CA2999401C - LIGHT EMITTING DEVICE, INTEGRATED LIGHT EMITTING DEVICE AND LIGHT EMITTING MODULE - Google Patents

LIGHT EMITTING DEVICE, INTEGRATED LIGHT EMITTING DEVICE AND LIGHT EMITTING MODULE

Info

Publication number
CA2999401C
CA2999401C CA2999401A CA2999401A CA2999401C CA 2999401 C CA2999401 C CA 2999401C CA 2999401 A CA2999401 A CA 2999401A CA 2999401 A CA2999401 A CA 2999401A CA 2999401 C CA2999401 C CA 2999401C
Authority
CA
Canada
Prior art keywords
light
emitting device
emitting
emitting element
encapsulant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CA2999401A
Other languages
English (en)
French (fr)
Other versions
CA2999401A1 (en
Inventor
Motokazu Yamada
Yuichi Yamada
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority claimed from PCT/JP2016/004528 external-priority patent/WO2017061127A1/en
Publication of CA2999401A1 publication Critical patent/CA2999401A1/en
Application granted granted Critical
Publication of CA2999401C publication Critical patent/CA2999401C/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Planar Illumination Modules (AREA)
CA2999401A 2015-10-08 2016-10-07 LIGHT EMITTING DEVICE, INTEGRATED LIGHT EMITTING DEVICE AND LIGHT EMITTING MODULE Active CA2999401C (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2015-200445 2015-10-08
JP2015200445 2015-10-08
JP2016197968A JP6506899B2 (ja) 2015-10-08 2016-10-06 発光装置、集積型発光装置および発光モジュール
JP2016-197968 2016-10-06
PCT/JP2016/004528 WO2017061127A1 (en) 2015-10-08 2016-10-07 Light-emitting device, integrated light-emitting device, and light-emitting module

Publications (2)

Publication Number Publication Date
CA2999401A1 CA2999401A1 (en) 2017-04-13
CA2999401C true CA2999401C (en) 2025-07-08

Family

ID=58538425

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2999401A Active CA2999401C (en) 2015-10-08 2016-10-07 LIGHT EMITTING DEVICE, INTEGRATED LIGHT EMITTING DEVICE AND LIGHT EMITTING MODULE

Country Status (8)

Country Link
JP (3) JP6506899B2 (https=)
KR (1) KR102632427B1 (https=)
CN (2) CN113437202B (https=)
AU (1) AU2016238924B2 (https=)
BR (1) BR112018006931B1 (https=)
CA (1) CA2999401C (https=)
RU (1) RU2717381C2 (https=)
TW (2) TWI799754B (https=)

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CN109390327B (zh) * 2017-08-02 2020-10-30 吴裕朝 发光装置、应用其的背光模组、光源模组及其制备方法
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JP7522529B2 (ja) * 2017-08-31 2024-07-25 日亜化学工業株式会社 発光装置
JP7082272B2 (ja) * 2017-09-27 2022-06-08 日亜化学工業株式会社 発光装置
JP7174216B2 (ja) * 2017-10-23 2022-11-17 日亜化学工業株式会社 発光モジュールおよび集積型発光モジュール
JP7077202B2 (ja) * 2017-10-26 2022-05-30 晶元光電股▲ふん▼有限公司 発光装置
JP6870592B2 (ja) 2017-11-24 2021-05-12 豊田合成株式会社 発光装置
JP7177331B2 (ja) 2018-06-29 2022-11-24 日亜化学工業株式会社 発光装置
CN111649261B (zh) * 2019-03-04 2023-01-10 群创光电股份有限公司 电子装置
JP7180552B2 (ja) * 2019-06-21 2022-11-30 豊田合成株式会社 発光装置の製造管理方法
JP7226131B2 (ja) * 2019-06-25 2023-02-21 豊田合成株式会社 発光装置及びその製造方法
JP2021009806A (ja) * 2019-07-01 2021-01-28 大日本印刷株式会社 バックライトモジュール、および表示装置
CN112485803A (zh) * 2019-08-21 2021-03-12 Oppo广东移动通信有限公司 激光发射装置及制作方法、飞行时间测量装置
JP7508278B2 (ja) * 2020-06-04 2024-07-01 キヤノン株式会社 露光装置、露光方法、及び物品の製造方法
US20230378403A1 (en) * 2020-10-20 2023-11-23 Dai Nippon Printing Co., Ltd. Surface-emitting device, display device, sealing member sheet for surface-emitting device, and method for producing surface-emitting device
CN116779744A (zh) * 2023-06-30 2023-09-19 淮安澳洋顺昌光电技术有限公司 一种芯片级led封装元件

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Also Published As

Publication number Publication date
KR102632427B1 (ko) 2024-01-31
BR112018006931B1 (pt) 2022-11-29
JP7175099B2 (ja) 2022-11-18
CA2999401A1 (en) 2017-04-13
TWI712181B (zh) 2020-12-01
CN106571421B (zh) 2021-07-09
KR20170044032A (ko) 2017-04-24
RU2018112372A (ru) 2019-10-07
TW202112181A (zh) 2021-03-16
JP7252483B2 (ja) 2023-04-05
JP6506899B2 (ja) 2019-04-24
JP2021170688A (ja) 2021-10-28
JP2017073549A (ja) 2017-04-13
JP2018139303A (ja) 2018-09-06
RU2018112372A3 (https=) 2019-12-05
AU2016238924A1 (en) 2017-04-27
TWI799754B (zh) 2023-04-21
BR112018006931A2 (en) 2018-10-16
AU2016238924B2 (en) 2021-06-10
CN106571421A (zh) 2017-04-19
CN113437202B (zh) 2025-11-04
CN113437202A (zh) 2021-09-24
RU2717381C2 (ru) 2020-03-23
TW201724554A (zh) 2017-07-01

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