TWI712181B - 發光裝置、整合式發光裝置、及發光模組 - Google Patents

發光裝置、整合式發光裝置、及發光模組 Download PDF

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Publication number
TWI712181B
TWI712181B TW105132674A TW105132674A TWI712181B TW I712181 B TWI712181 B TW I712181B TW 105132674 A TW105132674 A TW 105132674A TW 105132674 A TW105132674 A TW 105132674A TW I712181 B TWI712181 B TW I712181B
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Taiwan
Prior art keywords
light
emitting
emitting device
emitting element
encapsulant
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TW105132674A
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English (en)
Chinese (zh)
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TW201724554A (zh
Inventor
山田元量
山田有一
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日商日亞化學工業股份有限公司
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Planar Illumination Modules (AREA)
TW105132674A 2015-10-08 2016-10-07 發光裝置、整合式發光裝置、及發光模組 TWI712181B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2015200445 2015-10-08
JP??2015-200445 2015-10-08
JP??2016-197968 2016-10-06
JP2016197968A JP6506899B2 (ja) 2015-10-08 2016-10-06 発光装置、集積型発光装置および発光モジュール

Publications (2)

Publication Number Publication Date
TW201724554A TW201724554A (zh) 2017-07-01
TWI712181B true TWI712181B (zh) 2020-12-01

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
TW105132674A TWI712181B (zh) 2015-10-08 2016-10-07 發光裝置、整合式發光裝置、及發光模組
TW109137811A TWI799754B (zh) 2015-10-08 2016-10-07 整合式發光裝置、及發光模組

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW109137811A TWI799754B (zh) 2015-10-08 2016-10-07 整合式發光裝置、及發光模組

Country Status (8)

Country Link
JP (3) JP6506899B2 (https=)
KR (1) KR102632427B1 (https=)
CN (2) CN106571421B (https=)
AU (1) AU2016238924B2 (https=)
BR (1) BR112018006931B1 (https=)
CA (1) CA2999401C (https=)
RU (1) RU2717381C2 (https=)
TW (2) TWI712181B (https=)

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JP7082273B2 (ja) * 2017-07-21 2022-06-08 日亜化学工業株式会社 発光装置、集積型発光装置および発光モジュール
CN116884966A (zh) 2017-07-21 2023-10-13 日亚化学工业株式会社 背光装置以及光源
CN109390327B (zh) * 2017-08-02 2020-10-30 吴裕朝 发光装置、应用其的背光模组、光源模组及其制备方法
KR102631105B1 (ko) * 2017-08-31 2024-01-30 니치아 카가쿠 고교 가부시키가이샤 발광 장치
JP7522529B2 (ja) * 2017-08-31 2024-07-25 日亜化学工業株式会社 発光装置
JP7082272B2 (ja) * 2017-09-27 2022-06-08 日亜化学工業株式会社 発光装置
JP7174216B2 (ja) * 2017-10-23 2022-11-17 日亜化学工業株式会社 発光モジュールおよび集積型発光モジュール
KR102424005B1 (ko) * 2017-10-26 2022-07-25 에피스타 코포레이션 발광 장치
JP6870592B2 (ja) 2017-11-24 2021-05-12 豊田合成株式会社 発光装置
JP7177331B2 (ja) 2018-06-29 2022-11-24 日亜化学工業株式会社 発光装置
CN115875637A (zh) * 2019-03-04 2023-03-31 群创光电股份有限公司 电子装置
JP7180552B2 (ja) * 2019-06-21 2022-11-30 豊田合成株式会社 発光装置の製造管理方法
JP7226131B2 (ja) * 2019-06-25 2023-02-21 豊田合成株式会社 発光装置及びその製造方法
JP2021009806A (ja) * 2019-07-01 2021-01-28 大日本印刷株式会社 バックライトモジュール、および表示装置
CN112485803A (zh) * 2019-08-21 2021-03-12 Oppo广东移动通信有限公司 激光发射装置及制作方法、飞行时间测量装置
JP7508278B2 (ja) * 2020-06-04 2024-07-01 キヤノン株式会社 露光装置、露光方法、及び物品の製造方法
KR20260051096A (ko) * 2020-10-20 2026-04-15 다이니폰 인사츠 가부시키가이샤 면 발광 장치, 표시 장치, 면 발광 장치용 밀봉 부재 시트 및 면 발광 장치의 제조 방법
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Publication number Priority date Publication date Assignee Title
US6155699A (en) * 1999-03-15 2000-12-05 Agilent Technologies, Inc. Efficient phosphor-conversion led structure
US6345903B1 (en) * 2000-09-01 2002-02-12 Citizen Electronics Co., Ltd. Surface-mount type emitting diode and method of manufacturing same
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Also Published As

Publication number Publication date
JP6506899B2 (ja) 2019-04-24
CA2999401C (en) 2025-07-08
TW202112181A (zh) 2021-03-16
KR20170044032A (ko) 2017-04-24
RU2717381C2 (ru) 2020-03-23
CN113437202B (zh) 2025-11-04
TWI799754B (zh) 2023-04-21
TW201724554A (zh) 2017-07-01
CA2999401A1 (en) 2017-04-13
AU2016238924B2 (en) 2021-06-10
JP2021170688A (ja) 2021-10-28
CN106571421B (zh) 2021-07-09
KR102632427B1 (ko) 2024-01-31
JP2018139303A (ja) 2018-09-06
CN113437202A (zh) 2021-09-24
BR112018006931A2 (en) 2018-10-16
BR112018006931B1 (pt) 2022-11-29
JP2017073549A (ja) 2017-04-13
JP7175099B2 (ja) 2022-11-18
RU2018112372A3 (https=) 2019-12-05
AU2016238924A1 (en) 2017-04-27
RU2018112372A (ru) 2019-10-07
JP7252483B2 (ja) 2023-04-05
CN106571421A (zh) 2017-04-19

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