TWI772601B - 切割裝置的設定方法 - Google Patents

切割裝置的設定方法 Download PDF

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Publication number
TWI772601B
TWI772601B TW108102468A TW108102468A TWI772601B TW I772601 B TWI772601 B TW I772601B TW 108102468 A TW108102468 A TW 108102468A TW 108102468 A TW108102468 A TW 108102468A TW I772601 B TWI772601 B TW I772601B
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TW
Taiwan
Prior art keywords
cutting
reference position
unit
contact
chuck table
Prior art date
Application number
TW108102468A
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English (en)
Chinese (zh)
Other versions
TW201932237A (zh
Inventor
笠井剛史
Original Assignee
日商迪思科股份有限公司
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Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201932237A publication Critical patent/TW201932237A/zh
Application granted granted Critical
Publication of TWI772601B publication Critical patent/TWI772601B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
TW108102468A 2018-01-26 2019-01-23 切割裝置的設定方法 TWI772601B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-011497 2018-01-26
JP2018011497A JP6968501B2 (ja) 2018-01-26 2018-01-26 切削装置のセットアップ方法

Publications (2)

Publication Number Publication Date
TW201932237A TW201932237A (zh) 2019-08-16
TWI772601B true TWI772601B (zh) 2022-08-01

Family

ID=67412991

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108102468A TWI772601B (zh) 2018-01-26 2019-01-23 切割裝置的設定方法

Country Status (4)

Country Link
JP (1) JP6968501B2 (ja)
KR (1) KR102551970B1 (ja)
CN (1) CN110076917B (ja)
TW (1) TWI772601B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7154336B2 (ja) * 2021-03-26 2022-10-17 Ｔｏｗａ株式会社 切断装置、及び、切断品の製造方法
CN113140491B (zh) * 2021-05-26 2022-07-12 吉林华微电子股份有限公司 贴膜机和半导体器件生产系统

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1691302A (zh) * 2004-04-21 2005-11-02 株式会社迪思科 切削刀片的位置偏移的检测方法
US20070122926A1 (en) * 2001-04-10 2007-05-31 S.O.I.Tec Silicon On Insulator Technologies S.A. Substrate layer cutting device and method
CN103311114A (zh) * 2012-03-09 2013-09-18 株式会社迪思科 切削装置
CN104520040A (zh) * 2012-08-17 2015-04-15 伊利诺斯工具制品有限公司 样品制备锯
TW201544248A (zh) * 2014-04-25 2015-12-01 Disco Corp 切削裝置
CN106024709A (zh) * 2015-03-31 2016-10-12 株式会社迪思科 晶片的分割方法
TW201640607A (zh) * 2015-01-29 2016-11-16 Disco Corp 校準方法
TW201740452A (zh) * 2016-05-11 2017-11-16 Disco Corp 切割裝置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2890902B2 (ja) * 1991-06-20 1999-05-17 富士通株式会社 半導体装置の製造方法及び製造装置
GB9307761D0 (en) 1993-04-15 1993-06-02 Emhart Glass Mach Invest Glassware forming machine
JP3540474B2 (ja) * 1995-11-11 2004-07-07 株式会社ソディック ワイヤ放電加工装置の基準接触位置の位置決め方法及びその装置
JPH11345787A (ja) * 1998-06-01 1999-12-14 Disco Abrasive Syst Ltd ダイシング装置
JP2005203540A (ja) * 2004-01-15 2005-07-28 Disco Abrasive Syst Ltd ウエーハの切削方法
JP4594144B2 (ja) * 2005-03-28 2010-12-08 大日本スクリーン製造株式会社 検査装置および位置ずれ量取得方法
JP5122341B2 (ja) * 2008-03-26 2013-01-16 株式会社ディスコ 切削装置
JP2010184331A (ja) 2009-02-13 2010-08-26 Disco Abrasive Syst Ltd 保持テーブルおよび加工装置
JP5313026B2 (ja) 2009-04-17 2013-10-09 株式会社ディスコ 切削装置
JP2013258205A (ja) 2012-06-11 2013-12-26 Disco Abrasive Syst Ltd 切削装置
JP6078297B2 (ja) * 2012-10-31 2017-02-08 株式会社ディスコ 加工装置
JP6125867B2 (ja) 2013-03-26 2017-05-10 株式会社ディスコ 切削方法
JP6255285B2 (ja) * 2014-03-18 2017-12-27 株式会社ディスコ 検出方法
JP6422805B2 (ja) 2015-03-27 2018-11-14 株式会社ディスコ 切削装置
JP6356655B2 (ja) * 2015-12-10 2018-07-11 ファナック株式会社 加工屑を除去する機能を有する加工システム
JP6727699B2 (ja) * 2016-04-19 2020-07-22 株式会社ディスコ 切削装置のセットアップ方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070122926A1 (en) * 2001-04-10 2007-05-31 S.O.I.Tec Silicon On Insulator Technologies S.A. Substrate layer cutting device and method
CN1691302A (zh) * 2004-04-21 2005-11-02 株式会社迪思科 切削刀片的位置偏移的检测方法
CN103311114A (zh) * 2012-03-09 2013-09-18 株式会社迪思科 切削装置
CN104520040A (zh) * 2012-08-17 2015-04-15 伊利诺斯工具制品有限公司 样品制备锯
TW201544248A (zh) * 2014-04-25 2015-12-01 Disco Corp 切削裝置
TW201640607A (zh) * 2015-01-29 2016-11-16 Disco Corp 校準方法
CN106024709A (zh) * 2015-03-31 2016-10-12 株式会社迪思科 晶片的分割方法
TW201740452A (zh) * 2016-05-11 2017-11-16 Disco Corp 切割裝置

Also Published As

Publication number Publication date
CN110076917B (zh) 2022-08-30
JP2019129282A (ja) 2019-08-01
CN110076917A (zh) 2019-08-02
KR102551970B1 (ko) 2023-07-05
KR20190091196A (ko) 2019-08-05
TW201932237A (zh) 2019-08-16
JP6968501B2 (ja) 2021-11-17

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