TWI768111B - 負型感光性樹脂組成物、半導體裝置及電子機器 - Google Patents

負型感光性樹脂組成物、半導體裝置及電子機器 Download PDF

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Publication number
TWI768111B
TWI768111B TW107129976A TW107129976A TWI768111B TW I768111 B TWI768111 B TW I768111B TW 107129976 A TW107129976 A TW 107129976A TW 107129976 A TW107129976 A TW 107129976A TW I768111 B TWI768111 B TW I768111B
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TW
Taiwan
Prior art keywords
photosensitive resin
resin composition
layer
semiconductor device
film
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TW107129976A
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English (en)
Chinese (zh)
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TW201917489A (zh
Inventor
鈴木咲子
山川雄大
高橋泰典
Original Assignee
日商住友電木股份有限公司
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Publication of TW201917489A publication Critical patent/TW201917489A/zh
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Publication of TWI768111B publication Critical patent/TWI768111B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Formation Of Insulating Films (AREA)
TW107129976A 2017-08-28 2018-08-28 負型感光性樹脂組成物、半導體裝置及電子機器 TWI768111B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017163704 2017-08-28
JPJP2017-163704 2017-08-28

Publications (2)

Publication Number Publication Date
TW201917489A TW201917489A (zh) 2019-05-01
TWI768111B true TWI768111B (zh) 2022-06-21

Family

ID=65527669

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107129976A TWI768111B (zh) 2017-08-28 2018-08-28 負型感光性樹脂組成物、半導體裝置及電子機器

Country Status (5)

Country Link
JP (2) JP6631752B2 (ko)
KR (2) KR20200087876A (ko)
CN (1) CN111033379A (ko)
TW (1) TWI768111B (ko)
WO (1) WO2019044817A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023286748A1 (ja) * 2021-07-16 2023-01-19 富士フイルム株式会社 電子デバイス及び電子デバイスの製造方法
JPWO2023286747A1 (ko) * 2021-07-16 2023-01-19

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW538092B (en) * 2001-05-24 2003-06-21 Ind Tech Res Inst Photo/thermo-curable resin composition
US20060038304A1 (en) * 2004-08-18 2006-02-23 Harima Chemicals, Inc. Conductive adhesive agent and process for manufacturing article using the conductive adhesive agent
TW200801817A (en) * 2006-03-17 2008-01-01 San Ei Kagaku Kabushiki Kaisha Photosensitive thermosetting resin composition, flattened and resist film coated printed wiring board and method of preparing the same
TW201141952A (en) * 2010-03-08 2011-12-01 Lintec Corp Curable composition, hardened material, and method for using curable composition
TW201629147A (zh) * 2015-02-03 2016-08-16 Hitachi Chemical Co Ltd 環氧樹脂組成物、薄膜狀環氧樹脂組成物、硬化物及電子裝置
WO2017110947A1 (ja) * 2015-12-22 2017-06-29 リンテック株式会社 硬化性組成物、硬化性組成物の製造方法、硬化物、及び硬化性組成物の使用方法

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JP2003209104A (ja) 2002-01-15 2003-07-25 Hitachi Chemical Dupont Microsystems Ltd 半導体装置及びその材料
CN1849560B (zh) * 2004-03-26 2011-12-07 东京応化工业株式会社 感光性树脂组合物及使用该组合物的图案形成方法
CN101416111B (zh) * 2006-03-28 2012-07-04 富士胶片株式会社 感光性组合物及感光性薄膜、以及图案的形成方法及印制电路板
JP5465453B2 (ja) * 2009-03-26 2014-04-09 パナソニック株式会社 光導波路形成用エポキシ樹脂組成物、光導波路形成用硬化性フィルム、光伝送用フレキシブルプリント配線板、及び電子情報機器
JP5364460B2 (ja) * 2009-06-16 2013-12-11 株式会社デンソー 光硬化性エポキシ接着剤
JPWO2011086981A1 (ja) * 2010-01-12 2013-05-20 旭硝子株式会社 ネガ型感光性樹脂組成物ならびにこれを用いた硬化膜および基板の製造方法
CN102162996B (zh) * 2010-02-16 2013-07-17 旭化成电子材料株式会社 负型感光性树脂组合物、固化浮雕图案的制造方法
JP5583467B2 (ja) * 2010-04-30 2014-09-03 パナソニック株式会社 金属張積層板、光電複合配線板、金属張積層板の製造方法、及び光電複合配線板の製造方法
TWI459051B (zh) * 2012-03-01 2014-11-01 Chi Mei Corp 感光性樹脂組成物、黑色矩陣、彩色濾光片及其液晶顯示元件
KR101719045B1 (ko) * 2012-05-07 2017-03-22 아사히 가세이 이-매터리얼즈 가부시키가이샤 네거티브형 감광성 수지 조성물, 경화 릴리프 패턴의 제조 방법, 및 반도체 장치
JP6237030B2 (ja) * 2013-09-18 2017-11-29 三菱ケミカル株式会社 硬化性樹脂組成物、硬化物及び積層体
KR102053369B1 (ko) * 2014-06-20 2019-12-06 오사카 유키가가쿠고교 가부시키가이샤 감광성 조성물 및 그 경화막
CN104241210A (zh) * 2014-09-29 2014-12-24 华进半导体封装先导技术研发中心有限公司 一种低成本超薄扇出型封装结构及其制作方法
JP6418248B2 (ja) * 2015-09-30 2018-11-07 東レ株式会社 ネガ型感光性樹脂組成物、硬化膜、硬化膜を具備する素子及び表示装置、並びにその製造方法
JP6707854B2 (ja) * 2015-12-18 2020-06-10 住友ベークライト株式会社 ポジ型感光性樹脂組成物、硬化膜、保護膜、絶縁膜および電子装置
JP2018164072A (ja) * 2017-03-27 2018-10-18 住友ベークライト株式会社 電子デバイスの製造方法、および、感光性接着剤樹脂組成物

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW538092B (en) * 2001-05-24 2003-06-21 Ind Tech Res Inst Photo/thermo-curable resin composition
US20060038304A1 (en) * 2004-08-18 2006-02-23 Harima Chemicals, Inc. Conductive adhesive agent and process for manufacturing article using the conductive adhesive agent
TW200801817A (en) * 2006-03-17 2008-01-01 San Ei Kagaku Kabushiki Kaisha Photosensitive thermosetting resin composition, flattened and resist film coated printed wiring board and method of preparing the same
TW201141952A (en) * 2010-03-08 2011-12-01 Lintec Corp Curable composition, hardened material, and method for using curable composition
TW201629147A (zh) * 2015-02-03 2016-08-16 Hitachi Chemical Co Ltd 環氧樹脂組成物、薄膜狀環氧樹脂組成物、硬化物及電子裝置
WO2017110947A1 (ja) * 2015-12-22 2017-06-29 リンテック株式会社 硬化性組成物、硬化性組成物の製造方法、硬化物、及び硬化性組成物の使用方法

Also Published As

Publication number Publication date
JP6870724B2 (ja) 2021-05-12
KR102135599B1 (ko) 2020-07-20
JPWO2019044817A1 (ja) 2019-11-07
JP2020060773A (ja) 2020-04-16
CN111033379A (zh) 2020-04-17
KR20200087876A (ko) 2020-07-21
TW201917489A (zh) 2019-05-01
KR20200027032A (ko) 2020-03-11
WO2019044817A1 (ja) 2019-03-07
JP6631752B2 (ja) 2020-01-15

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