TWI437030B - Method for manufacturing siloxane containing reactive group - Google Patents
Method for manufacturing siloxane containing reactive group Download PDFInfo
- Publication number
- TWI437030B TWI437030B TW098129209A TW98129209A TWI437030B TW I437030 B TWI437030 B TW I437030B TW 098129209 A TW098129209 A TW 098129209A TW 98129209 A TW98129209 A TW 98129209A TW I437030 B TWI437030 B TW I437030B
- Authority
- TW
- Taiwan
- Prior art keywords
- group
- compound
- reactive functional
- functional group
- formula
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims description 52
- 238000000034 method Methods 0.000 title description 20
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 title 1
- -1 aziridine compound Chemical class 0.000 claims description 178
- 150000001875 compounds Chemical class 0.000 claims description 160
- 238000006243 chemical reaction Methods 0.000 claims description 137
- 125000000524 functional group Chemical group 0.000 claims description 99
- 125000003545 alkoxy group Chemical group 0.000 claims description 76
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 61
- 239000003921 oil Substances 0.000 claims description 60
- 125000004432 carbon atom Chemical group C* 0.000 claims description 55
- DIOQZVSQGTUSAI-UHFFFAOYSA-N n-butylhexane Natural products CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 claims description 45
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 37
- 125000003700 epoxy group Chemical group 0.000 claims description 35
- 229930182558 Sterol Natural products 0.000 claims description 34
- 150000003432 sterols Chemical class 0.000 claims description 34
- 235000003702 sterols Nutrition 0.000 claims description 34
- 125000000217 alkyl group Chemical group 0.000 claims description 26
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 25
- 239000003054 catalyst Substances 0.000 claims description 23
- 229920002098 polyfluorene Polymers 0.000 claims description 21
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 16
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical group CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 claims description 16
- 125000003118 aryl group Chemical group 0.000 claims description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 13
- 125000003342 alkenyl group Chemical group 0.000 claims description 13
- 238000006482 condensation reaction Methods 0.000 claims description 11
- 229910052799 carbon Inorganic materials 0.000 claims description 10
- 239000012295 chemical reaction liquid Substances 0.000 claims description 10
- 125000006165 cyclic alkyl group Chemical group 0.000 claims description 10
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 7
- BBWFBBVQVRYACB-UHFFFAOYSA-N C1(CC2C(CC1)O2)CCC(C(OCC)(OCC)OCC)CCCCCCCC Chemical compound C1(CC2C(CC1)O2)CCC(C(OCC)(OCC)OCC)CCCCCCCC BBWFBBVQVRYACB-UHFFFAOYSA-N 0.000 claims description 5
- 238000005580 one pot reaction Methods 0.000 claims description 5
- ANBBCZAIOXDZPV-UHFFFAOYSA-N 1,1,1-trimethoxy-2-methyldecane Chemical compound CC(C(OC)(OC)OC)CCCCCCCC ANBBCZAIOXDZPV-UHFFFAOYSA-N 0.000 claims description 4
- 239000007795 chemical reaction product Substances 0.000 claims description 4
- WMAZOIVUIWQRKU-UHFFFAOYSA-N C1(=CC=CC=C1)C(C(OCC)(OCC)OCC)CCCCCCCC Chemical compound C1(=CC=CC=C1)C(C(OCC)(OCC)OCC)CCCCCCCC WMAZOIVUIWQRKU-UHFFFAOYSA-N 0.000 claims description 3
- 125000003544 oxime group Chemical group 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 3
- RJCRUVXAWQRZKQ-UHFFFAOYSA-N oxosilicon;silicon Chemical compound [Si].[Si]=O RJCRUVXAWQRZKQ-UHFFFAOYSA-N 0.000 claims 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims 3
- 229920005591 polysilicon Polymers 0.000 claims 3
- 229910052710 silicon Inorganic materials 0.000 claims 3
- 239000010703 silicon Substances 0.000 claims 3
- CWZQYRJRRHYJOI-UHFFFAOYSA-N 1,1,1-trimethoxydecane Chemical compound CCCCCCCCCC(OC)(OC)OC CWZQYRJRRHYJOI-UHFFFAOYSA-N 0.000 claims 1
- LOLANUHFGPZTLQ-UHFFFAOYSA-N 1-ethoxydecane Chemical compound CCCCCCCCCCOCC LOLANUHFGPZTLQ-UHFFFAOYSA-N 0.000 claims 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 102
- 239000000203 mixture Substances 0.000 description 65
- 239000003822 epoxy resin Substances 0.000 description 57
- 229920000647 polyepoxide Polymers 0.000 description 57
- 239000011342 resin composition Substances 0.000 description 55
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 46
- 239000000047 product Substances 0.000 description 40
- 239000000243 solution Substances 0.000 description 37
- 238000005227 gel permeation chromatography Methods 0.000 description 31
- 230000000052 comparative effect Effects 0.000 description 30
- 239000004848 polyfunctional curative Substances 0.000 description 29
- 239000002904 solvent Substances 0.000 description 29
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 28
- 125000002328 sterol group Chemical group 0.000 description 28
- 238000012360 testing method Methods 0.000 description 26
- 230000003287 optical effect Effects 0.000 description 24
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 22
- 239000004065 semiconductor Substances 0.000 description 22
- 238000009833 condensation Methods 0.000 description 21
- 230000005494 condensation Effects 0.000 description 21
- 239000007788 liquid Substances 0.000 description 20
- 239000005011 phenolic resin Substances 0.000 description 20
- 150000002989 phenols Chemical class 0.000 description 20
- 239000004593 Epoxy Chemical group 0.000 description 19
- 238000010992 reflux Methods 0.000 description 19
- VPLKXGORNUYFBO-UHFFFAOYSA-N C1(CC2C(CC1)O2)CCC(C(OC)(OC)OC)CCCCCCCC Chemical compound C1(CC2C(CC1)O2)CCC(C(OC)(OC)OC)CCCCCCCC VPLKXGORNUYFBO-UHFFFAOYSA-N 0.000 description 18
- 230000007062 hydrolysis Effects 0.000 description 18
- 238000006460 hydrolysis reaction Methods 0.000 description 18
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 17
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 17
- 235000019799 monosodium phosphate Nutrition 0.000 description 17
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 16
- 229910000403 monosodium phosphate Inorganic materials 0.000 description 16
- 239000002994 raw material Substances 0.000 description 16
- 229920005989 resin Polymers 0.000 description 16
- 239000011347 resin Substances 0.000 description 16
- AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical compound [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 description 16
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical group [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 15
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 15
- 239000000126 substance Substances 0.000 description 15
- 238000005406 washing Methods 0.000 description 15
- 239000012153 distilled water Substances 0.000 description 14
- 239000012074 organic phase Substances 0.000 description 14
- 229920001568 phenolic resin Polymers 0.000 description 14
- 229930004725 sesquiterpene Natural products 0.000 description 14
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 13
- 239000003795 chemical substances by application Substances 0.000 description 13
- 239000003566 sealing material Substances 0.000 description 13
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 12
- 229920002675 Polyoxyl Polymers 0.000 description 12
- 150000004354 sesquiterpene derivatives Chemical class 0.000 description 12
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 11
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 11
- 239000002253 acid Substances 0.000 description 11
- 230000015572 biosynthetic process Effects 0.000 description 11
- 235000013824 polyphenols Nutrition 0.000 description 11
- CASUWPDYGGAUQV-UHFFFAOYSA-M potassium;methanol;hydroxide Chemical compound [OH-].[K+].OC CASUWPDYGGAUQV-UHFFFAOYSA-M 0.000 description 11
- 239000003463 adsorbent Substances 0.000 description 10
- 239000002585 base Substances 0.000 description 10
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 10
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 10
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 125000002723 alicyclic group Chemical group 0.000 description 9
- 239000003963 antioxidant agent Substances 0.000 description 9
- 235000006708 antioxidants Nutrition 0.000 description 9
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical group [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 9
- 239000000314 lubricant Substances 0.000 description 9
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 8
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 8
- 238000003786 synthesis reaction Methods 0.000 description 8
- 239000007822 coupling agent Substances 0.000 description 7
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- JSGRIFNBTXDZQU-UHFFFAOYSA-N C1(=CC=CC=C1)C(C(OC)(OC)OC)CCCCCCCC Chemical compound C1(=CC=CC=C1)C(C(OC)(OC)OC)CCCCCCCC JSGRIFNBTXDZQU-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 6
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Natural products C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 6
- 230000003078 antioxidant effect Effects 0.000 description 6
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- IXQGCWUGDFDQMF-UHFFFAOYSA-N o-Hydroxyethylbenzene Natural products CCC1=CC=CC=C1O IXQGCWUGDFDQMF-UHFFFAOYSA-N 0.000 description 6
- 230000035515 penetration Effects 0.000 description 6
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 5
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 5
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 5
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 5
- 125000000753 cycloalkyl group Chemical group 0.000 description 5
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 238000005286 illumination Methods 0.000 description 5
- 238000006386 neutralization reaction Methods 0.000 description 5
- 239000012071 phase Substances 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- GCZWJRLXIPVNLU-UHFFFAOYSA-N 2,2-dimethoxy-3-methylundecane Chemical compound CC(C(OC)(OC)C)CCCCCCCC GCZWJRLXIPVNLU-UHFFFAOYSA-N 0.000 description 4
- MFAWEYJGIGIYFH-UHFFFAOYSA-N 2-[4-(trimethoxymethyl)dodecoxymethyl]oxirane Chemical compound C(C1CO1)OCCCC(C(OC)(OC)OC)CCCCCCCC MFAWEYJGIGIYFH-UHFFFAOYSA-N 0.000 description 4
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- FFOPEPMHKILNIT-UHFFFAOYSA-N Isopropyl butyrate Chemical compound CCCC(=O)OC(C)C FFOPEPMHKILNIT-UHFFFAOYSA-N 0.000 description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 239000007983 Tris buffer Substances 0.000 description 4
- 150000008065 acid anhydrides Chemical class 0.000 description 4
- 150000001335 aliphatic alkanes Chemical class 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical compound C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 4
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 4
- 229930003836 cresol Natural products 0.000 description 4
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 4
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 4
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 4
- OAKJQQAXSVQMHS-UHFFFAOYSA-N hydrazine group Chemical group NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 4
- 230000003301 hydrolyzing effect Effects 0.000 description 4
- VKOBVWXKNCXXDE-UHFFFAOYSA-N icosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCC(O)=O VKOBVWXKNCXXDE-UHFFFAOYSA-N 0.000 description 4
- 150000007529 inorganic bases Chemical class 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 4
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 4
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 4
- FWHUTKPMCKSUCV-UHFFFAOYSA-N 1,3-dioxo-3a,4,5,6,7,7a-hexahydro-2-benzofuran-5-carboxylic acid Chemical compound C1C(C(=O)O)CCC2C(=O)OC(=O)C12 FWHUTKPMCKSUCV-UHFFFAOYSA-N 0.000 description 3
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 3
- 229910052684 Cerium Inorganic materials 0.000 description 3
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 3
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 229910019142 PO4 Inorganic materials 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- 125000005577 anthracene group Chemical group 0.000 description 3
- 235000010290 biphenyl Nutrition 0.000 description 3
- 239000004305 biphenyl Substances 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 235000014113 dietary fatty acids Nutrition 0.000 description 3
- 239000008393 encapsulating agent Substances 0.000 description 3
- 239000000194 fatty acid Substances 0.000 description 3
- 229930195729 fatty acid Natural products 0.000 description 3
- 238000005187 foaming Methods 0.000 description 3
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 3
- 125000000623 heterocyclic group Chemical group 0.000 description 3
- 150000004678 hydrides Chemical class 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 150000002430 hydrocarbons Chemical class 0.000 description 3
- 150000002460 imidazoles Chemical class 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- 239000004611 light stabiliser Substances 0.000 description 3
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 150000004780 naphthols Chemical class 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 3
- 150000007530 organic bases Chemical class 0.000 description 3
- 235000006408 oxalic acid Nutrition 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 125000004430 oxygen atom Chemical group O* 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000000746 purification Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 229910052707 ruthenium Inorganic materials 0.000 description 3
- 229910052717 sulfur Inorganic materials 0.000 description 3
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- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 229910000406 trisodium phosphate Inorganic materials 0.000 description 1
- 235000019801 trisodium phosphate Nutrition 0.000 description 1
- 235000013799 ultramarine blue Nutrition 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N urea group Chemical group NC(=O)N XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Chemical class 0.000 description 1
- NDKWCCLKSWNDBG-UHFFFAOYSA-N zinc;dioxido(dioxo)chromium Chemical compound [Zn+2].[O-][Cr]([O-])(=O)=O NDKWCCLKSWNDBG-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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Description
本發明係有關含反應性官能基之新穎矽氧烷化合物、其製造方法以及其組成物。更詳言之,係有關透明性、耐光性、低溫下之低彈性率特性優異之光半導體用硬化性樹脂組成物;以及經由該硬化物密封之光半導體元件。The present invention relates to a novel oxoxane compound containing a reactive functional group, a process for producing the same, and a composition thereof. More specifically, it is a curable resin composition for an optical semiconductor which is excellent in transparency, light resistance, and low modulus of elasticity at a low temperature, and an optical semiconductor element sealed by the cured product.
已往,作為LED等之光半導體元件的密封材料,以性能與經濟性平衡之觀點而採用環氧樹脂。特別是廣泛地使用耐熱性、透明性以及機械特性之平衡優異的雙酚A型環氧樹脂以及脂環式環氧樹脂等。In the past, epoxy resin has been used as a sealing material for optical semiconductor elements such as LEDs in terms of balance between performance and economy. In particular, a bisphenol A type epoxy resin and an alicyclic epoxy resin which are excellent in heat resistance, transparency, and mechanical properties are widely used.
近年來,對於LED發光波長之短波化(360nm至480nm)與發光強度之提昇的進展結果,而指出因光的影響使得上述密封材料著色而最後使LED之特性降低。In recent years, as a result of the progress of the short-wavelength (360 nm to 480 nm) of the LED light-emitting wavelength and the improvement of the light-emitting intensity, it has been pointed out that the above-mentioned sealing material is colored by the influence of light, and finally the characteristics of the LED are lowered.
其中,在避免因光而使密封材料著色之目的下,進行了聚矽氧樹脂之檢討。然而,相較於環氧樹脂,聚矽氧樹脂之機械特性、接著性較差,因而僅能選擇凝膠狀態的密封型態。因此,市面上指出有「密封後,產生表面發黏或變形」之問題。Among them, the review of the polyoxyxene resin was carried out for the purpose of avoiding coloring of the sealing material by light. However, the mechanical properties and adhesion of the polyoxyxene resin are inferior to those of the epoxy resin, so that only the sealed state of the gel state can be selected. Therefore, the market has pointed out that there is a problem that the surface is sticky or deformed after sealing.
為了改善上述環氧樹脂之耐久性、尤其是上述聚矽氧樹脂之發黏性等,在專利文獻1中,係將含環氧基之矽烷化合物與不含環氧基之矽烷化合物,在有機溶劑、有機鹼以及水的存在下進行加熱,得到重量平均分子量為500至100萬之聚有機矽氧烷。以耐光性之觀點,該聚有機矽氧烷高於以往之環氧樹脂。而且,相對於2官能烷氧矽烷化合物,藉由3官能烷氧矽烷化合物之導入量增多而改善發黏性與硬度。然而,為了表面發黏性以及變形之改善,在增加硬化物之硬度下,卻提高特別是低溫領域(-30℃以下之程度)之彈性率。其結果,在熱循環試驗中,將引起低溫(-30℃以下)之低彈性率特性低劣。In order to improve the durability of the above epoxy resin, particularly the tackiness of the above polyoxyxylene resin, Patent Document 1 discloses an epoxy group-containing decane compound and an epoxy group-free decane compound in an organic Heating is carried out in the presence of a solvent, an organic base and water to obtain a polyorganosiloxane having a weight average molecular weight of 500 to 1,000,000. From the viewpoint of light resistance, the polyorganosiloxane is higher than conventional epoxy resins. Further, with respect to the bifunctional alkoxysilane compound, the amount of introduction of the trifunctional alkoxysilane compound is increased to improve tackiness and hardness. However, in order to improve the surface tackiness and deformation, the elastic modulus of the hardened material is increased, particularly in the low temperature range (below -30 ° C). As a result, in the heat cycle test, low elastic modulus characteristics at low temperatures (-30 ° C or lower) were caused to be inferior.
密封劑硬化物即使在低溫中仍為低彈性率者係光半導體密封劑中的重要特性之一,而對此之改善成為重要課題。The sealant cured product is one of the important characteristics in the optical semiconductor encapsulant even in the low-temperature ratio, and this improvement has become an important issue.
[專利文獻1]日本再公表專利WO2005/100445號公報[Patent Document 1] Japanese Re-publication Patent WO2005/100445
本發明之目的係提供一種矽氧烷化合物、使用該化合物之硬化性樹脂組成物,以及使用該硬化性樹脂組成物作為密封材料之光半導體元件者,其中,矽氧烷化合物係作為LED密封材料且耐光性與低溫下之低彈性率並存之具有反應性官能基的新穎化合物。An object of the present invention is to provide a siloxane compound, a curable resin composition using the same, and an optical semiconductor element using the curable resin composition as a sealing material, wherein a siloxane compound is used as an LED sealing material. And a novel compound having a reactive functional group which is compatible with light resistance and low modulus at low temperature.
本發明者等為解決上述課題而專心致志進行研究之結果發現,由含下述通式(2)所示具有矽醇末端之聚矽氧油(矽化合物)與含環氧基之具有反應性官能基的三烷氧基矽烷化合物(矽化合物)反應而得的具有鏈狀聚矽氧鏈段與三 烷氧基矽烷的水解縮合鏈段之含反應性官能基的矽氧烷化合物,可用以解決上述之課題。亦即,含有該矽氧烷化合物之硬化性樹脂組成物係滿足上述課題之物。而且,進一步發現,該矽氧烷化合物可經2階段之反應而有效地合成。由其結果遂而完成本發明。As a result of intensive research to solve the above problems, the inventors of the present invention have found that a polyfluorene-containing oil (anthracene compound) having a sterol end group represented by the following formula (2) and a reactive functional group containing an epoxy group are found. a chain-like polyoxyl segment and three obtained by reacting a trialkoxyalkane compound (anthracene compound) The reactive functional group-containing oxoxane compound of the hydrolyzed condensed segment of the alkoxydecane can be used to solve the above problems. In other words, the curable resin composition containing the siloxane compound is one that satisfies the above problems. Moreover, it has been further found that the decane compound can be efficiently synthesized by a two-stage reaction. The present invention has been completed by the results thereof.
而且,如上述所知者,本發明之矽氧烷化合物係由鏈狀聚矽氧鏈段與烷氧矽烷之水解縮合鏈段(以倍半矽氧烷(silsesquioxane)鏈段為佳)所成的低聚物(聚合物),且至少一部分之該水解縮合鏈段含有至少一個含環氧基之反應性官能基。Further, as described above, the oxoxane compound of the present invention is formed by a hydrolyzed condensed segment of a chain polyoxyxene segment and an alkoxysilane (preferably a silsesquioxane segment). An oligomer (polymer), and at least a portion of the hydrolyzed condensed segment contains at least one reactive functional group containing an epoxy group.
本發明之記載如下。The description of the present invention is as follows.
亦即,本發明係有關下述者。That is, the present invention relates to the following.
[1]一種含反應性官能基之矽氧烷化合物,係具有鏈狀聚矽氧鏈段,與具有選自含環氧基之反應性官能基、甲基以及苯基所成組群之基的三(C1-C10)烷氧基矽烷之水解縮合鏈段的嵌段型矽氧烷低聚物,且至少一部分之水解縮合鏈段係含有至少一個含環氧基之反應性官能基的鏈段者。[1] A reactive functional group-containing oxoxane compound having a chain polyoxynitride segment and a group having a reactive functional group selected from an epoxy group-containing reactive group, a methyl group, and a phenyl group; a block type oxane oligomer of a hydrolyzed condensed segment of a tri(C1-C10) alkoxydecane, and at least a portion of the hydrolyzed condensed segment is a chain containing at least one reactive functional group containing an epoxy group Paragraph.
[2]如上述[1]所記載之含反應性官能基之矽氧烷化合物,其中,水解縮合鏈段係倍半矽氧烷鏈段。[2] The hydroxyl group-containing compound having a reactive functional group according to the above [1], wherein the hydrolyzed condensed segment is a sesquioxane chain segment.
[3]如上述[1]或[2]所記載之含反應性官能基之矽氧烷化合物,其係經由下述之兩階段反應而得,第1階段反應係使通式(2)所示矽醇末端聚矽氧油(b)與通式(1)所示烷氧矽烷化合物(a),在相對於矽醇末端聚矽氧油(b)之矽醇基1當量,烷氧矽烷化合物之烷氧當量為1.5至200當量之
範圍內反應並縮合,其後進行之第2階段反應係將水添加在所得反應液中,使剩餘的烷氧基水解‧縮合;
[4]如上述[3]所記載之含反應性官能基之矽氧烷化合物,其中,m為2至200。[4] The reactive functional group-containing oxoxane compound according to [3] above, wherein m is from 2 to 200.
[5]如上述[1]所記載之含反應性官能基之矽氧烷化合物,其係經由下述之兩階段反應而得,第1階段反應係使通式(2)所示矽醇末端聚矽氧油(b),與通式(1)所示烷氧矽烷化合物(a)以及通式(3)所示烷氧矽烷化合物(c)兩者,在相對於矽醇末端聚矽氧油(b)之矽醇基1當量,烷氧矽烷化合物(a)以及(c)之烷氧基總當量為1.5至200當量之範圍內反應並縮合,其後進行之第2階段反應係將水添加在所得反應液中,使剩餘的烷氧基水解‧縮合;
[6]如上述[3]至[5]中任一項所記載之含反應性官能基之矽氧烷化合物,其中,通式(2)之R3 各自獨立,表示甲基或苯基;通式(1)之R2 各自獨立,表示甲基或乙基;通式(3)之R2 可與通式(1)之R2 相同或相異,係各自獨立,表示甲基或乙基。[6] The reactive functional group-containing oxirane compound according to any one of the above [3], wherein R 3 of the formula (2) is independently a methyl group or a phenyl group; R 2 of the formula (1) is independently represented by a methyl group or an ethyl group; R 2 of the formula (3) may be the same as or different from R 2 of the formula (1), and each independently represents a methyl group or a base.
[7]如上述[3]至[6]中任一項所記載之含反應性官能基之矽氧烷化合物,其中,通式(1)之X為環氧基環己基乙基。[7] The reactive functional group-containing oxirane compound according to any one of [3] to [6] wherein X of the formula (1) is an epoxycyclohexylethyl group.
[8]如上述[3]至[6]中任一項所記載之含反應性官能基之矽氧烷化合物,其中,通式(2)之矽醇末端聚矽氧油(b)之重量平均分子量(Mw)為300至18000。[8] The reactive functional group-containing oxirane compound according to any one of the above [3] to [6] wherein the weight of the sterol terminal polyfluorene oxide (b) of the formula (2) The average molecular weight (Mw) is from 300 to 18,000.
[9]如上述[1]至[8]中任一項所記載之含反應性官能基之矽氧烷化合物,其中,重量平均分子量(Mw)為800至20000。[9] The reactive functional group-containing oxirane compound according to any one of [1] to [8] wherein the weight average molecular weight (Mw) is from 800 to 20,000.
[10]如上述[1]或[2]所記載之含反應性官能基之矽氧烷化合物,其中,鏈狀聚矽氧鏈段中之聚矽氧上的取代基為甲基或苯基之任一者或兩者。[10] The reactive functional group-containing oxoxane compound according to [1] or [2] above, wherein the substituent on the polyfluorene oxide in the chain polyoxynoxy segment is a methyl group or a phenyl group. Either or both.
[11]如上述[1]或[10]所記載之含反應性官能基之矽氧烷化合物,其中,倍半矽氧烷鏈段中之具有環氧基的反應性官能基係含有環氧基環己基者。[11] The reactive functional group-containing oxoxane compound according to the above [1] or [10] wherein the reactive functional group having an epoxy group in the sesquiterpene oxide chain contains an epoxy group. Base ring base.
[12]一種含反應性官能基之矽氧烷化合物的製造方法,其特徵為:第1階段反應係使通式(2)所示矽醇末端聚矽氧油(b),與通式(1)所示烷氧矽烷化合物(a),在相對於矽醇末端聚矽氧油(b)之矽醇基1當量,烷氧矽烷化合物(a)之烷氧當量為1.5至200當量之範圍內,於觸媒之存在下反應並縮合,其後進行之第2階段反應係將水添加在所得反應液中,使剩餘的烷氧基水解‧縮合者,[12] A method for producing a reactive functional group-containing oxoxane compound, characterized in that the first-stage reaction is carried out by using a decyl alcohol-terminated polyoxyxane oil (b) represented by the formula (2), and a formula ( 1) The alkoxyoxane compound (a) is shown in an amount of from 1.5 to 200 equivalents based on 1 equivalent of the oxime group of the oxime-terminated polyoxosulfonate (b), and the alkoxylated compound (a) has an alkoxy equivalent of from 1.5 to 200 equivalents. Internally, reacting and condensing in the presence of a catalyst, and then performing the second-stage reaction by adding water to the obtained reaction liquid to hydrolyze the remaining alkoxy group.
(式中,存在複數個之R3 可互同或互異,係各自獨立,表示碳數1至10之直鏈狀、分支狀或環狀之烷基、碳數6至14之芳基或碳數2至10之烯基;m表示平均值為2至2000)(wherein, a plurality of R 3 may be mutually identical or mutually different, each independently, and represent a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 14 carbon atoms or Alkenyl with 2 to 10 carbon atoms; m means an average of 2 to 2000)
XSi(OR2 )3 (1)XSi(OR 2 ) 3 (1)
(式中,X表示具有環氧基之反應性官能基;R2 表示碳數1至10之烷基)。(wherein, X represents a reactive functional group having an epoxy group; and R 2 represents an alkyl group having 1 to 10 carbon atoms).
[13]如上述[12]所記載之含反應性官能基之矽氧烷化合物之製造方法,其中,m為2至200。[13] The method for producing a reactive functional group-containing oxoxane compound according to [12] above, wherein m is from 2 to 200.
[14]一種含反應性官能基之矽氧烷化合物的製造方法,係包含下述之兩階段反應者,第1階段反應係使通式(2)所示矽醇末端聚矽氧油(b),與通式(1)所示烷氧矽烷化合物(a)以及下述通式(3)所示烷氧矽烷化合物(c),在相對於矽醇末端聚矽氧油(b)之矽醇基1當量,烷氧矽烷化合物(a)以及(c)之烷氧基總當量為1.5至200當量之範圍內,於觸媒之存在下進行縮合反應,其後進行之第2階段反應係將水添加在所得反應生成物中,使剩餘的烷氧基水解‧縮合;[14] A method for producing a reactive functional group-containing oxoxane compound, comprising the following two-stage reactor, wherein the first-stage reaction system is a sterol-terminated polyoxyxene oil represented by the general formula (2) (b) And the alkoxy decane compound (a) represented by the formula (1) and the alkoxy decane compound (c) represented by the following formula (3), after the polyoxyxanthene (b) with respect to the sterol terminal 1 equivalent of the alcohol group, the total equivalent weight of the alkoxydecane compound (a) and the alkyl group of (c) is in the range of 1.5 to 200 equivalents, and the condensation reaction is carried out in the presence of a catalyst, followed by the second-stage reaction system. Water is added to the obtained reaction product to hydrolyze and condense the remaining alkoxy group;
(式中,存在複數個之R3 可互同或互異,係各自獨立,表示碳數1至10之直鏈狀、分支狀或環狀之烷基、碳數6至14之芳基或碳數2至10之烯基;m表示平均值為2至200)(wherein, a plurality of R 3 may be mutually identical or mutually different, each independently, and represent a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 14 carbon atoms or Alkenyl having 2 to 10 carbon atoms; m means an average of 2 to 200)
XSi(OR2 )3 (1)XSi(OR 2 ) 3 (1)
(式中,X表示具有環氧基之反應性官能基;R2 表示碳數1至10之烷基)(Wherein, X represents a reactive functional group having epoxy groups; R 2 represents an alkyl group of 1 to 10 carbon atoms)
R4 Si(OR2 )3 (3)R 4 Si(OR 2 ) 3 (3)
(式中,R4 表示甲基、苯基;R2 可與通式(1)之R2 相同或相異,係各自獨立,表示碳數1至10之烷基)。(wherein R 4 represents a methyl group or a phenyl group; and R 2 may be the same as or different from R 2 of the formula (1), and each independently represents an alkyl group having 1 to 10 carbon atoms).
[15]如上述[12]至[14]所記載之含反應性官能基之矽氧烷化合物的製造方法,其中,製造步驟係以一鍋式依序進行第1階段反應、第2階段反應者。[15] The method for producing a reactive functional group-containing oxoxane compound according to the above [12] to [14] wherein the production step is a first-stage reaction and a second-stage reaction in a one-pot manner. By.
[16]如上述[11]至[15]所記載之含反應性官能基之矽氧烷化合物的製造方法,其中,通式(1)所示烷氧矽烷化合物係β-(3,4-環氧基環己基)乙基三甲氧基矽烷、或β-(3,4-環氧基環己基)乙基三乙氧基矽烷。[16] The method for producing a reactive functional group-containing oxoxane compound according to the above [11] to [15], wherein the alkoxydecane compound represented by the formula (1) is β-(3,4- Epoxycyclohexyl)ethyltrimethoxydecane, or β-(3,4-epoxycyclohexyl)ethyltriethoxydecane.
[17]如上述[12]至[16]所記載之含反應性官能基之矽氧烷化合物的製造方法,其中,通式(2)所示矽醇末端聚矽氧油(b)之R3 可互同或互異,係各自獨立之甲基或苯基。[17] The method for producing a reactive functional group-containing oxoxane compound according to the above [12] to [16], wherein the sterol terminal polyfluorene oxide (b) represented by the formula (2) 3 may be mutually identical or mutually different, each being a separate methyl or phenyl group.
[18]如上述[13]至[15]所記載之含反應性官能基之矽氧烷化合物的製造方法,其中,通式(3)所示烷氧矽烷化合物係選自甲基三甲氧基矽烷、苯基三甲氧基矽烷、甲基三乙氧基矽烷以及苯基三乙氧基矽烷所成組群中之至少一種。[18] The method for producing a reactive functional group-containing oxoxane compound according to the above [13] to [15] wherein the alkoxydecane compound represented by the formula (3) is selected from methyltrimethoxy group. At least one of a group consisting of decane, phenyltrimethoxydecane, methyltriethoxydecane, and phenyltriethoxydecane.
[19]一種硬化性樹脂組成物,係含有上述[1]至[11]中任一項所記載之含反應性官能基之矽氧烷化合物(A)以及硬化劑(B)者。[19] A curable resin composition comprising the reactive functional group-containing oxirane compound (A) and the curing agent (B) according to any one of the above [1] to [11].
[20]如上述[19]所記載之硬化性樹脂組成物,其中,復含有硬化促進劑(C)。[20] The curable resin composition according to the above [19], which further comprises a curing accelerator (C).
[21]一種光半導體用硬化物,係使上述[19]或[20]所記載之硬化性樹脂組成物進行熱硬化而得者。[21] A cured product for an optical semiconductor obtained by thermally curing the curable resin composition according to the above [19] or [20].
[22]一種光半導體元件,係以上述[20]所記載之光半導體用硬化物密封者。[22] An optical semiconductor device which is sealed with the cured product for an optical semiconductor according to the above [20].
本發明之含有矽氧烷化合物的硬化性樹脂組成物之硬化物,無發黏性或變形,且透明性、耐光性以及低溫時之低彈性率特性均為優異。因此,本發明之硬化性樹脂組成物極適用為光半導體密封材料。The cured product of the curable resin composition containing a siloxane compound of the present invention has no tackiness or deformation, and is excellent in transparency, light resistance, and low modulus of elasticity at low temperatures. Therefore, the curable resin composition of the present invention is extremely suitable as an optical semiconductor sealing material.
本發明之含反應性官能基之矽氧烷化合物(以下亦簡稱為本發明之矽氧烷化合物)係1分子中具有鏈狀聚矽氧鏈段,與三烷氧基矽烷之水解縮合鏈段(以具有含環氧基之反應性官能基的倍半矽氧烷鏈段為佳,並以三維網狀之倍半矽氧烷鏈段更佳)者。The reactive functional group-containing oxane compound of the present invention (hereinafter also referred to as a oxoxane compound of the present invention) has a chain polyfluorene chain segment in one molecule and a hydrolysis condensation segment with a trialkoxy decane. (preferably a sesquioxane chain segment having a reactive functional group containing an epoxy group, and a sesquioxane chain segment having a three-dimensional network is more preferable).
本發明之矽氧烷化合物,通常係成為以三烷氧基矽烷之水解縮合鏈段(以稱為倍半矽氧烷之分布在三維之具有網狀構造的倍半矽氧烷鏈段為佳)作為核心,延伸鏈狀聚矽氧鏈段,接著連接三烷氧基矽烷的水解縮合鏈段(以倍半矽氧烷鏈段為佳)之構造。本構造可賦予本發明之硬化性組成物硬度與柔軟性之平衡。The oxoxane compound of the present invention is usually a hydrolyzed condensed segment of a trialkoxy decane (referred to as a sesquioxane group having a network structure in a three-dimensional distribution). As a core, the chain polyphosphonium chain segment is extended, followed by the structure of the hydrolysis condensation segment of the trialkoxysilane (preferably a sesquioxane chain segment). This configuration imparts a balance between hardness and flexibility of the curable composition of the present invention.
本發明之矽氧烷化合物係如上所述,具有三烷氧基矽烷之水解縮合鏈段(以倍半矽氧烷鏈段為佳)與鏈狀聚矽氧鏈段,由該等係呈反覆之觀點,亦可稱為嵌段型矽氧烷化合物。The oxoxane compound of the present invention is as described above, having a hydrolyzed condensed segment of a trialkoxy decane (preferably a sesquioxane chain segment) and a chain polyoxyxene segment, which are repeated by the lines The viewpoint may also be referred to as a block type siloxane compound.
本發明之矽氧烷化合物係例如:以下述通式(10)所示烷氧矽烷化合物(a-1)(以下亦稱為烷氧矽烷(a-1)),較佳為下述通式(1)所示之烷氧矽烷化合物(a)(以下亦稱為烷氧矽烷(a)),與通式(2)所示聚矽氧油(b)作為原料即可製造,如有必要亦可將上述烷氧矽烷化合物(a-1)(以(a)為佳)與上述通式(3)所示烷氧矽烷化合物(c)併用作為原料,XSi(R1 )n(OR2 )3-n (10)(式中,X表示具有環氧基之反應性官能基;R1 表示取代或未取代之碳數1至10之烷基、取代或未取代之碳數6至14之芳基、或者,取代或未取代之碳數2至10之烯基;R2 表示碳數1至10之烷基;n表示0至2之整數;R1 存在複數個時,複數個R1 可互同或互異),The oxoxane compound of the present invention is, for example, an alkoxy decane compound (a-1) represented by the following formula (10) (hereinafter also referred to as an alkoxy decane (a-1)), preferably a general formula (1) The alkoxysilane compound (a) (hereinafter also referred to as alkoxysilane (a)) and the polyoxyxane (b) represented by the formula (2) can be produced as a raw material, if necessary The alkoxydecane compound (a-1) (preferably as (a)) and the alkoxydecane compound (c) represented by the above formula (3) may be used together as a raw material, XSi(R 1 )n (OR 2 ) 3-n (10) (wherein X represents a reactive functional group having an epoxy group; R 1 represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, and a substituted or unsubstituted carbon number of 6 to 14 An aryl group, or a substituted or unsubstituted alkenyl group having 2 to 10 carbon atoms; R 2 represents an alkyl group having 1 to 10 carbon atoms; n represents an integer of 0 to 2; when a plurality of R 1 are present, a plurality of R 1 can be mutually different or different),
XSi(OR2 )3 (1)XSi(OR 2 ) 3 (1)
(式中,X以及R2 與上述通式(10)者同義)。(wherein X and R 2 are synonymous with the above formula (10)).
本發明之矽氧烷化合物中之鏈狀聚矽氧鏈段係由聚矽氧油(b)所形成,三烷氧基矽烷之水解縮合鏈段(以倍半矽氧烷鏈段為佳,以三維之網狀倍半矽氧烷鏈段為更佳)係由烷氧矽烷化合物(a-1),以(a)為佳{依需要而併用烷氧矽烷化合物(c)(以下亦稱為烷氧矽烷(c))時,係由烷氧矽烷(a-1),以(a)為佳,與烷氧矽烷(c)}所形成。The chain polyoxyxene segment in the oxoxane compound of the present invention is formed by a polyoxyxanic acid (b), and a hydrolyzed condensation segment of a trialkoxy decane (preferably a sesquioxane chain segment, It is more preferable to use a three-dimensional network of sesquiterpene oxyalkylene segments from the alkoxy decane compound (a-1), preferably (a), and to use an alkoxy decane compound (c) as needed (hereinafter also referred to as In the case of alkoxydecane (c)), it is formed by alkoxydecane (a-1), preferably (a), and alkoxydecane (c).
該水解縮合鏈段,較佳為上述烷氧矽烷化合物(a)以及依需要之(c)之間,經由其烷氧基之水解與脫醇縮合之2段反應所形成的鏈段。經由該水解縮合,使X(依需要及R4 )SiO3/2之構造單元成為複數結合之構造。由於由該構造單元所形成之矽氧烷化合物稱為倍半矽氧烷,故可將該水解縮合鏈段稱為倍半矽氧烷鏈段。The hydrolysis condensation segment is preferably a segment formed by the two-stage reaction of the alkoxysilane compound (a) and, if necessary, (c), by hydrolysis and dealcoholization of the alkoxy group. By the hydrolysis condensation, the structural unit of X (required and R 4 )SiO 3/2 is a structure in which a plurality of bonds are combined. Since the oxoxane compound formed by the structural unit is referred to as sesquiterpene oxide, the hydrolyzed condensation segment can be referred to as a sesquiterpene oxide segment.
以下,針對各原料進行詳細說明。Hereinafter, each raw material will be described in detail.
上述通式(10)或(1)所示之烷氧矽烷化合物(a-1)或(a)中之X,只要為具有環氧基之有機基即可而無特別限制。例如可列舉:β-縮水甘油氧基乙基、γ-縮水甘油氧基丙基、γ-縮水甘油氧基丁基等縮水甘油氧基碳數1至4烷基;縮水甘油基;β-(3,4-環氧基環己基)乙基、γ-(3,4-環氧基環己基)丙基、β-(3,4-環氧基環庚基)乙基、β-(3,4-環氧基環己基)丙基、β-(3,4-環氧基環己基)丁基、β-(3,4-環氧基環己基)戊基等經具有環氧環(環氧乙烷環)之碳數5至8之環烷基取代的碳數1至5之烷基。該等之中,經縮水甘油氧基取代之碳數1至3之烷基或經具有環氧環之碳數5至8之環烷基取代之碳數1至3之烷基係例如,以β-縮水甘油氧基乙基、γ-縮水甘油氧基丙基、β-(3,4-環氧基環己基)乙基為佳,以β-(3,4-環氧基環己基)乙基為特佳。The alkoxydecane compound (a-1) represented by the above formula (10) or (1) or the X in (a) is not particularly limited as long as it is an organic group having an epoxy group. For example, a glycidyloxy group having a carbon number of 1 to 4 such as β-glycidoxyethyl group, γ-glycidoxypropyl group or γ-glycidoxybutyl group; glycidyl group; β-( 3,4-epoxycyclohexyl)ethyl, γ-(3,4-epoxycyclohexyl)propyl, β-(3,4-epoxycycloheptyl)ethyl, β-(3 , 4-epoxycyclohexyl)propyl, β-(3,4-epoxycyclohexyl)butyl, β-(3,4-epoxycyclohexyl)pentyl, etc., having an epoxy ring ( An alkyl group having 1 to 5 carbon atoms substituted by a cycloalkyl group having 5 to 8 carbon atoms of the oxirane ring). Among these, an alkyl group having 1 to 3 carbon atoms substituted by a glycidoxy group or an alkyl group having 1 to 3 carbon atoms substituted by a cycloalkyl group having 5 to 8 carbon atoms of an epoxy ring is, for example, Β-glycidoxyethyl, γ-glycidoxypropyl, β-(3,4-epoxycyclohexyl)ethyl, preferably β-(3,4-epoxycyclohexyl) Ethyl is especially good.
通式(10)或(1)中之R2 ,各自獨立,表示碳數1至10之烷基,可為直鏈狀、分支狀或環狀之任一者。其例可列舉如:甲基、乙基、正丙基、異丙基、正丁基、異丁基、第三丁基、正戊基、正己基、環戊基、環己基等。由相溶性、反應性等反應條件之觀點而言,該等R2 以甲基或乙基為佳,以甲基為特佳。R 2 in the formula (10) or (1), each independently, represents an alkyl group having 1 to 10 carbon atoms, and may be any of a linear chain, a branched chain or a cyclic chain. Examples thereof include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, tert-butyl group, n-pentyl group, n-hexyl group, cyclopentyl group, cyclohexyl group and the like. From the viewpoint of reaction conditions such as compatibility and reactivity, the R 2 is preferably a methyl group or an ethyl group, and particularly preferably a methyl group.
而且,通式(10)之R1 ,可直接引用下述通式(2)之R3 說明中之各基的說明。Further, R 1 of the formula (10) can be directly referred to the description of each group in the description of R 3 of the following formula (2).
通式(10)或(1)所示之烷氧矽烷(a-1)或(a)之較佳具體例可列舉如:β-縮水甘油氧基乙基三甲氧基矽烷、β-縮水甘油氧基乙基三乙氧基矽烷、γ-縮水甘油氧基丙基三甲氧基矽烷、γ-縮水甘油氧基丙基三乙氧基矽烷、β-(3,4-環氧基環己基)乙基三甲氧基矽烷、β-(3,4-環氧基環己基)乙基三乙氧基矽烷,以β-(3,4-環氧基環己基)乙基三甲氧基矽烷為特佳。該等烷氧矽烷化合物(a)可單獨使用或可使用2種以上,亦可併用下述通式(3)所示之烷氧矽烷(c)。Preferable specific examples of the alkoxydecane (a-1) or (a) represented by the formula (10) or (1) include, for example, β-glycidoxyethyltrimethoxydecane and β-glycidol. Oxyethyl triethoxy decane, γ-glycidoxypropyl trimethoxy decane, γ-glycidoxypropyl triethoxy decane, β-(3,4-epoxycyclohexyl) Ethyltrimethoxydecane, β-(3,4-epoxycyclohexyl)ethyltriethoxydecane, with β-(3,4-epoxycyclohexyl)ethyltrimethoxynonane good. These alkoxydecane compounds (a) may be used singly or in combination of two or more kinds, and the alkoxy decane (c) represented by the following formula (3) may be used in combination.
聚矽氧油(b)係具有下述式(2)所示構造之末端具有矽醇基的鏈狀聚矽氧油。The polyoxygenated oil (b) is a chain polyoxyxene oil having a sterol group at the terminal having a structure represented by the following formula (2).
(式中之R3 以及m與上述者相同)(where R 3 and m are the same as above)
通式(2)之式中,存在複數個之R3 可互同或互異,表示碳數1至10之烷基、碳數6至14之芳基或碳數2至10之烯基。In the formula (2), a plurality of R 3 may be mutually the same or different from each other, and represent an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 14 carbon atoms or an alkenyl group having 2 to 10 carbon atoms.
碳數1至10之烷基可列舉如:碳數1至10之直鏈狀、分支狀或環狀之烷基,其例可列舉如:甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基、正戊基、異戊基、戊基、正己基、環戊基、環己基、辛基、2-乙基己基、壬基、癸基等。如顧及到耐光性時,則以甲基、乙基或環己基為佳。The alkyl group having 1 to 10 carbon atoms may, for example, be a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms, and examples thereof include methyl group, ethyl group, n-propyl group and isopropyl group. , n-butyl, isobutyl, t-butyl, tert-butyl, n-pentyl, isopentyl, pentyl, n-hexyl, cyclopentyl, cyclohexyl, octyl, 2-ethylhexyl, anthracene Base, base, etc. When light resistance is taken into consideration, a methyl group, an ethyl group or a cyclohexyl group is preferred.
碳數6至14之芳基,其例可列舉如:苯基、鄰甲苯基、間甲苯基、對甲苯基、二甲苯基等。Examples of the aryl group having 6 to 14 carbon atoms include a phenyl group, an o-tolyl group, a m-tolyl group, a p-tolyl group, and a xylyl group.
碳數2至10之烯基,其例可列舉如:乙烯基、1-甲基乙烯基、烯丙基、丙烯基、丁烯基、戊烯基、己烯基等烯基等。The alkenyl group having 2 to 10 carbon atoms may, for example, be an alkenyl group such as a vinyl group, a 1-methylvinyl group, an allyl group, a propenyl group, a butenyl group, a pentenyl group or a hexenyl group.
由耐光性、耐熱性之觀點而言,R3 各自獨立宜為甲基、苯基、環己基或正丙基,以甲基或苯基為特佳。具體可列舉如:通式(2)之2個R3 為甲基或苯基、或一者為甲基另一者為苯基之情形。該等之組合一般多為反覆單元均為相同組合之情況,然而只要達成本發明之效果,可在反覆單元中混入不同組合。例如:即使各個反覆單元不同,亦可規則性或無規性地混入相異物。From the viewpoint of light resistance and heat resistance, each of R 3 is preferably a methyl group, a phenyl group, a cyclohexyl group or a n-propyl group, and a methyl group or a phenyl group is particularly preferred. Specific examples thereof include the case where two R 3 of the formula (2) are a methyl group or a phenyl group, or one of them is a methyl group and the other is a phenyl group. The combination of these is generally the case where the overlapping units are all the same combination, however, as long as the effect of the present invention is achieved, different combinations can be mixed in the overlapping unit. For example, even if the respective repetitive units are different, the foreign matter can be mixed regularly or randomly.
通式(2)之化合物的m平均值為2至2000,以2至200為佳,以3至100更佳,又以3至50為特佳。M值過低時,硬化物因過硬而使低彈性率特性低劣。M值過高時,硬化物會有機械特性惡化之傾向。The compound of the formula (2) has an average value of m of from 2 to 2,000, preferably from 2 to 200, more preferably from 3 to 100, still more preferably from 3 to 50. When the M value is too low, the hardened material is too hard to deteriorate the low modulus of elasticity. When the M value is too high, the cured product tends to deteriorate in mechanical properties.
聚矽氧油(b)之重量平均分子量(Mw)一般在300至50000之範圍內,以300至30000之範圍內為佳,以300至18000(GPC測定值)之範圍更佳。該等之中,如考量低溫下之彈性率,則以分子量300至10000者更佳,如進一步考量組成物化時之相溶性,則以300至5000者更佳,尤以500至3000者為特佳。重量平均分子量低於300時,會有鏈狀聚矽氧鏈鍛部份之特性無法呈現之虞。本發明之聚矽氧油(b)的分子量係使用GPC(Gel Permeation Chromatography:凝膠滲透層析),依下述條件測定之換算聚苯乙烯之重量平均分子量(Mw)。The weight average molecular weight (Mw) of the polyoxygenated oil (b) is generally in the range of 300 to 50,000, preferably in the range of 300 to 30,000, and more preferably in the range of 300 to 18,000 (GPC measured value). Among these, if the elastic modulus at a low temperature is considered, it is preferably a molecular weight of 300 to 10,000. For further consideration of the compatibility in composition physicochemical, it is preferably from 300 to 5,000, especially from 500 to 3,000. good. When the weight average molecular weight is less than 300, the properties of the chain polyoxynithalic chain forging portion may not be exhibited. The molecular weight of the polyoxyxane oil (b) of the present invention is a weight average molecular weight (Mw) of converted polystyrene measured by GPC (Gel Permeation Chromatography) under the following conditions.
GPC之各種條件Various conditions of GPC
廠商:島津製作所Manufacturer: Shimadzu Corporation
管柱:保護管柱(guard column)SHODEX GPC LF-G LF-804(3支)Column: guard column SHODEX GPC LF-G LF-804 (3)
流速:1.0ml/min.Flow rate: 1.0ml/min.
管柱溫度:40℃Column temperature: 40 ° C
使用溶劑:THF(四氫呋喃)Solvent: THF (tetrahydrofuran)
檢測器:RI(示差折射檢測器)Detector: RI (differential refraction detector)
聚矽氧油(b)之動黏度以10至200cSt之範圍者為佳,以30至90cSt者更佳。黏度過低時,本發明之標的矽氧烷化合物之黏度亦變低而有不適用為光半導體密封劑之情況,反之,黏度過高時,嵌段型矽氧烷化合物(A)之黏度上昇而有妨礙操作性之傾向。The dynamic viscosity of the polyoxygenated oil (b) is preferably in the range of 10 to 200 cSt, and more preferably 30 to 90 cSt. When the viscosity is too low, the viscosity of the target oxirane compound of the present invention is also low and it is not suitable for the case of the optical semiconductor encapsulant. On the contrary, when the viscosity is too high, the viscosity of the block type siloxane compound (A) is increased. There is a tendency to hinder the operability.
聚矽氧油(b)之R3 為甲基時的聚矽氧末端二甲基聚矽氧油之具體例可列舉如下之製品名稱。例如:東麗道康寧聚矽氧(股)之商品有PRX413、BY16-873;信越化學工業(股)之商品有X-21-5841、KF-9701;邁圖(MOMENTIVE)(股)之商品有XC96-723、TSR160、YR3370、YF3800、XF3905、YF3057、YF3807、YF3802、YF3897、XF3905;Gelest(股)之商品有DMS-S12、DMS-S14、DMS-S15、DMS-S21、DMS-S27、DMS-S31、DMS-S32、DMS-S33、DMS-S35、DMS-S42、DMS-S45、DMS-S51等。Specific examples of the polyoxynoxy terminated dimethylpolyphthalic acid oil in which R 3 of the polyoxyxane oil (b) is a methyl group include the following product names. For example: Dongli Dao Kang Ning Poly Oxide (shares) products are PRX413, BY16-873; Shin-Etsu Chemical Industry Co., Ltd. products are X-21-5841, KF-9701; Momentive (shares) products have XC96-723, TSR160, YR3370, YF3800, XF3905, YF3057, YF3807, YF3802, YF3897, XF3905; Gelest products are DMS-S12, DMS-S14, DMS-S15, DMS-S21, DMS-S27, DMS -S31, DMS-S32, DMS-S33, DMS-S35, DMS-S42, DMS-S45, DMS-S51, and the like.
聚矽氧油(b)之R3 為甲基以及苯基的聚矽氧末端甲基苯基聚矽氧油之較佳具體例可列舉如下之製品名稱。例如:邁圖(股)之商品有YF3804;Gelest(股)之商品有PDS-0332、PDS-1615等。Preferable specific examples of the polyoxonium-terminated methylphenyl polyfluorene oxide in which R 3 of the polyoxyxane oil (b) is a methyl group and a phenyl group include the following product names. For example, the products of Momentive (shares) are YF3804; the products of Gelest (shares) are PDS-0332, PDS-1615 and so on.
聚矽氧油(b)之R3 為苯基的聚矽氧末端二苯基聚矽氧油可列舉如Gelest(股)之PDS-9931作為較佳之製品名稱的具體例。在上述之具體例中,從分子量、動黏度之觀點,宜為PRX413、BY16-873、X-21-5841、KF-9701、XC96-723、YF3800、YF3804、DMS-S12、DMS-S14、DMS-S15、DMS-S21、PDS-1615。該等之中,由於具有聚矽氧鏈鍛柔軟性之特徵,因此從分子量之觀點,以X-21-5841、XC96-723、YF3800、YF3804、DMS-S14、PDS-1615為特佳。該等聚矽氧油(b)可單獨使用,亦可合併2種以上使用。As the polyoxynoxy-terminated diphenylpolyoxyl oil wherein R 3 of the polyoxygenated oil (b) is a phenyl group, PDS-9931 such as Gelest can be cited as a specific example of a preferred product name. In the above specific examples, from the viewpoints of molecular weight and dynamic viscosity, it is preferably PRX413, BY16-873, X-21-5841, KF-9701, XC96-723, YF3800, YF3804, DMS-S12, DMS-S14, DMS. -S15, DMS-S21, PDS-1615. Among these, since it is characterized by the flexibility of polyoxyl chain forging, X-21-5841, XC96-723, YF3800, YF3804, DMS-S14, and PDS-1615 are particularly preferable from the viewpoint of molecular weight. These polyoxygenated oils (b) may be used singly or in combination of two or more.
接著,對於烷氧矽烷化合物(c)詳加敘述。Next, the alkoxydecane compound (c) will be described in detail.
烷氧矽烷化合物(c)具有下述式(3)之構造。The alkoxydecane compound (c) has a structure of the following formula (3).
R4 Si(OR2 )3 (3)R 4 Si(OR 2 ) 3 (3)
通式(3)中之R4 表示甲基或苯基。R 4 in the formula (3) represents a methyl group or a phenyl group.
通式(3)中之R2 與通式(10)或(1)之R2 可相同或不同,係各自獨立,表示碳數1至10之烷基,可為直鏈狀、分支狀或環狀之任一者。具體上係包含較佳之基以及更佳之基,與上述通式(10)或(1)之R2 的說明中之例示相同。General formula R (3) R 2 in the general formula (10) or (1) 2 may be the same or different, each independently lines, represents an alkyl group of 1 to 10 carbon atoms, may be linear, branched, or Any of the rings. Specifically, it contains a preferred group and a more preferred group, and is the same as exemplified in the description of R 2 of the above formula (10) or (1).
烷氧矽烷化合物(c)之較佳具體例可列舉如:甲基三甲氧基矽烷、苯基三甲氧基矽烷、甲基三乙氧基矽烷、苯基三乙氧基矽烷等。上述之中,以甲基三甲氧基矽烷或苯基三甲氧基矽烷為佳。Preferable specific examples of the alkoxydecane compound (c) include methyltrimethoxydecane, phenyltrimethoxydecane, methyltriethoxydecane, and phenyltriethoxydecane. Among the above, methyltrimethoxydecane or phenyltrimethoxydecane is preferred.
本發明中,為了調整嵌段型矽氧烷化合物(A)之分子量、形成組成物時之相溶性、以及硬化物之耐熱性、耐光性、低透間性、低透氣性等,烷氧矽烷化合物(c)可合併使用烷氧矽烷化合物(a-1),以(a)為佳。In the present invention, in order to adjust the molecular weight of the block type siloxane compound (A), the compatibility at the time of forming a composition, and the heat resistance, light resistance, low permeability, low gas permeability, etc. of the cured product, the alkoxydecane The compound (c) may be used in combination with the alkoxydecane compound (a-1), preferably (a).
相對於烷氧矽烷化合物之總和((a-1),以(a)與(c)之總和為佳),烷氧矽烷化合物(c)之使用量為0至70莫耳%,以0至55莫耳%為佳,以0至40莫耳%更佳。如將烷氧矽烷化合物(c)與烷氧矽烷化合物(a)併用時,相對於烷氧矽烷化合物之總和,烷氧矽烷化合物(c)之使用範圍宜為5至70莫耳%,以5至50莫耳%更佳,又以10至40莫耳%為特佳。With respect to the sum of the alkoxydecane compounds ((a-1), preferably the sum of (a) and (c)), the alkoxydecane compound (c) is used in an amount of from 0 to 70 mol%, from 0 to 55% of the moles is preferred, preferably from 0 to 40% by mole. When the alkoxydecane compound (c) is used in combination with the alkoxydecane compound (a), the alkoxydecane compound (c) is preferably used in an amount of from 5 to 70 mol%, based on the total of the alkoxydecane compound. It is better to 50% by mole, and particularly preferably 10 to 40% by mole.
以下係記載本發明之矽氧烷化合物的製造方法。Hereinafter, a method for producing a oxoxane compound of the present invention will be described.
本發明之矽氧烷化合物可將上述之烷氧矽烷化合物(a-1)(以下亦稱烷氧矽烷(a-1)),以烷氧矽烷(a)(以下亦稱烷氧矽烷(a))為佳,與上述聚矽氧油(b)作為原料而製造,並可依需要而併用上述之烷氧矽烷化合物(c)作為原料。The alkoxyalkyl compound of the present invention may be the alkoxydecane compound (a-1) (hereinafter also referred to as alkoxydecane (a-1)) as an alkoxysilane (a) (hereinafter also referred to as alkoxysilane (a). ()) is preferably produced by using the above polyoxyxane oil (b) as a raw material, and the alkoxylated oxane compound (c) described above may be used in combination as needed.
本發明之矽氧烷化合物之製造係,可製造具有上述2個鏈段之本發明之矽氧烷化合物,可採用任意之方法。In the production of the oxoxane compound of the present invention, the oxirane compound of the present invention having the above two segments can be produced, and any method can be employed.
最合適之方法係如上述,經由下述兩階段反應之方法,第1階段反應係使矽醇末端聚矽氧油(b)、烷氧矽烷(a-1)(以(a)為佳)以及依所需之烷氧矽烷(c),在相對於矽醇末端聚矽氧油(b)之矽醇基1當量,上述烷氧矽烷化合物之烷氧當量為1.5至200當量之範圍內反應並縮合,其後進行之第2階段反應係將水添加在所得反應液中,使剩餘的烷氧基水解‧縮合(一鍋(One-pot)法)。The most suitable method is as described above, and the first-stage reaction is carried out by the following two-stage reaction system, which is a sterol-terminated polyoxyxane oil (b) or an alkoxydecane (a-1) (preferably (a)). And the alkoxyoxane (c) as required, reacting in an amount of from 1.5 to 200 equivalents based on 1 equivalent of the decyl alcohol group of the oxime-terminated polyoxyxanic oil (b) The condensation is carried out, and the second stage reaction is carried out by adding water to the obtained reaction liquid to hydrolyze and condense the remaining alkoxy group (one-pot method).
上述第1階段反應,不存在水時,宜在酸觸媒或鹼觸媒(以鹼觸媒為佳)之存在下進行。In the above first-stage reaction, in the absence of water, it is preferably carried out in the presence of an acid catalyst or an alkali catalyst (preferably a base catalyst).
上述第1階段反應之烷氧矽烷(a-1),以(a)為佳[因應所需而併用烷氧矽烷(c)]與聚矽氧油(b)之反應中的上述烷氧矽烷化合物,與聚矽氧油(b)之比例,一般相對於聚矽氧油(b)之矽醇基1當量,烷氧矽烷(a-1),以(a)為佳[因應所需而併用烷氧矽烷(c)]中之烷氧當量(在併用烷氧矽烷(c)時,烷氧矽烷(a-1),以(a)為佳,與烷氧矽烷(c)之烷氧基總當量)為1.5至200當量,以2至200當量為佳,以2至150當量更佳,又以2至100當量為特佳。而且,該比例係相對於聚矽氧油(b)之矽醇基1當量,上述烷氧矽烷化合物之烷氧當量可為3至100當量,以4至100當量為佳,以5至100當量更佳。The alkoxynonane (a-1) of the above first-stage reaction, preferably the above alkoxydecane in the reaction of (a) (corresponding to the use of the alkoxydecane (c) in combination with the polyoxyxane oil (b) The ratio of the compound to the polyoxyxane (b) is generally 1 equivalent to the decyl group of the polyoxyxanic oil (b), and the alkoxydecane (a-1) is preferably (a) [according to the need And the alkoxy equivalent of alkoxyoxane (c) is used together (in the case of alkoxysilane (c), alkoxydecane (a-1), preferably (a), and alkoxylate of alkoxydecane (c) The total equivalent weight of the base is from 1.5 to 200 equivalents, preferably from 2 to 200 equivalents, more preferably from 2 to 150 equivalents, still more preferably from 2 to 100 equivalents. Further, the ratio is 1 equivalent to the decyl group of the polyoxyxane oil (b), and the alkoxy oxirane compound may have an alkoxy equivalent of 3 to 100 equivalents, preferably 4 to 100 equivalents, and 5 to 100 equivalents. Better.
上述烷氧矽烷化合物之量如大幅超出上述之上限範圍時,則恐所得物會喪失本發明之烷氧矽烷化合物的較佳物性。When the amount of the alkoxydecane compound is substantially outside the above upper limit range, the resultant may lose the preferred physical properties of the alkoxysilane compound of the present invention.
專利文獻1(WO2005/100445號)中揭示,不使用矽醇末端聚矽氧油(b),在水的存在下,使具有環氧基之矽烷化合物與不具環氧基之矽烷化合物同時進行水解縮合。通常在具有官能基之倍半矽氧烷之合成中,與專利文獻1相同,在水的存在下,使具有官能基之烷氧矽烷化合物與不具官能基之烷氧矽烷化合物同時進行水解縮合。It is disclosed in Patent Document 1 (WO2005/100445) that a decyl compound having an epoxy group and a decane compound having no epoxy group are simultaneously hydrolyzed in the presence of water without using a sterol terminal polyoxyxanic oil (b). condensation. In the synthesis of a sesquiterpene having a functional group, in the same manner as in Patent Document 1, the alkoxysilane compound having a functional group and the alkoxysilane compound having no functional group are simultaneously subjected to hydrolysis condensation in the presence of water.
然而,如本發明,除了烷氧矽烷(a-1),以(a)為佳[因應所需之烷氧矽烷(c)],亦使用聚矽氧油(b)作為原料時,如使該等原料在觸媒以及水的存在下一起反應,由於烷氧矽烷(a-1),以(a)為佳[因應所需之烷氧矽烷(c)]之烷氧基間的水解‧縮合反應優先進行,有時,所形成之倍半矽氧烷化合物與未反應之聚矽氧油(b)殘留且互不相溶而有產生不均勻白濁化合物的傾向。如此之白濁有機聚矽氧烷不適於光學用途上。However, according to the present invention, in addition to the alkoxydecane (a-1), (a) is preferred [in response to the desired alkoxyoxane (c)], and polyoxyxane (b) is also used as a raw material, The raw materials are reacted together in the presence of a catalyst and water. The alkoxyoxane (a-1) is preferably (a) [in response to the hydrolysis of the alkoxy group of the alkoxyoxane (c) required) The condensation reaction proceeds preferentially, and the formed sesquiterpene oxide compound and the unreacted polyoxyxane oil (b) may remain incompatible with each other, and tend to cause uneven white turbidity compounds. Such a white turbid organopolysiloxane is not suitable for optical use.
而且,即使不影響透明性時,合成的化合物唯恐有分子量減低之傾向,且發生耐熱性降低以及「發黏」等之情形,而難以獲得較佳之本發明的矽氧烷化合物。Further, even if the transparency is not impaired, the synthesized compound tends to have a reduced molecular weight, and heat resistance is lowered and "stickiness" occurs, and it is difficult to obtain a preferred oxoxane compound of the present invention.
包含上述之最適方法,本發明之含反應性官能基之矽氧烷化合物的製造方法係以經由以下之(i)以及(ii)所示的製造步驟者為佳。Including the above-described optimum method, the method for producing a reactive functional group-containing oxoxane compound of the present invention is preferably a production step shown by the following (i) and (ii).
製造步驟(i):經由進行矽醇末端聚矽氧油(b)與上述烷氧矽烷之脫醇縮合而將聚矽氧油末端進行烷氧矽烷改質,而形成烷氧矽烷改質體(d)的步驟(鏈狀聚矽氧鏈段形成步驟)、製造步驟(ii):在水的存在下,進行烷氧矽烷改質體(d)以及上述烷氧矽烷化合物中之烷氧基間的水解‧縮合,形成烷氧矽烷之水解縮合鏈段(以倍半矽氧烷鏈段為佳)的步驟。Manufacturing step (i): alkoxysilane is subjected to alkoxysilane modification by a dealcoholization condensation of a decyl alcohol-terminated polyoxyxane oil (b) with the above alkoxysilane to form an alkoxysilane modified body ( Step d) (chain polyoxyl segment formation step), production step (ii): performing alkoxydecane modified body (d) and alkoxy group in the alkoxydecane compound in the presence of water Hydrolysis ‧ condensation to form a hydrolyzed condensed segment of the alkoxy decane (preferably a sesquioxane chain segment).
製造步驟(i)以及(ii)無論順序如何,只要經由各步驟進行反應即可。The production steps (i) and (ii) may be carried out by each step, regardless of the order.
而且,可依情況,以依次將水滴下等之方法使矽醇末端聚矽氧油(b)與上述烷氧矽烷化合物反應,使上述製造步驟(i)以及(ii)之反應以一個步驟進行。Further, depending on the case, the sterol terminal polyoxyxane oil (b) may be reacted with the alkoxy decane compound by a method such as dropping water in sequence, and the reaction of the above production steps (i) and (ii) may be carried out in one step. .
再者,在(i)中,取代上述烷氧矽烷而使用另外合成之具有2個以上烷氧基取代的倍半矽氧烷時,僅以製造步驟(i)亦可獲得本發明之矽氧烷化合物。Further, in (i), when a silsesquioxane having two or more alkoxy groups which are separately synthesized is used instead of the alkoxydecane, the oxygen of the present invention can be obtained only by the production step (i). Alkane compound.
較佳之製造方法包含上述之最適方法,具體上可列舉如以下之三種製造方法:A preferred manufacturing method includes the above-described optimum method, and specifically, the following three manufacturing methods are exemplified:
首先,進行製造步驟(i):經末端具有矽醇基之聚矽氧油(b)與烷氧矽烷(a)[可因應所需而併用烷氧矽烷(c)]之脫醇縮合反應,經由將聚矽氧油末端轉變為烷氧矽烷,可得烷氧矽烷改質體(d)。First, a manufacturing step (i) is carried out: a dealcoholization condensation reaction of a polyoxyxanic acid (b) having a sterol group at the end with an alkoxysilane (a) [which can be used in combination with an alkoxydecane (c) as required), The alkoxydecane modified body (d) can be obtained by converting the end of the polyoxyxane oil to an alkoxysilane.
其次,製造步驟(ii)較佳係在烷氧矽烷(a)[可因應所需而併用烷氧矽烷(c)]之共存下,使製造步驟(i)中所得之聚矽氧油之烷氧矽烷改質體(d)的烷氧基間、或上述烷氧矽烷化合物共存時之上述烷氧矽烷改質體(d)以及上述烷氧矽烷化合物兩者的烷氧基間,在水的存在下,經由進行水解縮合反應,而製造具有鏈狀聚矽氧鏈段[通常以-(OSi(R3 )2 )m -表示(R3 表示與式(2)者同義)]以及烷氧矽烷之水解縮合鏈段(以倍半矽氧烷鏈段為佳)的塊狀之本發明矽氧烷化合物的方法。Next, the production step (ii) is preferably carried out in the coexistence of the alkoxysilane (a) [which can be used in combination with the alkoxysilane (c)] to produce the polyoxyl oil obtained in the step (i). Between the alkoxy groups of the oxoxane modified substance (d) or the alkoxy oxane modified substance (d) and the alkoxy group of the alkoxy decane compound in the presence of the alkoxy decane compound, in water In the presence of a hydrolytic condensation reaction, a chain polyfluorene chain segment is formed (usually represented by -(OSi(R 3 ) 2 ) m - (R 3 represents synonymous with formula (2)) and an alkoxy group. A method of hydrolyzing a condensed segment of decane (preferably a sesquioxane chain segment) in the form of a block of the present invention.
首先,進行以下步驟:烷氧矽烷(a)[可因應所需而併用烷氧矽烷(c)]在水的存在下,使烷氧基間進行水解縮合反應,而獲得分子內具有烷氧基之烷氧矽烷的水解縮合物(以倍半矽氧烷(e)為佳)。First, the following steps are carried out: alkoxyoxane (a) [may be used in combination with alkoxydecane (c) in the presence of water] to carry out a hydrolysis condensation reaction between alkoxy groups to obtain an alkoxy group in the molecule. A hydrolysis condensate of alkoxyoxane (preferably sesquioxane (e)).
其次,較佳製造方法係將上述所合成之烷氧矽烷水解縮合物(以倍半矽氧烷(e)為佳)分離,此外,宜在水不存在下,使末端具有矽醇基之聚矽氧油(b)與上述所得之烷氧矽烷的水解縮合物(以倍半矽氧烷(e)為佳)進行脫醇縮合反應,而製得本發明之矽氧烷化合物者。Next, a preferred manufacturing method is to separate the alkoxydecane hydrolyzed condensate synthesized above (preferably sesquioxane (e)), and further, it is preferred to have a sterol group at the terminal in the absence of water. The hydrolyzed condensate of the oxirane oil (b) and the alkoxy oxane obtained above (preferably sesquioxane (e) is preferred) is subjected to a dealcoholization condensation reaction to obtain a oxoxane compound of the present invention.
首先進行製造步驟(i):宜在不存在水而在過剩之上述烷氧矽烷的存在下,使末端具有矽醇基之聚矽氧油(b)與烷氧矽烷(a)[可因應所需而併用烷氧矽烷(c)]進行脫醇縮合反應,形成上述烷氧矽烷改質體(d)後,接著,進行製造步驟(ii):在水的存在下,經由進行殘餘之烷氧矽烷(a)[因應所需而併用烷氧矽烷(c)時,則為殘餘之烷氧矽烷(a)以及(c)]以及上述烷氧矽烷改質體(d)之烷氧基間的水解縮合反應,而製得本發明之矽氧烷化合物之一鍋法。First, the manufacturing step (i) is carried out: in the absence of water, in the presence of the above alkoxysilane, the polyoxyxanthene (b) having a sterol group at the end and the alkoxysilane (a) The alkoxysilane (e) is subjected to a dealcoholization condensation reaction to form the alkoxydecane modified body (d), followed by a production step (ii): in the presence of water, via residual alkoxylation矽 ( (a) [when alkoxy decane (c) is used in combination, the residual alkoxy oxane (a) and (c)] and the alkoxy group of the alkoxy oxane modified substance (d) are The hydrolytic condensation reaction produces a pot method of the oxoxane compound of the present invention.
本發明中,由縮短製造步驟之觀點,較佳者為:不分離第1階段反應物而直接進行第2階段反應,依序地以一鍋式進行反應。In the present invention, from the viewpoint of shortening the production step, it is preferred to carry out the second-stage reaction directly without separating the first-stage reactant, and sequentially carry out the reaction in a one-pot manner.
以下,進一步地對具體之製造方法(丙)(前述之最佳製造方法)加以敘述。Hereinafter, a specific production method (C) (the above-described preferred production method) will be further described.
一鍋式進行時以製造步驟(i)作為第1階段反應,並以製造步驟(ii)作為第2階段反應,首先在第1階段反應(製造步驟(i))中,進行聚矽氧油(b)與烷氧矽烷(a)[因應所需之烷氧矽烷(c)]之脫醇縮合,使聚矽氧油(b)末端之矽醇基的氫原子改質為烷氧矽烷,得到烷氧矽烷改質體(d)。在第1階段反應中,較佳為在不添加水下進行,因此烷氧基間不會產生水解縮合,相對於矽醇基1當量,在使用烷氧基3當量以上之反應時,認為烷氧矽烷改質體(d)係以如下述式(4)所示之構造存在,並認為在形成如此之改質體(d)後,以接著進行烷氧基間的水解縮合為佳。因此,相對於聚矽氧油(b)之矽醇基1當量,該反應以使用烷氧基3當量至200當量反應者為較佳態樣之一。In the one-pot type, the production step (i) is used as the first-stage reaction, and the production step (ii) is used as the second-stage reaction. First, in the first-stage reaction (manufacturing step (i)), the polyoxygenated oil is carried out. (b) a dealuol condensation of alkoxyoxane (a) [corresponding to the desired alkoxyoxane (c)] to reform the hydrogen atom of the sterol group at the end of the polyoxyxanic oil (b) to an alkoxydecane, An alkoxydecane modified body (d) is obtained. In the first-stage reaction, it is preferred to carry out the hydrolysis without condensing, so that no hydrolysis condensation occurs between the alkoxy groups, and when the reaction is carried out using an alkoxy group of 3 equivalent or more with respect to 1 equivalent of the decyl group, the alkane is considered to be an alkane. The oxoxane modified body (d) is present in a structure represented by the following formula (4), and it is considered that after such a modified body (d) is formed, it is preferred to carry out hydrolysis and condensation between alkoxy groups. Therefore, the reaction is preferably one of the reaction using 3 equivalents to 200 equivalents of the alkoxy group with respect to 1 equivalent of the decyl alcohol group of the polyoxyxane oil (b).
式(4)中,R2 、R3 以及m表示與上述者同義,R6 可相同或不同,係各自獨立,表示上述X及/或R4 。In the formula (4), R 2 , R 3 and m are the same as those described above, and R 6 may be the same or different and each independently represents the above X and/or R 4 .
第1階段反應中,相對於矽醇基1當量,如使少於1.0當量之量的烷氧基反應時,在第1階段反應結束時因不存在烷氧基,而無法邁向第2階段反應,並且,如使烷氧基在1.0至1.5當量之間反應,則烷氧矽烷(a)[因應所需之烷氧矽烷(c)]中之2個以上烷氧基與聚矽氧油(b)之矽醇基反應,而在第1階段反應結束時,因過度形成高分子而引起凝膠化。因此,相對於矽醇基1當量,必須以1.5當量以上之烷氧基與之反應。由控制反應之觀點而言,宜為2.0當量以上。In the first-stage reaction, when the alkoxy group is reacted in an amount of less than 1.0 equivalent with respect to 1 equivalent of the sterol group, the alkoxy group is not present at the end of the first-stage reaction, and the second stage cannot be reached. a reaction, and, if the alkoxy group is reacted between 1.0 and 1.5 equivalents, the alkoxyoxane (a) [in response to the desired alkoxyoxane (c)] (b) The sterol group reacts, and at the end of the first stage reaction, gelation occurs due to excessive formation of a polymer. Therefore, it is necessary to react with 1.5 equivalents or more of the alkoxy group with respect to 1 equivalent of the sterol group. From the viewpoint of controlling the reaction, it is preferably 2.0 equivalent or more.
烷氧矽烷之水解縮合鏈段,由作成較佳之倍半矽氧烷鏈段之觀點而言,相對於矽醇基1當量,所使用之烷氧基宜為3當量以上,以4當量以上為佳,5當量以上更佳。The hydrolyzed condensed segment of the alkoxysilane is preferably 3 equivalents or more, and 4 equivalents or more, based on 1 equivalent of the decyl alcohol group, from the viewpoint of forming a preferred sesquiterpene gas chain segment. Good, more than 5 equivalents.
同時,本發明中之倍半矽氧烷鏈段可為一般所謂的梯型、籠型之部分開環者或無規型等之任意構造,一般認為是該等的混合型者。Meanwhile, the sesquiterpene oxide segment in the present invention may be any structure of a so-called ladder type, a partial ring opener of a cage type, or a random type, and is generally considered to be such a mixed type.
第1階段反應結束後,直接在反應液中添加水,進行烷氧基間之水解縮合的第2階段反應(製造步驟(ii))。After completion of the first-stage reaction, water is directly added to the reaction liquid to carry out a second-stage reaction (manufacturing step (ii)) in which hydrolysis and condensation between alkoxy groups are carried out.
相對於作為上述原料使用之烷氧矽烷化合物的烷氧基1當量,水之添加量約為0.5當量至100當量。相對於第1階段反應結束後殘餘烷氧基之水解縮合所需之水的理論量,以使用1至10倍量左右(以1至5倍量左右更佳)之水為佳。The amount of water added is about 0.5 equivalent to 100 equivalents per equivalent of the alkoxy group of the alkoxysilane compound used as the above raw material. The theoretical amount of water required for the hydrolytic condensation of the residual alkoxy group after the end of the first-stage reaction is preferably from about 1 to 10 times (more preferably from about 1 to 5 times).
認為在第2階段反應中引起以下所示(I)至(III)之反應。It is considered that the reaction of the following (I) to (III) is caused in the second-stage reaction.
(I):系中所殘留之烷氧矽烷(a)(以及依需求而併用時之烷氧矽烷(c))之烷氧基間的水解縮合反應。(I): a hydrolysis condensation reaction between alkoxy groups of alkoxyoxane (a) remaining in the system (and alkoxydecane (c) when used in combination).
(II):在第1階段反應所得之烷氧矽烷改質體(d)與烷氧矽烷(a)(以及依需求而併用時之烷氧矽烷(c))之烷氧基間的水解縮合反應。(II): Hydrolysis condensation between the alkoxyoxane modified product (d) obtained in the first stage reaction and the alkoxy group of the alkoxydecane (a) (and the alkoxydecane (c) when used in combination) reaction.
(III):在第1階段反應所得之烷氧矽烷改質體(d)與上述(I)之反應所生成之烷氧矽烷(a)(以及依需求而併用時之烷氧矽烷(c))之水解縮合物之烷氧基間的縮合反應。(III): alkoxy oxane (a) formed by the reaction of the alkoxy oxane modified product (d) obtained in the first stage reaction with the above (I) (and alkoxy decane (c) when used in combination a condensation reaction between alkoxy groups of the hydrolysis condensate.
在上述第2階段反應中,上述反應係複合發生,而同時進行上述水解縮合鏈段(以倍半矽氧烷鏈段為佳)之形成,以及與源自聚矽氧油(b)之鏈狀聚矽氧鏈段之縮合。In the second-stage reaction described above, the above reaction occurs in combination, and at the same time, the formation of the above-mentioned hydrolysis condensation segment (preferably a sesquioxane chain segment) and the chain derived from the polyoxyxane oil (b) are carried out. Condensation of a polyoxylated segment.
上述經第1階段反應以及第2階段反應所製造之本發明的嵌段型矽氧烷化合物之透明性優異,而使用該化合物之樹脂組成物而得之硬化物的透明性以及低彈性率性優異。The block type siloxane compound of the present invention produced by the first-stage reaction and the second-stage reaction is excellent in transparency and transparency and low modulus of elasticity of the cured product obtained by using the resin composition of the compound. Excellent.
本發明之具有反應性官能基的嵌段型矽氧烷化合物之製造雖可在無觸媒下進行,惟無觸媒時反應進行緩慢,由縮短反應時間之觀點,以在觸媒的存在下進行者為佳。可使用之觸媒而言,只要為呈現酸性或鹼性之化合物者即可使用。酸性觸媒之例可列舉如:鹽酸、硫酸、硝酸等無機酸;以及甲酸、乙酸、草酸等有機酸。鹼性觸媒之例可列舉如:氫氧化鈉、氫氧化鉀、氫氧化鋰、氫氧化銫類鹼金屬氫氧化物;如碳酸鈉、碳酸鉀、碳酸氫鈉、碳酸氫鉀之鹼金屬碳酸鹽、氨等無機鹼;三乙胺、二伸乙三胺、正丁胺、二甲胺基乙醇、三乙醇胺、氫氧化四甲銨等有機鹼。該等之中,特別是從生成物去除觸媒的容易性之觀點而言,以無機鹼為佳,尤以氫氧化鈉、氫氧化鉀更佳。觸媒之添加量在相對於反應系中之烷氧矽烷(a)(可依需要而併用烷氧矽烷(c))的總重量,一般為0.001至7.5重量%,以0.01至5重量%為佳。並且,該添加量可為0.01至1重量%左右。The production of the block type siloxane compound having a reactive functional group of the present invention can be carried out without a catalyst, but the reaction proceeds slowly without a catalyst, and the reaction time is shortened in the presence of a catalyst. The performer is better. As the catalyst which can be used, any compound which exhibits acidity or alkalinity can be used. Examples of the acidic catalyst include inorganic acids such as hydrochloric acid, sulfuric acid, and nitric acid; and organic acids such as formic acid, acetic acid, and oxalic acid. Examples of the alkaline catalyst include, for example, sodium hydroxide, potassium hydroxide, lithium hydroxide, cesium hydroxide-based alkali metal hydroxides; alkali metal carbonates such as sodium carbonate, potassium carbonate, sodium hydrogencarbonate, and potassium hydrogencarbonate. An inorganic base such as salt or ammonia; an organic base such as triethylamine, diethylenetriamine, n-butylamine, dimethylaminoethanol, triethanolamine or tetramethylammonium hydroxide. Among these, in particular, from the viewpoint of easiness of removing the catalyst from the product, an inorganic base is preferred, and sodium hydroxide or potassium hydroxide is more preferred. The amount of the catalyst added is generally from 0.001 to 7.5% by weight, based on the total weight of the alkoxydecane (a) (which may be used in combination with the alkoxysilane (c)), in an amount of from 0.01 to 5% by weight. good. Also, the amount added may be about 0.01 to 1% by weight.
觸媒的添加方法係直接添加,或以溶解在可溶性溶劑等之狀態下使用。其中亦以預先使觸媒溶解於甲醇、乙醇、丙醇、丁醇等醇類之狀態添加為佳。此時,以使用水等之水溶液添加時,係如上述,單方面進行烷氧矽烷(a)(依需要而併用之烷氧矽烷(c))之縮合,而由此所生成之倍半矽氧烷低聚物與聚矽氧油(b)不互溶而可能會產生白濁。The method of adding the catalyst is directly added or used in a state of being dissolved in a soluble solvent or the like. Among them, it is preferred to add the catalyst in advance in the form of an alcohol such as methanol, ethanol, propanol or butanol. In this case, when it is added by using an aqueous solution of water or the like, the condensation of the alkoxydecane (a) (alkoxy alkane (c) which is used in combination as needed) is unilaterally carried out as described above, and the sesquiterpene thus produced is obtained. The oxyalkylene oligomer and the polyoxygenated oil (b) are mutually miscible and may be cloudy.
本發明之含反應性官能基的矽氧烷化合物之製造可在無溶劑下或溶劑中進行。亦可在製造步驟途中追加溶劑。溶劑以可溶解烷氧矽烷化合物(a)、聚矽氧油(b)(可依需要而併用烷氧矽烷(c))、烷氧矽烷改質體(d)之溶劑為佳。如此之溶劑之例可列舉如:如二甲基甲醯胺、二甲基乙醯胺、四氫呋喃等非質子性極性溶劑;如甲基乙基酮、甲基異丁酮、環戊酮等酮類;乙酸乙酯、乙酸丁酯、乳酸乙酯、丁酸異丙酯等酯類;如甲醇、乙醇、丙醇、丁醇等醇類;如己烷、環己烷、甲苯、二甲苯等烴等。本發明中,由反應調控之觀點而言,以在醇類中反應為佳,以甲醇及/或乙醇更佳。溶劑之使用量如在反應可順利進行之範圍內者即可而無特別限制,相對於烷氧矽烷化合物(a)(可依需要而併用烷氧矽烷(c))以及聚矽氧油(b)之總重量100份,一般使用0至900重量份左右。反應溫度雖依觸媒量而異,惟一般為20至160℃,以40至140℃為佳,尤以50至150℃更佳。另外,反應時間一般在各製造步驟中分別為1至40小時,以5至30小時為佳。The production of the reactive functional group-containing oxirane compound of the present invention can be carried out without a solvent or in a solvent. It is also possible to add a solvent to the middle of the manufacturing process. The solvent is preferably a solvent which can dissolve the alkoxysilane compound (a), the polyoxyxane oil (b) (and alkoxysilane (c) if necessary), and the alkoxysilane modified body (d). Examples of such a solvent include, for example, an aprotic polar solvent such as dimethylformamide, dimethylacetamide or tetrahydrofuran; and a ketone such as methyl ethyl ketone, methyl isobutyl ketone or cyclopentanone. Ethyl acetate, butyl acetate, ethyl lactate, isopropyl butyrate and other esters; such as methanol, ethanol, propanol, butanol and other alcohols; such as hexane, cyclohexane, toluene, xylene, etc. Hydrocarbons, etc. In the present invention, it is preferred to carry out the reaction in an alcohol from the viewpoint of reaction control, and it is more preferable to use methanol and/or ethanol. The amount of the solvent to be used is not particularly limited as long as the reaction proceeds smoothly, and the alkoxydecane compound (a) (alkoxydecane (c) may be used in combination as needed) and the polyoxygenated oil (b) The total weight of 100 parts is generally about 0 to 900 parts by weight. The reaction temperature varies depending on the amount of the catalyst, but it is usually from 20 to 160 ° C, preferably from 40 to 140 ° C, more preferably from 50 to 150 ° C. Further, the reaction time is usually from 1 to 40 hours in each of the production steps, preferably from 5 to 30 hours.
反應結束後,依需要經由中和、及/或水洗而將觸媒去除。進行水洗時,宜依所使用之溶劑種類而添加可與水分離之溶劑。較佳溶劑之例可列舉如:如甲基乙基酮、甲基異丁酮、環戊酮等酮類;乙酸乙酯、乙酸丁酯、乳酸乙酯、丁酸異丙酯等酯類;如己烷、環己烷、甲苯、二甲苯等烴等。After the reaction is completed, the catalyst is removed by neutralization and/or water washing as needed. When washing with water, it is preferred to add a solvent which can be separated from water depending on the type of solvent to be used. Examples of preferred solvents include, for example, ketones such as methyl ethyl ketone, methyl isobutyl ketone, and cyclopentanone; esters such as ethyl acetate, butyl acetate, ethyl lactate, and isopropyl butyrate; Such as hexane, cyclohexane, toluene, xylene and other hydrocarbons.
本反應雖可僅以水洗而進行觸媒的去除,然而,由於係在酸性、鹼性條件或任一種條件下進行反應,因而以在中和後進行水洗,或使用吸附劑吸附觸媒後經過濾去除吸附劑者為佳。使用吸附劑時,將吸附劑添加於反應液中並進行攪拌、加熱等處理,觸媒經吸附後過濾吸附劑,再將殘渣進行水洗,藉此可去除觸媒、吸附劑。In this reaction, the catalyst may be removed only by washing with water. However, since the reaction is carried out under acidic or basic conditions or under any of the conditions, the mixture is washed with water after neutralization, or after the adsorbent is adsorbed by the adsorbent. It is preferred to remove the adsorbent by filtration. When the adsorbent is used, the adsorbent is added to the reaction liquid, and the mixture is stirred, heated, and the like. After the catalyst is adsorbed, the adsorbent is filtered, and the residue is washed with water, whereby the catalyst and the adsorbent can be removed.
中和時可使用呈現酸性或鹼性之化合物。A compound which exhibits acidity or basicity can be used for neutralization.
呈現酸性之化合物之例可列舉如:鹽酸、硫酸、硝酸、磷酸、磷酸二氫鈉等無機之酸性化合物;或者甲酸、乙酸、草酸等有機酸。呈現鹼性化合物之例可列舉如:如氫氧化鈉、氫氧化鉀、氫氧化鋰、氫氧化銫等鹼金屬氫氧化物;如碳酸鈉、碳酸鉀、碳酸氫鈉、碳酸氫鉀等鹼金屬碳酸鹽;如磷酸氫二鈉、磷酸三鈉、多磷酸、三聚磷酸鈉等鹼性磷酸鹽類等無機鹼;或者,氨、三乙胺、二伸乙三胺、正丁胺、二甲基胺基乙醇、三乙醇胺、氫氧化四甲銨等有機鹼。該等之中,特別是由容易從目的生成物中去除之觀點而言,則以無機鹼或無機酸化合物為佳,更佳者係較容易使pH調整至中性附近的磷酸二氫鈉或上述鹼性磷酸鹽類等磷酸鹽類。Examples of the acidic compound include inorganic acidic compounds such as hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, and sodium dihydrogen phosphate; and organic acids such as formic acid, acetic acid, and oxalic acid. Examples of the basic compound include alkali metal hydroxides such as sodium hydroxide, potassium hydroxide, lithium hydroxide, and barium hydroxide; alkali metals such as sodium carbonate, potassium carbonate, sodium hydrogencarbonate, and potassium hydrogencarbonate. a carbonate; an inorganic base such as an alkali phosphate such as disodium hydrogen phosphate, trisodium phosphate, polyphosphoric acid or sodium tripolyphosphate; or ammonia, triethylamine, diethylenetriamine, n-butylamine, or dimethyl An organic base such as arylaminoethanol, triethanolamine or tetramethylammonium hydroxide. Among these, in particular, from the viewpoint of being easily removed from the intended product, an inorganic base or an inorganic acid compound is preferred, and more preferably, the pH is adjusted to a neutral sodium dihydrogen phosphate or Phosphates such as the above basic phosphates.
吸附劑可例示如:活性白土、活性碳、沸石、無機‧有機系之合成吸附劑、離子交換樹脂等,具體例可列舉如以下製品。Examples of the adsorbent include activated clay, activated carbon, zeolite, inorganic/organic synthetic adsorbent, ion exchange resin, and the like. Specific examples thereof include the following products.
活性白土之例可列舉如:東新化成(股)之商品:活性白土(SA35、SA1、T、R-15或E),或尼可耐特(音譯)(G-36、G-153或G-168);水澤化學工業(股)之商品:Galleon Earth、或Mizuka AceRTM (上標之RTM表示登記商標。以下亦同)等。Examples of activated clays include, for example, Dongxin Chemicals Co., Ltd.: activated clay (SA35, SA1, T, R-15 or E), or Nicolette (G-36, G-153 or G-168); Products of Mizusawa Chemical Industry Co., Ltd.: Galleon Earth, or Mizuka Ace RTM (superscript RTM stands for registered trademark. The same applies below).
活性碳之例可列舉如:味之素精細化學(股)之商品:CL-H、Y-10S或Y-10SF;Futamura化學(股)之商品:S、Y、FC、DP、SA1000、K、A、KA、M、CW130BR、CW130AR或GM130A等。Examples of the activated carbon include, for example, Ajinomoto Fine Chemicals Co., Ltd.: CL-H, Y-10S or Y-10SF; Futamura Chemical Co., Ltd.: S, Y, FC, DP, SA1000, K , A, KA, M, CW130BR, CW130AR or GM130A.
沸石之例可列舉如:Union Showa(股)之商品:Molecular Sieve 3A、4A、5A或13X等。Examples of the zeolite include, for example, products of Union Showa (stock): Molecular Sieve 3A, 4A, 5A or 13X.
合成吸附劑之例可列舉如:協和化學(股)之商品:KyowardRTM 100、200、300、400、500、600、700、1000、2000;以及羅門哈斯(股)之商品:AmberlystRTM 15JWET、15DRY、16WET、31WET、A21、AmberliteRTM IRA40、0JC1、IRA403BLC1、IRA404JC1;以及陶氏化學(股)之商品:DOWEXRTM 66、HCR-S、HCRW2或MAC-3等。Examples of the synthetic adsorbent include, for example, Kyowa RTM 100, 200, 300, 400, 500, 600, 700, 1000, 2000; and Rohm and Haas (stock) products: Amberlyst RTM 15JWET , 15DRY, 16WET, 31WET, A21, Amberlite RTM IRA40, 0JC1, IRA403BLC1, IRA404JC1; and Dow Chemical (stock) products: DOWEX RTM 66, HCR-S, HCRW2 or MAC-3.
反應結束後或中和後可經由水洗、過濾之其他慣用的分離精製手段進行精製。精製手段之例可列舉如:管柱層析、減壓濃縮、蒸餾、萃取等。該等精製手段可單獨進行,亦可組合複數種進行。After the completion of the reaction or after the neutralization, it can be purified by other conventional separation and purification means which are washed with water and filtered. Examples of the purification means include column chromatography, concentration under reduced pressure, distillation, and extraction. These purification means may be carried out singly or in combination of plural kinds.
在使用與水混合之溶媒作為反應溶媒而反應時,較佳者係,中和後經蒸餾或減壓濃縮而從反應系中將與水混合之反應溶媒去除之後,在反應系中添加可與水分離之溶劑使目的之反應生成物溶解後,進行水洗者。When a solvent mixed with water is used as a reaction solvent, it is preferred to remove the reaction solvent mixed with water from the reaction system by distillation or concentration under reduced pressure after neutralization, and then add the reaction system to the reaction system. The solvent for water separation is obtained by dissolving the desired reaction product and then washing it with water.
水洗後經由減壓濃縮等而去除上述所使用之溶劑,即可獲得本發明之含反應性官能基之矽氧烷化合物。After washing with water, the solvent used above is removed by concentration under reduced pressure or the like to obtain a reactive functional group-containing oxoxane compound of the present invention.
本發明之矽氧烷化合物之外觀,一般為無色透明且在25℃具有流動性之液態者。The appearance of the oxirane compound of the present invention is generally a colorless, transparent liquid having a fluidity at 25 °C.
上述反應中所得本發明之矽氧烷化合物係如上述之含反應性官能基之嵌段型矽氧烷化合物,其特徵係:由鏈狀聚矽氧鏈段,較佳者係-(Si(R3 )2 O)m -[R3 及m表示與上述式(2)同義]所示之鏈狀聚矽氧鏈段,以及作為構造單元之(R6 SiO3/2 )nx [R6 與上述式(4)同義;nx表示平均值為2至20]所示之倍半矽氧烷鏈段所組成,且至少部分之倍半矽氧烷鏈段具有至少一個含環氧基之反應性官能基者。The oxoxane compound of the present invention obtained in the above reaction is a block type siloxane compound having a reactive functional group as described above, which is characterized in that it is composed of a chain-like polyoxygen segment, preferably a -Si R 3 ) 2 O) m - [R 3 and m represent a chain polyoxynized segment represented by the above formula (2), and (R 6 SiO 3/2 ) nx [R 6 as a structural unit) Synonymous with the above formula (4); nx represents a sesquiterpene oxide segment having an average value of 2 to 20], and at least a portion of the sesquiterpene oxide segment has at least one epoxy group-containing reaction. Sexual functional base.
倍半矽氧烷鏈段中,源自上述烷氧矽烷化合物(a)之X所示具有環氧基的反應性官能基之數,相對於倍半矽氧烷鏈段中之1個矽原子,平均以0.3至1之比例為佳,以0.45至1之比例更佳,又以0.6至1之比例為特佳。而且,源自烷氧矽烷(c)之R4 所示之基,相對於倍半矽氧烷鏈段中之1個矽原子,平均以0至0.7之比例為佳,以0至0.55之比例更佳,又以0至0.4之比例為特佳。In the sesquiterpene oxide segment, the number of reactive functional groups having an epoxy group represented by X derived from the alkoxydecane compound (a) is relative to one halogen atom in the sesquiterpene oxide segment. The average ratio is preferably from 0.3 to 1, preferably from 0.45 to 1, and from 0.6 to 1. Further, the group represented by R 4 derived from the alkoxydecane (c) is preferably in an amount of from 0 to 0.7 on average, and in a ratio of from 0 to 0.55, based on one atom of the sesquioxane group. More preferably, it is particularly good at a ratio of 0 to 0.4.
本發明之矽氧烷化合物之較佳分子量係,以GPC測定之重量平均分子量為500至20000左右,以800至20000左右為佳,以1000至10000左右更佳,又以1500至6000左右為特佳。重量平均分子量過低時,恐耐熱性降低,過高時因黏度上昇而會在操作上發生弊害。The preferred molecular weight of the oxoxane compound of the present invention is a weight average molecular weight of about 500 to 20,000 as measured by GPC, preferably about 800 to 20,000, more preferably about 1,000 to 10,000, and about 1,500 to 6,000. good. When the weight average molecular weight is too low, the heat resistance is lowered, and when the viscosity is too high, the viscosity is increased and the operation is disadvantageous.
重量平均分子量係使用GPC(凝膠滲透層析)依下述條件所測定之聚苯乙烯換算的重量平均分子量(Mw)。The weight average molecular weight is a polystyrene-equivalent weight average molecular weight (Mw) measured by GPC (gel permeation chromatography) under the following conditions.
製造商:島津製作所Manufacturer: Shimadzu Manufacturing Co., Ltd.
管柱:保護管柱SHODEX GPC LF-G LF-804(3支)Pipe column: protection column SHODEX GPC LF-G LF-804 (3 pieces)
流速:1.0ml/min.Flow rate: 1.0ml/min.
管柱溫度:40℃Column temperature: 40 ° C
使用溶劑:THF(四氫呋喃)Solvent: THF (tetrahydrofuran)
檢測器:RI(示差折射檢測器)Detector: RI (differential refraction detector)
本發明之矽氧烷化合物之環氧當量(以JIS K-7236中記載之方法測定)以300至1600g/eq者為佳,以400至1000g/eq者更佳,又以450至900g/eq者為特佳。環氧當量過小時,硬化物會過硬而有低彈性率性低劣之虞,過大時,硬化物之機械特性變差。The epoxy equivalent of the oxirane compound of the present invention (determined by the method described in JIS K-7236) is preferably from 300 to 1600 g/eq, more preferably from 400 to 1000 g/eq, and further from 450 to 900 g/eq. It is especially good. When the epoxy equivalent is too small, the hardened material is too hard and has low inelasticity, and when it is too large, the mechanical properties of the cured product are deteriorated.
本發明之矽氧烷化合物之黏度(E型黏度計、在25℃下測定)一般為50至20000mPa‧S左右,以150至10000mPa‧S左右者為佳,以200至10000mPa‧s左右者更佳,又以200至5000mPa‧S左右者為最佳。並且,有時又以500至10000mPa‧S者更佳,更以800至5000mPa‧S者為特佳。The viscosity of the oxirane compound of the present invention (E-type viscosity meter, measured at 25 ° C) is generally about 50 to 20,000 mPa ‧ S, preferably about 150 to 10,000 mPa ‧ S, and about 200 to 10000 mPa ‧ s Good, and the best is about 200 to 5000 mPa‧S. Moreover, it is sometimes better to use 500 to 10000 mPa‧S, and more preferably 800 to 5000 mPa‧S.
屬於本發明之矽氧烷化合物中的烷氧矽烷之水解縮合鏈段(較佳者係倍半矽氧烷鏈段)之與3個氧原子鍵結之矽原子,相對於全部矽原子,其比例可為5至95莫耳%左右,用於光半導體元件之密封時,以5至50莫耳%為佳,以8至30莫耳%更佳,又以10至25莫耳%為特佳。其餘部分為屬於鏈狀聚矽氧鏈段之矽原子的比例。上述「全部矽原子」係指本發明之矽氧烷化合物中的所有矽原子。屬於倍半矽氧烷鏈段之與3個氧原子鍵結之矽原子,相對於全部矽原子,其比例低於5莫耳%時,鏈狀聚矽氧鏈段之特徵強烈顯現之結果,在作為下述硬化性樹脂組成物之成分使用時,該樹脂組成物之硬化物會有過軟之傾向,而有表面沾黏或損傷之虞。反之,高於50莫耳%時,倍半矽氧烷鏈段之特徵強烈顯現之結果,在作為下述硬化性樹脂組成物之成分使用時,該樹脂組成物之硬化物將過硬使得低彈性率特性低劣,因而熱循環試驗之結果會有惡化之傾向。a hydrazine atom bonded to three oxygen atoms in a hydrolyzed condensed segment of an alkoxy decane which is a oxoxane compound of the present invention (preferably a sesquioxane chain segment), relative to all ruthenium atoms The ratio may be about 5 to 95 mol%, preferably 5 to 50 mol% for the sealing of the optical semiconductor element, more preferably 8 to 30 mol%, and 10 to 25 mol%. good. The remainder is the proportion of deuterium atoms belonging to the chain polyoxyl segment. The above "all germanium atoms" means all of the germanium atoms in the halogenated alkane compound of the present invention. a ruthenium atom bonded to three oxygen atoms belonging to the sesquioxane chain segment, and the ratio of the chain polyphosphonium chain is strongly exhibited when the ratio is less than 5 mol% with respect to all of the ruthenium atoms. When used as a component of the curable resin composition described below, the cured product of the resin composition tends to be too soft, and the surface is sticky or damaged. On the other hand, when it is more than 50% by mole, the characteristics of the sesquiterpene oxide segment are strongly exhibited, and when used as a component of the following curable resin composition, the cured product of the resin composition is too hard to be low in elasticity. The rate characteristics are inferior and the results of the thermal cycle test tend to deteriorate.
本發明之矽氧烷化合物係如上述,其特徵係:具有鏈狀聚矽氧鏈段以及上述烷氧矽烷之水解縮合鏈段(較佳者係倍半矽氧烷鏈段),後者之鏈段中具有含環氧基之反應性官能基,特別是,提高鏈狀聚矽氧鏈段比例之本發明之矽氧烷化合物,適於光半導體密封之點上亦為一大特徵。例如,如上述,相對於本發明之矽氧烷化合物中之全部矽原子,屬於上述烷氧矽烷之水解縮合鏈段(較佳者係倍半矽氧烷鏈段)之矽原子的比例為5至50莫耳%時,屬於鏈狀聚矽氧鏈段之矽原子的比例為50至95莫耳%。屬於鏈狀聚矽氧鏈段之矽原子的較佳比例為70至92莫耳%,以75至90莫耳%為佳。The oxoxane compound of the present invention is characterized in that it has a chain polyoxy oxymethylene segment and a hydrolyzed condensed segment of the alkoxy decane (preferably a sesquioxane chain segment), the latter chain It is also a feature that the reactive functional group having an epoxy group in the segment, particularly the azide oxide compound of the present invention which increases the proportion of the chain polyoxynoxy segment, is suitable for the sealing of the optical semiconductor. For example, as described above, the ratio of the ruthenium atoms belonging to the hydrolyzed condensation segment (preferably a sesquioxane chain segment) of the above alkoxydecane is 5 with respect to all the ruthenium atoms in the oxoxane compound of the present invention. At 50 mol%, the proportion of deuterium atoms belonging to the chain polyoxyl segment is 50 to 95 mol%. A preferred ratio of the ruthenium atoms belonging to the chain polyoxynene segment is from 70 to 92 mol%, preferably from 75 to 90 mol%.
本發明之矽氧烷化合物中之2個鏈段中的矽原子比例,可由原料之進料比例計算,亦可經由本發明之矽氧烷化合物的1 H NMR、29 Si NMR以及元素分析等而求出。The proportion of the ruthenium atom in the two segments of the oxoxane compound of the present invention can be calculated from the feed ratio of the raw material, and can also be subjected to 1 H NMR, 29 Si NMR, elemental analysis, etc. of the oxoxane compound of the present invention. Find out.
歸結本發明之矽氧烷化合物係如下述。The naphthenic compound of the present invention is as follows.
(i)一種含反應性官能基之矽氧烷化合物,係具有:鏈狀聚矽氧鏈段,與具有選自含環氧基之反應性官能基、甲基以及苯基所成組群之基的三(C1-C10)烷氧基矽烷之水解縮合鏈段的嵌段型矽氧烷低聚物,且至少一部分之水解縮合鏈段係含有至少一個含環氧基之反應性官能基的鏈段者。(i) a reactive functional group-containing oxoxane compound having a chain polyoxynized segment and a group having a reactive functional group selected from an epoxy group, a methyl group, and a phenyl group. a block type oxane oligomer of a hydrolyzed condensed segment of a tris(C1-C10) alkoxydecane, and at least a portion of the hydrolyzed condensed segment contains at least one reactive functional group containing an epoxy group Chain segment.
(ii)如上述(i)所記載之含反應性官能基之矽氧烷化合物,其中,鏈狀聚矽氧鏈段係下述式(2A)所示鏈段,-(Si(R3 )2 O)m- (2A)(式中之R3 可互同或互異,表示碳數1至10之直鏈狀、分支狀或環狀之烷基、碳數6至14之芳基或碳數2至10之烯基;m表示平均值為2至2000)。(ii) The reactive functional group-containing oxirane compound according to the above (i), wherein the chain polyoxynized segment is a segment represented by the following formula (2A), -(Si(R 3 ) 2 O)m- (2A) (wherein R 3 may be mutually identical or mutually different, and represents a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 14 carbon atoms or An alkenyl group having 2 to 10 carbon atoms; m represents an average value of 2 to 2000).
(iii)如上述(ii)所記載之含反應性官能基之矽氧烷化合物,其中,R3 為碳數1至10之烷基,m平均為2至200。(iii) The reactive functional group-containing oxirane compound according to the above (ii), wherein R 3 is an alkyl group having 1 to 10 carbon atoms, and m is an average of 2 to 200.
(iv)如上述(i)至(iii)中任一項所記載之含反應性官能基之矽氧烷化合物,其中,R3 為甲基。(iv) The reactive functional group-containing oxirane compound according to any one of the above (i) to (iii), wherein R 3 is a methyl group.
(v)如上述(i)至(iv)中任一項所記載之含反應性官能基之矽氧烷化合物,其中,具有環氧基之反應性官能基係經具有環氧基之碳數5至8之環烷基取代的碳數1至3之烷基。(v) The reactive functional group-containing oxirane compound according to any one of the above (i) to (iv), wherein the reactive functional group having an epoxy group is a carbon number having an epoxy group A cycloalkyl group of 5 to 8 is substituted with an alkyl group having 1 to 3 carbon atoms.
(vi)如上述(i)至(iv)中任一項所記載之含反應性官能基之矽氧烷化合物,其中,具有選自含環氧基之反應性官能基、甲基以及苯基所成組群之基的三(C1-C10)烷氧基矽烷為具有經含環氧基之碳數5至8之環烷基取代的碳數1至3之烷基的三(C1-C10)烷氧基矽烷。(vi) The reactive functional group-containing oxirane compound according to any one of the above (i) to (iv), which has a reactive functional group selected from an epoxy group, a methyl group, and a phenyl group. The tri(C1-C10) alkoxydecane group of the group is a tris(C1-C10) having an alkyl group having 1 to 3 carbon atoms substituted with a cycloalkyl group having 5 to 8 carbon atoms of an epoxy group. Alkoxydecane.
(vii)如上述(vi)所記載之含反應性官能基之矽氧烷化合物,其中,具有經含環氧基之碳數5至8之環烷基取代的 碳數1至3之烷基的三(C1-C10)烷氧基矽烷係β-(3,4-環氧基環己基)乙基三甲氧基矽烷。(vii) The reactive functional group-containing oxoxane compound according to the above (vi), which has a cycloalkyl group having 5 to 8 carbon atoms and having an epoxy group A tri(C1-C10) alkoxydecane having an alkyl group having 1 to 3 carbon atoms is β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane.
(viii)如上述(i)至(vii)中任一項所記載之含反應性官能基之矽氧烷化合物,其中,具有選自含環氧基之反應性官能基、甲基以及苯基所成組群之基的三(C1-C10)烷氧基矽烷係具有含環氧基之反應性官能基的三(C1-C10)烷氧基矽烷、與具有選自甲基以及苯基所成組群之基的三(C1-C10)烷氧基矽烷之兩者。(viii) The reactive functional group-containing oxirane compound according to any one of the above (i) to (vii), which has a reactive functional group selected from an epoxy group, a methyl group, and a phenyl group. The tris(C1-C10) alkoxydecane group of the group is a tri(C1-C10) alkoxydecane having a reactive functional group containing an epoxy group, and having a selected from a methyl group and a phenyl group. Both of the three (C1-C10) alkoxydecane groups in the group.
(ix)如上述(viii)所記載之含反應性官能基之矽氧烷化合物,其中,具有選自甲基以及苯基所成組群之基的三(C1-C10)烷氧基矽烷係苯基三甲氧基矽烷或甲基三甲氧基矽烷。(1) The reactive functional group-containing oxoxane compound according to the above (viii), wherein the tri(C1-C10) alkoxy decane having a group selected from the group consisting of a methyl group and a phenyl group is a (C1-C10) alkoxy decane system Phenyltrimethoxydecane or methyltrimethoxydecane.
(x)如上述(i)至(ix)中任一項所記載之含反應性官能基之矽氧烷化合物,其中,經GPC測定之重量平均分子量為500至20000。(a) The reactive functional group-containing oxirane compound according to any one of the above (i) to (ix), wherein the weight average molecular weight measured by GPC is from 500 to 20,000.
(xi)如上述(i)至(x)中任一項所記載之含反應性官能基之矽氧烷化合物,係經由下述之兩階段反應而得,第1階段反應係使通式(2)所示矽醇末端聚矽氧油(b)與通式(1)所示烷氧矽烷化合物(a),在相對於矽醇末端聚矽氧油(b)之矽醇基1當量,烷氧矽烷化合物之烷氧當量為1.5至200當量之範圍內反應並縮合,其後進行之第2階段反應係將水添加在所得反應液中,使剩餘的烷氧基水解‧縮合;(xi) The reactive functional group-containing oxoxane compound according to any one of the above (i) to (x), which is obtained by the following two-stage reaction, and the first-stage reaction system is a general formula ( 2) the sterol-terminated polyoxyxane oil (b) and the alkoxy decane compound (a) represented by the formula (1) are 1 equivalent to the sterol group of the fluorene-terminated oxy-acid (b). The alkoxyoxane compound is reacted and condensed in an amount of from 1.5 to 200 equivalents, and the second stage reaction thereafter is carried out by adding water to the obtained reaction liquid to hydrolyze and condense the remaining alkoxy group;
(式中,存在複數個之R3 可互同或互異,表示碳數1至10之直鏈狀、分支狀或環狀之烷基、碳數6至14之芳基或碳數2至10之烯基;m表示平均值為2至2000)(wherein a plurality of R 3 may be mutually identical or mutually different, and represent a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 14 carbon atoms or a carbon number of 2 to 10 alkenyl; m means an average of 2 to 2000)
XSi(OR2 )3 (1)XSi(OR 2 ) 3 (1)
(式中,X表示具有環氧基之反應性官能基;R2 表示碳數1至10之烷基)。(wherein, X represents a reactive functional group having an epoxy group; and R 2 represents an alkyl group having 1 to 10 carbon atoms).
(xii)如上述(xi)所記載之含反應性官能基之矽氧烷化合物,其中,經GPC(凝膠滲透層析)所測定之通式(2)所示矽醇末端聚矽氧油(b)之重量平均分子量為300至30000。(xii) The oxime compound having a reactive functional group as described in the above (xi), wherein the sterol terminal polyfluorene oxide represented by the formula (2) is measured by GPC (gel permeation chromatography) The weight average molecular weight of (b) is from 300 to 30,000.
(xiii)如上述(xi)或(xii)所記載之含反應性官能基之矽氧烷化合物,其中,相對於矽醇末端聚矽氧油(b)之矽醇基1當量,通式(1)所示烷氧矽烷化合物(a)之烷氧基之當量為2至100當量。(xiii) The reactive functional group-containing oxoxane compound as described in the above (xi) or (xii), wherein the oxime group is equivalent to 1 equivalent of the sterol-terminated polyoxyxanic oil (b), 1) The alkoxy group of the alkoxydecane compound (a) shown has an equivalent weight of 2 to 100 equivalents.
(xiv)如上述(xi)至(xiii)中任一項所記載之含反應性官能基之矽氧烷化合物,其中,通式(2)所示矽醇末端聚矽氧油(b)係矽醇末端二甲基聚矽氧油或矽醇末端甲基苯基聚矽氧油。(Xiv) The reactive functional group-containing oxirane compound according to any one of the above (xi) to (xiii), wherein the sterol terminal polyfluorene oxide (b) represented by the formula (2) is A sterol terminal dimethylpolyphthalic acid oil or a sterol terminal methyl phenyl phthalate oil.
(xv)如上述(xi)至(xiv)中任一項所記載之含反應性官能基之矽氧烷化合物,其中,通式(1)所示烷氧矽烷化合物(a)係β-縮水甘油氧基乙基三甲氧基矽烷、β-縮水甘油氧基乙基三乙氧基矽烷、γ-縮水甘油氧基丙基三甲氧基矽烷、γ-縮水甘油氧基丙基三乙氧基矽烷、β-(3,4-環氧基環己基)乙基三甲氧基矽烷或β-(3,4-環氧基環己基)乙基三乙氧基矽烷。(a) a reactive functional group-containing oxoxane compound according to any one of the above (xi) to (xiv), wherein the alkoxydecane compound (a) represented by the formula (1) is a β-shrinkage Glyceryloxyethyltrimethoxydecane, β-glycidoxyethyltriethoxydecane, γ-glycidoxypropyltrimethoxydecane, γ-glycidoxypropyltriethoxydecane , β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane or β-(3,4-epoxycyclohexyl)ethyltriethoxydecane.
(xvi)如上述(i)至(x)中任一項所記載之含反應性官能基之矽氧烷化合物,其中,第1階段反應係使通式(2)所示矽醇末端聚矽氧油(b),與通式(1)所示烷氧矽烷化合物(a)以及通式(3)所示烷氧矽烷化合物(c)兩者,在相對於矽醇末端聚矽氧油(b)之矽醇基1當量,烷氧矽烷化合物(a)以及(c)之烷氧基總當量為1.5至200當量之範圍內反應並縮合,其後進行之第2階段反應係將水添加在所得反應液中,使剩餘的烷氧基水解‧縮合:(Xvi) The reactive functional group-containing oxirane compound according to any one of the above (i) to (x), wherein the first-stage reaction is carried out by polymerizing the sterol terminal of the formula (2) The oxy-oil (b), both the alkoxy decane compound (a) represented by the formula (1) and the alkoxy decane compound (c) represented by the formula (3), are condensed with respect to the sterol-terminated polyoxyxene oil ( b) the sterol group is 1 equivalent, the alkoxy decane compound (a) and the total alkoxy group equivalent of (c) are reacted and condensed in the range of 1.5 to 200 equivalents, and the second stage reaction thereafter is carried out by adding water. In the resulting reaction solution, the remaining alkoxy groups are hydrolyzed and condensed:
(式中,存在複數個之R3 可互同或互異,表示碳數1至10之直鏈狀、分支狀或環狀之烷基、碳數6至14之芳基或碳數2至10之烯基;m表示平均值為2至200),(wherein a plurality of R 3 may be mutually identical or mutually different, and represent a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 14 carbon atoms or a carbon number of 2 to 10 alkenyl; m means an average of 2 to 200),
XSi(OR2 )3 (1)XSi(OR 2 ) 3 (1)
(式中,X表示具有環氧基之反應性官能基;R2 表示碳數1至10之烷基),(wherein, X represents a reactive functional group having an epoxy group; and R 2 represents an alkyl group having 1 to 10 carbon atoms),
R4 Si(OR2 )3 (3)R 4 Si(OR 2 ) 3 (3)
(式中,R4 表示甲基或苯基;R2 可與通式(1)之R2 相同或相異,係各自獨立,表示碳數1至10之烷基)。(wherein R 4 represents a methyl group or a phenyl group; and R 2 may be the same as or different from R 2 of the formula (1), and each independently, and represents an alkyl group having 1 to 10 carbon atoms).
(xvii)如上述(xvi)所記載之含反應性官能基之矽氧烷化合物,其中,通式(2)所示矽醇末端聚矽氧油(b)係上述(xii)或(xiv)所記載之聚矽氧油。(xvii) The reactive functional group-containing oxirane compound according to the above (xvi), wherein the sterol terminal polyfluorene oxide (b) represented by the formula (2) is the above (xii) or (xiv) The polyoxyl oil described.
(xviii)如上述(xvi)或(xvii)所記載之含反應性官能基之矽氧烷化合物,其中,通式(1)所示烷氧矽烷化合物(a)係上述(xv)所記載之化合物。(a) The alkoxysilane compound having a reactive functional group as described in the above (xvi) or (xvii), wherein the alkoxysilane compound (a) represented by the formula (1) is as described in the above (xv) Compound.
(xix)如上述(xvi)至(xviii)中任一項所記載之含反應性官能基之矽氧烷化合物,其中,通式(3)所示烷氧矽烷化合物(c)係甲基三甲氧基矽烷或苯基三甲氧基矽烷。(1) The reactive functional group-containing oxoxane compound according to any one of the above (xvi) to (xviii), wherein the alkoxy decane compound (c) represented by the formula (3) is a methyl trimethyl group. Oxydecane or phenyltrimethoxydecane.
接著,對本發明之硬化性樹脂組成物進行說明。Next, the curable resin composition of the present invention will be described.
本發明之矽氧烷化合物可作為硬化性樹脂組成物之成分使用。以下,本發明之矽氧烷化合物在該硬化性樹脂組成物之說明中稱為「本發明之矽氧烷化合物(A)」或簡稱為「矽氧烷化合物(A)」。此時,矽氧烷化合物(A)可為上述(i)至(xix)中任一項所記載之含反應性官能基之矽氧烷化合物,亦包含與該矽氧烷化合物之所有組合者。The siloxane compound of the present invention can be used as a component of a curable resin composition. Hereinafter, the siloxane compound of the present invention is referred to as "the oxoxane compound (A) of the present invention" or simply "the siloxane compound (A)" in the description of the curable resin composition. In this case, the oxoxane compound (A) may be a reactive functional group-containing oxoxane compound as described in any one of the above (i) to (xix), and may also include all combinations with the oxoxane compound. .
本發明之硬化性樹脂組成物含有作為環氧樹脂成分的本發明之矽氧烷化合物(A),且另含有硬化劑(B)。並且,進一步可依需要而含有矽氧烷化合物(A)以外之其他環氧樹脂、或/及硬化促進劑。其他環氧樹脂在不喪失本發明之矽氧烷化合物(A)的特性(例如作為使用在硬化性樹脂組成物時之硬化物的特性,具體上為透明性、耐熱‧耐光性、低溫時之低彈性率特性、不沾黏性、熱循環耐性以及硬度等)之範圍內,即可併用。依情況,此等之其他環氧樹脂會改善硬化性樹脂組成物之硬化物特性。本發明之矽氧烷化合物(A),相對於環氧樹脂成分整體之比例為20至100重量%,以30至100重量%為佳,以50至100重量%更佳,可依使用態樣而為60至100重量%,或70至100重量%,而以80至100重量%更佳。The curable resin composition of the present invention contains the oxirane compound (A) of the present invention as an epoxy resin component, and further contains a curing agent (B). Further, an epoxy resin other than the siloxane compound (A) or a curing accelerator may be further contained as needed. The other epoxy resin does not lose the characteristics of the oxirane compound (A) of the present invention (for example, as a property of a cured product when used in a curable resin composition, specifically, transparency, heat resistance, light resistance, and low temperature) It can be used in combination within the range of low modulus of elasticity, non-stickiness, thermal cycle resistance, and hardness. Such other epoxy resins may improve the cured properties of the curable resin composition, as the case may be. The ratio of the oxoxane compound (A) of the present invention to the entire epoxy resin component is 20 to 100% by weight, preferably 30 to 100% by weight, more preferably 50 to 100% by weight, depending on the aspect of use. It is preferably from 60 to 100% by weight, or from 70 to 100% by weight, more preferably from 80 to 100% by weight.
在併用時,合併本發明之矽氧烷化合物(A)與其他環氧樹脂之整體的環氧樹脂中,本發明之矽氧烷化合物的所佔比例以20至90重量%為佳,以30至90重量%為特佳。When used in combination, in combination with the epoxy resin compound (A) of the present invention and the other epoxy resin, the proportion of the oxoxane compound of the present invention is preferably 20 to 90% by weight, and preferably 30. Up to 90% by weight is particularly preferred.
更且,本發明之硬化性樹脂組成物中,本發明之矽氧烷化合物(A)單獨、或合併本發明之矽氧烷化合物(A)與其他環氧樹脂之全部環氧樹脂之比例,相對於該組成物全體,為30至90重量%左右,以40至90重量%為佳,又以50至90重量%左右更佳。且依實施形態,以40至80重量%為佳,又以50至80重量%左右更佳。Further, in the curable resin composition of the present invention, the ratio of the oxirane compound (A) of the present invention, alone or in combination with the epoxy resin of the present invention, the total epoxy resin of the oxirane compound (A) and other epoxy resins, It is preferably from 30 to 90% by weight, more preferably from 40 to 90% by weight, still more preferably from 50 to 90% by weight, based on the total mass of the composition. Further, depending on the embodiment, it is preferably 40 to 80% by weight, more preferably 50 to 80% by weight.
其他環氧樹脂之具體例可列舉如:多酚化合物之縮水甘油醚化物之多官能環氧樹脂、各種酚醛樹脂之縮水甘油醚化物之多官能環氧樹脂、芳香族環氧樹脂之核氫化(hydrogenated)物、脂環式環氧樹脂、雜環式環氧樹脂、縮水甘油酯系環氧樹脂、縮水甘油胺系環氧樹脂、鹵化酚類經縮水甘油化之環氧樹脂、經縮水甘油化之聚矽氧樹脂等。Specific examples of the other epoxy resin include polyfunctional epoxy resins of glycidyl ether compounds of polyphenol compounds, polyfunctional epoxy resins of glycidyl ether compounds of various phenol resins, and nuclear hydrogenation of aromatic epoxy resins ( Hydrogenated), alicyclic epoxy resin, heterocyclic epoxy resin, glycidyl ester epoxy resin, glycidylamine epoxy resin, halogenated phenol glycidylated epoxy resin, glycidylation Polyoxyl resin, etc.
上述多官能環氧樹脂中所使用之多酚化合物可列舉如:雙酚A、雙酚F、雙酚S、4,4’-聯酚、四甲基雙酚A、二甲基雙酚A、四甲基雙酚F、二甲基雙酚F、四甲基雙酚S、二甲基雙酚S、四甲基-4,4’-聯酚、二甲基-4,4’-聯酚、1-(4-羥苯基)-2-[4-(1,1-雙-(4-羥苯基)乙基)苯基]丙烷、2,2’-亞甲基-雙(4-甲基-6-第三丁基酚)、4,4’-亞丁基-雙(3-甲基-6-第三丁基酚)、三(羥苯基)甲烷、間苯二酚、對苯二酚、鄰苯三酚、具有二異亞丙基骨架之酚類、1,1-二-4-羥苯基茀等之具有茀骨架之酚類、酚化聚丁二烯等之多酚化合物。因此,作為上述多酚化合物之縮水甘油醚化物的多官能環氧樹脂,具體上可列舉如:上述多酚化合物之縮水甘油醚化物。Examples of the polyphenol compound used in the above polyfunctional epoxy resin include bisphenol A, bisphenol F, bisphenol S, 4,4'-biphenol, tetramethylbisphenol A, and dimethyl bisphenol A. , tetramethylbisphenol F, dimethyl bisphenol F, tetramethyl bisphenol S, dimethyl bisphenol S, tetramethyl-4,4'-biphenol, dimethyl-4,4'- Bisphenol, 1-(4-hydroxyphenyl)-2-[4-(1,1-bis-(4-hydroxyphenyl)ethyl)phenyl]propane, 2,2'-methylene-double (4-methyl-6-tert-butylphenol), 4,4'-butylene-bis(3-methyl-6-tert-butylphenol), tris(hydroxyphenyl)methane, isophthalic acid Phenols, hydroquinones, pyrogallols, phenols having a diisopropylidene skeleton, 1,1-di-4-hydroxyphenylhydrazine, etc., phenols having an anthracene skeleton, phenolated polybutadiene Polyphenolic compounds. Therefore, as the polyfunctional epoxy resin of the glycidyl ether compound of the above polyphenol compound, specifically, a glycidyl ether compound of the above polyphenol compound can be mentioned.
上述多官能環氧樹脂中所使用之各種酚醛樹脂可列舉如:將各種酚作為原料之酚醛樹脂,原料之各種酚可列舉如:將酚、甲酚類、乙基酚類、丁基酚類、辛基酚類、雙酚A、雙酚F、雙酚S以及萘酚類之各種酚作為原料的酚醛樹脂;含有伸苯二甲基骨架之酚酚醛樹脂;含有二環戊二烯骨架之酚酚醛樹脂;含有聯苯骨架之酚酚醛樹脂;含有茀骨架之酚酚醛樹脂等的各種酚醛樹脂。因此,各種酚醛樹脂之縮水甘油醚化物的多官能環氧樹脂之具體例可列舉如:該等酚醛樹脂之縮水甘油醚化物。Examples of the phenolic resin used in the above polyfunctional epoxy resin include phenolic resins obtained by using various phenols as raw materials, and various phenols as raw materials include phenol, cresol, ethyl phenol, and butyl phenol. a phenolic resin containing octylphenols, bisphenol A, bisphenol F, bisphenol S, and naphthols as raw materials; a phenolic phenolic resin containing a benzene dimethyl skeleton; and a dicyclopentadiene skeleton Phenolic phenolic resin; phenolic phenolic resin containing a biphenyl skeleton; various phenolic resins such as a phenolic phenolic resin containing an anthracene skeleton. Therefore, specific examples of the polyfunctional epoxy resin of the glycidyl ether compound of various phenol resins include glycidyl ether compounds of the phenol resins.
芳香族環氧樹脂之核氫化物可列舉如:以上述各種酚為原料之酚醛樹脂作為原料的酚醛樹脂之縮水甘油醚化物的核氫化物,具體上係將各種酚(例如:雙酚A、雙酚F、雙酚S、4,4’-聯酚等酚化合物之縮水甘油醚化物,或酚、甲酚類、乙基酚類、丁基酚類、辛基酚類、雙酚A、雙酚F、雙酚S以及萘酚類等)作為原料之酚醛樹脂的縮水甘油醚化物之核氫化物。The nuclear hydride of the aromatic epoxy resin may, for example, be a nuclear hydrogenated product of a glycidyl ether compound of a phenol resin using a phenol resin as a raw material of the above various phenols, and specifically, various phenols (for example, bisphenol A, a glycidyl ether compound of a phenol compound such as bisphenol F, bisphenol S or 4,4'-biphenol, or phenol, cresol, ethyl phenol, butyl phenol, octyl phenol, bisphenol A, A nuclear hydride of a glycidyl ether compound of a phenol resin as a raw material of bisphenol F, bisphenol S, and naphthol.
脂環式環氧樹脂可列舉如:2,2’-雙(4-縮水甘油氧基環己基)丙烷、3,4-環氧基環己烷羧酸3,4-環氧基環己基甲酯、乙烯基環己烯二氧化物、2-(3,4-環氧基環己基)-5,5-螺-(3,4-環氧基環己烷)-1,3-二噁烷、雙(3,4-環氧基環己基)己二酸酯等、以及環己烷等具有脂肪族骨架之脂環式環氧樹脂。The alicyclic epoxy resin may, for example, be 2,2'-bis(4-glycidoxycyclohexyl)propane or 3,4-epoxycyclohexanecarboxylic acid 3,4-epoxycyclohexyl Ester, vinyl cyclohexene dioxide, 2-(3,4-epoxycyclohexyl)-5,5-spiro-(3,4-epoxycyclohexane)-1,3-dioxin An alicyclic epoxy resin having an aliphatic skeleton such as an alkane, a bis(3,4-epoxycyclohexyl) adipate or the like, and a cyclohexane.
脂肪族系環氧樹脂係如多元醇之縮水甘油醚,其例可列舉如:1,4-丁二醇、1,6-己二醇、聚乙二醇、聚丙二醇、季戊四醇、苯二甲醇衍生物等多元醇之縮水甘油醚類等。The aliphatic epoxy resin is a glycidyl ether of a polyhydric alcohol, and examples thereof include 1,4-butanediol, 1,6-hexanediol, polyethylene glycol, polypropylene glycol, pentaerythritol, and benzenedimethanol. A glycidyl ether or the like of a polyhydric alcohol such as a derivative.
雜環式環氧樹脂可列舉如:異氰尿環(isocyanuric ring)、乙內醯脲環等具有雜環之雜環式環氧樹脂等。Examples of the heterocyclic epoxy resin include a heterocyclic epoxy resin having a hetero ring such as an isocyanuric ring or an intramethylene urea ring.
縮水甘油酯系環氧樹脂可列舉如:由六氫鄰苯二甲酸二縮水甘油酯、四氫鄰苯二甲酸二縮水甘油酯等羧酸之縮水甘油酯所構成的環氧樹脂等。Examples of the glycidyl ester-based epoxy resin include an epoxy resin composed of a glycidyl carboxylic acid such as hexahydrophthalic acid diglycidyl ester or tetrahydrophthalic acid diglycidyl ester.
縮水甘油胺系環氧樹脂可列舉如:苯胺、甲苯胺、對苯二胺、間苯二胺、二胺基二苯基甲烷衍生物、二胺基甲苯衍生物等之胺類經縮水甘油化的環氧樹脂等。Examples of the glycidylamine-based epoxy resin include glycidation of amines such as aniline, toluidine, p-phenylenediamine, m-phenylenediamine, diaminodiphenylmethane derivative, and diaminotoluene derivative. Epoxy resin, etc.
鹵化酚類經縮水甘油化之環氧樹脂可列舉如:溴化雙酚A、溴化雙酚F、溴化雙酚S、溴化酚酚醛、溴化甲酚酚醛、氯化雙酚S、氯化雙酚A等鹵化酚類經縮水甘油化的環氧樹脂等。The halogenated phenolic glycidylated epoxy resin may, for example, be brominated bisphenol A, brominated bisphenol F, brominated bisphenol S, brominated phenol novolac, brominated cresol novolac, chlorinated bisphenol S, A halogenated phenol such as bisphenol A or a glycidylated epoxy resin.
該等環氧樹脂在使用時並無特別限制,由透明性之觀點而言,以著色性少者為佳。一般所適用者為雙酚A、雙酚F、雙酚S、4,4’-聯酚、四甲基-4,4’-聯酚、1-(4-羥苯基)-2-[4-(1,1-雙-(4-羥苯基)乙基)苯基]丙烷、三(羥苯基)甲烷、間苯二酚、2,6-二第三丁基對苯二酚、具有二異亞丙基骨架之酚類、或1,1-二-4-羥苯基茀等之具有茀骨架之酚類的縮水甘油化物之多官能環氧樹脂;將酚、甲酚類、雙酚A、雙酚S以及萘酚類等之各種酚作為原料的酚醛樹脂、含有二環戊二烯骨架之酚酚醛樹脂、含有聯苯骨架之酚酚醛樹脂、含有茀骨架之酚酚醛樹脂等各種酚醛樹脂之縮水甘油醚化物;雙酚A、雙酚F、雙酚S、4,4’-聯酚等酚化合物之縮水甘油醚化物、或將酚、甲酚類、乙基酚類、丁基酚類、辛基酚類、雙酚A、雙酚F、雙酚S以及萘酚類等各種酚作為原料之酚醛樹脂的縮水甘油醚化物之核氫化物;3’,4’-環氧基環己烷羧酸3,4-環氧基環己基甲酯等具有環己烷骨架之脂環式環氧樹脂;1,6-己二醇、聚乙二醇、聚丙二醇之縮水甘油醚類;或者三縮水甘油基異氰尿酸酯或六氫鄰苯二甲酸二縮水甘油酯等。由耐熱透明性、耐光透明性之觀點而言,特別以具有環己烷骨架之脂環式環氧樹脂為佳。該等環氧樹脂視賦與耐熱性等之必要而可併用1種或2種以上之混合物。These epoxy resins are not particularly limited in use, and from the viewpoint of transparency, those having less coloring properties are preferred. Generally applicable are bisphenol A, bisphenol F, bisphenol S, 4,4'-biphenol, tetramethyl-4,4'-biphenol, 1-(4-hydroxyphenyl)-2-[ 4-(1,1-bis-(4-hydroxyphenyl)ethyl)phenyl]propane, tris(hydroxyphenyl)methane, resorcinol, 2,6-di-t-butyl hydroquinone a polyfunctional epoxy resin having a diisopropylidene skeleton phenol or a glycidyl compound having an anthracene skeleton such as 1,1-di-4-hydroxyphenylhydrazine; a phenol or a cresol a phenolic resin containing various phenols such as bisphenol A, bisphenol S and naphthol, a phenolic phenolic resin containing a dicyclopentadiene skeleton, a phenolic phenolic resin containing a biphenyl skeleton, and a phenolic phenolic resin containing an anthracene skeleton Glycidyl etherate of various phenolic resins; glycidyl etherate of phenolic compounds such as bisphenol A, bisphenol F, bisphenol S, 4,4'-biphenol, or phenol, cresol, ethylphenol a nuclear hydride of glycidyl etherate of a phenolic resin of various phenols such as butyl phenols, octyl phenols, bisphenol A, bisphenol F, bisphenol S and naphthols; 3', 4'- Ethylene cyclohexanecarboxylic acid 3,4-epoxycyclohexylmethyl ester or the like having cyclohexane bone Epoxy epoxy resin; glycidyl ether of 1,6-hexanediol, polyethylene glycol, polypropylene glycol; or triglycidyl isocyanurate or hexahydrophthalic acid diglycidyl ester Wait. From the viewpoint of heat-resistant transparency and light-resistant transparency, an alicyclic epoxy resin having a cyclohexane skeleton is particularly preferable. These epoxy resins may be used alone or in combination of two or more kinds depending on the heat resistance and the like.
對本發明中使用之硬化劑(B)以及硬化促進劑(C)之內容進行敘述。The contents of the curing agent (B) and the curing accelerator (C) used in the present invention will be described.
硬化劑(B)可使用胺系化合物、酸酐系化合物、羧酸系化合物、醯胺系化合物、酚系化合物等而無特別限制。具體上可列舉如:二胺基二苯基甲烷、二伸乙三胺、三伸乙四胺、二胺基二苯基碸、異佛爾酮二胺、雙氰胺(dicyandiamide)、四伸乙基五胺、二甲基苯甲胺、酮亞胺化合物、由亞麻酸之二聚物與伸乙二胺所合成之聚醯胺樹脂;鄰苯二甲酸酐、偏苯三酸酐、均苯四甲酸酐、馬來酸酐、四氫鄰苯二甲酸酐、甲基四氫鄰苯二甲酸酐、氫化納迪克酸酐、氫化甲基納迪克酸酐、甲基納迪克酸酐、六氫鄰苯二甲酸酐、甲基六氫鄰苯二甲酸酐、1,3,4-環己烷三羧酸-3,4-酐;鄰苯二甲酸、四氫鄰苯二甲酸、六氫鄰苯二甲酸、甲基六氫鄰苯二甲酸、偏苯三酸、環己烷三羧酸、1,2,3,4-丁烷四羧酸;雙酚類、酚類(酚、烷基取代酚、萘酚、烷基取代萘酚、二羥基苯、二羥基萘等)與各種醛之縮聚物、酚類與各種二烯化合物之聚合物、酚類與芳香族二羥甲基之縮聚物、或者,雙甲氧基甲基聯苯與萘酚或酚類之縮合物等、聯酚類以及該等之改質物、咪唑、三氟化硼-胺錯合物、胍衍生物等。該等之中,由與環氧樹脂混合作成樹脂組成物時之適度的可使用時間(或操作時間;Pot Life)、硬化物的透明性之觀點而言,特別以酸酐系化合物、羧酸系化合物為佳,更以六氫鄰苯二甲酸酐、甲基六氫鄰苯二甲酸酐、1,3,4-環己烷三羧酸-3,4-酐、氫化納迪克酸酐、氫化甲基納迪克酸酐為最佳。As the curing agent (B), an amine compound, an acid anhydride compound, a carboxylic acid compound, a guanamine compound, a phenol compound, or the like can be used without particular limitation. Specific examples thereof include diaminodiphenylmethane, diethylenetriamine, triethylenetetramine, diaminodiphenylphosphonium, isophoronediamine, dicyandiamide, and tetra-strand Ethylpentamine, dimethylbenzylamine, ketimine compound, polyamine resin synthesized from dimer of linolenic acid and ethylenediamine; phthalic anhydride, trimellitic anhydride, pyromellitic anhydride , maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, hydrogenated nadic anhydride, hydrogenated methyl nadic anhydride, methyl nadic anhydride, hexahydrophthalic anhydride, A Hexahydrophthalic anhydride, 1,3,4-cyclohexanetricarboxylic acid-3,4-anhydride; phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, methyl six Hydrogen phthalic acid, trimellitic acid, cyclohexanetricarboxylic acid, 1,2,3,4-butanetetracarboxylic acid; bisphenols, phenols (phenols, alkyl-substituted phenols, naphthols, alkanes) Polycondensate of various substituted aldehydes, polymers of phenols and various diene compounds, polycondensates of phenols and aromatic dimethylols, or dimethoxy base Biphenyl condensates of a phenol or naphthol and the like, as well as those modified with phenols of substance, imidazoles, boron trifluoride - amine complexes, and guanidine derivatives. Among these, an acid anhydride-based compound or a carboxylic acid-based compound is particularly useful in terms of an appropriate usable time (or operation time; Pot Life) and transparency of a cured product when the resin composition is mixed with an epoxy resin. The compound is preferably hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, 1,3,4-cyclohexanetricarboxylic acid-3,4-anhydride, hydrogenated nadic anhydride, hydrogenated The kinadic anhydride is the best.
相對於與組成物中之矽氧烷化合物(A)或其他之環氧樹脂合併之全部環氧樹脂的環氧基1當量,硬化劑(B)之使用量以0.2至1.5當量左右為佳,以0.3至1.2當量左右為特佳。而且,特別是在使用苯甲基二甲基胺等三級胺作為硬化劑(B)時之硬化劑的使用量,相對於組成物中所含環氧基之化合物,宜使用0.3至20重量%,以0.5至10重量%為特佳。The hardener (B) is preferably used in an amount of from 0.2 to 1.5 equivalents per equivalent of the epoxy group of all the epoxy resins combined with the oxirane compound (A) or other epoxy resin in the composition. It is particularly preferably from about 0.3 to 1.2 equivalents. Further, in particular, the amount of the hardener used when a tertiary amine such as benzyldimethylamine is used as the hardener (B) is preferably used in an amount of 0.3 to 20 by weight based on the epoxy group-containing compound contained in the composition. % is particularly preferably from 0.5 to 10% by weight.
硬化促進劑(C)之例可列舉如:2-甲基咪唑、2-苯基咪唑、2-十一烷基咪唑、2-十七烷基咪唑、2-苯基-4-甲基咪唑、1-苯甲基-2-苯基咪唑、1-苯甲基-2-甲基咪唑、1-氰基乙基-2-甲基咪唑、1-氰基乙基-2-苯基咪唑、1-氰基乙基-2-十一烷基咪唑、2,4-二胺基-6(2’-甲基咪唑(1’))乙基-s-三、2,4-二胺基-6(2’-十一烷基咪唑(1’))乙基-s-三、2,4-二胺基-6(2’-乙基,4-甲基咪唑(1’))乙基-s-三、2,4-二胺基-6(2’-甲基咪唑(1’))乙基-s-三‧異氰尿酸加成物、2-甲基咪唑異氰尿酸之2:3加成物、2-苯基咪唑異氰尿酸加成物、2-苯基-3,5-二羥甲基咪唑、2-苯基-4-羥甲基-5-甲基咪唑、1-氰基乙基-2-苯基-3,5-二氰基乙氧基甲基咪唑等各種咪唑類;以及,該等咪唑類與鄰苯二甲酸、異苯二甲酸、對苯二甲酸、偏苯三酸、均苯四甲酸、萘二羧酸、馬來酸、草酸等多元羧酸所成之鹽類;雙氰胺等醯胺類;1,8-二氮雜-雙環(5.4.0)十一烯-7等二氮雜化合物;以及該等之四苯基硼酸酯、酚酚醛等之鹽類;與上述多元羧酸類或膦酸類所成之鹽類;溴化四丁基銨、溴化十六烷基三甲基銨、氫氧化十六烷基三甲基銨、溴化三辛基甲基銨等銨鹽;三苯膦、三(甲苯基)膦、四苯基溴化鏻、四苯基鏻四苯基硼酸酯、甲基三丁基鏻二甲基磷酸酯等膦類或鏻化合物;2,4,6-三(胺基甲基)酚等酚類;胺加成物。例如:市售品之U-CAT 18X(商品名稱:San-Apro(股)製造)等。該等硬化促進劑可經微膠囊化。該等硬化促進劑中要使用何種者,可依例如:可得透明性、硬化速度、作業條件之透明樹脂組成物所要求的特性而適當選擇。相對於具有反應性官能基之嵌段型矽氧烷化合物(A)、或與其他環氧樹脂合併100重量份,硬化促進劑一般為使用0.001至15重量份,以0.005至5重量份之範圍為佳,更以0.05至1重量份為特佳。Examples of the hardening accelerator (C) include 2-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, and 2-phenyl-4-methylimidazole. , 1-benzyl-2-phenylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-phenylimidazole , 1-cyanoethyl-2-undecylimidazole, 2,4-diamino-6 (2'-methylimidazolium (1')) ethyl-s-three 2,4-Diamino-6(2'-undecylimidazolium (1'))ethyl-s-three 2,4-Diamino-6(2'-ethyl, 4-methylimidazolium (1'))ethyl-s-three 2,4-Diamino-6(2'-methylimidazolium(1'))ethyl-s-three ‧Isocyanuric acid adduct, 2:3 adduct of 2-methylimidazoisocyanuric acid, 2-phenylimidazoisocyanuric acid adduct, 2-phenyl-3,5-dihydroxymethylimidazole And various imidazoles such as 2-phenyl-4-hydroxymethyl-5-methylimidazole and 1-cyanoethyl-2-phenyl-3,5-dicyanoethoxymethylimidazole; a salt of the imidazoles and a polycarboxylic acid such as phthalic acid, isophthalic acid, terephthalic acid, trimellitic acid, pyromellitic acid, naphthalene dicarboxylic acid, maleic acid or oxalic acid; a diazonium compound such as dicyandiamide; a diaza compound such as 1,8-diaza-bicyclo(5.4.0) undecen-7; and a salt of such tetraphenylborate or phenol novolac a salt formed with the above polycarboxylic acid or phosphonic acid; tetrabutylammonium bromide, cetyltrimethylammonium bromide, cetyltrimethylammonium hydroxide, trioctyl bromide Ammonium salts such as ammonium chloride; phosphines such as triphenylphosphine, tris(tolyl)phosphine, tetraphenylphosphonium bromide, tetraphenylphosphonium tetraphenylborate, methyltributylphosphonium dimethyl phosphate or a hydrazine compound; a phenol such as 2,4,6-tris(aminomethyl)phenol; an amine adduct. For example, U-CAT 18X (trade name: manufactured by San-Apro Co., Ltd.) of a commercial item, etc. The hardening accelerators can be microencapsulated. Which of these hardening accelerators is used can be suitably selected, for example, according to the characteristics required for the transparent resin composition which can obtain transparency, a hardening speed, and operating conditions. The hardening accelerator is generally used in an amount of from 0.005 to 5 parts by weight, based on 100 parts by weight of the block type siloxane compound having a reactive functional group or with other epoxy resins. Preferably, it is particularly preferably 0.05 to 1 part by weight.
本發明之硬化性樹脂組成物中,在無損及透明性之範圍下,可依目的而適當地添加無機質充填劑、著色劑、聚矽氧樹脂、流平劑、潤滑劑、耦合劑、流平劑、潤滑劑、光安定劑、抗氧化劑以及螢光體等。In the curable resin composition of the present invention, an inorganic filler, a colorant, a polyoxyxylene resin, a leveling agent, a lubricant, a coupling agent, and a leveling agent may be appropriately added depending on the purpose in the range of non-destructiveness and transparency. Agents, lubricants, light stabilizers, antioxidants, and phosphors.
無機質充填劑並無特別限制,可列舉如:結晶性或非結晶性氧化矽、滑石、氮化矽、氮化硼、氧化鋁、氧化矽‧氧化鈦混熔體等。The inorganic filler is not particularly limited, and examples thereof include crystalline or amorphous cerium oxide, talc, cerium nitride, boron nitride, aluminum oxide, cerium oxide, and titanium oxide mixed solution.
著色劑並無特別限制,可列舉如:酞菁、偶氮、雙偶氮、喹吖啶酮、蒽醌、黃烷士酮、紫環酮、苝、二噁、縮合偶氮、甲亞胺(azodimethine)系之各種有機系色素、氧化鈦、硫酸鉛、鉻黃、鋅黃、鉬橙、鐵丹、鈷紫、普魯士藍、群青、碳黑、鉻綠、氧化鉻、鈷綠等之無機顏料。The coloring agent is not particularly limited, and examples thereof include phthalocyanine, azo, disazo, quinacridone, anthracene, flavanone, purple ring ketone, hydrazine, and dioxins. , condensed azo, azodimethine, various organic pigments, titanium oxide, lead sulfate, chrome yellow, zinc yellow, molybdenum orange, iron oxide, cobalt violet, Prussian blue, ultramarine blue, carbon black, chrome green, An inorganic pigment such as chromium oxide or cobalt green.
聚矽氧樹脂可列舉如:二甲基聚矽氧、苯基甲基聚矽氧、環氧基改質聚矽氧、聚醚改質聚矽氧、胺改質聚矽氧、乙烯基改質聚矽氧、矽烷基改質聚矽氧等。The polyoxynoxy resin may, for example, be dimethyl polyfluorene oxide, phenylmethyl polyfluorene oxide, epoxy modified polyfluorene oxide, polyether modified polyfluorene oxide, amine modified polyoxyl oxide, vinyl modified Poly-oxygen, decyl-modified polyoxyl, and the like.
流平劑可列舉如:丙烯酸乙酯、丙烯酸丁酯、丙烯酸2-乙基己酯等由丙烯酸酯類所組成之分子量4000至12000的寡聚物類;環氧化大豆脂肪酸;環氧化松香醇;氫化蓖麻油;鈦系耦合劑等。The leveling agent may, for example, be an acrylate having a molecular weight of 4000 to 12000 composed of an acrylate such as ethyl acrylate, butyl acrylate or 2-ethylhexyl acrylate; an epoxidized soybean fatty acid; an epoxidized rosin alcohol; Hydrogenated castor oil; titanium-based coupling agent.
潤滑劑可列舉如:石蠟、微晶蠟、聚乙烯蠟等之烴系潤滑劑;月桂酸、肉豆蔻酸、棕櫚酸、硬脂酸、花生酸、山萮酸等之高級脂肪酸系潤滑劑;硬脂醯胺、棕櫚醯胺、油醯胺、亞甲基雙硬脂醯胺、伸乙基雙硬脂醯胺等之高級脂肪醯胺系潤滑劑;硬化蓖麻油、硬脂酸丁酯、乙二醇單硬脂酸酯、季戊四醇(單、二、三或四)硬脂酸酯等之高級脂肪酸酯系潤滑劑;鯨蠟醇、硬脂醇、聚乙二醇、聚甘油等之醇系潤滑劑;月桂酸、肉豆蔻酸、棕櫚酸、硬脂酸、花生酸、山萮酸、蓖麻油酸、環烷酸等之鎂、鈣、鎘、鋇、鋅、鉛等金屬鹽的金屬皂類;巴西棕櫚蠟、勘地里拉蠟、蜜蠟、蒙旦蠟(亦稱褐煤蠟)等天然蠟類。Examples of the lubricant include hydrocarbon-based lubricants such as paraffin wax, microcrystalline wax, and polyethylene wax; and higher fatty acid-based lubricants such as lauric acid, myristic acid, palmitic acid, stearic acid, arachidic acid, and behenic acid; a high-grade fatty amide-based lubricant such as stearylamine, palm amide, ceramide, methylenebisstearylamine or ethyl bis-stearamide; hardened castor oil, butyl stearate, a higher fatty acid ester-based lubricant such as ethylene glycol monostearate or pentaerythritol (mono, di-, tri- or tetra) stearate; cetyl alcohol, stearyl alcohol, polyethylene glycol, polyglycerin, etc. Alcohol-based lubricant; metal salts of magnesium, calcium, cadmium, strontium, zinc, lead, etc. of lauric acid, myristic acid, palmitic acid, stearic acid, arachidic acid, behenic acid, ricinoleic acid, naphthenic acid, etc. Metal soaps; natural waxes such as carnauba wax, rehearsal wax, beeswax, and montan wax (also known as montan wax).
耦合劑可列舉如:3-縮水甘油氧基丙基三甲氧基矽烷、3-縮水甘油氧基丙基甲基二甲氧矽烷、3-縮水甘油氧基丙基三甲氧基矽烷、2-(3,4-環氧基環己基)乙基三甲氧基矽烷、N-(2-胺基乙基)3-胺基丙基甲基二甲氧矽烷、N-(2-胺基乙基)3-胺基丙基甲基三甲氧基矽烷、3-胺基丙基三乙氧基矽烷、3-巰基丙基三甲氧基矽烷、乙烯基三甲氧基矽烷、N-(2-(乙烯基苯甲胺基)乙基)3-胺基丙基三甲氧基矽烷鹽酸鹽、3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-氯丙基甲基二甲氧矽烷、3-氯丙基甲基三甲氧基矽烷等之矽烷系耦合劑;(N-乙基胺基乙基胺基)鈦酸異丙酯、三異硬脂醯基鈦酸異丙酯、二(二辛基焦磷醯基)氧基乙酸鈦、四異丙基二(二辛基亞磷酸基)鈦酸酯、新烷氧基三(p-N-(β-胺基乙基)胺基苯基)鈦酸酯等之鈦系耦合劑;乙醯丙酮鋯、甲基丙烯酸鋯、丙酸鋯、新烷氧基鋯酸酯、新烷氧基三新癸醯基鋯酸酯、新烷氧基三(十二醯基)苯磺醯鋯酸酯、新烷氧基三(乙二胺乙基)鋯酸酯、新烷氧基三(間-胺基苯基)鋯酸酯、碳酸鋯銨、乙醯丙酮鋁、甲基丙烯酸鋁、丙酸鋁等之鋯或鋁系耦合劑。The coupling agent may, for example, be 3-glycidoxypropyltrimethoxydecane, 3-glycidoxypropylmethyldimethoxydecane, 3-glycidoxypropyltrimethoxydecane, 2-( 3,4-Epoxycyclohexyl)ethyltrimethoxydecane, N-(2-aminoethyl) 3-aminopropylmethyldimethoxydecane, N-(2-aminoethyl) 3-aminopropylmethyltrimethoxydecane, 3-aminopropyltriethoxydecane, 3-mercaptopropyltrimethoxydecane, vinyltrimethoxydecane, N-(2-(vinyl Benzylamino)ethyl)3-aminopropyltrimethoxydecane hydrochloride, 3-methylpropenyloxypropyltrimethoxydecane, 3-chloropropylmethyldimethoxydecane, 3 a decane-based coupling agent such as chloropropylmethyltrimethoxydecane; (N-ethylaminoethylamino) isopropyl titanate, isopropyl triisostearate isopropyl titanate, and di(II) Octyl pyroylphosphonium oxyacetate, tetraisopropylbis(dioctylphosphite) titanate, neoalkoxytris(pN-(β-aminoethyl)aminophenyl) Titanium coupling agent such as titanate; zirconium acetonate, zirconium methacrylate, zirconium propionate, neoalkoxy zirconate, new Oxygen tridecyl zirconate, neoalkoxytris(taudecyl)benzenesulfonium zirconate, neoalkoxytris(ethylenediamineethyl)zirconate, neoalkoxy III A zirconium or aluminum-based coupling agent such as (m-aminophenyl) zirconate, ammonium zirconium carbonate, aluminum acetonate, aluminum methacrylate or aluminum propionate.
光安定劑以受阻胺系之光安定劑(HALS)為合適。HALS並無特別限定者,惟可列舉如:二丁胺‧1,3,5-三‧N,N-雙(2,2,6,6-四甲基-4-哌啶基)-1,6-己二胺與N-(2,2,6,6-四甲基-4-哌啶基)丁基胺之縮聚物、琥珀酸二甲基-1-(2-羥乙基)-4-羥基-2,2,6,6-四甲基哌啶縮聚物、聚[{6-(1,1,3,3-四甲基丁基)胺基-1,3,5-三-2,4-二基}{(2,2,6,6-四甲基-4-哌啶基)亞胺基}六亞甲基{(2,2,6,6-四甲基-4-哌啶基)亞胺基}]、雙(1,2,2,6,6-五甲基-4-哌啶基)[[3,5-雙(1,1-二甲基乙基)-4-羥基苯基]甲基]丁基丙二酸酯、雙(2,2,6,6-四甲基-4-哌啶基)癸二酸酯、雙(1,2,2,6,6-五甲基-4-哌啶基)癸二酸酯、雙(1-辛氧基-2,2,6,6-四甲基-4-哌啶基)癸二酸酯、2-(3,5-二第三丁基-4-羥基苯甲基)-2-正丁基丙二酸雙(1,2,2,6,6-五甲基-4-哌啶基)酯等。HALS可僅使用一種或2種類以上併用。The light stabilizer is suitably a hindered amine light stabilizer (HALS). HALS is not particularly limited, but can be listed as: dibutylamine ‧1,3,5-three ‧N,N-bis(2,2,6,6-tetramethyl-4-piperidinyl)-1,6-hexanediamine and N-(2,2,6,6-tetramethyl-4 Polycondensate of -piperidinyl)butylamine, dimethyl-1-(2-hydroxyethyl)-4-hydroxy-2,2,6,6-tetramethylpiperidine condensate, poly[ {6-(1,1,3,3-tetramethylbutyl)amino-1,3,5-three -2,4-diyl}{(2,2,6,6-tetramethyl-4-piperidinyl)imido}hexamethylene {(2,2,6,6-tetramethyl-) 4-piperidinyl)imido}], bis(1,2,2,6,6-pentamethyl-4-piperidinyl)[[3,5-bis(1,1-dimethyl) 4-hydroxyphenyl]methyl]butyl malonate, bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate, bis(1,2, 2,6,6-pentamethyl-4-piperidinyl) sebacate, bis(1-octyloxy-2,2,6,6-tetramethyl-4-piperidyl)sebacic acid Ester, 2-(3,5-di-t-butyl-4-hydroxybenzyl)-2-n-butylmalonic acid bis(1,2,2,6,6-pentamethyl-4-piperidin Pyridyl) ester and the like. HALS can be used alone or in combination of two or more types.
抗氧化劑可列舉如:酚系、硫系以及磷系抗氧化劑等。Examples of the antioxidant include a phenol type, a sulfur type, and a phosphorus type antioxidant.
酚系抗氧化劑之具體例可列舉如:2,6-二第三丁基-對甲酚、丁基化羥基苯甲醚、2,6-二第三丁基-對乙基酚、硬脂基-β-(3,5-二第三丁基-4-羥基苯基)丙酸酯、異辛基-3-(3,5-二第三丁基-4-羥基苯基)丙酸酯、2,4-雙-(正辛基硫基)-6-(4-羥基-3,5-二第三丁基苯胺基)-1,3,5-三、2,4-雙[(辛基硫基)甲基]鄰甲酚等單酚類;2,2’-亞甲基雙(4-甲基-6-第三丁基酚)、2,2’-亞甲基雙(4-乙基-6-第三丁基酚)、4,4’-硫基雙(3-甲基-6-第三丁基酚)、4,4’-亞丁基雙(3-甲基-6-第三丁基酚)、三甘醇-雙[3-(3-第三丁基-5-甲基-4-羥基苯基)丙酸酯]、1,6-己二醇-雙[3-(3,5-二第三丁基-4-羥基苯基)丙酸酯]、N,N’-六亞甲基雙(3,5-二第三丁基-4-羥基氫化肉桂醯胺)、2,2’-硫基-二伸乙基雙[3-(3,5-二第三丁基-4-羥基苯基)丙酸酯]、3,5-二第三丁基-4-羥基苯甲基-膦酸酯-二乙酯、3,9-雙[1,1-二甲基-2-{β-(3-第三丁基-4-羥基-5-甲苯基)丙醯氧基}乙基]2,4,8,10-四氧雜螺[5,5]十一烷、雙(3,5-二第三丁基-4-羥基苯甲基磺酸乙酯鈣等之雙酚類;1,1,3-三(2-甲基-4-羥基-5第三丁基苯基)丁烷、1,3,5-三甲基-2,4,6-三(3,5-二第三丁基-4-羥基苯甲基)苯、四-[亞甲基-3-(3’,5’-二第三丁基-4’-羥基苯基)丙酸酯]甲烷、雙[3,3’-雙-(4’-羥基-3’-第三丁基苯基)丁酸]二醇酯、三-(3,5-二第三丁基-4-羥基苯甲基)-異氰脲酸酯、1,3,5-三(3’,5’-二第三丁基-4’-羥基苯甲基)-S-三-2,4,6-(1H,3H,5H)三酮、茶兒酚等之高分子型酚類。Specific examples of the phenolic antioxidant include 2,6-di-t-butyl-p-cresol, butylated hydroxyanisole, 2,6-di-t-butyl-p-ethylphenol, and stearin. Benzyl-β-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, isooctyl-3-(3,5-di-t-butyl-4-hydroxyphenyl)propionic acid Ester, 2,4-bis-(n-octylthio)-6-(4-hydroxy-3,5-di-t-butylanilino)-1,3,5-three Monophenols such as 2,4-bis[(octylthio)methyl]o-cresol; 2,2'-methylenebis(4-methyl-6-tert-butylphenol), 2, 2'-methylenebis(4-ethyl-6-tert-butylphenol), 4,4'-thiobis(3-methyl-6-tert-butylphenol), 4,4'- Butylene bis(3-methyl-6-tert-butylphenol), triethylene glycol-bis[3-(3-tert-butyl-5-methyl-4-hydroxyphenyl)propionate], 1,6-hexanediol-bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], N,N'-hexamethylenebis(3,5-di Third butyl-4-hydroxy hydrogenated cinnamylamine), 2,2'-thio-diethylidene bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate ], 3,5-di-t-butyl-4-hydroxybenzyl-phosphonate-diethyl ester, 3,9-bis[1,1-dimethyl-2-{β-(3- Tributyl-4-hydroxy-5-tolyl)propoxy}ethyl]2,4,8,10-tetraoxaspiro[5,5]undecane, bis(3,5-di a bisphenol such as calcium tributyl-4-hydroxybenzylsulfonate; 1,1,3-tris(2-methyl-4-hydroxy-5-tert-butylphenyl)butane, 1 ,3,5-trimethyl-2,4,6-tris(3,5-di-t-butyl-4-hydroxybenzyl)benzene, tetra-[methylene-3-(3',5 '-Di-tert-butyl-4'-hydroxyphenyl)propionate] methane, double [3,3' - bis-(4'-hydroxy-3'-tert-butylphenyl)butyric acid]diol, tris-(3,5-di-t-butyl-4-hydroxybenzyl)-isocyanuramide Acid ester, 1,3,5-tris(3',5'-di-t-butyl-4'-hydroxybenzyl)-S-three -2,4,6-(1H,3H,5H) triols, tea phenols and other polymeric phenols.
硫系抗氧化劑之具體例係如:3,3’-硫代二丙酸二月桂酯、3,3’-硫代二丙酸二肉豆蔻酯、3,3’-硫代二丙酸二硬脂酯等。Specific examples of the sulfur-based antioxidant are: 3,3'-dilaurate of thiodipropionate, 3,3'-thiodipropionate dimyristate, 3,3'-thiodipropionic acid Stearyl ester and the like.
磷系抗氧化劑之具體例係如:三苯基亞磷酸酯、二苯基異癸基亞磷酸酯、苯基二異癸基亞磷酸酯、三(壬基苯基)亞磷酸酯、二異癸基季戊四醇亞磷酸酯、三(2,4-二第三丁基苯基)亞磷酸酯、環新戊烷四基雙(十八烷基)亞磷酸酯、環新戊烷四基雙(2,4-二第三丁基苯基)亞磷酸酯、環新戊烷四基雙(2,4-二第三丁基-4-甲基苯基)亞磷酸酯、雙[2-第三丁基-6-甲基-4-{2-(十八烷氧基羰基)乙基}苯基]氫亞磷酸酯等之亞磷酸酯類;9,10-二氫-9-氧雜-10-膦菲-10-氧化物、10-(3,5-二第三丁基-4-羥基苯甲基)-9,10-二氫-9-氧雜-10-膦菲-10-氧化物、10-癸氧基-9,10-二氫-9-氧雜-10-膦菲-10-氧化物等之氧雜膦菲氧化物類等。Specific examples of the phosphorus-based antioxidant are: triphenyl phosphite, diphenylisodecyl phosphite, phenyl diisodecyl phosphite, tris(nonylphenyl) phosphite, diiso Indole pentaerythritol phosphite, tris(2,4-di-t-butylphenyl)phosphite, cyclopentanetetraylbis(octadecyl)phosphite, cyclopentane tetrakis 2,4-di-t-butylphenyl)phosphite, cyclopentanetetraylbis(2,4-di-t-butyl-4-methylphenyl)phosphite, double [2- a phosphite such as tributyl-6-methyl-4-{2-(octadecyloxycarbonyl)ethyl}phenyl]hydrogen phosphite; 9,10-dihydro-9-oxa -10-phosphinophen-10-oxide, 10-(3,5-di-t-butyl-4-hydroxybenzyl)-9,10-dihydro-9-oxa-10-phosphinophen-10 An oxaphosphonium phenanthrene oxide such as an oxide or a 10-decyloxy-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide.
該等抗氧化劑可分別單獨使用,亦可併用2種以上之組合。特別在本發明中以磷系抗氧化劑為佳。相對於本發明之硬化性樹脂組成物中的樹脂成分100重量份,抗氧化劑之使用量,一般為0.008至1重量份,以0.01至0.5重量份為佳。These antioxidants may be used alone or in combination of two or more. In particular, in the present invention, a phosphorus-based antioxidant is preferred. The antioxidant is used in an amount of usually 0.008 to 1 part by weight, preferably 0.01 to 0.5 part by weight, per 100 parts by weight of the resin component in the curable resin composition of the present invention.
將本發明之硬化性樹脂組成物使用在光半導體密封劑時,可因應所需而添加螢光體。螢光體係例如藉由吸收一部分由藍色LED元件所發出之藍色光,而發出波長經轉換的黃色光之具有形成白色光之作用者。將螢光體預先分散於硬化性樹脂組成物後,將光半導體密封。螢光體並無特別限制,可使用以往習知之螢光體,例如可列舉:稀土元素之鋁酸鹽、硫代沒食子酸鹽、原矽酸鹽等。更具體而言,可列舉如:YAG螢光體、TAG螢光體、原矽酸鹽螢光體、硫代沒食子酸鹽螢光體、硫化物螢光體等螢光體,例如:YAlO3 :Ce、Y3 Al5 O12 :Ce、Y4 Al2 O9 :Ce、Y2 O2 S:Eu、Sr5 (PO4 )3 Cl:Eu、(SrEu)O‧Al2 O3 等。該螢光體之粒徑可使用該領域習知之粒徑,而平均粒徑為1至250μm,以2至50μm為佳。在使用該等螢光體時,相對於該樹脂成分100重量份,其添加量為1至80重量份,以5至60重量份為佳。When the curable resin composition of the present invention is used in a photo-semiconductor encapsulant, a phosphor can be added as needed. The fluorescent system emits white light having a wavelength converted by, for example, absorbing a portion of the blue light emitted by the blue LED element. After the phosphor is previously dispersed in the curable resin composition, the photo-semiconductor is sealed. The phosphor is not particularly limited, and conventionally used phosphors can be used, and examples thereof include an aluminate of a rare earth element, a thiogallate, and a protoporate. More specifically, examples thereof include a phosphor such as a YAG phosphor, a TAG phosphor, a protonate phosphor, a thiogallate phosphor, or a sulfide phosphor, and for example: YAlO 3 :Ce, Y 3 Al 5 O 12 :Ce, Y 4 Al 2 O 9 :Ce, Y 2 O 2 S:Eu, Sr 5 (PO 4 ) 3 Cl:Eu, (SrEu)O‧Al 2 O 3 and so on. The particle diameter of the phosphor may be a particle diameter conventionally known in the art, and the average particle diameter is from 1 to 250 μm, preferably from 2 to 50 μm. When these phosphors are used, the amount thereof is from 1 to 80 parts by weight, preferably from 5 to 60 parts by weight, per 100 parts by weight of the resin component.
本發明之較佳硬化性樹脂組成物係如下述。The preferred curable resin composition of the present invention is as follows.
(I)一種硬化性樹脂組成物,係含有上述(i)至(xix)中任一記載之含反應性官能基之矽氧烷化合物(以下稱為本發明之矽氧烷化合物(A)或該矽氧烷化合物(A))以及可任意含有之該矽氧烷化合物(A)以外的環氧化合物(以下亦稱為O-EPO),其總量相對於組成物全體為30至90重量%(以下如無特別限制則表示重量%),其餘部份為硬化劑(B)者。(I) A curable resin composition containing the reactive functional group-containing oxirane compound (hereinafter referred to as the oxoxane compound (A) of the present invention or the above-mentioned (i) to (xix) The oxoxane compound (A)) and an epoxy compound (hereinafter also referred to as O-EPO) other than the siloxane compound (A) which is optionally contained, the total amount thereof being 30 to 90 by weight based on the entire composition. % (hereinafter, unless otherwise specified, the weight %), and the rest is the hardener (B).
(II)如上述(I)所記載之硬化性樹脂組成物,其中,相對於該矽氧烷化合物(A)之環氧基1當量,硬化劑(B)所含範圍為0.2至1.5當量。(II) The curable resin composition according to the above (I), wherein the hardener (B) is contained in an amount of from 0.2 to 1.5 equivalents per equivalent of the epoxy group of the siloxane compound (A).
(III)如上述(I)或(II)所記載之硬化性樹脂組成物,其中,相對於組成物全體,該矽氧烷化合物(A)以及可任意含有之O-EPO,其總量為50至90%。(III) The curable resin composition according to the above (I) or (II), wherein the total amount of the oxirane compound (A) and optionally O-EPO is the same as the total amount of the composition. 50 to 90%.
(IV)如上述(I)至(III)中任一記載之硬化性樹脂組成物,其中,相對於該矽氧烷化合物(A)以及可任意含有之O-EPO之總量,該矽氧烷化合物(A)之比例為50至100%。(IV) The curable resin composition according to any one of the above-mentioned (I) to (III), wherein the oxy-oxygen compound (A) and the total amount of O-EPO which may be optionally contained are oxidized. The ratio of the alkane compound (A) is from 50 to 100%.
(V)如上述(I)至(IV)中任一記載之硬化性樹脂組成物,其中,相對於該矽氧烷化合物(A)以及可任意含有之O-EPO之總量,該矽氧烷化合物(A)之比例為30至90%。(V) The curable resin composition according to any one of the above-mentioned (I) to (IV), wherein the oxy-oxygen compound (A) and the total amount of O-EPO which may be optionally contained are oxidized. The ratio of the alkane compound (A) is from 30 to 90%.
(VI)如上述(I)至(V)中任一記載之硬化性樹脂組成物,其中,相對於該矽氧烷化合物(A)10重量份,復含有0.001至15重量份之比例的硬化促進劑。The curable resin composition according to any one of the above-mentioned (1), wherein the hardening resin is contained in an amount of 0.001 to 15 parts by weight based on 10 parts by weight of the siloxane compound (A). Promoter.
(VII)如上述(I)至(VI)中任一記載之硬化性樹脂組成物,其中,硬化劑(B)為酸酐化合物或羧酸化合物。(VII) The curable resin composition according to any one of the above (1), wherein the curing agent (B) is an acid anhydride compound or a carboxylic acid compound.
上述本發明之硬化性樹脂組成物係將上述原料以任意方法均勻混合即可獲得。The curable resin composition of the present invention described above can be obtained by uniformly mixing the above raw materials by any method.
上述本發明之硬化性樹脂組成物係含有含反應性官能基之矽氧烷化合物(A)、硬化劑(B)以及因應所需之硬化促進(C)劑者,在該硬化性樹脂組成物中,如有進一步需要,可調配其他之任意調配成分。其他之任意調配成分可列舉如:無機質充填劑、著色劑、聚矽氧樹脂、流平劑、潤滑劑、耦合劑、光安定劑、抗氧化劑以及螢光體等。該等其他調配成分,相對於該矽氧烷化合物(A)以及硬化劑(B)之總量100重量份,可在0至500重量份之範圍適宜地添加,以0至100重量份左右為佳。調配該等其他調配成分者,在固態時,使用亨舍爾攪拌機(Henschel mixer)、圓錐形螺旋混合機(Nauta mixer)等混合機混合後,使用捏合機、押出機、加熱輥於80至120℃下進行混練並冷卻後,經粉碎而得粉末狀者。另一方面,所調配者如為液態時,使用行星式攪拌機(Planetary mixer)等進行均勻分散,亦可做成含有該等之其他調配成分的本發明之硬化性樹脂組成物。The curable resin composition of the present invention contains a reactive functional group-containing oxirane compound (A), a curing agent (B), and a curing-promoting (C) agent required for the curing, and the curable resin composition In addition, if there is further need, other optional ingredients can be adjusted. Other optional ingredients may be, for example, inorganic fillers, colorants, polyoxyxides, leveling agents, lubricants, coupling agents, photosensitizers, antioxidants, and phosphors. The other compounding component may be appropriately added in an amount of from 0 to 500 parts by weight, based on 100 parts by weight of the total amount of the siloxane compound (A) and the curing agent (B), and is from about 0 to 100 parts by weight. good. For the preparation of these other ingredients, in a solid state, use a mixer such as a Henschel mixer or a Nauta mixer, and then use a kneader, an extruder, and a heating roller at 80 to 120. After kneading at °C and cooling, the powder is obtained by pulverization. On the other hand, when the blender is in a liquid state, it is uniformly dispersed by using a planetary mixer or the like, and the curable resin composition of the present invention containing the other blending components may be used.
使用如此而得之本發明的組成物,將LED、感光器、收發器(transceiver)等之光半導體密封而得本發明之光半導體時,可用轉注成型(transfer moulding)、壓縮成型(compression molding)、射出成形(injection molding)、點膠(dispensing)法、印刷法等之以往的成型方法成形。並且,成形後,用以使光半導體密封用樹脂組成物硬化之加熱方法,並無特別限制者,可採用熱風循環式加熱、紅外線加熱、高頻加熱等以往之習知方法。硬化條件一般約在80至250℃下於30秒鐘至15小時之範圍進行加熱,然亦可適當地更換條件。較佳條件為110至200℃,較佳者係例如:最先在100至140℃下進行硬化,接著於130至200℃下進行最後硬化之方法。When the optical semiconductor of the present invention is obtained by sealing the optical semiconductor such as an LED, a photoreceptor or a transceiver by using the composition of the present invention thus obtained, transfer molding and compression molding can be used. Forming by a conventional molding method such as injection molding, dispensing, and printing. Further, after the molding, the heating method for curing the resin composition for sealing the optical semiconductor is not particularly limited, and conventional conventional methods such as hot air circulation heating, infrared heating, and high frequency heating can be employed. The hardening conditions are generally heated at about 80 to 250 ° C for a period of from 30 seconds to 15 hours, but the conditions may be appropriately changed. Preferred conditions are from 110 to 200 ° C, preferably such as: first hardening at 100 to 140 ° C, followed by final hardening at 130 to 200 ° C.
以下係依合成例、實施例更詳加說明本發明。同時,本發明並非限定於該等合成例、實施例。而且,實施例中之各物性值係依以下方法測定。Hereinafter, the present invention will be described in more detail by way of Synthesis Examples and Examples. Meanwhile, the present invention is not limited to the above-described synthesis examples and examples. Further, each physical property value in the examples was measured by the following method.
(1)分子量:係依凝膠滲透層析(GPC)法以下述條件測定而求出之聚苯乙烯換算重量平均分子量。(1) Molecular weight: A polystyrene-equivalent weight average molecular weight determined by a gel permeation chromatography (GPC) method under the following conditions.
製造廠商:島津製作所Manufacturer: Shimadzu Corporation
管柱:保護管柱SHODEX GPC LF-G LF-804(3支)Pipe column: protection column SHODEX GPC LF-G LF-804 (3 pieces)
流速:1.0ml/min.Flow rate: 1.0ml/min.
管柱溫度:40℃Column temperature: 40 ° C
使用溶劑:THF(四氫呋喃)Solvent: THF (tetrahydrofuran)
檢測器:RI(示差折射檢測器)Detector: RI (differential refraction detector)
(2)環氧當量:依JIS K-7236所記載之方法測定。(2) Epoxy equivalent: Measured according to the method described in JIS K-7236.
(3)黏度:使用東機產業(股)製造之E型黏度計(TV-20)在25℃測定。(3) Viscosity: It was measured at 25 ° C using an E-type viscometer (TV-20) manufactured by Toki Sangyo Co., Ltd.
以下係依合成例、實施例更詳加說明本發明。同時,合成例、實施例中之「份」、「%」分別為「重量份」、「重量%」之意。而且,烷氧當量以及矽醇當量雖未記載單位,惟該等單位皆為g/eq。Hereinafter, the present invention will be described in more detail by way of Synthesis Examples and Examples. Meanwhile, the "parts" and "%" in the synthesis examples and the examples are "parts by weight" and "% by weight", respectively. Further, although the alkoxy equivalent and the decyl alcohol equivalent are not described, the units are all g/eq.
第1階段反應:將β-(3,4-環氧基環己基)乙基三甲氧基矽烷197.1份(烷氧當量82.1g/eq)、重量平均分子量1060(GPC測定值)之矽醇末端二甲基聚矽氧油237.4份(矽醇當量530g/eq)、0.5%氫氧化鉀(KOH)甲醇溶液21.3份(KOH份數為0.11份)裝入反應容器中,並使液溫升高至75℃。升溫後,在回流下於75℃中反應8小時。矽醇當量530g/eq係以GPC所測定之重量平均分子量1060做為聚矽氧油之分子量,由於每分子具有2個矽醇基,因而求算其一半值。以下實施例中,矽醇末端聚矽氧油(b)之矽醇當量亦以同法求取。Phase 1 reaction: 197.1 parts of β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane (alkoxy equivalent: 82.1 g/eq), weight average molecular weight 1060 (GPC measured value) of the sterol end 237.4 parts of dimethylpolysiloxane (sterol equivalent 530g/eq), 21.3 parts of 0.5% potassium hydroxide (KOH) methanol solution (0.11 parts of KOH) were charged into the reaction vessel, and the liquid temperature was raised. To 75 ° C. After the temperature was raised, the reaction was carried out at 75 ° C for 8 hours under reflux. The sterol equivalent weight 530 g/eq is a molecular weight molecular weight of 1060 measured by GPC as the molecular weight of the polyoxygenated oil, and since it has two sterol groups per molecule, half of the value is calculated. In the following examples, the sterol equivalent of the sterol terminal polyoxyxane oil (b) was also determined in the same manner.
第2階段反應:在上述所得反應液中加入甲醇305份,並於此以60分鐘滴入50%蒸餾水甲醇溶液86.4份,接著在回流下於75℃反應8小時。反應結束後,將反應液以5%磷酸二氫鈉水溶液中和後,於80℃下蒸餾回收甲醇。在剩餘的反應液中添加甲基異丁酮(MIBK)380份之後,進行反覆3次之水洗。接著將有機相分離後,在減壓、100℃下去除溶媒,藉此而得到具有反應性官能基之嵌段型矽氧烷化合物(A-1)344份。所得化合物之環氧當量為457g/eq,重量平均分子量為3700,黏度為600mPa‧S,外觀為無色透明。The second-stage reaction: 305 parts of methanol was added to the reaction liquid obtained above, and 86.4 parts of a methanol solution of 50% distilled water was added dropwise thereto over 60 minutes, followed by a reaction at 75 ° C for 8 hours under reflux. After completion of the reaction, the reaction solution was neutralized with a 5% aqueous sodium dihydrogen phosphate solution, and then methanol was distilled off at 80 °C. After adding 380 parts of methyl isobutyl ketone (MIBK) to the remaining reaction liquid, water washing was repeated three times. After the organic phase was separated, the solvent was removed under reduced pressure at 100 ° C to obtain 344 parts of a block type siloxane compound (A-1) having a reactive functional group. The obtained compound had an epoxy equivalent of 457 g/eq, a weight average molecular weight of 3,700, a viscosity of 600 mPa·s, and a colorless and transparent appearance.
屬於倍半矽氧烷鏈段之矽原子比例(相對於全部矽原子,由饋入原料比所算出之結合3個氧原子的矽原子之比例)為19.6莫耳%。同樣地,屬於鏈狀聚矽氧鏈段之矽原子比例為80.4莫耳%。實施例2The proportion of ruthenium atoms belonging to the sesquioxane chain segment (the ratio of the ruthenium atoms combined with the three oxygen atoms calculated from the feedstock ratio to the total ruthenium atom) was 19.6 mol%. Similarly, the proportion of germanium atoms belonging to the chain polyoxynene segment was 80.4 mol%. Example 2
第1階段反應:將β-(3,4-環氧基環己基)乙基三甲氧基矽烷197.1份(烷氧當量82.1)、重量平均分子量6120(GPC測定值)之矽醇末端二甲基聚矽氧油237.4份(矽醇當量3060)、0.5% KOH甲醇溶液20.0份(KOH份數為0.1份)裝入反應容器中,並使液溫升高至75℃。升溫後,在回流下於75℃反應8小時。Phase 1 reaction: 197.1 parts of β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane (alkoxy equivalent: 82.1), weight average molecular weight 6120 (GPC measured value) of sterol terminal dimethyl 237.4 parts of polyoxygenated oil (sterol equivalent of 3060) and 20.0 parts of a 0.5% KOH methanol solution (0.1 part by weight of KOH) were placed in a reaction vessel, and the liquid temperature was raised to 75 °C. After the temperature was raised, the mixture was reacted at 75 ° C for 8 hours under reflux.
第2階段反應:追加甲醇260份後,以60分鐘滴入50%蒸餾水甲醇溶液86.4份,使其在回流下於75℃反應8小時。反應結束後,以5%磷酸二氫鈉水溶液中和後,於80℃下蒸餾回收甲醇。添加MIBK 380份,進行反覆3次之水洗。接著將有機相在減壓、100℃下去除溶媒,藉此而得到具有反應性官能基之嵌段型矽氧烷化合物(A-2)360份。所得化合物之環氧當量為468g/eq,重量平均分子量為4160,黏度為481mPa‧s,外觀為無色透明。In the second-stage reaction, after adding 260 parts of methanol, 86.4 parts of a methanol solution of 50% distilled water was added dropwise thereto over 60 minutes, and the mixture was reacted at 75 ° C for 8 hours under reflux. After completion of the reaction, the mixture was neutralized with a 5% aqueous sodium dihydrogen phosphate solution, and then methanol was distilled off at 80 °C. 380 parts of MIBK were added and washed three times. Next, the organic phase was subjected to a solvent under reduced pressure at 100 ° C to obtain 360 parts of a block type siloxane compound (A-2) having a reactive functional group. The obtained compound had an epoxy equivalent of 468 g/eq, a weight average molecular weight of 4,160, a viscosity of 481 mPa·s, and a colorless and transparent appearance.
屬於倍半矽氧烷鏈段之矽原子比例為19.6莫耳%。同樣地,屬於鏈狀聚矽氧鏈段之矽原子比例為80.4莫耳%。實施例3The proportion of ruthenium atoms belonging to the sesquioxane chain segment was 19.6 mol%. Similarly, the proportion of germanium atoms belonging to the chain polyoxynene segment was 80.4 mol%. Example 3
第1階段反應:將β-(3,4-環氧基環己基)乙基三甲氧基矽烷98.6份(烷氧當量82.1)、重量平均分子量15800(GPC測定值)之矽醇末端二甲基聚矽氧油118.7份(矽醇當量7900)、0.5% KOH甲醇溶液10.0份(KOH份數為0.05份)裝入反應容器中,使液溫升高至75℃。升溫後,在回流下於75℃反應8小時。Phase 1 reaction: 98.6 parts of β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane (alkoxy equivalent: 82.1), weight average molecular weight 15800 (GPC measured value) of sterol terminal dimethyl 118.7 parts of polyoxygenated oil (sterol equivalent of 7900) and 10.0 parts of a 0.5% KOH methanol solution (0.05 parts of KOH fraction) were placed in a reaction vessel to raise the liquid temperature to 75 °C. After the temperature was raised, the mixture was reacted at 75 ° C for 8 hours under reflux.
第2階段反應:追加甲醇142份後,以60分鐘滴入50%蒸餾水甲醇溶液43.2份,使其在回流下於75℃中反應8小時。反應結束後,以5%磷酸二氫鈉水溶液中和後,於80℃下蒸餾回收甲醇。添加MIBK 191份,進行反覆3次之水洗。接著將有機相在減壓、100℃下去除溶媒,藉此而得到具有反應性官能基之嵌段型矽氧烷化合物(A-3)169份。所得化合物之環氧當量為477g/eq,重量平均分子量為4130,黏度為710mPa‧s,外觀為無色透明。The second-stage reaction: After adding 142 parts of methanol, 43.2 parts of a 50% distilled water methanol solution was added dropwise thereto over 60 minutes, and the mixture was reacted at 75 ° C for 8 hours under reflux. After completion of the reaction, the mixture was neutralized with a 5% aqueous sodium dihydrogen phosphate solution, and then methanol was distilled off at 80 °C. 191 parts of MIBK were added, and the washing was repeated three times. Next, the organic phase was subjected to a solvent under reduced pressure at 100 ° C to obtain 169 parts of a block type siloxane compound (A-3) having a reactive functional group. The obtained compound had an epoxy equivalent of 477 g/eq, a weight average molecular weight of 4130, a viscosity of 710 mPa·s, and a colorless transparency.
屬於倍半矽氧烷鏈段之矽原子比例為19.6莫耳%。同樣地,屬於鏈狀聚矽氧鏈段之矽原子比例為80.4莫耳%。實施例4The proportion of ruthenium atoms belonging to the sesquioxane chain segment was 19.6 mol%. Similarly, the proportion of germanium atoms belonging to the chain polyoxynene segment was 80.4 mol%. Example 4
第1階段反應:將β-(3,4-環氧基環己基)乙基三甲氧基矽烷49.3份(烷氧當量82.1)、苯基三甲氧基矽烷39.7份(烷氧當量66.1)、重量平均分子量1700(GPC測定值)之矽醇末端甲基苯基聚矽氧油118.7份(矽醇當量850)、0.5%KOH甲醇溶液10.0份(KOH份數為0.05份)裝入反應容器中,使液溫升高至75℃。升溫後,在回流下於75℃反應8小時。Stage 1 reaction: 49.3 parts of β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane (alkoxy equivalent: 82.1), 39.7 parts of phenyltrimethoxydecane (alkoxy equivalent 66.1), weight 118.7 parts (sterol equivalent weight 850) of sterol-terminated methylphenyl polyfluorene oxide having an average molecular weight of 1,700 (GPC measured value), and 10.0 parts of a 0.5% KOH methanol solution (0.05 parts of KOH) were placed in a reaction vessel. The liquid temperature was raised to 75 °C. After the temperature was raised, the mixture was reacted at 75 ° C for 8 hours under reflux.
第2階段反應:追加甲醇123份後,以60分鐘滴入50%蒸餾水甲醇溶液43.2份,使其在回流下於75℃中反應8小時。反應結束後,以5%磷酸二氫鈉水溶液中和後,於80℃下蒸餾回收甲醇。添加MIBK 191份,進行反覆3次之水洗。接著將有機相在減壓、100℃下去除溶媒,藉此而得到具有反應性官能基之嵌段型矽氧烷化合物(A-4)168份。所得化合物之環氧當量為874g/eq,重量平均分子量為2630,黏度為4600mPa‧s,外觀為無色透明。In the second-stage reaction, after adding 123 parts of methanol, 43.2 parts of a 50% distilled water methanol solution was added dropwise thereto over 60 minutes, and the mixture was reacted at 75 ° C for 8 hours under reflux. After completion of the reaction, the mixture was neutralized with a 5% aqueous sodium dihydrogen phosphate solution, and then methanol was distilled off at 80 °C. 191 parts of MIBK were added, and the washing was repeated three times. Next, the organic phase was subjected to a solvent under reduced pressure at 100 ° C to obtain 168 parts of a block type siloxane compound (A-4) having a reactive functional group. The obtained compound had an epoxy equivalent of 874 g/eq, a weight average molecular weight of 2,630, a viscosity of 4,600 mPa·s, and a colorless and transparent appearance.
屬於倍半矽氧烷鏈段之矽原子比例為22.5莫耳%。同樣地,屬於鏈狀聚矽氧鏈段之矽原子比例為77.5莫耳%。實施例5The proportion of ruthenium atoms belonging to the sesquioxane chain segment was 22.5 mol%. Similarly, the proportion of germanium atoms belonging to the chain polyoxynene segment was 77.5 mol%. Example 5
第1階段反應:將β-(3,4-環氧基環己基)乙基三甲氧基矽烷49.3份(烷氧當量82.1)、甲基三甲氧基矽烷27.2份(烷氧當量45.4)、重量平均分子量1700(GPC測定值)之矽醇末端甲基苯基聚矽氧油118.7份(矽醇當量850)、0.5%KOH甲醇溶液10.0份(KOH份數為0.05份)裝入反應容器中,使液溫升高至75℃。升溫後,在回流下於75℃反應8小時。Stage 1 reaction: 49.3 parts of β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane (alkoxy equivalent: 82.1), methyl 3-methoxydecane 27.2 parts (alkoxy equivalent: 45.4), weight 118.7 parts (sterol equivalent weight 850) of sterol-terminated methylphenyl polyfluorene oxide having an average molecular weight of 1,700 (GPC measured value), and 10.0 parts of a 0.5% KOH methanol solution (0.05 parts of KOH) were placed in a reaction vessel. The liquid temperature was raised to 75 °C. After the temperature was raised, the mixture was reacted at 75 ° C for 8 hours under reflux.
第2階段反應:追加甲醇123份後,以60分鐘滴入50%蒸餾水甲醇溶液43.2份,使其在回流下於75℃中反應8小時。反應結束後,以5%磷酸二氫鈉水溶液中和後,於80℃下蒸餾回收甲醇。添加MIBK 166份,進行反覆3次之水洗。接著將有機相在減壓、100℃下去除溶媒,藉此而得到具有反應性官能基之嵌段型矽氧烷化合物(A-5)151份。所得化合物之環氧當量為832g/eq,重量平均分子量為5850,黏度為4610mPa‧s,外觀為無色透明。In the second-stage reaction, after adding 123 parts of methanol, 43.2 parts of a 50% distilled water methanol solution was added dropwise thereto over 60 minutes, and the mixture was reacted at 75 ° C for 8 hours under reflux. After completion of the reaction, the mixture was neutralized with a 5% aqueous sodium dihydrogen phosphate solution, and then methanol was distilled off at 80 °C. 166 parts of MIBK were added and washed three times in succession. Next, the organic phase was subjected to a solvent under reduced pressure at 100 ° C to obtain 151 parts of a block type siloxane compound (A-5) having a reactive functional group. The obtained compound had an epoxy equivalent of 832 g/eq, a weight average molecular weight of 5,850, a viscosity of 4610 mPa·s, and a colorless and transparent appearance.
屬於倍半矽氧烷鏈段之矽原子比例為20.0莫耳%。同樣地,屬於鏈狀聚矽氧鏈段之矽原子比例為80.0莫耳%。The proportion of ruthenium atoms belonging to the sesquioxane chain segment was 20.0 mol%. Similarly, the proportion of germanium atoms belonging to the chain polyoxynene segment was 80.0 mol%.
將β-(3,4-環氧基環己基)乙基三甲氧基矽烷37.0份(烷氧當量82.1)、重量平均分子量1060(GPC測定值)之矽醇末端二甲基聚矽氧油170.9份(矽醇當量530)、0.5% KOH甲醇溶液12.3份(KOH份數為0.06份)裝入反應容器中,使液溫升高至75℃。升溫後,在回流下於75℃反應4小時後,反應物成為溶劑不溶性之凝膠化物(A-6)。37.0 parts of β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane (alkoxy equivalent: 82.1), weight average molecular weight 1060 (GPC measured value) of decyl alcohol terminal dimethyl polyfluorene oxide 170.9 A portion (sterol equivalent 530), 12.3 parts of a 0.5% KOH methanol solution (0.06 parts of KOH fraction) was placed in a reaction vessel, and the liquid temperature was raised to 75 °C. After the temperature was raised, the reaction was carried out at 75 ° C for 4 hours under reflux, and the reaction product became a solvent-insoluble gel (A-6).
將β-(3,4-環氧基環己基)乙基三甲氧基矽烷98.6份(烷氧當量82.1)、重量平均分子量1060(GPC測定值)之矽醇末端二甲基聚矽氧油118.7份(矽醇當量530)、甲醇131份、0.5% KOH甲醇溶液10.0份(KOH份數為0.05份)裝入反應容器中,使液溫升高至75℃。升溫後,以60分鐘滴入50%蒸餾水甲醇溶液43.2份,使其在回流下於75℃中反應8小時。反應結束後,以5%磷酸二氫鈉水溶液中和後,於80℃下蒸餾回收甲醇。添加MIBK 191份,進行反覆3次之水洗。接著將有機相在減壓、100℃下去除溶媒,藉此而得到具有反應性官能基之矽氧烷化合物(A-7)176份。所得化合物之環氧當量為459g/eq,重量平均分子量為3300,外觀有白濁發生而無法作為光半導體密封材用組成物使用。98.6 parts of β-(3,4-epoxycyclohexyl)ethyltrimethoxynonane (alkoxy equivalent: 82.1), weight average molecular weight 1060 (GPC measured value) of decyl alcohol terminal dimethyl polyfluorene oxide 118.7 A portion (sterol equivalent of 530), 131 parts of methanol, and 10.0 parts of a 0.5% KOH methanol solution (0.05 parts of KOH) were placed in a reaction vessel to raise the liquid temperature to 75 °C. After the temperature was raised, 43.2 parts of a 50% distilled water methanol solution was added dropwise thereto over 60 minutes, and the mixture was reacted at 75 ° C for 8 hours under reflux. After completion of the reaction, the mixture was neutralized with a 5% aqueous sodium dihydrogen phosphate solution, and then methanol was distilled off at 80 °C. 191 parts of MIBK were added, and the washing was repeated three times. Next, the organic phase was subjected to a solvent under reduced pressure at 100 ° C to obtain 176 parts of a oxoxane compound (A-7) having a reactive functional group. The obtained compound had an epoxy equivalent of 459 g/eq and a weight average molecular weight of 3,300. The appearance of white turbidity occurred and it could not be used as a composition for an optical semiconductor sealing material.
與專利文獻1之合成方法同樣操作,將β-(3,4-環氧基環己基)乙基三甲氧基矽烷45.4份(烷氧當量82.1)、重量平均分子量6120(GPC測定值)之矽醇末端二甲基聚矽氧油54.6份(矽醇當量3060)、三乙基胺10.0份、MIBK 500份裝入反應容器中,在室溫下攪拌,將蒸餾水100份以30分鐘滴入,升溫至80℃後使反應6小時。反應結束後,以20%磷酸二氫鈉水溶液中和後,進行反覆3次之水洗。接著將有機相在減壓、100℃下去除溶媒,得到白濁之液體(A-8)85份,無法作為光半導體密封材用組成物使用。In the same manner as in the synthesis method of Patent Document 1, 45.4 parts of β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane (alkoxy equivalent: 82.1) and a weight average molecular weight of 6120 (GPC measured value) were obtained. 54.6 parts of an alcohol terminal dimethylpolyfluorene oxide (sterol equivalent of 3060), 10.0 parts of triethylamine, and 500 parts of MIBK were placed in a reaction vessel, and stirred at room temperature, and 100 parts of distilled water was added dropwise over 30 minutes. The temperature was raised to 80 ° C and the reaction was allowed to proceed for 6 hours. After completion of the reaction, the mixture was neutralized with a 20% aqueous solution of sodium dihydrogen phosphate, and then washed with water three times. Then, the organic phase was removed under reduced pressure at 100 ° C to obtain 85 parts of a white turbid liquid (A-8), which was not used as a composition for an optical semiconductor sealing material.
將β-(3,4-環氧基環己基)乙基三甲氧基矽烷78.8份(烷氧當量82.1)、重量平均分子量6120(GPC測定值)之矽醇末端二甲基聚矽氧油94.0份(矽醇當量3060)、甲醇104份、0.5% KOH甲醇溶液8.0份(KOH份數為0.04份)裝入反應容器中,使液溫升高至75℃。升溫後,以60分鐘滴入50%蒸餾水甲醇溶液34.6份,使其在回流下於75℃中反應8小時。反應結束後,以5%磷酸二氫鈉水溶液中和後,於80℃下蒸餾回收甲醇。添加MIBK 152份,進行反覆3次之水洗。接著將有機相在減壓、100℃下去除溶媒,得到白濁之液體(A-9)151份,無法作為光半導體密封材用組成物使用。78.8 parts of β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane (alkoxy equivalent: 82.1), weight average molecular weight 6120 (GPC measured value) of decyl alcohol terminal dimethyl polyoxyl oil 94.0 A portion (sterol equivalent of 3060), 104 parts of methanol, and 8.0 parts of a 0.5% KOH methanol solution (0.04 parts of KOH fraction) were placed in a reaction vessel to raise the liquid temperature to 75 °C. After the temperature was raised, 34.6 parts of a 50% distilled water methanol solution was added dropwise thereto over 60 minutes, and the mixture was reacted at 75 ° C for 8 hours under reflux. After completion of the reaction, the mixture was neutralized with a 5% aqueous sodium dihydrogen phosphate solution, and then methanol was distilled off at 80 °C. 152 parts of MIBK were added, and the washing was repeated three times. Then, the organic phase was removed under reduced pressure at 100 ° C to obtain 151 parts of a white turbid liquid (A-9), which was not used as a composition for an optical semiconductor sealing material.
將β-(3,4-環氧基環己基)乙基三甲氧基矽烷98.6份(烷氧當量82.1)、重量平均分子量15800(GPC測定值)之矽醇末端二甲基聚矽氧油118.7份(矽醇當量7900)、甲醇142份、0.5% KOH甲醇溶液10.0份(KOH份數為0.05份)裝入反應容器中,使液溫升高至75℃。升溫後,以60分鐘滴入50%蒸餾水甲醇溶液43.2份,使其在回流下於75℃中反應8小時。反應結束後,以5%磷酸二氫鈉水溶液中和後,於80℃下蒸餾回收甲醇。添加MIBK 191份,進行反覆3次之水洗。接著將有機相在減壓、100℃下去除溶媒,得到白濁之液體(A-10)189份。98.6 parts of β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane (alkoxy equivalent: 82.1) and a weight average molecular weight of 15800 (GPC measured value) of decyl alcohol terminal dimethyl polyfluorene oxide 118.7 A portion (sterol equivalent of 7900), 142 parts of methanol, and 10.0 parts of a 0.5% KOH methanol solution (0.05 parts of KOH) were placed in a reaction vessel to raise the liquid temperature to 75 °C. After the temperature was raised, 43.2 parts of a 50% distilled water methanol solution was added dropwise thereto over 60 minutes, and the mixture was reacted at 75 ° C for 8 hours under reflux. After completion of the reaction, the mixture was neutralized with a 5% aqueous sodium dihydrogen phosphate solution, and then methanol was distilled off at 80 °C. 191 parts of MIBK were added, and the washing was repeated three times. Next, the organic phase was subjected to removal of the solvent under reduced pressure at 100 ° C to obtain 189 parts of a white turbid liquid (A-10).
使用下述式(5)所示末端為烷氧基之聚矽氧油以取代實施例1至5所使用式(2)之矽醇末端聚矽氧油,進行合成。The alkoxy-terminated polyoxyxene oil represented by the following formula (5) is used in place of the decyl alcohol-terminated polyoxygenated oil of the formula (2) used in Examples 1 to 5 to carry out the synthesis.
將β-(3,4-環氧基環己基)乙基三甲氧基矽烷37.0份(烷氧當量82.1)、重量平均分子量2500(GPC測定值)之甲氧基末端二甲基聚矽氧油63.1份(烷氧當量1250)、甲醇64份、0.5% KOH甲醇溶液5.0份(KOH份數為0.025份)裝入反應容器中,使液溫升高至75℃。升溫後,以60分鐘滴入50%蒸餾水甲醇溶液16.2份,使其在回流下於75℃中反應8小時。反應結束後,以5%磷酸二氫鈉水溶液中和後,於80℃下蒸餾回收甲醇。添加MIBK 88份,進行反覆3次之水洗。接著將有機相在減壓、100℃下去除溶媒,得到白濁之液體(A-11)80.6份,無法作為光半導體密封材用組成物使用。37.0 parts of β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane (alkoxy equivalent: 82.1), weight average molecular weight 2500 (GPC measured value) of methoxy-terminated dimethyl polyfluorene oxide 63.1 parts (alkoxy equivalent of 1250), 64 parts of methanol, 5.0 parts of a 0.5% KOH methanol solution (0.025 parts of KOH) were placed in a reaction vessel to raise the temperature of the liquid to 75 °C. After the temperature was raised, 16.2 parts of a 50% distilled water methanol solution was added dropwise thereto over 60 minutes, and the mixture was reacted at 75 ° C for 8 hours under reflux. After completion of the reaction, the mixture was neutralized with a 5% aqueous sodium dihydrogen phosphate solution, and then methanol was distilled off at 80 °C. 88 parts of MIBK were added and washed three times with repeated washing. Then, the organic phase was removed under reduced pressure at 100 ° C to obtain 80.6 parts of a white turbid liquid (A-11), which was not used as a composition for an optical semiconductor sealing material.
將實施例1至5、比較例1、2以及參考例1至4所得樹脂A-1至A-11之性狀歸納於表1。The properties of the resins A-1 to A-11 obtained in Examples 1 to 5, Comparative Examples 1, 2, and Reference Examples 1 to 4 are summarized in Table 1.
由上述結果,可確認使通式(1)所示化合物與通式(2)所示化合物之烷氧基/矽醇基所饋入當量值設為1.4之比較例1成為溶劑不溶性之凝膠化物,無法作為環氧樹脂使用。另外,通式(1)所示化合物與通式(2)所示化合物一次加入鹼觸媒與水而合成之參考例1、參考例2、參考例3、參考例4(A-7、A-8、A-9、A-10)成為白濁液體,可確認並不適用為光學用途。更且,使用末端具有烷氧基之聚矽氧油的式(5)化合物取代通式(2)所示化合物作為鏈狀聚矽氧鏈段之A-11(比較例2)亦成為白濁液體,判定不適用為光學用途。另一方面,使通式(1)、通式(2)所示化合物以2階段反應之實施例1至3(A-1、A-2、A-3)與使通式(1)、(2)以及(3)所示化合物以2階段反應之實施例4、5(A-4、A-5)可得無色透明之樹脂,可確認適用為光學用途。From the above results, it was confirmed that Comparative Example 1 in which the alkoxy group/sterol group of the compound represented by the formula (1) and the alkoxy group/sterol group of the compound represented by the formula (2) were fed was made into a solvent-insoluble coagulation. Glue cannot be used as an epoxy resin. Further, Reference Example 1, Reference Example 2, Reference Example 3, and Reference Example 4 (A-7, A) in which a compound represented by the formula (1) and a compound represented by the formula (2) are added with a base catalyst and water at a time. -8, A-9, A-10) become a turbid liquid, and it is confirmed that it is not suitable for optical use. Further, A-11 (Comparative Example 2) in which a compound of the formula (2) is substituted with a compound of the formula (2) using a polyoxyphthalic acid having an alkoxy group at the end as a chain polyoxynized group also becomes a cloudy liquid. , the judgment is not applicable for optical use. On the other hand, the compounds of the formula (1) and the formula (2) are subjected to the two-stage reaction of Examples 1 to 3 (A-1, A-2, A-3) and the formula (1), The compounds shown in (2) and (3) were obtained as colorless and transparent resins in Examples 4 and 5 (A-4, A-5) in a two-stage reaction, and were confirmed to be suitable for optical use.
如考慮以二甲基矽氧烷為單元構造時,則以使用下述式(6)之二甲基二甲氧矽烷作為原料,並使化合物中所含二甲基矽氧烷單元構造之含量濃度(莫耳%)成為與上述實施例1至3相同之濃度(莫耳%)進行合成。When dimethyl methoxy oxane is used as a unit, the dimethyl dimethoxy decane of the following formula (6) is used as a raw material, and the content of the dimethyl methoxy siloxane unit contained in the compound is determined. The concentration (% by mole) was synthesized in the same concentration (mol%) as in the above Examples 1 to 3.
合成係與專利文獻1所記載之方法同樣操作,將β-(3,4-環氧基環己基)乙基三甲氧基矽烷33.9份(烷氧當量82.1)、二甲基二甲氧矽烷(烷氧當量60.1)、三乙基胺10.0份、MIBK 500份裝入反應容器中,在室溫下攪拌,將蒸餾水100份以30分鐘滴入,升溫至80℃後使反應6小時。反應結束後,以20%磷酸二氫鈉水溶液中和後,進行反覆3次之水洗。接著將有機相在減壓、100℃下去除溶媒,得到具有反應性官能基之矽氧烷化合物(A-12)60份。所得化合物之環氧當量為459g/eq,重量平均分子量為940,外觀為無色透明。The synthesis system was operated in the same manner as in the method described in Patent Document 1, and 33.9 parts of β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane (alkoxy equivalent: 82.1) and dimethyldimethoxydecane ( The alkoxy equivalent of 60.1), the triethylamine (10.0 parts), and the MIBK 500 parts were placed in a reaction container, and the mixture was stirred at room temperature, and 100 parts of distilled water was added dropwise thereto for 30 minutes, and the temperature was raised to 80 ° C, and the reaction was allowed to proceed for 6 hours. After completion of the reaction, the mixture was neutralized with a 20% aqueous solution of sodium dihydrogen phosphate, and then washed with water three times. Next, the organic phase was subjected to removal of the solvent under reduced pressure at 100 ° C to obtain 60 parts of a oxoxane compound (A-12) having a reactive functional group. The obtained compound had an epoxy equivalent of 459 g/eq, a weight average molecular weight of 940, and a colorless and transparent appearance.
第1階段反應:將β-(3,4-環氧基環己基)乙基三甲氧基矽烷147.8份(烷氧當量82.1)、重量平均分子量1060(GPC測定值)之矽醇末端二甲基聚矽氧油252.8份(矽醇當量356)、0.5% KOH甲醇溶液20.0份(KOH份數為0.1份)裝入反應容器中,使液溫升高至75℃。升溫後,在回流下於75℃反應8小時。Phase 1 reaction: 147.8 parts of β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane (alkoxy equivalent: 82.1), weight average molecular weight 1060 (GPC measured value) of sterol terminal dimethyl 252.8 parts of polyoxygenated oil (sterol equivalent 356), 20.0 parts of a 0.5% KOH methanol solution (0.1 part by weight of KOH) were placed in a reaction vessel, and the liquid temperature was raised to 75 °C. After the temperature was raised, the mixture was reacted at 75 ° C for 8 hours under reflux.
第2階段反應:追加甲醇255份後,以60分鐘滴入50%蒸餾水甲醇溶液64.8份,使其在回流下於75℃中反應8小時。反應結束後,以5%磷酸二氫鈉水溶液中和後,於80℃下蒸餾回收甲醇。添加MIBK 352份,進行反覆3次之水洗。接著將有機相在減壓、100℃下去除溶媒,藉此而得到具有反應性官能基之嵌段型矽氧烷化合物(A-13)333份。所得化合物之環氧當量為578g/eq,重量平均分子量為5250,黏度為257mPa‧S,外觀為無色透明。The second-stage reaction: After adding 255 parts of methanol, 64.8 parts of a 50% distilled water methanol solution was added dropwise thereto over 60 minutes, and the mixture was reacted at 75 ° C for 8 hours under reflux. After completion of the reaction, the mixture was neutralized with a 5% aqueous sodium dihydrogen phosphate solution, and then methanol was distilled off at 80 °C. 352 parts of MIBK were added, and the washing was repeated three times. Next, the organic phase was subjected to a solvent under reduced pressure at 100 ° C to obtain 333 parts of a block type oxoxane compound (A-13) having a reactive functional group. The obtained compound had an epoxy equivalent of 578 g/eq, a weight average molecular weight of 5,250, a viscosity of 257 mPa·s, and a colorless and transparent appearance.
屬於倍半矽氧烷鏈段之矽原子比例為14.9莫耳%。同樣地,屬於鏈狀聚矽氧鏈段之矽原子比例為85.1莫耳%。The proportion of ruthenium atoms belonging to the sesquioxane chain segment was 14.9 mol%. Similarly, the proportion of germanium atoms belonging to the chain polyoxynene segment was 85.1 mol%.
如考慮以二甲基矽氧烷為單元構造時,則以使用下述式(6)之二甲基二甲氧矽烷作為原料並使化合物中所含二甲基矽氧烷單元構造之含量濃度(莫耳%)成為與上述實施例6相同之濃度(莫耳%)進行合成。When considering the structure of dimethyl methoxy oxane as a unit, the dimethyl dimethoxy decane of the following formula (6) is used as a raw material, and the concentration of the dimethyl methoxy siloxane unit contained in the compound is determined. (Mole %) was synthesized in the same concentration (mol%) as in Example 6 above.
合成係與專利文獻1所記載之方法同樣操作,將β-(3,4-環氧基環己基)乙基三甲氧基矽烷26.6份(烷氧當量82.1)、二甲基二甲氧矽烷73.4份(烷氧當量60.1)、三乙基胺10.0份、MIBK 500份裝入反應容器中,在室溫下攪拌,將蒸餾水100份以30分鐘滴入,升溫至80℃後使反應6小時。反應結束後,以20%磷酸二氫鈉水溶液中和後,進行反覆3次之水洗。接著將有機相在減壓、100℃下去除溶媒,得到具有反應性官能基之矽氧烷化合物(A-14)60份。所得化合物之環氧當量為561g/eq,重量平均分子量為830,外觀為無色透明。The synthesis system was operated in the same manner as in the method described in Patent Document 1, and 26.6 parts of β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane (alkoxy equivalent: 82.1), dimethyldimethoxydecane 73.4. A portion (alkoxy equivalent of 60.1), 10.0 parts of triethylamine, and 500 parts of MIBK were placed in a reaction vessel, and stirred at room temperature. 100 parts of distilled water was added dropwise thereto over 30 minutes, and the temperature was raised to 80 ° C, and the reaction was allowed to proceed for 6 hours. After completion of the reaction, the mixture was neutralized with a 20% aqueous solution of sodium dihydrogen phosphate, and then washed with water three times. Next, the organic phase was subjected to removal of the solvent under reduced pressure at 100 ° C to obtain 60 parts of a oxoxane compound (A-14) having a reactive functional group. The obtained compound had an epoxy equivalent of 561 g/eq, a weight average molecular weight of 830, and was colorless and transparent in appearance.
(使相對於矽醇基1當量烷氧基成為4.8當量之比例而反應之例)(Example of reacting with a ratio of 4.8 equivalents per equivalent of alkoxy group of a sterol group)
第1階段反應:將β-(3,4-環氧基環己基)乙基三甲氧基矽烷59.1份(烷氧當量82.1)、重量平均分子量1700(GPC測定值)之矽醇末端甲基苯基聚矽氧油130.6份(矽醇當量850)、0.5% KOH甲醇溶液10.0份(KOH份數為0.1份)裝入反應容器中,使液溫升高至75℃。升溫後,在回流下於75℃反應8小時。Phase 1 reaction: 59.1 parts of β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane (alkoxy equivalent: 82.1), weight average molecular weight 1700 (GPC measured value) of sterol terminal methylbenzene A solution of 130.6 parts of a polyoxyl oleate (sterol equivalent 850) and 10.0 parts of a 0.5% KOH methanol solution (0.1 part by weight of KOH) was placed in a reaction vessel to raise the temperature of the liquid to 75 °C. After the temperature was raised, the mixture was reacted at 75 ° C for 8 hours under reflux.
第2階段反應:追加甲醇135份後,以60分鐘滴入50%蒸餾水甲醇溶液25.9份,使其在回流下於75℃中反應8小時。反應結束後,以5%磷酸二氫鈉水溶液中和後,於80℃下蒸餾回收甲醇。其後,為了清洗而添加MIBK 170份,進行反覆3次之水洗。接著將有機相在減壓、100℃下去除溶媒,藉此而得到具有反應性官能基之嵌段型矽氧烷化合物(A-15)162份。所得化合物之環氧當量為707g/eq,重量平均分子量為2680,黏度為727mPa‧s,外觀為無色透明。Second-stage reaction: After adding 135 parts of methanol, 25.9 parts of a 50% distilled water methanol solution was added dropwise thereto over 60 minutes, and the mixture was reacted at 75 ° C for 8 hours under reflux. After completion of the reaction, the mixture was neutralized with a 5% aqueous sodium dihydrogen phosphate solution, and then methanol was distilled off at 80 °C. Thereafter, 170 parts of MIBK was added for washing, and water washing was repeated three times. Next, the organic phase was subjected to a solvent under reduced pressure at 100 ° C to obtain 162 parts of a block type siloxane compound (A-15) having a reactive functional group. The obtained compound had an epoxy equivalent of 707 g/eq, a weight average molecular weight of 2,680, a viscosity of 727 mPa·s, and a colorless and transparent appearance.
屬於倍半矽氧烷鏈段之矽原子比例為13.6莫耳%。同樣地,屬於鏈狀聚矽氧鏈段之矽原子比例為86.4莫耳%。The proportion of germanium atoms belonging to the sesquioxane chain segment was 13.6 mol%. Similarly, the proportion of germanium atoms belonging to the chain polyoxynene segment was 86.4 mol%.
將上述合成之矽氧烷化合物(A-1至3、12至15之任一者)或以往光半導體密封用所使用之市售的脂環型環氧樹脂(ERL-4221)、硬化劑(B-1至B-3)或者硬化劑(B-3)與硬化促進劑C-1兩者,以表2、3、4或5所示重量份進行混合,得到本發明之實施例8至13以及比較例5至7之組成物。The commercially available oxirane epoxy resin (ERL-4221) and the hardener (for any of the above-mentioned synthesized alkoxylate compounds (A-1 to 3, 12 to 15) or conventional optical semiconductor sealing materials ( B-1 to B-3) or both the hardener (B-3) and the hardening accelerator C-1 are mixed in parts by weight shown in Tables 2, 3, 4 or 5 to give Example 8 of the present invention. 13 and the compositions of Comparative Examples 5 to 7.
表2所記載之實施例以及比較例係如下述。The examples and comparative examples described in Table 2 are as follows.
實施例8:使用化合物A-1與硬化劑B-1之組成物Example 8: Composition using Compound A-1 and Hardener B-1
實施例9:使用化合物A-2與硬化劑B-1之組成物Example 9: Composition using Compound A-2 and Hardener B-1
實施例10:使用化合物A-3與硬化劑B-1之組成物Example 10: Composition using Compound A-3 and Hardener B-1
比較例5:使用化合物A-12與硬化劑B-1之組成物Comparative Example 5: Composition using Compound A-12 and Hardener B-1
比較例6:使用ERL-4221與硬化劑B-1之組成物Comparative Example 6: Composition using ERL-4221 and hardener B-1
表3所記載之實施例以及比較例係如下述。The examples and comparative examples described in Table 3 are as follows.
實施例11:使用化合物A-13、硬化劑B-3以及硬化促進劑C-1之組成物Example 11: Composition using Compound A-13, Hardener B-3, and Hardening Accelerator C-1
比較例7:使用化合物A-14、硬化劑B-3以及硬化促進劑C-1之組成物Comparative Example 7: Composition using Compound A-14, Hardener B-3, and Hardening Accelerator C-1
表4所記載之實施例係如下述。The examples described in Table 4 are as follows.
實施例12:使用化合物A-15、硬化劑B-3以及硬化促進劑C-1之組成物Example 12: Composition using Compound A-15, Hardener B-3, and Hardening Accelerator C-1
表5所記載之實施例以及比較例係如下述。The examples and comparative examples described in Table 5 are as follows.
實施例13:使用化合物A-13、硬化劑B-3以及硬化促進劑C-1之組成物Example 13: Composition using Compound A-13, Hardener B-3, and Hardening Accelerator C-1
比較例6:使用ERL-4221與硬化劑B-1之組成物Comparative Example 6: Composition using ERL-4221 and hardener B-1
對於實施例8至13、比較例5至7中所得硬化性樹脂組成物進行下述穿透率試驗、機械特性試驗(動態黏彈性試驗)、LED照明試驗,將其結果示於表2、3、4、5。The curable resin compositions obtained in Examples 8 to 13 and Comparative Examples 5 to 7 were subjected to the following transmittance test, mechanical property test (dynamic viscoelasticity test), and LED illumination test, and the results are shown in Tables 2 and 3. 4, 5.
將實施例8至13、比較例5至7所得之硬化性樹脂組成物實施真空脫泡20分鐘後,輕輕地倒入底面直徑5cm,高度2cm之鋁箔杯中鑄造。將該鑄造物在預定之硬化條件下放入烤箱中使之硬化,得到厚度2mm之穿透性用試驗片。使用該等試驗片,經由分光光度計測定紫外線照射前後之穿透率(測定波長:375nm、400nm、465nm),算出其變化率。The curable resin compositions obtained in Examples 8 to 13 and Comparative Examples 5 to 7 were subjected to vacuum defoaming for 20 minutes, and then gently poured into an aluminum foil cup having a bottom surface diameter of 5 cm and a height of 2 cm. The cast product was placed in an oven under predetermined hardening conditions to be hardened to obtain a test piece for penetration of 2 mm in thickness. Using these test pieces, the transmittance (measurement wavelength: 375 nm, 400 nm, 465 nm) before and after ultraviolet irradiation was measured by a spectrophotometer, and the rate of change was calculated.
紫外線照射條件如下。The ultraviolet irradiation conditions are as follows.
紫外線照射機:EYE SUPER UV TESTER SUV-W11UV irradiation machine: EYE SUPER UV TESTER SUV-W11
溫度:60℃Temperature: 60 ° C
照射能量:65mW/cm2 Irradiation energy: 65mW/cm 2
照射時間:100小時Irradiation time: 100 hours
將實施例8至13、比較例5至7所得之硬化性樹脂組成物實施真空脫泡20分鐘後,輕輕地倒入底面直徑5cm,高度2cm之鋁箔杯中鑄造。將該鑄造物在預定之硬化條件下放入烤箱中使之硬化,得到厚度2mm之穿透性用試驗片。使用該等試驗片,以分光光度計測定於150℃烤箱中放置96小時前後之穿透率(測定波長:375nm、400nm、465nm),算出其變化率。The curable resin compositions obtained in Examples 8 to 13 and Comparative Examples 5 to 7 were subjected to vacuum defoaming for 20 minutes, and then gently poured into an aluminum foil cup having a bottom surface diameter of 5 cm and a height of 2 cm. The cast product was placed in an oven under predetermined hardening conditions to be hardened to obtain a test piece for penetration of 2 mm in thickness. Using these test pieces, the transmittance (measurement wavelength: 375 nm, 400 nm, 465 nm) was measured by a spectrophotometer in an oven at 150 ° C for 96 hours, and the rate of change was calculated.
將實施例8至13、比較例5至7所得之硬化性樹脂組成物實施真空脫泡20分鐘後,輕輕地倒入寬7mm、長5cm、厚度約800μm之試驗片用模型中鑄造,然後從上方以聚醯亞胺膜蓋住。將該鑄造物依表2、3記載之硬化條件硬化而得到動態黏彈性用試驗片。使用該等試驗片,依下述條件實施動態黏彈性試驗。The curable resin compositions obtained in Examples 8 to 13 and Comparative Examples 5 to 7 were subjected to vacuum defoaming for 20 minutes, and then a test piece having a width of 7 mm, a length of 5 cm, and a thickness of about 800 μm was gently poured into a mold, and then Covered with a polyimide film from above. The cast product was cured under the curing conditions described in Tables 2 and 3 to obtain a test piece for dynamic viscoelasticity. Using these test pieces, a dynamic viscoelasticity test was carried out under the following conditions.
測定條件Measuring condition
動態黏彈性測定器:TA-instrument製,DMA-2980Dynamic viscoelasticity tester: TA-instrument, DMA-2980
測定溫度範圍:-30℃至280℃Measuring temperature range: -30 ° C to 280 ° C
升溫速度:2℃/分鐘Heating rate: 2 ° C / min
試驗片尺寸:使用切成5mm×50mm者(厚度約800μm)。Test piece size: those cut into 5 mm × 50 mm (thickness: about 800 μm) were used.
解析條件:Analysis conditions:
Tg:以DMA測定之Tan-δ波峰點為Tg。Tg: The Tan-δ peak point measured by DMA is Tg.
-30℃彈性率:測定-30℃時之彈性率。-30 ° C modulus: the modulus of elasticity at -30 ° C was measured.
將實施例8至13、比較例5至7所得硬化性樹脂組成物實施真空脫泡20分鐘後,充填於注射器並使用精密吐出裝置,在搭載有具發光波長375nm之發光元件的表面封裝型LED中鑄造。其後,在預定之硬化條件下使之硬化,得到照明試驗用LED。照明試驗係為了進行加速條件下之試驗,而在相當於規定電流之3倍的60mA下進行照明試驗。詳細條件係如下所示。測定項目係將100小時照明前後之照度使用積分球測定,算出照度之維持率。再於100小時照明後,觀察發光元件之表面狀態。The curable resin compositions obtained in Examples 8 to 13 and Comparative Examples 5 to 7 were subjected to vacuum defoaming for 20 minutes, and then filled in a syringe and mounted on a surface mount type LED having a light-emitting element having an emission wavelength of 375 nm, using a precision discharge device. Casting in. Thereafter, it was hardened under predetermined hardening conditions to obtain an LED for illumination test. In the lighting test, an illumination test was performed at 60 mA which is three times the predetermined current in order to perform the test under the accelerated condition. The detailed conditions are as follows. In the measurement item, the illuminance before and after the illumination for 100 hours was measured using an integrating sphere, and the illuminance retention rate was calculated. After further lighting for 100 hours, the surface state of the light-emitting element was observed.
發光波長:375nmLight emission wavelength: 375nm
驅動方式:定電流方式、60mA(發光元件之規定電流為20mA)Drive mode: constant current mode, 60mA (the specified current of the light-emitting component is 20mA)
驅動環境:25℃、65%Drive environment: 25 ° C, 65%
*硬化劑B-1:硬化劑係預先準備1,3,4-環己烷三羧酸-3,4-酐(三菱氣體化學(股)製造之「H-TMA」)30份與甲基六氫鄰苯二甲酸酐、六氫鄰苯二甲酸酐之混合物的「MH-700G」(新日本理化(股)製造)70份混合之物作為硬化劑B-1。* Hardener B-1: Hardener is prepared by preliminarily preparing 1,3,4-cyclohexanetricarboxylic acid-3,4-anhydride ("H-TMA" manufactured by Mitsubishi Gas Chemical Co., Ltd.) and methyl group. "MH-700G" (manufactured by Shin Nippon Chemical & Chemical Co., Ltd.) of a mixture of hexahydrophthalic anhydride and hexahydrophthalic anhydride was used as a hardener B-1.
*硬化劑B-2:硬化劑係預先準備1,3,4-環己烷三羧酸-3,4-酐(三菱氣體化學(股)製造之「H-TMA」)50份與甲基六氫鄰苯二甲酸酐、六氫鄰苯二甲酸酐之混合物的「MH-700G」(新日本理化(股)製造)50份混合之物作為硬化劑B-2。* Hardener B-2: Hardener is prepared by pre-preparing 50 parts of methyl 1,3,4-cyclohexanetricarboxylic acid-3,4-anhydride ("H-TMA" manufactured by Mitsubishi Gas Chemical Co., Ltd.) "MH-700G" (manufactured by Shin Nippon Chemical & Chemical Co., Ltd.) of a mixture of hexahydrophthalic anhydride and hexahydrophthalic anhydride was used as a hardener B-2.
*ERL-4221:陶氏化學公司製造之脂環型環氧樹脂。*ERL-4221: An alicyclic epoxy resin manufactured by The Dow Chemical Company.
*硬化條件:120℃ 2hr+140℃ 2hr(實施例8、9、10、比較例5、6)* Hardening conditions: 120 ° C 2 hr + 140 ° C 2 hr (Examples 8, 9, 10, Comparative Examples 5, 6)
*Tg之單位為[℃]、-30℃彈性率之單位為[MPa]。* The unit of Tg is [°C], and the unit of modulus of elasticity at -30 °C is [MPa].
由以上結果可知,使用以2階段反應合成之本發明的矽氧烷化合物(A)的實施例8至10之硬化性樹脂組成物,相較於使用與二甲基矽氧烷單元構造之含量濃度(莫耳%)相同的化合物之比較例5,Tg較高且耐熱性優異,並且低溫下之彈性率減低,係耐熱性、低彈性率特性優異者。更且,相較於以往之脂環式環氧樹脂的比較例6,可確認其耐光性、低彈性率特性更優越。From the above results, it is understood that the curable resin compositions of Examples 8 to 10 using the oxoxane compound (A) of the present invention synthesized in a two-stage reaction are compared with the content of the dimethyl methoxy siloxane unit structure. In Comparative Example 5 in which the concentration (mol%) was the same, the Tg was high and the heat resistance was excellent, and the elastic modulus at a low temperature was lowered, and the heat resistance and the low modulus property were excellent. Further, in Comparative Example 6 of the conventional alicyclic epoxy resin, it was confirmed that the light resistance and the low modulus of elasticity were superior.
*硬化劑B-3:使用甲基六氫鄰苯二甲酸酐、六氫鄰苯二甲酸酐之混合物(新日本理化(股)製「MH-700G」)。* Hardener B-3: A mixture of methylhexahydrophthalic anhydride and hexahydrophthalic anhydride ("MH-700G" manufactured by Nippon Chemical and Chemical Co., Ltd.) was used.
*硬化促進劑C-1:環氧樹脂與酸酐之反應促進劑係使用San-apro(股)公司販售之「U-CAT 18X」(商品名稱)。* Hardening accelerator C-1: A reaction accelerator for an epoxy resin and an acid anhydride is "U-CAT 18X" (trade name) sold by San-apro Co., Ltd.
*硬化條件:統一為120℃ 2hr+140℃ 2hr* Hardening conditions: unified to 120 ° C 2hr + 140 ° C 2hr
*Tg之單位為[℃]、-30℃彈性率之單位為[MPa]。* The unit of Tg is [°C], and the unit of modulus of elasticity at -30 °C is [MPa].
*2)有起泡痕跡,而無法獲得適當的試樣作為動態黏彈性用硬化物。*2) There is a foaming mark, and a suitable sample cannot be obtained as a cured material for dynamic viscoelasticity.
*3)由於確認出*2)中比較例7的起泡痕跡,因而在製作UV耐久性穿透試驗用試樣時,測定樹脂所減少之量而確認重量維持率。*3) Since the foaming trace of Comparative Example 7 in *2) was confirmed, when the sample for UV durability penetration test was produced, the amount of reduction of the resin was measured to confirm the weight retention ratio.
另外,重量維持率係以(硬化後鑄造物之重量/硬化前鑄造物之重量)×100而算出。Further, the weight maintenance ratio was calculated by (weight of the cast product after hardening/weight of the cast product before hardening) × 100.
在比較例7之硬化性樹脂組成物中產生起泡痕跡而無法作成作為動態黏彈性測定用之正常硬化物,相對於此,可判明實施例11之硬化性樹脂組成物可作成無黏性之硬化物且成為低彈性率之硬化物。而且,在比較例7之硬化性樹脂組成物中,測定UV耐久性穿透試驗用試樣在硬化前後樹脂的減量結果,為減少9%之量,相對於此,實施例11之硬化性樹脂組成物中所減少之量止於5%左右,本發明之硬化性樹脂組成物在硬化前後之減量亦少,LED封裝用鑄造物在硬化後之凹陷亦少,因而可判明本發明之硬化性樹脂組成物在此點上亦適用為LED密封用組成物。此外,與比較例7相較,亦判明實施例11穿透率之UV耐久性及耐熱性亦均優越。In the curable resin composition of Comparative Example 7, a foaming mark was generated and it was not possible to form a normal cured product for dynamic viscoelasticity measurement. On the other hand, it was found that the curable resin composition of Example 11 can be made non-tacky. Hardened and cured as a low modulus of elasticity. Further, in the curable resin composition of Comparative Example 7, the amount of reduction of the resin before and after curing of the sample for UV durability penetration test was measured to be 9% by weight, whereas the curable resin of Example 11 was used. The amount of the composition to be reduced is about 5%, and the curable resin composition of the present invention has a small amount of reduction before and after curing, and the cast product for LED encapsulation has less depression after hardening, so that the curability of the present invention can be confirmed. The resin composition is also suitable as a composition for LED sealing at this point. Further, as compared with Comparative Example 7, it was also found that the UV durability and heat resistance of the transmittance of Example 11 were also excellent.
*硬化劑B-3:使用甲基六氫鄰苯二甲酸酐、六氫鄰苯二甲酸酐之混合物(新日本理化(股)製造「MH-700G」)。* Hardener B-3: A mixture of methylhexahydrophthalic anhydride and hexahydrophthalic anhydride ("MH-700G" manufactured by Nippon Chemical and Chemical Co., Ltd.) was used.
*硬化促進劑C-1:環氧樹脂與酸酐之反應促進劑係使用San-apro(股)公司販售之「U-CAT 18X」(商品名稱)。* Hardening accelerator C-1: A reaction accelerator for an epoxy resin and an acid anhydride is "U-CAT 18X" (trade name) sold by San-apro Co., Ltd.
*硬化條件:120℃ 1hr+150℃ 3hr* Hardening conditions: 120 ° C 1 hr + 150 ° C 3 hr
*Tg之單位為[℃]、-30℃彈性率之單位為[MPa]。* The unit of Tg is [°C], and the unit of modulus of elasticity at -30 °C is [MPa].
判明使用2階段反應所合成之本發明的矽氧烷化合物(A)的實施例12之硬化性樹脂組成物,成為低溫下彈性率亦低之硬化物。The curable resin composition of Example 12 of the oxirane compound (A) of the present invention synthesized by the two-stage reaction was found to be a cured product having a low modulus at a low temperature.
*為查看元件本身之劣化,將未注入樹脂的無密封者同時進行LED照明試驗。* In order to check the deterioration of the component itself, the unsealed person who did not inject the resin simultaneously performed the LED illumination test.
*硬化劑B-2:硬化劑係預先準備1,3,4-環己烷三羧酸-3,4-酐(三菱氣體化學(股)製造之「H-TMA」)50份與甲基六氫鄰苯二甲酸酐、六氫鄰苯二甲酸酐之混合物的「MH-700G」(新日本理化(股)製造)50份混合之物作為硬化劑B-2。* Hardener B-2: Hardener is prepared by pre-preparing 50 parts of methyl 1,3,4-cyclohexanetricarboxylic acid-3,4-anhydride ("H-TMA" manufactured by Mitsubishi Gas Chemical Co., Ltd.) "MH-700G" (manufactured by Shin Nippon Chemical & Chemical Co., Ltd.) of a mixture of hexahydrophthalic anhydride and hexahydrophthalic anhydride was used as a hardener B-2.
*硬化劑B-3:使用甲基六氫鄰苯二甲酸酐、六氫鄰苯二甲酸酐之混合物的「MH-700G」(新日本理化(股)製造)。* Hardener B-3: "MH-700G" (manufactured by Shin Nippon Chemical & Chemical Co., Ltd.) using a mixture of methylhexahydrophthalic anhydride and hexahydrophthalic anhydride.
*硬化促進劑C-1:環氧樹脂與酸酐之反應促進劑係使用San-apro(股)公司販售之「U-CAT 18X」(商品名稱)。* Hardening accelerator C-1: A reaction accelerator for an epoxy resin and an acid anhydride is "U-CAT 18X" (trade name) sold by San-apro Co., Ltd.
*ERL-4221:陶氏化學公司製造之脂環型環氧樹脂。*ERL-4221: An alicyclic epoxy resin manufactured by The Dow Chemical Company.
*硬化條件:110℃ 6hr(實施例13)* Hardening conditions: 110 ° C 6 hr (Example 13)
*硬化條件:120℃ 1hr+150℃ 3hr(比較例6)* Hardening conditions: 120 ° C 1 hr + 150 ° C 3 hr (Comparative Example 6)
*Tg之單位為[℃]、-30℃彈性率之單位為[MPa]。* The unit of Tg is [°C], and the unit of modulus of elasticity at -30 °C is [MPa].
由以上結果可判明,將使用以2階段反應所合成之本發明的矽氧烷化合物(A)的實施例13之硬化性樹脂組成物使用在LED密封材時,相較於以往使用脂環型環氧樹脂之比較例6的硬化性樹脂組成物,照度維持率明顯優異。由此可確認本發明之硬化性樹脂組成物適用為LED密封材。From the above results, it was found that when the curable resin composition of Example 13 using the oxirane compound (A) of the present invention synthesized by the two-stage reaction is used in an LED sealing material, the alicyclic type is used in comparison with the conventional one. The curable resin composition of Comparative Example 6 of the epoxy resin was remarkably excellent in the illuminance maintenance ratio. From this, it was confirmed that the curable resin composition of the present invention is suitably used as an LED sealing material.
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TW201113330A (en) * | 2009-08-21 | 2011-04-16 | Jsr Corp | Photo-semiconductor package composition |
JP5700618B2 (en) * | 2009-11-30 | 2015-04-15 | 日本化薬株式会社 | Epoxy resin composition, curable resin composition |
JP5730852B2 (en) * | 2010-03-02 | 2015-06-10 | 日本化薬株式会社 | Method for producing organopolysiloxane, organopolysiloxane obtained by the production method, and composition containing the organopolysiloxane |
CN102791760A (en) * | 2010-03-02 | 2012-11-21 | 日本化药株式会社 | Curable resin composition and cured article thereof |
JP5585529B2 (en) * | 2011-05-06 | 2014-09-10 | 信越化学工業株式会社 | Terminal alkoxy-modified organopolysiloxane and method for producing the same |
JP5891617B2 (en) * | 2011-05-17 | 2016-03-23 | 三菱化学株式会社 | Thermosetting resin composition, semiconductor device member, and semiconductor device using the same |
EP2722366B1 (en) * | 2011-06-17 | 2023-01-04 | LG Chem, Ltd. | Curable composition |
CN102299216A (en) * | 2011-08-15 | 2011-12-28 | 广东银雨芯片半导体有限公司 | LED packaging technology |
JP6031739B2 (en) * | 2011-09-08 | 2016-11-24 | 三菱化学株式会社 | Thermosetting resin composition, semiconductor device member, and semiconductor device using the same |
JP6004581B2 (en) * | 2013-03-25 | 2016-10-12 | 日本化薬株式会社 | Epoxy group-containing silicone resin, epoxy group-containing silicone resin composition, and cured product thereof |
WO2014208619A1 (en) * | 2013-06-26 | 2014-12-31 | 日本化薬株式会社 | Epoxy-group-containing polyorganosiloxane and curable resin composition containing same |
US10658554B2 (en) | 2014-06-19 | 2020-05-19 | Inkron Oy | LED lamp with siloxane particle material |
TWI570187B (en) * | 2015-12-17 | 2017-02-11 | 財團法人工業技術研究院 | Optical solid state prepolymer and molding composition |
KR101871574B1 (en) * | 2016-05-12 | 2018-06-27 | 삼성에스디아이 주식회사 | Epoxy resin composition for encapsulating semicomductor device and semiconductor device encapsulated using the same |
KR102146668B1 (en) | 2017-05-31 | 2020-08-21 | 코오롱인더스트리 주식회사 | Composition For Coating and Coating Film Including Cured Product Of The Same As The Coating Layer |
CN107353871B (en) * | 2017-08-21 | 2020-09-08 | 山东省科学院新材料研究所 | High-temperature-resistant bonding sealing silicone resin and preparation method thereof |
JP7218604B2 (en) * | 2018-02-26 | 2023-02-07 | 三菱ケミカル株式会社 | Curable resin composition containing epoxy group-containing polyorganosiloxane and cured product thereof |
EP4023694B1 (en) * | 2019-08-27 | 2024-02-14 | Mitsubishi Chemical Corporation | Epoxy group-containing polyorganosiloxane, curable resin composition containing epoxy group-containing polyorganosiloxane, and cured product of same |
KR102252385B1 (en) * | 2019-12-09 | 2021-05-14 | 주식회사 티에스엘켐 | UV adhesive composition |
CN115003759B (en) * | 2020-01-15 | 2023-12-01 | 株式会社钟化 | Resin composition, method for producing same, and multicomponent curable resin composition |
CN111234233B (en) * | 2020-03-26 | 2022-05-27 | 兆舜科技(广东)有限公司 | Phenyl silicone resin and preparation method thereof |
CN111574715A (en) * | 2020-05-22 | 2020-08-25 | 中国乐凯集团有限公司 | Composition, packaging film containing composition, preparation method of packaging film and electronic device |
KR20220039206A (en) * | 2020-09-22 | 2022-03-29 | ㈜ 엘프스 | Self-sealing type conductive connection material, bonding module including same, and manufacturing method thereof |
TWI773424B (en) * | 2021-07-08 | 2022-08-01 | 碁達科技股份有限公司 | Thermal interface composition, thermal interface material and preparation method thereof |
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