TWI778786B - 晶圓加工方法及載台 - Google Patents
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Abstract
本發明提供一種晶圓加工方法,其步驟包含:提供一晶圓、一浸泡裝置、一載台及一噴灑裝置;將平放的晶圓翻轉為直立;將晶圓直立置入浸泡裝置浸泡;將晶圓自浸泡裝置取出並平放於載台;以噴灑裝置對載台上的晶圓噴灑藥液;沖洗晶圓;旋轉載台使晶圓乾燥。其晶圓能夠在同一個載台上進行多道步驟而加速製程。
Description
本發明係有關於晶圓加工,尤其是一種晶圓加工方法及載台,其藉由可升降、翻轉及旋轉的載台,使得晶圓能夠在同一個載台上進行多道步驟。
現有的晶圓加工製程包含多道浸泡藥液、噴灑藥液、沖洗及乾燥等步驟。一般而言,各步驟站點皆以設置有特定的裝置執行,晶圓需藉由機器人手臂在各站點之間傳輸。因此,設備成本高,傳輸耗時久,轉換站點也需重新定位,因此現有的晶圓加工產線之產率不佳。
有鑑於此,本發明人遂針對上述現有技術,特潛心研究並配合學理的運用,盡力解決上述之問題點,即成為本發明人改良之目標。
本發明提供一種晶圓加工方法及載台,其藉由可升降、翻轉及旋轉的載台,使得晶圓能夠在同一個載台上進行多道加工步驟。
本發明提供一種晶圓加工方法,其步驟包含:提供一晶圓、一浸泡裝置、一載台及一噴灑裝置;將平放的晶圓翻轉為直立;將晶圓直立置入浸
泡裝置浸泡;將晶圓自浸泡裝置取出並平放於載台;以噴灑裝置對載台上的晶圓噴灑藥液;沖洗晶圓;旋轉載台使晶圓乾燥。
本發明的晶圓加工方法,其步驟包含:翻轉載台將晶圓直立置入噴灑裝置;對直立的晶圓噴灑藥液;翻轉載台將晶圓平放。
本發明的晶圓加工方法,其載台包含一外罩以及能夠相對移動出入外罩的一夾具,於步驟中將晶圓平放於夾具。
本發明的晶圓加工方法,其步驟中將夾具移入外罩,並且在外罩內沖洗晶圓。
本發明的晶圓加工方法,其步驟中將夾具移出外罩,並且旋轉夾具。
本發明的晶圓加工方法,其步驟中提供一輸入手臂且以輸入手臂將晶圓置入浸泡裝置。
本發明的晶圓加工方法,其步驟中提供一轉移手臂,以輸入手臂自浸泡裝置取出晶圓並轉移至轉移手臂,並且以轉移手臂將晶圓翻轉後平放於載台。
本發明的晶圓加工方法,更包含一步驟:自載台取下晶圓並輸出。其步驟中以輸入手臂將晶圓自載台取下並輸出。
本發明的晶圓加工方法,其步驟中提供一輸入手臂且以輸入手臂將晶圓自載台取下並輸出。
本發明的晶圓加工方法,其提供複數晶圓、一浸泡裝置、複數載台及對應各載台的複數噴灑裝置,在步驟中將各晶圓分別翻轉放置到各載台上,各晶圓分別在各載台上接續進行步驟。本發明的晶圓加工方法,其提供複
數轉移手臂,於步驟中以各轉移手臂將各晶圓分別翻轉放置到各載台。於步驟中將該些晶圓一併置入浸泡裝置。
本發明另提供一種載台,其用於加工一晶圓。載台包含一外罩、一夾具、一升降機構及一翻轉機構。夾具設置在外罩內且用於承載所述晶圓。升降機構連接在夾具及外罩之間而能夠相對移動夾具及外罩使夾具出入外罩。翻轉機構連動夾具而能夠翻轉夾具。
本發明的晶圓加工方法提供了能夠升降、翻轉及旋轉的載台,其使得晶圓能夠在同一個載台上進行直立或水平噴除、清洗及乾燥等步驟。因此,本發明有效減少了轉換站移動及定位之耗時而加速製程。而且,本發明同時縮減了單一產線備體積,故使得原有的空間可容納更多產線而增加製程產率。
10:晶圓
100:浸泡裝置
110:夾爪
120:槽體
200:載台
210:外罩
220:夾具
230:升降機構
240:翻轉機構
250:沖洗噴嘴
260:旋轉機構
300:噴灑裝置
310:製程噴嘴
320:外殼
410:輸入手臂
420:轉移手臂
a~h:步驟
圖1係本發明之晶圓加工方法之步驟流程圖。
圖2係本發明之晶圓加工方法之中的噴灑步驟之流程圖。
圖3係本發明之晶圓加工方法之輸入及定位步驟示意圖。
圖4係本發明之晶圓加工方法之浸泡步驟示意圖。
圖5係本發明之晶圓加工方法之轉移步驟示意圖。
圖6至圖9係本發明之晶圓加工方法之噴灑步驟示意圖。
圖10係本發明之晶圓加工方法之沖洗步驟示意圖。
圖11係本發明之晶圓加工方法之乾燥步驟示意圖。
參閱圖1至圖4,本發明提供一種晶圓加工方法,包含後述步驟:首先,於步驟a中提供至少一晶圓10、一浸泡裝置100、一載台200、一噴灑裝置300、一輸入手臂410及一轉移手臂420。浸泡裝置100包含一槽體110以及一夾爪120,槽體110盛裝浸泡製程用的藥液(蝕刻液),夾爪120則配置能夠相對於槽體110移動以進出槽體110。輸入手臂410及轉移手臂420為機械手臂,其用於在加工站點之間傳送晶圓10。
載台200用於承載及移動待加工的晶圓10以進行晶圓10加工製程,載台200包含:一外罩210、一夾具220、一升降機構230、一翻轉機構240及一旋轉機構260。於本實施例中,外罩210較佳地為頂部呈開放的圓形罩。夾具220設置在外罩210內且用於承載前述的晶圓10。升降機構230連接夾具220及外罩210的至少其中之一以用於驅動夾具220出入外罩210。於本實施例中,升降機構230較佳地連接夾具220而能夠相對於外罩210移動夾具220以使夾具220出入外罩210。具體而言,升降機構230可以具有至少一伸縮桿,伸縮桿可以是電動缸(線性致動器)或氣壓缸。伸縮桿可以連接夾具220及外罩210的其中之一者且另一者可以相對於升降機構230固定配置而使夾具220及外罩210能夠相對移動,升降機構230也可以包含分別連接夾具220及外罩210的複數伸縮桿而能夠分別移動夾具220及外罩210。翻轉機構240連動夾具220而能夠翻轉夾具220。本發明不限定翻轉機構240之形式,具體而言,翻轉機構240可以包含一底座供夾具220樞設於其上。而且,翻轉機構240可以更包含一個連接於其樞軸的馬達以驅動樞軸旋轉而翻轉夾具220,或是包含一端固定且另一端直接或間接連接於夾具220的伸縮桿以推動夾具220沿樞軸翻轉。於本實施例中,翻轉機構240較佳地透過升降
機構230間接連接夾具220而能夠將夾具220及外罩210連同升降機構230同步翻轉。旋轉機構260連動夾具220而能夠旋轉夾具220,旋轉機構260可以只連動夾具220旋轉也可以連動夾具220及外罩210同時旋轉。
參閱圖3,接續步驟a,於步驟b的輸入及定位步驟中以輸入手臂410夾取平放的晶圓10輸入本實施的製程產線中。由於晶圓10由產外輸入而未與產線中各設備定位,故輸入手臂410夾取晶圓10後接著將晶圓10置入一定位裝置掃描晶圓10以定位晶圓10的中心位置。輸入手臂410再依據晶圓10的中心位置夾持晶圓10之特定位部位,然後以輸入手臂410將平放的晶圓10翻轉為直立後置於浸泡裝置10的夾爪120。
參閱圖4,接續步驟b,於步驟c的浸泡步驟中以夾爪120直立夾持晶圓10,並將晶圓10直立置入槽體110浸泡。
參閱圖5,接續步驟c,於步驟d的轉移步驟中以夾爪120自浸泡裝置100取出晶圓10並轉移至轉移手臂420,並且以轉移手臂420將晶圓10翻轉後平放於載台200的夾具220。
參閱圖1至2及圖6至圖7,接續步驟d,於步驟e的噴灑步驟中以噴灑裝置300對晶圓10噴灑藥液(蝕刻液)。噴灑裝置300至少包含一製程噴嘴310,製程噴嘴310連接於一藥液源以提供製程用的藥液。於本實施例中噴灑裝置300還包含一外殼320且製程噴嘴310置於外殼320內。
於本實施例中,噴灑裝置300對載台200上的晶圓10直立噴除時,噴灑步驟e較佳地包含後述之步驟:
e1)參閱圖2及圖6,以翻轉機構240翻轉載台200的夾具220而將晶圓10直立置入噴灑裝置300的外殼320內使製程噴嘴310位於夾具220的一側且朝
向晶圓10的表面。於本實施例中,夾具220翻轉時,翻轉機構240也連動外罩210翻轉,但本發明不以此為限。
e2)參閱圖2及圖7,以噴灑裝置300對直立於置於夾具220的晶圓10噴灑藥液(蝕刻液)。並且在噴灑的過程中將溢流的藥液匯集於外殼320之內再排出。
e3)參閱圖2及圖8,以翻轉機構240翻轉載台200的夾具220將晶圓10平放。
參閱圖1及圖9,步驟e的噴灑步驟中噴灑裝置300也可以對載台200上的晶圓10水平噴除,水平噴除時將製程噴嘴310移至夾具220上方,並以製程噴嘴310向下噴灑藥液至平放的晶圓10表面上。並且在噴灑的過程中將溢流的藥液匯集於外罩210之內再排出。
參閱圖10,接續步驟e,於步驟f的沖洗步驟中以升降機構230將夾具220移入外罩210而閉合外罩210的底部,並且以一沖洗噴嘴250向外罩210注入清洗液,藉此在外罩210內沖洗晶圓10。並且在沖洗的過程中將溢流的清洗液匯集於外罩210之內再排出。
參閱圖11,接續步f,於步驟g的乾燥步驟中旋轉載台200使晶圓10乾燥。具體而言,以升降機構230將夾具220移出外罩210,並且以旋轉機構260旋轉夾具220使晶圓10乾燥。於本實施例中,旋轉機構260旋轉夾具220時,外罩210不連動旋轉,但本發明不以此為限。
接續步驟g,於步驟h的輸出步驟中以輸入手臂410將晶圓10自載台200取下並輸出。
綜上所述,本發明的晶圓加工方法提供了能夠升降、翻轉及旋轉的載台200,其使得晶圓10能夠在同一個載台200上進行直立或水平噴除、清洗及乾燥等步驟。因此有效減少了轉換站移動及定位之耗時而加速製程而增加製程產率。
本發明的晶圓加工方法同時縮減了單一產線備體積,原有的空間可容納更多產線。多產線同時進行加工時,步驟a中可以提供複數晶圓10、一浸泡裝置100及一輸入手臂410,並且對應複數載台200分別配置複數噴灑裝置300及複數轉移手臂420。在步驟a中將晶圓10共同放置在一載匣中而於步驟b一併置入多產線共用的浸泡裝置100。在步驟c中藉由各轉移手臂420將各晶圓10分別翻轉放置到各載台200並在各載台200上分別接續進行噴灑、沖洗及乾燥等步驟。
以上所述僅為本發明之較佳實施例,非用以限定本發明之專利範圍,其他運用本發明之專利精神之等效變化,均應俱屬本發明之專利範圍。
a~h:步驟
Claims (13)
- 一種晶圓加工方法,包含後述步驟:a)提供一晶圓、一浸泡裝置、一載台及一噴灑裝置;b)將平放的該晶圓翻轉為直立;c)將該晶圓直立置入該浸泡裝置浸泡;d)將該晶圓自該浸泡裝置取出並平放於該載台,且包含後述步驟:d1)翻轉該載台將該晶圓直立置入該噴灑裝置d2)對直立的該晶圓噴灑藥液;d3)翻轉該載台將該晶圓平放;e)以該噴灑裝置對該載台上的該晶圓噴灑藥液;f)沖洗該晶圓;及g)旋轉該載台使該晶圓乾燥。
- 如請求項1所述的晶圓加工方法,其中該載台包含一外罩以及能夠相對移動出入該外罩的一夾具,於步驟c中將該晶圓平放於該夾具。
- 如請求項2所述的晶圓加工方法,其中於步驟f中將該夾具移入該外罩,並且在該外罩內沖洗該晶圓。
- 如請求項2所述的晶圓加工方法,其中於步驟g中將該夾具移出該外罩,並且旋轉該夾具。
- 如請求項1所述的晶圓加工方法,其中於步驟a中提供一輸入手臂且於步驟b中以該輸入手臂將該晶圓置入該浸泡裝置。
- 如請求項5所述的晶圓加工方法,其中於步驟a中提供一轉移手臂,於步驟c中以該輸入手臂自該浸泡裝置取出該晶圓並轉移至該轉移手臂,並且以該轉移手臂將該晶圓翻轉後平放於該載台。
- 如請求項5所述的晶圓加工方法,更包含一步驟:h)自該載台取下該晶圓並輸出。
- 如請求項7所述的晶圓加工方法,其中於步驟h中以該輸入手臂將該晶圓自該載台取下並輸出。
- 如請求項1所述的晶圓加工方法,其中於步驟a中提供一輸入手臂且於步驟h中以該輸入手臂將該晶圓自該載台取下並輸出。
- 如請求項1所述的晶圓加工方法,其中於步驟a提供複數晶圓、一浸泡裝置、複數載台及對應各該載台的複數噴灑裝置,在步驟c中將各該晶圓分別翻轉放置到各該載台上,各該晶圓分別在各該載台上接續進行步驟e、f及g。
- 如請求項10所述的晶圓加工方法,其中於步驟a中提供複數轉移手臂,於步驟c中以各該轉移手臂將各該晶圓分別翻轉放置到各該載台。
- 如請求項11所述的晶圓加工方法,其中於步驟b中將該些晶圓一併置入該浸泡裝置。
- 一種載台,用於加工一晶圓,該載台包含:一外罩;一夾具,設置在該外罩內且用於承載所述晶圓;一升降機構,連接在該夾具及該外罩之間而能夠相對移動該夾具及該外罩使該 夾具出入該外罩;及一翻轉機構,連動該夾具而能夠翻轉該夾具。
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