SG11202106695XA - Photocurable composition for imprinting - Google Patents
Photocurable composition for imprintingInfo
- Publication number
- SG11202106695XA SG11202106695XA SG11202106695XA SG11202106695XA SG11202106695XA SG 11202106695X A SG11202106695X A SG 11202106695XA SG 11202106695X A SG11202106695X A SG 11202106695XA SG 11202106695X A SG11202106695X A SG 11202106695XA SG 11202106695X A SG11202106695X A SG 11202106695XA
- Authority
- SG
- Singapore
- Prior art keywords
- imprinting
- photocurable composition
- photocurable
- composition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F251/00—Macromolecular compounds obtained by polymerising monomers on to polysaccharides or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/37—Thiols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/37—Thiols
- C08K5/372—Sulfides, e.g. R-(S)x-R'
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
- G02B1/041—Lenses
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Polymerisation Methods In General (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018240319 | 2018-12-21 | ||
PCT/JP2019/049184 WO2020129902A1 (ja) | 2018-12-21 | 2019-12-16 | インプリント用光硬化性組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202106695XA true SG11202106695XA (en) | 2021-07-29 |
Family
ID=71101301
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202106695XA SG11202106695XA (en) | 2018-12-21 | 2019-12-16 | Photocurable composition for imprinting |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP7021710B2 (ja) |
KR (1) | KR102496908B1 (ja) |
CN (1) | CN113195547B (ja) |
SG (1) | SG11202106695XA (ja) |
TW (1) | TWI805881B (ja) |
WO (1) | WO2020129902A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023157024A (ja) * | 2020-09-14 | 2023-10-26 | 日産化学株式会社 | インプリント用プライマー層形成組成物 |
CN116940456A (zh) * | 2021-03-30 | 2023-10-24 | 东洋合成工业株式会社 | 压印用固化性组合物、图案形成方法及零件制造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5470246B2 (ja) * | 2008-05-07 | 2014-04-16 | アドバンスト・ソフトマテリアルズ株式会社 | ポリロタキサン、及びポリロタキサンとポリマーとの架橋体、並びにこれらの製造方法 |
JP2010000612A (ja) * | 2008-06-18 | 2010-01-07 | Fujifilm Corp | ナノインプリント用硬化性組成物、パターン形成方法 |
KR101779531B1 (ko) | 2010-02-26 | 2017-09-18 | 신닛테츠 수미킨 가가쿠 가부시키가이샤 | 경화성 수지 조성물, 그 경화물 및 광학 재료 |
JP2014234458A (ja) | 2013-06-03 | 2014-12-15 | 昭和電工株式会社 | 硬化性組成物およびその硬化物 |
JP2015071741A (ja) * | 2013-09-04 | 2015-04-16 | Jsr株式会社 | 硬化性組成物、ナノインプリント材料、硬化膜、積層体、硬化膜の製造方法、パターン形成方法及び半導体発光素子用基板 |
KR102387237B1 (ko) | 2014-11-04 | 2022-04-18 | 가부시키가이샤 에이에스엠 | 광경화성 조성물, 광경화성 조성물로 형성되는 경화체, 및 해당 경화체의 제조 방법 |
JP2016121277A (ja) | 2014-12-25 | 2016-07-07 | 日東電工株式会社 | 光硬化性樹脂組成物およびそれを用いた光学材料 |
JPWO2016171187A1 (ja) * | 2015-04-21 | 2018-02-15 | 住友化学株式会社 | 光硬化性樹脂組成物、これを用いる硬化膜の製造方法及び該硬化膜を含む積層体 |
WO2018052008A1 (ja) * | 2016-09-16 | 2018-03-22 | 住友精化株式会社 | ポリロタキサン含有組成物及びその硬化物 |
JPWO2018155013A1 (ja) * | 2017-02-22 | 2019-12-12 | 日産化学株式会社 | インプリント用光硬化性組成物 |
-
2019
- 2019-12-16 WO PCT/JP2019/049184 patent/WO2020129902A1/ja active Application Filing
- 2019-12-16 JP JP2020561413A patent/JP7021710B2/ja active Active
- 2019-12-16 KR KR1020217020074A patent/KR102496908B1/ko active IP Right Grant
- 2019-12-16 SG SG11202106695XA patent/SG11202106695XA/en unknown
- 2019-12-16 CN CN201980084213.8A patent/CN113195547B/zh active Active
- 2019-12-19 TW TW108146556A patent/TWI805881B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR20210106459A (ko) | 2021-08-30 |
JPWO2020129902A1 (ja) | 2021-11-04 |
TWI805881B (zh) | 2023-06-21 |
WO2020129902A1 (ja) | 2020-06-25 |
KR102496908B1 (ko) | 2023-02-07 |
CN113195547A (zh) | 2021-07-30 |
JP7021710B2 (ja) | 2022-02-17 |
CN113195547B (zh) | 2023-08-11 |
TW202039606A (zh) | 2020-11-01 |
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