JPWO2017078087A1 - 接着剤組成物及び構造体 - Google Patents
接着剤組成物及び構造体 Download PDFInfo
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- JPWO2017078087A1 JPWO2017078087A1 JP2017548820A JP2017548820A JPWO2017078087A1 JP WO2017078087 A1 JPWO2017078087 A1 JP WO2017078087A1 JP 2017548820 A JP2017548820 A JP 2017548820A JP 2017548820 A JP2017548820 A JP 2017548820A JP WO2017078087 A1 JPWO2017078087 A1 JP WO2017078087A1
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- adhesive composition
- silane compound
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- 230000001070 adhesive effect Effects 0.000 title claims abstract description 131
- 239000000203 mixture Substances 0.000 title claims abstract description 107
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- 229910000077 silane Inorganic materials 0.000 claims abstract description 86
- 150000001875 compounds Chemical class 0.000 claims abstract description 63
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- 125000000524 functional group Chemical group 0.000 claims abstract description 25
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- 238000010526 radical polymerization reaction Methods 0.000 abstract description 17
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- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
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- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 1
- QYJYJTDXBIYRHH-UHFFFAOYSA-N trimethoxy-[8-(oxiran-2-ylmethoxy)octyl]silane Chemical compound C(C1CO1)OCCCCCCCC[Si](OC)(OC)OC QYJYJTDXBIYRHH-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
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Abstract
Description
本実施形態の接着剤組成物は、シラン化合物と、ラジカル重合性化合物(ラジカル重合性物質)と、硬化剤と、を含有する。本実施形態の接着剤組成物は、シラン化合物として、ラジカル重合可能な官能基(硬化系のラジカル重合反応に関与する官能基。ラジカル重合系において重合し得る官能基)を有する第1のシラン化合物と、前記第1のシラン化合物と反応する第2のシラン化合物(前記第1のシラン化合物に該当する化合物を除く)とを含有する。本実施形態の接着剤組成物は、前記硬化剤として、1分間半減期温度が120℃以下である過酸化物を含有する。本実施形態の接着剤組成物は、ラジカル硬化系(ラジカル重合系)の接着剤組成物である。本実施形態の接着剤組成物は、回路接続用接着剤組成物として好適に用いることができる。以下、各成分について説明する。
本実施形態の接着剤組成物は、ラジカル重合可能な官能基を有する第1のシラン化合物と、前記第1のシラン化合物と反応する第2のシラン化合物とを含有する。第2のシラン化合物は、第1のシラン化合物に該当しない化合物であり、ラジカル重合可能な官能基を有していない。シラン化合物は、シランカップリング剤であってもよい。
ラジカル重合性化合物は、ラジカル重合可能な官能基を有する化合物であり、第1のシラン化合物に該当しない化合物である。このようなラジカル重合性化合物としては、(メタ)アクリレート化合物、マレイミド化合物、シトラコンイミド樹脂、ナジイミド樹脂等が挙げられる。「(メタ)アクリレート化合物」とは、(メタ)アクリロイル基を有する化合物を意味する。ラジカル重合性化合物は、モノマー又はオリゴマーの状態で用いてもよく、モノマーとオリゴマーとを併用することもできる。ラジカル重合性化合物は、1種単独で用いてもよく、2種以上を組み合わせて用いてもよい。
硬化剤としては、熱(加熱)により遊離ラジカルを発生する硬化剤、光により遊離ラジカルを発生する硬化剤、超音波、電磁波等により遊離ラジカルを発生する硬化剤などを用いることができる。
なお、半減期とは、過酸化物の濃度が初期の半分に減ずるまでの時間であり、1分間半減期温度は、半減期が1分間になる温度を示す。1分間半減期温度としては、日油株式会社発行のカタログ(有機過酸化物(第10版、2015年2月))掲載の値を用いることができる。
本実施形態の接着剤組成物は、必要に応じて、フィルム形成材を含有してもよい。フィルム形成材は、液状の接着剤組成物をフィルム状に固形化した場合に、通常の状態(常温常圧)でのフィルムの取扱い性を向上させ、裂け難い、割れ難い、べたつき難い等の特性をフィルムに付与することができる。フィルム形成材としては、フェノキシ樹脂、ポリビニルホルマール、ポリスチレン、ポリビニルブチラール、ポリエステル、ポリアミド、キシレン樹脂、ポリウレタン等が挙げられる。これらの中でも、接着性、相溶性、耐熱性及び機械的強度に優れる観点から、フェノキシ樹脂が好ましい。フィルム形成材は、1種単独で用いてもよく、2種以上を組み合わせて用いてもよい。
本実施形態の接着剤組成物は、導電粒子を更に含有していてもよい。導電粒子の構成材料としては、金(Au)、銀(Ag)、ニッケル(Ni)、銅(Cu)、はんだ等の金属、カーボンなどが挙げられる。また、非導電性の樹脂、ガラス、セラミック、プラスチック等を核とし、この核に前記金属(金属粒子等)又はカーボンを被覆した被覆導電粒子でもよい。被覆導電粒子又は熱溶融金属粒子は、加熱加圧により変形性を有するため、接続時に回路電極の高さばらつきを解消し、接続時に電極との接触面積が増加することから信頼性が向上するため好ましい。
本実施形態の接着剤組成物は、必要に応じて、ハイドロキノン、メチルエーテルハイドロキノン類等の重合禁止剤を適宜含有してもよい。
本実施形態の構造体は、本実施形態の接着剤組成物又はその硬化物を備える。本実施形態の構造体は、例えば、回路接続構造体等の半導体装置である。本実施形態の構造体の一態様として、回路接続構造体は、第一の回路電極を有する第一の回路部材と、第二の回路電極を有する第二の回路部材と、第一の回路部材及び第二の回路部材の間に配置された回路接続部材と、を備える。第一の回路部材は、例えば、第一の基板と、当該第一の基板上に配置された第一の回路電極と、を有する。第二の回路部材は、例えば、第二の基板と、当該第二の基板上に配置された第二の回路電極と、を有する。第一の回路電極及び第二の回路電極は、相対向すると共に電気的に接続されている。回路接続部材は、本実施形態の接着剤組成物又はその硬化物を含んでいる。本実施形態に係る構造体は、本実施形態に係る接着剤組成物又はその硬化物を備えていればよく、前記回路接続構造体の回路部材に代えて、回路電極を有していない部材(基板等)を用いてもよい。
還流冷却器、温度計及び撹拌機を備えたセパラブルフラスコに、エーテル結合を有するジオールであるポリプロピレングリコール(和光純薬工業株式会社製、数平均分子量Mn=2000)1000質量部、及び、メチルエチルケトン(溶剤)4000質量部を加えた後、40℃で30分間撹拌して反応液を調製した。前記反応液を70℃まで昇温した後、ジメチル錫ラウレート(触媒)0.0127質量部を加えた。次いで、この反応液に対して、4,4’−ジフェニルメタンジイソシアネート125質量部をメチルエチルケトン125質量部に溶解して調製した溶液を、1時間かけて滴下した。その後、赤外分光光度計(日本分光株式会社製)によってイソシアネート基由来の吸収ピーク(2270cm−1)が見られなくなるまで前記温度で撹拌を続けて、ポリウレタンのメチルエチルケトン溶液を得た。次いで、この溶液の固形分濃度(ポリウレタンの濃度)が30質量%となるように溶剤量を調整した。得られたポリウレタン(ウレタン樹脂)の重量平均分子量は、GPC(ゲルパーミエーションクロマトグラフィー)による測定の結果、320000(標準ポリスチレン換算値)であった。GPCの測定条件を表1に示す。
温度計、撹拌機、不活性ガス導入口及び還流冷却器を装着した2L(リットル)の四つ口フラスコに、ポリカーボネートジオール(アルドリッチ社製、数平均分子量2000)4000質量部と、2−ヒドロキシエチルアクリレート238質量部と、ハイドロキノンモノメチルエーテル0.49質量部と、スズ系触媒4.9質量部とを仕込んで反応液を調製した。70℃に加熱した反応液に対して、イソホロンジイソシアネート(IPDI)666質量部を3時間かけて均一に滴下し、反応させた。滴下完了後、15時間反応を継続し、NCO%(NCO含有量)が0.2質量%以下となった時点を反応終了とみなし、ウレタンアクリレートを得た。NCO%は、電位差自動滴定装置(商品名:AT−510、京都電子工業株式会社製)によって確認した。GPCによる分析の結果、ウレタンアクリレートの重量平均分子量は8500(標準ポリスチレン換算値)であった。なお、GPCによる分析は、前記ポリウレタンの重量平均分子量の分析と同様の条件で行った。
ポリスチレン粒子の表面に厚さ0.2μmのニッケル層を形成した。さらに、このニッケル層の外側に厚さ0.04μmの金層を形成させた。これにより、平均粒径4μmの導電粒子を作製した。
表2及び表3に示す成分を、表2及び表3に示す質量比(固形分)で混合して混合物を得た。この混合物に前記導電粒子を1.5体積%の割合(基準:接着剤組成物の接着剤成分の全体積)で分散させて、フィルム状接着剤を形成するための塗工液を得た。この塗工液を厚み50μmのポリエチレンテレフタレート(PET)フィルムに、塗工装置を用いて塗布した。塗膜を70℃で10分熱風乾燥して、厚み18μmのフィルム状接着剤を形成させた。
表2及び表3に示すフィルム状接着剤を用いて、ライン幅75μm、ピッチ150μm(スペース75μm)及び厚さ18μmの銅回路を2200本有するフレキシブル回路基板(FPC)と、ガラス基板、及び、ガラス基板上に形成された厚さ0.2μmの窒化珪素(SiNx)の薄層を有するSiNx基板(厚さ0.7mm)とを接続した。接続は、熱圧着装置(加熱方式:コンスタントヒート型、東レエンジニアリング株式会社製)を用い、130℃、3MPaで5秒間、又は、170℃、3MPaで5秒間の加熱及び加圧により行った。これにより、幅1.5mmにわたりFPCとSiNx基板とがフィルム状接着剤の硬化物により接続された接続体を作製した。加圧の圧力は、圧着面積を0.495cm2として計算した。
前記接続体の作製直後の接続外観と、前記接続体を85℃、85%RHの恒温恒湿槽中に250時間放置した後(高温高湿試験後)の接続外観とを、光学顕微鏡を用いて観察した。スペース部分におけるSiNx基板と硬化物との界面において剥離が発生している面積(剥離面積)を測定し、剥離の有無を評価した。スペース全体に占める剥離面積の割合が30%を超える場合を「B」(剥離有り)と評価し、剥離面積の割合が30%以下の場合を「A」(剥離なし)と評価した。評価結果を表2及び表3に示す。なお、接続体の作製直後の接続外観については、全ての実施例及び比較例において剥離なしであった。
前記フィルム状接着剤を40℃の恒温槽にて1日処理した。このフィルム状接着剤を用いて、前記と同様の方法で接続体を作製した後に高温高湿試験を行った。評価結果を表2及び表3に示す。
Claims (7)
- ラジカル重合可能な官能基を有する第1のシラン化合物と、
前記第1のシラン化合物と反応する第2のシラン化合物と、
ラジカル重合性化合物(前記第1のシラン化合物に該当する化合物を除く)と、
1分間半減期温度が120℃以下である過酸化物と、を含有する、接着剤組成物。 - 前記第1のシラン化合物の前記官能基が、(メタ)アクリロイル基及びビニル基からなる群より選ばれる少なくとも1種を含む、請求項1に記載の接着剤組成物。
- 前記第2のシラン化合物がエポキシ基を有する、請求項1又は2に記載の接着剤組成物。
- 導電粒子を更に含有する、請求項1〜3のいずれか一項に記載の接着剤組成物。
- 回路接続用である、請求項1〜4のいずれか一項に記載の接着剤組成物。
- 請求項1〜5のいずれか一項に記載の接着剤組成物又はその硬化物を備える、構造体。
- 第一の回路電極を有する第一の回路部材と、
第二の回路電極を有する第二の回路部材と、
前記第一の回路部材及び前記第二の回路部材の間に配置された回路接続部材と、を備え、
前記第一の回路電極及び前記第二の回路電極が電気的に接続されており、
前記回路接続部材が、請求項1〜5のいずれか一項に記載の接着剤組成物又はその硬化物を含む、構造体。
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