TWI786036B - 用於電路連接的接著劑組成物及結構體 - Google Patents

用於電路連接的接著劑組成物及結構體 Download PDF

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Publication number
TWI786036B
TWI786036B TW105135632A TW105135632A TWI786036B TW I786036 B TWI786036 B TW I786036B TW 105135632 A TW105135632 A TW 105135632A TW 105135632 A TW105135632 A TW 105135632A TW I786036 B TWI786036 B TW I786036B
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TW
Taiwan
Prior art keywords
mass
adhesive composition
silane compound
circuit
parts
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Application number
TW105135632A
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English (en)
Chinese (zh)
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TW201724924A (zh
Inventor
森尻智樹
竹田津潤
田中勝
立澤貴
工藤直
Original Assignee
日商昭和電工材料股份有限公司
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Publication of TW201724924A publication Critical patent/TW201724924A/zh
Application granted granted Critical
Publication of TWI786036B publication Critical patent/TWI786036B/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Combinations Of Printed Boards (AREA)
TW105135632A 2015-11-04 2016-11-03 用於電路連接的接著劑組成物及結構體 TWI786036B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-216516 2015-11-04
JP2015216516 2015-11-04

Publications (2)

Publication Number Publication Date
TW201724924A TW201724924A (zh) 2017-07-01
TWI786036B true TWI786036B (zh) 2022-12-11

Family

ID=58662435

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105135632A TWI786036B (zh) 2015-11-04 2016-11-03 用於電路連接的接著劑組成物及結構體

Country Status (5)

Country Link
JP (2) JP6915544B2 (ja)
KR (1) KR102608218B1 (ja)
CN (1) CN108350320B (ja)
TW (1) TWI786036B (ja)
WO (1) WO2017078087A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI671921B (zh) * 2018-09-14 2019-09-11 頎邦科技股份有限公司 晶片封裝構造及其晶片

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003060107A (ja) * 2001-06-05 2003-02-28 Matsushita Electric Ind Co Ltd 半導体モジュール
JP2011199097A (ja) * 2010-03-23 2011-10-06 Sumitomo Bakelite Co Ltd 半導体装置の製造方法

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* Cited by examiner, † Cited by third party
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JP2002285103A (ja) * 2001-03-26 2002-10-03 Sumitomo Bakelite Co Ltd 異方導電性接着剤
JP2004067908A (ja) * 2002-08-07 2004-03-04 Sumitomo Bakelite Co Ltd 異方導電性接着剤
JP4146747B2 (ja) * 2003-03-26 2008-09-10 積水化学工業株式会社 硬化性組成物
JP2006022231A (ja) * 2004-07-08 2006-01-26 Sumitomo Bakelite Co Ltd 異方導電性接着剤および異方導電性接着剤フィルム
KR101081263B1 (ko) * 2006-05-09 2011-11-08 히다치 가세고교 가부시끼가이샤 접착 시트, 이를 이용한 회로 부재의 접속 구조 및 반도체 장치
KR101100507B1 (ko) * 2007-05-09 2011-12-29 히다치 가세고교 가부시끼가이샤 필름상 회로 접속 재료 및 회로 부재의 접속 구조
KR20100080628A (ko) 2007-11-12 2010-07-09 히다치 가세고교 가부시끼가이샤 회로 접속 재료, 및 회로 부재의 접속 구조
KR101343864B1 (ko) * 2009-03-23 2013-12-20 세메다인 가부시키 가이샤 경화성 조성물
JP2012072305A (ja) * 2010-09-29 2012-04-12 Hitachi Chemical Co Ltd 樹脂ペースト組成物
JP5909911B2 (ja) * 2011-07-29 2016-04-27 住友ベークライト株式会社 液状樹脂組成物および半導体装置
WO2013035164A1 (ja) * 2011-09-06 2013-03-14 日立化成株式会社 接着剤組成物及び接続体
JP5934528B2 (ja) 2012-03-12 2016-06-15 デクセリアルズ株式会社 回路接続材料、及びそれを用いた実装体の製造方法
JP6250265B2 (ja) * 2012-03-16 2017-12-20 リンテック株式会社 接着剤組成物、接着シートおよび半導体装置の製造方法
KR20150005516A (ko) * 2012-04-25 2015-01-14 히타치가세이가부시끼가이샤 회로 접속 재료, 회로 접속 구조체, 접착 필름 및 권중체
JP2013253151A (ja) * 2012-06-06 2013-12-19 Hitachi Chemical Co Ltd 回路接続用接着フィルム、並びに回路部材の接続構造体及びその製造方法
CN103131336B (zh) * 2013-03-22 2015-06-10 苏州度辰新材料有限公司 一种硅烷交联的乙烯醋酸乙烯共聚物胶膜的制备方法
CN103360956B (zh) * 2013-06-18 2015-06-03 明基材料有限公司 一种用于电子元件间电性导通的粘着剂
JP6398570B2 (ja) * 2013-10-09 2018-10-03 日立化成株式会社 回路接続材料、回路部材の接続構造体、及び回路部材の接続構造体の製造方法
JP6437323B2 (ja) * 2014-02-14 2018-12-12 デクセリアルズ株式会社 接続構造体の製造方法、及び回路接続材料

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003060107A (ja) * 2001-06-05 2003-02-28 Matsushita Electric Ind Co Ltd 半導体モジュール
JP2011199097A (ja) * 2010-03-23 2011-10-06 Sumitomo Bakelite Co Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
JP7124936B2 (ja) 2022-08-24
TW201724924A (zh) 2017-07-01
WO2017078087A1 (ja) 2017-05-11
JPWO2017078087A1 (ja) 2018-09-06
CN108350320B (zh) 2021-11-26
JP6915544B2 (ja) 2021-08-04
JP2021165397A (ja) 2021-10-14
KR102608218B1 (ko) 2023-11-30
KR20180079370A (ko) 2018-07-10
CN108350320A (zh) 2018-07-31

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