TWI780055B - 抑制沿面放電發生之方法 - Google Patents
抑制沿面放電發生之方法 Download PDFInfo
- Publication number
- TWI780055B TWI780055B TW106122065A TW106122065A TWI780055B TW I780055 B TWI780055 B TW I780055B TW 106122065 A TW106122065 A TW 106122065A TW 106122065 A TW106122065 A TW 106122065A TW I780055 B TWI780055 B TW I780055B
- Authority
- TW
- Taiwan
- Prior art keywords
- resin
- creeping discharge
- anhydride
- manufactured
- silica sol
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 54
- 239000002245 particle Substances 0.000 claims description 25
- 239000003822 epoxy resin Substances 0.000 claims description 16
- 229920000647 polyepoxide Polymers 0.000 claims description 16
- 239000000377 silicon dioxide Substances 0.000 claims description 16
- 239000004593 Epoxy Substances 0.000 claims description 10
- 235000012239 silicon dioxide Nutrition 0.000 claims description 10
- 238000002156 mixing Methods 0.000 claims description 8
- 239000000178 monomer Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 4
- 239000005543 nano-size silicon particle Substances 0.000 claims description 3
- 239000004848 polyfunctional curative Substances 0.000 claims description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 2
- 229920005989 resin Polymers 0.000 abstract description 33
- 239000011347 resin Substances 0.000 abstract description 33
- 239000007787 solid Substances 0.000 abstract description 14
- 239000011810 insulating material Substances 0.000 abstract description 9
- 230000005684 electric field Effects 0.000 abstract description 8
- 239000010954 inorganic particle Substances 0.000 abstract description 3
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 29
- 239000000126 substance Substances 0.000 description 21
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 12
- -1 polyethylene Polymers 0.000 description 8
- 239000010419 fine particle Substances 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 150000008065 acid anhydrides Chemical class 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerol Natural products OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- JFDZBHWFFUWGJE-UHFFFAOYSA-N benzonitrile Chemical compound N#CC1=CC=CC=C1 JFDZBHWFFUWGJE-UHFFFAOYSA-N 0.000 description 3
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 150000002460 imidazoles Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000011859 microparticle Substances 0.000 description 3
- 239000002480 mineral oil Substances 0.000 description 3
- 235000010446 mineral oil Nutrition 0.000 description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 2
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 2
- YNDCPHMNPGEGLV-UHFFFAOYSA-N 2-[(2-amino-1-methylcyclohexyl)methyl]-2-methylcyclohexan-1-amine Chemical compound C1CCCC(N)C1(C)CC1(C)CCCCC1N YNDCPHMNPGEGLV-UHFFFAOYSA-N 0.000 description 2
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 2
- WVRNUXJQQFPNMN-VAWYXSNFSA-N 3-[(e)-dodec-1-enyl]oxolane-2,5-dione Chemical compound CCCCCCCCCC\C=C\C1CC(=O)OC1=O WVRNUXJQQFPNMN-VAWYXSNFSA-N 0.000 description 2
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 2
- GOYGTBXFJBGGLI-UHFFFAOYSA-N 7a-but-1-enyl-3a-methyl-4,5-dihydro-2-benzofuran-1,3-dione Chemical compound C1=CCCC2(C)C(=O)OC(=O)C21C=CCC GOYGTBXFJBGGLI-UHFFFAOYSA-N 0.000 description 2
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 2
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 229910000410 antimony oxide Inorganic materials 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000008119 colloidal silica Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- KEIQPMUPONZJJH-UHFFFAOYSA-N dicyclohexylmethanediamine Chemical compound C1CCCCC1C(N)(N)C1CCCCC1 KEIQPMUPONZJJH-UHFFFAOYSA-N 0.000 description 2
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 125000003827 glycol group Chemical group 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 2
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- 239000002114 nanocomposite Substances 0.000 description 2
- 239000002105 nanoparticle Substances 0.000 description 2
- 150000002825 nitriles Chemical class 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 2
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 2
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- YQJPWWLJDNCSCN-UHFFFAOYSA-N 1,3-diphenyltetramethyldisiloxane Chemical compound C=1C=CC=CC=1[Si](C)(C)O[Si](C)(C)C1=CC=CC=C1 YQJPWWLJDNCSCN-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- RXYPXQSKLGGKOL-UHFFFAOYSA-N 1,4-dimethylpiperazine Chemical compound CN1CCN(C)CC1 RXYPXQSKLGGKOL-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
- FAMJUFMHYAFYNU-UHFFFAOYSA-N 1-methyl-4-(propan-2-yl)cyclohex-1-ene Chemical compound CC(C)C1CCC(C)=CC1 FAMJUFMHYAFYNU-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- FUIQBJHUESBZNU-UHFFFAOYSA-N 2-[(dimethylazaniumyl)methyl]phenolate Chemical compound CN(C)CC1=CC=CC=C1O FUIQBJHUESBZNU-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- QKPVEISEHYYHRH-UHFFFAOYSA-N 2-methoxyacetonitrile Chemical compound COCC#N QKPVEISEHYYHRH-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- YEYKMVJDLWJFOA-UHFFFAOYSA-N 2-propoxyethanol Chemical compound CCCOCCO YEYKMVJDLWJFOA-UHFFFAOYSA-N 0.000 description 1
- DOYKFSOCSXVQAN-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C(C)=C DOYKFSOCSXVQAN-UHFFFAOYSA-N 0.000 description 1
- JTWDWVCNOLORBR-UHFFFAOYSA-N 3-chloropropyl-methoxy-dimethylsilane Chemical compound CO[Si](C)(C)CCCCl JTWDWVCNOLORBR-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
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- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C—CHEMISTRY; METALLURGY
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- H02B13/02—Arrangement of switchgear in which switches are enclosed in, or structurally associated with, a casing, e.g. cubicle with metal casing
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- H02G5/06—Totally-enclosed installations, e.g. in metal casings
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Abstract
本發明之課題在於確立不依賴於固體絕緣材料之樹脂本身之電場緩和(即樹脂之低介電率化)，而抑制樹脂表面之沿面放電發生之手法。
本發明之解決手段係抑制樹脂表面之沿面放電發生之方法，其特徵係使奈米尺寸之無機微粒子分散於樹脂中而抑制樹脂硬化體之表面之沿面放電發生者。
Description
本發明係關於抑制高電壓(電力)機器之絕緣材料之沿面放電發生之技術。
高電壓(電力)機器中，固體絕緣材料表面為容易藉由高電壓引起沿面放電之部位。此處所謂表面意指液體/固體、氣體/固體、真空/固體等之異質界面。在這種情況下，沿面放電不會發生於固體中，而發生在液體、氣體、真空中任一者。
以往，作為抑制樹脂表面之沿面放電技術報告有，藉由控制可能產生沿面放電之固體絕緣材料之介電率而緩和電場(此種情況下，為使液體．氣體．真空之介電率匹配，進行固體之低介電率化)、藉由介電率於空間中傾斜分佈而緩和電場、藉由導電率非線形性而緩和電場、藉由表面凹凸而增加沿面距離等。亦即，作為防止沿面放電之對策，僅實施電場緩和或取得物理之沿面距離之方法。
[專利文獻1]日本專利特開2012-110206號公報
[專利文獻2]日本專利特開2016-031845號公報
本發明之課題在於確立不依賴於固體絕緣材料之樹脂硬化體本身之電場緩和(即樹脂之低介電率化)，而抑制樹脂硬化體之表面之沿面放電發生之方法。
本發明係基於發現藉由使用使奈米尺寸之無機微粒子分散於固體絕緣材料的樹脂中之奈米複合絕緣材料，而抑制樹脂表面之沿面放電發生，因而完成本發明。
達成上述目的之本發明係一種抑制沿面放電發生之方法，其特徵係使奈米尺寸之無機微粒子分散於樹脂中而抑制樹脂硬化體之表面之沿面放電發生。
於此，作為無機微粒子，可使用二氧化矽、氧化鋁、氧化鈦、氧化鋯、氧化鋅、氧化錫、氧化銻、氧化鐵、氧化鎂，或以此等為主成分之複合氧化物微粒子。
奈米尺寸之粒子，一般而言係具有奈米(nm)等級大小之粒子，一般指1~數百nm大小之粒子，於本發明中為平均粒徑1~400nm者。並且，平均粒徑係如後述由比表面積求得。
本發明中使用之無機微粒子，其平均粒徑較佳為5~200nm，尤其更佳為5~100nm。作為樹脂係使用環氧樹脂等一般熱硬化性樹脂。奈米複合材料中無機微粒子之添加率為0.1~50質量%。
藉由使用本發明，無須施以固體絕緣材料之電場緩和或增加物理之沿面距離，即可提高樹脂硬化體固體表面之沿面放電發生電壓，可較好地利用於GIS(氣體絕緣開閉裝置)之絕緣間隔物或油浸式變壓器之壓板用塗覆樹脂等。
1‧‧‧試料
2‧‧‧針電極
3‧‧‧平板電極
4‧‧‧試驗容器
5‧‧‧礦物油
6‧‧‧脈衝電壓發生裝置
7‧‧‧分壓器
8‧‧‧相機
9‧‧‧光電子倍增管
9a‧‧‧信號用
9b‧‧‧雜訊用
圖1係顯示沿面放電之測定系統之概略構成之圖。
作為本發明中使用之絕緣樹脂，可舉例為如環氧樹脂、聚醯亞胺樹脂、聚醯胺醯亞胺樹脂、矽氧樹脂等熱硬化性樹脂。此外，亦可舉例為聚乙烯、聚丙烯等熱可塑性樹脂。
作為本發明中使用之環氧樹脂雖無特別限定，但可舉例為雙酚A型環氧樹脂、雙酚F型環氧樹脂、脂環式環氧樹脂等。通常，將此等環氧樹脂與硬化劑等組 合摻合後，經注模．熱硬化而成形為期望之形狀。
作為本發明中使用之環氧樹脂之硬化劑，可舉例為酚樹脂、胺類、聚醯胺樹脂、咪唑類、聚硫醇、酸酐等。
作為酚樹脂，可舉例為例如酚酚醛清漆樹脂、甲酚酚醛清漆樹脂等。
作為胺類，舉例為例如哌啶、N,N-二甲基哌嗪、三伸乙基二胺、2,4,6-三(二甲胺基甲基)苯酚、苄基二甲胺、2-(二甲胺基甲基)苯酚、二伸乙基三胺、三伸乙基四胺、四伸乙基五胺、二乙胺基丙胺、N-胺基乙基哌嗪、二(1-甲基-2-胺基環己基)甲烷、薄荷烯二胺(menthene)、異佛爾酮二胺、二胺基二環己基甲烷、1,3-二胺基甲基環己烷、苯二甲胺、間苯二胺、二胺基二苯基甲烷、二胺基二苯基碸等。此等之中可較佳地使用液狀之二伸乙基三胺、三伸乙基四胺、四伸乙基五胺、二乙胺基丙胺、N-胺基乙基哌嗪、二(1-甲基-2-胺基環己基)甲烷、薄荷烯二胺、異佛爾酮二胺、二胺基二環己基甲烷等。
作為聚醯胺樹脂，係藉由二聚酸及聚胺縮合所生成者，係分子中具有一級胺及二級胺之聚醯胺胺。
作為咪唑類，可舉例為2-甲基咪唑、2-乙基-4-甲基咪唑、1-氰乙基-2-十一烷基咪唑鎓偏苯三酸酯、環氧咪唑加成物等。
聚硫醇為例如於聚丙二醇鏈末端存在硫醇基者，或於聚乙二醇鏈末端存在硫醇基者，較佳為液狀者。
作為本發明中使用之酸酐，較佳為一分子中含有複數個羧基之化合物之酸酐。作為此等酸酐，可舉例為鄰苯二甲酸酐、偏苯三甲酸酐、均苯四甲酸酐、二苯甲酮四羧酸酐、乙二醇雙偏苯三酸酯、甘油三偏苯三酸酯、馬來酸酐、四氫鄰苯二甲酸酐、甲基四氫鄰苯二甲酸酐、內亞甲基四氫鄰苯二甲酸酐、甲基內亞甲基四氫鄰苯二甲酸酐、甲基丁烯基四氫鄰苯二甲酸酐、十二碳烯基丁二酸酐、六氫鄰苯二甲酸酐、甲基六氫鄰苯二甲酸酐、丁二酸酐、甲基環己烯二羧酸酐、氯橋酸酐(chlorendic anhydride)等。
該等中較佳為於常溫、常壓下為液狀之甲基四氫鄰苯二甲酸酐、甲基內亞甲基四氫鄰苯二甲酸酐、甲基丁烯基四氫鄰苯二甲酸酐、十二碳烯基丁二酸酐、甲基六氫鄰苯二甲酸酐。此等液狀之酸酐其黏度於25℃下測定為10mPas~1000mPas左右。
此外，獲得上述硬化物時，亦可適當併用硬化促進劑。作為硬化促進劑，可舉例為三苯基膦或三丁基膦等之有機磷化合物，乙基三苯基溴化鏻、甲基三苯基鏻磷酸二乙酯等之4級鏻鹽，1,8-二氮雜雙環(5,4,0)十一碳-7-烯、1,8-二氮雜雙環(5,4,0)十一碳-7-烯與辛酸之鹽、辛酸鋅、四丁基溴化銨等之4級銨鹽、二甲基苄胺等之3級胺等。此等硬化促進劑，對於硬化劑1質量份，以0.001~0.1質量份之比例含有。
作為本發明中使用之奈米尺寸之無機微粒 子，基於絕緣性或分散性之觀點，較佳為金屬氧化物微粒子。作為金屬氧化物微粒子較佳之例，可舉例為二氧化矽、氧化鋁、氧化鈦、氧化鋯、氧化鋅、氧化錫、氧化銻、氧化鐵、氧化鎂或以此等為主成分之複合氧化物微粒子。其中，由於二氧化矽之介電率低至4左右，且熱膨脹率亦低，故適合用作為本發明所使用之無機微粒子。
本發明中使用之二氧化矽，為粒子狀態之二氧化矽，較佳為平均粒徑200nm以下，例如5nm~200nm，更佳為5nm~100nm、10nm~100nm、10nm~80nm。粒徑大於100nm時，抑制沿面放電的效果變得不顯著。
本發明中使用之二氧化矽粒子之平均粒徑，係自藉由氮吸附法測定之比表面積值算出之平均粒徑值。
尤其於本發明中，可適當地使用具有上述平均粒徑值之膠體二氧化矽，且作為該膠體二氧化矽，可使用矽溶膠。作為矽溶膠，可將以矽酸鈉水溶液作為原料而藉由習知方法所製作之水性矽溶膠與把該水性矽溶膠之分散介質的水經有機溶劑進行置換而得之有機矽溶膠作為原料使用。此外，亦可將把矽酸甲酯或矽酸乙酯等之烷氧基矽烷，於醇等有機溶劑中在觸媒(例如，氨、有機胺化合物、氫氧化鈉等鹼觸媒)存在下水解、縮合所得之矽溶膠，或把該矽溶膠經其他有機溶劑進行溶劑置換後之有機矽溶膠作為原料使用。
作為上述有機矽溶膠之有機溶劑之例，可舉例為醇類、醚類、酮類、酯類、醯胺類、烴類、腈類等。
作為醇類，可舉例為甲醇、乙醇、1-丙醇、2-丙醇、1-丁醇、異丁醇、2-丁醇、乙二醇、甘油、丙二醇、三乙二醇、聚乙二醇、苄醇、1,5-戊二醇、二丙酮醇等。
作為醚類，可舉例為二乙醚、二丁醚、四氫呋喃、二噁烷、乙二醇單甲醚、乙二醇單丙醚、丙二醇單甲醚、丙二醇單乙醚、二乙二醇單甲醚、二乙二醇單乙醚、二乙二醇單丁醚等。
作為酮類，可舉例為丙酮、甲基乙基酮、2-戊酮、3-戊酮、甲基異丁基酮、2-庚酮、環己酮等。
作為酯類，可舉例為甲酸乙酯、乙酸甲酯、乙酸乙酯、乙酸丙酯、乙酸丁酯、乙二醇單乙醚乙酸酯、乙二醇單丁醚乙酸酯、丙二醇單甲醚乙酸酯等。
作為醯胺類，可舉例為乙醯胺、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基吡咯烷酮等。
作為烴類，可舉例為正己烷、環己烷、苯、甲苯、二甲苯、溶劑石油腦、苯乙烯等，進而作為鹵化烴類可舉例為二氯甲烷、三氯乙烯等。
作為腈類，可舉例為乙腈、戊二腈、甲氧基乙腈、丙腈、苯甲腈等。
作為上述有機矽溶膠之市售品，可舉例為例如商品名MA-ST-S(甲醇分散矽溶膠，日產化學工業(股)製)、商品名MT-ST(甲醇分散矽溶膠，日產化學工業(股)製)、商品名MA-ST-UP(甲醇分散矽溶膠，日產化學工業 (股)製)、商品名MA-ST-M(甲醇分散矽溶膠，日產化學工業(股)製)、商品名MA-ST-L(甲醇分散矽溶膠，日產化學工業(股)製)、商品名IPA-ST-S(異丙醇分散矽溶膠，日產化學工業(股)製)、商品名IPA-ST(異丙醇分散矽溶膠，日產化學工業(股)製)、商品名IPA-ST-UP(異丙醇分散矽溶膠，日產化學工業(股)製)、商品名IPA-ST-L(異丙醇分散矽溶膠，日產化學工業(股)製)、商品名IPA-ST-ZL(異丙醇分散矽溶膠，日產化學工業(股)製)、商品名NPC-ST-30(正丙基溶纖劑分散矽溶膠，日產化學工業(股)製)、商品名PGM-ST(1-甲氧基-2-丙醇分散矽溶膠，日產化學工業(股)製)、商品名DMAC-ST(二甲基乙醯胺分散矽溶膠，日產化學工業(股)製)、商品名XBA-ST(二甲苯.正丁醇混合溶劑分散矽溶膠，日產化學工業(股)製)、商品名EAC-ST(乙酸乙酯分散矽溶膠，日產化學工業(股)製)、商品名PMA-ST(丙二醇單甲醚乙酸酯分散矽溶膠，日產化學工業(股)製)、商品名MEK-ST(甲基乙基酮分散矽溶膠，日產化學工業(股)製)、商品名MEK-ST-UP(甲基乙基酮分散矽溶膠，日產化學工業(股)製)、商品名MEK-ST-L(甲基乙基酮分散矽溶膠，日產化學工業(股)製)及商品名MIBK-ST(甲基異丁基酮分散矽溶膠，日產化學工業(股)製)等，但不限於此等。
本發明中使用之二氧化矽粒子之表面亦可經疏水化處理。作為疏水化處理劑，可舉例為矽氮烷、矽氧烷或烷氧基矽烷及其部分水解物或其經聚合之2聚體~5聚 體之寡聚物。
作為矽氮烷，可舉例為例如六甲基二矽氮烷及六乙基二矽氮烷。
作為矽氧烷，可舉例為例如六甲基二矽氧烷、1,3-二丁基四甲基二矽氧烷、1,3-二苯基四甲基二矽氧烷、1,3-二乙烯基四甲基二矽氧烷、六乙基二矽氧烷及3-縮水甘油氧基丙基五甲基二矽氧烷。
作為烷氧基矽烷，可舉例為例如三甲基甲氧基矽烷、三甲基乙氧基矽烷、三甲基丙氧基矽烷、苯基二甲基甲氧基矽烷、氯丙基二甲基甲氧基矽烷、二甲基二甲氧基矽烷、甲基三甲氧基矽烷、四甲氧基矽烷、四乙氧基矽烷、四丙氧基矽烷、四丁氧基矽烷、乙基三甲氧基矽烷、二甲基二乙氧基矽烷、丙基三乙氧基矽烷、正丁基三甲氧基矽烷、正己基三甲氧基矽烷、正辛基三乙氧基矽烷、正辛基甲基二乙氧基矽烷、正十八烷基三甲氧基矽烷、苯基三甲氧基矽烷、苯基甲基二甲氧基矽烷、苯乙基三甲氧基矽烷、十二烷基三甲氧基矽烷、正十八烷基三乙氧基矽烷、苯基三甲氧基矽烷、二苯基二甲氧基矽烷、乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、乙烯基三(β-甲氧基乙氧基)矽烷、γ-甲基丙烯醯氧基丙基三甲氧基矽烷、γ-丙烯醯氧基丙基三甲氧基矽烷、γ-(甲基丙烯醯氧基丙基)甲基二甲氧基矽烷、γ-甲基丙烯醯氧基丙基甲基二乙氧基矽烷、γ-甲基丙烯醯氧基丙基三乙氧基矽烷、β-(3,4-環氧環己基)乙基三甲氧基矽烷、γ-縮水甘油氧基丙基三甲 氧基矽烷、γ-縮水甘油氧基丙基甲基二乙氧基矽烷、γ-縮水甘油氧基丙基三乙氧基矽烷、N-β(胺基乙基)γ-(胺基丙基)甲基二甲氧基矽烷、N-β(胺基乙基)γ-(胺基丙基)三甲氧基矽烷、N-β(胺基乙基)γ-(胺基丙基)三乙氧基矽烷、γ-胺基丙基三甲氧基矽烷、γ-胺基丙基三乙氧基矽烷、N-苯基-γ-胺基丙基三甲氧基矽烷、γ-巰基丙基三甲氧基矽烷、3-異氰酸酯基丙基三乙氧基矽烷、三氟丙基三甲氧基矽烷、十七烷基三氟丙基三甲氧基矽烷、正癸基三甲氧基矽烷、二甲氧基二乙氧基矽烷、雙(三乙氧基矽基)乙烷及六乙氧基二矽氧烷。
作為本發明之樹脂中之奈米二氧化矽之摻合量，例如為0.1~50質量%，較佳為0.2~30質量%、0.5~30質量%，基於更抑制樹脂之沿面放電之觀點，較佳為0.5~20質量%、1~20質量%，更佳為1~15質量%、2~15質量%。
若奈米二氧化矽之摻合量多於50質量%則樹脂硬化物之介電率上升，抑制放電效果變小。又，奈米二氧化矽之摻合量少於0.1質量%則添加二氧化矽之效果變小，無法獲得抑制樹脂放電之效果。
上述之有機矽溶膠，例如可藉由與環氧樹脂混合並脫溶劑，而獲得分散有奈米二氧化矽之環氧樹脂。於此樹脂中適當加入硬化劑後，藉由注模．加熱等進行硬化反應，可獲得期望之絕緣樹脂成型物。
(材料準備)
將於雙酚A二縮水甘油醚JER828(三菱化學(股)製，環氧值185g/eq.)中，分散有平均粒徑為12~500nm之二氧化矽粒子之環氧單體分散矽溶膠調整成二氧化矽濃度30.5質量%。平均粒徑500nm之二氧化矽粒子係使用ADMAFINE SO-C2(Admatechs(股)製)。平均粒徑係使用比表面積測定裝置Monosorb(註冊商標)MS-16(Yuasa iohics(股)製)測定二氧化矽之300℃乾燥粉末之比表面積後，藉由平均粒徑(nm)=2720/比表面積(m2/g)之換算式算出。
實施例1~實施例10及比較例1、2
將表1中準備好之環氧單體分散矽溶膠與酸酐(RIKACID MH-700，新日本理化(股)製)、反應促進劑(二甲基苄胺，東京化成)，以表2中記載之摻合比混合獲得環氧樹脂硬化用組成物。所得之環氧樹脂硬化用組成物注入注模板(以脫模膜PL#400(FUTAMURA化學(股)製)被覆之玻璃板3mm厚)，以70℃2小時、90℃2小時、150℃8小 時之硬化條件進行加熱處理，獲得環氧樹脂硬化體。
(沿面放電之測定方法)
沿面放電測定系統之概略構成示於圖1。此裝置可取得各施加電壓時之時間波形及發光圖像，算出沿面放電之發生概率。
作為試料1，係使用以實施例1~實施例10製作之環氧樹脂硬化體。試料1之厚度為3mm。
如圖1所示，於試料1表面將針電極2與平板電極3以間距長=50mm配置。該等試料1及針電極2與平板電極3之電極系統，配置於試驗容器4中。將礦物油5填充於試驗容器4中，試料1及電極系統配置於礦物油5內。
針電極2之直徑為1mm，尖端曲率半徑為10μm，對於試料1表面以θ=30°傾斜配置。將針電極2連接於脈衝電壓發生裝置6，將平板電極3透過50Ω的電阻接 地。對於針電極2，透過分壓器7，以5kV步進、施加間隔1分鐘，施加正極性標準雷電脈衝電壓(1.2μs/50μs)至35kV~75kV，使用附有圖像增強器之CCD相機8確認沿面放電發生。試料1之數量為3片，試驗次數於各電壓實施5次，以總計15次之實驗算出沿面放電之發生概率。
又，試料1之相對介電率係使用介電率計測器評價。
試料條件、試料之相對介電率測定結果及沿面放電試驗結果示於表3。由表3可知若二氧化矽微粒子之添加率增加則相對介電率有增加之傾向。另一方面，可知二氧化矽微粒子之粒徑為500nm之試料以外，放電發生概率下降，放電發生電壓增加。此外，放電發生概率到達100%之電壓，粒徑為500nm之試料以外亦上升5~15kV。亦即，藉由使用本提案之方法，無論樹脂之相對介電率幾乎不變或增加，皆可抑制樹脂表面之沿面放電發生。
(材料準備)
將於雙酚A二縮水甘油醚JER828(三菱化學(股)製，環氧值185g/eq.)中，分散有平均粒徑為130nm之二氧化矽粒子之環氧單體分散矽溶膠調製成二氧化矽濃度30.5質量%(單體溶膠6)。
以與實施例1~10同樣之條件，製造具有下述組成之實施例11、12及參考例1之硬化物。
(沿面放電之測定)
使用與上述同樣之沿面放電測定系統裝置，使用光電子倍增管9確認實施例1、2、4、5、9、11、12及比較例1、2及參考例1之硬化物之沿面放電發生。光電子倍增管9係使用信號用9a與雜訊用9b。
試料條件、試料之相對介電率之測定結果及沿面放電試驗結果示於表6。二氧化矽微粒子粒徑為130nm以上之試料以外，其放電發生概率較比較例1(無二 氧化矽)更降低，可知其放電發生電壓增加。此外，放電發生概率到達100%之電壓，粒徑為130nm以上之試料以外亦上升5~10kV。亦即，藉由使用本提案之手法，無論樹脂之相對介電率幾乎不變或增加，皆可抑制樹脂表面之沿面放電發生。
藉由本發明，無須施以固體絕緣材料之電場緩和或增加物理之沿面距離，即可提高固體表面之沿面放電發生電壓，可較好地利用於GIS(氣體絕緣開閉裝置)之絕緣間隔物或油浸式變壓器之壓板用塗覆樹脂等。
Claims (1)
- 一種抑制沿面放電發生之方法，其特徵為：將有機矽溶膠與環氧單體混合並脫溶劑而獲得分散有奈米二氧化矽之環氧單體溶膠，將其與硬化劑混合所得之環氧樹脂硬化用組成物進行硬化而獲得環氧樹脂硬化體，進而抑制該環氧樹脂硬化體之表面之沿面放電發生者，其中前述環氧樹脂硬化體中之二氧化矽粒子之摻合量為0.1~15質量%，前述二氧化矽粒子之平均粒徑為5~80nm，前述環氧單體為雙酚A型環氧單體。
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