TWI799754B - Integrated light-emitting device, and light-emitting module - Google Patents

Integrated light-emitting device, and light-emitting module Download PDF

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Publication number
TWI799754B
TWI799754B TW109137811A TW109137811A TWI799754B TW I799754 B TWI799754 B TW I799754B TW 109137811 A TW109137811 A TW 109137811A TW 109137811 A TW109137811 A TW 109137811A TW I799754 B TWI799754 B TW I799754B
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TW
Taiwan
Prior art keywords
light
emitting
emitting device
integrated
emitting module
Prior art date
Application number
TW109137811A
Other languages
Chinese (zh)
Other versions
TW202112181A (en
Inventor
山田元量
山田有一
Original Assignee
日商日亞化學工業股份有限公司
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Publication of TW202112181A publication Critical patent/TW202112181A/en
Application granted granted Critical
Publication of TWI799754B publication Critical patent/TWI799754B/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)
  • Led Devices (AREA)
TW109137811A 2015-10-08 2016-10-07 Integrated light-emitting device, and light-emitting module TWI799754B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP??2015-200445 2015-10-08
JP2015200445 2015-10-08
JP??2016-197968 2016-10-06
JP2016197968A JP6506899B2 (en) 2015-10-08 2016-10-06 Light emitting device, integrated light emitting device and light emitting module

Publications (2)

Publication Number Publication Date
TW202112181A TW202112181A (en) 2021-03-16
TWI799754B true TWI799754B (en) 2023-04-21

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
TW105132674A TWI712181B (en) 2015-10-08 2016-10-07 Light-emitting device, integrated light-emitting device, and light-emitting module
TW109137811A TWI799754B (en) 2015-10-08 2016-10-07 Integrated light-emitting device, and light-emitting module

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW105132674A TWI712181B (en) 2015-10-08 2016-10-07 Light-emitting device, integrated light-emitting device, and light-emitting module

Country Status (8)

Country Link
JP (3) JP6506899B2 (en)
KR (1) KR102632427B1 (en)
CN (2) CN113437202A (en)
AU (1) AU2016238924B2 (en)
BR (1) BR112018006931B1 (en)
CA (1) CA2999401A1 (en)
RU (1) RU2717381C2 (en)
TW (2) TWI712181B (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7082273B2 (en) * 2017-07-21 2022-06-08 日亜化学工業株式会社 Light emitting device, integrated light emitting device and light emitting module
CN116884966A (en) 2017-07-21 2023-10-13 日亚化学工业株式会社 Backlight device and light source
CN109390327B (en) * 2017-08-02 2020-10-30 吴裕朝 Light-emitting device, backlight module applying same, light source module and preparation method thereof
JP7522529B2 (en) * 2017-08-31 2024-07-25 日亜化学工業株式会社 Light-emitting device
KR102631105B1 (en) * 2017-08-31 2024-01-30 니치아 카가쿠 고교 가부시키가이샤 Light emitting device
JP7082272B2 (en) * 2017-09-27 2022-06-08 日亜化学工業株式会社 Light emitting device
JP7174216B2 (en) * 2017-10-23 2022-11-17 日亜化学工業株式会社 Light-emitting modules and integrated light-emitting modules
JP7077202B2 (en) * 2017-10-26 2022-05-30 晶元光電股▲ふん▼有限公司 Light emitting device
JP6870592B2 (en) 2017-11-24 2021-05-12 豊田合成株式会社 Light emitting device
JP7177331B2 (en) 2018-06-29 2022-11-24 日亜化学工業株式会社 light emitting device
JP7180552B2 (en) * 2019-06-21 2022-11-30 豊田合成株式会社 Manufacturing control method for light emitting device
JP7226131B2 (en) 2019-06-25 2023-02-21 豊田合成株式会社 Light emitting device and manufacturing method thereof
JP2021009806A (en) * 2019-07-01 2021-01-28 大日本印刷株式会社 Backlight module and display device
CN112485803A (en) * 2019-08-21 2021-03-12 Oppo广东移动通信有限公司 Laser emitting device, manufacturing method thereof and flight time measuring device
JP7508278B2 (en) 2020-06-04 2024-07-01 キヤノン株式会社 Exposure apparatus, exposure method, and method for manufacturing article
JP7143967B1 (en) * 2020-10-20 2022-09-29 大日本印刷株式会社 Surface light-emitting device, display device, sealing member sheet for surface light-emitting device, and method for manufacturing surface light-emitting device
CN116779744A (en) * 2023-06-30 2023-09-19 淮安澳洋顺昌光电技术有限公司 Chip-level LED packaging element

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070138494A1 (en) * 2005-12-19 2007-06-21 Lumileds Lighting U.S., Llc Light-emitting device
US20070284600A1 (en) * 2006-06-09 2007-12-13 Philips Lumileds Lighting Company, Llc Low Profile Side Emitting LED
TW201413347A (en) * 2012-09-19 2014-04-01 Chi Lin Technology Co Ltd Backlight module having light wave length converting element
US20150226400A1 (en) * 2011-03-25 2015-08-13 Sharp Kabushiki Kaisha Light-emitting device, illuminating apparatus, and display apparatus

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6155699A (en) * 1999-03-15 2000-12-05 Agilent Technologies, Inc. Efficient phosphor-conversion led structure
JP2001257381A (en) * 2000-03-13 2001-09-21 Sharp Corp Light-emitting diode, manufacturing method therefor and illumination device
US6345903B1 (en) * 2000-09-01 2002-02-12 Citizen Electronics Co., Ltd. Surface-mount type emitting diode and method of manufacturing same
AU2002217845A1 (en) * 2000-11-16 2002-05-27 Emcore Corporation Microelectronic package having improved light extraction
JP2002280614A (en) * 2001-03-14 2002-09-27 Citizen Electronics Co Ltd Light emitting diode
RU2207663C2 (en) * 2001-07-17 2003-06-27 Ооо Нпц Оэп "Оптэл" Light-emitting diode
JP2004253436A (en) * 2003-02-18 2004-09-09 Citizen Electronics Co Ltd Light emitting diode
JP2004304041A (en) * 2003-03-31 2004-10-28 Citizen Electronics Co Ltd Light emitting diode
DE102004001312B4 (en) * 2003-07-25 2010-09-30 Seoul Semiconductor Co., Ltd. Chip light-emitting diode and method for its production
JP2006049857A (en) * 2004-06-29 2006-02-16 Fuji Photo Film Co Ltd Light source, light source manufacturing method and color thermal printer
JP2006261540A (en) * 2005-03-18 2006-09-28 Stanley Electric Co Ltd Light emitting device
RU53500U1 (en) * 2005-11-22 2006-05-10 Емельян Михайлович Гамарц ELECTROLUMINESCENT RADIATOR
KR100649765B1 (en) * 2005-12-21 2006-11-27 삼성전기주식회사 Led package and back light unit using the same
JP2008041290A (en) 2006-08-02 2008-02-21 Akita Denshi Systems:Kk Lighting device and manufacturing method therefor
US8755005B2 (en) * 2008-09-24 2014-06-17 Koninklijke Philips N.V. Thin edge backlight with LEDS optically coupled to the back surface
JP2010092672A (en) 2008-10-06 2010-04-22 Harison Toshiba Lighting Corp Backlight device, and display device
JP5347953B2 (en) * 2009-12-28 2013-11-20 日亜化学工業株式会社 Light emitting device and manufacturing method thereof
US9263315B2 (en) * 2010-03-30 2016-02-16 Dai Nippon Printing Co., Ltd. LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
CN102933893B (en) * 2010-06-15 2015-06-03 夏普株式会社 Lighting device, display device, and television reception device
JP5178796B2 (en) * 2010-09-10 2013-04-10 三菱電機株式会社 Light emitting device and lighting device
JP2012204370A (en) * 2011-03-23 2012-10-22 Sony Corp Light source circuit unit, lighting device, and display device
JP5796209B2 (en) * 2011-05-23 2015-10-21 パナソニックＩｐマネジメント株式会社 LIGHT EMITTING DEVICE AND LIGHTING DEVICE USING THE SAME
US8624482B2 (en) * 2011-09-01 2014-01-07 Toshiba Techno Center Inc. Distributed bragg reflector for reflecting light of multiple wavelengths from an LED
JP2013077798A (en) * 2011-09-14 2013-04-25 Toyoda Gosei Co Ltd Glass sealing led lamp and manufacturing method of the same
JP6048001B2 (en) * 2012-07-13 2016-12-21 日亜化学工業株式会社 Light emitting device
TWI528083B (en) * 2012-11-29 2016-04-01 鴻海精密工業股份有限公司 Backlight module
JP2014187095A (en) * 2013-03-22 2014-10-02 Toshiba Lighting & Technology Corp Led module and illumination device
JP6179854B2 (en) * 2013-07-23 2017-08-16 パナソニックＩｐマネジメント株式会社 lighting equipment
JP6273124B2 (en) * 2013-11-08 2018-01-31 シチズン電子株式会社 LED lighting device
JP2017501580A (en) * 2013-12-19 2017-01-12 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． LED module with uniform fluorescent lighting
CN104766916A (en) * 2014-01-07 2015-07-08 易美芯光（北京）科技有限公司 LED integrated light source adopting inverted blue light chip for packaging
CN103872223A (en) * 2014-01-26 2014-06-18 上海瑞丰光电子有限公司 LED (light-emitting diode) chip scale packaging method
RU151161U1 (en) * 2014-08-19 2015-03-20 Общество с ограниченной ответственностью "ЭНЕРКОМ" A WHITE LIGHT SOURCE AND A LAMP CONTAINING SUCH A SOURCE

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070138494A1 (en) * 2005-12-19 2007-06-21 Lumileds Lighting U.S., Llc Light-emitting device
US20070284600A1 (en) * 2006-06-09 2007-12-13 Philips Lumileds Lighting Company, Llc Low Profile Side Emitting LED
US20150226400A1 (en) * 2011-03-25 2015-08-13 Sharp Kabushiki Kaisha Light-emitting device, illuminating apparatus, and display apparatus
TW201413347A (en) * 2012-09-19 2014-04-01 Chi Lin Technology Co Ltd Backlight module having light wave length converting element

Also Published As

Publication number Publication date
JP7252483B2 (en) 2023-04-05
RU2018112372A (en) 2019-10-07
JP2018139303A (en) 2018-09-06
TW201724554A (en) 2017-07-01
RU2018112372A3 (en) 2019-12-05
JP6506899B2 (en) 2019-04-24
JP7175099B2 (en) 2022-11-18
JP2021170688A (en) 2021-10-28
CN106571421A (en) 2017-04-19
AU2016238924B2 (en) 2021-06-10
RU2717381C2 (en) 2020-03-23
TW202112181A (en) 2021-03-16
CN113437202A (en) 2021-09-24
KR20170044032A (en) 2017-04-24
BR112018006931A2 (en) 2018-10-16
KR102632427B1 (en) 2024-01-31
CA2999401A1 (en) 2017-04-13
BR112018006931B1 (en) 2022-11-29
CN106571421B (en) 2021-07-09
AU2016238924A1 (en) 2017-04-27
JP2017073549A (en) 2017-04-13
TWI712181B (en) 2020-12-01

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