化性樹脂組成物、これを用いる硬化膜の製造方法及び該硬化膜を含む積層体
JPWO2018155013A1 (ja) * 2017-02-22 2019-12-12 日産化学株式会社 インプリント用光硬化性組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015071741A (ja) 2013-09-04 2015-04-16 Jsr株式会社 硬化性組成物、ナノインプリント材料、硬化膜、積層体、硬化膜の製造方法、パターン形成方法及び半導体発光素子用基板
WO2018052008A1 (ja) 2016-09-16 2018-03-22 住友精化株式会社 ポリロタキサン含有組成物及びその硬化物

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Publication number Publication date
KR20210106459A (ko) 2021-08-30
JPWO2020129902A1 (ja) 2021-11-04
TWI805881B (zh) 2023-06-21
WO2020129902A1 (ja) 2020-06-25
SG11202106695XA (en) 2021-07-29
CN113195547A (zh) 2021-07-30
JP7021710B2 (ja) 2022-02-17
CN113195547B (zh) 2023-08-11
TW202039606A (zh) 2020-11-01

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