TWI772601B - How to set the cutting device - Google Patents

Abstract

[Problem] Appropriately derive the reference position of the cutting unit. [Solution] A method for setting a dicing device including a setting unit for detecting a position of the dicing unit when energization between a chuck table and a dicing blade is detected, and a method for setting the dicing device using the dicing device , taking the position of the cutting unit when it is detected that the cutting blade contacts the chuck table as the reference position, wherein, the setting method of the cutting device has: a step of temporarily registering the reference position, making the cutting unit move, and detecting when the power is turned on The position of the dicing blade is registered as a temporary reference position; and a contact mark determination step is to determine whether there is a contact mark of the cutting blade, and if it is determined that the contact mark is present in the contact mark determination step, a reference position setting step is performed to set the temporary reference position. The reference position is set, and when it is determined that there is no contact mark in the contact mark determination step, the temporary reference position registration step and the contact mark determination step are performed again.

Description

How to set the cutting device

The present invention relates to a setting method of a cutting device for cutting a workpiece with a cutting blade.

The element wafer on which the semiconductor element is mounted is formed by dividing a semiconductor wafer, a package substrate, or the like. The front surface of a semiconductor wafer or the like is divided by a plurality of intersecting planned dividing lines, semiconductor elements are formed in the divided regions, and then the semiconductor wafer or the like is divided along the planned dividing lines to form individual element wafers.

For the division of semiconductor wafers and the like, for example, a dicing device including a dicing unit can be used, and the dicing unit is further equipped with an annular dicing blade. In the dicing device, the dicing blade is rotated on a plane perpendicular to the front surface of the workpiece such as a semiconductor wafer, and the dicing blade is lowered to a predetermined height position in the incision feeding direction, and the workpiece is processed in the direction along the predetermined dividing line. Instead, the cutting blade is used to cut the workpiece.

When cutting a workpiece, it is important to position the cutting unit at a reference position so that the lower end of the cutting edge of the cutting blade is positioned at an appropriate height. The reference position is, for example, the height position of the cutting unit (position in the cutting feed direction) when the lower end of the cutting edge of the cutting blade is aligned with the height position of the holding surface of the chuck table holding the workpiece. Before performing cutting, a setting program for deriving the reference position is performed.

In the setting procedure, for example, the dicing unit is gradually lowered while the dicing blade is rotated, and the dicing blade is brought into contact with the holding surface of the chuck table. The position of the cutting unit in the cutting feed direction when the chuck table is in contact with the cutting blade becomes the reference position of the cutting unit. Contact between the chuck table and the dicing blade can be detected, for example, by monitoring the presence or absence of energization between the two (see Patent Document 1 and Patent Document 2).

[Previously known technical literature] [Patent Literature] [Patent Document 1] Japanese Patent Application Laid-Open No. 7-10552 [Patent Document 2] Japanese Patent Application Laid-Open No. 2010-251577

[Problems to be solved by the invention] In addition, when the workpiece is cut with the dicing blade, cutting chips are generated from the workpiece and scattered. Also, processing heat is generated due to friction between the workpiece and the cutting blade. Then, when the workpiece is cut with the dicing blade, a cutting liquid such as pure water is supplied to the workpiece or the dicing blade. Machining chips generated by cutting are taken away by the cutting liquid and removed, and the cutting blade and the workpiece are cooled by the cutting liquid. On the other hand, when a dicing liquid is used, the dicing liquid may adhere to the dicing blade or the chuck table and remain.

If the cutting liquid adheres to the cutting blade or the chuck table, the cutting blade and the chuck table may be energized through the cutting liquid before the cutting unit reaches the height that should be the reference position in the setting program. If conduction through the cutting fluid is detected, an inappropriate position is derived as the reference position of the cutting unit.

This reference position is a very important reference for determining the accuracy of the cutting process by the cutting blade. If an inappropriate height position is registered as the reference position of the cutting unit, the workpiece may not be properly cut with the cutting blade.

The present invention has been made in view of this problem, and an object thereof is to provide a method of setting a cutting device that can appropriately derive the reference position of the cutting unit.

[Technical means to solve the problem] According to an aspect of the present invention, a method for setting a cutting device can be provided, wherein the cutting device includes: a chuck table having a holding surface for holding a workpiece on the holding surface; and a cutting unit for cutting and holding a workpiece on the chuck with a cutting blade The workpiece on the disc table, while supplying cutting liquid to the workpiece and the cutting blade; cutting into the feeding unit, so that the cutting unit moves in the cutting and feeding direction perpendicular to the holding surface; the camera, shooting and holding on the chuck table and a setting unit capable of detecting the energization between the chuck table and the cutting blade, and when the energization is detected when the cutting unit is moved by the plunging feed unit, the cutting unit can be detected At the position in the cutting feed direction, the setting method of the cutting device is that in the cutting device, the position of the cutting unit when the cutting blade contacts the chuck table is derived as a reference position, wherein the setting of the cutting device The method includes a step of temporarily registering a reference position, moving the cutting unit in the cutting feed direction toward the holding surface, and detecting that the cutting unit is in the cutting feed direction when energization between the cutting blade and the chuck table is detected. Register the position in the direction as a temporary reference position; and a contact mark determination step, after the temporary reference position registration step is performed, the holding surface is photographed with the camera to determine whether there is a contact mark between the cutting blade and the chuck table. When it is determined that the contact trace formed on the holding surface has the contact trace in the contact trace determination step, a reference position setting step is performed, the temporary reference position is set as the reference position, and it is determined in the contact trace determination step. When there is no contact trace, the temporary reference position registration step and the contact trace determination step are performed again.

Preferably, when it is determined in the contact mark determination step that there is no contact mark, before the temporary reference position registration step is performed again, a gas blowing step is performed to blow air to the holding surface to adhere to the holding surface. The cutting fluid on it is removed.

[Inventive effect] According to a method for setting a cutting device according to an aspect of the present invention, in order to perform the temporary reference position registration step, the height position (position in the cutting feed direction) of the cutting unit when energization between the cutting blade and the chuck table is detected is detected. ) is registered as a temporary reference position.

The cutting unit is positioned at a height that should be the reference position, and when the cutting blade is in contact with the chuck table and the energization between the two is detected, the cutting blade slightly cuts the holding surface of the chuck table and makes contact with the holding surface. mark. On the other hand, when the cutting liquid adheres to the holding surface and the energization is detected through the cutting liquid, the cutting unit does not reach the height position that should be the reference position and does not cut the holding surface of the chuck table, so no formation is formed on the holding surface. contact marks.

Then, in one aspect of the present invention, a contact mark determination step is implemented, the holding surface of the chuck table is photographed with a camera, and the presence or absence of contact marks of the dicing blade is determined. When it is determined that the holding surface has a contact mark, it is confirmed that the setting procedure has been appropriately performed by the temporary reference position registration step, and the reference position setting step is executed to set the registered temporary reference position as the reference position.

On the other hand, when it is determined that there is no contact mark on the holding surface, it is confirmed that the setting program has not been properly implemented, so the temporary reference position registration step and the contact mark determination step are performed again.

As described above, by determining the presence or absence of the contact trace formed on the holding surface, the setting program can be appropriately performed, and the reference position of the cutting unit can be appropriately derived.

Therefore, according to an aspect of the present invention, there is provided a method for setting a cutting device that can appropriately derive the reference position of the cutting unit.

Embodiments related to one aspect of the present invention will be described with reference to the drawings. First, the cutting apparatus which implements the setting method concerning this embodiment, and the workpiece|work cut by this cutting apparatus are demonstrated using FIG. 1. FIG. FIG. 1 is a perspective view schematically showing a cutting device and a workpiece. The workpiece 1 is, for example, a substantially disk-shaped substrate or the like made of materials such as silicon, SiC (silicon carbide), or other semiconductor materials, or materials such as sapphire, glass, and quartz.

The front surface of the workpiece 1 is divided by a plurality of planned division lines arranged in a grid shape, and elements such as ICs are formed in the divided regions. Finally, the workpiece 1 is divided along the planned dividing line, whereby each element wafer is formed. For example, the workpiece 1 is held on the adhesive film 5 attached to the ring-shaped frame 3 , and the cutting is performed in a state in which the frame 3 and the adhesive film 5 are integrally formed as a frame unit. When the workpiece 1 is properly cut, the lower end of the blade of the cutting blade described below will reach the film 5 .

Next, the cutting device will be described. As shown in FIG. 1 , the cutting device 2 includes a device base 4 that supports each component. An X-axis moving table 6 and a machining feed unit (not shown) for moving the X-axis moving table 6 in the machining and feeding direction (X-axis direction) are disposed in the upper center of the apparatus base 4 . A dust-proof and drip-proof cover 8 covering the machining and feeding unit is attached to an upper end of the X-axis moving table 6 .

The X-axis moving table 6 is provided with a chuck table 10 for sucking and holding the workpiece 1 . The chuck table 10 includes a disk-shaped frame body 10c having a concave portion open upward, and a porous member disposed in the concave portion, the upper surface of which serves as a holding surface 10a for attracting and holding the workpiece 1 . This porous member is connected to a suction source (not shown) through a flow path (not shown) formed inside the chuck table 10 . The workpiece 1 is placed on the holding surface 10a, and the workpiece 1 is sucked and held by applying a negative pressure.

A clamp 10b is disposed around the holding surface 10a for fixing the annular frame 3 that holds the workpiece 1 through the adhesive film 5 . The chuck table 10 is connected to a rotational drive source (not shown) such as a motor, and is rotatable about a rotation axis perpendicular to the holding surface 10a. In addition, the chuck table 10 is sent to the machining feed direction (X-axis direction) by the machining feed unit.

In the front part of the apparatus base 4, the cassette mounting base 12 which can mount the cassette 12a which accommodates the workpiece|work 1 is arrange|positioned. The cutting device 2 includes a conveyance unit (not shown) that conveys the workpiece 1 between the cassette 12 a placed on the cassette placement table 12 and the chuck table 10 .

On the upper surface of the apparatus base 4 , a support portion 16 is disposed so as to protrude above the X-axis moving table 6 , and supports the cutting unit 14 that cuts the workpiece 1 . An index feeding unit 18 a for moving the cutting unit 14 in the index feeding direction (Y-axis direction) is disposed on the front surface of the support portion 16 .

The index feeding unit 18a includes a pair of Y-axis guide rails 20 arranged on the front surface of the support portion 16 and parallel to the Y-axis direction. The Y-axis moving plate 22 is slidably mounted on the Y-axis guide rail 20 . A nut portion (not shown) is provided on the rear side (rear side) of the Y-axis moving plate 22 , and the Y-axis ball screw 24 parallel to the Y-axis guide 20 is screwed to the nut portion.

A Y-axis pulse motor (not shown) is connected to one end of the Y-axis ball screw 24 . When the Y-axis ball screw 24 is rotated by the Y-axis pulse motor, the Y-axis moving plate 22 moves in the indexing feed direction along the Y-axis guide rail 20 . On the front surface (front surface) of the Y-axis moving plate 22, a cutting feed unit 18b that moves the cutting unit 14 in the cutting feed direction (Z-axis direction) is disposed.

A pair of Z-axis guide rails 26 parallel to the Z-axis direction are provided on the surface of the Y-axis moving plate 22 . The Z-axis moving plate 28 is slidably mounted on each of the Z-axis guide rails 26 .

A nut portion (not shown) is provided on the back side (rear side) of the Z-axis moving plate 28 , and the Z-axis ball screw 30 parallel to the Z-axis guide rail 26 is screwed to the nut portion. A Z-axis pulse motor 32 is connected to one end of the Z-axis ball screw 30 . When the Z-axis ball screw 30 is rotated by the Z-axis pulse motor 32 , the Z-axis moving plate 28 moves along the Z-axis guide rail 26 in the cutting feed direction.

A cutting unit 14 for cutting the workpiece 1 held on the chuck table 10 , and a camera (camera unit) 34 for photographing the workpiece 1 are fixed to the front lower portion of the Z-axis moving plate 28 . When the Y-axis moving plate 22 is moved in the Y-axis direction, the cutting unit 14 and the camera 34 are moved in the indexing feed direction, and when the Z-axis moving plate 28 is moved in the Z-axis direction, the cutting unit 14 and the camera are moved in the Z-axis direction. 34 moves in the plunging feed direction.

The cutting unit 14 includes a main shaft 40 (see FIG. 2(A) ) constituting a rotation axis parallel to the Y-axis direction, and an annular cutting blade 36 attached to one end side of the main shaft 40 . A rotary drive source 42 such as a motor is connected to the other end side of the spindle 40 (see FIG. 2(A) ). When the rotary drive source 42 is operated, the cutter blade 36 attached to the spindle 40 can be rotated. An annular cutting blade for cutting into the workpiece 1 is fixed to the outer peripheral portion of the cutting blade 36 .

When the workpiece 1 is cut with the cutting blade 36 , cutting chips are generated from the workpiece 1 , and scattered on the workpiece 1 or inside the cutting device 2 to become a contamination source. Further, there is a possibility that the cutting blade 36 or the workpiece 1 may be damaged due to processing heat generated by the friction between the workpiece 1 and the cutting blade 36 . Then, when cutting the workpiece 1 , the cutting liquid is supplied to the cutting blade 36 and the workpiece 1 .

A cutting liquid supply nozzle 50 (see FIG. 4 ) for supplying the cutting liquid to the cutting blade 36 and the workpiece 1 is arranged in the vicinity of the cutting blade 36 . Machining chips generated by cutting are carried away by the cutting liquid and removed, so that contamination of the workpiece 1 or the cutting device 2 can be suppressed. In addition, since the cutting blade 36 and the workpiece 1 can be cooled by the cutting liquid, damage to the cutting blade 36 or the workpiece 1 can be suppressed. The cutting liquid is, for example, pure water or water to which a surfactant or the like is added.

As shown in FIG. 1 , a cleaning unit 38 for cleaning the cut workpiece 1 is disposed at the rear of the upper surface of the apparatus base 4 . The cleaning unit 38 includes a cleaning table 38 a that holds the workpiece 1 , and a cleaning nozzle 38 b that cleans the workpiece 1 by supplying cleaning liquid to the workpiece 1 held on the cleaning table 38 a.

When the workpiece 1 is cut by the cutting unit 14 , first, the workpiece 1 in the frame unit state is placed on the holding surface 10 a of the chuck table 10 , and a negative pressure is applied to the workpiece 1 to attract and hold the workpiece 1 on the chuck table 10 . superior. At this time, the frame 3 of the frame unit is held by the jig 10b.

Next, the chuck table 10 is moved in the machining feed direction, and the upper surface of the workpiece 1 held on the chuck table 10 is photographed by the camera 34 to confirm the position of the planned dividing line of the workpiece 1 . Then, the relative positions of the cutting unit 14 and the chuck table 10 are adjusted so that the workpiece 1 can be cut along the planned dividing line.

Then, the cutting blade 36 is rotated above the outer peripheral side of the chuck table 10, and the cutting and feeding unit 18b is operated to lower the cutting unit 14 to a predetermined height position based on the reference position. Here, the reference position is the position of the cutting unit 14 in the cutting feed direction (Z-axis direction) when the cutting blade 36 contacts the chuck table 10 . Next, when the machining feed unit is operated to move the chuck table 10 in the machining feed direction and the cutting blade 36 cuts into the workpiece 1, the workpiece 1 is cut.

After cutting the workpiece 1 along one planned dividing line, the cutting unit 14 is moved in the indexing feeding direction by the indexing feeding unit 18a, and then the workpiece 1 is cut along the other planned dividing lines successively. After cutting the workpiece 1 along all the planned dividing lines arranged in one direction, the chuck table 10 is rotated about an axis perpendicular to the holding surface 10a, and the workpiece 1 is cut along the planned dividing lines arranged in the other direction. Then, when the workpiece 1 is cut along all the planned dividing lines, the cutting process is completed.

The cutting device 2 further includes a setting unit 44 (see FIG. 2(A) ) that executes a setting program for deriving the reference position of the cutting unit before starting the cutting process of the workpiece 1 . In addition, the setting unit 44 may include a control unit (not shown) that controls each configuration of the cutting device 2 . The setting unit 44 is electrically connected to the dicing blade 36 through the spindle 40 (see FIG. 2(A) ), and is also electrically connected to the frame body 10 c of the chuck table 10 .

In the setting procedure, the dicing blade 36 is moved toward the holding surface 10 a while being rotated in the cutting feed direction so that the dicing blade 36 comes into contact with the frame body 10 c of the chuck table 10 . The setting unit 44 detects the contact between the cutting blade 36 and the chuck table 10 by detecting energization between the two. Then, the position of the cutting unit 14 in the cutting feed direction when the contact of the cutting blade 36 with the chuck table 10 is detected is registered as a reference position.

However, for example, when the cutting liquid supplied when cutting the workpiece 1 remains on the holding surface 10a of the chuck table 10, the cutting blade 36 and the chuck table 10 may pass through the cutting liquid when the setting program is executed. power-on condition. In this case, although the lower end of the cutting edge of the cutting blade 36 does not reach the chuck table 10, the setting unit 44 detects the contact between the two, and registers the inappropriate position as the reference position.

Therefore, in the setting method of the dicing device 2 according to the present embodiment, in order to detect the contact of the dicing blade 36 with the chuck table 10 , the contact mark formed on the holding surface 10 a is performed. Then, it is confirmed that the cutting blade 36 is in contact with the chuck table 10 and the reference position of the cutting unit 14 is appropriately led out. Hereinafter, the setting method of the cutting device 2 according to the present embodiment will be described in detail.

This setting method includes a temporary reference position registration step, and registers the position of the cutting unit 14 in the cutting feed direction when the energization between the cutting blade 36 and the chuck table 10 is detected as the temporary reference position. The temporary reference position registration procedure will be described with reference to FIG. 2(A). FIG. 2(A) is a cross-sectional view schematically showing a temporary reference position registration procedure.

In the temporary reference position registration step, first, the X-axis moving table 6 is moved so that the dicing blade 36 is positioned above the frame body 10c of the chuck table 10, and the index feeding unit 18a is operated. Next, the incision feeding unit 18b is operated, and the cutting unit 14 is moved in the incision feeding direction toward the holding surface 10a.

At this time, the setting unit 44 is made to monitor the presence or absence of electricity between the cutting blade 36 and the chuck table 10 . Then, when the energization of both is observed, the height position of the cutting unit 14 is registered as a temporary reference position. For example, the setting unit 44 may include a temporary reference position registration unit (not shown), and the temporary reference position may be registered in the temporary reference position registration unit. In addition, this temporary reference position registration part may be arrange|positioned in the control unit (not shown) which controls the cutting apparatus 2.

Next, a contact trace determination step is performed. FIG. 2(B) is a cross-sectional view schematically showing a contact trace determination step. The contact trace determination procedure will be described with reference to FIG. 2(B). In the contact mark determination step, the camera 34 is moved above the area of the holding surface 10a where the cutting blade 36 is to be brought into contact, and the holding surface 10a is photographed with the camera 34 . Then, it is determined whether or not there is a contact mark of the dicing blade 36 formed on the holding surface 10a.

FIG. 3 is a plan view schematically showing a contact trace determination step. As shown in FIG. 3 , a contact mark 48 is formed on the frame body 10c of the chuck table 10 by the previously performed setting procedure.

If such a contact mark 48 is confirmed at the contact point 46 where the dicing blade 36 of the holding surface 10a is to come into contact, it is confirmed that the dicing blade 36 and the chuck table 10 are in contact when the energization of the cutting blade 36 and the chuck table 10 is detected. That is, since it is confirmed that an appropriate setting procedure has been carried out, the reference position setting step of setting the temporary reference position as the reference position is carried out.

On the other hand, in the example shown in FIG. 3 , it can be seen that the contact trace 48 is not formed in the intended contact position 46 . In this case, for example, the cutting blade 36 or the holding surface 10a is adhered to the cutting blade 36 or the holding surface 10a for reasons such as detection of energization between the two caused by the permeation of the cutting liquid, and it is confirmed that the two are not actually in contact. Therefore, it can be confirmed that the registered temporary reference position is not the position that should be registered as the reference position.

Then, in order to appropriately derive the reference position of the cutting unit 14, the temporary reference position registration step and the contact mark determination step are performed again. At this time, it is not necessary to directly perform the two steps at the contact predetermined position 46 of the holding surface 10a, and a position different from the contact predetermined position 46 can be reset as the contact predetermined position 46 to perform the two steps.

Furthermore, before performing the temporary reference position registration step again, a gas blowing step may be performed to blow air to the holding surface 10a to remove the cutting liquid adhering to the holding surface 10a. FIG. 4 is a cross-sectional view schematically showing a gas blowing step. For example, the cutting unit 14 may include a blowing gas unit 52 that blows a gas 52a such as high-pressure dry air to the holding surface 10a. In the gas blowing step, the gas 52a is supplied to the holding surface 10a by the gas blowing unit 52 to remove the cutting liquid 50a.

After that, when the temporary reference position registration step is performed again, the dicing blade 36 is brought into contact with the chuck table 10 to detect energization, and at the same time, a contact trace is formed on the holding surface 10a. Then, in the contact trace determination step, it is determined that the contact trace is present, and the temporary reference position registered in the temporary reference position registration step to be performed again is used as the reference position.

In addition, even when it is judged that there is no contact trace in the contact trace determination step, the gas blowing step may not be performed in some cases. For example, in the temporary reference position registration step, when the rotating cutting blade 36 comes into contact with the cutting liquid adhering to the holding surface 10a, the cutting liquid may be bounced due to the rotation of the cutting blade 36 at the same time as the energization is detected. In this case, if the temporary reference position registration procedure is directly performed again, the reference position can be appropriately derived.

As described above, according to the setting method of the cutting device according to the present embodiment, the reference position of the cutting unit 14 can be appropriately derived. In addition, it can be confirmed that the derived reference position is an appropriate position.

In addition, in the above-described embodiment, the camera 34 images the holding surface 10a to determine the presence or absence of the contact trace 48 in the contact trace determination step, but the aspect of the present invention is not limited to this. In one aspect of the present invention, whether or not the temporary reference position should be registered as the reference position may be determined by another method.

For example, the holding surface 10a may be photographed by the camera 34 to determine the presence or absence of residual cutting liquid or the like. In this case, for example, when it is determined that the cutting liquid or the like is adhering to the contact point 46 of the cutting blade 36, the gas blowing step is performed to remove the cutting liquid, and the temporary reference position registration step is performed again.

In addition, in the range which does not deviate from the objective of this invention, the structure, method, etc. concerning the above-mentioned embodiment can be suitably changed and implemented.

1‧‧‧Workpiece 3‧‧‧Framework 5‧‧‧Film 2‧‧‧Cutting device 4‧‧‧Installation base 6‧‧‧X-axis moving table 8‧‧‧Dust-proof and drip-proof cover 10‧‧‧Chuck table 10a‧‧‧Maintaining surface 10b‧‧‧Clamp 10c‧‧‧Frame 12‧‧‧Cassette mounting table 12a‧‧‧Cassette 14‧‧‧Cutting unit 16‧‧‧Support 18a‧‧‧Indexing feed unit 18b‧‧‧Plunging into the feed unit 20, 26‧‧‧guide rail 22, 28‧‧‧Mobile board 24, 30‧‧‧ball screw 32‧‧‧Pulse motor 34‧‧‧Camera 36‧‧‧Cutting blades 38‧‧‧Cleaning unit 38a‧‧‧Cleaning station 38b‧‧‧Cleaning Nozzle 40‧‧‧Spindle 42‧‧‧Rotary drive source 44‧‧‧Setting Unit 46‧‧‧Contact reservation 48‧‧‧Contact marks 50‧‧‧Cutting fluid supply nozzle 50a‧‧‧Cutting fluid 52‧‧‧Gas injection unit 52a‧‧‧Gas

FIG. 1 is a perspective view schematically showing a cutting device and a workpiece. FIG. 2(A) is a cross-sectional view schematically showing a temporary reference position registration step, and FIG. 2(B) is a cross-sectional view schematically showing a contact trace determination step. FIG. 3 is a plan view schematically showing a cut mark formed on the holding surface of the chuck table. FIG. 4 is a cross-sectional view schematically showing a gas blowing step.

10‧‧‧Chuck table

10a‧‧‧Maintaining surface

10c‧‧‧Frame

46‧‧‧Contact reservation

48‧‧‧Contact marks

Claims (2)

A method for setting a cutting device, the cutting device comprises: a chuck table with a holding surface for holding a workpiece on the holding surface; a cutting unit for cutting the workpiece held on the chuck table with a cutting blade, and simultaneously the workpiece is and the cutting blade to supply cutting fluid; a cutting feed unit to move the cutting unit in a cutting feed direction perpendicular to the holding surface; a camera to photograph the workpiece held on the chuck table; and a setting unit to detect The energization between the chuck table and the cutting blade, and when the energization is detected when the cutting unit is moved by the plunging feeding unit, can detect the position of the cutting unit in the plunging feeding direction, The setting method of the dicing device includes, in the dicing device, a position of the dicing unit when the dicing blade contacts the chuck table as a reference position, wherein the method of setting the dicing device includes a step of registering a temporary reference position, The cutting unit moves in the cutting feed direction toward a predetermined contact point of the holding surface where the cutting blade is to come into contact, and the cutting unit will move in the cutting feed direction when energization between the cutting blade and the chuck table is detected. registering the position in the direction as a temporary reference position; and a contact mark determination step, after the temporary reference position registration step is carried out, the camera is used to photograph the contact point of the holding surface, and it is determined whether there is a cause of the cutting blade and the chuck. If it is determined in the contact trace determination step that there is a contact trace formed on the holding surface due to the contact of the stage, the reference position setting step is performed, and the temporary reference position is set as the reference If it is determined that there is no contact trace in the contact trace determination step, the temporary reference position registration step and the contact trace determination step are performed again. The method for setting a cutting device according to claim 1, wherein, when it is determined in the contact mark determination step that there is no contact mark, the gas blowing step is performed before the temporary reference position registration step is performed again , blowing air on the holding surface to remove the cutting liquid adhering to the holding surface.

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