TWI799754B - 整合式發光裝置、及發光模組 - Google Patents

整合式發光裝置、及發光模組 Download PDF

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Publication number
TWI799754B
TWI799754B TW109137811A TW109137811A TWI799754B TW I799754 B TWI799754 B TW I799754B TW 109137811 A TW109137811 A TW 109137811A TW 109137811 A TW109137811 A TW 109137811A TW I799754 B TWI799754 B TW I799754B
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TW
Taiwan
Prior art keywords
light
emitting device
emitting
integrated
emitting element
Prior art date
Application number
TW109137811A
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English (en)
Chinese (zh)
Other versions
TW202112181A (zh
Inventor
山田元量
山田有一
Original Assignee
日商日亞化學工業股份有限公司
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Publication of TW202112181A publication Critical patent/TW202112181A/zh
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Publication of TWI799754B publication Critical patent/TWI799754B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Planar Illumination Modules (AREA)
TW109137811A 2015-10-08 2016-10-07 整合式發光裝置、及發光模組 TWI799754B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP??2015-200445 2015-10-08
JP2015200445 2015-10-08
JP??2016-197968 2016-10-06
JP2016197968A JP6506899B2 (ja) 2015-10-08 2016-10-06 発光装置、集積型発光装置および発光モジュール

Publications (2)

Publication Number Publication Date
TW202112181A TW202112181A (zh) 2021-03-16
TWI799754B true TWI799754B (zh) 2023-04-21

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
TW109137811A TWI799754B (zh) 2015-10-08 2016-10-07 整合式發光裝置、及發光模組
TW105132674A TWI712181B (zh) 2015-10-08 2016-10-07 發光裝置、整合式發光裝置、及發光模組

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW105132674A TWI712181B (zh) 2015-10-08 2016-10-07 發光裝置、整合式發光裝置、及發光模組

Country Status (8)

Country Link
JP (3) JP6506899B2 (https=)
KR (1) KR102632427B1 (https=)
CN (2) CN113437202B (https=)
AU (1) AU2016238924B2 (https=)
BR (1) BR112018006931B1 (https=)
CA (1) CA2999401C (https=)
RU (1) RU2717381C2 (https=)
TW (2) TWI799754B (https=)

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JP7082273B2 (ja) * 2017-07-21 2022-06-08 日亜化学工業株式会社 発光装置、集積型発光装置および発光モジュール
CN109390327B (zh) * 2017-08-02 2020-10-30 吴裕朝 发光装置、应用其的背光模组、光源模组及其制备方法
KR102631105B1 (ko) 2017-08-31 2024-01-30 니치아 카가쿠 고교 가부시키가이샤 발광 장치
JP7522529B2 (ja) * 2017-08-31 2024-07-25 日亜化学工業株式会社 発光装置
JP7082272B2 (ja) * 2017-09-27 2022-06-08 日亜化学工業株式会社 発光装置
JP7174216B2 (ja) * 2017-10-23 2022-11-17 日亜化学工業株式会社 発光モジュールおよび集積型発光モジュール
JP7077202B2 (ja) * 2017-10-26 2022-05-30 晶元光電股▲ふん▼有限公司 発光装置
JP6870592B2 (ja) 2017-11-24 2021-05-12 豊田合成株式会社 発光装置
JP7177331B2 (ja) 2018-06-29 2022-11-24 日亜化学工業株式会社 発光装置
CN111649261B (zh) * 2019-03-04 2023-01-10 群创光电股份有限公司 电子装置
JP7180552B2 (ja) * 2019-06-21 2022-11-30 豊田合成株式会社 発光装置の製造管理方法
JP7226131B2 (ja) * 2019-06-25 2023-02-21 豊田合成株式会社 発光装置及びその製造方法
JP2021009806A (ja) * 2019-07-01 2021-01-28 大日本印刷株式会社 バックライトモジュール、および表示装置
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Also Published As

Publication number Publication date
KR102632427B1 (ko) 2024-01-31
CA2999401C (en) 2025-07-08
BR112018006931B1 (pt) 2022-11-29
JP7175099B2 (ja) 2022-11-18
CA2999401A1 (en) 2017-04-13
TWI712181B (zh) 2020-12-01
CN106571421B (zh) 2021-07-09
KR20170044032A (ko) 2017-04-24
RU2018112372A (ru) 2019-10-07
TW202112181A (zh) 2021-03-16
JP7252483B2 (ja) 2023-04-05
JP6506899B2 (ja) 2019-04-24
JP2021170688A (ja) 2021-10-28
JP2017073549A (ja) 2017-04-13
JP2018139303A (ja) 2018-09-06
RU2018112372A3 (https=) 2019-12-05
AU2016238924A1 (en) 2017-04-27
BR112018006931A2 (en) 2018-10-16
AU2016238924B2 (en) 2021-06-10
CN106571421A (zh) 2017-04-19
CN113437202B (zh) 2025-11-04
CN113437202A (zh) 2021-09-24
RU2717381C2 (ru) 2020-03-23
TW201724554A (zh) 2017-07-01

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