TW201141952A - Curable composition, hardened material, and method for using curable composition - Google Patents

Curable composition, hardened material, and method for using curable composition Download PDF

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TW201141952A
TW201141952A TW100107284A TW100107284A TW201141952A TW 201141952 A TW201141952 A TW 201141952A TW 100107284 A TW100107284 A TW 100107284A TW 100107284 A TW100107284 A TW 100107284A TW 201141952 A TW201141952 A TW 201141952A
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group
compound
decane
curable composition
composition
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TW100107284A
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TWI504681B (en
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Mikihiro Kashio
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Lintec Corp
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/22Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/22Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/06Triglycidylisocyanurates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04Polysiloxanes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • H01L23/296Organo-silicon compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701Low temperature co-fired ceramic [LTCC]

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)

Abstract

Disclosed is a curable composition that includes (A) a silane compound copolymer having specific repeating units, (B) an epoxy compound having an isocyanurate skeleton, (C) a curing agent that includes an alicyclic acid anhydride having a carboxyl group, and (D) a silane coupling agent having an acid anhydride structure. Also disclosed are a hardened material formed by hardening the composition and a method for using the aforementioned composition as an adhesive for an optical element fixing material and as a sealing material for an optical element fixing material. With the curable composition, a hardened material can be obtained that does not lose transparency with coloring and has excellent transparency over an extended period of time even when irradiated with high-energy light or when in a high temperature state, and that has high adhesive strength even at high temperatures. The curable composition can be used when forming an optical element fixing material, and in particular can be optimally used as an adhesive for an optical element fixing material and as a sealing material for an optical element fixing material.

Description

201141952 四、指定代表圖: (一) 本案指定代表圖為:無。 (二) 本代表圖之元件符號簡單說明:無。 徵的化學式: 五、本案若有化學式時,請揭示最能顯示發明特 無0 六、發明說明: 【發明所屬之技術領域】 本發明係關於可得透明性及耐熱性優声 Ά ^ > 又且具有高的 接者力之硬化物之硬化性組合物,硬化該組合物而成石 化物,以及使用上述組合物作為光元件 口疋材用接著劑或 光元件固定用封裝材之方法。 【先前技術】 先前’硬化性組合物’依照用途做了各式各樣的改良 而在產業上廣泛地利用於作為光學零件或原形體之原料 _、塗層劑等。例如’形成透明性優良的硬化物之; 性組合物,作為光學零件的原料,或其塗層劑,此外 形成具有高接著力的硬化物之硬化性組合物,可良好㈣ 於作為接著劑或塗層劑。 _此外’近年來’硬化性組合物,錢制作為製造另 ί裝料,作為光兀件固定材用接著劑或光元件固笼 用封裝劑等的光元件固定材用組合物。 201141952 體二:半導體雷射⑽等的各種雷射或發光二極 == 的發光元件、感光元件、複合光元件、光積體電 二年,發光波蜂更短波長的藍光或白光的光元件被 二地被使用。隨著如此之發光波峰波長短的發光 :件的㈠度化的飛躍的進步1元件的發熱量有 大的傾向。 』,在於近年隨著光元件的高亮度化,光元件固定 _ :組合物的硬化物時間暴露於更高能量的光或由光 產生的高溫的熱’而惡化產生龜裂、剝離等問題。 為解決此問題,在於專利文獻卜3,提案有以聚倍半 矽氧烷化合物為主成分之光元件固定材用組合物。 但疋,即使是以專利文獻卜3所記載之聚倍半石夕氧燒 化合物為主成分之光元件固定材用組合物之硬化物亦有 難以保持充分的接著力,而得到耐熱性及透明性之情形。 此外,作為用於光元件封裝用之組合物,於專利讀 4,提案有使用脂環環氧樹脂之環氧樹脂組合物,於專利文 獻5,提案含有聚疏醇化合物之環氧樹脂组合物。 但疋,即使疋使用該等組合物之情形,隨著經時變化 無法毅充分的耐光惡化性,或有接著力降低之情形。 [先行技術文獻] [專利文獻] [專利文獻1 ]日本特開2004-359933號公報 [專利文獻2]日本特開2〇〇5_263869號公報 [專利文獻3]日本特開2006-328231號公報 201141952 [專利文獻4]日本特開平7-3〇9927號公報 [專利文獻5]日本特開2009-0 01 752號公報 【發明内容】 [發明所欲解決的課題] 本發明係有鑑於所關先前技術之情形而完成者,其課 題係在於提供’可得耐熱性及透明性優良,且具有高的接 更化物之硬化性組合物,硬化該組合物而成之硬化 物’以及使用該組合物作為光元件固定材用接著劑或光元 件固定用封裝材之方法。 [用以解決課題的手段] 本發明者們為解決上述課題反覆銳意研究的結果,發 現包含(A)具有特定的矽烷化合物共聚物、(B)具有異氰脲 酸S旨基骨架的環氧化合物、及(c)包含具有羧基之脂環酸酐 之組合物之硬化物,以及含有(D)具有酸酐構造之矽烷偶合 劑之組合物之硬化物,可成為可長期保持優良的透明性、 耐熱性,且即使在於高溫亦可具有高的接著力之硬化物, 達至完成本發明。 因此根據本發明之第1 ’可提供下述[丨]~ [ 9 ]之硬化性 組合物。 [1 ]—種硬化性組合物,其係包含: (A)砂烧化合物共聚物’其係於分子内,具有下 ,. e r 式(1 )、 (H)及(iii)所示之反覆單位之中的(i)及 ... (1)及 G11)' (ii)及(iii)或(i)、(ii)及(iii)之反覆單位,重201141952 IV. Designated representative map: (1) The representative representative of the case is: None. (2) A brief description of the symbol of the representative figure: None. The chemical formula of the levy: 5. If there is a chemical formula in this case, please reveal the best indication of the invention. VI. Description of the invention: [Technical field of the invention] The present invention relates to transparency and heat resistance which can be obtained. Further, a curable composition having a cured product having a high contact force, a composition obtained by curing the composition into a petrochemical material, and a method of using the above composition as an adhesive for an optical element or a mouth material or a package for fixing an optical element. [Prior Art] The conventional 'curable composition' has been variously modified according to the use, and is widely used in the industry as a raw material for an optical component or a prototype, a coating agent, and the like. For example, 'the formation of a cured product excellent in transparency; a composition as a raw material of an optical component, or a coating agent thereof, and a curable composition which forms a cured product having a high adhesion, which is good (d) as an adhesive or Coating agent. In addition, the 'curable composition of the present invention' is a composition for an optical element fixing material such as an adhesive for an optical element fixing material or an encapsulating agent for an optical element cage. 201141952 Body 2: semiconductor laser (10) and other laser or light-emitting diodes == light-emitting elements, photosensitive elements, composite optical elements, optical products for two years, illuminating bees, shorter-wavelength blue or white light components It is used in two places. With the illuminance of the illuminating peaks of the illuminating peaks, there is a large tendency for the heat generation of the element to be improved. In recent years, with the increase in the brightness of the optical element, the optical element is fixed _: the cured product of the composition is exposed to higher-energy light or high-temperature heat generated by light, which causes problems such as cracking and peeling. In order to solve this problem, Patent Document 3 proposes a composition for an optical element fixing material containing a polysilsesquioxane compound as a main component. However, even if it is a cured product of the composition for an optical element fixing material which is a component of the poly-half-stone-oxygen-burning compound which is described in the patent document 3, it is difficult to maintain a sufficient adhesive force, and it is heat-resistant and transparent. Sexual situation. Further, as a composition for optical element encapsulation, an epoxy resin composition using an alicyclic epoxy resin is proposed in Patent Reading 4, and an epoxy resin composition containing a polyhydric alcohol compound is proposed in Patent Document 5. . However, even in the case where the composition is used, it is not possible to sufficiently deteriorate the light resistance deterioration with time, or there is a case where the adhesion is lowered. [Patent Document 1] [Patent Document 1] JP-A-2004-359933 (Patent Document 2) JP-A-2005-328869 (Patent Document 3) JP-A-2006-328231A No. 201141952 [Patent Document 4] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. In the case of the technology, the problem is to provide a cured product which is excellent in heat resistance and transparency, has a high adhesion, and hardens the composition, and uses the composition. A method of using an adhesive for an optical element fixing material or a packaging material for fixing an optical element. [Means for Solving the Problem] As a result of intensive research to solve the above problems, the inventors of the present invention have found that (A) a specific decane compound copolymer and (B) an epoxy group having an isocyanuric acid S-based skeleton are included. The cured product of the compound and (c) a composition comprising a alicyclic anhydride having a carboxyl group, and a cured product containing a composition of (D) a decane coupling agent having an acid anhydride structure, which can maintain excellent transparency and heat resistance for a long period of time. The present invention can be completed by the fact that it is a cured product having a high adhesion even at a high temperature. Therefore, according to the first aspect of the present invention, the following curable composition of [丨] to [9] can be provided. [1] A curable composition comprising: (A) a calcined compound copolymer which is attached to a molecule, having a lower, er formula (1), (H) and (iii) (i) and (1) and G11)' (ii) and (iii) or (i), (ii) and (iii)

S 4 201141952 篁平均分子量為1,〇〇〇〜3〇,〇〇〇 ; (B) %氧化合物,其具有異氰脲酸酯基骨架; (C) 硬化劑,其包含具有羧基之脂環酸酐及其他的脂環 酸針;及 (D)砂燒偶合劑,其具有酸酐構造:S 4 201141952 篁 average molecular weight is 1, 〇〇〇~3〇, 〇〇〇; (B) % oxygen compound having an isocyanurate-based skeleton; (C) hardener comprising an alicyclic ring having a carboxyl group Anhydride and other alicyclic acid needles; and (D) a sand-burning coupling agent having an anhydride structure:

W ⑼ (Hi) 式中’ R係表示虱原子或碳數1〜6之览基,係表示 鹵素原子、氰基或以式:0G表示之基,式中,G係表示羥 基之保護基,D係表示單鍵結或連接基,R2係表示碳數卜2〇 之烧基或可具有取代基之苯基。 [2 ]如[1 ]所述的硬化性組合物’其中上述(a )之石夕烧化 5物共1物,係以式.f-CHCXy-D -表示之基之存在量 ([RLCHCXO-D])與R2之存在量([R2])之莫耳比為, [f-CiUXO-D] : [R2] = 60 : 40〜5 : 95之矽烷化合物共聚物。 [3 ]如[1 ]或[2 ]所述的硬化性組合物,其中上述(A)、 (B)、( C)、及(D)成分的含有比例,以(A)與[(β) + (c) + (D)] 之質量比,以(A) : [(BH(C) + (D)] = 90 : 1〇〜5〇 : 5〇。 201141952 [4 ]—種硬化性組合物,其包含: (A’ )矽烷化合物共聚物,其係將包含以式(丨): R1-(:Η(Χβ)-ΐ)-υ(〇κ3)ρ(χ1)3_ρ所示之矽烷化合物(1)之至少 一種,及 式(2) : R2Si(〇R4)q(x2)3_q所示之矽烷化合物之至少 一種之石夕院化合物之混合物縮合而得,重量平均分子量為 1,000-30,〇〇〇 ; (B) 環氧化合物,其具有異氰脲酸酯基骨架的; (C) 硬化劑’其包含具有羧基之脂環酸酐及其他的脂環 酸酐;及 ' (D:U夕烷偶合劑,其具有酸酐構造之: 式中’ R1係表示氫原子或碳數卜6之烷基,χ〇係表厂、 函素原子、氰基或以式:GG表示之基,式中,G係表示: 基之保護D係表示單鍵結或連接基,r3係表示碳數卜6 之烧基’ X1係表示_素原子,p係Η之整數;r2係表示碳 數1〜20之烷基或可具有取代基之笨基,y係表示碳數^ 之烷基,X2係表示鹵素原子,q係表示之整數。 [5]如[4]所述的硬化性組合物,其中上述(a,)之矽烷 化合物共聚物,係將矽烷化合物(1)與矽烷化合物(2)以= 耳比,[石夕烷化合物(1)]:[矽烷化合物(2)] = 6〇: 4〇〜5: % 之比例縮合而得者。 [6 ]如[4 ]或[5 ]所述之硬化性組合物,其中上述 (A,)、⑻、(C)、及⑻成分的含有比例,以、(a,)與 UBH(c)+(D)]之 f 量比,以(A’): [(B) + (c) +⑻]=9〇’:、W (9) (Hi) where R represents a halogen atom or a carbon number of 1 to 6, and represents a halogen atom, a cyano group or a group represented by the formula: 0G, wherein G represents a protecting group of a hydroxyl group, D represents a single bond or a linker, and R2 represents a phenyl group of a carbon number or a phenyl group which may have a substituent. [2] The curable composition according to [1], wherein the above-mentioned (a) is a total of 1 in the form of a group represented by the formula: f-CHCXy-D- ([RLCHCXO- The molar ratio of D]) to R2 ([R2]) is [f-CiUXO-D]: [R2] = 60: 40~5: 95 decane compound copolymer. [3] The curable composition according to [1] or [2] wherein the ratio of the components (A), (B), (C), and (D) is (A) and [(β) ) + (c) + (D)] mass ratio to (A) : [(BH(C) + (D)] = 90 : 1〇~5〇: 5〇. 201141952 [4 ] - Hardenability a composition comprising: (A') a decane compound copolymer, which is comprised of the formula (丨): R1-(:Η(Χβ)-ΐ)-υ(〇κ3)ρ(χ1)3_ρ And a mixture of at least one of the decane compound (1) and a mixture of the compound of the formula (2): at least one of the decane compounds represented by R2Si(〇R4)q(x2)3_q, having a weight average molecular weight of 1,000- 30, 〇〇〇; (B) an epoxy compound having an isocyanurate-based skeleton; (C) a hardener comprising an alicyclic anhydride having a carboxyl group and other alicyclic anhydrides; and ' (D: a U-alkane coupling agent having an anhydride structure: wherein R 1 represents a hydrogen atom or an alkyl group of a carbon number, an anthracene, a cyano group or a group represented by the formula: GG. In the formula, G is represented by: The protection of the base D represents a single bond or a linker, and the r3 system represents The alkyl group of the carbon number B is represented by an atomic number of the p-type atom, and the p2 is an alkyl group having a carbon number of 1 to 20 or a stupid group which may have a substituent, and the y is an alkyl group having a carbon number of [5] The hardening composition according to [4], wherein the (a,) decane compound copolymer is a decane compound (1) and a decane compound. (2) with = ear ratio, [Astraestane compound (1)]: [decane compound (2)] = 6〇: 4〇~5: % of the ratio of condensation. [6] as [4] or [5] The curable composition according to the above, wherein the content ratio of the components (A,), (8), (C), and (8) is the amount of (a,) and UBH(c)+(D)] Ratio to (A'): [(B) + (c) +(8)]=9〇':,

S 6 201141952 10~50 : 50 。 [7 ]如[1 ]或[4 ]所述的硬化性組合物,其中上述(b )、 (C)、及(D)成为的含有比例’以[(b) + (C)]與(D)之質量比, 以[(B) + (C)] : (D) = 90 : 10〜10 : 90。 [8 ]如[1 ]或[4 ]所述的硬化性組合物,其中上述([)之 硬化物’係選自由具有羧基之脂環酸酐及其他的脂環酸酐 之一種或兩種以上所組成,其質量比為(具有羧基之脂環酸 酐):(其他的脂環酸酐)= 100: 〇〜10: 90。 [9 ]如[1 ]或[4 ]所述的硬化性組合物,其係光元件固定 材用組合物。 根據本發明之第2’可提供下述[10]、[u]之硬化物。 [10] —種硬化物,其係硬化[Π或[4]所述的硬化性組 合物而成。 [11] 如[10]所述的硬化物,其係光元件固定材。 根據本發明之第3,可提供下述[12]、[13]之使用本 發明之硬化性組合物之方法。 [12 ] —種方法,其係使用[i ]或[4 ]所述的硬化性組合 物’作為光元件固定材用接著劑。 [1 3 ]種方法,其係使用[1 ]或[4 ]所述的硬化性組合 物’作為光元件固定材用封裝劑。 [發明效果] 根據本發明之硬化性組合物,可得即使被照射高能量 的光之If形或南溫狀態,並不會著色而降低透明性,可長 月-有優良的透明#,且在於高溫亦可具有高的接著力之 201141952 硬化物。 本發明之硬化性組合物,σ 時,特別是可良好地使 可使用於形成光元件固定材 用於作氧止— 光元件固定材㈣裝#1。件固定用接著劑,及 【實施方式 以下’將本發明分項為D硬化性組合物、2)硬化物、 及3)硬化性组合物之使用方法詳細說明。 1)硬化性組合物 本發明之硬化性組合物,其特徵在於:包含: (A:u夕烧化合物共聚物,其係於分子内,具有下式、 (ii) 及(iii)所示之反覆單位之中的(^及^土)、(〇及 (iii) 、(ii)及(iii)或(i)、(ii)及(iii)之反覆單位,重 量平均分子量為1,〇〇〇~30,000 ; (B)環氧化合物,其具有 異氰脲酸酯基骨架;及(C)硬化劑’其包含具有羧基之脂環 酸酐,及(D)矽烷偶合劑’其具有酸酐構造:S 6 201141952 10~50 : 50 . [7] The curable composition according to [1] or [4], wherein the above-mentioned (b), (C), and (D) have a content ratio of [(b) + (C)] and ( D) mass ratio, to [(B) + (C)]: (D) = 90: 10~10: 90. [8] The curable composition according to [1], wherein the hardened material of the above ([) is selected from one or more selected from the group consisting of an alicyclic acid anhydride having a carboxyl group and another alicyclic acid anhydride. The composition has a mass ratio of (alicyclic anhydride having a carboxyl group): (other alicyclic anhydride) = 100: 〇~10: 90. [9] The curable composition according to [1] or [4], which is a composition for a light element fixing material. According to the second aspect of the present invention, the cured products of the following [10] and [u] can be provided. [10] A cured product obtained by hardening [a hardening composition according to [4] or [4]. [11] The cured product according to [10], which is a light element fixing material. According to a third aspect of the present invention, there is provided a method of using the curable composition of the present invention in [12] or [13] below. [12] A method of using the curable composition described in [i] or [4] as an adhesive for an optical element fixing material. [1 3] The curable composition according to [1] or [4] is used as an encapsulant for an optical element fixing material. [Effect of the Invention] According to the curable composition of the present invention, even if it is irradiated with a high-energy light in an If-shaped or a south-temperature state, it is not colored and the transparency is lowered, and the long-lasting-excellent transparency can be obtained. It is a 201141952 hardened material which has a high adhesion force at a high temperature. The curable composition of the present invention, in particular, can be suitably used for forming an optical element fixing material for use as an oxygen-stopping member (four) mounting #1. The adhesive for fixing a part, and the following describes the method of using the D curable composition, 2) the cured product, and 3) the curable composition. 1) Curable composition The curable composition of the present invention comprises: (A: a sulfonated compound copolymer which is in a molecule and has the following formula, (ii) and (iii) The repetitive unit of (^ and ^ soil), (〇 and (iii), (ii) and (iii) or (i), (ii) and (iii), the weight average molecular weight is 1, 〇〇 〇~30,000; (B) an epoxy compound having an isocyanurate-based skeleton; and (C) a hardener comprising an alicyclic acid anhydride having a carboxyl group, and (D) a decane coupling agent having an anhydride structure:

CC

//

DD

(iii)(iii)

-Si—0-O i -Si一Ο-Si—0-O i -Si

D CH——X° R1 0) (ϋ) s 201141952 式中’ R係表示氫原子或碳數卜6之烷基,χ°係表示 鹵素原子、氰基或以式:〇G表示之基,式中,g係表示羥 基之保濩基’ D係表示單鍵結或連接基,R2係表示碳數卜20 之烧基或可具有取代基之苯基。 (A)矽烷化合物共聚物 本發明之硬化性組合物,作為(A)成分,含有:以上述 式(〇、(ii)及(iii)所示之反覆單位之中,具有(i)及 (ii)、(i)及(iii)、(ii)及(iii)或(i)、(ii)及(iii)之反 覆單位,重量平均分子量為L 〇〇〇〜3〇, 〇〇〇之矽烷化合物共 聚物(以下’有稱為「矽烷化合物共聚物(A)」之情形)。 石夕燒化合物共聚物(A) ’可分別具有(i)、(丨丨)、(丨丨土) 所示之反覆單位之一種,或兩種以上。 式(i Mi i i)中’ R1係表示氫原子或碳數卜6之淀基, 以氫原子為佳。 以R1表示之碳數1〜6之烷基,可舉曱基、乙基、正丙 基、異丙基、正丁基、第三丁基、異丁基、第二丁基、正 戊基、正己基等。 X °係表示敗原子、氣原子、溴原子、峨元子等的齒素 原子;氰基或以式:0G表示之基。 G係表示羥基之保護基。羥基之保護基,並無特別限 制’可舉已知作為羥基之保護基之習知之保護基。可舉0 如’醯基系保護基;三曱基矽烷基、三乙基矽烷基、第_ 丁基二甲基矽烷基、第三丁基二苯基矽烷基等的石夕、境基& :.保護基;三曱氧基甲基 '甲氧基以氧基曱基、1 -以氣基乙 201141952 基、四氫吡喃-2-基、四氫呋喃_2_基等的縮醛系保護基; 第三丁氧基羧基等的烷氧羧基系保護基;甲基、乙基、第 三丁基、辛基'稀丙基、三笨基甲基、节基、對甲氧基节D CH——X° R1 0) (ϋ) s 201141952 where R is a hydrogen atom or an alkyl group having a carbon number of 6 and χ is a halogen atom, a cyano group or a group represented by the formula: 〇G. In the formula, g is a sulfhydryl group which represents a hydroxy group, and D represents a single bond or a linker, and R2 represents a phenyl group of a carbon number or a phenyl group which may have a substituent. (A) decane compound copolymer The curable composition of the present invention contains, as component (A), (i) and (i) among the reversing units represented by the above formulas (〇, (ii) and (iii) Ii), (i) and (iii), (ii) and (iii) or (i), (ii) and (iii) the repeating unit, the weight average molecular weight is L 〇〇〇~3〇, 〇〇〇之a decane compound copolymer (hereinafter referred to as "the decane compound copolymer (A)"). The sulphur compound copolymer (A) ' may have (i), (丨丨), (alumina), respectively. One of the repetitive units shown, or two or more. In the formula (i Mi ii), 'R1 is a hydrogen atom or a decyl group of carbon number 6, preferably a hydrogen atom. The carbon number is 1 to 6 represented by R1. The alkyl group may, for example, be an alkyl group, an ethyl group, a n-propyl group, an isopropyl group, an n-butyl group, a t-butyl group, an isobutyl group, a second butyl group, a n-pentyl group or a n-hexyl group. a dentate atom such as a atom, a gas atom, a bromine atom or a quinone; a cyano group or a group represented by the formula: 0 G. The G system represents a protecting group of a hydroxyl group. 'A conventional protecting group known as a protecting group for a hydroxyl group is exemplified. For example, 'anthraceyl protecting group; tridecyl decyl group, triethyl decyl group, _ butyl dimethyl decyl group, Tributyl diphenyl fluorenyl and the like, such as: lysine & :. protecting group; trimethoxymethyl group 'methoxy group oxy fluorenyl group, 1 - gas group B 201141952 group, tetrahydropyridyl An acetal protecting group such as a fluoren-2-yl group or a tetrahydrofuran-2-yl group; an alkoxycarboxy group protecting group such as a third butoxy carboxy group; a methyl group, an ethyl group, a tert-butyl group, and an octyl group Base, trisylmethyl, nodal, p-methoxy

基、芴基、三笨甲基、二笨甲基等的醚系保護基等。該等 之中,G以醯基系保護基為佳。 X 醯基系保護基,具體而言,係以式:_c( = 〇)RS表示 基。式中,R5係表示甲基、乙基、正丙基、異丙基、正丁 基、異丁基、第二丁基、第三丁基 '正戊基等的碳數卜6 之烷基;或可具有取代基之笨基。 以R5表示之可具有取代基之苯基之取代基可舉甲 基、乙基'正丙基、異丙基、正丁基、第二丁基異丁基、 第三丁基、正戊基、正己基、正庚基、正辛基、異辛基土等 的烷基;氟原子、氣原子、溴原子等的齒素原子;甲氧基、 乙氧基等的烷氧基。 該等之中以人手容易性,及可得具有高接著力之 硬化物,以選自由氣原子、以式:〇G,表示之基(式中,G, 係表示醯基系之保護基。)及氛基之基為佳,以選自由氣原 子、乙醯氧基及氰基之基更佳,以乙醯氧基特別佳。 D係表示單鍵結或連接基。 連接基,可舉可具有取代基之2價有機基。該有機基 之碳數以1〜2 0為佳,以1〜1 〇更佳。 可具有取代基之2價有機基,可舉例如,可具有取代 基之亞院基'可具有取代基之亞稀基'可具有取代基之亞 快基、可具有取代基之亞芳基、可具有取代基之(亞烧基、An ether-based protecting group such as a thiol group, a fluorenyl group, a tris-methyl group or a dimethylene group. Among these, G is preferably a thiol-based protecting group. The X 醯 group protecting group, specifically, is represented by the formula: _c( = 〇)RS. In the formula, R5 represents an alkyl group of a methyl group, an ethyl group, a n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a second butyl group, a t-butyl 'n-pentyl group or the like. Or may have a stupid base. The substituent of the phenyl group which may have a substituent represented by R5 may, for example, be a methyl group, an ethyl 'n-propyl group, an isopropyl group, an n-butyl group, a second butyl isobutyl group, a third butyl group or a n-pentyl group. An alkyl group such as n-hexyl, n-heptyl, n-octyl or isooctyl; a acene atom such as a fluorine atom, a gas atom or a bromine atom; or an alkoxy group such as a methoxy group or an ethoxy group. Among these, it is easy to handle by hand, and a cured product having high adhesion is obtained, and is selected from a group represented by a gas atom and having the formula: 〇G (wherein, G is a protecting group of a fluorenyl group). The base of the aryl group is preferably selected from the group consisting of a gas atom, an ethoxy group and a cyano group, and particularly preferably an ethoxy group. D represents a single bond or a linker. The linking group may be a divalent organic group which may have a substituent. The carbon number of the organic group is preferably from 1 to 2 0, more preferably from 1 to 1 Torr. a divalent organic group which may have a substituent, and, for example, a sub-base group which may have a substituent, a sub-base group which may have a substituent, a sub-fast group which may have a substituent, an arylene group which may have a substituent, Substitutable (sub-alkyl,

S 10 201141952 亞烯基、或亞炔基)及可具有取代基之亞芳基之組合所構成 之2價基等。 可具有取代基之亞烷基之亞烷基,可舉亞曱基、亞乙 基、亞丙基、三亞甲基、四亞甲基、五亞甲基、六亞甲義 等的碳數1〜20,最好是碳數1〜1〇之亞烷基。 可具有取代基之亞烯基之亞烯基,可舉亞乙稀基、亞 丙烯基、亞丁烯基、亞戊烯基等的碳數2〜2〇之亞烯基,以 碳數2〜1 0之亞烯基為佳。 可具有取代基之亞炔基之亞炔基,可舉亞乙炔基亞 炳炔基等的碳數2〜20之亞炔基,以碳數2〜1〇之亞炔基為 佳。 · 了具有取代基之亞芳基之亞芳基,可舉鄰亞苯基、間 亞苯基、對亞苯基、2, 6-亞萘基等的碳數6〜2〇之亞芳基, 以碳數6〜10之亞芳基為佳。 上述亞烷基、亞烯基、及亞炔基之取代基,可舉氟原 子、氯原子等的i素原子;甲氧基、6氧基等的院氧基; 甲硫基、乙硫基等的烷硫基;甲氧基羧基、乙氧基羧基等 的烷氧基羧基等。 上述亞芳基之取代基,可舉氰基、硝基、氟原子、氣 原子、溴原子等的鹵素原子;甲基、乙基等的烷基;甲氧 基、乙氧基等的烷氧基、曱硫基、乙硫基等的烷硫基等。 該等取代基,可於亞烧基、亞稀基、亞快基及亞芳基 之基與任意位置鍵結,可為相同或相異複數個鍵結。 可具有取代基之(亞烷基、亞烯基、或亞炔基)與可具 11 201141952 有取代基之亞芳基之組合所構成之2價基,可舉上述可具 有取代基之(亞烷基、亞烯基、或亞炔基)之至少一種,與 上述可具有取代基之亞芳基之至少一種串聯鍵結之基。具 體而言,可舉下式所示之基。A divalent group composed of a combination of S 10 201141952 alkenylene group or alkynylene group and an arylene group which may have a substituent. An alkylene group which may have a substituent alkylene group, and may have a carbon number of an anthranylene group, an ethylene group, a propylene group, a trimethylene group, a tetramethylene group, a pentamethylene group, a hexamethylene group or the like. 〜20, preferably an alkylene group having a carbon number of 1 to 1 Å. The alkenylene group which may have a substituent alkenylene group, and the alkenylene group having a carbon number of 2 to 2 Å, such as an ethyleneylene group, a propylene group, a butenylene group, a pentenylene group, or the like, may have a carbon number of 2 to 2 The alkenylene group of 10 is preferred. The alkynylene group having an alkynylene group having a substituent may, for example, be an alkynylene group having 2 to 20 carbon atoms such as an ethynylene acetylene group, and preferably an alkynylene group having 2 to 1 carbon atoms. The arylene group having a substituent arylene group may, for example, be an arylene group having a carbon number of 6 to 2 Å, such as an o-phenylene group, a m-phenylene group, a p-phenylene group or a 2,6-naphthylene group. It is preferred to use an arylene group having a carbon number of 6 to 10. Examples of the substituent of the above alkylene group, alkenylene group, and alkynylene group include an atomic atom such as a fluorine atom or a chlorine atom; an oxy group such as a methoxy group or a oxy group; and a methylthio group or an ethylthio group. An alkylthio group; an alkoxycarboxy group such as a methoxycarboxy group or an ethoxycarboxy group; and the like. Examples of the substituent of the above arylene group include a halogen atom such as a cyano group, a nitro group, a fluorine atom, a gas atom or a bromine atom; an alkyl group such as a methyl group or an ethyl group; and an alkoxy group such as a methoxy group or an ethoxy group. An alkylthio group such as a thiol group or an ethylthio group. The substituents may be bonded to any of the groups of the alkylene group, the sub-base group, the sub-fast group and the arylene group, and may be the same or different plural bonds. a divalent group which may be a combination of an (alkylene group, an alkenylene group or an alkynylene group) which may have a substituent and an arylene group which may have a substituent of 11 201141952, and may have a substituent which may have a substituent At least one of an alkyl group, an alkenylene group, or an alkynylene group, a group bonded in series with at least one of the above-mentioned arylene groups having a substituent. Specifically, a base represented by the following formula can be mentioned.

(?Η2)2(?Η2)2

田j忖丹肩尚接者力之硬化物, 以碳數1 ~ 1 0之亞貌某為# 坑丞马佳,以奴數丨〜6之亞烷基更佳,以 亞甲基或亞乙基特別佳。 弋(·)(iii)中,r係表示碳數卜2〇之院基或可具有 取代基之苯基。 以R2表示之碳數卜20之烷基,可舉甲基、乙基、正 丙基、異丙基、正丁其、笛_ J丞、第一丁基、異丁基、第三丁基、 正戊基、正己基、装、 止辛基、異辛基、正壬基、正癸基、正 十二烷基等。 以R表不之可具有取代基之苯基之取代基可舉曱 基、乙基、正丙基、里 異丙基'正丁基、第二丁基、異丁基、 第二丁基、正戊基、^ 土已丞、正庚基、正辛基、異辛基等 的烧基;甲氧基、乙訇其笪 G氧基4的烷氧基;氟原子、氣原子等 的_素原子等。Tian j忖 Dan shoulder still receives the hardened material of the force, with the carbon number of 1 ~ 1 0 of the sub-form of #坑丞马佳, the slave number 丨 ~ 6 alkylene is better, to methylene or Asian Ethyl is especially preferred. In 弋(·)(iii), r is a phenyl group of a carbon number or a phenyl group which may have a substituent. The alkyl group of carbon number represented by R2 may, for example, be methyl, ethyl, n-propyl, isopropyl, n-butyl, flute _ J 丞, first butyl, isobutyl, tert-butyl , n-pentyl, n-hexyl, phenyl, octyl, isooctyl, n-decyl, n-decyl, n-dodecyl and the like. The substituent of the phenyl group which may have a substituent in the form of R may, for example, be an alkyl group, an ethyl group, a n-propyl group, a isopropyl isopropyl group, a second butyl group, an isobutyl group, a second butyl group, or the like. An alkoxy group such as a n-pentyl group, a ruthenium group, a n-heptyl group, an n-octyl group or an isooctyl group; an alkoxy group of a methoxy group; an ethoxy group of an ethoxy group; a fluorine atom; a gas atom; Prime atoms and so on.

S 12 201141952 以R2表示之可具有取代基之笨基之具體例,可舉苯 基、2 -氯笨基、4 -甲基苯基、3 -乙基苯基、2, 4-二曱基笨 基、2-曱氧基苯基等。 在於矽烷化合物共聚物(A) ’以式:r1 —CH(X°)-D-表示 之基之存在量([F-CIKXy-D])與R2之存在量([R2])之莫耳 比,[R’-CiKX11)-!)] : [R2] = 60: 40〜5: 95 為佳,以 50: 50~5 : 9 5更佳’以5 0 : 5 0〜1 0 : 9 0特別佳。藉由在該範圍内,可 得透明性及接著性優良,且耐熱性優良之硬化物。 以式.R-CH(X°)-D -表示之基及R2之存在量,例如可 藉由測量矽烷化合物共聚物(A)之nmr光譜定量。 石夕院化合物共聚物(A)可為無規共聚物、嵌段共聚物、 接枝共聚物、交互共聚物等的任一的共聚物,惟以無規共 聚物特別佳。 石夕烧化合物共聚物(A)之重量平均分子量(Mw)為 1,000〜30,000之範圍,以丨’500〜6 〇〇〇之範圍。藉由在於 該範圍,可得組合物的操作性優良,且接著性 '耐熱性優 良的硬化物。重量平均分子量(M w ),可例如以四氫呋喃(T H F ) 作為溶劑之凝膠滲透層析(GPC)之標準聚苯乙烯換算值求 得。 矽烷化合物共聚物(A)之分子量分布(Mw/Mn),並無特 別限制’通常以U〜3.〇,以i•卜2〇之範圍為佳。藉由 在於該範圍内,可得接著性、耐熱性優良的硬化物。 矽烷化合物共聚物(A)可以一種單獨,或組合兩種以上 使用。 13 201141952 有梯型構造之聚倍半梦氧 碎烷化合物共聚物(A),係具 化合物。S 12 201141952 Specific examples of the stupid group which may have a substituent represented by R2 may, for example, be a phenyl group, a 2-chlorophenyl group, a 4-methylphenyl group, a 3-ethylphenyl group or a 2,4-difluorenyl group. Stupid base, 2-decyloxyphenyl and the like. The molar amount of the decane compound copolymer (A)' represented by the formula: r1 - CH(X°)-D- ([F-CIKXy-D]) and the amount of R2 ([R2]) Than, [R'-CiKX11)-!)] : [R2] = 60: 40~5: 95 is better, with 50: 50~5: 9 5 better 'to 5 0 : 5 0~1 0 : 9 0 is especially good. Within this range, a cured product excellent in transparency and adhesion and excellent in heat resistance can be obtained. The amount represented by the formula: R-CH(X°)-D - and the amount of R2 can be quantified, for example, by measuring the nmr spectrum of the decane compound copolymer (A). The Shi Xiyuan compound copolymer (A) may be any copolymer of a random copolymer, a block copolymer, a graft copolymer, an interactive copolymer or the like, but is particularly preferably a random copolymer. The weight average molecular weight (Mw) of the zephyr compound copolymer (A) is in the range of 1,000 to 30,000, and is in the range of 丨'500 to 6 Torr. By the above range, it is possible to obtain a cured product excellent in handleability and excellent in heat resistance. The weight average molecular weight (M w ) can be obtained, for example, from a standard polystyrene equivalent value of gel permeation chromatography (GPC) using tetrahydrofuran (T H F ) as a solvent. The molecular weight distribution (Mw/Mn) of the decane compound copolymer (A) is not particularly limited. Usually, it is U~3.〇, and the range of i•b 2〇 is preferable. By this range, a cured product excellent in adhesion and heat resistance can be obtained. The decane compound copolymer (A) may be used singly or in combination of two or more. 13 201141952 Polyepimane oxyalkylene compound copolymer (A) with a ladder structure.

聚倍半矽氧化合物具有梯 應生成物進行紅外線吸收光譜 測定而確認。 型構造,例如,可藉由對反 '則疋、X射線繞射測定、NMR 上述(A)成分,亦可係將 在於本發明之硬化性組合物 包含: (A’)式⑴:^丨―CH(xvD_Si⑽3)ρ(χ1)3ρ 所示之矽烷化合物(1)之至少一種,及 式(2) : R2Si(OR4)q(X2)3.q 所示之碎烧化合物(2)之至少一種之石夕烧化合物之浪 合物縮合而得’重量平均分子量為1,_~30, 〇〇〇之石夕烧化 合物共聚物(以下,有稱為「矽烷化合物共聚物α,)」之 情形。): 式中,R1係表示氫原子或碳數id之烷基,χ()係表示 函素原子、氰基或以式:GG表示之基,式中,G係表示經 基之保護基,D係表示單鍵結或連接基,y係表示碳數^ 之烷基,X1係表示画素原子,?係〇~3之整數;R2係表示碳 數1〜20之烷基或可具有取代基之苯基,R4係表示碳數16 之烷基,X2係表示鹵素原子,q係表示〇〜3之整數,矽烷 化合物共聚物(A)以矽烷化合物共聚物(A,)為佳。 [梦院化合物(1)] 矽烷化合物(1),係以式(1) : Rl_CH(XC)_D_Si(〇R3)p (X )3-p表示之化合物。藉由使用石夕烧化合物(1),可得於硬The polytetradecyloxy compound was confirmed by infrared absorption spectrum measurement of the ladder product. The structure may be, for example, by inverse 疋, X-ray diffraction measurement, or NMR (A) component, or may be included in the curable composition of the present invention: (A') Formula (1): At least one of the decane compound (1) represented by "CH(xvD_Si(10)3) ρ(χ1)3ρ, and at least one of the calcined compound (2) represented by R2Si(OR4)q(X2)3.q A cation of a compound of a smelting compound is condensed to obtain a weight average molecular weight of 1, _~30, which is a copolymer of cerium oxide (hereinafter referred to as "decane compound copolymer α,"). . Wherein R1 represents a hydrogen atom or an alkyl group having a carbon number id, and χ() represents a functional atom, a cyano group or a group represented by the formula: GG, wherein G represents a protecting group of a thiol group, D represents a single bond or a linker, y represents an alkyl group having a carbon number, and X1 represents a pixel atom, ? An integer of 3~3; R2 represents an alkyl group having 1 to 20 carbon atoms or a phenyl group which may have a substituent, R4 represents an alkyl group having 16 carbon atoms, X2 represents a halogen atom, and q represents a 〇~3 The integer, decane compound copolymer (A) is preferably a decane compound copolymer (A,). [Dream compound (1)] The decane compound (1) is a compound represented by the formula (1): R1_CH(XC)_D_Si(〇R3)p(X)3-p. By using the stone smelting compound (1), it can be obtained by hard

S 14 201141952 化後透明性、接著力亦良好的矽烷化合物共聚物。 式(1)中,R1係表示氫原子或碳數i〜6之烷基,以氫原 子為佳。具體例,可舉於矽烷化合物共聚物(八)例示作為 R1者。 ()中X係表示氟原子、氯原子、溴原子、埃原子 等的函素原子、氰基或以式:QG表示之基,(式中,G係表S 14 201141952 A decane compound copolymer having good transparency and adhesion after the formation. In the formula (1), R1 represents a hydrogen atom or an alkyl group having a carbon number of i to 6, preferably a hydrogen atom. Specific examples thereof include those in which the decane compound copolymer (VIII) is exemplified as R1. The X system in () represents a functional atom such as a fluorine atom, a chlorine atom, a bromine atom or an argon atom, a cyano group or a group represented by the formula: QG, (wherein, the G series table

示羥基之保護基。)’ °係表示單鍵結或連接基。以X。或D 表示者之具體例’可舉分別於矽烷化合物共聚物⑴例示作 為X°及D者。 R3係表示甲基、乙基、正丙基、異丙基、正丁基、第 二丁基、異了基、第三丁基、正戊基、正己基等的碳數Η 之烷基。 X係表不氟原子、氣原子、漠原子、破原子等的函素 原子。 Ρ係表示0〜3之整數。 Ρ為2以上時,叱相互可為相同亦可為相異。此外, (3-p)為2以上時,X1相互可為相同亦可為相異。 石夕烷化合物⑴的具體例’可舉:氯甲基三曱氧基矽 烷、漠甲基三乙氧基石夕烷、2_氯乙基三丙氧基石夕烷、2_漠 乙基三丁氧基㈣、3-氣丙基三甲氧基錢、3_氣丙基三 乙氧基矽烷、3'氣丙基三丙氧基矽烷、3'氣丙基三丁氧基 石夕烧、3-、;㈣基三甲氧基錢、3_漠丙基^氧基_、 3-潰丙基三丙氧基石夕烧、3-漠丙基三丁氧基石夕烧、3_氟丙 基三甲氧基石夕院、3-氣丙基三乙氧基錢、^氣丙基三丙 15 201141952 氧基矽烷、3-氟丙基三丁氧基矽烷、3_蛾丙基三曱氧基矽 烷、2-氣乙基三甲氧基矽烷' 3-氯丙基三甲氧基矽烷、4-氣丁基三曱氧基石夕坑、5 -氣戊基三甲氧基石夕烧、2 -氣丙基 三曱氧基矽烷、3-氣-3-乙醯丙基三曱氧基石夕院、3-氣-3-曱氧基羰基丙基三甲氧基矽烷、鄰(2_氣乙基)苯基三丙氧 基矽烷、間(2-氯乙基)苯基三丙氧基矽烷、對(2-氣乙基) 笨基三丙氧基矽烷、對(2-氟乙基)苯基三丙氧基矽烷等的 為由素原子之三烷氧基矽烷化合物類; 氣甲基三氣矽烷、溴甲基溴二曱基矽烷、2-氯乙基二 氣甲氧基矽烷、2-溴乙基二氣乙氧基矽烷、3-氣丙基三氣 矽烷' 3-氣丙基三溴矽烷、3-氣丙基二氣曱氧基矽烷' 3-氣丙基二氣乙氧基矽烷、3-氣丙基氣二甲氧基矽烷、3-氣 丙基氣二乙氧基矽烷、3-溴丙基二氣乙氧基矽烷、3-溴丙 基三溴矽烷、3_溴丙基三氯矽烷、3-溴丙基氣二曱氧基矽 院、3 -氟丙基三氣石夕烧、3 -氟丙基氣二甲氧基石夕烧、3 -氟 丙基二氣曱氧基矽烷、3-氟丙基氣二乙氧基矽烷、3-埃丙 基三氣矽烷、4-氣丁基氣二乙氧基矽烷、3-氯正丁基氣二 乙氧基矽烷、3 -氣-3-乙醯丙基二氣乙氧基矽烷、3 -氣- 3- 曱氧基羰基丙基三溴矽烷等的X。為齒素原子之鹵化矽院化 合物類; 氰基甲基三甲氧基矽烷、氰基甲基三乙氧基矽烷、卜 氰基乙基三曱氧基矽烷、2-氰基乙基三甲氧基矽烷、2-氰 基乙基三乙氧基矽烷、2-氰基乙基三丙氧基矽烷、3_氰基 丙基二甲氧基矽烷、3-氰基丙基三乙氧基矽烷、3_氰基丙Show the protecting group of the hydroxyl group. ) ° indicates a single bond or a linker. Take X. The specific example of the case where D is represented by the decane compound copolymer (1) is exemplified as X° and D, respectively. R3 represents a C Η alkyl group such as a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a t-butyl group, an isobutyl group, a t-butyl group, a n-pentyl group or a n-hexyl group. The X series shows a non-fluorine atom, a gas atom, a desert atom, a broken atom, and the like. The Ρ indicates an integer from 0 to 3. When Ρ is 2 or more, 叱 may be the same or different. Further, when (3-p) is 2 or more, X1 may be the same or different from each other. Specific examples of the compound (1) can be exemplified by chloromethyltrimethoxy decane, methylenetriethoxy oxacyclohexane, 2-chloroethyltripropoxy oxacyclohexane, and 2-diethyl sulphate. Oxygen (tetra), 3-vapor propyl trimethoxy ketone, 3- propyl propyl triethoxy decane, 3' propyl propyl tripropoxy decane, 3 ' propyl propyl tributoxide oxylate, 3- (4) bistrimethoxy ketone, 3 _ propyl propyl oxy _, 3- propyl propyl tripropoxy zebra, 3- propyl propyl tributoxide, 3 - fluoropropyl trimethoxy基石夕院, 3-气丙三ethoxy money, methoxypropyl tripropylene 15 201141952 oxydecane, 3-fluoropropyl tributoxy decane, 3_molyl tridecyloxy decane, 2 - gas ethyl trimethoxy decane ' 3-chloropropyl trimethoxy decane, 4- butyl tributoxy oxazepine, 5- gas pentyl trimethoxy sulphur, 2- propyl propyl trioxane Base decane, 3-ox-3-ethyl propyl propyl tridecyloxy sylvestre, 3-ox-3-oxooxycarbonylpropyltrimethoxy decane, o-(2-hydroxyethyl)phenyl tripropoxy Base decane, m-(2-chloroethyl)phenyltripropoxydecane, p-(2-cycloethyl)phenyltripropoxy Alkane, p-(2-fluoroethyl)phenyltripropoxydecane, etc., a trialkyloxydecane compound of the same atom; gas methyl trioxane, bromomethyl bromide, 2- Chloroethyl dimethoxy methoxy decane, 2-bromoethyl diethoxy ethoxy decane, 3- propyl propyl trioxane ' 3- propyl tribromo decane, 3- propyl propyl di oxooxy矽 ' ' 3- propyl propyl diethoxy ethoxy decane, 3- propyl propyl dimethoxy decane, 3- propyl propyl diethoxy decane, 3-bromopropyl di ethoxy decane, 3-bromopropyltribromodecane, 3-bromopropyltrichlorodecane, 3-bromopropyldimethoxy fluorene, 3-fluoropropyl tri-gas, x-fluoropropyl dimethyl Oxyzetan, 3-fluoropropyldimethoxymethoxydecane, 3-fluoropropyl gas diethoxy decane, 3-Epropyl trioxane, 4-cyclobutyl diethoxy decane, X such as 3-chloro-n-butyl gas diethoxy decane, 3- gas-3-ethyl propyl propyl di ethoxy decane, 3- gas-3-methoxycarbonyl propyl tribromo decane. a compound of a halogenated porphyrin compound; cyanomethyltrimethoxydecane, cyanomethyltriethoxydecane, cyanoethyltrimethoxy decane, 2-cyanoethyltrimethoxy Decane, 2-cyanoethyltriethoxydecane, 2-cyanoethyltripropoxydecane, 3-cyanopropyldimethoxydecane, 3-cyanopropyltriethoxydecane, 3_cyanopropyl

S 16 201141952 基三丙氧基矽烷、3_氰基丙基三丁氧基矽烷、4-氰基丁基 三曱氧基矽烷、5一氰基戊基三甲氧基矽烷、2-氰基丙基三 甲氧基矽烷、2-(氰基曱氧基)乙基三甲氧基矽烷、2-(2-氰基乙氧基)乙基三甲氧基矽烷、鄰(氰基甲基)苯基三丙氧 基矽烷、間(氰基甲基)苯基三曱氧基矽烷、對(氰基甲基) 笨基三乙氧基矽烷、對(2 -氰基乙基)苯基三甲氧基矽烷等 之X°為氰基之三烷氧基矽烷化合物類; 氰基曱基三氯石夕烧、氰基甲基溴二甲氧基石夕院、2 -氰 基乙基二氯甲氧基矽烧、2 -氰基乙基二氣乙氧基矽烧、3-氰基丙基三氣矽烷、3-氰基丙基三溴矽烷、3-氰基丙基二 氯曱氧基矽烷、3-氰基丙基二氯乙氧基矽烷、3_氰基丙基 氯二甲氧基矽烷、3-氰基丙基氯二乙氧基矽烷、4_氰基丁 基氣二乙氧基矽烷、3 -氰基正丁基氣二乙氧基矽烷、2_(2_ 氰基乙基)苯基三氯矽烷、2-(2 -氰基乙基)乙基溴二乙氧基 矽烷、2-(2 -氰基乙基)乙基二氣丙氧基石夕院、鄰(2_氰基乙 基)苯基三氣矽烷、間(2-氰基乙基)苯基二曱氧基溴矽烷、 對(2-氰基乙基)苯基二曱氧基氯矽烷、對(2_氰基乙基)苯 基二》臭石夕院等的χ°為氰基之鹵化矽烧化合物類; 3-乙醯氧基丙基三甲氧基矽烷、3_乙醯氧基丙基三乙 氧基矽烷、3-乙醯氧基丙基三丙氧基矽烷、3_乙醯氧基丙 基三丁氧基矽烷、3-丙醯氧基丙基三丁氧基矽烷、3_丙醯 氧基丙基三乙氧基矽烷、3_苯甲醯氧基丙基三曱氧基矽 烷' 3-笨甲醯氧基丙基三乙氧基矽烷、3 —笨甲醯氧基:基 二丙氧基矽烷、3-苯甲醯氧基丙基三丁氧基矽烷、I三甲 17 201141952 基矽氧基乙基三甲基矽烷、3-三乙基矽氧基丙基三乙氧基 石夕院、3-(2~四氫吡喃氧基)丙基三丙氧基矽烷、3_(2-四氫 0比喃氧基)丙基三丁氧基矽烷、3-甲氧基甲基氧丙基三甲氧 基石夕烧、3-甲氧基乙氧基甲基氧丙基三乙氧基矽烷、3一(1_ 乙氧基乙基氧)丙基三丙氧基矽烷、3-(第三丁氧基羰基氧) 丙基三曱氧基矽烷、3-第三丁氧基丙基三甲氧基矽烷、3- 节氧基丙基三乙氧基矽烷、3-三苯基曱氧基丙基三乙氧基 石夕烧等的X°為上式:〇G所示之基之三完氧基矽烷化合物類; 3-乙酿氧基丙基三氣石夕烧、3 -乙酿氧基丙基三溴石夕 院、3-乙酿氧基丙基二氯曱氧基矽烷、3_乙醯氧基丙基二 氣乙氧基矽烷、3-乙醯氧基丙基氣二曱氧基矽烷、3_乙醯 氧基丙基氣二乙氧基矽烷、3-苯甲醯氧基丙基三氣矽烷、 3-三甲基矽氧基丙基氣二曱氧基矽烷、3_三乙基矽氧基丙 基二氣甲氧基矽烷、3-(2-四氫吨喃氧基)丙基氯二乙氧基 矽烷、3-(2-四氩呋喃氧基)丙基二氣乙氧基矽烷、3_曱氧 基曱基氧丙基三溴矽烷、3-甲氧基乙氧基曱基氧丙基三氣 矽烷、3-(1-乙氧基乙基養)丙基氣二甲氧基矽烷、卜第三 丁氧基羰基氧丙基二氯甲氧基矽烷、3_第三丁氧基丙基氯 二氣乙氧基石夕烧、3-三苯基甲氧基丙基二氣乙氧基矽烷、 3-节氧基丙基三漠石夕院等的X。為上式:〇G所示之齒化石夕烧 化合物類等。 該等矽院化合物(1 )可以一種覃猸 裡早獨’或組合兩種以上使 用。 該 等之中’槪合物⑴,由可得具有更優良的接著S 16 201141952 1,3-trimethoxydecane, 3-cyanopropyl tributoxy decane, 4-cyanobutyltrimethoxy decane, 5-cyanopentyltrimethoxydecane, 2-cyanopropyl Trimethoxy decane, 2-(cyanomethoxy)ethyltrimethoxydecane, 2-(2-cyanoethoxy)ethyltrimethoxynonane, o-(cyanomethyl)phenyl three Propoxy decane, m-(cyanomethyl)phenyl trimethoxy decane, p-(cyanomethyl) phenyl triethoxy decane, p-(2-cyanoethyl) phenyl trimethoxy decane Xt is a cyanotrial alkoxy oxirane compound; cyano decyl triclosan, cyanomethyl bromide dioxate, 2-cyanoethyl dichloromethoxy fluorene Burned, 2-cyanoethyl diethylene ethoxylated, 3-cyanopropyl trioxane, 3-cyanopropyltribromodecane, 3-cyanopropyldichlorodecyloxydecane, 3 -Cyanopropyldichloroethoxy decane, 3-cyanopropyl chlorodimethoxy decane, 3-cyanopropyl chlorodiethoxy decane, 4-cyanobutyl dimethyl dimethoxy decane , 3-cyano-n-butyl gas diethoxy decane, 2_(2-cyanoethyl)phenyl Chlorodecane, 2-(2-cyanoethyl)ethylbromodiethoxydecane, 2-(2-cyanoethyl)ethyldipropoxylate Shixia, o-(2-cyanoethyl) Phenyl trioxane, m-(2-cyanoethyl)phenyl dimethoxy bromide, p-(2-cyanoethyl)phenyl dimethoxy chlorodecane, p-(2-cyanoethyl) a sulfonium halide compound of the phenyl group, which is a cyano group; 3-ethoxypropyl propyl trimethoxy decane, 3 ethoxypropyl propyl triethoxy decane , 3-ethoxypropyl propyl tripropoxy decane, 3 ethoxypropyl propyl tributoxy decane, 3-propoxy propyl tributoxy decane, 3 propyl methoxy propylene Triethoxy decane, 3_benzylidene propyl trimethoxy decane' 3-abidomethyloxypropyl triethoxy decane, 3 - benzoyloxy: bispropoxy Decane, 3-benzyloxypropyl tributoxy decane, I trimethyl 17 201141952 hydrazinyloxyethyl trimethyl decane, 3-triethyl methoxy propyl triethoxy sylvestre, 3 -(2~tetrahydropyranyloxy)propyltripropoxydecane, 3_(2-tetrahydro 0-methoxy)propyltributyl Oxydecane, 3-methoxymethyloxypropyltrimethoxy zeoxime, 3-methoxyethoxymethyloxypropyltriethoxydecane, 3-mono(1-ethoxyethyloxy) Propyltripropoxydecane, 3-(t-butoxycarbonyloxy)propyltrimethoxyoxydecane, 3-tert-butoxypropyltrimethoxydecane, 3-methoxypropyltriethyl The X° of oxydecane, 3-triphenylphosphonium oxypropyltriethoxy sulphide, etc. is the above formula: the decyloxydecane compound represented by 〇G; 3-ethyloxypropane Base three gas stone Xizhu, 3-ethoxypropoxypropyltribromide, 3-ethyloxypropyldichloromethoxy decane, 3_ethoxypropyl propyl diethoxy ethoxy decane , 3-ethoxypropyl propyl dimethoxy decane, 3 ethoxypropyl propyl diethoxy decane, 3-benzyl methoxy propyl trioxane, 3-trimethyl hydrazine Oxypropyl propyl dimethoxy decane, 3-triethyl methoxy propyl dimethoxy methoxy decane, 3-(2-tetrahydro tonyloxy) propyl chlorodiethoxy decane, 3 -(2-tetrahydrofuranyloxy)propyl dioxyethoxy decane, 3-methoxyoxypropyltribromodecane, 3-methyl Ethyloxymercaptooxypropyl trioxane, 3-(1-ethoxyethyl)propyl dimethoxydecane, tert-butoxycarbonyloxypropyldichloromethoxydecane , 3_t-butoxypropyl chloride, diethylene ethoxylate, 3-triphenylmethoxypropyl diethoxy ethoxy decane, 3-ethoxy propyl smectite, etc. X. It is a compound of the above formula: dent G, which is represented by 〇G. These brothel compounds (1) may be used in combination of two or more types. Among these, the compound (1) is more excellent in the available

S 18 201141952 物m㈣原子之三炫氧基㈣化合物類、 為氰基之三烷氧基矽烷化合物類、或r為上式:〇g所示 之基之三烷氧基矽烷化合物類為佳,以具有3'氣丙基之三 院氧基料化合物類、具有3_乙醯氧基丙基之三院氧基: 院化合物類、具有2-氰基乙基之三院氧基石夕院化合物類、 或具有3-氰基丙基之三烷氧基矽烷化合物類更佳。 [矽烷化合物(2)] 矽烷化合物(2),係以式⑴:r2Si (〇R4)q(x2)3 q所示之 矽烷化合物。 式(2)中,R2係表示碳數卜2〇之烷基或可具有取代基 之苯基。具體例’可舉於矽烷化合物共聚物(A)例示作為 R2者。 R係表不與上述R3同樣的碳數1〜6之烷基。 X2係表示與上述X1同樣的齒素原子。 Q係表不0〜3之任—整數。 Q為2以上時,OR4相互可為相同亦可為相異。此外, (3-Q)為2以上時,X2相互可為相同亦可為相異。 矽烷化合物(2)之具體例,可舉:曱基三甲氧基矽烷、 曱基二乙氧基矽烷、乙基三甲氧基矽烷、乙基三乙氧基矽 烷、正丙基二曱氧基矽烷、正丁基三乙氧基矽烷、異丁基 三甲氧基矽烷、正戊基三乙氧基矽烷、正己基三曱氧基矽 烷、異辛基二乙氧基矽烷、十二烷基三曱氧基矽烷、甲基 一甲氧基乙氧基矽烷、曱基二乙氧基甲氧基矽烷等的烷基 二元氧基梦烧化合物類; 19 201141952 甲基氯二甲氧基矽烷、甲基二氯甲氧基矽烷、曱基氣 二乙氧基矽烷、乙基氣二曱氧基矽烷、乙基二氯甲氧基矽 燒、正丙基氯二曱氧基石夕烧、正丙基二氣甲氧基石夕炫等的 烷基ii化烷氧基矽烷類; 甲基三氯石夕烧、甲基三溴石夕烧、乙基三氯石夕烧、乙基 三溴矽烷、正丙基三氣矽烷、等的烷基三_化矽烷化合物 類; 笨基三甲氧基矽烷、4-甲氧基苯基三曱氧基矽烷、2-氣苯基三曱氧基矽烷、苯基三乙氧基矽烷、2-曱氧基苯基 三乙氧基矽烷、苯基二甲氧基乙氧基矽烷、苯基二乙氧基 甲氧基矽烷等的可具有取代基之苯基三烷氧基矽烷化合物 苯基氣二曱氧基矽烷、苯基二氣甲氧基矽烷、苯基氣 甲氧基乙氧基矽烷、苯基氣二乙氧基矽烷、苯基二氣乙氧 基矽烷等的可具有取代基之苯基齒化烷氧基矽烷化合物 類; 苯基三氣矽烷、苯基三溴矽烷、4-甲基苯基三氣矽烷、 2-氣苯基三氣矽烷、2-乙氧基苯基三氣矽烷等的可具有取 代基之苯基三ill化碎院化合物。 該等矽烷化合物(2 ),可以一種單獨,或組合兩種以上 使用。 [矽烷化合物之混合物] 用於製造矽烷化合物共聚物(A,)時之矽烷化合物之 混合物’可為矽烷化合物(丨)及矽烷化合物(2)所組成之混S 18 201141952 The compound of the m (tetra) atom, the trioctyloxy group, the trialkyloxydecane compound which is a cyano group, or the trialkyloxydecane compound wherein r is a group represented by the above formula: a three-compartment oxy compound having a 3'-gas propyl group, a three-yard oxy group having a 3-ethoxypropyl group: a compound of the compound, and a compound of a compound of 2-cyanoethyl The class, or a trialkoxydecane compound having a 3-cyanopropyl group, is more preferred. [decane compound (2)] The decane compound (2) is a decane compound represented by the formula (1): r2Si (〇R4)q(x2)3 q . In the formula (2), R2 represents an alkyl group having a carbon number or a phenyl group which may have a substituent. Specific examples are exemplified as the decane compound copolymer (A) as R2. The R group represents an alkyl group having 1 to 6 carbon atoms which is the same as the above R3. X2 represents the same dentate atom as the above X1. The Q series is not 0 to 3 - integer. When Q is 2 or more, OR4 may be the same or different from each other. Further, when (3-Q) is 2 or more, X2 may be the same or different from each other. Specific examples of the decane compound (2) include mercaptotrimethoxydecane, decyldiethoxydecane, ethyltrimethoxydecane, ethyltriethoxydecane, and n-propyldimethoxyoxydecane. , n-butyltriethoxydecane, isobutyltrimethoxydecane, n-pentyltriethoxydecane, n-hexyltrimethoxyoxane, isooctyldiethoxydecane,dodecyltriazine Alkyl dioxy oxymethane compounds such as oxydecane, methyl monomethoxyethoxy decane, decyl diethoxy methoxy decane, etc.; 19 201141952 methyl chlorodimethoxy decane, A Dichloromethoxy decane, decyl gas diethoxy decane, ethyl gas dimethoxy decane, ethyl dichloro methoxy oxime, n-propyl chloro decyl oxide, n-propyl Alkyl methoxylated alkoxy decanes such as dimethoxy methoxy sulphate; methyl sulphate, methyl tribromide, ethyl sulphate, ethyl tribromo decane, positive a propyl trioxane, an alkyla-tridecane compound; a stupyl trimethoxy decane, a 4-methoxyphenyl trimethoxy decane, a 2-gas phenyl tri Oxydecane, phenyltriethoxydecane, 2-decyloxyphenyltriethoxydecane, phenyldimethoxyethoxysilane, phenyldiethoxymethoxydecane, etc. may have Substituted phenyltrialkoxydecane compound phenyl gas dimethoxy decane, phenyl dimethoxy methoxy decane, phenyl methoxy ethoxy decane, phenyl gas diethoxy decane, benzene a phenyl-terminated alkoxy decane compound having a substituent such as a phenyl ethoxy decane; phenyl trioxane, phenyl tribromodecane, 4-methylphenyl trioxane, 2-gas A phenyl tripled compound compound which may have a substituent such as phenyl trioxane or 2-ethoxyphenyl trioxane. These decane compounds (2) may be used alone or in combination of two or more. [A mixture of decane compounds] A mixture of decane compounds used in the production of the decane compound copolymer (A,) can be a mixture of a decane compound (丨) and a decane compound (2).

20 S 201141952 口物,進一步亦可以不阻礙本發明之目的之範圍包含其他 矽烷化合物之混合物,惟以矽烷化合物(1)及矽烷化合物(?) 所組成之混合物為佳。 石夕炫化合物(1)與矽烷化合物(2)之使用比例,以莫耳 比以[石夕烧化合物(1) ] ··[矽烷化合物] = 60 : 4〇〜5 : 95 為佳’以50 : 50〜5 : 95更佳,以50 : 50〜10 : 90特別佳。 使上述石夕炫•化合物之混合物縮合之方法,並無特別限 制,可舉將矽烷化合物(1 )、矽烷化合物(2 )、及根據所期 望之其他矽烷化合物溶解於溶劑,添加既定量的觸媒,以 既定的溫度攪拌之方法。 使用之觸媒’可為酸觸媒及鹼觸媒之任一。 酸觸媒’可舉鹽酸、硫酸、硝酸、磷酸等的無機酸; 甲石黃酸、三氟甲磺酸、苯磺酸、對甲苯磺酸、醋酸、三氟 醋酸等的有機酸等。 驗觸媒’可舉三甲基胺、三乙基胺、二異丙胺基鋰、 雙(三曱基矽基)胺基鋰、吡啶、丨,8-二氮雜雙環[5. 4 〇] 十一碳-7-烯、苯胺、曱基吡啶、1,4-二氮雜雙環[2.2.2] 辛烧、咪唑等的有機鹼;氫氧化四甲基銨、氫氧化四乙基 敍等的有機鹽氫氧化物;甲醇鈉、乙醇鈉、第三丁醇鈉、 第三丁醇鉀等的金屬醇化物;氫化鈉、氫化鈣等的金屬氫 化物;氫氧化鈉、氫氧化鉀、氫氧化鈣等的金屬氫氧化物; 碳酸鈉、碳酸鉀、碳酸鎂等的金屬碳酸鹽:碳酸氫鈉、碳 酸氫鉀等的金屬碳酸氫鹽等。 該等之中,使用的觸媒,以酸觸媒為佳’以無機酸更 201141952 佳。 觸媒的使用量’對矽烧化合物的總莫耳量,通常為 O.lmol%〜lOmoi%,以 im〇1%〜5m〇1%的範圍。 使用之溶劑,可按照矽烷化合物的種類等,適宜選擇。 可舉例如:水、苯、甲笨、二甲苯等的芳香烴類;醋酸甲 酯、醋酸乙酯、醋酸丙酯、丙酸甲酯等的酯類;丙酮、甲 乙酮、曱基異丁酮、環己酮等酮類;曱醇、乙醇、正丙醇、 異丙醇、正丁醇、異丁醇、第二丁醇、第三丁醇等的醇類 等。該溶劑可以一種單獨,或混合兩種以上使用。 該等之中,以水、芳香烴、及該等之混合溶劑為佳, 以水與甲苯的混合溶劑特別佳,使用水與曱苯時,水與甲 苯的比例(容積比),以1: 9〜9: !為佳,以7: 3〜3: 7更 佳。 溶劑的使用量,溶劑1公升當量,矽烷化合物的總莫 耳量通常為O.lmoWOmol,以成為〇 5m〇w〇m〇1之量更 佳。 使矽烷化合物縮合(反應)之溫度,通常為〇t至使用 之溶劑之沸點之溫度範圍,以2〇t〜1〇〇t之範圍為佳。反 應溫度過低則縮合反應的進行有不充分的情形。另一方 面’反應溫度過高則難以抑制凝膠化。反應,通常在3〇分 至20小時完成。 反應結束後,使用酸觸媒時,藉由對反應溶液添加碳 酸氩鈉水溶液等的鹼性水溶液1用鹼觸媒時,對反應溶 液添加鹽酸等的酸進行中和’此時將產生的鹽藉由過遽或20 S 201141952 Oral, it is further possible to include a mixture of other decane compounds in a range which does not hinder the object of the present invention, but a mixture of a decane compound (1) and a decane compound (?) is preferred. The ratio of the compound of Shi Xixuan compound (1) to the compound of decane (2) is preferably [Moxi-smelting compound (1)] ··[decane compound] = 60 : 4〇~5 : 95 50: 50~5: 95 is better, with 50: 50~10: 90 especially good. The method of condensing the mixture of the above-mentioned Shi Xi Xuan compound is not particularly limited, and the decane compound (1), the decane compound (2), and other desired decane compounds are dissolved in a solvent, and a predetermined amount of contact is added. Medium, a method of stirring at a given temperature. The catalyst used may be either an acid catalyst or a base catalyst. The acid catalyst may be an inorganic acid such as hydrochloric acid, sulfuric acid, nitric acid or phosphoric acid; an organic acid such as toluene acid, trifluoromethanesulfonic acid, benzenesulfonic acid, p-toluenesulfonic acid, acetic acid or trifluoroacetic acid. The catalyst can be exemplified by trimethylamine, triethylamine, lithium diisopropylamide, lithium bis(trimethylsulfonyl)amine, pyridine, hydrazine, 8-diazabicyclo[5. 4 〇] Organic bases such as undec-7-ene, aniline, mercaptopyridine, 1,4-diazabicyclo[2.2.2] octane, imidazole, etc.; tetramethylammonium hydroxide, tetraethyl hydride, etc. Organic salt hydroxide; metal alkoxides such as sodium methoxide, sodium ethoxide, sodium butoxide, potassium butoxide; metal hydrides such as sodium hydride, calcium hydride, etc.; sodium hydroxide, potassium hydroxide, hydrogen A metal hydroxide such as calcium oxide; a metal carbonate such as sodium carbonate, potassium carbonate or magnesium carbonate: a metal hydrogencarbonate such as sodium hydrogencarbonate or potassium hydrogencarbonate. Among these, the catalyst used is preferably acid catalyst. The inorganic acid is better than 201141952. The amount of catalyst used is - the total molar amount of the smoldering compound, usually from 0.1 mol% to lOmoi%, in the range of im 〇 1% 〜 5 m 〇 1%. The solvent to be used can be appropriately selected depending on the type of the decane compound and the like. Examples thereof include aromatic hydrocarbons such as water, benzene, methyl bromide, and xylene; esters of methyl acetate, ethyl acetate, propyl acetate, and methyl propionate; acetone, methyl ethyl ketone, and mercapto isobutyl ketone; A ketone such as cyclohexanone; an alcohol such as decyl alcohol, ethanol, n-propanol, isopropanol, n-butanol, isobutanol, second butanol or tert-butanol. The solvent may be used singly or in combination of two or more. Among them, water, an aromatic hydrocarbon, and a mixed solvent thereof are preferred, and a mixed solvent of water and toluene is particularly preferred. When water and toluene are used, the ratio of water to toluene (volume ratio) is 1: 9~9: ! is better, with 7: 3~3: 7 better. The solvent is used in an amount of 1 liter equivalent of the solvent, and the total molar amount of the decane compound is usually 0.1 mol of WOmol, more preferably 〇 5m〇w〇m〇1. The temperature at which the decane compound is condensed (reacted) is usually in the range of from 〇t to the boiling point of the solvent to be used, preferably in the range of 2 Torr to 1 Torr. When the reaction temperature is too low, the progress of the condensation reaction may be insufficient. On the other hand, when the reaction temperature is too high, it is difficult to suppress gelation. The reaction is usually completed in 3 to 20 hours. When an acid catalyst is used, when an alkaline catalyst 1 such as an aqueous solution of sodium argon carbonate is added to the reaction solution, an acid such as hydrochloric acid is added to the reaction solution to neutralize the salt which will be produced at this time. By over or

S 22 201141952 水洗等去除,可得目的之矽烷化合物工具物。 (B)具有異氰脲酸酯基骨架的環氧化合物 二發明之硬化性組合物’包含:具有異氣脲酸 架的環氧化合物(以下,有稱為「产畜儿人 作為⑻成分。 有稱為&氧化合物⑻」之情形。) 本發明之硬化性組合物’由於含有環氧化合物⑻ 仔即使在熱履歷後,耐熱性、透明性優良的硬化物。 作為環氧化合物(B),只要於 骨架(於下述⑷,式巾…絲 有異亂脲酸嘴基 U式中-係表不鍵結鍵。)及具有環氧 :,、’無特別限定。再者,於異氰脲酸醋基骨架( 可存在如下所述之互變異構物(異氮脲酸§旨基骨竿)’ 式中-係表示鍵結鍵。)’惟具有該骨架之環氧化合物,, 包含在用於本發明之環氧化合物(B)。 亦 0>S 22 201141952 Removal by water washing, etc., the desired decane compound tool can be obtained. (B) Epoxy compound having an isocyanurate group skeleton 2. The curable composition of the invention includes an epoxy compound having a gas urethane frame (hereinafter, it is referred to as "product of the animal" as the component (8). There is a case where it is called &oxy compound (8).) The curable composition of the present invention contains a cured compound which is excellent in heat resistance and transparency even after the heat history of the epoxy compound (8). As the epoxy compound (B), as long as it is in the skeleton (in the following (4), the towel has a different type of urethane nozzle, the U-form is not bonded), and has an epoxy:, 'no special limited. Further, in the isocyanuric acid sulphate skeleton (the tautomers (isoisouric acid §) can be present as described below], the system represents a bonding bond.) 'Only with the skeleton An epoxy compound, which is contained in the epoxy compound (B) used in the present invention. Also 0>

• N• N

丫 N Ο \Ν、 Ν Ο (c)丫 N Ο \Ν, Ν Ο (c)

°\ (C) 其中’環氧化合物⑻,以下式(C-1)〜(c_3)所示 鍵結於異氰脲酸酯tq Μ,將 U曰之1、3、5位之氮原子之氯原子 —個’以具有環氧環之基⑻取代之化合物為㊣: 〉、 23 201141952°\ (C) wherein the epoxy compound (8) is bonded to the isocyanurate tq oxime as shown in the following formula (C-1) to (c_3), and the nitrogen atom of the 1, 3, and 5 positions of U 曰Chlorine Atom - A compound substituted with a group having an epoxy ring (8) is positive: 〉, 23 201141952

EE

Ο (c-1)Ο (c-1)

l -X' » (c-3) X ,E係表示具有環氧環之基,R俜I _ — 有機基等的具K係表不氫原子 ,、有%虱環之基以外之任意的基。 上,具有環氧基之基⑻’可舉例如 —L,.\ r巧所不之基l -X' » (c-3) X , E means a group having an epoxy ring, R 俜 I _ - an organic group or the like having a K group and a hydrogen atom, and having a radical other than the group of the % ring base. The group having an epoxy group (8)' may, for example, be -L,.

CH2—CH—^CH2 ΟCH2—CH—^CH2 Ο

可取代甲基、乙基等的烷基。 ; , 環氧化合物⑻的具體例,由可得具有高接著力之硬化 物之觀點,可舉:縮水甘油異氰腺酸醋、二縮水甘油基異 氰脲酸酯、三(2, 3-環氧基丙基)異氰脲 氣脲馱酯、三(縮水甘油An alkyl group such as a methyl group or an ethyl group may be substituted. Specific examples of the epoxy compound (8) are: from the viewpoint of obtaining a cured product having a high adhesion, glycidyl isocyanurate, diglycidyl isocyanurate, and tris(2, 3- Epoxy propyl) isocyanurate urethroate, tris (glycidol)

基丙基)異亂脈酸醋、三((2 -甲其始I 〈Τ基鈿水甘油基)異氰脲酸 酯、及含有兩種以上該等化合物之混合物等。 此外,亦可直接使用市售之具有異氰脲酸醋骨架之環a propyl group, a heterologous vinegar, a tris((2-methyliso-I)-hydrazinyl)-isocyanurate, a mixture of two or more of these compounds, etc. Use a commercially available ring with an isocyanuric acid vinegar skeleton

S 24 201141952 氧化合物(例如,商品名:TEPIC_S、TEPIC-PAS B22、商品 名:TEPIC-PAS B26等,均為曰產化學工業公司製)作為環 氧化合物(B)。 環氧化合物(B)的調合量,並無特別限定,由可得接著 力更高的硬化物的觀點,環氧基當量,以5〇~3〇〇g/eq為 佳,以100~200g/eq特別佳。再者,環氧當量,係遵照JIs K 7 2 3 6 : 2 0 01測定之值。 (C)硬化劑 本發明之硬化性組合物,包含具有羧基之脂環酸酐之 硬化劑(以下,有稱為「硬化劑(c)j之情形。)作為(c)成 分。本發明之硬化性組合物,由於含有硬化劑(c),可得耐 熱性優良的硬化物。 具有羧基之脂環酸酐,係至少具有一個羧基取代之脂 裱構造之酸酐。脂環構造,可舉飽和環狀烴(環烷)構造、 不飽和環狀烴(環烯、環炔)構造等。 脂環酸酐,可舉3-甲基-me—四氫鄰苯二曱酸酐、 4-曱基_1,2, 3, 6-四氫鄰苯二甲酸酐、四氫鄰笨二甲酸酐、 3_甲基-六氫鄰苯二甲酸酐、4_甲基—六氫鄰苯二甲酸酐、 六氫鄰苯二曱酸酐、甲基納迪克酸酐、5_雙環庚烯—2 3 雙羧酸酐、雙環庚烯-2, 3-雙羧酸酐、曱基 X ^庚稀 -2,3-雙羧酸酐、甲基_雙環庚烯_2,3_雙羧酸酐等。 羧基,可取代之脂環酸酐之脂環構造之任意位置,取 代位置或取代之羧基數並無特別限定。 該等之中,於六氫鄰苯二甲酸酐取代羧美 〜硬丞之%己烷 25 201141952 -1,2,4-三羧酸-1,2酐、環己烷—i 9 机i,2,3-三羧酸_1>2酐為 佳,以環己烷-1,2,4-三羧酸-1 2邮4*。, 1Z軒特別佳。該化合物, 可存在立體異構物,且任一異構物均可。 具有羧基之脂環酸酐,可以—插留 種早獨,或組合兩種以 上使用。 硬化劑(C),可進一步含有其他的硬化劑。 其他的硬化劑(C),可舉:不且古祕好 +具有羧基之脂環酸酐(以 下’有稱為「其他的脂環酸酐) 吼or」)、聚壬二酸酐等的脂肪 酸乾、脂肪族胺系硬化劍、脂措吐么工 化剤月曰%胺糸硬化劑、2級或3級 胺系硬化劑、芳香族胺系硬化劑、 _ « B ^ ⑴ 又虱妝、二氟化硼胺錯 鹽、咪唑化合物等。 其他的硬化劑,可以—種單獨,或組合兩種以上使用。 其他的硬化劑,由即使在於高溫一渴得到具有高接著 力的硬化物,以其他的脂環酸酐為佳。其他的脂環酸軒, 可舉與例不作為上述具有缓基之脂環酸軒之脂環酸軒相同 者。其中’以3_甲基_六氫鄰苯二甲酸針、"基〜六氫鄰 苯二甲酸軒為佳…-甲基-六氫鄰苯二甲酸野特別佳。 η硬化物(C),由€自由具有緩基之脂環酸針及其他的脂 環酸酐之一種貨兩種以上所組成為佳,其質量比,以曰 緩基之脂核酸針):(其他的脂環酸酐)= 100 : 0〜10 : 9〇 佳,以50 : 50〜1〇 : 9〇更佳。 為 (D )梦燒偶合劑 本發明之硬化性組合物,&含:具冑酸針構造之 偶合劑(以下,有稱為「残偶合劑⑻」之情形。)作為二S 24 201141952 Oxygen compounds (for example, trade names: TEPIC_S, TEPIC-PAS B22, trade name: TEPIC-PAS B26, etc., all manufactured by Daicel Chemical Industries, Ltd.) are used as the epoxy compound (B). The blending amount of the epoxy compound (B) is not particularly limited, and from the viewpoint of obtaining a cured product having a higher adhesive force, the epoxy equivalent is preferably 5 〇 to 3 〇〇 g/eq, and 100 to 200 g. /eq is especially good. Further, the epoxy equivalent is a value measured in accordance with JIs K 7 2 3 6 : 2000. (C) Curing Agent The curable composition of the present invention contains a curing agent having a carboxy alicyclic acid anhydride (hereinafter referred to as "the curing agent (c) j). (c) component. The hardening of the present invention. The composition contains a hardener (c), and a cured product excellent in heat resistance is obtained. The alicyclic acid anhydride having a carboxyl group is an acid anhydride having at least one carboxyl group-substituted lipid raft structure. The alicyclic structure may be a saturated ring. a hydrocarbon (cycloalkane) structure, an unsaturated cyclic hydrocarbon (cycloalkenyl, cycloalkyne) structure, etc. The alicyclic acid anhydride may, for example, be 3-methyl-me-tetrahydrophthalic anhydride or 4-mercapto-1. 2, 3, 6-tetrahydrophthalic anhydride, tetrahydrophthalic anhydride, 3-methyl-hexahydrophthalic anhydride, 4-methyl-hexahydrophthalic anhydride, hexahydrogen O-phthalic anhydride, methyl nadic anhydride, 5-bicycloheptene-2 2 dicarboxylic anhydride, bicycloheptene-2, 3-biscarboxylic anhydride, mercapto X ^ heptane-2,3-biscarboxylic anhydride , methyl bis bicycloheptene 2,3 bis carboxylic anhydride, etc. Carboxy, optionally substituted alicyclic anhydride alicyclic structure at any position, the position of substitution or the number of substituted carboxyl groups is not particularly limited Among these, hexahydrophthalic anhydride is substituted for carboxymei~hard hydrazine % hexane 25 201141952 -1,2,4-tricarboxylic acid-1,2 anhydride, cyclohexane-i 9 machine i 2,3-tricarboxylic acid_1>2 anhydride is preferred, and cyclohexane-1,2,4-tricarboxylic acid-1 2 is 4*. 1Z Xuan is particularly preferred. The structure may be any of the isomers. The alicyclic acid anhydride having a carboxyl group may be used as a seed, or may be used in combination of two or more. The hardener (C) may further contain other hardeners. The hardener (C) can be mentioned as follows: not only the secrets are good + the alicyclic acid anhydride having a carboxyl group (hereinafter referred to as "other alicyclic acid anhydride" 吼or"), the fatty acid of the polysebacic anhydride, and the aliphatic Amine-based hardening sword, fat sputum, sputum, sputum, sulphuric acid, hardener, grade 2 or 3 amine hardener, aromatic amine hardener, _ « B ^ (1) 虱 makeup, boron difluoride Amine salt, imidazole compound, and the like. Other hardeners may be used singly or in combination of two or more. Other hardeners are preferably other alicyclic acid anhydrides obtained from a cured product having a high adhesion even at a high temperature. Other alicyclic acids may be the same as those of the above-mentioned alicyclic acid oxime which has a slow-acting alicyclic acid. Among them, a 3-methyl-hexahydrophthalic acid needle and a "yl-hexahydrophthalic acid oxime are preferred. -Methyl-hexahydrophthalic acid is particularly preferred. The η hardened material (C) is preferably composed of two or more kinds of alicyclic acid needles having a slow base and other alicyclic acid anhydrides, and the mass ratio thereof is a nucleating nucleic acid needle: Other alicyclic anhydrides = 100: 0~10: 9 〇 good, to 50: 50~1 〇: 9 〇 better. (D) Dream Burning Coupling Agent The curable composition of the present invention, & contains: a coupling agent having a citric acid needle structure (hereinafter, referred to as "residual coupling agent (8)").

S 26 201141952 成刀。本發明之硬化性組 -τα ^ 物’由於含有矽烷偶合劑(D) 可仟不會相分離(白濁),透 ), 化物。 月性優良,具有高接著力之石更 矽烷偶合劑(D),以於^八之丄 „ „ , h 、 刀子中,兼具酸酐構造(γ), 及水解性基(〇Rb)兩者之有 ★ 有機矽化合物,具體而言,可舉下 式(d)所示之化合物。 下 •(ORb) (d) (Ra)j (Y·)—Si- 式中,Y係表示酸酐構造, 或可具有取代基之苯基,Rb係表示 係表不1 ~ 3之整 碳數1〜6之烷基,丨你 表示1〜3之整數,j係表示0〜2之整數, 、 數 ’ i + j + k = 4。 可。舉以下式表示之基等’以⑼表示之基特別佳:S 26 201141952 into a knife. The curable group -τα^ of the present invention can be phase-separated (white turbid), permeable, and contains a decane coupling agent (D). It has excellent uranium and high arsenic coupling agent (D), and it has both an anhydride structure (γ) and a hydrolyzable group (〇Rb) in the 八 丄 „ „ , h , knives There are ★ organic hydrazine compounds, and specific examples thereof include compounds represented by the formula (d). (ORb) (d) (Ra)j (Y·)—Si— where Y represents an anhydride structure, or a phenyl group which may have a substituent, and Rb represents an integer number of carbon atoms of 1 to 3 1 to 6 alkyl, 丨 you represent an integer from 1 to 3, j is an integer from 0 to 2, and the number ' i + j + k = 4. can. The base represented by the following formula, etc., is particularly excellent in terms of (9):

(Y1)(Y1)

00

式中,h係表示〇〜1〇之整數。 式(d)中,以Ra、Rb袅于夕^山 、之衩數1〜6之烷基,可舉與例 27 201141952 不作為以上述R1所示之碳數丨〜6之烷基同樣的基以^表 1之可具有取代基之苯基,可舉與於先前例示作為以上述 示之取代基之苯基同樣的基。 其中,以式(d)表示之化合物,以下式(d—丨)表示之化 合物為佳:In the formula, h is an integer representing 〇~1〇. In the formula (d), the alkyl group having a number of 1 to 6 in the range of 1 to 6 in the case of Ra and Rb is the same as the alkyl group having the carbon number of 丨6 to 6 represented by the above R1. The phenyl group which may have a substituent in Table 1 may be the same as the phenyl group which has been exemplified as the substituent shown above. Among them, the compound represented by the formula (d) is preferably a compound represented by the following formula (d-丨):

工甲’ K、h、1、j、k係表示與上述相同意思。y, 以甲基、乙基、丙基、甲氧基曱基等的,可具有取代基之 碳數1〜6之烷基為佳,h以2~8為佳。 以式(d-Ι)表示之矽烷偶合劑之具體例,可舉2_三曱 氧基矽基乙基琥珀酸酐、3 —三乙氧基矽基丙基琥珀酸酐等。 具有酸酐構造之矽烷偶合劑(D),可以一種單獨,或組 合兩種以上使用。 於本發明之硬化性組合物,使上述、(c)及(M 成分的含有比例,以(A)與[(B)KC) + (d)]2質量比,以 (A) : [(B) + (C) + (D)] = 90 : 10〜50 : 50 為佳。此外,使上述 (A )、(B)、(C)及(D)成分’以(A’ )與[(B)+(C)+(D)]之 貝里比’以(A’ : [(B) + (C) + (D)] = 90 : 1〇〜50 : 50 為佳。 再者’上述(B)、(C)及(D)成分的比例,以[(b) + (c)] 與(D)之質量比,以[(b) + (c)]: (d) = 9〇: 1〇〜1〇: 9〇 為佳。The armor 'K, h, 1, j, k means the same meaning as above. Y, preferably an alkyl group having 1 to 6 carbon atoms which may have a substituent, such as a methyl group, an ethyl group, a propyl group or a methoxycarbonyl group, and h is preferably 2 to 8. Specific examples of the decane coupling agent represented by the formula (d-Ι) include 2-trisethoxydecylethyl succinic anhydride and 3-triethoxydecylpropyl succinic anhydride. The decane coupling agent (D) having an acid anhydride structure may be used singly or in combination of two or more. In the curable composition of the present invention, the ratio of the content of the above (c) and (M) is (A) to [(B)KC) + (d)] 2 by mass ratio (A) : [( B) + (C) + (D)] = 90 : 10~50 : 50 is better. Further, let the above components (A), (B), (C), and (D) 'B' with (A') and [(B)+(C)+(D)] be (A': [(B) + (C) + (D)] = 90 : 1〇~50 : 50 is better. Furthermore, the ratio of the above (B), (C) and (D) components is [(b) + (c)] To the mass ratio of (D), to [(b) + (c)]: (d) = 9〇: 1〇~1〇: 9〇 is preferred.

28 S 201141952 藉由以如此之比例使用各成分,可得長期透明性、 耐 熱性優良’即使在高溫亦具有很高的接著力的硬 化性組合物。 < 硬 本發明之硬化性組合物,在不阻礙本發明之目的的 圍,可進一步含有其他的成分。 、已 其他的成分,可舉:硬化觸媒、氧化防止劑、紫外線 吸收劑、光安定劑、稀釋劑等。 ” 硬化觸媒,係為促進硬化而添加。硬化觸媒,可舉l 曱基咪唑、三苯膦等。該等硬化觸媒,可以_種單獨牛 組合兩種以上使用。 5 氧化防止劑,係為防止加熱時之氧化惡化所添加者。 上述氧化防止劑’可舉磷系氧化防止劑、酚系氧化防止劑、 硫系氧化防止劑等。 磷系氧化防止劑,可舉:磷酸三苯酯、磷酸二苯基異 癸醋、磷酸苯基二異癸醋、較三(壬&苯基)醋、磷:二 異癸基異戊四醇醋、磷酸三(2, 4一二第三丁基苯基)醋、磷 酸環辛戊烧四基雙(十人烧基)酯、嶙酸環辛戊烧四基雙 (2, 4-二第三丁基笨基)酯、磷酸環辛戊烷四基雙(2, 4 —二第 三丁基-4-甲基苯基)酯、雙[2_第三丁基_6_甲基—(十 八烷氧基羧基)乙基}苯基]氫化填等的碟酸鹽類、9 一二 氫-9-氧雜-10-磷雜菲_1〇—氧化物、1〇_(35-二第三丁基 -4-羥苄基)-9, 10_二氫_9_氧雜_1〇__磷雜菲—氧化物ι〇_ 癸氧基-9, 10-二氫-9-氧雜_10_磷雜菲备氧化物等的氧 雜磷雜菲氧化物類。 29 201141952 酚系氧化防止劑,可舉:2,6_二第三丁基_對曱酚、二 丁基羥基甲笨、丁基化羥基苯甲醚、2,6_二第三丁基對乙 基盼、硬脂基十(3, 5-二第三丁基+經基笨基)丙酸酿等 的單酚類;2, 2’ -亞甲基雙(4_甲基_6_第三丁基酚)、 2,2’ -亞曱基雙(4-乙基_6 一第三丁基酚)、44,_硫代雙 (3-曱基-6-第三丁基酚)、4,4’ _亞丁基雙(3_曱基一6_第三 丁基酚)、3,9-雙[1,1一二曱基_2_丨一第三丁基_4_羥基 -5-甲基酚)丙烯醯氧基}乙基]2,4,8, 1〇_四氧螺[5,5]十二 烷等的雙酚類;1,1,3-三(2-曱基—4-羥基-5_第三丁基笨基) 丁烷、1,3, 5-三曱基-2, 4, 6-三(3, 5-二第三丁基-4一羥美苄 基)苯、四[亞甲基-3-(3’,5, 一二第三丁基_4, _經基笨基) 丙酸醋]甲烷、雙[3,3,-雙(4, _經基_3, _第三丁基苯基) 丁酸]二醇醋、1,3,5-三(3, ,5,—二第三丁基_4, _羥基节 基)-S-三嗪-2,4,6-(111,311,511)三酮、生育酚等的高分子型 酚類。 硫系氧化防止劑,可舉:二月桂基—33, _硫代二丙稀 酸醋、二肉苴窺基_3,3,—硫代二丙酸雖、二硬脂基-3,3, _ 硫代二丙烯酸酯等。 該等氧化防止劑,可以一種單獨,亦可組合兩種以上 使用。惟,本發明之硬化性組合物,由於含有⑻成分⑻ 成刀艮P使/又有特別有氧化防止劑,亦不容易發生加轨時 的氧化惡化°使用氧化防止劑時’其使用量,對石夕烧化合 物”聚物(A)或(A )1〇〇質量部,通常為〇.。卜1〇質量部。 紫外線吸收劑,係以提升所得硬化物之而寸光性之目的28 S 201141952 By using each component in such a ratio, it is possible to obtain a hardening composition which has excellent long-term transparency and heat resistance, and which has a high adhesion even at a high temperature. < Hard The curable composition of the present invention may further contain other components without hindering the object of the present invention. Other components include a curing catalyst, an oxidation inhibitor, an ultraviolet absorber, a light stabilizer, and a diluent. The hardening catalyst is added to promote hardening. The hardening catalyst may be decyl imidazole or triphenylphosphine. These hardening catalysts may be used in combination of two or more kinds of individual cattle. 5 Oxidation inhibitor, The anti-oxidation inhibitor is added to prevent oxidative deterioration during heating. Examples of the anti-oxidation inhibitor include a phosphorus-based oxidation inhibitor, a phenol-based oxidation inhibitor, and a sulfur-based oxidation inhibitor. Examples of the phosphorus-based oxidation inhibitor include triphenyl phosphate. Ester, diphenylisophthalic acid citrate, phenyl diisoindole citrate, tris(壬 & phenyl) vinegar, phosphorus: diisodecyl isopentenyl vinegar, phosphoric acid tris (2, 4-12) Tributyl phenyl) vinegar, cyclooctyl phosphate tetrakis(dione), octyl octanoate, tetrakis(2,4-di-tert-butyl), phosphate ring Octyl pentane bis(2,4-di-tert-butyl-4-methylphenyl) ester, bis[2_t-butyl-6-methyl-(octadecyloxycarboxy)ethyl }Phenyl]hydrogenated discate, 9-dihydro-9-oxa-10-phosphaphenanthracene-oxide, 1〇_(35-di-tert-butyl-4-hydroxyl Benzyl)-9,10_dihydro_9_oxa-1〇__phosphaphenanthrene-oxygen 〇 〇 癸 癸 -9 -9 -9 -9 -9 -9 -9 -9 10 10 10 10 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 29 2,6_di-tert-butyl-p-nonylphenol, dibutylhydroxymethyl stupid, butylated hydroxyanisole, 2,6-di-t-butyl-p-ethyl-p-ethyl, stearyl-tung Monophenols such as 5-di-tert-butyl+pyridyl-propionic acid; 2,2'-methylenebis(4-methyl-6-t-butylphenol), 2,2' - anthracenyl bis(4-ethyl-6-tert-butylphenol), 44, _ thiobis(3-mercapto-6-tert-butylphenol), 4,4'-butylene bis ( 3_mercapto- 6_t-butylphenol), 3,9-bis[1,1-diindolyl-2-yl-tert-butyl-4-ylhydroxy-5-methylphenol) propylene oxime Bisphenols such as ethyl}2,4,8, 1〇_tetraoxiro[5,5]dodecane; 1,1,3-tris(2-mercapto- 4-hydroxy-5_ Tert-butylphenyl)butane, 1,3,5-trimethyl-2,4,6-tris(3,5-di-tert-butyl-4-hydroxymethylene)benzene, tetra [Asia] Methyl-3-(3',5,1-2 dibutyl-4-4, _ phenyl group) propionic acid vinegar] methane, bis[3,3,-bis(4, _ _ _3, _ Third butylbenzene Butyric acid] glycolic acid, 1,3,5-tris(3,5,2-di-tert-butyl-4, hydroxyl- yl)-S-triazine-2,4,6-(111, 311, 511) a polymeric phenol such as a triketone or a tocopherol. The sulfur-based oxidation preventing agent may be, for example, dilauryl-33, thiodiacetic acid vinegar, or dipyridyl _3,3. - thiodipropionic acid, distearyl-3,3, thiodiacrylate, and the like. These oxidation inhibitors may be used singly or in combination of two or more. However, since the curable composition of the present invention contains (8) component (8) to form a squeegee P, and particularly has an oxidation preventing agent, oxidation deterioration at the time of addition is less likely to occur. For the mass spectrometry "A" or (A) 1 〇〇 mass part, it is usually 〇.. 1 〇 mass part. Ultraviolet absorber, for the purpose of enhancing the obtained hardened material.

S 30 201141952 而添加。 紫外線吸收劑,可舉例如:柳酸笨酯、柳酸對第三丁 基苯酯、柳酸對辛基笨酯等的柳酸類;2, 4-羥基二笨甲酮、 2-羥基-4-甲氧基二苯甲酮、2_羥基_4一辛氧基二笨曱酮、 2-羥基-4-十二烷氧基二苯甲酮、2, 2,_二羥基_4_甲氧基 二苯曱酮、2,2’ -二羥基_44,_二甲氧基二苯甲_'2_ 羥基-4-曱氧基-5-磺酸二苯甲酮、2-(2,-羥基-5,甲基 苯基)苯並三唑、2-(2’ -羥基_5,_第三丁基苯基)苯並三 唾、2-(2’ -經基-3’ ,5’ -二第三丁基苯基)苯並三唑、 2-(2,_羥基-3,_第三丁基_5,-甲基苯基卜5_氣笨並三 唑、2-(2’ -羥基-3, ,5, _二第三丁基苯基)_5_氣苯並三 唑、2-(2’ -羥基-3, 2-{(2’ -羥基-3’ ,3, -二第三戊基苯基)笨並三β坐、 4’ , , 5’ , , 6’ ,-四氫鄰笨 二曱醯亞胺曱基)—5’ -甲基苯基丨苯並三唑、雙(2, 2, 6, 6- 四曱基-4-哌啶基)癸二酸酯、雙(1,2,2,6,6,_五曱基_4一 旅咬基)癸二酸酷、雙(1,2, 2, 6, 6, 一五曱基-4_哌咬 基)Π3,5-雙(1,卜二甲基乙基)_4_經基苯基}曱基]丁基丙 二酸酯等的受阻胺類等。 該等紫外線吸收劑可以一種單獨,或組合兩種以上使 用。 紫外線吸收劑的使用晉,誓+ h &w 文用s,對矽烷化合物共聚物(A)或 (A,)100質量部’通常未〇 〇卜1〇質量部。 光文疋劑,係為提升所得廊彳卜& 4 7T W传吏化物之耐光性之目的而添 加0 31 201141952 光安定劑’可舉例如:聚[imu-四甲基丁基) 胺基-U’5-三H4-二基}{( 2,2 6 6_四曱基_4十定基) 亞胺基}六亞曱基{(2 2rr ,,6’ 6-四甲基-4-哌啶基)亞胺基}] 等的受阻胺類。 該等的光安定劑可以—括sg扼.» 種早獨,或組合兩種以上使用。 光女疋劑的使用量,料ρ几人1 里對矽烷化合物共聚物(A)或(A,) 100質量部,通常為0.01〜10質量部。 稀釋劑,係為調整硬化性組合物之黏度而添加。 稀釋劑,可舉例如:甘油二縮水甘油謎、丁二醇二縮 水甘油鍵、二縮水甘油其贫& 八苷油基本胺、辛戊二醇縮水甘油醚、環 己烷二曱醇二縮水甘油醚、亞烷基二縮水甘油醚、聚二醇 缩水甘油醚、聚丙二醇二縮水甘㈣、三經甲基丙院三 縮水甘油喊、甘油r输士 #、丄 —縮水甘油醚、4-乙烯基環己烯環氧化 物、二氧化環己稀乙埽、甲基化二氧化環己稀乙稀等。 該等的稀釋劑可以-種單獨,或組合兩種以上使用。 本發明之硬化性組合物,例如將上述或(A,)、 ⑻、(C)、⑻成分,以及根據期望之其他的成分以既定比 例調合,以習知之方法混合、脫泡而得。 以如以上所得之本發明之硬化性組合物,可得即使照 射高能量的光時或高溫狀態,並不會著色或降低透明性,、 可長期具有優良的透明性’且具有很高的接著力之硬化物。 因此’本發明之硬化性組合物’可良好地使用於作為 光學零件^形體之原料、接著劑、鍍敷財1別是, 可以解決隨著光元件之高亮度化’關於光元件固定材之惡S 30 201141952 and added. Examples of the ultraviolet absorber include, for example, stearic acid, stearic acid, p-tert-butylphenyl ester, salicylic acid, p-octyl ester, and the like; 2, 4-hydroxydibenzophenone, 2-hydroxy-4 -Methoxybenzophenone, 2-hydroxy-4-isooctyloxyindolone, 2-hydroxy-4-dodecyloxybenzophenone, 2,2,-dihydroxy-4-yl Oxydibenzophenone, 2,2'-dihydroxy-44,-dimethoxybenzhydryl-'2-hydroxy-4-indolyl-5-sulfonic acid benzophenone, 2-(2, -hydroxy-5,methylphenyl)benzotriazole, 2-(2'-hydroxy-5,-t-butylphenyl)benzotrisene, 2-(2'-trans-yl-3', 5'-di-t-butylphenyl)benzotriazole, 2-(2,-hydroxy-3,_t-butyl-5,-methylphenyl b-5-gas streptotriazole, 2- (2'-hydroxy-3, ,5, _di-t-butylphenyl)_5_gas benzotriazole, 2-(2'-hydroxy-3, 2-{(2'-hydroxy-3', 3,-di-t-amylphenyl) phenyl-β-s, 4', , 5',, 6',-tetrahydro-o-indolediamine fluorenyl)-5'-methylphenyl hydrazine Benzotriazole, bis(2, 2, 6, 6-tetradecyl-4-piperidyl) sebacate, bis (1, 2, 2, 6 , 6, _ 曱 曱 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ A hindered amine such as bis-methylethyl)- 4-p-phenylphenyl fluorenyl butyl malonate or the like. The ultraviolet absorbing agents may be used singly or in combination of two or more. Use Jin, oath + h &w text with s, for the decane compound copolymer (A) or (A,) 100 mass parts 'usually not 〇〇 1〇 quality part. Optical tanning agent, is the promotion of the gallery Adding 0 31 201141952 Light stabilizers can be exemplified by poly[imu-tetramethylbutyl]amino-U'5-tris-H4-diyl }{( 2,2 6 6_tetradecyl _4 dedecyl) imido}hexamethylene {{2 2rr ,,6' 6-tetramethyl-4-piperidinyl)imido}] Hindered amines. These light stabilizers can be used in the form of sg扼.», or in combination of two or more. The amount of the light scorpioning agent used is 1 part by mass for the decane compound copolymer (A) or (A,) 100 parts by mass, usually 0.01 to 10 parts by mass. The diluent is added to adjust the viscosity of the curable composition. The diluent may, for example, be a glycerol diglycidol mystery, a butanediol diglycidyl bond, a diglycidyl dilute & an octapeptide oil basic amine, an octyl glycol glycidyl ether, a cyclohexane diethanol condensate Glycerol ether, alkylene diglycidyl ether, polyglycol glycidyl ether, polypropylene glycol diglycidyl (tetra), trimethoprimin triglycidide shout, glycerol r loser #, 丄-glycidyl ether, 4- Vinyl cyclohexene epoxide, dicyclohexanyl dioxide, methylated dicyclohexyl bromide, and the like. These diluents may be used singly or in combination of two or more. The curable composition of the present invention is obtained by, for example, mixing the above components (A,), (8), (C), and (8), and other components as desired, in a predetermined ratio, and mixing and defoaming by a conventional method. According to the curable composition of the present invention obtained as described above, it is possible to obtain a high transparency even when irradiated with high-energy light or a high-temperature state without coloring or lowering transparency, and has a high degree of adhesion. Hardened material. Therefore, the 'curable composition of the present invention' can be suitably used as a raw material, an adhesive, and a plating material for an optical component, and can be used to solve the problem of high luminance of the optical component. evil

S 32 201141952 化之問題,本發明之硬化性組合物,可良好地使用於作為 光元件固定材用組合物。 2)硬化物 本發明之第2,係硬化本發明之硬化性組合物之硬化 物。 使本發明之硬化性組合物硬化之方法可舉加熱硬化。 硬化時之加熱溫度,通常為1〇〇〜2〇〇〇c,加熱時間通常為 1 〇分至20小時,以30分至1 〇小時為佳。 本發明之硬化物,得即使照射高能量的光時或高溫狀 態,並不會著色或降低透明性,可長及具有優良的透明性, 且具有很高的接著力之硬化物。 因此,本發明之硬化物,可良好地使用於光學零件或 成形體、接著層、鍍敷層等。特別是,以解決隨著光元件 之高亮度化,關於光元件固定材之惡化之問題,本發明之 硬化性組合物’可良好地使用於作為光元件固定材用組合 物。 本發明之硬化物具有很高的接著力,例如可藉由如下 之接著力測定確認。即,對石夕晶片的鏡面塗佈硬化性組合 物,將塗佈面載置於被著體上壓接,加熱處理使之硬化。 將=’放置於預先加熱為既定溫度(例如饥、iG(rc)之 接著測試機的測定a卜罢 ^ ]疋°上放置30秒’由被著體50㈣的高度 ,立置,對接著面施以水平方 ,,^ J &gt;卞乃凌(剪斷方向)之應力,測定 。式驗片與被著體之接著力。 硬化物之接著力,在於饥以⑽/2_□以上為佳。 33 201141952 上述硬化物透明性優良,可藉由測定光穿透率確認。 硬化物之光穿透率’在波長4〇〇nm之光,以8〇%以上為佳, 以84%以上特別佳,以波長45〇nm之光,以87%以上為佳。 上述硬化物之耐熱性優良,可由將硬化物放置於高溫 下後接著力或透明性的變化小而確認。透明性,以1 5 〇 I 放置500小時後,波長4〇〇nm之穿透率以初期穿透率之7〇% 以上為佳,以80%以上更佳。 3)硬化性組合物之使用方法 本發明之第3,係將本發明之硬化性組合物,使用於 作為光兀件固定材用接著劑或光元件固定材用封裝劑之方 法。 光元件,可舉LED、LD等的發光元件、感光元件、複 合光元件、光積體電路等。 〈光元件固定材用接著劑&gt; 本發明之硬化性組合物’可良好地使用於作為光元件 固定材用接著劑。 將本發明之硬化性組合物使用於作為光元件固定用接 著劑之方法,可舉於接著對象之材料(光元件與其基板等) 之一方或雙方的接著劑面塗佈該組合物,壓接後,使之加 熱硬化,使接著對象$好4 + κ设有耵豕之材枓相互牢固地接著之方法。 接著光元件之主要 要的基板材料,可舉:鈉玻璃、耐熱 性硬質玻璃荨的玻璃類;陶咨 貝闹是、鐵、銅、鋁、金、銀、鉑、 絡、欽、及該等金Μ夕人A . 屬之〇金,不銹鋼(SUS3〇2、S[JS3〇4、 SUS304L、SUS309等)等的金屬 興艰,眾對本一甲酸乙二醇醅、The problem of the S32 201141952, the curable composition of the present invention can be suitably used as a composition for an optical element fixing material. 2) Hardened material According to the second aspect of the present invention, the cured product of the curable composition of the present invention is cured. The method of hardening the curable composition of the present invention is heat hardening. The heating temperature at the time of hardening is usually 1 Torr to 2 Torr, and the heating time is usually 1 Torr to 20 hours, preferably 30 minutes to 1 Torr. The cured product of the present invention has a cured product which is excellent in transparency and has a high adhesion even when it is irradiated with high-energy light or in a high-temperature state without coloring or lowering transparency. Therefore, the cured product of the present invention can be suitably used for an optical component or a molded article, an adhesive layer, a plating layer or the like. In particular, the curable composition of the present invention can be suitably used as a composition for an optical element fixing material in order to solve the problem of deterioration of the optical element fixing material in accordance with the increase in the brightness of the optical element. The cured product of the present invention has a high adhesion, and can be confirmed, for example, by the following force measurement. That is, the mirror-coated curable composition of the Shixi wafer is placed on the object to be pressed by the coated surface, and heat-treated to be cured. Place =' in a preheated to a predetermined temperature (for example, hunger, iG (rc), the tester's measurement ab ^ ^ 疋 ° placed for 30 seconds ' from the height of the body 50 (four), stand up, the opposite side Apply the horizontal square, ^ J &gt; 卞乃凌 (cutting direction) stress, measure the adhesion between the test piece and the object. The adhesion of the hardened material is better than (10)/2_□. 201141952 The above-mentioned cured product is excellent in transparency and can be confirmed by measuring the light transmittance. The light transmittance of the cured product is preferably 8% or more in light of 4 〇〇 nm, and particularly preferably 84% or more. The light having a wavelength of 45 Å is preferably 87% or more. The cured product is excellent in heat resistance, and can be confirmed by placing the cured product at a high temperature and then changing the force or transparency to be small. The transparency is 1 5 〇. I After 500 hours of standing, the transmittance at a wavelength of 4 〇〇 nm is preferably 7% or more of the initial transmittance, more preferably 80% or more. 3) The method of using the curable composition is the third aspect of the present invention, The curable composition of the present invention is used as an adhesive for optical element fixing materials or an optical component fixing material. A method of using an encapsulant. The optical element may be a light-emitting element such as an LED or an LD, a light-receiving element, a composite optical element, or an optical unit circuit. <Binder for optical element fixing material> The curable composition of the present invention can be suitably used as an adhesive for an optical element fixing material. The curable composition of the present invention is used as a method for fixing an optical element, and the composition is applied to one or both of the following materials (such as an optical element and a substrate thereof), and the composition is applied. After that, it is heat-hardened, so that the object of the object $4+ κ is firmly adhered to each other. The main substrate materials of the optical element are: glass of soda glass and heat-resistant hard glass crucible; ceramics of iron, copper, aluminum, gold, silver, platinum, cord, chin, and the like Kim Min Hau A. belongs to the gold, stainless steel (SUS3〇2, S[JS3〇4, SUS304L, SUS309, etc.) and other metals are difficult, and the public is on the formic acid glycol oxime,

S 34 201141952 聚對苯二曱酸丁二醇酯、聚萘酸乙二醇酯、乙烯-醋酸乙酯 共聚物、聚苯乙烯'聚碳酸酯、聚甲基戊烯、聚砜、聚醚 醚酮、聚醚砜、聚苯硫醚、聚醚亞胺、聚亞醯胺、聚醯胺、 丙烯酸樹脂、降冰片烯系樹脂、環烯烴樹脂、玻璃環氧樹 脂等的合成樹脂。 加熱硬化時之加熱溫度,雖依硬化性組合物等,通常 為100〜20(TC。加熱時間,通常為1〇分鐘至2〇小時以 30分鐘至10小時為佳。 (光元件固定材用封裝劑) 本發明之硬化性組合物,可良好地使用於作為光元件 封裝體之封裝劑。 將本發明之硬化性組合物使用於作為光元件固定材封 裝劑之方法,可舉例如,將該組合物成形為所期望的形狀, 得到内包光元件之成形體之後1其加熱硬化而製造光元 件封裝體之方法等。 將本發明之硬化性έ且物Α、jj/ / 注、'且口物成形為所期望的形狀之方 法,並無特別限定,可採用通常 &lt; Ρ幻锊盧成形法,或注模法 等習知之成形法。 加熱硬化時之加執泪;$:,g备 /皿度,雖依使用之硬化性組合物, 通常為100~200°C。加献時間通堂或1n 、 …矸门逋吊為10分鐘至20小時, 以30分鐘至10小時為佳。 所付光το件封裝體,由於使用本發明之硬化性組人 物,故即使在光元件’使用白色或藍…的發光波峰 波長為·49〇nm之短波長者’亦不會因熱或光而著色惡 35 201141952 化’且透明性、耐熱性優良。 [實施例] 其次以實施例及比較例更詳細地說明本發明,惟本發 明並非受限於下述實施例者。 (重量平均分子量測定) 以製造例所得之矽烷化合物共聚物之重量平均分子量 (Mw),係以標準聚苯乙烯換算值,以如下裝置及條件測定。 裝置名:HLC-8220GPC T0S0公司製S 34 201141952 Polybutylene terephthalate, polyethylene naphthalate, ethylene-ethyl acetate copolymer, polystyrene 'polycarbonate, polymethylpentene, polysulfone, polyether ether A synthetic resin such as a ketone, a polyether sulfone, a polyphenylene sulfide, a polyetherimide, a polyamidamine, a polyamide, an acrylic resin, a norbornene resin, a cycloolefin resin, or a glass epoxy resin. The heating temperature at the time of heat curing is usually 100 to 20 (TC. The heating time is usually from 1 minute to 2 hours, preferably from 30 minutes to 10 hours, depending on the curable composition, etc.) (for optical element fixing materials) Encapsulant) The curable composition of the present invention can be suitably used as an encapsulant for an optical element package. The curable composition of the present invention is used as a method of encapsulating an optical element fixing material, and for example, The composition is molded into a desired shape, and a method of producing a light-emitting element package by heat-hardening the molded body of the optical element is obtained. The hardenability of the present invention is Α, jj / /Note, 'and The method of forming the mouth shape into a desired shape is not particularly limited, and a conventional molding method such as a & Ρ 锊 锊 molding method or an injection molding method can be employed. The tear is added during heat hardening; $:, g The preparation/dishness, although depending on the hardening composition used, is usually 100~200°C. Add time to the hall or 1n, ... 矸 逋 为 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 The light το package is used due to the use According to the curable group of the invention, even in the case where the light element 'using a white or blue light-emitting wavelength of a short wavelength of ·49 〇nm' is not colored by heat or light, it is transparent and heat-resistant. [Examples] Next, the present invention will be described in more detail by way of examples and comparative examples, but the present invention is not limited by the following examples. (Measurement of weight average molecular weight) The decane compound copolymer obtained in the production example The weight average molecular weight (Mw) is measured in terms of standard polystyrene and is measured by the following apparatus and conditions. Device name: HLC-8220GPC T0S0 company

管柱:將 TSKgelGMHXL、TSKgelGMHXL 及 TSKgel 2000HXL 依序連接者。 溶劑:四氫呋喃 注入量:80# 1 測定溫度:40°C 流速:1 m 1 /分 感測盗.不差折射計 (IR光譜之測定) 以製造例所得之矽烷化合物共聚物之IR光譜係使用 如下裝置測定。 傅立葉轉換紅外線光譜儀(SpectrumlOO,珀金埃爾默公司 製) (製造例1) 於300ml之水滴瓶,放入苯基三甲氧基石夕烧(東京化成 工業公司製)16. 7g(84mmol)作為矽烷化合物(2),3-乙醯氧 基丙基三曱氧基矽烷(八21^乂公司製)8_〇层(36111111〇1)作為石夕Column: TSKgelGMHXL, TSKgelGMHXL and TSKgel 2000HXL are connected in sequence. Solvent: tetrahydrofuran injection amount: 80# 1 measurement temperature: 40 ° C flow rate: 1 m 1 /min. Sense stolen. Inhomogeneous refractometer (measurement of IR spectrum) IR spectrum of the decane compound copolymer obtained in the production example Determined by the following apparatus. FT-IR-infrared spectrometer (Spectrum lOO, manufactured by Perkin Elmer) (manufacturing example 1) In a 300 ml water-dropping flask, phenyl trimethoxy zeshi (manufactured by Tokyo Chemical Industry Co., Ltd.) 16.7 g (84 mmol) was used as decane. Compound (2), 3-ethyloxypropyltrimethoxy decane (manufactured by Oct. 21 Co., Ltd.) 8_〇 layer (36111111〇1) as Shi Xi

S 36 201141952 . 烷化合物(D,作為溶劑放入甲笨6〇ml,蒸館水30ιη1後, 邊授拌,加入填酸(關東化學公司製)〇15g(i5mm〇1)作為 觸媒’以室溫進一步攪拌16小時。 反應結束後,對反應混合物加入1〇〇ml醋酸乙醋,以 飽和碳酸氫鈉水溶液中和。靜置一陣子之後,分取有機層。 接著,將有機層以蒸餾水清洗2次之後,以無水硫酸鎂乾 燥。過濾硫酸鎂後,將濾液以減壓濃縮機濃縮至5〇ml,將 此滴入多量的正己烷中使之再沉澱,將沉澱物以傾析分 離。將所得沉殿物溶解於甲乙酮回收,以減壓濃縮機將溶 劑減壓德除’藉由真空乾燥,得到矽烷化合物共聚物 (A1)14. 7g 。 石夕烧化合物共聚物(A1)之重量平均分子量(Mw)為 2,700,分子量分佈為(Mw/Μη)為1.53。 此外’將矽院化合物共聚物(Α1)之IR光譜(傅立葉轉 換紅外線光譜(FT-1R))資料表示如下。 • Si-Ph: 699CHT1,741cm—、Si-0: 1132cm.1,-CO: 1738cm.1 (製造例2) 於製造例1,使苯基三曱氧基矽烷之使用量為U 3g (72龍〇1) ’ 3-乙醯氧基丙基三曱氧基矽烷7g(48mmol) 以外’以與製造例1同樣地得到石夕炫化合物共聚物 (A2)15. 9g 。 矽烧化合物共聚物(A2)之重量平均分子量(mw)為 2, 600,分子量分佈(Mw/Mn)為1. 50。 此外,將矽烷化合物共聚物(A2)之IR光譜(傅立葉轉 37 201141952 換紅外線光譜(FT-IR))資料表示如下。S 36 201141952 . Alkane compound (D, as a solvent, put it into 6 〇ml, steamed water 30 ηη1, and then add the acid (manufactured by Kanto Chemical Co., Ltd.) 〇15g (i5mm〇1) as a catalyst. After further stirring for 16 hours at room temperature, after the reaction was completed, 1 〇〇 ml of ethyl acetate was added to the reaction mixture, and the mixture was neutralized with a saturated aqueous sodium hydrogencarbonate solution. After standing for a while, the organic layer was separated. Then, the organic layer was distilled water. After washing twice, it was dried over anhydrous magnesium sulfate. After filtering magnesium sulfate, the filtrate was concentrated to 5 〇ml with a vacuum concentrator, and this was added dropwise to a large amount of n-hexane to reprecipitate the precipitate by decantation. The sulphate compound copolymer (A1) 14. 7g is obtained by dissolving the obtained sulphate in a methyl ketone. The decane compound copolymer (A1) is obtained by vacuum drying to obtain a decane compound copolymer (A1). The weight average molecular weight (Mw) was 2,700, and the molecular weight distribution was (Mw/Μη) of 1.53. Further, the IR spectrum (Fourier transform infrared spectroscopy (FT-1R)) of the broth compound copolymer (Α1) was expressed as follows. • Si-Ph: 699CHT1 741 cm -, Si-0: 1132 cm.1, -CO: 1738 cm.1 (Production Example 2) In Production Example 1, the amount of phenyltrimethoxy decane used was U 3g (72 〇 1) ' 3- In the same manner as in Production Example 1, the oxime compound copolymer (A2) was obtained in an amount of 15.9 g. The weight average molecular weight of the stilbene compound copolymer (A2) was 5%. (mw) is 2,600, and the molecular weight distribution (Mw/Mn) is 1.50. Further, the IR spectrum of the decane compound copolymer (A2) (Fourier to 37 201141952 by infrared spectroscopy (FT-IR)) data is expressed as follows .

Si-Ph: 699cm 丨’ 741cm 丨,Si-〇:⑴之㈣-1,-CO: 1738cm-1 (製造例3) 於製造例1,使苯基三甲氧基矽烷之使用量為19.〇g (96mmol),3-乙醯氧基丙基三甲氧基矽烷53g(24_〇1)以 外,以與製造例1同樣地得到矽烷化合物共聚物 (A3)14. 9g。 矽烷化合物共聚物(A3)之重量平均分子量(Mw)為 2,500,分子量分佈(Mw/Mn)為1.59。 此外,將矽烷化合物共聚物(A3)之IR光譜(傅立葉轉 換紅外線光譜(F T -1R))資料表示如下。Si-Ph: 699 cm 丨' 741 cm 丨, Si-〇: (1) (4)-1, -CO: 1738 cm-1 (Production Example 3) In Production Example 1, the amount of phenyltrimethoxydecane used was 19. 9 g。 The decane compound copolymer (A3) 14.9 g was obtained in the same manner as in Production Example 1, except that the decane compound copolymer (A3) was obtained. The decane compound copolymer (A3) had a weight average molecular weight (Mw) of 2,500 and a molecular weight distribution (Mw/Mn) of 1.59. Further, the IR spectrum (Fourier transform infrared spectroscopy (F T -1R)) data of the decane compound copolymer (A3) is shown below.

Si-Ph: 70Ocm-1’ 742CHT1,Si-〇: 1132cm-1,-CO: 1738cm-1 (製造例4) 於製造例1,使苯基三曱氧基矽烷之使用量為l6 7g (84ππηο1) ’取代3_乙酿氧基丙基三甲氧基碎燒8 〇 g (3 6mmo 1),使用苯基三曱氧基矽烷(東京化成工業公司· 製)11_ 9g(60mmol)及3-甘油酸丙基三甲氧基矽完(東京化 成工業公司製)(下述第1表-1、第1表-2中,盲己載為 「GlyTMS」。)14.2(60mmol)以外,以與製造例1同樣地得 到矽烷化合物共聚物(A4)16. 3g。 矽烷化合物共聚物(A4)之重量平均分子量(Mw)為 2,800,分子量分佈(Mw/Mn)為1.56。 此外,將矽烷化合物共聚物(A4)之IR光譜(傅立帛轉 換紅外線光譜(FT-IR))資料表示如下。Si-Ph: 70Ocm-1' 742CHT1, Si-〇: 1132cm-1, -CO: 1738cm-1 (Production Example 4) In Production Example 1, the amount of phenyltrimethoxydecane used was 167g (84ππηο1). 'Substituting 3_Ethyloxypropyltrimethoxyacetate 8 〇g (3 6mmo 1), using phenyltrimethoxy decane (manufactured by Tokyo Chemical Industry Co., Ltd.) 11_9g (60mmol) and 3-glycerol The acid propyl trimethoxy oxime (manufactured by Tokyo Chemical Industry Co., Ltd.) (hereinafter referred to as "GlyTMS" in Table 1 - 1 and Table 1 - 2 below), 14.2 (60 mmol), and the production example 1克。 The decane compound copolymer (A4) 16.3g. The decane compound copolymer (A4) had a weight average molecular weight (Mw) of 2,800 and a molecular weight distribution (Mw/Mn) of 1.56. Further, the IR spectrum (Fourier transform infrared spectroscopy (FT-IR)) data of the decane compound copolymer (A4) is shown below.

38 S 20114195238 S 201141952

Si-Ph : 700cm-1 ’ 742cm.1 ’ Si_〇 : 1132cnfl,環氧基: 1254cm—1 (製造例5) 於300ml之水滴瓶,放入笨基三曱氧基矽烷(東京化成 工業公司製)19. 0g(96mmol)作為矽烷化合物(2),3-氯丙基 二甲氧基石夕烧(東厅、化成工業公司製)4.77g(24minol)作為 矽烧化合物(1),作為溶劑放入甲苯6〇111卜蒸餾水30ml後, 邊授拌,加入填酸(關東化學公司製)〇.15g(1.5mmol)作為 觸媒’以室溫進一步攪拌1 6小時。 反應結束後’對反應混合物加入醋酸乙酯1 〇〇m 1,以 飽和碳酸氫納水溶液中和。靜置一陣子之後,分取有機層。 接著’將有機層以蒸館水清洗2次之後,以無水硫酸鎖乾 燥。過遽硫酸鎮後,將濾液滴入多量的正己烧中使之再沉 澱,去除己烷取出沉澱物。將所得沉澱物溶解於曱乙酮回 收’以減壓濃縮機將溶劑減壓餾除,藉由真空乾燥,得到 矽烷化合物共聚物(A5)13. 6g。 碎烧化合物共聚物(A 5)之重量平均分子量(Mw)為 3, 000 ’分子量分佈為(Mw/Mn)為1. 59。 此外’將矽烷化合物共聚物(A5)之IR光譜資料表示如 下。Si-Ph : 700cm-1 ' 742cm.1 ' Si_〇: 1132cnfl, epoxy group: 1254cm -1 (Production Example 5) In a 300ml water drop bottle, put in a stupid base of tridecyloxy decane (Tokyo Chemical Industry Co., Ltd.) 19. g (96 mmol) as a decane compound (2), 3-chloropropyldimethoxy zebra (manufactured by Tosho, Kasei Kogyo Co., Ltd.) 4.77 g (24 minol) as a calcined compound (1) as a solvent After adding 30 ml of toluene, 6 〇 111, and distilled water, the mixture was stirred, and 15 g (1.5 mmol) of acid (manufactured by Kanto Chemical Co., Ltd.) was added as a catalyst, and further stirred at room temperature for 16 hours. After the end of the reaction, ethyl acetate 1 〇〇m 1 was added to the reaction mixture, and the mixture was neutralized with a saturated aqueous sodium hydrogencarbonate solution. After standing for a while, the organic layer was taken. Then, the organic layer was washed twice with steaming water, and then dried with anhydrous sulfuric acid. After passing through the sulfuric acid town, the filtrate was dropped into a large amount of normal calcined water to be reprecipitated, and the hexane was removed to remove the precipitate. 6克。 The decane compound copolymer (A5) 13. 6g. The decane compound copolymer (A5) was obtained. The weight average molecular weight (Mw) of the calcined compound copolymer (A 5 ) is 3,000 Å and the molecular weight distribution is (Mw/Mn) of 1.59. Further, the IR spectrum data of the decane compound copolymer (A5) is shown below.

Si-Ph '· 700cm&quot;1 » 741cm'1 » Si-0 : 1132cm'1 5 -Cl '· 648cm'1 (製造例6) 於製造例5,使苯基三甲氧基矽烷之使用量為16. 7g (84mmol),3-氣丙基三曱氧基矽烷之使用量為7. 15g 39 201141952 (36mmol)以外’以與製造例5同樣地得到矽烷化合物共聚 物(A6)13.4g。 矽烷化合物共聚物(A6)之重量平均分子量(Mw)為 3, 300,分子量分佈(Mw/Mn)為1. 59。 此外,將矽烷化合物共聚物(A6)之IR光譜資料表示如 下。Si-Ph '·700cm&quot;1 » 741cm'1 » Si-0 : 1132cm'1 5 -Cl '· 648cm'1 (Production Example 6) In Production Example 5, the amount of phenyltrimethoxydecane used was 16 7 g (84 mmol), the amount of 3-cyclopropyltrimethoxy decane used was 7.15 g 39 201141952 (36 mmol). In the same manner as in Production Example 5, 13.4 g of a decane compound copolymer (A6) was obtained. The decane compound copolymer (A6) has a weight average molecular weight (Mw) of 3,300 and a molecular weight distribution (Mw/Mn) of 1.59. Further, the IR spectrum data of the decane compound copolymer (A6) is expressed as follows.

Si-Ph: 70 0cm'1 &gt; 742cm'1 &gt; Si-〇: 1133cm'1 &gt; -Cl : 648cm'1 (製造例7) 於製造例5 ’使苯基三甲氧基矽烷之使用量為14. 3g (72_〇l),3-氣丙基三甲氧基矽烷之使用量為9 54g (48mniol)以外,以與製造例5同樣地得到矽烷化合物共聚 物(A7)13.0g。 矽烷化合物共聚物(A7)之重量平均分子量(Mw)為 3,400,分子量分佈(Mw/Mn)為1.61。 此外’將矽烷化合物共聚物(A7)之IR光譜資料表示如 下。Si-Ph: 70 0cm'1 &gt; 742cm'1 &gt; Si-〇: 1133cm'1 &gt; -Cl : 648cm'1 (Production Example 7) The use amount of phenyltrimethoxydecane in Production Example 5 In the same manner as in Production Example 5, 13.0 g of a decane compound copolymer (A7) was obtained, except that the amount of the solvent was 1. </ RTI> ( </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> The decane compound copolymer (A7) had a weight average molecular weight (Mw) of 3,400 and a molecular weight distribution (Mw/Mn) of 1.61. Further, the IR spectrum data of the decane compound copolymer (A7) is shown below.

Si-Ph: 699cm1,741 cnf1 ’ Si-〇: 1132011-1,-Cl : 648cm-1 (製造例8) 於製造例5’使苯基三曱氧基矽烷之使用量為n9g (60隨〇1)’3-氣丙基三甲氧基矽烷之使用量為n.9g (60mmol)以外以與製造例5同樣地得到矽烷化合物共聚物 (A8)12.9g 。 石夕烧化合物共聚物(A8)之重量平均分子量(Mw)為 3,600,分子量分佈(Mw/Mn)為1.63。Si-Ph: 699 cm1, 741 cnf1 'Si-〇: 1132011-1, -Cl: 648 cm-1 (Production Example 8) The amount of phenyltrimethoxy decane used in the production example 5' was n9 g (60 〇 1) The decane compound copolymer (A8) was obtained in the same manner as in Production Example 5 except that the amount of the 3-methoxypropyltrimethoxydecane used was n.9 g (60 mmol). The weight-average molecular weight (Mw) of the Shiqi-sinter compound copolymer (A8) was 3,600, and the molecular weight distribution (Mw/Mn) was 1.63.

40 S 201141952 此外,將矽烷化合物共聚物(A8)之IR光譜資料表示如 下。40 S 201141952 Further, the IR spectrum data of the decane compound copolymer (A8) is expressed as follows.

Si-Ph: 700cm'1 &gt; 741cm-1 &gt; Si-O: 1133cm'1 &gt; -Cl : 648cm'1 (製造例9) 於製造例5,取代3-氣丙基三甲氧基矽烷4. 77g使用 2-氰基乙基三曱氧基矽烧(AZMAX公司製)4. 21g(24mmol)以 外,以與製造例5同樣地得到矽烷化合物共聚物(A9) 13.5g。 石夕烧化合物共聚物(A9)之重量平均分子量(Mw)為 2,900’分子量分佈(Mw/Mn)為1.58。 此外,將矽烷化合物共聚物(A9)之IR光譜資料表示如 下。Si-Ph: 700 cm'1 &gt; 741 cm-1 &gt; Si-O: 1133 cm'1 &gt; -Cl: 648 cm'1 (Production Example 9) In Production Example 5, 3-cyclopropyltrimethoxydecane 4 was replaced. 77 g of a decane compound copolymer (A9) was obtained in the same manner as in Production Example 5 except that the product was obtained by the method. The weight average molecular weight (Mw) of the zephyr compound copolymer (A9) was 2,900' molecular weight distribution (Mw/Mn) of 1.58. Further, the IR spectrum data of the decane compound copolymer (A9) is shown below.

Si-Ph: 70 0cm ^ 741cm'1» Si-O: 1131cm'1 &gt; -CN : 2252cm'1 (製造例10) 於製造例9,使苯基三曱氧基矽烷之使用量為16. 7g (84mmol),2 -氰基乙基三曱氧基矽烷之使用量為6.31g (3 6mmo 1)以外,以與製造例9同樣地得到石夕烧化合物共聚 物(A10)13·3g。 矽烷化合物共聚物(A10)之重量平均分子量(Mw)為 3,200,分子量分佈(Mw/Mn)為1.64。 此外,將矽烷化合物共聚物(A10)之IR光譜資料表示 如下。Si-Ph: 70 0cm ^ 741cm'1» Si-O: 1131cm'1 &gt; -CN : 2252cm'1 (Production Example 10) In Production Example 9, the amount of phenyltrimethoxydecane used was 16. In the same manner as in Production Example 9, except that 7 g (84 mmol) and 2-cyanoethyltrimethoxy decane were used in an amount of 6.31 g (3 6 mmo 1 ), 13 g of a compound (A10) was obtained in the same manner as in Production Example 9. The decane compound copolymer (A10) had a weight average molecular weight (Mw) of 3,200 and a molecular weight distribution (Mw/Mn) of 1.64. Further, the IR spectrum data of the decane compound copolymer (A10) is shown below.

Si-Ph: 699cm—1,742(:111_1,Si-〇: 1131cm ’ -CN: 2253cm.1 (製造例11) 41 201141952 於製造例9,使苯基三曱氧基矽烷之使用晉 里芍14. 3g (7 2mmol ),2 -氰基乙基三甲氧基矽燒之使用量為&amp; (48mmo 1 )以外,以與製造例9同樣地得到石夕烧化入物共聚 物(All)12.8g。 量(Mw)為 石夕烧化合物共聚物(All)之重量平均分子 3, 300,分子量分佈(Mw/Mn)為1· 62。 此外’將矽烷化合物共聚物(All)之ir光譜資料表 如下。Si-Ph: 699 cm -1,742 (:111_1, Si-〇: 1131 cm ' -CN: 2253 cm.1 (Production Example 11) 41 201141952 In Production Example 9, the use of phenyltrimethoxy decane was used. 14.3 g (7 2 mmol ) and 2-cyanoethyltrimethoxy oxime were used in the same manner as in Production Example 9 except that the amount of 2-cyanoethyltrimethoxy oxime was &amp; (48 mmo 1 ). g. The amount (Mw) is the weight average molecular weight of the copolymer of the smelting compound (All) 3, 300, and the molecular weight distribution (Mw/Mn) is 1.62. Further, the ir spectrum data of the decane compound copolymer (All) The table is as follows.

Si-Ph: 6 99cm·1» 742cm'1» Si-〇: 1131cm'1« -CN: 2253cm-1 (製造例12) 於製造例9,使苯基三曱氧基矽烷之使用量為U9g (60nmol) ’ 2 -氰基乙基二曱氧基矽烷之使用量為 (60ππη〇1)以外,以與製造例9同樣地得到矽烷化合物共聚 物(A12)12.3g。 石夕烧化合物共聚物(A12)之重量平均分子量(Mw)為 3,500’分子量分佈(Mw/Mn)為1.61。 此外,將矽烷化合物共聚物(A12)之I r光譜資料表示 如下。Si-Ph: 6 99cm·1» 742cm'1» Si-〇: 1131cm'1« -CN: 2253cm-1 (Production Example 12) In Production Example 9, the amount of phenyltrimethoxydecane used was U9g. (2.3 mmol) of the decane compound copolymer (A12) was obtained in the same manner as in Production Example 9 except that the amount of (2,0,5,0,0,0,0,0,0,0,0,0,0,0,0,0,2,2,3,3,3,3,3,3,3,3,3,3,3,2 The weight average molecular weight (Mw) of the Shiqi-sinter compound copolymer (A12) was 3,500', and the molecular weight distribution (Mw/Mn) was 1.61. Further, the Ir spectrum data of the decane compound copolymer (A12) is shown below.

Si-Ph: 70 0cm'1 &gt; 742cm&quot;1 &gt; Si-〇: ll33cm-', _cn: 2252cm'1 (實施例1) 於製造例1所得之矽烷化合物共聚物(A1 )1〇g,加入 1. 5g具有異氰脲酸酯骨架之環氧化合物(日產化學工業公 司製,TEPIC-PAS B26,環氧當量137g/eq)(於下述第:ι表 -1、第1表2中記載為「B1」。)作為環氧化合物(β),〇. 375g 42 s 201141952 ' 4-甲基環己烷-1,2-二羧酸酐(東京化成工業公司製)(於下 述苐1表-1、第1表2中記載為「C1」。)及環己院 -1,2,4-三羧酸-1,2-酐(三菱瓦斯化學公司製)(於下述第1 表-1、第1表2中記載為「C2」。)作為硬化劑(c),以及 0.375g 3 -二乙氧基石夕基丙基琥j自酸針(AZMAX公司製)(於 下述第1表-1、第1表2中記載為「D1」。)作為矽烷偶合 劑(D),將全容充分混合,脫泡,得到硬化性組合物(丨 (實施例2〜7) 依照下述第1表-1,使用矽烷化合物共聚物、環氧化 合物、硬化劑及矽烷偶合劑,以與實施例1同樣地,得到 硬化性組合物(2)〜(7)。 再者’於下述第1表—1、第1表2中’ 「B2」係表示 具有異氰脲酸酯骨架之環氧化合物(日產化學工業公司 製,TEPIC-PAS B22,環氧當量 i79g/eq)。 (比較例1、2) 依照下述第1表-丨’使用矽烷化合物共聚物' 環氧化 合物、硬化劑及矽烷偶合劑,以與實施例丨同樣地,得到 硬化性組合物(8)、( 9 )。 (比較例3) 於貫施例1’取代環氧化合物(B)使用3,4_環氧環己基 甲基3, 4環氧環己基羧酸酯(西克瑪艾爾迪希公司製)(於 下述第1表-1、第1表2中記載為「BF1」。)1.5g以外, 以與實施例1同樣地,得到硬化性組合物(1〇)。 (比較例4) 43 201141952 於實施例l,取代製造例丨所得之矽烷化合物共聚物 (A1) ’使用製造例4所得之矽烷化合物共聚物(A4)以外, 以與實施例1同樣地’得到硬化性組合物(丨丨)。 (比較例5 ) 於實施例1 ’取代矽烷偶合劑(D1)使用3_甘油基丙基 二甲氧基石夕烧(東厅、化成工業公司製)(於下述第1表_1、第 1表2中§己載為「DF1」。)〇.375g以外,以與實施例1同 樣地,得到硬化性組合物(12)。 (比較例6) 使用0.375g石夕酸四曱基酯(東京化成工業公司製)作 為實施例1之矽烧偶合劑(D1)(於下述第1表_ 1、第1表2 中記載為「DF2」。)以外’以與實施例1同樣地,得到硬 化性組合物(13)。 (實施例8) 於製造例5所得之矽烷化合物共聚物(A5)10g,加入 1. 5g具有異氰脲酸酯骨架之環氧化合物(日產化學工業公 司製,TEPIC-PAS B26 ’環氧當量!37g/eci)作為矽烷偶合 劑(B)、0· 38g 4-甲基環己烷-1,2-二羧酸酐(東京化成工業 公司製)及0· 75g環己烷_1,2, 4-三羧酸_1,2-酐(三菱瓦斯 化學公司製)作為硬化劑(C),以及〇.38g 3_三乙氧基矽基 丙基琥站酸酐(AZMAX公司製)作為矽烷偶合劑(D),將全容 充分混合’脫泡’得到硬化性組合物(14 )。 (實施例9〜1 5,比較例7〜1 6) 依照下述第1表-2 ’使用矽烷化合物共聚物、環氧化 44 201141952 例8同樣地,得到 合物、硬化劑及;ε夕烧偶合劑,以與實施 硬化性組合物(1 5) ~ (31)。 45 201141952 第1表-1 矽烷化合物共聚物 環氧化合物 (質量部) 硬化劑 (質fi部) 矽烷耦合劑 (質量部) A:[(B)+ (C)+(D)] (質量比) 硬化性 組成比(莫耳» 組合物 種類 矽烷 化合物 矽烷 化合物 矽烷 化合物 矽烷 化合物 GlyTMS (質量部) B1 B2 BF1 C1 C2 D1 DF1 DF2 (la) (lb) (lc) (2) 實施例1 A1 30 - - 70 - 10 1.5 - - 0.375 0.75 0.375 - - 77:23 實施例2 2 A1 30 - - 70 - 10 - 1.5 - 0.375 0.75 0.375 - - 77:23 實施例3 3 A1 30 - - 70 - 10 1.5 - - - 0. 75 0.75 - - 77:23 實施例4 4 Λ2 40 - - 60 - 10 1.5 - - - 0.75 0.75 - - 77:23 實施例5 5 A3 20 - - 80 - ]〇 1.5 - - - 0.75 0.75 - - 77:23 實施例6 6 Λ1 30 - - 70 - 10 1.0 - - 0.25 0.5 0.25 - - 83:17 實施例7 7 A1 30 - - 70 - 10 2.0 - - 0.5 1.0 0.5 - - 71:29 比較例1 8 A1 30 - - 70 - 10 1.5 - - 0.75 0.75 - - - - 比較例2 9 A1 30 - - 70 - 10 1.5 - - 0.75 - 0.75 - - - 比較例3 10 A1 30 - - 70 - 10 - - 1.5 0.375 0.75 0.375 - - - 比較例4 11 A4 - - - 50 50 ]〇 1.5 - - 0.375 0.75 0.375 - - - 比較例5 12 A1 30 - - 70 - 10 1.5 - - 0.375 0. 75 - 0.375 - - 比較例6 13 A1 30 - - 70 - 10 1.5 - - 0.375 0.75 - - 0.375 - 矽烷化合物(la) : 3-乙醖氡基丙基三甲氧基矽烷 矽烷化合物(lb) : 3-氣丙基三甲氧基矽烷 矽烷化合物(lc) : 2-氱基以磯三甲氧基矽烷 矽烷化合物(2):苯基三甲氧基矽烷 第1表-2 矽烷化合物共聚物 環氣化合物 (ft 部) 硬^ (質1 匕劑 i部) 矽烷耦合劑 (質t部) A:[(B)+ (C)+(D)] (質量比) 硬化性 組成比(莫耳50 組合物 種類 矽烷 化合物 矽烷 化合物 矽烷 化合物 矽烷 化合物 GlyTMS (質量部) B1 B2 BF1 C1 C2 D1 DF1 DF2 (la) (lb) (lc) (2) 實施例8 14 A5 - 20 - 80 - 10 1.5 - - 0.38 0.75 0.38 - - 77:23 實施例9 15 A6 - 30 - 70 - 10 1.5 - - 0.38 0.75 0.38 - - 77:23 實施例10 16 Λ7 - 40 - 60 - 10 1.5 - - 0.38 0.75 0.38 - - 77:23 實施例11 17 Λ8 - 50 - 50 - 10 1.5 - - 0.38 0.75 0.38 - - 77:23 實施例12 18 A9 - - 20 80 - 10 1.5 - - 0.38 0.75 0.38 - - 77:23 實施例13 19 A10 - - 30 70 - 10 1.5 - 0.38 0.75 0.38 - - 77:23 實施例14 20 Λ11 - - 40 60 - 10 1.5 - - 0.38 0.75 0.38 - - 77:23 實施例15 21 Λ12 - - 50 50 - 10 1.5 - - 0.38 0.75 0.38 - - 77:23 比較例7 22 A6 - 30 - 70 - 10 1.5 - - 0.75 0.75 - - - - 比較例8 23 A6 - 30 - 70 - 10 1.5 - - 0.75 - 0.75 - - - 比較例9 24 A6 - 30 - 70 - 10 - - 1.5 0.375 0.75 0.375 - - - 比較例10 25 A6 - 30 - 70 - 10 1.5 - - 0.375 0.75 - 0.38 - - 比較例11 26 A6 - 30 - 70 - 10 1.5 - - 0.375 0.75 - - 0.38 - 比較例12 27 A10 - - 30 70 - 10 1.5 - - 0.75 0.75 - - - - 比較例13 28 A10 - - 30 70 - 10 1.5 - - 0.75 - 0.75 - - - 比較例14 29 A10 - - 30 70 - 10 - - 1.5 0.375 0.75 0.375 - - - 比較例15 30 A10 - - 30 70 - 10 1.5 - - 0.375 0.75 - 0.38 - - 比較例16 31 A10 - - 30 70 - 10 1.5 - - 0.375 0.75 - - 0.38 - 矽烷化合物(la) : 3-乙醖氧基丙基三甲氣基矽烷 矽烷化合物(lb) : 3-氣丙基三甲氧基矽烷 矽烷化合物(lc) : 2-氰基以磯三甲氣基矽烷 矽烷化合物(2):笨基三甲氧基矽烷 關於實施例1〜1 5及比較例1〜1 6所得之硬化性組合物Si-Ph: 70 0cm'1 &gt;742cm&quot;1&gt; Si-〇: ll33cm-', _cn: 2252cm'1 (Example 1) The decane compound copolymer (A1) obtained in Production Example 1 was 1 〇g, 1. 5 g of an epoxy compound having an isocyanurate skeleton (manufactured by Nissan Chemical Industries, Ltd., TEPIC-PAS B26, epoxy equivalent: 137 g/eq) (in the following paragraph: i Table-1, Table 1) It is described as "B1".) As an epoxy compound (β), 375. 375g 42 s 201141952 ' 4-methylcyclohexane-1,2-dicarboxylic anhydride (manufactured by Tokyo Chemical Industry Co., Ltd.) Table-1 and Table 1 are described as "C1".) and Cyclohexa-1,2,4-tricarboxylic acid-1,2-anhydride (manufactured by Mitsubishi Gas Chemical Co., Ltd.) (Table 1 below) -1, the first table 2 is described as "C2".) As the curing agent (c), and 0.375 g of 3-diethoxy schyl propyl sulphate (according to AZMAX) (below 1) and 1st table 2 are described as "D1".) As a decane coupling agent (D), the entire volume is sufficiently mixed and defoamed to obtain a curable composition (Examples 2 to 7). Table 1, Table 1, using a decane compound copolymer, an epoxy compound In the same manner as in Example 1, the curable compositions (2) to (7) were obtained in the same manner as in Example 1. Further, in the following Tables 1 and 1, Table 2, "B2" was used. An epoxy compound having an isocyanurate skeleton (TEPIC-PAS B22, epoxy equivalent i79 g/eq, manufactured by Nissan Chemical Industries, Ltd.) is shown. (Comparative Examples 1 and 2) The use of decane according to the following Table 1 - 丨 ' The compound copolymer 'epoxy compound, hardener, and decane coupling agent were obtained in the same manner as in Example , to obtain curable compositions (8) and (9). (Comparative Example 3) Example 1' Substituted epoxy As the compound (B), 3,4-epoxycyclohexylmethyl 3,4 epoxycyclohexylcarboxylate (manufactured by Sikma Aldrich Co., Ltd.) was used (see Table 1 below, Table 1 below) In the same manner as in Example 1, a curable composition (1〇) was obtained in the same manner as in Example 1. (Comparative Example 4) 43 201141952 In Example 1, the decane compound obtained in the production example was replaced. Copolymer (A1) 'The curable composition (丨丨) was obtained in the same manner as in Example 1 except that the decane compound copolymer (A4) obtained in Production Example 4 was used. (Comparative Example 5) In the example 1 'substituted decane coupling agent (D1), 3-glycerol propyl dimethoxy zeshi (manufactured by Tosei Kasei Co., Ltd.) was used (in Table 1 below, In the first table 2, § has been carried out as "DF1".) A curable composition (12) was obtained in the same manner as in Example 1 except for 375 g. (Comparative Example 6) 0.375 g of tetradecyl oleate (manufactured by Tokyo Chemical Industry Co., Ltd.) was used as the oxime coupling agent (D1) of Example 1 (described in Table 1 below, Table 1 below) In the same manner as in Example 1, except for "DF2".), a curable composition (13) was obtained. (Example 8) 10 g of the decane compound copolymer (A5) obtained in Production Example 5, and 1.5 g of an epoxy compound having an isocyanurate skeleton (manufactured by Nissan Chemical Industries, Ltd., TEPIC-PAS B26 'epoxy equivalent) !37g/eci) as a decane coupling agent (B), 0. 38 g of 4-methylcyclohexane-1,2-dicarboxylic anhydride (manufactured by Tokyo Chemical Industry Co., Ltd.) and 0·75 g of cyclohexane_1, 2, 4-tricarboxylic acid_1,2-anhydride (manufactured by Mitsubishi Gas Chemical Co., Ltd.) as a curing agent (C), and 38.38 g of 3-triethoxydecyl propyl sulphate anhydride (manufactured by AZMAX Co., Ltd.) as a decane couple In the mixture (D), the whole container is thoroughly mixed and 'defoamed' to obtain a curable composition (14). (Examples 9 to 15 and Comparative Examples 7 to 16) In the same manner as in the following Table 2-2', using a decane compound copolymer and epoxidation 44 201141952 Example 8, a compound, a curing agent, and an oxime The coupling agent is used to carry out the curable composition (15) ~ (31). 45 201141952 Table 1-1 decane compound copolymer epoxy compound (mass part) Hardener (mass fi part) 矽 耦合 coupling agent (mass part) A: [(B)+ (C)+(D)] (mass ratio Hardenability composition ratio (mole) Composition type decane compound decane compound decane compound decane compound GlyTMS (mass part) B1 B2 BF1 C1 C2 D1 DF1 DF2 (la) (lb) (lc) (2) Example 1 A1 30 - - 70 - 10 1.5 - - 0.375 0.75 0.375 - - 77:23 Example 2 2 A1 30 - - 70 - 10 - 1.5 - 0.375 0.75 0.375 - - 77:23 Example 3 3 A1 30 - - 70 - 10 1.5 - - - 0. 75 0.75 - - 77:23 Example 4 4 Λ 2 40 - - 60 - 10 1.5 - - - 0.75 0.75 - - 77:23 Example 5 5 A3 20 - - 80 - ]〇1.5 - - - 0.75 0.75 - - 77:23 Example 6 6 Λ1 30 - - 70 - 10 1.0 - - 0.25 0.5 0.25 - - 83:17 Example 7 7 A1 30 - - 70 - 10 2.0 - - 0.5 1.0 0.5 - - 71: 29 Comparative Example 1 8 A1 30 - - 70 - 10 1.5 - - 0.75 0.75 - - - - Comparative Example 2 9 A1 30 - - 70 - 10 1.5 - - 0.75 - 0.75 - - - Comparative Example 3 10 A1 30 - - 70 - 10 - - 1.5 0.375 0.75 0.375 - - - Comparative Example 4 11 A4 - - - 50 50 ]〇1.5 - - 0.375 0.75 0.375 - - - Comparative Example 5 12 A1 30 - - 70 - 10 1.5 - - 0.375 0. 75 - 0.375 - - Comparative Example 6 13 A1 30 - - 70 - 10 1.5 - - 0.375 0.75 - - 0.375 - decane compound (la) : 3-ethylmercaptopropyltrimethoxydecane decane compound (lb) : 3-cyclopropyltrimethoxydecane decane compound (lc) : 2-mercapto Isomethoxytrimethoxydecane compound (2): Phenyltrimethoxydecane, Table 1-2, decane compound copolymer, ring gas compound (ft part), hard ^ (quality 1 匕 i i矽 耦合 耦合 coupling agent (mass t part) A: [(B) + (C) + (D)] (mass ratio) Hardenability composition ratio (Mole 50 composition type decane compound decane compound decane compound decane compound GlyTMS ( Quality Department) B1 B2 BF1 C1 C2 D1 DF1 DF2 (la) (lb) (lc) (2) Example 8 14 A5 - 20 - 80 - 10 1.5 - - 0.38 0.75 0.38 - - 77:23 Example 9 15 A6 - 30 - 70 - 10 1.5 - - 0.38 0.75 0.38 - - 77:23 Example 10 16 Λ7 - 40 - 60 - 10 1.5 - - 0.38 0.75 0.38 - - 77:23 Example 11 17 Λ8 - 50 - 50 - 10 1.5 - - 0.38 0.75 0.38 - - 77:23 Example 12 18 A9 - - 20 80 - 10 1.5 - - 0.38 0.75 0.38 - - 77:23 Example 13 19 A10 - - 30 70 - 10 1.5 - 0.38 0.75 0.38 - - 77:23 Example 14 20 Λ11 - - 40 60 - 10 1.5 - - 0.38 0.75 0.38 - - 77:23 Example 15 21 Λ12 - - 50 50 - 10 1.5 - - 0.38 0.75 0.38 - - 77:23 Comparative Example 7 22 A6 - 30 - 70 - 10 1.5 - - 0.75 0.75 - - - - Comparative Example 8 23 A6 - 30 - 70 - 10 1.5 - - 0.75 - 0.75 - - - Comparative Example 9 24 A6 - 30 - 70 - 10 - - 1.5 0.375 0.75 0.375 - - - Comparative Example 10 25 A6 - 30 - 70 - 10 1.5 - - 0.375 0.75 - 0.38 - - Comparative Example 11 26 A6 - 30 - 70 - 10 1.5 - - 0.375 0.75 - - 0.38 - Comparative Example 12 27 A10 - - 30 70 - 10 1.5 - - 0.75 0.75 - - - - Comparative Example 13 28 A10 - - 30 70 - 10 1.5 - - 0.75 - 0.75 - - - Comparative Example 14 29 A10 - - 30 70 - 10 - - 1.5 0.375 0.75 0.375 - - - Comparative Example 15 30 A10 - - 30 70 - 10 1.5 - - 0.375 0.75 - 0.38 - - Comparative Example 16 31 A10 - - 30 70 - 10 1.5 - - 0.375 0.75 - - 0.38 - decane compound (la) : 3-ethoxypropyl propyl trimethoxide Alkane decane compound (lb): 3-cyclopropyltrimethoxydecane decane compound (lc): 2-cyanopyranosyl decane decane compound (2): Stupyl trimethoxy decane About Example 1~ 1 5 and the curable composition obtained in Comparative Examples 1 to 16

S 201141952 1〜31之硬化物’如下所述, 加熱後之穿透率。 將測定結果示於下述第 (接著力試驗) 測定接著力、初期穿透率、及 2表-1、第2表-2。 對 2mm 四方的伙H ,, 的石夕BB片的鏡面,塗佈硬化性組合物 &quot;卜使各個厚度約2 &quot; m ’將塗佈面載置於被著體(鍍銀 銅板)上壓接。之後,以丨啊加滅理2小時使之硬化得 到附有.式驗片之被著體。將該附有試驗片之被著體,放置 於預先加熱為既定溫度(例#饥、1〇。。〇之接著測試機 (Series 4000 ’ DAGE公司製)的測定台上放置3〇秒,由被 者體50“的高度的位置’以速度2〇〇&quot;m/s對接著面施以 艮平方法(剪斷方向)之應力,測定在於23t及10(TC之試 驗片與被著體之接著力N/2mm口。 (接著耐熱性) “於接著力試驗,於loot之接著力,係在於23t之接 耆力之50%以上時評估為「〇」,未滿5〇%時為「X」。 (初期穿透率之測定) 咖將硬化性組合物1〜31,分別灌入模具使之成長25mm、 寬2〇_、厚lmm ’以l40°C加熱6小時使之硬化,分別製 乍=驗片。對於所得試驗片,以分光光度計、島 製作所公司製),測定波長400nm、450nm之初期穿透率 (%)。 4牙处早 (初期透明性) 於初期穿透率測定’ 4〇〇nm的穿透率為8〇%以上評估為 47 201141952 〇」以上未滿80%為「△」,未滿70%為「χ」。 (加熱後之穿透率測定) 將測疋初期穿透率之各試驗片放入15〇乞之烘箱 J時再人,測疋波長40〇nm、450nm之穿透率(%)。將此 做為加熱後穿透率。 [耐熱性(加熱後透明性)]S 201141952 Hardened material of 1 to 31', as described below, the transmittance after heating. The measurement results are shown in the following (continuous force test), and the adhesion, initial penetration, and Table 2 and Table 2-2 were measured. For the mirror surface of the 2mm square gang H,, the Shi Xi BB piece, apply the hardening composition &quot; to make each coated thickness of about 2 &quot; m ' put the coated surface on the object (silver-plated copper plate) Crimp. After that, the cockroach was sterilized for 2 hours to harden it to obtain the object with the test piece. The object to which the test piece is attached is placed on a measuring stand preheated to a predetermined temperature (example #饥,1〇.. 接着 接着 测试 Series (Series 4000 'DAGE)) for 3 sec. The position of the height of the body 50" is measured by the speed 2〇〇&quot;m/s, and the stress of the flattening method (cutting direction) is measured at 23t and 10 (the test piece and the object of the TC) The force is N/2mm. (Continue to heat resistance) "In the case of the adhesion test, the adhesion force at the loot is evaluated as "〇" when it is 50% or more of the contact force of 23t, and when it is less than 5〇% "X". (Measurement of initial penetration rate) The curable compositions 1 to 31 were poured into a mold to grow 25 mm, width 2 〇, and thickness lmm 'heated at 40 ° C for 6 hours to harden.乍 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 初期 初期 初期 初期 初期 初期 初期 初期 初期 初期 初期 初期 初期 初期 初期 初期 初期 初期 初期 初期 初期 初期 初期 初期 初期 初期 初期 初期 初期 初期 初期 初期 4 4 4 4 4 4 Rate measurement 'The penetration rate of 4〇〇nm is 8〇% or more and is estimated to be 47 201141952 〇”. The above 80% is “△”, less than 70%. χ 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定). This is taken as the penetration rate after heating. [Heat resistance (transparency after heating)]

S 在於加熱後穿透率測定,4〇〇nm的穿透率,為初期穿 透率的80%以上評估為「〇」,7〇以上未滿8()%為「△」, 未滿70%為「X」。 第2表-1 硬化性 組合物 (f 接著力 Ί/2πιπ〇 ) 初期穿邊率 (%) 初期 透明性 加熱後穿透率 耐熱性 (加熱後 透明性) 23°C 100°C 接著 耐熱性 400nm 86 2 450nm QQ A - 400nm ) 450nm 實施例1 1 152.6 95.5 CT 實施例2 2 134.4 82.6 〇 88.6 0〇. 4 89.5 Ο 〇 ~ 83.0 — 〇〇 t\ 87.2 〇 !施例3 3 156.1 107.3 〇 85.9 87.7 〇 〇c. 9 〇〇 1 87.1 〇 實施例4 4 141.3 86.0 〇 [89^ 90.6 〇Γ7 i 〇 〇ώ. 1 ~82ΤΓ 87. 〇 〇 實施例5 5 162.2 101.1 〇 84 o 87.3 〇 實施例6 _實施例t 6 7 138.0 177.5 80.1 114.2 〇 ο 87.5 86 3 o7.1 89.3 Q7 o ό 〇 82.3 in-1 86.9 87.6 〇 〇 比較例1 比較例2 8 9 158.6 90.2 93.7 40.8 〇 X 60.1 87.9 0 i. o 71.3 89.4 ~8ΪΓ ~9〇1~ ~76ΓΓ ϋ X 〇 ~ο~~ &quot;~ο~~ X 82.2 58.3 87.1 70.3 〇 〇 比較例3 10 169.1 92.4 〇 83.T 81.9 -— - 52.7 87.5 〇— 比較例4 11 170.7 112.9 〇 88ΤΓ B7.8 ~6Q?T~ 65. 4 X ΙΣΙ Λ 比較例5 比皋交你丨fi 12 1Q 142.3 140 5 89.4 Q7 ^ 〇 r\ 69. Γ 1 0 O I . 0 65. 7 Γ73.6 X 64.4 72.9 L〇~ 48 201141952 第2表-2S is the transmittance after heating, and the transmittance at 4 〇〇 nm is estimated to be “〇” for 80% or more of the initial transmittance, and less than 8 ()% for 7〇 or more is “△”, less than 70 % is "X". Table 2-1 Curable composition (f follows force Ί/2πιπ〇) Initial edge ratio (%) Initial transparency, heat transmission, heat resistance (transparency after heating) 23°C, 100°C, heat resistance 400nm 86 2 450nm QQ A - 400nm ) 450nm Example 1 1 152.6 95.5 CT Example 2 2 134.4 82.6 〇88.6 0〇. 4 89.5 Ο 〇~ 83.0 — 〇〇t\ 87.2 〇! Example 3 3 156.1 107.3 〇85.9 87.7 〇〇c. 9 〇〇1 87.1 〇Example 4 4 141.3 86.0 〇[89^ 90.6 〇Γ7 i 〇〇ώ. 1 ~82ΤΓ 87. 〇〇Example 5 5 162.2 101.1 〇84 o 87.3 〇Example 6 _Example t 6 7 138.0 177.5 80.1 114.2 〇ο 87.5 86 3 o7.1 89.3 Q7 o ό 〇 82.3 in-1 86.9 87.6 〇〇Comparative Example 1 Comparative Example 2 8 9 158.6 90.2 93.7 40.8 〇X 60.1 87.9 0 i. o 71.3 89.4 ~8ΪΓ ~9〇1~ ~76ΓΓ ϋ X 〇~ο~~ &quot;~ο~~ X 82.2 58.3 87.1 70.3 〇〇Comparative Example 3 10 169.1 92.4 〇83.T 81.9 -- - 52.7 87.5 〇 Comparative Example 4 11 170.7 112.9 〇88ΤΓ B7.8 ~6Q?T~ 65. 4 X ΙΣΙ Λ Comparative Example 5 Comparison 丨fi 12 1Q 142.3 140 5 89.4 Q7 ^ 〇r\ 6 9. Γ 1 0 O I . 0 65. 7 Γ 73.6 X 64.4 72.9 L〇~ 48 201141952 Table 2-2

由第2表-1、第2表-2 ’實施例1 ~ 15之硬化物(1〜7、 14〜21)的硬化物,在於23〇c具有134N/2mm□以上的高接著 力’於尚溫(loot )’亦保持在於23。(:的接著力的58%以上 的接著力,接著耐熱性優良。此外,波長4〇〇nm、45〇nm之 初期穿透率、加熱後穿透率都很高,係初期透明性、耐熱 性(加熱後透明性)優良者。 另一方面,比較例1、5~7、10〜12 ' 15、16之硬化物 性組合物(8、12、13、22、25〜27、30、31)的硬化物,接 著耐熱性都較差。比較例2、8、13之硬化性組合物(9、23、 2 8)之硬化物’接者力、接著耐熱性均較差,比較例3、4、 9、14之硬化性組合物(1〇、11、24、29)之硬化物,耐熱 49 201141952 性(加熱後透明性)顯著地較差。 【圖式簡單說明】 無。 【主要元件符號說明】 無。The cured product of the cured materials (1 to 7, 14 to 21) of the second table-1 and the second table-2's 1 to 15 is that 23〇c has a high adhesion force of 134N/2 mm□ or more. The temperature (loot) also remains at 23. The adhesion force of 58% or more of the adhesion force is excellent in heat resistance. In addition, the initial transmittance at a wavelength of 4 〇〇 nm and 45 〇 nm and the transmittance after heating are high, and the initial transparency and heat resistance are high. The properties (transparency after heating) are excellent. On the other hand, the cured physical compositions of Comparative Examples 1, 5 to 7, 10 to 12' 15, 16 (8, 12, 13, 22, 25 to 27, 30, 31) The cured product was inferior in heat resistance. The cured products of the curable compositions (9, 23, and 28) of Comparative Examples 2, 8, and 13 were inferior in both the contact force and the heat resistance, and Comparative Examples 3 and 4. The hardened composition of the hardening composition (9, 14, 24, 29) of 9,14, heat resistance 49 201141952 (transparency after heating) is significantly inferior. [Simple description of the figure] None. [Main component symbol description 】 No.

50 S50 S

Claims (1)

201141952 七、申請專利範圍: 1 ·—種硬化性組合物,包含: (A)石夕烷化合物共聚物,於分子 及(i i Π辦_ 内,具有下式(i )、( i i) 及(⑴)心之反覆單位之中的(1)及(Η)、 (11)及0^)或(1)、(11)及〇1〇 111 ..., &lt;反覆早位’重量平均分 子篁為1,000〜30, 000 ; ⑻環氧化合物,具有異氰腺釀酯基骨架; (C)硬化劑’包含具有羧基之 酐;及 酐及其他的脂環酸 (D)矽烷偶合劑,具有酸酐構造. R\ . pH—χ°201141952 VII. Scope of application: 1 · A kind of hardening composition, comprising: (A) a copolymer of oxalate, in the numerator and (ii), having the following formulas (i), (ii) and (1) Among the repetitive units of the heart, (1) and (Η), (11) and 0^) or (1), (11) and 〇1〇111 ..., &lt;reverse early 'weight average molecules篁 is 1,000 to 30, 000; (8) epoxy compound having an isocyanate-based ester skeleton; (C) hardener 'containing an anhydride having a carboxyl group; and anhydride and other alicyclic acid (D) decane coupling agent With anhydride structure. R\ . pH-χ° (ί〇 (iii) 式中,R1係表示氫原子或碳數1〜6之烷基,X。係表示 齒素原子、氰基或以式:〇G表示之基,式中,G係表示羥 基之保護基’ D係表示單鍵結或連接基,R2係表示碳數卜2〇 之烧基或可具有取代基之苯基。 2·如申請專利範圍第1項所述的硬化性組合物,其中 上述(A)之矽烷化合物共聚物係以式:V-CHCD-D-表示之 51 201141952 &lt;存在量([R2])之莫耳比 5 · 9 5之石夕院化合物共聚 基之存在量([RLCIKXy-D])與R2 為,[R'-CHU。)-D] : [R2] = 60 : 40〜 物。 述的硬化性組合物, 的含有比例,以(A) [(B)+(C)+(D)]=90 : 3.如申請專利範圍第1或2項戶斤 其中上述(A)、(B)、(C)、及(D)成分 與[(3) + (〇 + 〇)]之質量比,以(^): 10 〜5 0 : 5 0。 4.—種硬化性組合物,包含: (A’ )碎烷化合物共聚物,其係將包含以式(i): r1_ch (X°)-D-Si(OR3)p(Xi)3_p所示之矽烷化合物(ι)之至少一 種,及 式(2) : R2Si(〇R4)q(X2)h所示之矽烷化合物(2)之至少 一種之矽烷化合物之混合物縮合而得,重量平均分子量為 1,〇〇〇〜30, 〇〇〇 ; (B)環氧化合物,其具有異氰脲酸酯基骨架的; (c)更化劑,其包含具有缓基之脂環酸奸及其他的脂環 酸酐;及 ' 夕院偶合劑,其具有酸酐構造之: 式中,R係表示氫原子或碳數卜6之烷基,χ。係表示 齒素原子、氰基或以式:QG㈣之基,式中,G係表示經 基之保護《’ D係表示單鍵結或連接基,r3係表示碳數卜6 之烧基’χ1係表示_素原子,P係Η之整數;R2係表示碳 數卜20之烷基或可具有取代基之苯基,R4係表示碳數^ 之烧基’ χ2係表示i素原子’ q係表示0〜3之整數。 S 52 201141952 5.如申請專利範圍第4項所述的硬化性組合物,其中 上述(A )之碎院化合物共聚物係將梦烧化合物(1 )與^夕炫 化合物(2)以莫耳比,[矽烷化合物(1)]:[矽烷化合物 (2)] = 60 : 40〜5 : 95之比例縮合而得者。 6 ·如申請專利範圍第4或5項所述的硬化性組合物, 其中上述(A,)、(B)、(c)、及(D)成分的含有比例,以(A,) 與[(B) + (C) + (D)]之質量比,以(A, ): [(B) + (C) + (D)] = 90 : 1〇〜50 : 50 。 7.如申請專利範圍第1或4項所述的硬化性組合物, 其中上述、(c)、及(D)成分的含有比例’以[(B) + (c)] 與(D)之質量比’以[(B) + (C)] : (D) = 90 : HM0 : 90。 8·如申請專利範圍第1或4項所述的硬化性組合物, 其中上述(C)之硬化物係選自由具有羧基之脂環酸酐及其 他的知環酸酐之一種或兩種以上所組成,其質量比為(具有 幾基之脂環酸酐):(其他的脂環酸酐)=1〇〇 : 〇〜1〇 : 9〇。 9 ·如申明專利範圍第1或4項所述的硬化性組合物, 其係光元件固定材用組合物。 1 0. —種硬化物,其係硬化申請專利範圍第i或4項所 述的硬化性組合物而成。 11. 如申請專利範圍帛1G項所述的硬化物,其係光元 件固定材。 12. 種方法,使用申請專利範圍第丨或4項所述的硬 化性組合物,作為光元件固定材用接著劑。 13 ·種方法,使用申請專利範圍帛1或4項所述的硬 53 201141952 化性組合物,作為光元件固定材用封裝劑。 54 S 201141952 四、指定代表圖: (一) 本案指定代表圖為:無。 (二) 本代表圖之元件符號簡單說明:無。 徵的化學式: 五、本案若有化學式時,請揭示最能顯示發明特 無0 六、發明說明: 【發明所屬之技術領域】 本發明係關於可得透明性及耐熱性優声 Ά ^ &gt; 又且具有高的 接者力之硬化物之硬化性組合物,硬化該組合物而成石 化物,以及使用上述組合物作為光元件 口疋材用接著劑或 光元件固定用封裝材之方法。 【先前技術】 先前’硬化性組合物’依照用途做了各式各樣的改良 而在產業上廣泛地利用於作為光學零件或原形體之原料 _、塗層劑等。例如’形成透明性優良的硬化物之; 性組合物,作為光學零件的原料,或其塗層劑,此外 形成具有高接著力的硬化物之硬化性組合物,可良好㈣ 於作為接著劑或塗層劑。 _此外’近年來’硬化性組合物,錢制作為製造另 ί裝料,作為光兀件固定材用接著劑或光元件固笼 用封裝劑等的光元件固定材用組合物。(iii) wherein R1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and X represents a dentate atom, a cyano group or a group represented by the formula: 〇G, wherein the G system represents The protecting group of the hydroxyl group 'D means a single bond or a linking group, and R2 means a phenyl group of a carbon number or a phenyl group which may have a substituent. 2. The sclerosing combination as described in claim 1 And the decane compound copolymer of the above (A) is represented by the formula: V-CHCD-D- 51 201141952 &lt;the amount of ([R2]) molar ratio 5 · 9.5 of the stone compound compound copolymer The amount of existence ([RLCIKXy-D]) and R2 is, [R'-CHU.)-D]: [R2] = 60: 40~. The content ratio of the hardenable composition is as follows: (A) [(B) + (C) + (D)] = 90: 3. As in the scope of claim 1 or 2, the above (A), The mass ratio of (B), (C), and (D) components to [(3) + (〇+ 〇)], with (^): 10 〜 5 0 : 5 0. 4. A hardenable composition comprising: (A') a crushed alkyl compound copolymer, which is comprised of formula (i): r1_ch (X°)-D-Si(OR3)p(Xi)3_p And a mixture of at least one of the decane compound (1) and a mixture of the decane compounds of at least one of the decane compound (2) represented by R2Si(〇R4)q(X2)h, wherein the weight average molecular weight is 1, 〇〇〇~30, 〇〇〇; (B) an epoxy compound having an isocyanurate-based skeleton; (c) a modifier comprising an alicyclic sorghum having a slow base and the like An alicyclic acid anhydride; and a ceremonial coupling agent having an acid anhydride structure: wherein R represents a hydrogen atom or an alkyl group of carbon number 6, hydrazine. The system represents a dentate atom, a cyano group or a group of the formula: QG (d), wherein the G system represents the protection of the radical group "'D represents a single bond or a linker, and the r3 system represents a burnt group of carbon number 6'" The system represents an atomic atom, and the P system is an integer of Η; R2 represents an alkyl group having a carbon number of 20 or a phenyl group which may have a substituent, and R4 represents a carbon number of the alkyl group. Indicates an integer from 0 to 3. 5. The sclerosing composition according to claim 4, wherein the compound of the above-mentioned (A) is a compound of the compound of the compound (1) and the compound of the compound (2) Ratio, [decane compound (1)]: [decane compound (2)] = 60: 40~5: 95 ratio of condensation. 6. The curable composition according to claim 4, wherein the ratio of the components (A,), (B), (c), and (D) is (A,) and [ (B) + (C) + (D)] mass ratio to (A, ): [(B) + (C) + (D)] = 90 : 1〇~50 : 50 . 7. The curable composition according to claim 1 or 4, wherein the content ratio of the above components (c), (D) and (D) is [(B) + (c)] and (D) Mass ratio 'with [(B) + (C)] : (D) = 90 : HM0 : 90. The curable composition according to claim 1 or 4, wherein the hardened material of the above (C) is selected from the group consisting of one or more selected from the group consisting of an alicyclic acid anhydride having a carboxyl group and another known cyclic acid anhydride. , the mass ratio is (having a few groups of alicyclic anhydride): (other alicyclic anhydride) = 1 〇〇: 〇 ~ 1 〇: 9 〇. The curable composition according to claim 1 or 4, which is a composition for an optical element fixing material. 1 0. A cured product obtained by hardening a hardenable composition as described in claim i or 4 of the patent application. 11. A cured material as claimed in claim 1G, which is an optical component fixing material. 12. A method of using the hardening composition according to claim 4 or 4 as an adhesive for an optical element fixing material. 13. A method of using the hard 53 201141952 chemical composition described in claim 1 or 4 as an encapsulant for an optical element fixing material. 54 S 201141952 IV. Designated representative map: (1) The representative representative of the case is: None. (2) A brief description of the symbol of the representative figure: None. The chemical formula of the levy: 5. If there is a chemical formula in this case, please reveal the best indication of the invention. VI. Description of the invention: [Technical field of the invention] The present invention relates to transparency and heat resistance which can be obtained. Further, a curable composition having a cured product having a high contact force, a composition obtained by curing the composition into a petrochemical material, and a method of using the above composition as an adhesive for an optical element or a mouth material or a package for fixing an optical element. [Prior Art] The conventional 'curable composition' has been variously modified according to the use, and is widely used in the industry as a raw material for an optical component or a prototype, a coating agent, and the like. For example, 'the formation of a cured product excellent in transparency; a composition as a raw material of an optical component, or a coating agent thereof, and a curable composition which forms a cured product having a high adhesion, which is good (d) as an adhesive or Coating agent. In addition, the 'curable composition of the present invention' is a composition for an optical element fixing material such as an adhesive for an optical element fixing material or an encapsulating agent for an optical element cage.
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