TW201932237A - Setup method of cutting apparatus detecting a position of the cutting unit when electrical conduction between the chuck table and the cutting blade is detected - Google Patents

Abstract

A reference position of a cutting unit is appropriately derived. A setup method of a cutting apparatus is provided; the cutting apparatus comprises a set-up unit for detecting the position of the cutting unit when the electrical conduction between the chuck table and the cutting blade is detected. The cutting apparatus setup method uses the cutting apparatus to set the position of the cutting unit as a reference position when the cutting blade is brought into contact with the chuck table. The cutting apparatus setup method comprises: a temporary reference position registration step for moving the cutting unit and registering the position where the electrical conduction is detected as a temporary reference position; and a contact mark determination step for determining the presence or absence of a contact mark of the cutting blade. When the contact mark determination step determines that the contact mark is present, a reference position setting step is performed such that the temporary reference position is set as the reference position. When it is determined in the contact mark determination step that there is no contact mark, the temporary reference position registration step and the contact mark determination step are carried out again.

Description

Setting method of cutting device

The invention relates to a setting method of a cutting device for cutting a workpiece with a cutting blade.

An element wafer on which a semiconductor element is mounted is formed by dividing a semiconductor wafer, a package substrate, or the like. The front of a semiconductor wafer or the like is divided by a plurality of intersecting division lines, and a semiconductor element is formed in each of the divided regions. Then, the semiconductor wafer or the like is divided along the division line to form each element wafer.

For the division of semiconductor wafers, for example, a dicing device having a dicing unit can be used, and the dicing unit is also provided with a circular dicing blade. In the dicing apparatus, the dicing blade is rotated on a plane perpendicular to the front surface of a workpiece such as a semiconductor wafer, and the dicing blade is lowered to a predetermined height position in the cutting feed direction, and the workpiece is processed in a direction along a predetermined division line A cutting blade is used to cut the workpiece.

When cutting a workpiece, it is important to position the cutting unit at a reference position such that the lower end of the cutting edge of the cutting blade is positioned at an appropriate height position. This reference position is, for example, the height position (position in the cutting feed direction) of the cutting unit when the lower end of the cutting edge of the cutting blade is aligned with the height position of the holding surface of the chuck table holding the workpiece. Before the cutting is performed, a setting procedure for deriving the reference position is performed.

In the setting procedure, for example, the cutting unit is gradually lowered while the cutting blade is rotated, and the cutting blade is brought into contact with the holding surface of the chuck table. When the chuck table contacts the cutting blade, the position of the cutting unit in the feed direction becomes the reference position of the cutting unit. The contact between the chuck table and the cutting blade can be detected, for example, by monitoring the presence or absence of power between the two (see Patent Literature 1 and Patent Literature 2).

[Xizhi technical literature]
[Patent Literature]
[Patent Document 1] Japanese Shikaihei 7-10552
[Patent Document 2] Japanese Patent Laid-Open No. 2010-251577

[Problems to be Solved by the Invention]
In addition, when a workpiece is cut with a cutting blade, cutting chips are generated from the workpiece and scattered. In addition, processing heat is generated due to friction between the workpiece and the cutting blade. Then, when the workpiece is cut with a cutting blade, a cutting liquid such as pure water is supplied to the work or the cutting blade. The cutting chips generated by the cutting are removed by the cutting liquid, and the cutting blade and the workpiece are cooled by the cutting liquid. On the other hand, when a cutting fluid is used, the cutting fluid may adhere to a cutting blade or a chuck table and may remain.

If the cutting fluid is attached to the cutting blade or the chuck table, in the setting procedure, the cutting blade and the chuck table may be energized through the cutting liquid before the cutting unit reaches the height which should be the reference position. If conduction through the cutting fluid is detected, an inappropriate position is derived as the reference position of the cutting unit.

This reference position is a very important reference for determining the accuracy of the cutting process with the cutting blade. If an inappropriate height position is registered as the reference position of the cutting unit, the workpiece cannot be appropriately cut with the cutting blade.

The present invention has been made in view of this problem, and an object thereof is to provide a method for setting a cutting device that can appropriately derive a reference position of a cutting unit.

[Technical means to solve the problem]
According to an aspect of the present invention, a setting method of a cutting device is provided. The cutting device includes a chuck table having a holding surface to hold a workpiece on the holding surface, and a cutting unit to cut and hold the card with a cutting blade. The workpiece on the tray table is simultaneously supplied with cutting fluid to the workpiece and the cutting blade; a cutting-in feed unit moves the cutting unit in a cutting-in feed direction perpendicular to the holding surface; a camera is photographed and held on the chuck table And a setting unit that can detect the energization between the chuck table and the cutting blade, and can detect the cutting unit when the cutting unit is moved by the infeed unit and the energization is detected. At the position in the cutting feed direction, the setting method of the cutting device is that in the cutting device, the position of the cutting unit when the cutting blade contacts the chuck table is derived as a reference position, wherein the setting of the cutting device is The method includes a temporary reference position registration step, the cutting unit is moved toward the holding surface in the cutting feed direction, and the cutting blade is detected And the registration position of the cutting unit in the cutting feed direction when power is applied between the chuck table as a temporary reference position; and a contact mark determination step, after implementing the temporary reference position registration step, photographing the holding with the camera And determine whether there is a contact mark formed on the holding surface due to the contact between the cutting blade and the chuck table. When it is determined that the contact mark exists in the contact mark determination step, a reference position setting step is performed, and The temporary reference position is set as the reference position, and when it is determined that the contact mark is not present in the contact mark determination step, the temporary reference position registration step and the contact mark determination step are performed again.

Preferably, in the case where it is determined that the contact mark is absent in the contact mark determination step, before performing the temporary reference position registration step again, a gas blowing step is performed to blow the holding surface to adhere to the holding surface. This cutting fluid is removed.

[Inventive effect]
In the setting method of the cutting device according to one aspect of the present invention, in order to implement the temporary reference position registration step, the height position of the cutting unit (the position in the cutting feed direction) when the energization between the cutting blade and the chuck table is detected ) Register as a temporary reference position.

Position the cutting unit at a height that should be the reference position. When the cutting blade is in contact with the chuck table and the energization between the two is detected, the cutting blade slightly cuts the holding surface of the chuck table to make contact on the holding surface. mark. On the other hand, when a cutting fluid is adhered to the holding surface and the current is detected through the cutting fluid, the cutting unit does not reach the height position that should be the reference position and the holding surface of the chuck table is not cut, so it is not formed on the holding surface. Contact marks.

Then, in one aspect of the present invention, a contact mark determination step is performed, and the holding surface of the chuck table is photographed with a camera to determine the presence or absence of a contact mark of the cutting blade. When it is determined that the holding surface has a contact mark, it is confirmed that the setting procedure has been appropriately implemented by the temporary reference position registration step. Therefore, the reference position setting step is performed to set the registered temporary reference position as the reference position.

On the other hand, when it is determined that there is no contact mark on the holding surface, it is confirmed that the setting procedure is not properly performed, and therefore the temporary reference position registration step and the contact mark determination step are performed again.

As described above, the setting program can be appropriately implemented by determining the presence or absence of the contact mark formed on the holding surface, and the reference position of the cutting unit can be appropriately derived.

Therefore, according to an aspect of the present invention, a method for setting a cutting device is provided, and a reference position of a cutting unit can be appropriately derived.

An embodiment according to one aspect of the present invention will be described with reference to the drawings. First, the cutting apparatus which implements the setting method concerning this embodiment, and the workpiece | work cut by this cutting apparatus are demonstrated using FIG. 1. FIG. FIG. 1 is a perspective view schematically showing a cutting device and a workpiece. The workpiece 1 is, for example, a substantially circular plate-shaped substrate made of a material such as silicon, SiC (silicon carbide), or other semiconductors, or a material such as sapphire, glass, or quartz.

The front surface of the workpiece 1 is divided by a plurality of predetermined division lines arranged in a grid shape, and elements such as ICs are formed in the divided regions. Finally, the workpiece 1 is divided along the predetermined division line, thereby forming each element wafer. For example, the workpiece 1 is held on the adhesive film 5 attached to the ring-shaped frame 3 and cut in a state where the frame unit is integrated with the frame 3 and the adhesive film 5. When the workpiece 1 is appropriately cut, the lower end of the cutting edge of the cutting blade described below reaches the adhesive film 5.

Next, the cutting device will be described. As shown in FIG. 1, the cutting device 2 includes a device base 4 that supports each constituent element. An X-axis moving table 6 and a processing feed unit (not shown) that moves the X-axis moving table 6 in the processing feed direction (X-axis direction) are arranged on the center upper part of the device base 4. A dust-proof and drip-proof cover 8 covering the processing feed unit is attached to the upper end of the X-axis moving table 6.

A chuck table 10 for attracting and holding the work 1 is provided on the X-axis moving table 6. The chuck table 10 includes a disc-shaped frame 10 c formed with a recessed portion that opens upward, and a porous member disposed in the recessed portion. The upper surface of the porous member is a holding surface 10 a that attracts and holds the workpiece 1. This porous member is connected to a suction source (not shown) through a flow path (not shown) formed inside the chuck table 10. The workpiece 1 is placed on the holding surface 10 a, and a negative pressure is applied to attract and hold the workpiece 1.

Around the holding surface 10a, a jig 10b is arranged to fix the ring-shaped frame 3 holding the workpiece 1 through the adhesive film 5. The chuck table 10 is connected to a rotation drive source (not shown) such as a motor, and is rotatable about a rotation axis perpendicular to the holding surface 10a. Moreover, the chuck table 10 is sent to a processing feed direction (X-axis direction) by the processing feed unit.

A cassette mounting table 12 on which a cassette 12 a for accommodating the workpiece 1 is placed is arranged at the front of the apparatus base 4. The cutting device 2 includes a transfer unit (not shown) that transfers the workpiece 1 between the cassette 12 a and the chuck table 10 placed on the cassette mounting table 12.

A support portion 16 is disposed on the upper surface of the device base 4 so as to protrude above the X-axis moving table 6 to support the cutting unit 14 that cuts the workpiece 1. An index feeding unit 18 a for moving the cutting unit 14 in the index feeding direction (Y-axis direction) is disposed on the front surface of the support portion 16.

The indexing feed unit 18 a includes a pair of Y-axis guides 20 arranged in front of the support portion 16 and parallel to the Y-axis direction. The Y-axis moving plate 22 is slidably mounted on the Y-axis guide 20. A nut portion (not shown) is provided on the back side (rear side) of the Y-axis moving plate 22, and a Y-axis ball screw 24 parallel to the Y-axis guide 20 is screwed to the nut portion.

A Y-axis pulse motor (not shown) is connected to one end of the Y-axis ball screw 24. When the Y-axis ball screw 24 is rotated by a Y-axis pulse motor, the Y-axis moving plate 22 moves along the Y-axis guide 20 in the index feed direction. A cut-in feed unit 18 b that moves the cutting unit 14 in the cut-in feed direction (Z-axis direction) is provided on the front (front) of the Y-axis moving plate 22.

A pair of Z-axis guides 26 are provided on the surface of the Y-axis moving plate 22 in parallel with the Z-axis direction. The Z-axis moving plate 28 is slidably mounted on each Z-axis guide 26.

A nut portion (not shown) is provided on the back side (rear side) of the Z-axis moving plate 28, and a Z-axis ball screw 30 parallel to the Z-axis guide 26 is screwed to the nut portion. A Z-axis pulse motor 32 is connected to one end of the Z-axis ball screw 30. When the Z-axis ball screw 30 is rotated by the Z-axis pulse motor 32, the Z-axis moving plate 28 moves in the plunging feed direction along the Z-axis guide 26.

A cutting unit 14 that cuts the workpiece 1 held on the chuck table 10 and a camera (imaging unit) 34 that can capture the workpiece 1 are fixed to the lower portion of the front of the Z-axis moving plate 28. If the Y-axis moving plate 22 is moved in the Y-axis direction, the cutting unit 14 and the camera 34 are moved in the index feed direction, and if the Z-axis moving plate 28 is moved in the Z-axis direction, the cutting unit 14 and the camera are moved 34 moves in the plunging feed direction.

The cutting unit 14 includes a main shaft 40 (see FIG. 2 (A)) constituting a rotation axis parallel to the Y-axis direction, and an annular cutting blade 36 attached to one end side of the main shaft 40. A rotary driving source 42 (see FIG. 2 (A)) such as a motor is connected to the other end side of the spindle 40. When the rotary driving source 42 is operated, the cutting blade 36 mounted on the spindle 40 can be rotated. An annular cutting blade for cutting into the workpiece 1 is fixed to the outer peripheral portion of the cutting blade 36.

When the workpiece 1 is cut with the cutting blade 36, cutting chips are generated from the workpiece 1, and are scattered on the workpiece 1 or inside the cutting device 2 and become a source of pollution. In addition, processing heat is generated due to friction between the work 1 and the cutting blade 36, and there is a concern that the cutting blade 36 or the work 1 may be damaged. Then, when the work 1 is cut, the cutting blade 36 and the work 1 are supplied with a cutting liquid.

A cutting fluid supply nozzle 50 (see FIG. 4) that supplies the cutting fluid to the cutting blade 36 and the workpiece 1 is disposed near the cutting blade 36. The cutting chips generated by the cutting are taken away and removed by the cutting liquid, and contamination of the workpiece 1 or the cutting device 2 can be suppressed. In addition, since the cutting blade 36 and the workpiece 1 can be cooled by the cutting liquid, damage to the cutting blade 36 or the workpiece 1 can be suppressed. This cutting liquid is, for example, pure water or water to which a surfactant is added.

As shown in FIG. 1, a cleaning unit 38 for cleaning the cut workpiece 1 is arranged at the rear of the upper surface of the device base 4. The cleaning unit 38 includes a cleaning table 38 a that holds the workpiece 1, and a cleaning nozzle 38 b that supplies a cleaning liquid to the workpiece 1 held by the cleaning table 38 a to clean the workpiece 1.

When cutting the workpiece 1 by the cutting unit 14, first, the workpiece 1 in a frame unit state is placed on the holding surface 10 a of the chuck table 10, and a negative pressure is applied to the workpiece 1 to attract and hold the workpiece 1 on the chuck table 10. on. At this time, the frame 3 of the frame unit is held by the jig 10b.

Next, the chuck table 10 is moved in the processing feed direction, and the upper surface of the work 1 held on the chuck table 10 is photographed by the camera 34 to confirm the position of the predetermined division line of the work 1. Then, the relative positions of the cutting unit 14 and the chuck table 10 are adjusted so that the workpiece 1 can be cut along the predetermined division line.

After that, the cutting blade 36 is rotated above the outer peripheral side of the chuck table 10, and the cutting feed unit 18b is operated to lower the cutting unit 14 to a predetermined height position based on the reference position. Here, the reference position is the position of the cutting unit 14 in the cutting feed direction (Z-axis direction) when the cutting blade 36 contacts the chuck table 10. Next, when the processing feed unit is operated to move the chuck table 10 in the processing feed direction and the cutting blade 36 cuts into the workpiece 1, the workpiece 1 is cut.

After cutting the workpiece 1 along a predetermined division line, the cutting unit 14 is moved in the index feeding direction by the index feeding unit 18a, and then the workpiece 1 is successively cut along other predetermined division lines. After cutting the workpiece 1 along all the planned division lines arranged in one direction, the chuck table 10 is rotated around an axis perpendicular to the holding surface 10a, and the workpiece 1 is cut along the planned division lines arranged in other directions. Then, if the workpiece 1 is cut along all the division lines, the cutting process is completed.

The cutting device 2 further includes a setting unit 44 (see FIG. 2 (A)) that executes a setting program for deriving a reference position of the cutting unit before starting the cutting process of the workpiece 1. In addition, the setting unit 44 may include a control unit (not shown) that controls each configuration of the cutting device 2. The setting unit 44 is electrically connected to the cutting blade 36 through the main shaft 40 (see FIG. 2 (A)), and is also electrically connected to the frame 10 c of the chuck table 10.

In the setting procedure, the cutting blade 36 is moved in the cutting feed direction toward the holding surface 10 a while rotating, so that the cutting blade 36 contacts the housing 10 c of the chuck table 10. The setting unit 44 detects the contact between the cutting blade 36 and the chuck table 10 by detecting the energization between the cutting blade 36 and the chuck table 10. Then, the position of the cutting unit 14 in the cutting feed direction when contact between the cutting blade 36 and the chuck table 10 is detected is registered as a reference position.

However, for example, if the cutting fluid supplied during cutting of the workpiece 1 remains on the holding surface 10a of the chuck table 10, the cutting blade 36 and the chuck table 10 may pass through the cutting liquid during the setting process. When power is applied. In this case, although the lower end of the cutting edge of the cutting blade 36 does not reach the chuck table 10, the setting unit 44 detects contact between the two, and an inappropriate position is registered as a reference position.

Therefore, in the setting method of the cutting device 2 according to the present embodiment, a contact mark formed on the holding surface 10 a is used to detect the contact of the cutting blade 36 to the chuck table 10. Then, it is confirmed that the cutting blade 36 is in contact with the chuck table 10 and the reference position of the cutting unit 14 is appropriately led out. Hereinafter, a setting method of the cutting device 2 according to the present embodiment will be described in detail.

This setting method includes a temporary reference position registration step of registering the position of the cutting unit 14 in the plunging feed direction when the energization between the cutting blade 36 and the chuck table 10 is detected as the temporary reference position. The temporary reference position registration procedure will be described using FIG. 2 (A). FIG. 2 (A) is a cross-sectional view schematically showing a temporary reference position registration step.

In the temporary reference position registration step, first, the X-axis moving table 6 is moved so that the cutting blade 36 is positioned above the housing 10c of the chuck table 10, and the index feeding unit 18a is operated. Next, the cutting feed unit 18b is operated, and the cutting unit 14 is moved toward the holding surface 10a in the cutting feed direction.

At this time, the setting unit 44 is caused to monitor the presence or absence of power between the cutting blade 36 and the chuck table 10. Then, when the energization of both is observed, the height position of the cutting unit 14 is registered as a temporary reference position. For example, the setting unit 44 may include a temporary reference position registration unit (not shown), and register the temporary reference position in the temporary reference position registration unit. The temporary reference position registration unit may be provided in a control unit (not shown) that controls the cutting device 2.

Next, a contact mark determination step is performed. FIG. 2 (B) is a cross-sectional view schematically showing a contact mark determination step. The step of determining a contact mark will be described using FIG. 2 (B). In the contact mark determination step, the camera 34 is moved over the area of the holding surface 10 a where the cutting blade 36 is to be brought into contact, and the holding surface 10 a is captured by the camera 34. Then, it is determined whether there is a contact mark of the cutting blade 36 formed on the holding surface 10a.

FIG. 3 is a plan view schematically showing a contact mark determination step. As shown in FIG. 3, a contact mark 48 is formed on the housing 10 c of the chuck table 10 by a previously performed setting procedure.

When such a contact mark 48 is confirmed at the contact predetermined place 46 where the cutting blade 36 of the holding surface 10a is to be brought into contact, it is confirmed that the cutting blade 36 and the chuck table 10 are in contact with each other when power is detected. That is, it is confirmed that an appropriate setting procedure has been performed, and therefore a reference position setting step of setting a temporary reference position as a reference position is performed.

On the other hand, in the example shown in FIG. 3, it is understood that the contact mark 48 is not formed at the predetermined contact position 46. In this case, it is confirmed that, for example, the cutting fluid is adhered to the cutting blade 36 or the holding surface 10a and the energization of the two caused by the penetration of the cutting fluid is detected, and it is confirmed that the two are not actually in contact. Therefore, it can be confirmed that the registered temporary reference position is not a position that should be registered as a reference position.

Then, the temporary reference position registration step and the contact mark determination step are performed again in order to appropriately derive the reference position of the cutting unit 14. At this time, it is not necessary to directly perform the two steps at the predetermined contact point 46 of the holding surface 10a, and a different position from the predetermined contact point 46 may be reset to perform the two steps.

In addition, before the temporary reference position registration step is performed again, a gas blowing step may be performed to blow the holding surface 10a to remove the cutting liquid attached to the holding surface 10a. FIG. 4 is a cross-sectional view schematically showing a gas blowing step. For example, the cutting unit 14 may include a blowing gas unit 52 that blows a gas 52 a such as high-pressure dry air onto the holding surface 10 a. In the gas blowing step, a gas 52a is supplied to the holding surface 10a by the gas blowing unit 52 to remove the cutting liquid 50a.

After that, if the temporary reference position registration step is performed again, the cutting blade 36 comes into contact with the chuck table 10 to detect the energization, and at the same time, a contact mark is formed on the holding surface 10a. Then, it is determined in the contact mark determination step that the contact mark is present, and the temporary reference position registered in the temporary reference position registration step that is performed again is used as the reference position.

In addition, even when it is determined that there is no contact mark in the contact mark determination step, the gas blowing step may not be performed. For example, in the temporary reference position registration step, when the rotating cutting blade 36 is in contact with the cutting fluid attached to the holding surface 10a, the cutting fluid may be ejected due to the rotation of the cutting blade 36 when the current is detected. In this case, if the temporary reference position registration step is directly performed again, the reference position can be appropriately derived.

As described above, according to the setting method of the cutting device according to the present embodiment, the reference position of the cutting unit 14 can be appropriately derived. In addition, it can be confirmed that the derived reference position is an appropriate position.

In the above-mentioned embodiment, the presence or absence of the contact mark 48 is determined by the imaging of the holding surface 10a by the camera 34 in the contact mark determination step, but one aspect of the present invention is not limited to this. In one aspect of the present invention, it may be determined by other methods whether to register the temporary reference position as the reference position.

For example, the holding surface 10a can be imaged by the camera 34 to determine the presence or absence of a cutting fluid or the like. In this case, for example, if it is determined that a cutting fluid or the like is attached to the predetermined contact position 46 of the cutting blade 36, the cutting fluid is performed by removing the cutting fluid, and the temporary reference position registration process is performed again.

In addition, the structure, method, etc. concerning the said embodiment can be changed suitably, and it can implement it, without deviating from the objective of this invention.

1‧‧‧Workpiece

3‧‧‧frame

5‧‧‧ Adhesive film

2‧‧‧ cutting device

4‧‧‧ device abutment

6‧‧‧X-axis mobile stage

8‧‧‧Dustproof and drip-proof cover

10‧‧‧ chuck table

10a‧‧‧ keep face

10b‧‧‧Jig

10c‧‧‧Frame

12‧‧‧ Cassette Loading Platform

12a‧‧‧Cassette

14‧‧‧ cutting unit

16‧‧‧ support

18a‧‧‧ indexing feed unit

18b‧‧‧cut into the feed unit

20, 26‧‧‧ rail

22, 28‧‧‧ mobile board

24, 30‧‧‧ Ball Screw

32‧‧‧Pulse motor

34‧‧‧Camera

36‧‧‧ cutting blade

38‧‧‧cleaning unit

38a‧‧‧washing table

38b‧‧‧clean nozzle

40‧‧‧ Spindle

42‧‧‧Rotary drive source

44‧‧‧setting unit

46‧‧‧ Contact Reservation

48‧‧‧contact marks

50‧‧‧ cutting fluid supply nozzle

50a‧‧‧ cutting fluid

52‧‧‧Blow gas unit

52a‧‧‧gas

FIG. 1 is a perspective view schematically showing a cutting device and a workpiece.

FIG. 2 (A) is a cross-sectional view schematically showing a temporary reference position registration step, and FIG. 2 (B) is a cross-sectional view schematically showing a contact mark determination step.

3 is a plan view schematically showing a cut mark formed on a holding surface of a chuck table.

FIG. 4 is a cross-sectional view schematically showing a gas blowing step.

Claims (2)

A setting method of a cutting device, the cutting device includes: The chuck table has a holding surface to hold the workpiece on the holding surface; A cutting unit that cuts a workpiece held on the chuck table with a cutting blade, and simultaneously supplies cutting liquid to the workpiece and the cutting blade; A cutting-in feeding unit, so that the cutting unit moves in a cutting-in feeding direction perpendicular to the holding surface; A camera that captures the workpiece held on the chuck table; and The setting unit can detect the energization between the chuck table and the cutting blade, and when the cutting unit is moved by the cut-in feed unit and the power is detected, it can detect the cutting unit at the cut-in feed Position in the direction, The setting method of the cutting device is that in the cutting device, the position of the cutting unit when the cutting blade contacts the chuck table is derived as a reference position, where: The setting method of the cutting device includes: The temporary reference position registration step moves the cutting unit in the cutting feed direction toward the holding surface, and the cutting unit is in the cutting feed direction when power is detected between the cutting blade and the chuck table. Registered as a temporary reference position; and In the contact mark determination step, after performing the temporary reference position registration step, the holding surface is photographed with the camera, and it is determined whether there is a contact mark formed on the holding surface due to the contact between the cutting blade and the chuck table, When it is determined that the contact mark is present in the contact mark determination step, a reference position setting step is performed, and the temporary reference position is set as the reference position. When it is determined that there is no contact mark in the contact mark determination step, the temporary reference position registration step and the contact mark determination step are performed again. The setting method of the cutting device according to item 1 of the scope of patent application, wherein: In the case where it is determined that the contact mark is absent in the contact mark determination step, before the temporary reference position registration step is performed again, a gas blowing step is performed, and the holding surface is blown to blow the cutting adhered to the holding surface. Liquid removal.