TW201020279A - Siloxane, hardening resin composition, hardened substance thereof, and optical semiconductor component - Google Patents

Siloxane, hardening resin composition, hardened substance thereof, and optical semiconductor component Download PDF

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TW201020279A
TW201020279A TW098129209A TW98129209A TW201020279A TW 201020279 A TW201020279 A TW 201020279A TW 098129209 A TW098129209 A TW 098129209A TW 98129209 A TW98129209 A TW 98129209A TW 201020279 A TW201020279 A TW 201020279A
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group
compound
reaction
reactive functional
functional group
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TW098129209A
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TWI437030B (en
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Naofusa Miyagawa
Yoshihiro Kawata
Masataka Nakanishi
Chie Sasaki
Kenichi Kuboki
Shizuka Aoki
Zuikan Suzuki
Masato Yarita
Hiroo Koyanagi
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Nippon Kayaku Kk
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • H01L23/296Organo-silicon compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/30Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32Epoxy compounds containing three or more epoxy groups
    • C08G59/3254Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • C08L83/06Polysiloxanes containing silicon bound to oxygen-containing groups
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/56Materials, e.g. epoxy or silicone resin

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Silicon Polymers (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The present invention relates to a novel reactive functional groupcontaining a siloxane (A), a hardening resin composition including the siloxane (A) and a hardening agent (B), and an optical semiconductor component (such as LED) hermetically sealed by a hardened substance thereof, wherein the hermetically sealed optical semiconductor component demonstrates excellent resistance to light and low elasticity at low temperature. The siloxane (A) is a block-type siloxane oligomer having a chain of silicone segment and a hydrolysis and condensation segment of trialkoxysilane (C1-C10) containing a group selected from the group consisting of epoxy-containing reactive functional group, methyl, and ethyl, wherein at least a portion of the hydrolysis and condensation segment contains at least an epoxy-containing reactive functional group. The siloxane is obtained by the first step reaction and the ensuing second step reaction described hereunder. 1st step reaction: Reacting the siloxane compound in the condition that the alkoxy equivalent is within 1.5 to 200, relative to one equivant of silanol group of silanol ending polysilicone oil; 2nd step reaction: In the presence of water, subject the said alkoxysilane and the alkoxy group of the product obtained from 1st step reaction, to undergo hydrolysis and condensation reaction.

Description

201020279 六、發明說明· 【發::卜術領域】 其製造方法2關含反應性官能基之新财氧燒化合物、 光性、低k其組成物。更詳言之,财關透明性、财 脂組成物;低彈11率特11優異之光半導體用硬化性樹 【先前技術】經由該硬化物密封之光半導體元件。 能與經濟性平紙LED等之光半導體元件的㈣材料,以性 用耐熱性、透^觀點而採用環氧樹脂。特別是廣泛地使 氧樹㈣及骑環= ^生之平衡優異的雙齡A型環 近年來,盤t τ 曰· 與發光強度ED發光波長之短波化⑽rnn至480nm) 述密封材料^的進展結果’而指出因光的影響使得上 其中,考色而最後使LED之特性降低。 了聚石夕氣樹光而使密封材料著色之目的下,進行 脂之機械特性f。然而’相較於環氧樹脂,聚石夕氧樹 封型態。因此,古耆性較差’因而僅能選擇凝膠狀態的密 變形」之問題。®上指出有「密封後’產生表面發黏或 樹腸Si㈡述旨之耐久性、尤其是上綱氧 化合物輿不人η社獻1中,係將含環氧基之石夕燒 以及水的’在有機溶劑、有機驗 100萬之加熱,得到重量平均分子量為_至 W機錢燒。以耐紐之觀點,有 321483 4 201020279 烧高於以往之環氧樹脂。而且’相對於2官能烧氧石夕院化 合物,藉由3官能烧氧石夕院化合物之導入量增多而改善發 黏性與硬度。然而,為了表面發勒性以及變形之改善,在 增加硬化物之硬度下,卻提高特別是低溫領域㈠代以下 之程度)之彈性率。其結果,在熱循環試驗中,將引起低温 (-30°C以下)之低彈性率特性低劣。 密封劑硬化物即使在低溫中仍為低彈性率者係光半 導體密封劑中的重要特性之一,而對此之改善成為重要課 題。 [先前技術文獻] [專利文獻] [專利文獻1]日本再公表專利W02005/100445號公報 【發明内容】 -[發明所要解決的課題] 本發明之目的係提供一種矽氧烷化合物、使用該化合 ®物之硬化性樹脂組成物,以及使用該硬化性樹脂組成物作 為Φ封材料之光半導體元件者,其中’矽氧烷化合物係作 為LED密封材料且耐光性與低溫下之低彈性率並存之具有 反應性官能基的新穎化合物。 [用以解決問題之手段] 本發明者等為解決上述課題而專心致志進行研究之 、、告果發現’由含下述通式(2)所示具有矽醇末端之聚;ε夕氧油 (石夕化合物)與含環氧基之具有反應性官能基的三烷氧基石夕 燒化合物(石夕化合物)反應而得的具有鏈狀聚矽氧鏈段與三 5 321483 201020279 烷氧基矽烷的水解縮合鏈段之人 合物,可用以解決上述之課:3反應性官能基的石夕氧燒化 ^ 碭。亦即,含有該矽氧烷化人 物之硬化性樹脂組絲係滿足上㈣歇物 =口 ^現,财氧絲合射經2階段之反應 ^ 成。由其結果遂而完成本發明。 1双也口 而且,如上述所知去,士 ^ ^ ^ - A* ^ ^ - 發明之矽氧烷化合物係由鏈 狀敝與料錢之切縮合鏈段(以倍半 Θ Μ1%,1·110鍵段為佳)所成的低聚物(聚合物),且至 該水解縮合鏈段含有至少具有-個環氧基之反 本發明之記載如下。 亦即,本發明係有關下述者。 ❹ ^:種含*反應性官能基之⑪氧烧化合物,係具有鏈狀聚石夕 祕段,與具有選自含環氧基之反應性官能基、曱基夕 本基所成組群之基的三(C1__錄基钱之 段的嵌段财祕低聚物,且至少—部分之 係含有至少具有—個錢基之反應性官能基的鏈= [2]如上述⑴所記載之含反應性官能基之錢貌化合物, /、,水解縮合鏈段係倍半矽氧烷鏈段。 [3]如上述⑴或⑵所記載之含反應性官能基之發氧燒化 合物,其係經由下述之兩階段反應而得,帛1階段反應係 使通式⑵所示⑦醇⑼心氧油(b)與通式⑴所示烧氧 石夕烧,合物(a) ’在相料料末端聚錢油⑹之謂基 1當1 ’燒氧雜化合物之燒氧#量為15至2⑽當量之 321483 6 201020279 範圍内反應並縮合,其後進行之第2階段反應係將水悉& 在所得反應液中,使剩餘的烷氧基水解•縮合; / I3 \ HO-|—Si—0 十-H (2) \ R3 / m (式中’存在複數個之R3可互同或互異,表示碳數〗至 王10 之直鍵狀、分支狀或環狀之院基、碳數6至14之芳基咬山 數2至10之烯基;m表示平均值為2至2000) ❹ XSi(〇R2)3 ⑴ (式中’ X表示具有環氧基之反應性官能基;匕表示碳數1 至10之烷基)。 [4]如上述[3]所記載之含反應性官能基之矽氧燒化合物 - 其中,m為2至200。 * [5]如上述[丨]所記载之含反應性官能基之矽氧烷化合物, 其中,第1階段反應係使通式(2)所示;ε夕醇末端聚石夕氧油 ❹(b),與通式(1)所示烷氧矽烷化合物(a)以及通式(3)所厂 燒氧我化合物(c)兩者,在相對於石夕醇末端聚石夕氧油(『 之=醇基i當量,燒氧魏化合物⑷以及(c)之燒氧基總 當置為1.5至200當量之範圍内反應並縮合,其後進行之 第2階段反應係將水添加在所得反應液中,使剩餘的炫氧 基水解•縮合;201020279 VI. Description of the Invention · [Fa:: Field of Sweeping] The manufacturing method 2 is a composition of a novel oxy-oxygen compound containing a reactive functional group, a photonic property, and a low-k composition. More specifically, the fiscal transparency and the fat composition are excellent; and the low-elasticity 11 is excellent in the use of a curable tree for optical semiconductors. [Prior Art] An optical semiconductor element sealed by the cured product. (4) Materials which can be used for optical semiconductor elements such as economical flat paper LEDs, and epoxy resins are used for the purpose of heat resistance and transparency. In particular, the two-year-old A-type ring, which is excellent in balance between oxygen tree (4) and riding ring = ^, has recently been developed, and the disk t τ 曰· and the illuminating intensity ED are short-wavelength (10) rnn to 480 nm. As a result, it is pointed out that due to the influence of light, the color is lowered and the characteristics of the LED are finally lowered. The mechanical properties of the fat f are carried out for the purpose of coloring the sealing material by collecting the light of the tree. However, compared to the epoxy resin, the polysulfate tree is sealed. Therefore, the problem of poor ancientity is such that only the dense deformation of the gel state can be selected. ® indicates that the surface is sticky or has a durability of the Si (II), especially in the upper oxygen compound. 'In the organic solvent, the organic test 1 million heating, the weight average molecular weight is _ to W machine money to burn. From the point of view of Nike, there are 321483 4 201020279 burning higher than the previous epoxy resin. And 'relative to the bifunctional burning Oxygen stone compound compound improves the tackiness and hardness by increasing the amount of introduction of the trifunctional burnt oxygen stone compound. However, in order to improve the surface hair and the deformation, the hardness of the hardened material is increased. In particular, the modulus of elasticity in the low temperature range (1) is less than that. As a result, in the thermal cycle test, the low modulus (lower than -30 ° C) low in elastic modulus is inferior. The sealant cured product is at a low temperature. The low modulus is one of the important characteristics in the optical semiconductor encapsulant, and this improvement has become an important issue. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Re-Patent Patent W02005/100445 [Problem to be Solved by the Invention] An object of the present invention is to provide a siloxane compound, a curable resin composition using the compound, and an optical semiconductor element using the curable resin composition as a Φ sealing material. In the present invention, the present inventors have solved the above problems as a novel compound having a reactive functional group which is an LED sealing material and has a light-resistant property and a low modulus of elasticity at a low temperature. While focusing on the research, I found out that it consists of a polyether having a sterol end group represented by the following formula (2); an oxime oxygen oil (Shi Xi compound) and a reactive functional group containing an epoxy group. A compound having a chain polyfluorene chain segment and a hydrolyzed condensed segment of a 3 5 321483 201020279 alkoxydecane obtained by reacting a trialkoxylate compound (Australian compound) can be used to solve the above-mentioned lesson: 3 Reactive functional group of the sulphur-oxygenated sputum. That is, the curable resin group containing the oxyalkylene group has a silky line satisfying the above (four) rest; The invention is completed by the result. 1 double mouth and, as the above is known, the ^ ^ ^ - A * ^ ^ - invention of the oxane compound is from the chain 敝 and the money An oligomer (polymer) formed by cutting a condensation segment (preferably a sesquiterpene 1%, a 1.110 bond segment), and the hydrolysis condensation segment contains at least one epoxy group. That is, the present invention relates to the following: ❹ ^: an 11-oxygen-containing compound containing a *reactive functional group having a chain-like polycene segment and having an epoxy group-containing group a reactive functional group, a group of three groups (C1__基基钱), and at least a part of the group contains at least one hydroxyl group reaction Chain of a functional functional group = [2] The phenanthroline chain segment containing a reactive functional group as described in the above (1), /, a hydrolyzed condensed segment. [3] The oxygen-containing compound containing a reactive functional group as described in the above (1) or (2), which is obtained by the following two-stage reaction, wherein the first-stage reaction is carried out by the alcohol (9) of the formula (2) The oil (b) and the pyrolysis gas shown in the general formula (1), the compound (a) 'at the end of the phase material, the money (6) is said to be the base 1 when the 1 'burning oxygen compound is burned to the amount of oxygen #15 to 2 (10) equivalents of 321483 6 201020279 range of reaction and condensation, followed by the second stage of the reaction is water & in the resulting reaction solution, the remaining alkoxy hydrolysis / condensation; / I3 \ HO-| - Si —0 十-H (2) \ R3 / m (In the formula, there are a plurality of R3s which may be mutually the same or different, representing the carbon number to the direct bond of the king 10, branch or ring, and carbon The number of aryl groups of 6 to 14 is 2 to 10 alkenyl groups; m represents an average value of 2 to 2000) ❹ XSi(〇R2)3 (1) (wherein X represents a reactive functional group having an epoxy group;匕 represents an alkyl group having 1 to 10 carbon atoms). [4] The oxo-oxygen-containing compound containing a reactive functional group as described in the above [3], wherein m is from 2 to 200. * [5] The reactive functional group-containing oxoxane compound as described in the above [丨], wherein the first-stage reaction system is represented by the formula (2); (b), both with the alkoxydecane compound (a) represented by the formula (1) and the oxygenated my compound (c) of the formula (3), in the opposite phase of the aspartic acid 『 = alcohol base i equivalent, the oxygenated Wei compound (4) and the alkoxy group of (c) are always reacted and condensed in the range of 1.5 to 200 equivalents, and then the second stage reaction is carried out by adding water to the obtained In the reaction solution, the remaining methoxy group is hydrolyzed and condensed;

321483 7 201020279 (式中,存在複數個之匕可互同或互$,表示碳數^ι〇 之直鏈狀、分支狀或環狀之烧基、碳數6幻4之芳基或碳 數2至10之烯基;m表示平均值為2至2⑽) XSi(〇R2)3 ⑴ (式中’ X表示具有環氧基之反應性官能基;&表示碳數i 至10之烧基) R4Si(〇R2)3 ⑶ (式中’ I表示甲基或苯基;R2可與通式⑴之&相同或相 異,係各自獨立,表示碳數!至10之院基)。 [6]如上述[3]至[5]中任一項所記載之含反應性官能基之 石夕威化合物’其中,通式⑵之&各自獨立,表示甲基 或苯基;通式⑴之匕各自獨立,表示甲基或乙基;通式 ⑶之R2可與通式⑴之R2相同或相異,翁自獨立,表示 甲基或乙基。 m如上述[3]至[6]中任一項所記載之含反應性官能基之 碎氧炫化合物’其中’通式⑴之x為環氧基環己基乙基。 [8]如上述[3]至[6]中任一項所記載之含反應性官能基之 2烧化合物,其中’通式⑵之料末端㈣氧油⑻之 重篁平均分子量(Mw)為300至18〇〇〇。 [W如上至[8]中任一項所記载之含反應性官能基之 ^歧化σ物,其中,重量平均分子量(Mw)為綱至誦〇。 =如=⑴或[2]所記載之含反應性官能基之石夕氧烧化 中’鏈狀聚石夕氧鏈段中之聚石夕氧上的取代基為曱 基或本基之任一者或兩者。 321483 8 201020279 [11 ]如上述[1 ]或[1 〇 ]所記載之含反應性官能基之;g夕氧炫 化合物,其中,倍半矽氧烷鏈段中之具有環氧基的反應性 官能基係含有環氧基環己基者。 [12]—種含反應性官能基之矽氧烷化合物的製造方法,其 特徵為:第1階段反應係使通式(2)所示矽醇末端聚石夕氧油 (b) ’與通式(1)所示烷氧矽烷化合物,在相對於石夕醇末 端聚矽氧油(b)之矽醇基1當量,烷氧矽烷化合物(a)之烷 氧當量為1.5至200當量之範圍内,於觸媒之存在下反應 β並縮合,其後進行之第2階段反應係將水添加在所得反應 液中’使剩餘的烷氧基水解•縮合者,321483 7 201020279 (In the formula, there are a plurality of enthalpy or mutual $, which means a linear, branched or cyclic alkyl group with a carbon number of ^ι〇, an aryl group or a carbon number of 6 carbon 4 2 to 10 alkenyl; m represents an average of 2 to 2 (10)) XSi(〇R2)3 (1) (wherein 'X represents a reactive functional group having an epoxy group; & represents a carbon number i to 10 alkyl group R4Si(〇R2)3 (3) (wherein 'I represents a methyl group or a phenyl group; and R2 may be the same as or different from the & of the formula (1), and each independently, representing a carbon number! to a hospital base of 10). [6] The reactive functional group-containing shixiwei compound as described in any one of the above [3] to [5] wherein the formula (2) is independently and represents a methyl group or a phenyl group; (1) Each of them is independently a methyl group or an ethyl group; and R2 of the formula (3) may be the same as or different from R2 of the formula (1), and independently, represents a methyl group or an ethyl group. m. The oxycyanyl compound containing a reactive functional group as described in any one of the above [3] to [6] wherein x of the formula (1) is an epoxycyclohexylethyl group. [8] The calcined functional group-containing calcined compound according to any one of the above [3] to [6] wherein the weight average molecular weight (Mw) of the end (4) oxygen oil (8) of the formula (2) is 300 to 18 inches. The disproportionation σ containing a reactive functional group as described in any one of the above [8], wherein the weight average molecular weight (Mw) is from the group to the oxime. = the substituent on the polyoxo oxygen in the chain-like polyoxo-oxygen group in the gas-oxygenation of the reactive functional group as described in (1) or [2], which is a mercapto group or a base group Or both. 321483 8 201020279 [11] The reactive functional group-containing compound described in the above [1] or [1 〇]; wherein the sesquioxane moiety has reactivity with an epoxy group; The functional group contains an epoxycyclohexyl group. [12] A method for producing a reactive functional group-containing oxoxane compound, characterized in that the first-stage reaction system is a sterol-terminated polyoxo-oxygen oil (b) of the formula (2) The alkoxydecane compound represented by the formula (1) is in an amount of from 1.5 to 200 equivalents based on 1 equivalent of the decyl alcohol group of the polyoxyxanthene (b). Internally, β is condensed in the presence of a catalyst, and the second stage reaction is followed by adding water to the obtained reaction liquid to 'hydrolyze/condense the remaining alkoxy group.

2000) * 式中,存在複數個之匕可互同或互異,係各自獨立,表 示碳數1至10之直鏈狀、分支狀或環狀之烷基、碳數6 ❹至14之芳基或碳數2至之烯基;m表示平均值為2至 XSi(〇R2) 至1 〇之燒基)。 (式中,)ί表示具有環氧基之反應性官能基;R2表示碳數i [13,]如上述[12]所記載之含反應性官能基之#氧炫化合物 之製造方法’其中’m為2至200。 [14]-種含反應性宫能基之料餘合物的製造方法,係 C 3下述之兩階段反應者’帛j階&反應係使通式⑵所示 321483 9 201020279 夕醇末端聚;^氧油⑻’與通式⑴所示烧氧梦燒化合物⑷ =及下述ϋ式⑻所示絲魏化合物⑹,在相對於石夕醇 末端㈣氧油⑻之㈣基】當量’炫氧魏化合物(a)以 及(C)之燒氧基總當量為L5至2⑽當量之範圍内,於觸媒 之存在下進仃縮合反應’其後進行之第2階段反應係將水 添加在所得反應生成物中,使剩餘的燒氧基水解·縮合;2000) * In the formula, there are a plurality of enthalpy or different, each independently, which represents a linear, branched or cyclic alkyl group having a carbon number of 1 to 10, and a carbon number of 6 to 14 Base or carbon number 2 to alkenyl; m represents an average of 2 to XSi (〇R2) to 1 烧 of the alkyl group). (wherein, ί represents a reactive functional group having an epoxy group; and R2 represents a carbon number i [13,] a method for producing an oxygen-containing compound containing a reactive functional group as described in the above [12], wherein ' m is 2 to 200. [14] A method for producing a residue containing a reactive utero-energy group, which is a two-stage reactor of the following C 3 'step & reaction system, which gives the end of the formula (2) 321483 9 201020279 Polyoxymethylene oil (8)' and the oxygenated gas-casting compound (4) represented by the general formula (1) = and the silky compound (6) represented by the following formula (8), in terms of (four) base equivalent to the end of the gas (4) oxygen oil (8) The total equivalent of the aerobic compound (a) and (C) is in the range of L5 to 2 (10) equivalents, and the second stage reaction is carried out in the presence of a catalyst to carry out the enthalpy condensation reaction. In the obtained reaction product, the remaining alkoxy groups are hydrolyzed and condensed;

(2) (式中,存在複數個之匕可互同或互異,係各自獨立,表 示碳數1至1G之直鏈狀、分支狀或環狀之院基、碳數6 至14之芳基或碳數2至1()之稀基;m表示平 200) XSi(〇R2)3 ⑴ R2表示礙數1 (式中,X表示具有環氧基之反應性官能基 至10之烷基)(2) (In the formula, there are plural numbers which may be mutually identical or mutually different, and are independent, representing a linear, branched or circular base of carbon number 1 to 1G, and a carbon number of 6 to 14 a base or a carbon number of 2 to 1 (); m represents a flat 200) XSi(〇R2)3 (1) R2 represents a hindrance number 1 (wherein X represents a reactive functional group having an epoxy group to 10 alkyl group) )

hSi (〇R2)3 (3) (式中’ R4表示甲基、苯基;可與通式(1)之匕相同或相 異,係各自獨立,表示碳數丨至1〇之烷基)。 [15]如上則1取[14]所記載之含反應性冑能基之砍氧院 化合物的製造方法,其中’製造步驟係以一鍋式饵序進行 第1階段反應、第2階段反應者。 .hSi (〇R2)3 (3) (wherein R4 represents a methyl group, a phenyl group; may be the same as or different from the formula (1), and each independently, representing an alkyl group having a carbon number of 丨 to 1〇) . [15] As described above, the method for producing a reactive oxygen atom-containing compound having a reactive ruthenium group according to [14], wherein the 'manufacturing step is a first-stage reaction and a second-stage reaction in a one-pot bait order . .

[叫如上述[n]至[15]所記載之含反祕官能基之錢烧 化合物的製造方法’其中’通式⑴所示烧氧魏化合物係 321483 10 201020279 θ-(3, 4-環氧基環己基)乙基三甲氧基基矽烷、或冷_(3,4— •環氧基環己基)乙基三乙氧基石夕烧。 [17] 如上述[12]至[16]所記載之含反應性官能基之矽氧烷 - 化合物的製造方法,其中,通式(2)所示矽醇末端聚矽氧油 , (13)之R3可互同或互異,係各自獨立之曱基或苯基。 [18] 如上述[13]至[15]所記載之含反應性官能基之矽氧烷 化合物的製造方法,其中,通式(3)所示烷氧矽烷化合物係 選自甲基二曱氧基矽烷、苯基三甲氧基矽烷、甲基三乙氧 ❺基矽烷以及苯基三乙氧基矽烷所成組群中之至少一種。 [19] 一種硬化性樹脂組成物,係含有上述[^至口丨]中任一 項所s己載之含反應性官能基之矽氧烷化合物(Α)以及硬化 劑(Β)者。 [20] 如上述[19]所記載之硬化性樹脂組成物,其中,復含 有硬化促進劑(C)。 [21] —種光半導體用硬化物,係使上述[19]或[2〇]所記載 ❹之硬化性樹脂組成物進行熱硬化而得者。 [22] —種光半導體元件,係以上述[2〇]所記載之光半導體 用硬化物密封者。 [發明之效果] 本發月之3有石夕氣院化合物的硬化性樹脂組成物之 硬化物,無發黏性或變形,且透明性、耐光性以及低溫時 之低彈性率特性均為優異。因此,本發明之硬化性樹脂組 成物極適用為光半導體密封材料。 【實施方式】 11 321483 201020279 [實施發明的最佳形態] 稱明之含反應性官能基之矽氧烷化合物(以下亦《 稱為本發明之石夕氧院化合物)係1分子中且右职間 反庫性官:^氧基石夕烧之水解縮合鏈段(以具有含環氧基之 半矽氧烷鏈段更佳)者。 h-維網狀之倍 ,發明之♦氧院化合物’通t係成為以三 〇 網狀構鏈段(以稱為倍半矽氧烷之分布在三維之具有① 氧^;倍半石夕氧⑽段為佳)作為核心,延伸鏈狀聚石夕 =,,,妾三罐魏的水解縮合鏈段(以倍半: 物硬度與mm。本構造可⑽本㈣之硬化性組成 本發明之石夕纽化合物係如上所㉛’具有三烧氧基石夕 炫^水解縮合鏈段(以倍半魏⑽段為佳)與鏈狀聚ς氧 鏈1又,由該等係呈反覆之觀點,亦可稱為嵌段型矽氧烷化 合物。 本發明之矽氧烷化合物係例如:以下述通式(10)所示❹ 院乳石夕烧化合物(a-Ι)(以下亦稱為㈣雜(a-1)),較佳 為下述通式(1)所示之烷氧矽烷化合物(a)(以下亦稱為烷 氧矽烷(a)) ’與通式(2)所示聚矽氧油(b)作為原料即可製 造’如有必要亦可將上述烷氧矽烷化合物(a-Ι)(以(a)為佳) 與上述通式(3)所示烷氧矽烷化合物(c)併用作為原料, XSi(Ri)n(0R2)3-„ (10) (式中’X表示具有環氧基之反應性官能基;Ri表示取代或 12 321483 201020279 未取代之碳數1至10之貌基、取代或未取代之碳數6至 14之芳基、或者,取代或未取代之碳數2幻〇之稀基; R2表示碳數i至Π)之絲;η表示〇至2 m土存在 複數個時,複數個扎可互同或互異), XSi(0R〇3 ⑴ (式中’ X以及匕與上述通式(1〇)者同義)。 本發明之發氧炫化合物中之鏈狀㈣氧鍵段係由聚 ❿ 石夕氧油⑹所形成,三烧氧基石夕燒之水解縮合鏈段(以倍半 矽乳烧鏈段為佳,以三維之網狀倍半石夕氧燒鍵段為更佳) 係由烧氧石夕燒化合物㈤),以⑷為佳{依需要而併用烧氧 石夕坑化合物(c)(以下亦稱為燒氧石夕烧(c))時,係由烧氧石夕 烷\1) ’以(a)為佳,與烷氧矽烷(c)}所形成。 »尺解縮合鍵段較佳為上述燒氧石夕燒化合物⑷以 要之⑹之間,經由魏氧基之水解與麟縮合之2 ❹ 成的鍵段。經由該水解縮合,使x(依需要及 、Α „ _·之構造單元成為複數結合之構造 。由於由該構 太組給人^成之石夕氧燒化合物稱為倍半石夕氧烧,故可將該 水解縮合鏈段稱為倍半石夕氧院鏈段。 、、'針對各原料進行詳細說明。 (a)中之Τ式〇〇)或⑴所示之烷氧矽烷化合物(a -1)或 二。例如可歹^為,有環氧基之有機基即可而無特別限 A 縮水甘油氧基乙基、r -縮水甘油氧 二X·土給^缩水甘油氧基丁基等縮水甘油氧基碳數1至4 說基,縮水甘油其. 土 ’々~(3, 4-環氧基環己基)乙基、7-(3,4- 13 321483 201020279 壤氧基%己基)丙基、^(3,1環氧基環庚基)乙基、万 其(3士環氧基環己基)丙基、石—(3,4-環氧基環己基)丁 土 (3’4—%氧基環己基)戊基等經具有環氧環(環氧乙 院衣)之石厌數5至8之環烧基取代的碳數j至5之炫基。該 等經縮水甘油氧基取代之碳數1至3之烷基或經具 有衣氧%之妷數5至8之環烷基取代之碳數丨至3之烷基 係例如,以万-縮水甘油氧基乙基、卜縮水甘油氧基丙基、 冷(3’4 %氧基環己基)乙基為佳,以冷一(3,4—環氧基環己 基)乙基為特佳。 -通式(10)或(1)中之匕,各自獨立,表示碳數丨至1〇 之烷基,可為直鏈狀、分支狀或環狀之任一者。其例可列 舉如·甲基、乙基、正丙基、異丙基、正丁基、異丁基、 第三丁基、正戊基、正己基、環戊基、環己基等。由相溶 性、反應性等反應條件之觀點而言,該等Rz以甲基或乙基 為佳’以曱基為特佳。 而且,通式(1〇)之匕,可直接引用下述通式(2)之匕 說明中之各基的說明。 通式(10)或(1)所示之烷氧矽烷(a-D或(3)之較佳具 體例可列舉如:点-縮水甘油氧基乙基三曱氧基矽烷、石一 縮水甘油氧基乙基三乙氧基矽烷、r _縮水甘油氧基丙基三 曱氧基石夕烧、縮水甘油氧基丙基三乙氧基石夕烧、冷一 (3, 4-環氧基環己基)乙基三甲氧基矽烷、々—(if環氧基 環己基)乙基三乙氧基矽烷,以点-(3,4-環氧基環己基)乙 基三甲氧基矽烷為特佳。該等烷氧矽烷化合物(3)可單獨使 14 321483 201020279 亦可併用下述通式(3)所示之燒氧 用或可使用2種以上, 矽烷(c)。 聚矽氧油(b)係具有下述式(2)所示構造之末端具有 石夕醇基的鏈狀聚矽氧油。[Manufacturing method of the money-burning compound containing the anti-secret functional group as described in [n] to [15] above] wherein the "Oxygenated Wei compound" represented by the formula (1) is 321483 10 201020279 θ-(3, 4-ring Oxycyclohexyl)ethyltrimethoxydecane, or cold-(3,4-oxocyclohexyl)ethyltriethoxylate. [17] The method for producing a reactive functional group-containing oxoxane-compound according to the above [12] to [16], wherein the sterol terminal polyfluorene oxide of the formula (2), (13) R3 may be the same or different from each other, and is independently a thiol group or a phenyl group. [18] The method for producing a reactive functional group-containing oxoxane compound according to the above [13] to [15] wherein the alkoxydecane compound represented by the formula (3) is selected from the group consisting of methyl dioxane At least one of a group consisting of decane, phenyltrimethoxydecane, methyltriethoxydecyldecane, and phenyltriethoxydecane. [19] A curable resin composition comprising a siloxane compound (Α) containing a reactive functional group and a curing agent (Β) contained in any one of the above [^ to 丨]. [20] The curable resin composition according to the above [19], which further comprises a curing accelerator (C). [21] A cured product for a photo-semiconductor, which is obtained by thermally curing a curable resin composition of the above-mentioned [19] or [2]. [22] The optical semiconductor element is sealed with the cured product for an optical semiconductor described in the above [2〇]. [Effects of the Invention] The cured product of the curative resin composition of the Shixi gas compound has no stickiness or deformation, and is excellent in transparency, light resistance, and low modulus at low temperatures. . Therefore, the curable resin composition of the present invention is extremely suitable as an optical semiconductor sealing material. [Embodiment] 11 321483 201020279 [Best Mode for Carrying Out the Invention] A known cyclooxygenated compound containing a reactive functional group (hereinafter also referred to as "the invention of the invention" is in the middle molecule and is in the right-handed position. Anti-accumulator: The hydrolyzed condensed segment of the oxetene (preferably having a half-oxyalkylene group having an epoxy group). The h-dimensional network is doubled, and the invention of the oxygen compound compound's t-system becomes a three-dimensional network-like segment (referred to as a distribution of sesquioxanes in three-dimensional with 1 oxygen ^; Oxygen (10) is preferred as the core, and the chain-like polycene ==,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The diarrhea compound is as described above, 31' has a three-burning oxygen-oxygen Xi Xiu ^ hydrolysis condensation segment (preferably sesquiter (10) segment) and the chain polyoxyl chain 1 again, from which the system is repeated Further, it may be referred to as a block type siloxane compound. The oxime compound of the present invention is, for example, a sputum sputum compound (a- Ι) represented by the following formula (10) (hereinafter also referred to as (four) The hetero (a-1)) is preferably an alkoxydecane compound (a) represented by the following formula (1) (hereinafter also referred to as alkoxydecane (a))' and a compound represented by the formula (2) The helium oxide oil (b) can be produced as a raw material. If necessary, the alkoxysilane compound (a-fluorene) (preferably as (a)) and the alkoxysilane compound represented by the above formula (3) can be used. c) and used as As raw material, XSi(Ri)n(0R2)3-„(10) (wherein 'X represents a reactive functional group having an epoxy group; Ri represents a substitution or 12 321483 201020279 unsubstituted carbon number 1 to 10 a substituted or unsubstituted aryl group having 6 to 14 carbon atoms, or a substituted or unsubstituted carbon number 2 fluorene base; R2 represents a carbon number i to Π); η represents 〇 to 2 m soil When there are a plurality of plural, the plurality of ties may be mutually different or different from each other), XSi(0R 〇 3 (1) (wherein X and 匕 are synonymous with the above formula (1 〇)). In the oxygen generating compound of the present invention The chain (four) oxygen bond segment is formed by polyphosphorus oxygen oil (6), and the hydrolyzed condensation segment of the three alkoxylates is preferably a sesquiterpene-sintered segment, and a three-dimensional network The oxygen-burning bond segment is more preferable. It is preferably (4) by the calcined oxygen-sintering compound (5). (If necessary, the oxygen-burning stone compound (c) is used together (hereinafter also referred to as a calcined stone (c) When it is made of azepine oxide \1) ' is preferably formed by (a) and alkoxy decane (c)}. The cleavage bond is preferably the above-mentioned oxy-stone compound (4) Between (6), via Wei The bond between the hydrolysis of the base and the condensation of the ruthenium is formed by the hydrolysis condensation, so that the structural unit of x (the structure of the complex and the Α _ _ is a complex combination). The oxy-oxygen compound is referred to as sesquiterpene oxygenation, so the hydrolyzed condensation segment can be referred to as a sesquiterpene oxygenation chain segment. [, and 'each material will be described in detail. (a) Or alkoxydecane compound (a-1) or two as shown in (1). For example, it may be an organic group having an epoxy group, and there is no particular limitation on glycidyloxy carbon such as A glycidyloxyethyl group, r-glycidoxy oxygen X-ray, and glycidyloxybutyl group. Numbers 1 to 4 are based on glycidol. Soil '々~(3,4-epoxycyclohexyl)ethyl, 7-(3,4- 13 321483 201020279 Lytic hexyl)propyl, ^( 3,1 epoxycycloheptyl)ethyl, valence (3 epoxide cyclohexyl) propyl, stone-(3,4-epoxycyclohexyl)butane (3'4-hydroxyl) Cyclohexyl)pentyl or the like having a carbon number of from 5 to 5 substituted with a cycloalkyl group having an epoxy ring (epoxyether). The alkyl group having a carbon number of 1 to 3 substituted by a glycidoxy group or an alkyl group having a carbon number of 3 to 3 substituted by a cycloalkyl group having a number of oxime of 5 to 8 of the oxime, for example, 10,000-shrinkage Glyceryloxyethyl, glycidoxypropyl, cold (3'4%oxycyclohexyl)ethyl is preferred, and cold mono(3,4-epoxycyclohexyl)ethyl is particularly preferred. - The oxime in the formula (10) or (1), each independently, represents an alkyl group having a carbon number of 丨 to 1 Å, and may be any of a linear chain, a branched chain or a cyclic chain. Examples thereof include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, tert-butyl group, n-pentyl group, n-hexyl group, cyclopentyl group, cyclohexyl group and the like. From the viewpoint of reaction conditions such as compatibility and reactivity, the Rz is preferably a methyl group or an ethyl group, and particularly preferably a fluorenyl group. Further, in the case of the formula (1), the description of each group in the description of the following formula (2) can be directly cited. Preferred examples of the alkoxydecane represented by the formula (10) or (1) (aD or (3) include, for example, a dot-glycidoxyethyltrimethoxy decane, a stone-glycidyloxy group. Ethyl triethoxy decane, r _ glycidoxypropyl trimethoxy oxycarbazide, glycidoxypropyl triethoxy sulphur, cold one (3, 4-epoxycyclohexyl) Trimethoxy decane, 々-(if epoxycyclohexyl)ethyltriethoxy decane, particularly preferably p-(3,4-epoxycyclohexyl)ethyltrimethoxydecane. The alkoxyoxane compound (3) may be used alone or in combination with two or more kinds of decane (c) as shown in the following formula (3). The end of the structure represented by the following formula (2) has a chain-like polyoxyalkylene oil.

(式中之R3以及m與上述者相同) 通式(2)之式中’存在複數個 之R3可互同或互異,表 示碳數1至之烧基、碳數6至14之芳基或碳數2至1〇 碳數1至10之烷基可列舉如:碳數1至1〇之直鍵狀、 分支狀或壤狀之炫基 ’其例可列舉如:曱基、乙基、正丙 土八丙基、正丁基、異丁基、第二丁基、第三丁基、正 ^基異戊基、戊基、正己基、環戊基、環己基、辛基、 © I乙基己基、壬基、癸基等。如顧及到耐光性時,則 土、乙基或環己基為佳。 基 碳數6至14之芳基,其例可列舉如:苯基、鄰 間曱笨基、對曱苯基、二曱笨基等。 碳數2 基乙烯基、 烯基等。 至10之烯基,其例可列舉如:乙烯基、卜甲 烯丙基、丙烯基、丁烯基、戊烯基、己烯基等 t先性、耐熱性之觀點而言,R3各自獨立宜為 苯基、環p « 7 τ I、 已基或正丙基,以曱基或苯基為特佳。具體可列 321483 15 201020279 舉如通式(2)之2個R3為曱基或苯基、或一者為甲基另 一者為笨基之情形。該等之組合一般多為反覆單元均為相 同組合之情況,然而只要達成本發明之效果,可在反覆單 凡中混入不同組合。例如:即使各個反覆單元不同,亦可 規則性或無規性地混入相異物。 通式(2)之化合物的m平均值為2至2〇〇〇,以2至2〇〇 為佳以3至1 〇〇更佳,又以3至5〇為特佳。μ值過低時, 硬化物因過硬而使低彈性率特性低劣。Μ值過高時,硬化 物會有機械特性惡化之傾向。 聚矽氧油(b)之重量平均分子量(Mw)一般在3〇〇至 50000之範圍内,以3〇〇至3〇〇〇〇之範圍内為佳,以3〇〇 至18000(GPC測定值)之範圍更佳。該等之中,如考量低溫 下之彈性率,則以分子量3〇〇至者更佳,如進一步 考量組成物化時之相溶性,則以3〇〇至5〇〇〇者更佳,尤以 500至3000者為特佳。重量平均分子量低於3〇〇時,會有 鏈狀聚石夕氧鏈鍛部份之特性無法呈現之虞。本發明之聚石夕 氧油(b)的分子量係使用GPC(Gel Permeation Chromatography :凝膠滲透層析)’依下述條件測定之換算 聚本乙稀之重量平均分子量(Mw)。 GPC之各種條件 廠商:島津製作所 管柱:保護管柱(guardcolumn)SH0DEXGPCLF-GLF-804(3 支) 流速:1. 〇ml/min. 321483 16 201020279 管柱溫度:40°C 使用溶劑:THF(四氫呋喃) 檢測器:RI(示差折射檢測器) 聚矽氧油(b)之動黏度以10至200cSt之範圍者為佳, 。以30至90cSt者更佳。黏度過低時,本發明之標的石夕氧燒 化合物之黏度亦變低而有不適用為光半導體密封劑之情 況,反之,黏度過高時’嵌段型矽氧烧化合物(A)之黏度上 昇而有妨礙操作性之傾向。 ® 聚矽氧油(b)之R3為曱基時的聚矽氧末端二曱基聚矽 氧油之具體例可列舉如下之製品名稱。例如: 東麗道康寧聚矽氧(股)之商品有PRX413、BY16-873 ; 信越化學工業(股)之商品有X-21-5841、KF-9701 ; 邁圖(M0MENTIVE)(股)之商品有 XC96-723、TSR160、 YR3370、YF3800、XF3905、YF3057、YF3807、YF3802、YF3897、 XF3905 ; ❹ Gelest(股)之商品有 DMS-S12、DMS-S14、DMS-S15、 DMS-S21、DMS-S27、DMS-S31、DMS-S32、DMS-S33、DMS-S35、 DMS-S42 、 DMS-S45 、 DMS-S51 等。 聚矽氧油(b)之R3為甲基以及苯基的聚矽氧末端甲基 苯基聚矽氧油之較佳具體例可列舉如下之製品名稱。例如: 邁圖(股)之商品有YF3804 ;(wherein R3 and m are the same as those described above) In the formula (2), a plurality of R3s may be mutually the same or different from each other, and represent an aryl group having a carbon number of 1 to a carbon group of 6 to 14 carbon atoms. Or an alkyl group having a carbon number of 2 to 1 〇 and a carbon number of 1 to 10, for example, a straight-bonded, branched or precipitated condensed base having a carbon number of 1 to 1 Å, and examples thereof include a mercapto group and an ethyl group. , n-propyl octapropyl, n-butyl, isobutyl, t-butyl, tert-butyl, n-isopentyl, pentyl, n-hexyl, cyclopentyl, cyclohexyl, octyl, © Iethylhexyl, fluorenyl, fluorenyl and the like. When considering light resistance, soil, ethyl or cyclohexyl is preferred. Examples of the aryl group having 6 to 14 carbon atoms include a phenyl group, an anthracene group, a p-phenylene group, and a diphenyl group. Carbon number 2 based vinyl, alkenyl, and the like. Examples of the alkenyl group to 10 include, for example, a vinyl group, a methallyl group, a propenyl group, a butenyl group, a pentenyl group, a hexenyl group, and the like, and a heat resistance. It is preferably a phenyl group, a ring p « 7 τ I, a hexyl group or a n-propyl group, particularly preferably a fluorenyl group or a phenyl group. Specifically, 321483 15 201020279 is a case where two R3 of the formula (2) are a mercapto group or a phenyl group, or one of which is a methyl group and the other is a stupid group. The combination of these is generally the case where the overlapping units are all the same combination, however, as long as the effect of the present invention is achieved, different combinations can be mixed in the repeated cases. For example, even if the individual reversing units are different, the foreign matter can be mixed regularly or randomly. The compound of the formula (2) has an average value of 2 to 2 Å, preferably 2 to 2 Torr, more preferably 3 to 1 Torr, and particularly preferably 3 to 5 Å. When the μ value is too low, the hardened material is too hard to deteriorate the low modulus of elasticity. When the enthalpy is too high, the hardened material tends to deteriorate in mechanical properties. The weight average molecular weight (Mw) of the polyoxygenated oil (b) is generally in the range of 3 Torr to 50,000, preferably in the range of 3 Torr to 3 Torr, and is determined from 3 Å to 18,000 (GPC measurement). The range of values) is better. Among these, if the elastic modulus at low temperature is considered, the molecular weight is preferably 3 〇〇, and further consideration is given to the compatibility of the composition physicochemical, preferably 3 〇〇 to 5 ,, especially 500 to 3000 are particularly good. When the weight average molecular weight is less than 3 Å, the characteristics of the chain poly-stone chain forging portion cannot be exhibited. The molecular weight of the polyoxime oil (b) of the present invention is a weight average molecular weight (Mw) of the converted polyethylene according to the following conditions using GPC (Gel Permeation Chromatography). Various conditions of GPC: Shimadzu Corporation column: guard column (guardcolumn) SH0DEXGPCLF-GLF-804 (3) Flow rate: 1. 〇ml/min. 321483 16 201020279 Column temperature: 40 °C Solvent: THF ( Tetrahydrofuran) Detector: RI (Differential Refractive Detector) The viscosity of the polyoxygenated oil (b) is preferably in the range of 10 to 200 cSt. Better than 30 to 90 cSt. When the viscosity is too low, the viscosity of the target ascorbic oxide compound of the present invention is also low, and it is not suitable for the case of the optical semiconductor encapsulant. On the contrary, when the viscosity is too high, the viscosity of the block type antimony-oxygen compound (A) is high. It rises and has a tendency to hinder operability. Specific examples of the polyfluorene end-terminated dimercaptopolyoxyl oil when R3 of the polyoxyxane oil (b) is a mercapto group include the following product names. For example: Dongli Dao Kang Ning Poly Oxide (shares) products are PRX413, BY16-873; Shin-Etsu Chemical Industry Co., Ltd. products are X-21-5841, KF-9701; Momentive (M0MENTIVE) (shares) have XC96-723, TSR160, YR3370, YF3800, XF3905, YF3057, YF3807, YF3802, YF3897, XF3905; ❹ Gelest products are DMS-S12, DMS-S14, DMS-S15, DMS-S21, DMS-S27, DMS-S31, DMS-S32, DMS-S33, DMS-S35, DMS-S42, DMS-S45, DMS-S51, etc. Preferable specific examples of the polyoxonium-terminated methyl phenyl polyfluorene oxide in which R 3 of the polyoxygenated oil (b) is a methyl group and a phenyl group include the following product names. For example: the products of Momentive (shares) are YF3804;

Gelest(股)之商品有 PDS-0332、PDS-1615 等。 聚矽氧油(b )之R 3為苯基的聚砍氧末端二苯基聚矽氧 油可列舉如Gelest(股)之PDS-9931作為較佳之製品名稱 17 321483 201020279 的具體例。在上述之具體例中,從分子量、動黏度之觀點, 宜為 PRX413、BY16-873、X-2卜584卜 KF-97(H、XC96-723、 YF3800、YF3804、DMS-S12、DMS-S14、DMS-S15、DMS-S21、 PDS-1615。該等之中’由於具有聚矽氧鏈鍛柔軟性之特徵, 因此從分子量之觀點’以X-21-584卜XC96-723、YF3800、 YF3804、DMS-S14、PDS-1615為特佳。該等聚矽氧油(b)可 單獨使用,亦可合併2種以上使用。 接著,對於烷氧矽烷化合物(c)詳加敘述。 烷氧矽烷化合物(c)具有下述式(3)之構造。 R4Si(〇R2)3 (3) 通式(3)中之R4表示曱基或苯基。 通式(3)中之R2與通式(1〇)或(丨)之匕可相同或不同, 係各自獨立,表示碳數丨至1〇之烷基,可為直鏈狀、分支 狀或環狀之任一者。具體上係包含較佳之基以及更佳之 基,與上述通式(10)或(1)之的說明中之例示相同。 炫·氧矽院化合物(c)之較佳具體例可列舉如:甲基三 曱氧基矽烷、苯基三甲氧基矽烷、甲基三乙氧基矽烷、苯 基二乙氧基矽烷等。上述之中,以甲基三甲氧基矽烷或苯 基二曱氧基碎烧為佳。 本發明中,為了調整嵌段型矽氧烷化合物(A)之分子 I、形成組成物時之相溶性、以及硬化物之耐熱性、财光 性、低透濕性、低透氣性等,烷氧矽烷化合物(c)可合併使 用烧氧石夕烧化合物(a-Ι),以(a)為佳。 相對於烷氧矽烷化合物之總和((&amp;-υ,以(&amp;)與((〇之 321483 18 201020279 總和為佳),烷氧矽烷化合物(c)之使用量為〇至70莫耳%, 以0至55莫耳%為佳,以〇至莫耳%更佳。如將烧氧梦 烷化合物(c)與院氧發燒化合物(a)供用時,相對於院氧石夕 烷化合物之總和’烷氧矽烷化合物(c)之使用範圍宜為5 至70莫耳% ’以5至50莫耳%更佳,又以10至40莫耳% 為特佳。 以下係記載本發明之;5夕氧烧化合物的製造方法。 本發明之矽氧烷化合物可將上述之烷氧矽烷化合物 v (a-1)(以下亦稱烷氧矽烷(a-1)),以烷氧矽烷(a)(以下亦 稱烷氧矽烷(a))為佳’與上述聚矽氧油(b)作為原料而製 造,並可依需要而併用上述之烷氧矽烷化合物(c)作為原 料。 本發明之矽氧烷化合物之製造係,可製造具有上述2 - 個鏈段之本發明之矽氧烷化合物,可採用任意之方法。 最合適之方法係如上述’經由下述兩階段反應之方 ❹法’第1階段反應係使矽醇末端聚矽氧油(b)、院氧石夕烧 (a 1)(以(a)為佳)以及依所需之燒氧石夕烧(c),在相對於碎 醇末端聚矽氧油(b)之矽醇基1當量,上述意氡砍烧化合物 之烧氧當量為1. 5至200當量之範圍内反應並縮合,其後 進行之第2階段反應係將水添加在所得反應液中,使剩餘 的烧氧基水解•縮合(一銷(One-pot)法)。 上述第1階段反應’不存在水時,宜在酸觸媒或驗觸 媒(以鹼觸媒為佳)之存在下進行。 上述第1階段反應之烷氧矽烷(a-Ι),以(a)為佳[因 321483 19 201020279 應所需而併用烷氧矽烷(C)]與聚矽氧油(b)之反應中的上 述烷氧矽烷化合物,與聚矽氧油(b)之比例,一般相對於聚 矽氧油(b)之矽醇基1當量,烷氧矽烷(a-Ι),以(a)為佳[因 應所需而併用烷氧矽烷(c)]中之烷氧當量(在併用烷氧矽 烷(c)時,烷氧矽烷(a-1),以(a)為佳,與烷氧矽烷(c)之 烷氧基總當量)為1. 5至200當量,以2至200當量為佳, 以2至150當量更佳,又以2至100當量為特佳。而且, 該比例係相對於聚矽氧油(b)之矽醇基1當量,上述烷氧矽 烷化合物之烷氧當量可為3至100當量,以4至100當量 © 為佳,以5至100當量更佳。 上述烷氧矽烷化合物之量如大幅超出上述之上限範 圍時,則恐所得物會喪失本發明之烷氧矽烷化合物的較佳 物性。 _ 專利文獻UW02005/100445號)中揭示,不使用矽醇 末端聚石夕氧油(b ),在水的存在下,使具有環氧基之砍烧化 合物與不具環氧基之矽烷化合物同時進行水解縮合。通常 _ 在具有官能基之倍半矽氧烷之合成中,與專利文獻1相 同,在水的存在下,使具有官能基之烷氧矽烷化合物與不 具官能基之烷氧矽烷化合物同時進行水解縮合。 然而,如本發明,除了烷氧矽烷(a-Ι),以(a)為佳[因 應所需之烷氧矽烷(c)],亦使用聚矽氧油(b)作為原料時, 如使該等原料在觸媒以及水的存在下一起反應,由於烷氧 矽烷(a-Ι),以(a)為佳[因應所需之烷氧矽烷(c)]之烧氧基 間的水解•縮合反應優先進行,有時,所形成之倍半矽氧 20 321483 201020279 烧化合物與未反應之聚石夕氧油(b)殘留且互不相溶而有產 生不均勻白濁化合物的傾向。如此之白濁有機聚;g夕氧烧不 適於光學用途上。 而且,即使不影響透明性時,合成的化合物唯恐有分 子量減低之傾向’且發生耐熱性降低以及「發黏」等之情 形’而難以獲得較佳之本發明的矽氧烷化合物。 包含上述之最適方法,本發明之含反應性官能基之石夕 ❺氧烷化合物的製造方法係以經由以下之(i)以及(ii)所示 的製造步驟者為佳。 製造步驟(i):經由進行矽醇末端聚矽氧油與上述 烷氣矽烷之脫醇縮合而將聚矽氧油末端進行烷氧矽烷改 質,而形成烷氧矽烷改質體(d)的步驟(鏈狀聚矽氧鏈段形 成步驟)、 ' 製造步驟(ii):在水的存在下,進行烷氧矽烷改質體 (d)以及上述烷氧矽烷化合物中之烷氧基間的水解·縮合, ©形成燒氧石夕烧之水解縮合鏈段(以料石夕氧烧鏈段為佳)的 步驟。 製造步驟(i)以及(ii)無論順序如何,只t經由各步 驟進行反應即可。 而,,可依情況,以依次將水滴下等之方法使矽醇末 夕氧油(b)與上述烧氧梦烧化合物反應,使上述製造责 驟(i)以及(ii)之反應以一個步驟進行。 之夏再者在(!)中,取代上述烷氧矽烷而使用另外合成 -、有2個以上燒氧基取代的倍半⑦氧燒時,僅以製造炎 21 321483 201020279 驟(i)亦可獲得本發明之矽氧烷化合物。 較佳之製造方法包含上述之最適方法,具體上可列舉 如以下之三種製造方法: &lt;製造方法(甲)&gt; 首先,進行製造步驟(i):經末端具有矽醇基之聚矽 氧油(b)與烷氧矽烷(a)[可因應所需而併用烷氧矽烷(c)] 之脫醇縮合反應,經由將聚矽氧油末端轉變為烷氧矽烷, 可得烷氧矽烷改質體(d)。 其次,製造步驟(ii)較佳係在烷氧矽烷(a)[可因應所 © 需而併用烷氧矽烷(c)]之共存下,使製造步驟(i)中所得之 聚矽氧油之烷氧矽烷改質體(d)的烷氧基間、或上述烷氧矽 烷化合物共存時之上述烷氧矽烷改質體(d)以及上述烷氧 石夕院化合物兩者的烧氧基間,在水的存在下,經由進行水 解縮合反應,而製造具有鏈狀聚矽氧鏈段[通常以 -(0Si(R3)2)ra-表示(R3表示與式(2)者同義)]以及烷氧矽烷 之水解縮合鏈段(以倍半矽氧烷鏈段為佳)的塊狀之本發明 _ 石夕氧烧化合物的方法。 〈製造方法(乙)&gt; 首先,進行以下步驟:烷氧矽烷(a)[可因應所需而併 用炫氧碎烧(c)]在水的存在下,使烧氧基間進行水解縮合 反應,而獲得分子内具有烷氧基之烷氧矽烷的水解縮合物 (以倍半矽氧烷(e)為佳)。 其次,較佳製造方法係將上述所合成之烷氧矽烷水解 縮合物(以倍半矽氧烷(e)為佳)分離,此外,宜在水不存在 22 321483 201020279 下’使末端具有賴叙㈣氧油⑹與上賴得之炫氧石夕 .㈣水解縮合物(以倍半石夕氧燒⑷為佳)進行脫醇縮合反 應,而製得本發明之矽氧烷化合物者。 〈製造方法(丙)&gt; 首先進行製造步驟⑴:宜在不存在水而在過剩之上 述烧氧石夕院的存在下,使末端具有石夕醇基之聚石夕氧油⑻ 與烷氧矽烷(a)[可因應所需而併用烷氧矽烷(c)]進行脫醇 縮合反應,形成上述烷氧矽烷改質體((1)後,接著,進行製 造步驟(11):在水的存在下’經由進行殘餘之烧氧石夕烷 (a)[因應所需而併用燒氧魏⑹時,則為殘餘之院氧石夕院 (a)以及(c)]以及上述烷氧矽烷改質體((1)之烷氧基間的水 解縮合反應,而製得本發明之矽氧烷化合物之一鍋法。 本發明中,由縮短製造步驟之觀點,較佳者為:不分 離第1階段反應物而直接進行第2階段反應,依序地以一 鍋式進行反應。 ❿ 以下,進一步地對具體之製造方法(丙)(前述之最佳 製造方法)加以敘述。 一鍋式進行時以製造步驟(i)作為第丨階段反應,並 以製造步驟(ii)作為第2階段反應,首先在第1階段反應 (製造步驟(1))中’進行聚矽氧油(b)與烷氧矽烷(a)[因應 所需之烷氧矽烷(C)]之脫醇縮合,使聚矽氧油(1))末端之矽 醇基的風原子改貝為烧氧石夕燒’得到烧氧石夕燒改質體(d )。 在第1階段反應中’較佳為在不添加水下進行,因此烧氧 基間不會產生水解縮合’相對於矽醇基1當量,在使用院 321483 23 201020279 氧基3當量以上之反應時,認為烷氧矽烷改質體(d)係以如 下述式(4)所示之構造存在,並認為在形成如此之改質體(d) 後,以接著進行烷氧基間的水解縮合為佳。因此,相對於 聚矽氧油(b)之矽醇基1當量,該反應以使用烷氧基3當量 至200當量反應者為較佳態樣之一。 r2o r6 Si—Ο OR2The products of Gelest are PDS-0332, PDS-1615 and so on. The polyoxydeoxy-terminated diphenylpolyoxyl oil having a polyoxyxane oil (b) wherein R 3 is a phenyl group can be exemplified by PDS-9931 of Gelest as a specific example of the preferred product name 17 321483 201020279. In the above specific examples, from the viewpoints of molecular weight and dynamic viscosity, it is preferably PRX413, BY16-873, X-2, 584, KF-97 (H, XC96-723, YF3800, YF3804, DMS-S12, DMS-S14). , DMS-S15, DMS-S21, PDS-1615. Among these, 'because of the characteristics of the softness of the polyoxygen chain forging, from the viewpoint of molecular weight', X-21-584, XC96-723, YF3800, YF3804 DMS-S14 and PDS-1615 are particularly preferred. These polyoxyxane oils (b) may be used singly or in combination of two or more. Next, the alkoxy decane compound (c) will be described in detail. The compound (c) has a structure of the following formula (3): R4Si(〇R2)3 (3) R4 in the formula (3) represents a fluorenyl group or a phenyl group. R2 and a formula of the formula (3) 1〇) or (丨) may be the same or different, each independently, representing an alkyl group having a carbon number of 丨 to 1〇, which may be linear, branched or cyclic. The preferred group and the preferred group are the same as those exemplified in the description of the above formula (10) or (1). Preferred examples of the compound (c) of the oxime compound are exemplified by methyltrimethoxy group. Decane, The above is preferably trimethylmethoxydecane, phenyldiethoxysilane or phenyldiethoxydecane. In the above, it is preferably calcined with methyltrimethoxydecane or phenyldiazepine. In order to adjust the molecular I of the block type siloxane compound (A), the compatibility at the time of forming a composition, and the heat resistance, the viscous property, the low moisture permeability, the low gas permeability of the cured product, etc., the alkoxy decane compound ( c) may be used in combination with a pyrochlore compound (a-Ι), preferably (a). Relative to the sum of alkoxysilane compounds ((&amp;-υ, to (&) and ((〇之321483 18 201020279 The sum is better), the alkoxydecane compound (c) is used in an amount of from 〇 to 70 mol%, preferably from 0 to 55 mol%, more preferably from 〇 to mol%. When the compound (c) and the hospital oxygen-suppressing compound (a) are used, the sum of the alkoxydecane compound (c) is preferably in the range of 5 to 70 mol% to 5 to 50 mol. The ear % is more preferably 10 to 40 mol %. The following is a description of the method for producing the 5 o'clock oxygen-burning compound of the present invention. The alkoxysilane compound of the present invention may be the alkoxyoxane compound v (a-1) (hereinafter also referred to as alkoxydecane (a-1)) as an alkoxydecane (a) (hereinafter also referred to as alkoxydecane (a)). And the above-mentioned polyoxyxane oil (b) is used as a raw material, and the above alkoxylated oxane compound (c) can be used as a raw material as needed. The manufacturing system of the oxirane compound of the present invention can be produced. The above-described two-stage segment of the present invention may be any of the methods described above. The most suitable method is as described above for the 'stage-by-step reaction of the two-stage reaction'. The first-stage reaction system is to make the sterol-terminated polyoxyl oil (b) and the oxalate (a 1) (a) Preferably, and according to the desired pyrochlore (c), the oxygenated equivalent of the above-mentioned chopped chopping compound is 1. 1 equivalent to the decyl alcohol group of the polyoxyxamic oil (b) at the end of the broken alcohol. The reaction and condensation are carried out in the range of 5 to 200 equivalents, and the second stage reaction thereafter is carried out by adding water to the obtained reaction liquid to hydrolyze and condense the remaining alkoxy group (one-pot method). In the case where the first-stage reaction "in the absence of water", it is preferably carried out in the presence of an acid catalyst or a catalyst (preferably a base catalyst). The alkoxynonane (a-fluorene) of the above first-stage reaction is preferably (a) [due to the use of alkoxydecane (C) as required by 321483 19 201020279] and the polyoxyxane (b) The ratio of the alkoxydecane compound to the polyoxyxane oil (b) is generally 1 equivalent to the decyl alcohol group of the polyoxyxanic oil (b), and the alkoxydecane (a-fluorene) is preferably (a). The alkoxy equivalent of alkoxy decane (c) is used in combination with the alkoxy decane (c), alkoxy oxane (a-1), preferably (a), with alkoxy decane (c) The total alkoxy group equivalent weight) is from 1.5 to 200 equivalents, preferably from 2 to 200 equivalents, more preferably from 2 to 150 equivalents, still more preferably from 2 to 100 equivalents. Further, the ratio is 1 equivalent to the sterol group of the polyoxyxane oil (b), and the alkoxy decane compound may have an alkoxy equivalent of 3 to 100 equivalents, preferably 4 to 100 equivalents, and 5 to 100. The equivalent is better. When the amount of the alkoxysilane compound is greatly exceeded the above upper limit range, the resultant may lose the preferred physical properties of the alkoxysilane compound of the present invention. _ Patent Document UW02005/100445, discloses that, without using a sterol terminal polyoxosulfuric acid (b), a chopping compound having an epoxy group and a decane compound having no epoxy group are simultaneously carried out in the presence of water. Hydrolysis condensation. In general, in the synthesis of a sesquiterpene having a functional group, as in Patent Document 1, a alkoxysilane compound having a functional group is simultaneously subjected to hydrolysis condensation with an alkoxysilane compound having no functional group in the presence of water. . However, according to the present invention, in addition to the alkoxydecane (a-fluorene), it is preferred that (a) is used [in response to the desired alkoxyoxane (c)], and when the polyoxygenated oil (b) is used as a raw material, These materials are reacted together in the presence of a catalyst and water. Because of the alkoxydecane (a-fluorene), (a) is preferred [in response to the desired alkoxyoxane (c)] hydrolysis between the alkoxy groups. The condensation reaction proceeds preferentially, and sometimes the formed sesquiterpene oxide 20 321483 201020279 calcined compound and the unreacted polysulfuric acid (b) remain incompatible with each other and tend to produce uneven white turbidity compounds. Such a white turbid organic polymer; g oxy-oxygen is not suitable for optical use. Further, even if the transparency is not affected, the synthesized compound tends to have a reduced molecular weight, and the heat resistance is lowered and the "stickiness" is caused, and it is difficult to obtain a preferred oxoxane compound of the present invention. Including the above-described optimum method, the method for producing the reactive functional group-containing oxanthene oxide compound of the present invention is preferably a production step shown by the following (i) and (ii). Manufacturing step (i): the alkoxysilane is subjected to alkoxysilane modification by a dealcoholization condensation of a decyl alcohol-terminated polyoxyl oil with the above alkane gas to form an alkoxysilane modified body (d). Step (chain-like polyoxygen segment formation step), 'manufacturing step (ii): performing a hydrolysis between alkoxysilane modified substance (d) and an alkoxy group in the above alkoxydecane compound in the presence of water Condensation, © a step of forming a hydrolyzed condensed segment of the pyrotechnic sinter (preferably, the oxysulfonation chain is preferred). The manufacturing steps (i) and (ii), regardless of the order, can be carried out only through the respective steps. Alternatively, depending on the situation, the sterol oxy-oil (b) may be reacted with the above-mentioned oxy-moulding compound by a method of sequentially dropping water droplets, etc., so that the reaction of the above-mentioned manufacturing steps (i) and (ii) is one. The steps are carried out. In the summer, in (!), when the above alkoxy decane is used instead of the alkoxy oxime, and the halophilic 7-oxygen aldehyde is substituted with two or more alkoxy groups, only the inflammatory 21 321483 201020279 (i) may be produced. The oxoxane compound of the present invention is obtained. The preferred production method includes the above-described optimum method, and specifically, the following three production methods are exemplified: &lt;Production method (A)&gt; First, the production step (i): a polyoxyloxy oil having a sterol group at the terminal (b) with a dealcoholization condensation reaction with alkoxy oxane (a) [which can be used in combination with alkoxy oxirane (c), as desired, by converting the end of the polyoxyxane oil to an alkoxy oxane Body (d). Next, the production step (ii) is preferably carried out in the coexistence of alkoxysilane (a) [which can be used in combination with alkoxysilane (c)] to produce the polyoxyxene oil obtained in the step (i). And the alkoxy group of the alkoxy oxane modified product (d) or the alkoxy oxane modified product (d) and the alkoxylated compound of the alkoxysulfan compound in the presence of the alkoxydecane compound, In the presence of water, by carrying out a hydrolysis condensation reaction, a chain polyphosphonium chain segment is formed [usually represented by -(0Si(R3)2)ra- (R3 represents synonymous with formula (2)) and an alkane The present invention for the hydrolyzed condensation segment of oxoxane (preferably a sesquioxane chain segment) is a method for the synthesis of a compound. <Manufacturing Method (B)&gt; First, the following steps are carried out: alkoxyoxane (a) [may be used in combination with phosgene (c) in the presence of water] to carry out a hydrolysis condensation reaction between the alkoxy groups in the presence of water Further, a hydrolysis condensate of alkoxyoxane having an alkoxy group in the molecule (preferably sesquioxane (e) is preferred). Secondly, the preferred method of preparation is to separate the alkoxydecane hydrolyzed condensate (preferably sesquioxane (e)) as described above, and further preferably, in the absence of water 22 321483 201020279 (4) The oxygen oil (6) and the oxidized oxygen stone of the upper lysate. (4) The hydrolysis condensate (preferably sesquiterpene gas (4) is preferred) to carry out the dealcoholization condensation reaction to obtain the oxoxane compound of the present invention. <Manufacturing Method (C)&gt; First, the manufacturing step (1) is carried out: in the presence of the above-mentioned oxygen-burning stone court in the absence of water, the poly-stone-oxygen oil (8) having an anthracene group at the end and the alkoxy group are preferably present. The decane (a) [may be used in combination with the alkoxy decane (c)] to carry out a dealcoholization condensation reaction to form the above alkoxy oxane modified body ((1), followed by a production step (11): in water In the presence of 'by the residual pyrithione (a) [when the oxygenated Wei (6) is used in combination, the remaining courtyards (a) and (c)] and the above alkoxy decane are modified. The plastid (the hydrolytic condensation reaction between the alkoxy groups of (1), the one of the oxoxane compounds of the present invention is obtained. In the present invention, from the viewpoint of shortening the production steps, it is preferred that the separation is not carried out. The first-stage reaction is carried out directly in the first-stage reaction, and the reaction is carried out in a one-pot manner in sequence. ❿ Hereinafter, a specific production method (C) (the above-described preferred production method) will be further described. The manufacturing step (i) is used as the second-stage reaction, and the manufacturing step (ii) is used as The two-stage reaction, first in the first-stage reaction (manufacturing step (1)), the deco-alcoholization of the polyoxyxane oil (b) with the alkoxy oxane (a) [in response to the desired alkoxy decane (C)] The gas atom of the sterol group at the end of the polyoxygenated oil (1)) is converted to a calcined oxygen stone to obtain a burned oxygen stone modified body (d). In the first stage reaction, 'preferably The reaction is carried out without adding water, so that there is no hydrolysis condensation between the alkoxy groups, and 1 equivalent of the sterol group is used. When the reaction is carried out in a hospital of 321483 23 201020279 oxy 3 equivalents or more, the alkoxy oxane modified body is considered to be The structure exists as shown in the following formula (4), and it is considered that after the formation of such a modified body (d), it is preferred to carry out hydrolytic condensation between alkoxy groups. Therefore, relative to the polyoxygenated oil (b) The sterol group is 1 equivalent, and the reaction is preferably one of the reaction using 3 to 200 equivalents of the alkoxy group. r2o r6 Si-Ο OR2

(4)

式(4)中,R2、R3以及m表示與上述者同義,R6可相同 或不同,係各自獨立,表示上述X及/或1?4。 第1階段反應中,相對於矽醇基1當量,如使少於1. 0 當量之量的烷氧基反應時,在第1階段反應結束時因不存 在烷氧基,而無法邁向第2階段反應,並且,如使烷氧基 在1. 0至1. 5當量之間反應,則烷氧矽烷(a)[因應所需之 烷氧矽烷(c)]中之2個以上烷氧基與聚矽氧油(b)之矽醇 基反應,而在第1階段反應結束時,因過度形成高分子而 引起凝膠化。因此,相對於矽醇基1當量,必須以1.5當 量以上之烷氧基與之反應。由控制反應之觀點而言,宜為 2. 0當量以上。 烷氧矽烷之水解縮合鏈段,由作成較佳之倍半矽氧烷 鏈段之觀點而言,相對於矽醇基1當量,所使用之烷氧基 宜為3當量以上,以4當量以上為佳,5當量以上更佳。 同時,本發明中之倍半矽氧烷鏈段可為一般所謂的梯 24 321483 201020279 型、籠型之部分開環者或無規型等之任意構造,一般認為 是該等的混合型者。 第1階段反應結束後,直接在反應液中添加水,進行 烷氧基間之水解縮合的第2階段反應(製造步驟(丨丨))。 相對於作為上述原料使用之烧氧石夕燒化合物的烧氧 基1當量’水之添加量約為0· 5當量至1〇〇當量。相對於 第1階段反應結束後殘餘烧氧基之水解縮合所需之水的理 論量,以使用1至10倍量左右(以1至5倍量左右更佳) ®之水為佳。 認為在第2階段反應中引起以下所示(丨)至(πΐ)之反 應。 (I):系中所殘留之烷氧矽烷(a)(以及依需求而併用時之烷 - 氧矽烷(c))之烷氧基間的水解縮合反應。 (Π):在第1階段反應所得之烷氧矽烷改質體(们與烷氧矽 烷(a)(以及依需求而併用時之烷氧矽烷之烷氧基間的 ❹水解縮合反應。 (III):在第1階段反應所得之烷氧矽烷改質體(d)與上述 (I)之反應所生成之烷氧矽烷(a)(以及依需求而银用時之 燒氧石夕烷(c))之水解縮合物之烷氧基間的縮合反應。 在上述第2階段反應中,上述反應係複合發生,而同 k進行上述水解縮合鏈段(以倍半石夕氧烧鏈段為佳)之形 成,以及與源自聚矽氧油(b)之鏈狀聚矽氧鏈段之縮合。 上述經第1階段反應以及第2階段反應所製造之本發 明的嵌段型矽氧烷化合物之透明性優異,而使用該化合物 25 321483 201020279 之樹脂組成物而得之硬化物的透明性以及低彈性率性優 異。 本發明之具有反應性官能基的嵌段型矽氧烷化合物 之製造雖可在無觸媒下進行,惟無觸媒時反應進行緩慢, 由縮短反應時間之觀點,以在觸媒的存在下進行者為佳。 可使用之觸媒而言,只要為呈現酸性或鹼性之化合物者即 可使用。酸性觸媒之例可列舉如:鹽酸、硫酸、硝酸等無 機酸;以及曱酸、乙酸、草酸等有機酸。鹼性觸媒之例可 列舉如:氫氧化鈉、氫氧化鉀、氩氧化鋰、氫氧化铯類鹼 金屬氫氧化物;如碳酸鈉、碳酸鉀、碳酸氫鈉、碳酸氫鉀 之鹼金屬碳酸鹽、氨等無機鹼;三乙胺、二伸乙三胺、正 丁胺、二曱胺基乙醇、三乙醇胺、氳氧化四甲銨等有機鹼。 該等之中,特別是從生成物去除觸媒的容易性之觀點而 言,以無機鹼為佳,尤以氫氧化鈉、氫氧化鉀更佳。觸媒 之添加量在相對於反應系中之烷氧矽烷(a)(可依需要而併 用烷氧矽烷(c))的總重量,一般為0. 001至7. 5重量%,以 0.01至5重量%為佳。並且,該添加量可為0.01至1重量 %左右。 觸媒的添加方法係直接添加,或以溶解在可溶性溶劑 等之狀態下使用。其中亦以預先使觸媒溶解於曱醇、乙醇、 丙醇、丁醇等醇類之狀態添加為佳。此時,以使用水等之 水溶液添加時,係如上述,單方面進行烧氧石夕燒(a)(依需 要而併用之烧氧石夕烧(c))之縮合,而由此所生成之倍半石夕 氧烷低聚物與聚矽氧油(b)不互溶而可能會產生白濁。 26 321483 201020279 本發明之含反應性官能基的矽氧烷化合物之製造可 在無溶劑下或溶劑中進行。亦可在製造步驟途中追加溶劑。 溶劑以可溶解烷氧矽烷化合物(a)、聚矽氣油(b)(可依需要 而併用烷氧矽烷(C))、烷氧矽烷改質體(d)之溶劑為佳。如 此之溶劑之例可列舉如:如二曱基曱醯胺、二曱基乙醯胺、 四氫吱喃等非質子性極性溶劑;如曱基乙基酮、甲基異丁 _、環戊酮等酮類;乙酸乙酯、乙酸丁酯、乳酸乙醋、丁 ❹酸異丙酯等酯類;如甲醇、乙醇、丙醇、丁醇等醇類;如 己院、環己烧、甲苯、二曱苯等烴等。本發明中,由反應 調控之觀點而言,以在醇類中反應為佳,以甲醇及/或乙醇 更佳。溶劑之使用量如在反應可順利進行之範圍内者即可 而無特別限制,相對於烷氧矽烷化合物(a)(可依需要而併 用燒氧矽烷(c))以及聚矽氧油(b)之總重量100份,一般 ' 使用〇至則〇重量份左右。反應溫度雖依觸媒量而異,惟 —般為20至160°C,以40至14〇。(:為隹,尤以50至15〇 ❹ c更佳。另外,反應時間一般在各製造步驟中分別為i至 40小時,以5至30小時為佳。 反應結束後,依需要經由中和、及/或水洗而將觸媒 去除。進行水洗時,宜依所使用之溶劑種類而添加可與水 分離之溶劑。較佳溶劑之例可列舉如:如曱基乙基_、甲 基異丁酮、環戊酮等酮類;乙酸乙醋、乙酸丁酯、乳酸乙 醋、丁酸異丙酯等酯類;如己燒、環己炫、甲苯、二甲苯 等烴等。 本反應雖可僅以水洗而進行觸媒的去除’然而,由於 321483 27 201020279 係在酸性、驗性條件或任一種條件下進行反應,因而以在 中和後進行水洗,或使用吸附劑吸附觸媒後經過濾去除吸 附劑者為佳。使用吸附劑時,將吸附劑添加於反應液中並 進行攪拌、加熱等處理,觸媒經吸附後過濾吸附劑,再將 殘渣進行水洗,藉此可去除觸媒、吸附劑。 中和時可使用呈現酸性或驗性之化合物。 呈現酸性之化合物之例可列舉如:鹽酸、硫酸、硝酸、 鱗酸、碌酸二氫納等無機之酸性化合物;或者甲酸、乙酸、 草酸等有機酸。呈現鹼性化合物之例可列舉如:如氫氧化 ❿ 鈉、氫氧化鉀、氫氧化鋰、氫氧化铯等鹼金屬氫氧化物; 如碳酸鈉、碳酸鉀、碳酸氳鈉、碳酸氫鉀等驗金屬礙酸鹽; 如磷酸氫二鈉、磷酸三鈉、多磷酸、三聚磷酸鈉等鹼性磷 酸鹽類等無機鹼;或者,氨、三乙胺、二伸乙三胺、正丁 胺、二曱基胺基乙醇、三乙醇胺、氫氧化四甲銨等有機鹼。 該等之中,特別是由容易從目的生成物中去除之觀點而 言,則以無機鹼或無機酸化合物為佳,更佳者係較容易使 @ pH調整至中性附近的磷酸二氫鈉或上述鹼性磷酸鹽類等 磷酸鹽類。 吸附劑可例示如:活性白土、活性碳、沸石、無機· 有機系之合成吸附劑、離子交換樹脂等,具體例可列舉如 以下製品。 活性白土之例可列舉如:東新化成(股)之商品:活性 白土(8人35、3人1、1'、尺-15或£),或尼可耐特(音譯)(0-36、 G-153或G-168);水澤化學工業(股)之商品:Galleon 28 321483 201020279In the formula (4), R2, R3 and m are the same as those described above, and R6 may be the same or different and each independently represents the above X and/or 1?4. In the first-stage reaction, when the alkoxy group is reacted in an amount of less than 1.0 equivalent based on 1 equivalent of the sterol group, the alkoxy group is not present at the end of the first-stage reaction, and the first step cannot be reached. a two-stage reaction, and, if the alkoxy group is reacted between 1.0 and 1.5 equivalents, the alkoxyoxane (a) [in response to the desired alkoxyoxane (c)] The base reacts with the sterol group of the polyoxygenated oil (b), and at the end of the first-stage reaction, gelation occurs due to excessive formation of the polymer. Therefore, it is necessary to react with an alkoxy group of 1.5 or more with respect to 1 equivalent of the sterol group. From the viewpoint of controlling the reaction, it is preferably 2.0 equivalent or more. The hydrolyzed condensed segment of the alkoxysilane is preferably 3 equivalents or more, and 4 equivalents or more, based on 1 equivalent of the decyl alcohol group, from the viewpoint of forming a preferred sesquiterpene gas chain segment. Good, more than 5 equivalents. Meanwhile, the sesquiterpene gas chain segment in the present invention may be any structure of a so-called ladder type 24 321483 201020279 type, a cage type partial ring opener or a random type, and is generally considered to be such a mixed type. After completion of the first-stage reaction, water is directly added to the reaction liquid to carry out a second-stage reaction (manufacturing step (丨丨)) of hydrolysis condensation between alkoxy groups. The amount of addition of 1 equivalent of water to the oxygen-burning base of the pyrochlore compound used as the above-mentioned raw material is about 0.5 to 1 equivalent. The amount of water required for the hydrolytic condensation of the residual alkoxy group after the end of the first-stage reaction is preferably from about 1 to about 10 times (more preferably from about 1 to 5 times). It is considered that the reaction shown in the following stage (丨) to (πΐ) is caused in the second-stage reaction. (I): a hydrolysis condensation reaction between alkoxy groups of alkoxyoxane (a) remaining in the system (and alkane-oxydecane (c) when used in combination). (Π): an alkoxysilane modified product obtained by the first-stage reaction (the azide hydrolyzed condensation reaction with the alkoxysilane (a) (and the alkoxy group of the alkoxysilane when used in combination). ): the alkoxyoxane (a) formed by the reaction of the alkoxysilane modified product (d) obtained in the first stage reaction with the above (I) (and the alkoxyline (c) when used as a silver a) a condensation reaction between alkoxy groups of the hydrolysis condensate. In the second-stage reaction described above, the reaction is recombined, and the hydrolysis and condensation segment is carried out with k (the sesquiterpene oxygenation segment is preferred) And the formation of the chain-type polyoxynoxy group derived from the polyoxyxane oil (b). The block type siloxane compound of the present invention produced by the first stage reaction and the second stage reaction The cured product obtained by using the resin composition of the compound 25 321483 201020279 is excellent in transparency and low modulus of elasticity. The production of the block type siloxane compound having a reactive functional group of the present invention is Can be carried out without catalyst, but the reaction is slow when there is no catalyst, shortened by From the viewpoint of time, it is preferable to carry out in the presence of a catalyst. The catalyst which can be used can be used as long as it is an acidic or basic compound. Examples of the acidic catalyst include hydrochloric acid. An inorganic acid such as sulfuric acid or nitric acid; and an organic acid such as citric acid, acetic acid or oxalic acid. Examples of the alkaline catalyst include sodium hydroxide, potassium hydroxide, lithium argon oxide, and alkali metal hydroxide of cerium hydroxide; Such as sodium carbonate, potassium carbonate, sodium hydrogencarbonate, alkali metal carbonate of potassium hydrogencarbonate, inorganic bases such as ammonia; triethylamine, diethylenetriamine, n-butylamine, diammonium ethanol, triethanolamine, hydrazine oxidation An organic base such as tetramethylammonium. Among these, in particular, from the viewpoint of easiness of removing the catalyst from the product, an inorganic base is preferred, and sodium hydroxide or potassium hydroxide is more preferred. The amount of the alkoxy oxane (a), which may be used in combination with the alkoxy decane (c), is generally 0.001 to 7.5 wt%, and is 0.01 to 5% by weight. Preferably, the addition amount may be about 0.01 to 1% by weight. It is preferably added in a state of being dissolved in a solvent or the like, and it is preferably added in a state in which the catalyst is dissolved in an alcohol such as decyl alcohol, ethanol, propanol or butanol. When the aqueous solution is added, as described above, the condensation of the calcined stone (a) (the calcined stone (c) if necessary) is unilaterally carried out, and the sesquiterpene generated thereby The oligomer and the polyoxygenated oil (b) are immiscible and may be cloudy. 26 321483 201020279 The production of the reactive functional group-containing oxoxane compound of the present invention can be carried out without a solvent or in a solvent. A solvent is added in the middle of the production step. The solvent is a solvent capable of dissolving the alkoxysilane compound (a), the polyfluorene gas (b) (and alkoxysilane (C) may be used in combination), and the alkoxysilane modified product (d). It is better. Examples of such a solvent include, for example, an aprotic polar solvent such as dimethyl decylamine, dimercaptoacetamide or tetrahydrofuran; such as mercaptoethyl ketone, methyl isobutyl amide, and cyclopentane Ketones such as ketones; esters such as ethyl acetate, butyl acetate, lactic acid ethyl acetate, and isopropyl butyrate; such as methanol, ethanol, propanol, butanol, etc.; such as Jiyuan, cyclohexane, toluene Hydrocarbons such as diphenylbenzene. In the present invention, it is preferred to carry out the reaction in an alcohol, and it is more preferable to use methanol and/or ethanol from the viewpoint of reaction control. The amount of the solvent to be used is not particularly limited as long as the reaction proceeds smoothly, and the alkoxyoxane compound (a) (can be used in combination with the oxydecane (c)) and the polyoxygenated oil (b) The total weight of 100 parts, generally 'used to 〇 to 〇 by weight. The reaction temperature varies depending on the amount of the catalyst, but it is usually from 20 to 160 ° C and from 40 to 14 Torr. (: 隹, especially 50 to 15 〇❹ c. Further, the reaction time is generally from i to 40 hours in each manufacturing step, preferably from 5 to 30 hours. After the reaction is completed, it is neutralized as needed. And/or washing with water to remove the catalyst. When washing with water, it is preferred to add a solvent which can be separated from water depending on the type of solvent to be used. Examples of preferred solvents include, for example, mercaptoethyl _, methyl iso Ketones such as butanone and cyclopentanone; esters such as ethyl acetate, butyl acetate, lactic acid ethyl acetate, and isopropyl butyrate; such as hexane, cyclohexanol, toluene, xylene, etc. Catalyst removal can be carried out only by washing. However, since 321483 27 201020279 is reacted under acidic conditions, test conditions or any of the conditions, it is washed with water after neutralization, or after adsorbing the catalyst with an adsorbent. It is preferred to remove the adsorbent by filtration. When the adsorbent is used, the adsorbent is added to the reaction solution and stirred, heated, etc., after the catalyst is adsorbed, the adsorbent is filtered, and the residue is washed with water, thereby removing the catalyst. , adsorbent. Acidic or inspective compounds. Examples of the compound which exhibits acidity include inorganic acidic compounds such as hydrochloric acid, sulfuric acid, nitric acid, scalylic acid, and dihydrogen hydride; or organic acids such as formic acid, acetic acid, and oxalic acid. Examples of the compound include, for example, alkali metal hydroxides such as sodium cesium hydroxide, potassium hydroxide, lithium hydroxide, and cesium hydroxide; for example, sodium chloride, potassium carbonate, sodium cesium carbonate, potassium hydrogencarbonate, etc. An inorganic base such as an alkali phosphate such as disodium hydrogen phosphate, trisodium phosphate, polyphosphoric acid or sodium tripolyphosphate; or ammonia, triethylamine, diethylenetriamine, n-butylamine or diamyl An organic base such as aminoethanol, triethanolamine or tetramethylammonium hydroxide. Among these, in particular, from the viewpoint of easy removal from the intended product, an inorganic base or an inorganic acid compound is preferred, and more preferably. It is easier to adjust the @pH to a sodium phosphate or a phosphate such as the above-mentioned alkaline phosphate in the vicinity of neutral. The adsorbent can be exemplified by a synthetic adsorbent such as activated clay, activated carbon, zeolite, inorganic or organic. Ion exchange Specific examples of the resin include the following products. Examples of the activated clay include, for example, Dongxin Chemical Co., Ltd.: activated clay (8 persons 35, 3 persons 1, 1 ', feet -15 or £), or Nikon Knight (0-36, G-153 or G-168); Mizusawa Chemical Industry Co., Ltd. Goods: Galleon 28 321483 201020279

Earth、或Mizuka AceRTM (上標之RTM表示登記商標。以 下亦同)等。Earth, or Mizuka AceRTM (superscript RTM stands for registered trademark. The same applies below).

活性碳之例可列舉如··味之素精細化學(股)之商品·· CL-H、Y-10S 或 Y-10SF ; Futamura 化學(股)之商品·· S、Y、 FC、DP、SA1000、K、A、KA、Μ、CW130BR、CW130AR 或 GM130A 等。 沸石之例可列舉如·· Union Showa(股)之商品: Molecular Sieve 3A、4A、5A 或 13X 等。 © 合成吸附劑之例可列舉如:協和化學(股)之商品:Examples of the activated carbon include, for example, Ajinomoto Fine Chemicals Co., Ltd., CL-H, Y-10S, or Y-10SF; Futamura Chemicals Co., Ltd., S, Y, FC, DP, SA1000, K, A, KA, Μ, CW130BR, CW130AR or GM130A. Examples of the zeolite include the products of Union Showa (Molecular Sieve 3A, 4A, 5A or 13X). © Examples of synthetic adsorbents, such as: Concord Chemicals (stocks):

KyowardRTM 100、200、300、400、500、600、700、1000、 2000 ;以及羅門哈斯(股)之商品:AmberlystRTM 15JWET、 15DRY、16WET、31WET、A2:l、AmberliteRTM IRA40、0JC1、 IRA403BLC1、IRA404JC1 ;以及陶氏化學(股)之商品:DOWEX RTM 66、HCR-S、HCRW2 或 MAC-3 等。 反應結束後或中和後可經由水洗、過濾之其他慣用的 U 分離精製手段進行精製。精製手段之例可列舉如:管柱層 析、減壓濃縮、蒸餾、萃取等。該等精製手段可單獨進行, 亦可組合複數種進行。 在使用與水混合之溶媒作為反應溶媒而反應時,較佳 者係,中和後經蒸餾或減壓濃縮而從反應系中將與水混合 之反應溶媒去除之後’在反應系中添加可與水分離之溶劑 使目的之反應生成物溶解後,進行水洗者。 水洗後經由減壓濃縮等而去除上述所使用之溶劑,即 可獲得本發明之含反應性官能基之石夕氧烧化合物。 321483 29 201020279 本發明之石夕氧炫化合物之外觀,一般為無色透明且在 25°C具有流動性之液態者。 上述反應中所得本發明之矽氧院化合物係如上述之 含反應性官能基之嵌段型矽氧烷化合物,其特徵係:由鍵 狀聚碎氧鏈段,較佳者係-(S i (R3)2〇)m- [ R3及m表示與上述 式(2)同義]所示之鍵狀聚石夕氧鏈段,以及作為構造單元之 (1^8丨〇3/2):〇[[1^與上述式(4)同義;nx表示平均值為2至2〇] 所示之倍半矽氧烷鏈段所組成,且至少部分之倍半石夕氧燒 鏈段具有至少含一個環氧基之反應性官能基者。 倍半石夕氧院鏈段中,源自上述烧氧石夕烧化合物(a)之X 所示具有環氧基的反應性官能基之數,相對於倍半石夕氧烧 鏈段中之1個矽原子,平均以0.3至i之比例為佳,以〇 45 至1之比例更佳’又以0.6至1之比例為特佳。而且,源 自烷氧矽烷(〇之L所示之基,相對於倍半矽氧烷鏈段中 之1個矽原子,平均以〇至0.7之比例為佳,以〇至〇 55 之比例更佳,又以0至0.4之比例為特佳。 ^發明之矽氧烷化合物之較佳分子量係,以Gpc測定 之重畺平均分子量為5〇〇至20000左右,以至20000 左右為佳以1〇〇〇至loooo左右更佳,又以至 f右為特佳。重量平均分子量過低時,恐耐熱性降低,過 南時因黏度上昇而會在操作上發生弊害。 重量平均分子量係使用Gpc(凝膠滲透層析)依下述條 件所測定之聚笨乙職算的重量平均分子量(Mw)。 GPC之各種條件 321483 30 201020279 製造商:島津製作所 管柱:保護管杈 SHODEX GPC LF-G LF-804(3 支) 流速·· 1. 管柱溫度:40。〇 使用溶劑:THF(四氫呋喃) 檢測器:RI(示差折射檢測器)KyowardRTM 100, 200, 300, 400, 500, 600, 700, 1000, 2000; and Rohm and Haas stocks: AmberlystRTM 15JWET, 15DRY, 16WET, 31WET, A2:1, AmberliteRTM IRA40, 0JC1, IRA403BLC1, IRA404JC1 And Dow Chemical (stock) products: DOWEX RTM 66, HCR-S, HCRW2 or MAC-3. After the completion of the reaction or after the neutralization, it can be purified by other conventional U separation and purification means which are washed with water and filtered. Examples of the purification means include column chromatography, concentration under reduced pressure, distillation, and extraction. These purification means may be carried out singly or in combination of plural kinds. When a solvent mixed with water is used as a reaction solvent, it is preferred to carry out the reaction in the reaction system after the neutralization and distillation or concentration under reduced pressure to remove the reaction solvent mixed with water from the reaction system. The solvent for water separation is obtained by dissolving the desired reaction product and then washing it with water. After washing with water, the solvent used above is removed by concentration under reduced pressure or the like, whereby the reactive functional group-containing oxalate compound of the present invention can be obtained. 321483 29 201020279 The appearance of the oxime compound of the present invention is generally a colorless, transparent liquid having a fluidity at 25 ° C. The oxime compound of the present invention obtained in the above reaction is a block type siloxane compound having a reactive functional group as described above, which is characterized in that it is composed of a bond-like polyoxygen chain segment, preferably a system - (S i (R3)2〇)m- [R3 and m represent a bond-like polyoxo-oxygen segment represented by the above formula (2), and (1^8丨〇3/2) as a structural unit: 〇 [[1^ is synonymous with the above formula (4); nx represents a sesquiterpene oxide segment represented by an average of 2 to 2 Å], and at least a part of the sesquiterpene oxygenated segment has at least A reactive functional group of an epoxy group. The number of reactive functional groups having an epoxy group represented by X of the above-mentioned calcined oxygen compound (a) in the sesquiterpene oxygenation chain segment, relative to the sesquiterpene oxygenation segment One helium atom, the average ratio of 0.3 to i is better, and the ratio of 〇45 to 1 is better, and the ratio of 0.6 to 1 is particularly good. Further, it is derived from an alkoxysilane (the group represented by L in the oxime, and the ratio of 〇 to 0.7 is preferably on the average of 矽 to 〇55 with respect to one 矽 atom in the sesquioxane chain segment. Preferably, it is particularly preferably in a ratio of 0 to 0.4. The preferred molecular weight of the inventoxane compound, the average molecular weight of the helium measured by Gpc is from about 5 to about 20,000, and preferably about 20,000. It is better to lingo to loooo, and even f right. When the weight average molecular weight is too low, the heat resistance is lowered, and when the temperature is too high, the viscosity will rise due to the increase in viscosity. The weight average molecular weight is Gpc (condensation). Gel permeation chromatography) Weight average molecular weight (Mw) of polystyrene according to the following conditions. Various conditions of GPC 321483 30 201020279 Manufacturer: Shimadzu Pipe Column: Protection tube 杈 SHODEX GPC LF-G LF- 804 (3 pieces) Flow rate·· 1. Column temperature: 40. 〇 Solvent: THF (tetrahydrofuran) Detector: RI (differential refraction detector)

本發明之石夕氧烷化合物之環氧當量(以JIS K-7236中 記載之方法測定)以300至1600g/eq者為佳,以400至 1〇〇〇g/eq者更佳,又以450至900 g/eq者為特佳。環氧 虽量過小時,硬化物會過硬而有低彈性率性低劣之虞,過 大時,硬化物之機械特性變差。 本發明之矽氧烷化合物之黏度(E型黏度計、在25°C 下測定)一般為50至2〇〇〇〇mPa · s左右,以15〇至 lOOOOmPa · s左右者為佳,以2〇〇至1〇〇〇〇mpa · s左右者 更佳’又以200至5_mPa· s左右者為最佳。並且,有時 又以500至l〇_mPa.s者更佳,更以_至5刪_.5 者為特佳。 屬於本發明切氧統合財眺祕歇水解縮 3鏈段(較佳者係倍切氧⑽段)之與3個氧原子鍵結之 原子’相對於全部石夕原子,其比例可為5至95莫耳%左 右,用於光料體元件之密封時,以5至5 以8至30莫耳%更佳, 旲斗%為隹 分為屬於鏈狀”氧料接特佳。其餘部 原子」儲本㈣^氧純合财的财㈣子^於 321483 31 201020279 倍半矽氧烷鏈段之與3個氧原子鍵結之 部石夕原子,其比例低於5莫耳科,鏈狀聚 =顯=果’在作為下述硬化性樹腊組成物之 用時〜枒脂組成物之硬化物會有過軟之傾向,而 沾黏或損傷之虞。反之’高於5G莫耳%時,倍切氧 ==強烈顯現之結果,在作為下述硬化性樹脂組:物 成刀使用時脂組成物之硬化物將過硬使得低 率特性低劣,因而熱循環試驗之結果會有惡化之傾向。 ❹ 本,明之石夕氧燒化合物係如上述,其特徵係: 狀聚砍氧鍵段以及上述烧氧石夕燒之水解縮合鏈段(較佳者 ==院鏈段)’後者之鏈段中具有含環氧基之反應性 氧:二物別Γ提兩鏈狀聚矽氧鏈段比例之本發明之矽 ^ 。物,適於光半導體密封之點上亦為—大特徵 屬於上=目對於本發㈣她合物中之全部石夕原 罐;二合鏈段(較佳者係倍㈣氧 ❹ 氧鏈段之石夕原子:=,50莫耳%時’屬於鍵狀聚石夕 ’、勺比例為50至95莫耳%。屬於键狀平#畜 =一 _為7〇-莫二: 例,可由原料之===之二個鍵段中的石夕原子比 化合發隨以及元素可=等本==紐 ⑴-種含反:二係如下述。 基之石夕氧燒化合物,係具有:鏈狀聚 321483 32 201020279 矽氧鏈段,與具有.環氧基之反應性官能基、甲基以及苯基 所成組群之基的三(C卜C10)烷氧基矽烷之水解縮合鏈段的 嵌段型矽氧烷低聚物’且至少一部分之水解縮合鏈段係含 有至少具有一個環氧基之反應性官能基的鏈段者。 ’ (ii)如上述(i)所記载之含反應性官能基之矽氧烷化合物, 其中,鏈狀聚矽氧鏈段係下述式(2A)所示鏈段, 一(Si(R3)2〇)m一 (2A) 〇 (式中之匕可互同或互異,表示碳數1至10之直鏈狀、分 支狀或環狀之烧基、碳數6至14之芳基或碳數2至1〇之 稀基;m表示平均值為2至2〇〇〇)。 (iii)如上述(丨丨)所記载之含反應性官能基之石夕氧院化合 物其中,R3為碳數1至10之烧基,m平均為2至200。 (lv)如上述(i)至(iii)中任一項所記載之含反應性官能基 之矽氧烷化合物,其中,R3為曱基。 (v)如上述(i)至(iv)中任一項所記載之含反應性官能基之 ® 夕氣燒化合物,其中’具有環氧基之反應性官能基係經具 (%氧基之碳數5至8之環烷基取代的碳數1至3之烷基。The epoxy equivalent of the oxalate compound of the present invention (determined by the method described in JIS K-7236) is preferably from 300 to 1600 g/eq, more preferably from 400 to 1 〇〇〇g/eq, and further preferably 450 to 900 g/eq is especially good. When the amount of the epoxy is too small, the hardened material is too hard and the low modulus of elasticity is inferior. When it is too large, the mechanical properties of the cured product are deteriorated. The viscosity of the oxirane compound of the present invention (E-type viscometer, measured at 25 ° C) is generally about 50 to 2 〇〇〇〇 mPa · s, preferably from about 15 〇 to about 100 MPa·s, to 2 〇〇 to 1〇〇〇〇mpa · s is better, and it is best to be around 200 to 5_mPa·s. Also, sometimes it is better to use 500 to l〇_mPa.s, and it is especially good to delete _.5 from _ to 5. The atom of the oxygen-conducting 3 chain segment (preferably, the cleavage oxygen (10) segment) and the three oxygen atom-bonded atoms belonging to the present invention are relative to all the stone atoms, and the ratio may be 5 to 95% or so, for the sealing of the light body components, 5 to 5 to 8 to 30 mol% is better, and the bucket % is divided into chains which are particularly good for the oxygen. "Storage (4) ^ Oxygen pure wealth of wealth (four) sub ^ 321483 31 201020279 sesquiterpene oxide chain with 3 oxygen atoms bonded to the part of Shi Xi atom, the ratio is lower than 5 Moco, chain When it is used as a composition of the following curable wax composition, the cured product of the blush composition tends to be too soft, and it is sticky or damaged. On the other hand, when it is higher than 5G mol%, the result of the cleavage of the oxidizing resin == is strongly exhibited. When used as a curable resin group as follows: the cured product of the fat composition is too hard to make the low-rate characteristic inferior, and thus heat The results of the cycle test tend to deteriorate. ❹本,明之石夕氧烧化合物的系系系系系系系系系系系系系系系系系系系系系系系系系系系系系系系系系系系系系系系系系系系系系系系系系系系系系系系系系Reactive oxygen containing an epoxy group: the ratio of the two-chain polyoxyl segment in the present invention. The object, which is suitable for the sealing of the optical semiconductor, is also characterized by a large characteristic of the above-mentioned (four) all of the Shixia original cans of the compound; the two-in-one segment (preferably the doubling (tetra) oxy-oxygen segment) Shishi atom:=, 50% of the time 'belongs to the key polycene', the proportion of the scoop is 50 to 95 mol%. It belongs to the key flat #畜=一_为7〇-莫二: In the two bond segments of the raw material ===, the stone atomic ratio is the same as that of the compound, and the element can be equal to the == New Zealand (1)-species containing the reverse: the second is as follows. The base of the oxylate compound has the following: Chain-like poly 321483 32 201020279 hydrazine segment, hydrolyzed condensed segment of tris(C-C10) alkoxy decane with a group of reactive functional groups of epoxy groups, methyl groups and phenyl groups And the at least a portion of the hydrolyzed condensed segment is a segment containing a reactive functional group having at least one epoxy group. ' (ii) as described in (i) above a siloxane compound containing a reactive functional group, wherein the chain polyoxy oxymethylene segment is a segment represented by the following formula (2A), and one (Si(R3)2〇)m-(2A) 〇 After Identical or mutually different, representing a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 14 carbon atoms or a dilute group having 2 to 1 carbon number; m represents an average value of (2) A compound having a reactive functional group as described in the above (丨丨), wherein R3 is a carbon number of 1 to 10, m is an average of 2 to The reactive functional group-containing oxoxane compound according to any one of the above (i) to (iii), wherein R3 is a fluorenyl group. (v) as described above (i) to (iv) The reactive functional group-containing smouldering compound according to any one of the preceding claims, wherein the 'reactive functional group having an epoxy group is substituted with a cycloalkyl group having a carbon number of 5 to 8 An alkyl group having 1 to 3 carbon atoms.

Vl)如上述(i)至(iv)中任.一項所記戴,之含Λ反底性·官能基 =♦氧燒化合物,其中,具有選自含環氧基之反應性官能 j '甲基以及苯基所成組群之基的三(C1-C10)烷氧基矽烷 有經含環氧基之碳數5至8之環烷基取代的碳數1至 (之棱*基的三(C1-C10)烷氧基矽烷。 U)如上述(vi)所記載之含反應性官能基之矽、氧院化合 物,甘 ,、中’具有經含環氧基之碳數5至8之環烷基取代的 33 321483 201020279 碳數1至3之烷基的三(C1_C10)烷氧基矽烷係石-(3,4~環 氧基壞己基)乙基三〒氧基石夕烧。 (vi i i)如上述(i)至(vi i)中任一項所記載之含反應性官能 基之矽氧烧化合物’其中,具有選自含環氧基之反應性官 能基、甲基以及苯基所成紐群之基的三(n_cl0)烷氧基矽 烷係具有含環氧基之反應性官能基的三(cl_cl〇)烷氧基矽 烧、與具有選自曱基以及笨基所成組群之基的三(cl_cl〇) 烷氧基矽烷之兩者。 (IX)如上述(vii i)所記載之含反應性官能基之矽氧烷化合 ❹ 物,其中,具有選自甲基以及苯基所成組群之基的三 (C1-C10)烷氧基矽烷係苯基三甲氧基矽烷或甲基三甲氧基 石夕炫。 00如上述(i)至(ix)中任一項所記載之含反應性官能基之 石夕氧炫化合物,其中,經GPC測定之重量平均分子量為5〇〇 至 20000 。 ⑹如上述⑴至⑴中任-項所記載之含反應性官能基之 石夕氧烧化合物’係經由下述之兩階段反應而得,第i階段❹ 反應係使通式(2)所示梦醇末端聚矽氧油(b)與通式(1)所 示燒氧石夕烧化合物(a),在相對於矽醇末端聚石夕^油(^之 石夕醇基1當量,说氧魏化合物q氧當量為i 5至_ 當量之範圍内反應並縮合’其後進行之第2階段反應係將 水添加在所得反應液中’使剩餘的烷氧基水解·縮合; 321483 34 (2) 201020279Vl) as recited in any one of the above (i) to (iv), which has a ruthenium-containing, functional group-based oxy-burning compound having a reactive functional group selected from the group consisting of an epoxy group-containing reactive functional group a tri(C1-C10) alkoxydecane having a methyl group and a group of a phenyl group having a carbon number of 1 to 5 substituted by a cycloalkyl group having 5 to 8 carbon atoms of an epoxy group a tris(C1-C10) alkoxydecane. U) a reactive functional group-containing oxime, an oxygen compound, a glycerol, and a 'having an epoxy group-containing carbon number 5 to 8 as described in (vi) above. Cycloalkyl substituted 33 321483 201020279 Tri(C1_C10) alkoxydecane lanthanide of a C 1 to 3 alkyl group - (3,4~epoxyduccinyl)ethyltrimethoxylate. (vi ii) The oxo-oxygenated compound containing a reactive functional group as described in any one of the above (i) to (vi i), which has a reactive functional group selected from an epoxy group-containing group, a methyl group, and a tri(n-cl0) alkoxydecane having a phenyl group as a group having a reactive functional group containing an epoxy group, a tris(cl_cl〇) alkoxy group, and having a group selected from a fluorenyl group and a stupid group Both of the three (cl_cl〇) alkoxydecane groups in the group. (IX) The reactive functional group-containing oxoxane compound according to the above (vii i), wherein the tri(C1-C10) alkoxy group having a group selected from the group consisting of a methyl group and a phenyl group A decyl phenyl trimethoxy decane or a methyl trimethoxy sulphate. The reactive functional group-containing oxazepine compound according to any one of the above (i) to (ix), wherein the weight average molecular weight measured by GPC is from 5 Å to 20,000. (6) The reactive oxygen-containing compound of the above-mentioned (1) to (1) is obtained by the following two-stage reaction, and the i-stage ❹ reaction system is represented by the general formula (2) The dream alcohol terminal polyoxyxane oil (b) and the pyrochlore compound (a) represented by the general formula (1) are compared with the sterol terminal polysulfide oil (the equivalent of the stone base alcohol group) The oxygen-containing compound q has an oxygen equivalent of i 5 to _ equivalent and reacts and condenses 'the second stage of the reaction is followed by adding water to the obtained reaction liquid to 'hydrolyze and condense the remaining alkoxy group; 321483 34 ( 2) 201020279

(式中,存在複數個之匕可互同或互異,表 之直鏈狀、分支狀·狀之絲、絲 數2錢之稀基;,表示平均值為2至_)之方基或石反 XSi(〇R2)3 ⑴ ❹ ❹ =之:具有環氧基之反應性官能基;一數1 記载之含反應性官—合 醇末端。1 渗透層_定之 之重量平均分子量為_至_。 氧燒化人物所記載之含反應性官能基之石夕 1當量,°通式Γυ所-相對於石夕醇末端聚石夕氧油(b)之石夕醇基 為2至刚當量。4乳魏化合物(a)之烧氧基之當量 A )如上述(X1)至(Xlii)中任一項所記載之含反應性官 I基之♦氧烧化合物’其中,通式⑵所示_醇末端聚石夕氧(In the formula, there are a plurality of scorpions which may be mutually identical or mutually different, and the linear, branched, and filaments of the watch, and the thin base of the number of wires; 2, represent the square of the average of 2 to _) or Stone anti-XSi(〇R2)3 (1) ❹ ❹ =: a reactive functional group having an epoxy group; a reactive hydroxyl-containing terminal described in the number 1. 1 The permeation layer _ has a weight average molecular weight of _ to _. The oxygen-burning character described in the character of the reactive functional group is 1 equivalent, and the formula is -2 to the equivalent equivalent of the base alcohol group of the endstone polyoxosulfuric acid (b). (4) The equivalent of the alkoxy group of the compound (a) of the formula (a), wherein the oxy-fired compound containing the reactive group I group as described in any one of the above (X1) to (Xlii) is represented by the formula (2) _ alcohol end polyglycol

Mb)係石夕醇末端二甲基聚石夕氧油或石夕醇末端甲基苯基聚 矽氧油。 上述(xi)至(xiv)中任一項所記載之含反應性官能 基之矽氧烷化合物,其中,通式(1)所示烷氧矽烷化合物(幻 系召縮水甘油氧基乙基三曱氧基矽烷、沒_縮水甘油氧基 乙基二乙氧基矽烷、縮水甘油氧基丙基三曱氧基矽烷、 35 321483 201020279 甘油乳基丙基三乙氧基石夕H(3,4-環氧基環己 土 土二甲氧基石夕燒或石-(3, 4-環氧基環己基)乙基 氣某矽烷。 ^Mb) is a xylenol terminal dimethyl polyphosphite or a linalool-terminated methyl phenyl polysiloxane. The reactive functional group-containing oxoxane compound according to any one of the above (xi) to (xiv), wherein the alkoxy decane compound represented by the formula (1) (the phantom glycosyloxyethyl three)曱oxydecane, _glycidoxyethyl diethoxy decane, glycidoxypropyl trimethoxy decane, 35 321483 201020279 glyceryl lactyl propyl triethoxy sulphate H (3,4- Epoxycyclohexyl dimethyloxycarbazide or stone-(3,4-epoxycyclohexyl)ethyl oxane. ^

Om)如上述⑴至(x)中任—項所記載之含反應性宫能基 t氧烧化合物’其中’第1階段反應係使通式⑵所示石夕 知末端”氧油(b) ’與通式⑴所示炫氧我化合物⑷ =及通式⑶所喊氧魏化合物⑹兩者,在相對於石夕醇 末端聚料油⑻之料基i #量,綠魏化合物⑷以 ^(C)之燒氧基總當量為15至2⑽當量之範_反應並縮 y其後進狀第2階段反㈣將轉加在所得反應液 中,使剩餘的烷氧基水解•縮合:Om) The reactive oxy-energy t-oxygen compound as described in any one of the above items (1) to (x) wherein 'the first-stage reaction system is a gas-based oil (b) represented by the formula (2) 'With the formula (1) shown in the formula (1) = and the general formula (3), the oxy-wet compound (6), in relation to the base of the base alcohol (8), the amount of the base # i, the green Wei compound (4) to ^ (C) The total equivalent of the alkoxy group is 15 to 2 (10) equivalents. The reaction is condensed and then y. The second stage is reversed. (IV) is added to the obtained reaction solution to hydrolyze and condense the remaining alkoxy groups:

(2) (式中’存在複數個之R3可互同或互異,表示碳數ι至ι〇 分支狀或環狀之烷基、碳數6至14之芳基或碳 之烯基;m表示平均值為2至2〇〇), (1) 能基;R2表示碳數1 XSi(〇R2)3 (式中,X表示具有環氧基之反應性官 至10之烷基), R^Si (0^2)3 (3) 夕中?表示甲基或苯基;R2可與通式⑴之_同或相 異’係各自獨立,表示碳數1幻〇之烧基)。 Ο如上述(XV1)所記載之含反應性官能基之硬氧烧化 321483 36 201020279 合物,其忪通式⑵所示矽醇末端(2) (wherein a plurality of R3s may be mutually identical or mutually different, and represent a carbon number ι to ι〇 branched or cyclic alkyl group, a carbon number 6 to 14 aryl group or a carbon alkenyl group; m Indicates an average value of 2 to 2 〇〇), (1) an energy group; R2 represents a carbon number of 1 XSi(〇R2)3 (wherein, X represents a reactive group having an epoxy group to 10 alkyl groups), R ^Si (0^2)3 (3) In the middle of the day, it means a methyl group or a phenyl group; and R2 may be independently or different from the formula (1), and each represents a carbon number of 1 fluorene. For example, a hard oxygen-fired 321483 36 201020279 compound containing a reactive functional group as described in the above (XV1), which has a sterol terminal represented by the formula (2)

或(xiv)所記載之聚發氧油。 半w係上迷(XII ==(:,V11)所記载之含反應性官能基之 =:載::合:式⑴所,—物⑷係 ㈣如上述㈣至(xviii)中任—項 ο 夕氧烧化合物’其中,通式⑶所示燒氧柳匕合 物⑹係甲基二甲氧基矽烷或笨基三甲氧基矽烷。 接著’對本發明之硬化性樹脂組成物進行說明。 本發明之錢燒化合物可作為硬化性樹脂組成物之 成分使用。以下’本發明之石夕氧燒化合物在該硬化性樹月旨 組成物之說财稱為「本判巧纽化合 為「石夕氧烧化合物⑴」。此時,石夕氧燒化合物(射為2 ⑴至(xix)巾任—賴記叙妓祕官能基之錢燒化 合物,亦包含與該矽氧烷化合物之所有組合者。 本發明之硬彳t性劃旨組成物含有作為縣樹脂成分 的本發明之石夕氧烧化合物⑴,且另含有硬化劑⑻。並且, ^ 一步可依需要而含有矽氧烷化合物(A)u外之其他環氧 樹脂、或/及硬化促進劑。其他環氧樹脂在不喪失本發明之 石夕氧燒化合物⑷_性(例如作為❹在硬倾樹餘成 物時之硬化物的特性’具體上為透明性、耐熱·耐光性、 低溫時之低彈性率特性、不沾勒性、熱循環耐性以及硬产 等)之範圍内,即可併用。依情況,此等之其他環氧樹脂i 改善硬化性樹脂組成物之硬化物特性。本發明之石夕氧烧化 321483 37 201020279 物(A)才目對於%氧樹脂成分整體 量%’以3〇至10〇重 匕例為20至重 依使用態樣而為6〇至1〇^旦Π 〇〇重量%更佳’可 以8〇至⑽重量%更佳0重置%,或7〇至1〇0重量%,而 1 ’合併本發明之矽氧烷化合物(Α)與其他環 =曰之㈣的環氧樹脂中,本發明切紐化合物的所 :至90重量%為佳,以30至9〇重量%為特佳。 _ 本發月之硬化性樹脂組成物中,本發明之石夕氧 物⑷早獨、或合併本發明之石夕氧燒化合物(Α)與其 衣氧树月曰之王部續氧樹脂之比例’相對於該組成物全 為30至90重量%左右,以4〇至9〇重量%為佳,又以 。至90重量%左右更佳。且依實施形態以仙至重量 %為佳,又以5〇至80重量%左右更佳。 、其他環氧樹脂之具體例可列舉如:多紛化合物之縮水 ,由鱗化物《夕g能環氧樹脂、各種盼駿樹脂之縮水甘油 醚化物之多官能環氧樹脂、芳香族環氧樹脂之核氣化 (hydr〇genated)物、脂環式環氧樹脂、雜環式環氧樹脂、 _油醋系環氧樹脂、縮水甘油胺系環氧樹 ^縮水甘減之縣樹脂、闕水甘油化之㉔氧樹^ 上述多官能環氧樹脂中所使用之多酚化合物可 如·雙酚A、雙酚F、雙酚s、4,4,-聯酚、四甲 二曱基雙紛A、四甲基雙紛F、二甲基雙盼F、: A、 s、二甲基雙酚s、四甲基—4,4,_ 二 =酚 τ暴〜4,4,-聯 321483 38 201020279 紛、1-(4-經笨基)|[4_(1,卜雙—(4_經苯基)乙基)苯基] 丙烷、2,2’ 一亞甲基-雙(4_甲基-6-第三丁基酚)、4, 4,— 亞丁基又(3甲基第三丁基酚)、三(羥苯基)曱烷、間 苯-盼f士苯一驗、鄰笨三紛、具有二異亞丙基骨架之紛 類: 4羥笨基苐等之具有苐骨架之酚類、酚化聚丁 烯等之^ SHb合物。因此,作為上述多紛化合物之縮水 甘油醚化物的夕g能環氧樹脂,具體上可列舉如:上述多 紛化合物之縮水甘油醚化物。 上述夕g症環氧樹脂中所使用之各種盼搭樹脂可列 舉如’將各種紛作為原料之紛路樹脂,原料之各種紛可列 舉如:將酚、曱酚類、乙基酚類、丁基酚類、辛基酚類、 雙盼A、雙酚F、雙酚s以及萘酚類之各種酚作為原料的酚 醛樹脂;含有伸苯二甲基骨架之酚酚醛樹脂;含有二環戊 二烯骨架之酚酚醛樹脂;含有聯苯骨架之酚酚醛樹脂;含 有苐骨架之酚酚醛樹脂等的各種酚醛樹脂。因此,各種酚 Q 醛樹脂之縮水甘油醚化物的多官能環氧樹脂之具體例可列 舉如:該等酚醛樹脂之縮水甘油醚化物。 芳香族環氧樹脂之核氫化物可列舉如:以上述各種酚 為原料之酚醛樹脂作為原料的紛搭樹脂之縮水甘油醚化物 的核氫化物,具體上係將各種紛(例如:雙酚A、雙酚F、 雙酚S、4, 4’ -聯酚等酚化合物之縮水甘油醚化物,或酚、 甲酚類、乙基酚類、丁基酚類、辛基酚類、雙酚A、雙酚F、 雙酚S以及萘酚類等)作為原料之酚醛樹脂的縮水甘油醚 化物之核氫化物。 39 321483 201020279 •、衣乳财月日可列舉如:2 p,—雄 基環己基)丙烷、3 4产新A班,又(4一鈿水甘油氧 ,4衣巩基%己烷羧酸3, 4-環氧基jf己 基甲醋、乙稀基環己稀二氧化物 :,己 5’5螺-(3,卜環氧基環己 基環己基)己二醆酯等 ,衣虱 環式環氧樹腊。 及似專具有脂肪族骨架之脂 列舉如·· 1,4-丁二醇、!,6一己 :旨肪族系環氧樹脂係如多元醇之縮水甘油醚,其例可 醇、聚乙二醇、聚丙 醇 、四醇、苯二甲醇衍生物等多元醇之縮水甘軸類等。 .雜環式環氧樹脂可列舉如:異氰尿環(is〇cy麵价 nng):乙内_環等具有雜環之雜環式環氧樹脂等。 :縮水甘油酯系環氧樹脂可列舉如:由六氫鄰苯二甲酸 -縮水甘油自旨、四氫鄰苯二甲酸二縮水甘油§旨等紐之縮 水甘油酯所構成的環氧樹脂等。 縮水甘油胺系環氧樹脂可列舉如:苯胺' 曱苯胺、對 笨私間本一私:、二胺基二苯基甲院衍生物、二胺基甲 笨衍生物等之胺類經縮水甘油化的環氧樹脂等。 鹵化酚類經縮水甘油化之環氧樹脂可列舉如:溴化雙 紛A、溴化雙酚!^、溴化雙酚s、漠化紛酚搭、漠化曱酚酚 酸·氯化雙紛S、氯化雙驗a等鹵化紛類經縮水甘油化的 環氧樹脂等。 該等環氧樹脂在使用時並無特別限制,由透明性之觀 點而言’以著色性少者為佳。一般所適用者為雙酚A、雙 紛F、雙紛s、4, 4’ -聯齡、四曱基-4, 4,-聯齡、1 — (4_ 321483 40 201020279 經笨基)-2-[4-(1,1-雙-(4-羥笨基)乙基)苯基]丙烷、三 (备苯基)甲烧、間苯二酴、2, 6-二第三丁基對苯二酴、具 有一異亞丙基骨架之紛類、或1,1-二~4-經苯基第等之具 有筅骨架之酚類的縮水甘油化物之多官能環氧樹脂;將 酚、甲酚類、雙酚A、雙酚S以及萘酚類等之各種酚作為 原料的酚醛樹脂、含有二環戊二烯骨架之酚酚醛樹脂、含 有聯苯骨架之酚酚醛樹脂、含有葬骨架之酚酚醛樹脂等各 Ο 種酚醛樹脂之縮水甘油醚化物;雙酚A、雙齡F、雙紛$、 4’4’ -聯酚等酚化合物之縮水甘油醚化物、或將酚、曱酚 類乙基龄類、丁基酌'類、辛基朌類、雙盼a、雙紛jr、雙 盼S以及萘賴等各種时為频之祕樹㈣縮水甘油 麵化物之核氫化物;3,,4, ~環氧基環己院_3,4_環氧Or (xiv) the polyoxygenated oil described. The half-w-system (XII == (:, V11)-containing reactive functional group =: loading:: combining: formula (1), - (4) (4) as in (4) to (xviii) above - In the case of the oxy-oxygen compound (6), the oxygenated oxonium compound (6) represented by the formula (3) is methyl dimethoxy decane or phenyl trimethoxy decane. Next, the curable resin composition of the present invention will be described. The money-burning compound of the present invention can be used as a component of a curable resin composition. The following description of the composition of the sclerosing sulphur compound of the present invention is referred to as "the present invention" Oxygen-burning compound (1)". At this time, the compound of the Xixi oxygen-burning compound (produced as 2 (1) to (xix) towel--------------------------------------- The hard-acting composition of the present invention contains the ascorbic oxide compound (1) of the present invention as a resin component of the present invention, and further contains a hardener (8). Further, a step can contain a oxoxane compound as needed ( A) Other epoxy resins, or / and hardening accelerators other than u. Other epoxy resins are not Loss of the cerium oxygen-sintering compound (4) of the present invention (for example, the property of the cured product when the ruthenium is in the hard-dumped structure) is specifically transparency, heat resistance, light resistance, low modulus of elasticity at low temperatures, and In the range of dipping property, thermal cycle resistance, hard production, etc., it can be used in combination. In other cases, these other epoxy resins i improve the cured property of the curable resin composition. The invention is based on the electrothermal burning 321483 37 201020279 The total amount of %(%) of the oxygen resin component is from 3〇 to 10〇, and the weight is from 20 to 10. According to the use, it is 6〇 to 1〇^Π Π 〇〇 'Can be 8 〇 to (10) wt% better 0 reset %, or 7 〇 to 1 〇 0 wt%, while 1 ' combines the oxirane compound of the present invention (Α) with other rings = 曰 (4) epoxy resin The incision compound of the present invention is preferably from 90% by weight to 30% by weight to 9% by weight. _ The curable resin composition of the present invention, the stone of the present invention (4) Or the ratio of the oxime oxygen-burning compound (Α) of the present invention to the oxygen-reducing resin of the king of the oxy-tree The composition is preferably from about 30 to 90% by weight, more preferably from 4 to 9% by weight, even more preferably from about 90% by weight to about 90% by weight, and more preferably from about 9% to about 5% by weight. More preferably, it is about 5 to 80% by weight. Specific examples of other epoxy resins include, for example, shrinkage of a plurality of compounds, and the amount of glycidyl ether compounds of the squama Functional epoxy resin, aromatic epoxy resin nucleus hydration, alicyclic epoxy resin, heterocyclic epoxy resin, _ oleine epoxy resin, glycidylamine epoxy resin ^Reducing and reducing the resin of the county, the water-hydrogenated 24 oxygen tree ^ The polyphenol compound used in the above polyfunctional epoxy resin can be, for example, bisphenol A, bisphenol F, bisphenol s, 4, 4,- Bisphenol, tetramethyldihydrazyl double A, tetramethyl double F, dimethyl dip F,: A, s, dimethyl bisphenol s, tetramethyl-4, 4, _ bis τ暴〜4,4,-联321483 38 201020279 纷,1-(4-经笨基)|[4_(1,Bus-(4_Phenyl)ethyl)phenyl]propane, 2,2 'Methylene-bis(4_methyl-6- Third butyl phenol), 4, 4, - butylene (3 methyl tert-butyl phenol), tris (hydroxyphenyl) decane, m-benzene - expectant benzene, a neighbor, stupid, There are a variety of diisopropylidene skeletons: hydroxy groups having an anthracene skeleton such as a hydroxy group, and a SHb compound such as a phenolated polybutene. Therefore, as the epoxy resin of the polyglycidyl ether compound of the above-mentioned compound, specifically, the glycidyl ether compound of the above-mentioned compound can be mentioned. The various types of resin to be used in the above-mentioned epoxy resin can be exemplified by various materials which are various raw materials, and various raw materials such as phenol, indophenol, ethylphenol, and butyl. Phenolic resin as a raw material for various phenols of phenols, octylphenols, bisphenol A, bisphenol F, bisphenol s and naphthols; phenolic phenolic resin containing a benzene dimethyl skeleton; containing dicyclopentane A phenolic phenolic resin having an olefin skeleton; a phenol phenol resin containing a biphenyl skeleton; and various phenol resins such as a phenol phenol resin containing an anthracene skeleton. Therefore, specific examples of the polyfunctional epoxy resin of the glycidyl ether compound of various phenol Q aldehyde resins include glycidyl ether compounds of the phenol resins. The nuclear hydride of the aromatic epoxy resin may, for example, be a nuclear hydride of a glycidyl etherate of a varnish resin which is a raw material of a phenol resin as a raw material, and specifically, various kinds thereof (for example, bisphenol A) , glycidyl ether compounds of phenolic compounds such as bisphenol F, bisphenol S, 4, 4'-biphenol, or phenol, cresol, ethyl phenol, butyl phenol, octyl phenol, bisphenol A A nucleated hydrogenated product of a glycidyl ether compound of a phenolic resin as a raw material, such as bisphenol F, bisphenol S, and naphthol. 39 321483 201020279 • The date of the milky month can be exemplified by: 2 p, —androkiylcyclohexyl)propane, 3 4 new A class, and (4 g of glyceryl oxyhydroxide, 4 glycosyl hexane carboxylic acid 3 , 4-epoxy group jf hexyl methacetate, ethylene cyclohexadiene dioxide: 5'5 snail-(3, b-epoxycyclohexylcyclohexyl) hexamethylene diester, etc. Epoxy waxes, and fats which are specifically designed with an aliphatic skeleton, such as 1,4-butanediol, hexanyl hexamethacrylate, an aliphatic epoxy resin such as a glycidyl ether of a polyhydric alcohol, for example, a polycondensation of a polyhydric alcohol such as an alcohol, a polyethylene glycol, a polyhydric alcohol, a tetraol or a benzene dimethanol derivative, etc. The heterocyclic epoxy resin may be, for example, an isocyanuric ring (is〇cy face price nng) : a heterocyclic epoxy resin having a heterocyclic ring such as a _ ring or the like. The glycidyl ester epoxy resin may, for example, be a hexahydrophthalic acid-glycidyl phthalate or tetrahydrophthalic acid. Diglycidyl § An epoxy resin composed of a glycidyl ester of hexagram, etc. The glycidylamine-based epoxy resin may, for example, be an aniline anilide, a private one, or a diamine. A glycidylated epoxy resin such as an amine diphenylmethyl derivative or a diamine methyl streprene derivative. The halogenated phenolic glycidylated epoxy resin can be exemplified by: brominated double A , brominated bisphenol!^, brominated bisphenol s, desertified phenolic phenol, desertified phenolic phenolic acid, chlorinated double S, chlorinated double a, etc. The epoxy resins are not particularly limited in use, and from the viewpoint of transparency, 'the coloring property is preferably small. Generally, the bisphenol A, the double F, the double s, and the 4 are used. 4' - joint age, tetradecyl-4, 4, - joint age, 1 - (4_ 321483 40 201020279 by stupid base)-2-[4-(1,1-bis-(4-hydroxy stupyl) Phenyl]propane, tris(p-phenyl)methane, m-benzoquinone, 2,6-di-t-butyl-p-benzoquinone, having a hetero-propylene skeleton, or 1,1 a polyfunctional epoxy resin having a glycidyl compound of a phenol having an anthracene skeleton; a phenol having a phenol, a cresol, a bisphenol A, a bisphenol S, and a naphthol a phenolic resin as a raw material, containing a dicyclopentadiene skeleton a phenolic phenolic resin, a phenolic phenolic resin containing a biphenyl skeleton, a glycidyl ether compound of various phenolic resins such as a phenolic phenolic resin containing a burial skeleton; bisphenol A, double age F, double squaring, 4'4'-linked a glycidyl ether compound of a phenol compound such as a phenol, or a phenol, a phenolic ethyl group, a butyl group, a octyl group, a bis, a pair, a jr, a bis, and a naphthene. For the frequency of the secret tree (four) glycidylation of the nuclear hydride; 3,, 4, ~ epoxy ring _ 3,4_ epoxy

基環己基甲酯等具有環己料架之脂環式環氧樹脂;H 醇、聚乙二醇、聚丙二醇之縮水甘麟類; :甘油基異氰尿酸醋或六氫鄰苯二甲酸二縮 由耐熱透明性、耐光透明性 曰等 燒骨架之脂環式環氧樹脂為佳。:;氧二具有環己 性等之必要而可併用丨種或2種=::,與耐熱 内容=:使用之硬化劑⑻以及硬化促進劑(。之 =合物、醯胺系化合物、_化合物等而無。 具體上可列舉如:H笨基甲炫、二伸乙_ 胺基二苯基石風、異佛爾嗣二胺、雙氰胺 硬化劑⑻可使用胺系化合 肝 人·一 a / . 奶、羧酸 限制 伸 二 乙四胺 32J483 41 201020279 (dicyandiamide)、四伸乙基五胺、二甲基苯曱胺、酮亞胺 化合物、由亞麻酸之二聚物與伸乙二胺所合成之聚醯胺樹 脂;鄰苯二甲酸酐、偏苯三酸酐、均苯四甲酸酐、馬來酸 酐、四氫鄰苯二曱酸酐、曱基四氫鄰苯二曱酸酐、氫化納 迪克酸酐、氫化曱基納迪克酸酐、曱基納迪克酸酐、六氫 鄰苯二曱酸酐、曱基六氫鄰笨二甲酸酐、1,3, 4-環己烷三 羧酸-3, 4-酐;鄰笨二曱酸、四氫鄰苯二曱酸、六氫鄰苯二 甲酸、曱基六氫鄰苯二曱酸、偏苯三酸、環己烷三羧酸、 1, 2, 3, 4-丁烷四羧酸;雙酚類、酚類(酚、烷基取代酚、萘 ❿ 酚、烷基取代萘酚、二羥基苯、二羥基萘等)與各種醛之縮 聚物、酚類與各種二烯化合物之聚合物、酚類與芳香族二 羥甲基之縮聚物、或者,雙曱氧基曱基聯苯與萘酚或酚類 之縮合物等、聯酚類以及該等之改質物、咪唑、三氟化硼-胺錯合物、胍衍生物等。該等之中,由與環氧樹脂混合作 成樹脂組成物時之適度的可使用時間(或操作時間;Pot Life)、硬化物的透明性之觀點而言,特別以酸酐系化合 _ 物、羧酸系化合物為佳,更以六氫鄰苯二甲酸酐、甲基六 氫鄰苯二曱酸酐、1, 3, 4-環己烷三羧酸-3, 4-酐、氳化納迪 克酸酐、氫化甲基納迪克酸酐為最佳。 相對於與組成物中之矽氧烷化合物(A)或其他之環氧 樹脂合併之全部環氧樹脂的環氧基1當量,硬化劑(B)之使 用量以0. 2至1.5當量左右為佳,以0. 3至1.2當量左右 為特佳。而且,特別是在使用苯甲基二曱基胺等三級胺作 為硬化劑(B)時之硬化劑的使用量,相對於組成物中所含環 42 321483 201020279 氧基之化合物’宜使用0.3至20重量%,以0.5至10重量 %為特佳。 硬化促進劑(C)之例可列舉如:2-曱基咪唑、2-苯基 咪唑、2-十一烷基咪唑、2-十七烷基咪唑、2-苯基-4-曱基 咪唑、1-苯曱基-2-苯基咪唑、1-苯曱基—2-曱基咪唑、1-氰基乙基-2-甲基咪嗤、1-氰基乙基-2-苯基咪^坐、1—氰基 乙基-2-十一烧基咪唑、2, 4-二胺基-6(2’ -曱基咪唾(1,)) 乙基-s-三D井、2, 4-二胺基-6(2,—烧基°米〇坐(1,))乙 ❹基-s-三哄、2, 4-二胺基-6(2’ _乙基,4-曱基咪唑(1,)) 乙基-s-三D井、2,4-二胺基-6(2,-甲基咪〇坐(1,))乙基—s— 三哄·異氰尿酸加成物、2-曱基咪唑異氰尿酸之2 : 3加成 物、2-苯基咪哇異氰尿酸加成物、2-苯基-3, 5-二經甲基咪 唾、2-苯基-4-羥曱基-5-甲基咪唑、1-氰基乙基-2-苯基 -3, 5-一氰基乙氧基甲基味°坐等各種咪唾類;以及,該等咪 唑類與鄰苯二甲酸、異苯二曱酸、對苯二甲酸、偏苯三酸、 ❹均苯四甲酸、萘二羧酸、馬來酸、草酸等多元羧酸所成之 鹽類;雙氰胺等醯胺類;1,8-二氮雜-雙環(5· 4.0)十一晞 -7等二氮雜化合物;以及該等之四苯基硼酸酯、酚紛醛等 之鹽類;與上述多元羧酸類或膦酸類所成之鹽類;溴化四 丁基銨、溴化十六烷基三曱基銨、氫氧化十六烷基三曱基 銨、溴化三辛基曱基銨等銨鹽;三苯膦、三(曱苯基)膦、 四苯基、;臭化鱗、四苯基鱗四苯基棚酸醋、甲基三丁基鱗二 曱基磷酸酯等膦類或鳞化合物;2, 4, 6-三(胺基曱基)酚等 酚類;胺加成物。例如:市售品之U-CAT 18X(商品名稱·· 43 321483 201020279An alicyclic epoxy resin having a cyclohexane frame such as a cyclohexylmethyl ester; a glycine-containing melamine of H alcohol, polyethylene glycol, or polypropylene glycol; glyceryl isocyanurate or hexahydrophthalic acid It is preferable to reduce the alicyclic epoxy resin which burns the skeleton, such as heat-resistant transparency, light-resistant transparency, and the like. :; Oxygen II has the necessity of cyclohexene, etc., and can be used in combination with two or two kinds of =::, with heat resistant content =: hardener (8) used and hardening accelerator (. = compound, amide compound, _ The compound may be exemplified by, for example, H, phenyl, acenaphthyl, acenaphthyl diphenyl stone, isophora diamine, dicyandiamide sclerosing agent (8), amine group, liver, human a / . Milk, carboxylic acid limited diethylenetetramine 32J483 41 201020279 (dicyandiamide), tetraethylamamine, dimethylbenzamide, ketimine compound, dimer from linolenic acid and ethylenediamine Polyamine resin synthesized; phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, tetrahydrophthalic anhydride, mercapto tetrahydrophthalic anhydride, hydrogenated nadic anhydride, hydrogenation曱 纳 纳 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克 克Stearic acid, tetrahydrophthalic acid, hexahydrophthalic acid, mercapto hexahydrophthalic acid, trimellitic acid, cyclohexane Acid, 1, 2, 3, 4-butane tetracarboxylic acid; bisphenols, phenols (phenols, alkyl-substituted phenols, naphthoquinones, alkyl-substituted naphthols, dihydroxybenzenes, dihydroxynaphthalenes, etc.) a polycondensate of various aldehydes, a polymer of phenols and various diene compounds, a polycondensate of phenols and aromatic dimethylol groups, or a condensate of bis-decyloxy fluorenylbiphenyl with naphthol or phenols And phenols and such modified substances, imidazole, boron trifluoride-amine complex, hydrazine derivative, etc. Among these, moderately usable time when mixed with epoxy resin to form a resin composition (or operation time; Pot Life), and transparency of the cured product, in particular, an acid anhydride compound or a carboxylic acid compound is preferred, and hexahydrophthalic anhydride or methylhexahydroortylene is further used. Diphthalic anhydride, 1,3,4-cyclohexanetricarboxylic acid-3,4-anhydride, deuterated nadic anhydride, hydrogenated methylnadic anhydride are preferred. Relative to the oxirane compound in the composition. The amount of the hardening agent (B) is from about 0.2 to 1.5 equivalents, and the amount of the hardener (B) is from about 0.2 to about 1.5 equivalents. Preferably, it is preferably from about 0.3 to 1.2 equivalents, and particularly, the amount of the hardener used in the case of using a tertiary amine such as benzyldidecylamine as the hardener (B), relative to the composition The ring 42 321483 201020279 is preferably used in an amount of from 0.3 to 20% by weight, particularly preferably from 0.5 to 10% by weight. Examples of the hardening accelerator (C) include 2-mercaptoimidazole and 2-benzene. Imidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenyl-4-mercaptoimidazole, 1-phenylmercapto-2-phenylimidazole, 1-phenylhydrazino-2 Mercaptoimidazole, 1-cyanoethyl-2-methylimidazolium, 1-cyanoethyl-2-phenylmethane, 1-cyanoethyl-2-undecylimidazole, 2, 4-diamino-6(2'-mercaptopropi (1,)) ethyl-s-tripa D well, 2,4-diamino-6 (2,-alkyl group 〇 sitting (1 ,)) Ethyl-s-trisyl, 2, 4-diamino-6(2'-ethyl, 4-mercaptoimidazole (1,)) Ethyl-s-three D well, 2, 4 -diamino-6(2,-methylmercapto(1,))ethyl-s-triterpene-isocyanuric acid adduct, 2-mercaptoimidazole isocyanuric acid 2:3 adduct 2-phenylimiphatic isocyanuric acid , 2-phenyl-3, 5-dimethylmethyl salic, 2-phenyl-4-hydroxydecyl-5-methylimidazole, 1-cyanoethyl-2-phenyl-3, 5 - a cyanoethoxymethyl taste ° sitting in various kinds of sodium saliva; and, such imidazoles and phthalic acid, isophthalic acid, terephthalic acid, trimellitic acid, pyromellitic acid a salt of a polycarboxylic acid such as naphthalene dicarboxylic acid, maleic acid or oxalic acid; a guanamine such as dicyandiamide; and 1,8-diaza-bicyclo(5·4.0) eleven-7 Aza compound; and salts of such tetraphenylborate, phenol aldehyde, etc.; salts with the above polycarboxylic acid or phosphonic acid; tetrabutylammonium bromide, cetyl bromide Ammonium salts such as trimethyl ammonium, cetyltrimethylammonium hydroxide, trioctyl decyl ammonium bromide; triphenylphosphine, tris(phenyl)phosphine, tetraphenyl, stinky scale, four a phosphine or a scaly compound such as phenyl fluorene tetraphenyl succinic acid vinegar or methyl tributyl sulphate phosphatide; a phenol such as 2, 4, 6-tris(amino fluorenyl) phenol; an amine adduct . For example: U-CAT 18X (commodity name·· 43 321483 201020279)

San-Apro(股)製造)等。該等硬化促進劑可經微膠囊化。該 等硬化促進劑中要使用何種者,可依例如:可得透明性、 硬化速度、作業條件之透明樹脂組成物所要求的特性而適 當選擇。相對於具有反應性官能基之嵌段型矽氧烷化合物 (A )、或與其他環氧樹脂合併10 0重量份,硬化促進劑一般 為使用0. 001至15重量份,以0. 005至5重量份之範圍為 佳,更以0. 05至1重量份為特佳。 本發明之硬化性樹脂組成物中,在無損及透明性之範 圍下,可依目的而適當地添加無機質充填劑、著色劑、聚 © 石夕氧樹脂、流平劑、潤滑劑、搞合劑、流平劑、潤滑劑、 光安定劑、抗氧化劑以及螢光體等。 無機質充填劑並無特別限制,可列舉如:結晶性或非 結晶性氧化矽、滑石、氮化矽、氮化硼、氧化鋁、氧化矽· 氧化鈦混熔體等。 著色劑並無特別限制,可列舉如:酞菁、偶氮、雙偶 氮、喹吖啶酮、蒽醌、黃烷士酮、紫環酮、茈、二噁畊、 q 縮合偶氮、曱亞胺(azodimethine)系之各種有機系色素、 氧化鈦、硫酸船、鉻黃、鋅黃、錮撥、鐵丹、銘紫、普魯 士藍、群青、碳黑、鉻綠、氧化鉻、鈷綠等之無機顏料。 聚矽氧樹脂可列舉如:二甲基聚矽氧、苯基曱基聚矽 氧、環氧基改質聚矽氧、聚醚改質聚矽氧、胺改質聚矽氧、 乙烯基改質聚矽氧、矽烷基改質聚矽氧等。 流平劑可列舉如:丙烯酸乙酯、丙烯酸丁酯、丙烯酸 2-乙基己酯等由丙烯酸酯類所組成之分子量4000至12000 44 321483 201020279 的寡聚物類;環氧化大豆脂肪酸;環氧化松香醇;氫化蓖 麻油;鈦系搞合劑等。 潤滑劑可列舉如:石蠟、微晶蠟、聚乙烯蠟等之烴系 潤滑劑;月桂酸、肉豆蔻酸、棕櫚酸、硬脂酸、花生酸、 山荼酸等之高級脂肪酸系潤滑劑;硬脂醯胺、棕櫚醯胺、 油醯胺、亞曱基雙硬脂醯胺、伸乙基雙硬脂醯胺等之高級 脂肪醯胺系潤滑劑;硬化蓖麻油、硬脂酸丁酯、乙二醇單 硬脂酸酯、季戊四醇(單、二、三或四)硬脂酸酯等之高級 〇 脂肪酸酯系潤滑劑;鯨蠟醇、硬脂醇、聚乙二醇、聚甘油 等之醇系潤滑劑;月桂酸、肉豆蔻酸、棕橺酸、硬脂酸、 花生酸、山荼酸、蓖麻油酸、環院酸等之鎮、#5、鑛、鋇、 辞、鉛等金屬鹽的金屬皂類;巴西棕櫚蠟、勘地里拉蠟、 - 蜜蠟、蒙旦蠟(亦稱褐煤蠟)等天然蠟類。 耦合劑可列舉如:3-縮水甘油氧基丙基三甲氧基矽 烷、3-縮水甘油氧基丙基曱基二曱氧矽烷、3-縮水甘油氧 q 基丙基三曱氧基矽烷、2-(3, 4-環氧基環己基)乙基三甲氧 基矽烷、N-(2-胺基乙基)3-胺基丙基甲基二甲氧矽烷、 N - ( 2 -胺基乙基)3 -胺基丙基甲基三甲氧基矽炫、k胺基丙 基三乙氧基矽烷、3-巯基丙基三甲氧基矽烷、乙烯基三曱 氧基矽烷、N-(2-(乙烯基苯曱胺基)乙基)3-胺基丙基三曱 氧基矽烷鹽酸鹽、3-甲基丙烯醯氧基丙基三曱氧基矽烷、 3-氯丙基甲基二曱氧矽烷、3-氯丙基甲基三曱氧基矽烷等 之矽烷系耦合劑;(N-乙基胺基乙基胺基)鈦酸異丙酯、三 異硬脂醯基鈦酸異丙酯、二(二辛基焦磷醯基)氧基乙酸 45 321483 201020279 鈦、四異丙基二(二辛基亞磷酸基)欽酸酯、新烧氧基三 (P-N-(沒-胺基乙基)胺基苯基)鈦酸酯等之鈦系耦合劑;乙 醯丙酮錘、曱基丙烯酸鍅、丙酸锆、新烷氧基锆酸酯、新 烷氧基三新癸醯基鍅酸酯、新烷氧基三(十二醯基)苯磺醯 锆酸酯、新烷氧基三(乙二胺乙基)鍅酸酯、新烷氧基三(間 -胺基笨基)锆酸酯、碳酸錘銨、乙醯丙酮鋁、曱基丙烯酸 链、丙酸鋁等之锆或鋁系耦合劑。 光安定劑以受阻胺系之光安定劑(11虬幻為合適。Hals 並無特別限定者,惟可列舉如:二丁胺.三哄.N,N_ q 雙(2, 2, 6, 6-四曱基-4-派。定基)-1,6一己二胺與 N-(2’ 2, 6’ 6-四曱基-4-哌啶基)丁基胺之縮聚物、琥珀酸二 甲基-1-(2-羥乙基)—4-羥基-2, 2, 6, 6-四甲基哌啶縮聚 物、聚[{6-(1’1,3,3-四曱基丁基)胺基— H5—三哄一2,4_ 二基H(2,2,6,6-四甲基—4-哌啶基)亞胺基}六亞曱基 {(2,2’6,6-四甲基-4—哌啶基)亞胺基丨]、雙(1,2,2,6,6_ 五曱基-4-哌啶基)[[3, 5_雙(1,丨―二甲基乙基)_4_羥基苯 基]甲基]丁基丙二酸醋、雙(2,2,6,6_四甲基_4_旅咬基)© 夭敲酉曰、雙(1,2, 2, 6, 6-五甲基-4-哌啶基)癸二酸酯、雙 (1辛氧基-2’ 2, 6, 6-四甲基—4-哌啶基)癸二酸酯、2_(3, 5_ (^^^^-五甲基—彳—哌啶基“旨等 或2種類以上併用。 二第三丁基_4_羥基苯甲基)_2_正丁基丙二酸雙 ° HALS可僅使用一種 硫系以及磷系抗氧化劑等。 4舉如:2, 6-二第三丁基- 抗氧化劑可列舉如··酚系、硫系i 酚系抗氧化劑之具體例可列舉如 321483 46 201020279 對曱酚、丁基化羥基苯甲醚、2, 6-二第三丁基-對乙基酚、 硬脂基-冷-(3, 5-二第三丁基-4-羥基苯基)丙酸酯、異辛基 -3-(3, 5-二第三丁基-4-經基苯基)丙酸i旨、2,4-雙-(正辛 基硫基)-6-(4-經基-3, 5-二第三丁基苯胺基)-1,3, 5-三 畊、2, 4-雙[(辛基硫基)甲基]鄰甲酚等單酚類;2,2’ -亞 甲基雙(4-曱基-6-第三丁基酚)、2,2’ -亞甲基雙(4-乙基 -6-第三丁基酚)、4, 4’ -硫基雙(3-甲基-6-第三丁基酚)、 4,4 -亞丁基雙(3-甲基-6-第三丁基朌)、三甘醇-雙 ® [3-(3-第三丁基-5-甲基-4-經基苯基)丙酸酉旨]、1,6 -己二 醇-雙[3-(3, 5-二第三丁基-4-羥基苯基)丙酸酯]、Ν,Ν’ - 六亞甲基雙(3, 5-二第三丁基-4-羥基氫化肉桂醯胺)、 2, 2’ -硫基-二伸乙基雙[3-(3, 5-二第三丁基-4-羥基苯基) 丙酸酯]、3,5-二第三丁基-4-羥基苯甲基-膦酸酯-二乙 酯、3,9-雙[1,1-二甲基-2-{石-(3-第三丁基-4-羥基一5一 甲苯基)丙醯氧基}乙基]2, 4, 8, 10-四氧雜螺[5, 5]十一 ❹烷、雙(3,5-二第三丁基-4-羥基苯甲基磺酸乙酯鈣等之雙 盼類;1,1,3-三(2-甲基-4-羥基-5第三丁基苯基)丁烧、 1,3, 5-二甲基-2, 4, 6-二(3, 5-二第三丁基-4-觀基苯甲基) 苯、四-[亞甲基-3-(3’,5’ -二第三丁基-4,-羥基苯基) 丙酸酯]甲烷、雙[3,3,_雙-(4,_羥基-3,-第三丁基苯基) 丁酸]二醇酯、三-(3, 5-二第三丁基-4-經基苯甲基)_異氰 脲酸酯、1,3,5-三(3,,5’ -二第三丁基—4,-羥基苯曱 基)-S-三哄-2, 4, 6-(1Η,3Η,5Η)三酮、茶兒酚等之高分子型 紛類。 321483 47 201020279 硫系抗氧化劑之具體例係如:3,3’ -硫代二丙酸二 月桂醋、3, 3’ -硫代二丙酸二肉豆蔻酯、3, 3’ -硫代二肉 酸二硬脂酯等。 鱗系抗氧化劑之具體例係如:三笨基亞磷酸酯、二笨 基異癸基亞磷酸酯、苯基二異癸基亞磷酸酯、三(壬基苯基) 亞礙酸醋、二異癸基季戊四醇亞磷酸酯、三(2,4_二第三丁 基苯基)亞磷酸酯、環新戊烷四基雙(十八烷基)亞磷酸酯、 環新戊烷四基雙(2, 4-二第三丁基苯基)亞磷酸酯、環新戊 烷四基雙(2, 4-二第三丁基-4-曱基苯基)亞磷酸酯、雙[2_ 第二丁基-6-甲基-4-{2-(十八烷氧基羰基)乙基丨苯基]氫 亞磷酸酯等之亞磷酸酯類;9,1〇_二氫_9_氧雜—1〇_膦菲 -10-氧化物、1〇-(3, 5-二第三丁基-4—羥基笨甲基)_9, 1〇_ 一氫-9-氧雜-ίο-膦菲—1〇_氧化物、1〇_癸氧基_9, 1〇_二氫 9-氧雜4 0-膦菲_10_氧化物等之氧雜膦菲氧化物類等。 該等抗氧化劑可分別單獨使用,亦可併用2種以上之 組合。特财本發财以㈣、抗氧化劑為佳。相對於本發 明之硬化性樹脂組成物中的樹脂成分⑽重量份,抗氧化 劑之使用量,一般為0 _至J重量份,以〇. 〇1至〇. 5 重量份為佳。 將本發明之硬化性樹脂組成物使用在光半導體密封 劑時’可因應所需而添加螢光體。螢光體係例如藉由則 ==色㈣元件所發出之藍色光,而發出波長經車 有形成白色光之作用者。將螢光_ 散於硬化㈣肋成物後,將光何體密封。f光體並, 321483 48 201020279 特別限制,可使用以往習知之螢光體,例如可列舉:稀土 •元素之鋁酸鹽、硫代沒食子酸鹽、原矽酸鹽等。^具體而 言,可列舉如:YAG螢光體、TAG螢光體、原矽酸鹽螢光體、 硫代沒食子酸鹽螢光體、硫化物螢光體等螢光體,例如. γΑ1〇3 : Ce ^ YsAhO, : Ce ^ Y4Ah〇9 : Ce ^ Y2〇2S : Eu &gt; Sr5(P〇4)3ci : ❿San-Apro (share) manufacturing) and so on. The hardening accelerators can be microencapsulated. Which of these hardening accelerators is used can be suitably selected, for example, according to characteristics required for a transparent resin composition which can obtain transparency, curing speed, and working conditions. 0至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至至The range of 5 parts by weight is preferably more preferably from 0.05 to 1 part by weight. In the curable resin composition of the present invention, an inorganic filler, a colorant, a polysulfide resin, a leveling agent, a lubricant, a compounding agent, and the like may be appropriately added depending on the purpose, without departing from the scope of transparency and transparency. Leveling agents, lubricants, light stabilizers, antioxidants, and phosphors. The inorganic filler is not particularly limited, and examples thereof include crystalline or amorphous cerium oxide, talc, cerium nitride, boron nitride, aluminum oxide, cerium oxide, and titanium oxide mixed solution. The coloring agent is not particularly limited, and examples thereof include phthalocyanine, azo, disazo, quinacridone, anthracene, flavanone, purple ketone, hydrazine, dioxin, q condensed azo, hydrazine. Azodimethine is a variety of organic pigments, titanium oxide, sulphuric acid boat, chrome yellow, zinc yellow, sputum, iron sulphide, Ming purple, Prussian blue, ultramarine blue, carbon black, chrome green, chromium oxide, cobalt green, etc. Inorganic pigments. The polyoxynoxy resin may, for example, be dimethyl polyfluorene oxide, phenyl fluorenyl polyfluorene oxide, epoxy modified polyfluorene oxide, polyether modified polyfluorene oxide, amine modified polyoxyl oxide, vinyl modified Poly-oxygen, decyl-modified polyoxyl, and the like. The leveling agent may, for example, be an acrylate having a molecular weight of 4000 to 12000 44 321483 201020279 composed of acrylates such as ethyl acrylate, butyl acrylate or 2-ethylhexyl acrylate; epoxidized soybean fatty acid; epoxidation; Rosin alcohol; hydrogenated castor oil; titanium-based compounding agent. Examples of the lubricant include hydrocarbon-based lubricants such as paraffin wax, microcrystalline wax, and polyethylene wax; and higher fatty acid-based lubricants such as lauric acid, myristic acid, palmitic acid, stearic acid, arachidic acid, and behenic acid; a high-grade fatty amide-based lubricant such as stearylamine, palm amide, ceramide, sulfhydryl bis-lipidamine or ethyl bis-stearamide; hardened castor oil, butyl stearate, a high-grade oxime fatty acid ester lubricant such as ethylene glycol monostearate or pentaerythritol (mono, di-, tri- or tetra) stearate; cetyl alcohol, stearyl alcohol, polyethylene glycol, polyglycerin, etc. Alcohol-based lubricant; lauric acid, myristic acid, palmitic acid, stearic acid, arachidic acid, behenic acid, ricinoleic acid, Huanyuan acid, etc., #5, mine, 钡, 辞, lead, etc. Metal soaps of metal salts; natural waxes such as carnauba wax, rehearsal wax, - beeswax, and montan wax (also known as montan wax). The coupling agent may, for example, be 3-glycidoxypropyltrimethoxydecane, 3-glycidoxypropylmercaptodioxane, 3-glycidyloxyqylpropyltrimethoxy decane, 2 -(3,4-epoxycyclohexyl)ethyltrimethoxydecane, N-(2-aminoethyl)3-aminopropylmethyldimethoxydecane, N-(2-aminoethyl 3-aminopropylmethyltrimethoxyoxime, k-aminopropyltriethoxydecane, 3-mercaptopropyltrimethoxydecane, vinyltrimethoxy decane, N-(2- (Vinylbenzamine)ethyl)3-aminopropyltrimethoxy decane hydrochloride, 3-methylpropenyloxypropyltrimethoxy decane, 3-chloropropylmethyldi a decane-based coupling agent such as a decyloxane or a 3-chloropropylmethyltrimethoxy decane; (N-ethylaminoethylamino) isopropyl titanate or a triisostearate titanate Propyl ester, bis(dioctylpyranosyl)oxyacetic acid 45 321483 201020279 Titanium, tetraisopropylbis(dioctylphosphite)carboxylate, neosodium oxylate (PN-(no-amine) Titanium-based coupling agent such as ethyl ethyl)aminophenyl) titanate; Hammer, bismuth methacrylate, zirconium propionate, neoalkoxy zirconate, neoalkoxytrimethylene phthalate, neoalkoxytris(taudecyl)benzenesulfonate zirconate, Neoalkoxytris(ethylenediamineethyl)phthalate, neoalkoxytris(m-aminophenyl)zirconate, ammonium carbonate, acetoacetate, mercapto acrylate chain, aluminum propionate A zirconium or aluminum based coupling agent. The light stabilizer is a hindered amine-based light stabilizer (11 illusion is suitable. Hals is not particularly limited, but may be exemplified by: dibutylamine. Sanken. N, N_ q double (2, 2, 6, 6 - tetrakisyl-4-pin. succinyl)-1,6-hexanediamine and N-(2' 2,6' 6-tetradecyl-4-piperidyl)butylamine polycondensate, succinic acid II Methyl-1-(2-hydroxyethyl)- 4-hydroxy-2, 2, 6, 6-tetramethylpiperidine polycondensate, poly[{6-(1'1,3,3-tetradecyl) Butyl)amino-H5-tris- 2,4-diyl H(2,2,6,6-tetramethyl-4-piperidinyl)imido}hexamethylene {{2,2' 6,6-tetramethyl-4-piperidinyl)imidopyrene], bis(1,2,2,6,6-pentamethyl-4-piperidinyl)[[3, 5_double (1) , 丨-dimethylethyl)_4_hydroxyphenyl]methyl]butylmalonic acid vinegar, bis(2,2,6,6-tetramethyl_4_Brigade bite) © 夭 酉曰, bis(1,2,2,6,6-pentamethyl-4-piperidyl)sebacate, bis(1-octyloxy-2' 2,6,6-tetramethyl-4-piperidyl Pyridyl) sebacate, 2_(3, 5_(^^^^-pentamethyl-indenyl-piperidinyl) or two or more types. Di-tert-butyl-4-hydroxybenzyl) _2_n-butylmalonic acid double ° For the HALS, only one type of sulfur-based or phosphorus-based antioxidant may be used. For example, the 2,6-di-tert-butyl-antioxidant may be exemplified by a specific example of a phenol-based or sulfur-based phenol-based antioxidant. For example, 321483 46 201020279 p-nonylphenol, butylated hydroxyanisole, 2,6-di-t-butyl-p-ethylphenol, stearyl-cold-(3, 5-di-tert-butyl-4- Hydroxyphenyl)propionate, isooctyl-3-(3,5-di-t-butyl-4-phenylphenyl)propanoic acid, 2,4-bis-(n-octylthio) -6-(4-carbazhen-3,5-di-t-butylanilino)-1,3,5-three-pill, 2,4-bis[(octylthio)methyl]o-cresol, etc. Monophenols; 2,2'-methylenebis(4-mercapto-6-tert-butylphenol), 2,2'-methylenebis(4-ethyl-6-tert-butylphenol ), 4, 4'-thiobis(3-methyl-6-tert-butylphenol), 4,4-butylenebis(3-methyl-6-tert-butylhydrazine), triethylene glycol - bis-[3-(3-t-butyl-5-methyl-4-phenylphenyl)propanoate], 1,6-hexanediol-bis[3-(3, 5-di Third butyl-4-hydroxyphenyl)propionate], hydrazine, Ν'-hexamethylene bis (3, 5-di-t-butyl-4-hydroxy hydrogenated cinnamyl) Indoleamine, 2, 2'-thio-di-extended ethyl bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], 3,5-di-third 4-hydroxybenzyl-phosphonate-diethyl ester, 3,9-bis[1,1-dimethyl-2-{stone-(3-tert-butyl-4-hydroxy-5-one Tolyl)propenyloxy}ethyl]2, 4, 8, 10-tetraoxaspiro[5,5]undecane, bis(3,5-di-t-butyl-4-hydroxybenzoate a double-seeking class of ethyl sulfonate, calcium, etc.; 1,1,3-tris(2-methyl-4-hydroxy-5th-butylphenyl)butane, 1,3,5-dimethyl- 2, 4, 6-bis(3, 5-di-t-butyl-4-o-benzyl) benzene, tetra-[methylene-3-(3',5'-di-t-butyl- 4,-Hydroxyphenyl)propionate]methane, bis[3,3,-bis-(4,-hydroxy-3,-tert-butylphenyl)butyrate]diol, tris-(3, 5-di-tert-butyl-4-carbylmethyl)-isocyanurate, 1,3,5-tris(3,5'-di-t-butyl-4,-hydroxyphenylhydrazino )-S-tripa-2, 4, 6-(1Η, 3Η, 5Η) triketones, tea phenols and other polymer types. 321483 47 201020279 Specific examples of sulfur-based antioxidants are: 3,3'-thiodipropionic acid dilaurin vinegar, 3,3'-thiodipropionate dimyristyl ester, 3,3'-thiodi Distearyl benzoate and the like. Specific examples of squama antioxidants are: trisuccinyl phosphite, dipyridyl isodecyl phosphite, phenyl diisononyl phosphite, tris(nonylphenyl) amide vinegar, two Isodecyl pentaerythritol phosphite, tris(2,4-di-t-butylphenyl)phosphite, cyclopentanetetraylbis(octadecyl)phosphite, cyclopentane tetrakisyl double (2,4-di-t-butylphenyl)phosphite, cyclopentanetetrakis(2,4-di-t-butyl-4-decylphenyl)phosphite, double [2_ a phosphite such as dibutyl-6-methyl-4-{2-(octadecyloxycarbonyl)ethylphosphonium phenyl]hydrogen phosphite; 9,1 〇_dihydro_9_oxygen Hetero-1 〇 phosphinophen-10-oxide, 1 〇-(3, 5-di-tert-butyl-4-hydroxylmethyl)_9, 1〇_monohydro-9-oxa-ίο-phosphine An oxaphosphonium phenanthrene oxide such as phenanthrene oxide, fluorene phenanthrene oxide, or the like. These antioxidants may be used alone or in combination of two or more. Special wealth is good (4), antioxidants are better. The amount of the antioxidant to be used is usually from 0 to J by weight, based on the weight of the resin component (10) by weight of the curable resin composition of the present invention, preferably from 〇1 to 〇. 5 parts by weight. When the curable resin composition of the present invention is used in an optical semiconductor encapsulant, a phosphor can be added as needed. The fluorescent system emits white light by the vehicle, for example, by the blue light emitted by the element of the == color (4). After the fluorescent _ is scattered on the hardened (four) ribs, the light is sealed. Further, 321483 48 201020279 A conventionally known phosphor can be used, and examples thereof include a rare earth elemental aluminate, a thiogallate, and a protoporate. Specifically, for example, a phosphor such as a YAG phosphor, a TAG phosphor, an orthosilicate phosphor, a thiogallate phosphor, a sulfide phosphor, or the like can be cited, for example. ΑΑ1〇3 : Ce ^ YsAhO, : Ce ^ Y4Ah〇9 : Ce ^ Y2〇2S : Eu &gt; Sr5(P〇4)3ci : ❿

Eu、(SrEU)〇 · Al2〇3等。言亥營光體之粒徑可使用該領域習 ^之粒技,而平均粒徑為1至250 _,以2至5()_為佳。 在使用該等螢光體時,相對於該樹脂成分1〇〇重量份,其 添加量為1至80重量份,以5至60重量份為佳。&quot;^ 本發明之較佳硬化性樹脂組成物係如下述。 (I) —種硬化性樹脂組成物,係含有上述(1)至(^。中任一 記载之含反應性官能基之矽氧烷化合物(以下稱為本發明 之矽氧烷化合物(A)或該矽氧烷化合物(A))以及可任^含 有之該矽氧烷化合物(A)以外的環氧化合物(以下亦稱為 G~B:P〇),其總量相對於組成物全體為3〇至9〇重量从以下 如無特別限制則表示重量%),其餘部份為硬化劑(B)者。 (II) 如上述(丨)所記載之硬化性樹脂組成物,其中,相對於 該石夕氧燒化合物(A)之環氧基1當量,硬化齋l(B)所含範圍 為〇·2至1· 5當量。 (11〇如上述(I)或(II)所記載之硬化性樹脂組成物,其 中’相對於組成物全體,該矽氧烷化合物(A)以及可任意含 有之0-ΕΡ0,其總量為50至90%。 (IV)如上述(I)至(III)中任一記載之硬化性樹脂組成物, 其中,相對於該矽氧烷化合物(A)以及可任意含有之〇_EP〇 321483 49 201020279 之總量,該矽氧烷化合物(A)之比例為50至1〇〇%。 (V) 如上述⑴至(IV)中任-記載之硬化性樹脂組成物,盆 中,相對於該矽氧烷化合物(A)以及可任意含有之〇—Ep〇' 之總量,該矽氧烷化合物(A)之比例為3〇至9〇%。 (VI) 如上述⑴至⑺中任—記載之硬化性樹脂組成物,盆 中,相對於該矽氧烷化合物(A)10重量份,復含有〇 〇(n、 至15重量份之比例的硬化促進劑。 (VII) 如上述(I)至(VD中任—記載之硬化性樹脂組成物, ”中,硬化劑(B)為酸酐化合物或竣酸化合物。 上述本發明之硬化性樹脂組成物係將上述原料以任意 方法均勻混合即可獲得。 ^ 上述本發明之硬化性樹脂組成物係含有含反應性官 月匕基之石夕氧燒化合物(A)、硬化劑(B)以及因應所需之硬化 促進(C)劑者,在該硬化性樹脂組成物中’如有進一步需 要可调配其他之任意調配成分。其他之任意調配成分可 列舉如:無機質充填劑、著色劑、聚矽氧樹脂、流平劑、 潤滑劑、耗合劑、光安定劑、抗氧化劑以及螢光體等。該 等其他調配成分’相對於該矽氧烷化合物(A)以及硬化劑(B) 之總量100重量份,可在0至500重量份之範圍適宜地添 加’以0至100重量份左右為佳。調配該等其他調配成分 者在固態時’使用亨舍爾攪拌機(Henschel mixer)、圓 錐开&gt;螺旋混合機(Nautamixer)等混合機混合後,使用捏合 機、押出機、加熱輥於80至12(TC下進行混練並冷卻後, 、屋粉碎而得粉末狀者。另一方面’所調配者如為液態時, 50 321483 201020279 使用行星式攪拌機(Planetarymixer)等進行均勻分散,亦 可做成3有該等之其他細&amp;成分的本發明之硬化性樹脂組 成物。 便用如此而得之本發明的組成物,將led、感光器、 收發器(transceiver)等之光半導體密封而得本發明之光 半導體時’可用轉注成⑽⑽咖職咖小壓縮成型 (compression molding) ^A^^(injecti〇nm〇ld.ng) ^ ❹ 點膠(disPensing)法、印刷法等之以往的成型方法成形。 里且成1後,用以使光半導體密封用樹脂組成物硬化之 加熱方法,並無特別限制者,可採用熱風循環式加熱、紅 外線加熱、㈣加鱗喊之習知方法。硬化條件一般約 =至纖下於3G秒鐘至15小時之_進行加熱,然 亦可適Μ地更換條件。較佳條件為⑽至職,較佳者 係例如.最先在100至14〇°c下推〜Α , onn〇r. ^ L下進仃硬化,接著於13〇至 200 C下進行最後硬化之方法。 以下係依合成例、實施例更詳加說明本發明。同時, 本發明並非限定於該等合成例、實施例。而且,實施例中 之各物性值係依以下方法測定。 ⑴分子量:係依凝轉透層析(Gpc)法以下述條件測定而 求出之聚苯乙烯換算重量 GPC之各種條件 J刀卞罝 製造薇商:島津製作所 管柱:保護管柱SHQDEX GPC LF~G Lf__ 流速:1· Oml/min· 321483 51 201020279 管柱溫度:40°C 使用溶劑:THF (四氫吱喃) 檢測器:RI (示差折射檢測器) (2) 環氧當量:依JIS K-7236所記載之方法測定。 (3) 黏度:使用東機產業(股)製造之E型黏度計(TV-20)在 25°C測定。 [實施例] 以下係依合成例、實施例更詳加說明本發明。同時, 合成例、實施例中之「份」、「%」分別為「重量份」、「重量 %」之意。而且,烷氧當量以及矽醇當量雖未記載單位,惟 該等單位皆為g/eq。 實施例1 (使相對於碎醇基1當量跋氧基成為5. 3當量之比例進行反 應之例) 第1階段反應:將/3-(3, 4-環氧基環己基)乙基三曱 氧基矽烷197. 1份(烷氧當量82. lg/eq)、重量平均分子量 10 6 0 (G P C測定值)之矽醇末端二曱基聚矽氧油2 3 7. 4份(矽 醇當量530g/eq)、0. 5%氫氧化鉀(Κ0Η)甲醇溶液21. 3份 (Κ0Η份數為0. 11份)裝入反應容器中,並使液溫升高至75 °C。升溫後,在回流下於75°C中反應8小時。矽醇當量 53Og/eq係以GPC所測定之重量平均分子量1060做為聚石夕 氧油之分子量,由於每分子具有2個石夕醇基,因而求算其 一半值。以下實施例中,矽醇末端聚矽氧油(b)之矽醇當量 亦以同法求取。 52 321483 201020279 第又反應·在上述所得反應液中加入曱醇305 於此以60分鐘滴入5〇%蒸館水辣容液86· 4份, 、:机下於75 C反應8小時。反應結束後,將反應液 =厂酸一虱納水溶液中和後,於齡下蒸德回收甲醇。 ―剩,的反應液中添加甲基異丁闕(M服)份之後,進 ❹ ❹ 。二=A之水洗。接著將有機相分離後,在減壓、100 溶媒’藉此而得到具有反應性官能基之刪石夕 2化合物(h)344份。所得化合物之環氧當量為 Μ ^紅1 4量平均分子量為3700,黏度為600mPa.S,外 觀為無色透明。 屬於倍半石夕氧烧鏈段之石夕原子比例(相對於全部石夕原 子’由饋人原料比所算出之結合3個氧原子的㈣子之、 例)為19· 6莫耳%。同樣地,屬於鍵狀聚石夕氧鍵段 比例為80.4莫耳%。 屬子 實施例2 (使相對神醇基丨t找氧基成為3().8當量之比例 反應之例) 進仃 第1階段反應:將冷-(3, 4-環氧基環己基)乙基二 氧基矽烷197. 1份(烷氧當量82·丨)、重量平均分子^一甲 (GPC測定值)之矽醇末端二曱基聚矽氧油237.4份= 量3060)、0. 5%Κ0Η甲醇溶液20. 0份(Κ0Η份數:j醇當 裝入反應容器中,並使液溫升高至75°C。升溫後,.知) 下於75°C反應8小時。 在回流 第2階段反應:追加甲醇260份後,以6〇分鐘滴人 321483 53 201020279 50°。館甲醇溶液86. 4份,使其在回流下於π 小時。及^廉4士 jk &gt; 〇 〇 ^ 後,以5%磷酸二氫鈉水溶液中和後, 醇。添加M服⑽份,進行反覆3次二 ' 將有機相在減壓、100°C下去除溶媒,藉 具有反應性官萨苴山 玄陆/合琛错此而得到 得化合你夕s :基之嵌段型矽氧烷化合物(A-2)36〇份。所 4160,黏&amp;%巩當量為468&amp;/叫,重量平均分子量為 擺,黏度為48lmp 卞垔為 屬於倍半錢燒奸Λ 色 樣地,屬於鍵狀聚㈣二原子比例為19· 6莫耳%。同 實施例3 _段之#原子_為8G.4莫耳%。 (使相對於矽醇基丨當量 反應之例) 土成為80. 1當量之比例進行 第1階段反應:將厶〜。a 氧基石夕燒98.6份(燒氧當量己基)乙基三甲 (GPW定值)之石夕醇末端·=重里平均分子量15_ 量790〇)、05%K〇H甲醇土聚石夕氧’由118.7份(石夕醇當 酤λ = 液10. 〇份(KOH份數i Λ 田 裝入反應容器中’使液温升 =〇· 05份) 於75Ϊ反應8小時。 开/取唆,在回流下 第2階段反應:追加甲醇142份後, 5〇%蒸•水曱醇溶液43. 2份,使其在回流下:。鳍滴入 8小時。反應結束後’μ,酸二氫納水溶C中反應 8〇 C下蒸顧回收曱醇。添加咖ΐ9ΐ份:和後’於 水洗。接著將有機相在減髮、刚。c下去除反覆3 :欠之 到具有反應性官能基之嵌”魏㈣、藉此而得 U,69 份。 321483 201020279 所得化合物之環氧當量 4130,黏度為710mPa · : ^ eq,重平均分子量為 凰认 卜規為無色透明。 摄地屬 氧垸鏈段之^子比例為19 6莫抑 樣地’屬於鏈狀聚錢鏈段 a 4耳心同 實施例4 原子比例為80_4莫耳%。 (使相對於矽醇基丨當量 應之例) 基成為8.6當量之_進行反 ❹ 氣基n(3,4'環氧基環己基)乙基三甲 二基石夕燒49.3份(燒氧當量82i 份(烷氧當量66 1)、舌曰τ |孔丞矽沉卯.7 石夕醇末端甲分子量17_PC測定值)之 κηΗ ψ ^ 土乂 氧油 118·?份(矽醇當量 850)、0·5% Κ0Η甲醇溶㈣.。份(咖份數為,认反應容器 ^液μ升间至75&lt;:°升溫後,在回流下於75°C反應8 小時。 第2階段反應:追加曱醇123份後,以60分鐘滴入 ❹50%蒸鶴水甲醇溶液43 2份,使其在回流下於饥中反應 8 J時反應結束後’以5%磷酸二氫納水溶液中和後,於 別t:下蒸餾回收甲醇。添加ΜΙβκ 191份,進行反覆3次之 水洗。接著將有機相在減壓' 1〇〇力下去除溶媒,藉此而得 到具有反應性官能基之嵌段型石夕氧烧化合物(A 一 4 ) i 6 8份。 所付化合物之環氧當量為874g/eq,重量平均分子量為 2630,黏度為4600mPa · s,外觀為無色透明。 屬於倍半矽氧燒鏈段之石夕原子比例為22. 5莫耳%。同 樣地,屬於鏈狀聚矽氧鏈段之矽原子比例為77. 5莫耳%。 321483 55 201020279 實施例5 (使相對於矽醇基丨當量烷氧基 應之例) 為8. 6當量之比例進行反 弟1階段反應 氧基矽烷49. 3份(烷氧當量82.丨^氧基%己基)乙基三甲 份(烷氧當量45. 4)、重量平岣分甲基—曱氧基矽烷27. 2 矽醇末端甲基苯基聚矽氧油118 17〇〇(GPC測定值)之 Κ0Η曱醇溶液10.0份(K〇H份數為知(矽醇當量850)、0.5% 中,使液溫升高至75°C。升、^ 〇 〇5知)裝入反應容器 小時。 ’在回流下於75〇C反應8 第2階段反應:追加甲醇 50%蒸餘水甲醇溶液43. 2份:後’以分鐘滴入 8小時。反應結束後,以5。娜酸流下於肌中反應 赃下蒸館回收甲醇。添加MIBK:納水溶液中和後,於 水洗。接著將有機相在減壓、1〇 I進仃反覆3次之 ==官能基之錢型錢~_份。 5850 ^之環氧當量為咖⑽,重量平均分子量為 黏度為461〇mPa.s,外觀為無色透明。 _ ^半石夕氧院鍵段之石夕原子比例為20.0莫耳%。同 ,也’屬於鏈狀㈣氧鏈段之W子關為動莫耳%。 比車父例1 (使相對於料基1#纽氧基成机4#量之比例進行反 …?' ·於第1階段反應而凝膠化之例) 、冷(3’4-%氧基環己基)乙基三甲氧基矽烷37〇份 321483 56 201020279 (烧氧當量82. 1)、畲暑芈祕、^Eu, (SrEU) 〇 · Al2 〇 3 and the like. The particle size of Yanhai Camp can be used in the field, and the average particle size is 1 to 250 _, preferably 2 to 5 () _. When the phosphors are used, the amount thereof is from 1 to 80 parts by weight, preferably from 5 to 60 parts by weight, based on 1 part by weight of the resin component. &quot;^ The preferred curable resin composition of the present invention is as follows. (I) A curable resin composition containing the reactive functional group-containing oxirane compound (hereinafter referred to as the oxime compound of the present invention (A) Or the oxoxane compound (A)) and an epoxy compound other than the oxirane compound (A) (hereinafter also referred to as G~B: P〇), the total amount of which is relative to the composition The total weight is from 3 to 9 inches from the following unless otherwise limited, and the remainder is the hardener (B). (II) The curable resin composition according to the above (丨), wherein the range of the hardening fastness (B) is 〇·2 with respect to 1 equivalent of the epoxy group of the austenite compound (A) Up to 1.5 equivalents. (11) The curable resin composition according to the above (I) or (II), wherein the total amount of the oxirane compound (A) and the arbitrarily contained 0-ΕΡ0 relative to the entire composition is (C) The curable resin composition according to any one of the above (I) to (III), wherein the oxime compound (A) and optionally 〇EP〇321483 are contained. The total amount of the siloxane compound (A) is from 50 to 1% by weight. (V) The curable resin composition as described in any one of the above (1) to (IV), in the pot, relative to The total amount of the oxoxane compound (A) and the hydrazine-Ep〇' which may be optionally contained, the ratio of the oxoxane compound (A) is from 3 〇 to 9 〇 %. (VI) as in the above (1) to (7) A hardening resin composition according to the above, wherein the pottery contains a hardening accelerator in a ratio of n to 15 parts by weight based on 10 parts by weight of the azide compound (A). (VII) as described above ( I) to (a hardening resin composition described in any one of VD), wherein the curing agent (B) is an acid anhydride compound or a citric acid compound. The resin composition is obtained by uniformly mixing the above-mentioned raw materials by any method. ^ The above-mentioned curable resin composition of the present invention contains a reactive oxygen-containing compound (A) and a hardener (B) And any other compounding component which can be adjusted in the curable resin composition in accordance with the hardening-promoting (C) agent required. Other optional ingredients may be, for example, inorganic fillers and colorants. , polyoxyl resin, leveling agent, lubricant, consumable, light stabilizer, antioxidant, phosphor, etc. These other compounding ingredients 'relative to the alkoxylate compound (A) and hardener (B) The total amount of 100 parts by weight may be suitably added in the range of 0 to 500 parts by weight, preferably from 0 to 100 parts by weight. When these other ingredients are formulated, the Henschel mixer is used in the solid state. After mixing with a mixer such as a conical mixer (Nautamixer), the kneader, the extruder, and the heating roller are kneaded at 80 to 12 (TC) and cooled, and the house is pulverized to obtain a powder. On the one hand, when the blender is in a liquid state, 50 321483 201020279 is uniformly dispersed by using a planetary mixer or the like, and the curable resin composition of the present invention having 3 other fine &amp; components may be obtained. With the composition of the present invention thus obtained, when the optical semiconductor of the present invention is sealed by the optical semiconductor of the LED, the photoreceptor, the transceiver, etc., it can be converted into (10) (10) compression molding. ^A^^(injecti〇nm〇ld.ng) ^ 成形Forming by conventional molding methods such as disPensing method and printing method. In the heating method for curing the resin composition for sealing a photo-semiconductor, it is not particularly limited, and a hot-air circulation type heating, infrared heating, or (four) scaling method can be employed. The hardening conditions are generally about = to 3 minutes to 15 hours after the fiber is heated, but the conditions can be appropriately changed. The preferred condition is (10) to the job, preferably for example. First, push 100~14〇°c down to Α, onn〇r. ^ L under 仃 hardening, then final hardening at 13〇 to 200 C The method. Hereinafter, the present invention will be described in more detail by way of Synthesis Examples and Examples. Meanwhile, the present invention is not limited to the above-described synthesis examples and examples. Further, each physical property value in the examples was measured by the following method. (1) Molecular weight: Various conditions of polystyrene-equivalent weight GPC determined by the following conditions by the GPC method. J. 卞罝 薇 薇 : :: Shimadzu Corporation column: protection column SHQDEX GPC LF ~G Lf__ Flow rate: 1· Oml/min· 321483 51 201020279 Column temperature: 40°C Solvent: THF (tetrahydrofuran) Detector: RI (differential refractive detector) (2) Epoxy equivalent: according to JIS The method described in K-7236 was measured. (3) Viscosity: measured at 25 ° C using an E-type viscometer (TV-20) manufactured by Toki Sangyo Co., Ltd. [Examples] Hereinafter, the present invention will be described in more detail by way of Synthesis Examples and Examples. Meanwhile, the "parts" and "%" in the synthesis examples and the examples are "parts by weight" and "% by weight", respectively. Further, although the alkoxy equivalent and the decyl alcohol equivalent are not described, the units are all g/eq. Example 1 (Example of reacting 1 equivalent of decyloxy group with respect to a ground alcohol group to a ratio of 5.3 equivalents) Stage 1 reaction: /3-(3,4-epoxycyclohexyl)ethyl three 1 part (alkoxy equivalent: 82. lg / eq), weight average molecular weight 10 6 0 (GPC measured value) of sterol terminal dimercapto polyoxyl oil 2 3 7.4 parts (sterol) Equivalent 530 g/eq), 0.5% potassium hydroxide (Κ0Η) methanol solution 21. 3 parts (Κ0Η parts of 0.11 parts) were charged into the reaction vessel, and the liquid temperature was raised to 75 °C. After the temperature was raised, the reaction was carried out at 75 ° C for 8 hours under reflux. The sterol equivalent of 53 Og/eq is the weight average molecular weight of 1060 as measured by GPC as the molecular weight of the polyoxo oxy-oil, and since it has two linoleic groups per molecule, half of the value is calculated. In the following examples, the decyl alcohol equivalent of the decyl alcohol-terminated polyoxyl oil (b) was also determined in the same manner. 52 321483 201020279 The second reaction was carried out by adding decyl alcohol 305 to the reaction liquid obtained above, and then injecting 5 〇% of the steaming water and boiling liquid 86. 4 parts in 60 minutes, and reacting at 75 C for 8 hours under a machine. After the completion of the reaction, the reaction liquid was neutralized with a plant acid-sodium sulphate aqueous solution, and methanol was recovered under steaming. After adding methyl isobutyl hydrazine (M serving) to the remaining reaction solution, it is then added to ❹ ❹. Two = A water wash. Next, the organic phase was separated, and then, under reduced pressure, a solvent of 100 was used to obtain 344 parts of a compound (h) having a reactive functional group. The obtained compound had an epoxy equivalent of Μ ^ red 14. The average molecular weight was 3,700, and the viscosity was 600 mPa·s. The appearance was colorless and transparent. The proportion of the stone atomic atoms belonging to the sesquiterpene gas-burning chain segment (relative to all the stone cherries) was calculated to be 19.6 mol% from the (four) sub-combination of the three oxygen atoms calculated by the feed material ratio. Similarly, the proportion of the bond-like polyoxo bond segment was 80.4 mol%. Dependent Example 2 (Example of a reaction in which the relative oxo group 找t is oxidized to 3 ().8 equivalents) The first stage reaction: cold-(3,4-epoxycyclohexyl) Ethyldimethoxydecane 197.1 parts (alkoxy equivalent 82 丨), weight average molecular weight of one A (GPC measured value) of sterol terminal dimercaptopolyoxyl oil 237.4 parts = amount 3060), 0. 5% Κ 0 Η methanol solution 20.0 parts (Κ0 Η parts: j alcohol was charged into the reaction vessel, and the liquid temperature was raised to 75 ° C. After heating, known), the reaction was carried out at 75 ° C for 8 hours. In the reflux phase 2 reaction: after adding 260 parts of methanol, the person was dripped in 32,148,53, and 201020279, 50°. 8 parts of methanol solution was taken at reflux for π hours. And ^ 廉 4士 jk &gt; 〇 〇 ^, after neutralization with 5% aqueous sodium dihydrogen phosphate solution, alcohol. Add M service (10) parts, repeat 3 times twice 'The organic phase is removed under reduced pressure, 100 ° C, and the solvent is obtained by the reactive official Saji Mountain Xuan Lu / Heyi. The block type siloxane compound (A-2) is 36 parts by weight. In 4160, the viscous &amp;% sufficiency is 468 &amp; /, the weight average molecular weight is pendulum, the viscosity is 48 lmp 卞垔 is a halved money smear, and the bond poly (tetra) diatomic ratio is 19.6 Moer%. In the same manner as in Example 3, the # atom_ is 8 G.4 mol%. (Example of the reaction with respect to the oxime-based oxime equivalent) The soil is made into a ratio of 80. 1 equivalent. The first-stage reaction: 厶~. a oxy-stone smoldering 98.6 parts (burning oxygen equivalent hexyl) ethyl trimethyl (GPW fixed value) of the end of the sulphate end = = weight average molecular weight 15 _ 790 〇), 05% K 〇 H methanol soil poly-stone oxygen 'by 118.7 parts (Shixi alcohol 酤 λ = liquid 10. 〇 part (KOH part i Λ field into the reaction vessel 'to make the liquid temperature rise = 〇 · 05 parts) to react at 75 8 for 8 hours. The second-stage reaction under reflux: after adding 142 parts of methanol, 4〇% of the steaming and water sterol solution was 43. 2 parts, and it was made to reflux: the fin was dripped for 8 hours. After the reaction, 'μ, acid dihydrogen sodium The water-soluble C reaction was carried out at 8 ° C to recover the sterol. Adding 9 parts of curry: and then 'washing with water. Then the organic phase was removed under the reduction, just c. Repeat 3: owed to the reactive functional group Inlaid "Wei (four), from this, U, 69. 321483 201020279 The obtained compound has an epoxy equivalent of 4130, a viscosity of 710 mPa · : ^ eq, and the weight average molecular weight is nucleus transparent and colorless and transparent. The ratio of the segment of the segment is 19 6 and the sample is 'chain-like poly-chain segment a 4 the ear is the same as the embodiment 4 atomic ratio is 80_4 mol%. In the case of the decyl alcohol equivalent, the base should be 8.6 equivalents of the ruthenium-based n(3,4'epoxycyclohexyl)ethyltrimethyl sulphide 49.3 parts (burning oxygen equivalent 82i parts (alkane) Oxygen equivalent 66 1), Tongue 曰 | 丞矽 丞矽 卯 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 κ κ κ κ 乂 乂 乂 乂 乂 乂 乂 乂 乂 118 118 118 118 118 118 118 118 118 118 118 118 118 118 Κ0ΗMethanol dissolved (four).. (The number of coffee is: the reaction container is raised to between 75 μL and 75 °; and the temperature is raised, and the reaction is carried out at 75 ° C for 8 hours under reflux. The second stage reaction: adding 123 parts of sterol After that, 43 parts of ❹50% steamed crane water methanol solution was added dropwise in 60 minutes, and it was reacted under reflux for 8 J under reflux. After the reaction was finished, 'after neutralization with 5% aqueous solution of dihydrogen phosphate, after t: The methanol was distilled off, and 191 parts of ΜΙβκ was added, and the water was washed three times. Then, the organic phase was removed under reduced pressure of 1 Torr to obtain a block type oxalate compound having a reactive functional group. (A-4) i 6 8 parts. The epoxy equivalent of the compound was 874 g/eq, the weight average molecular weight was 2630, and the viscosity was 4600 mPa · s. 5摩尔的。 321483 55 The ratio of the atomic atoms belonging to the chain polyoxynoxy group is 77. 5 mol%. 321483 55 2010份。 Example 5 (assuming that the equivalent of alkoxy groups relative to the oxime oxime) is 8.6 equivalents of the anti-different phase 1 reaction oxoxane 49. 3 parts (alkoxy equivalent 82. 丨 ^ oxy % hexyl) ethyl trimethyl ester (alkoxy equivalent: 45.4), weight 岣 岣 甲基 甲基 27 27 27 27. 2 矽 末端 末端 end methyl phenyl phthalate 118 17 〇〇 (GPC measured value) Then, 10.0 parts of the oxime solution (the K 〇 H fraction is known as sterol equivalent 850) and 0.5%, and the liquid temperature was raised to 75 °C. l, ^ 〇 〇 5 know) loaded into the reaction vessel for hours. Reaction at 75 ° C under reflux 8 Phase 2 reaction: additional methanol 50% distilled water methanol solution 43. 2 parts: after 'drip in 8 minutes. After the reaction is over, take 5 . Nasal acid flows down in the muscles and reacts with methanol to recover methanol. After adding MIBK: neutralized aqueous solution, it was washed with water. Next, the organic phase is subjected to a reduced pressure, 1 〇 I, and repeated 3 times == functional group money type money ~ _ parts. The epoxy equivalent of 5850^ is coffee (10), the weight average molecular weight is 461〇mPa.s, and the appearance is colorless and transparent. _ ^ The ratio of the stone atom of the semi-stone compound is 20.0%. In the same way, the W sub-group belonging to the chain (four) oxygen chain segment is the movable Mole %. Example 1 (Comparative to the ratio of the base 1# to the amount of the base 4# to the amount of the substrate), which is the result of gelation in the first stage reaction, and cold (3'4-% oxy group) Cyclohexyl)ethyltrimethoxydecane 37 〇 part 321483 56 201020279 (burning oxygen equivalent 82.1), 畲 芈 芈 secret, ^

醇末端二甲基聚石夕17^刀子I 1〇6〇(GPC測定值)之矽 甲醇、、容液7〇.9份(矽醇當量530)、0.5%KOH =?ϊ7份咖份數為。.06份)裝入反應容器中, 便展皿升兩至75〇r w 後,反應物成在以L下於75°c反應4小時 參考例1 為,奋劑不洛性之凝膠化物(A-6)。 ❹ if存相醇基1當纽氧基成為5· 5當量之比例且在水 的仔在下反應之例) (烧氧將/量Ϊ ^環氧ΐ環已基)乙基三甲氧基石夕烧⑽· 6份 口田-.、重量平均分子量l〇60(GPC測定值)之矽 醇末端二曱基聚石夕氧油118.7份(石夕醇當量53〇)、甲醇i3i 份、0.5% Κ0Η曱醇溶液10·0份⑽份數為⑽份)震入 反應容器中,使液溫升高至75乞。升溫後,以6〇分鐘滴 入5Oi蒸顧水甲醇溶液43. 2份,使其在回流下於π中反 應8小時。反應結束後,以5%磷酸二氫鈉水溶液中和後, ❹ 於80°C下蒸餾回收甲醇。添加MIBK 191份,進行反覆3 次之水洗。接著將有機相在減壓、1〇{rc下去除溶媒,藉此 而得到具有反應性官能基之矽氧烷化合物(A_7)176份。所 得化合物之環氧當量為459g/eq,重量平均分子量為33〇〇, 外觀有白濁發生而無法作為光半導體密封材用組成物使’ 用。 參考例2 (使相對於矽醇基1當量烷氧基成為3〇. 7當量之比例且在 水的存在下反應之例) 321483 57 201020279 與專利文獻1之合成方法同樣操作,將/5-(3, 4-環氧 基環己基)乙基三曱氧基矽烷45.4份(烷氧當量82. 1)、重 量平均分子量6120CGPC測定值)之矽醇末端二曱基聚矽氧 油54. 6份(矽醇當量3060)、三乙基胺10. 0份、MIBK 500 份裝入反應容器中,在室溫下攪拌,將蒸餾水100份以30 分鐘滴入,升溫至80°C後使反應6小時。反應結束後,以 20%填酸二氫納水溶液中和後,進行反覆3次之水洗。接著 將有機相在減壓、l〇〇°C下去除溶媒,得到白濁之液體(A-8) 85份,無法作為光半導體密封材用組成物使用。 © 參考例3 (使相對於矽醇基1當量烷氧基成為31. 0當量之比例且在 水的存在下反應之例) 將/3-(3, 4-環氧基環己基)乙基三曱氧基矽烷78.8份 (烷氧當量82. 1)、重量平均分子量6120(GPC測定值)之矽 醇末端二甲基聚矽氧油94. 0份(矽醇當量3060)、甲醇104 份、0. 5% KOH甲醇溶液8. 0份(KOH份數為0. 04份)裝入反 ^ 應容器中,使液溫升高至75°C。升溫後,以60分鐘滴入 50%蒸餾水曱醇溶液34. 6份,使其在回流下於75°C中反應 8小時。反應結束後,以5%磷酸二氫鈉水溶液中和後,於 80°C下蒸餾回收曱醇。添加MIBK 152份,進行反覆3次之 水洗。接著將有機相在減壓、l〇〇°C下去除溶媒,得到白濁 之液體(A-9)151份,無法作為光半導體密封材用組成物使 用。 參考例4 58 321483 201020279 (使相對於矽醇基1當量烷氧基成為80. 0當量之比例且在 水的存在下反應之例) 將;5-(3, 4-環氧基環己基)乙基三甲氧基矽烷98. 6份 (烷氧當量82. 1)、重量平均分子量15800CGPC'測定值)之 矽醇末端二甲基聚矽氧油118. 7份(矽醇當量7900)、甲醇 142份、0. 5% ΚΟΗ曱醇溶液10. 0份(ΚΟΗ份數為0. 05份) 裝入反應容器中,使液溫升高至75°C。升溫後,以60分 鐘滴入50%蒸餾水甲醇溶液43.2份,使其在回流下於75 ❹ °C中反應8小時。反應結束後,以5%磷酸二氳鈉水溶液中 和後,於80°C下蒸餾回收甲醇。添加MIBK 191份,進行 反覆3次之水洗。接著將有機相在減壓、100°C下去除溶 媒,得到白濁之液體(A-10)189份。 比較例2 使用下述式(5)所示末端為烷氧基之聚矽氧油以取代 實施例1至5所使用式(2)之矽醇末端聚矽氧油,進行合成。 H3C-0-4—Si—0-j—CH3 (5) ^ ch3 /m 將万-(3, 4-環氧基環己基)乙基三曱氧基矽烷37. 0份 (烷氧當量82. 1)、重量平均分子量2500(GPC測定值)之甲 氧基末端二甲基聚矽氧油63. 1份(烷氧當量1250)、甲醇 64份、0. 5% KOH甲醇溶液5. 0份(KOH份數為0. 025份)裝 入反應容器中,使液溫升高至75°C。升溫後,以60分鐘 59 321483 201020279 滴入5 0 %蒸顧水甲醇溶液16. 2份,使其在回流下於7 5 °C中 反應8小時。反應結束後,以5%磷酸二氫鈉水溶液中和後, 於80°C下蒸餾回收甲醇。添加MIBK88份,進行反覆3次 之水洗。接著將有機相在減壓、100°C下去除溶媒,得到白 濁之液體(A-11)80. 6份,無法作為光半導體密封材用組成 物使用。 將實施例1至5、比較例1、2以及參考例1至4所得 樹脂A-1至A-Π之性狀歸納於表1。 表1 化合物 添加當量值 (烧氧基/碎醇基) 實施例1 A-1 5.3 實施例2 A-2 30.8 實施例3 A-3 80.1 實施例4 A-4 8.6 實施例5 A-5 8.6 比較例1 A-6 1.4 參考例1 A-7 5.5 參考例2 A-8 30.7 參考例3 A-9 31.0 參考例4 A-10 80.0 比較例2 A-11 — 環氧當量 分子量 性狀 457 3700 無色透明液體 468 4160 無色透明液體 447 4130 無色透明液體 874 2630 無色透明液體 832 5830 無色透明液體 — — 凝膠化物 — — 白濁液體 — — 白濁液體 — — 白濁液體 — — 白濁液體 — — 白濁液體 由上述結果,可確認使通式(1)所示化合物與通式(2) 所示化合物之烷氧基/矽醇基所饋入當量值設為1.4之比 較例1成為溶劑不溶性之凝膠化物,無法作為環氧樹脂使 用。另外,通式(1)所示化合物與通式(2)所示化合物一次 加入鹼觸媒與水而合成之參考例1、參考例2、參考例3、 參考例4(A-7、A-8、A-9、A-10)成為白濁液體,可確認並 60 321483 201020279 不適用為光學用途。更且,使用末端具有燒氧其之聚石夕# 油的式(5)化合物取代通式(2)所示化合物二為‘狀聚 鏈段之A-ll(比較例2)亦成為白濁液體,矣】定不適用為光 學用途。另一方面,使通式(υ、通式(2)所二化=物二2 階段反應之實施例1至3(Α-1、Α-2、Α〜3)與使通式(1)、 (2)以及(3)所示化合物以2階段反應之實施例4、5(A_4、 A-5)可得無色透明之樹脂’可確認適用為光學用途。 比較例3 ❹ ❹ 如考慮以一曱基珍乳烧為早元構造時,則以使用下述 式(6)之二甲基二曱氧矽烷作為原料’並使化合物中所含二 甲基矽氧烷單元構造之含量濃度(莫耳成為°與上述實施 例1至3相同之濃度(莫耳%)進行合成。 ch3 (6) H3C—0—Si—O-CH-s CH, 合成係與專利文獻i所記載之方法同樣操作,將’ =環氧基環己基)乙基三甲氧基石夕燒33·9份(燒氧當量 =•1)、二甲基二甲氧魏(炫氧當量心)、 ^ ^麵5〇0份裳入反應容器中,在室溫下攪拌’將蒸顧 30分鐘滴入,升溫至8(rc後使反應6小時。 反應、.、《束後,以20%磷酸二氫鈉水溶液 覆3 次之水洗。接著將有機相在減壓、⑽ 具有反應性官能基之錢燒化合物(“2):= 321483 61 201020279 物之%氧當量為459g/eq,重量平均分子量為940,外觀為 無色透明。 實施例6 (使相對於石夕醇基i當量燒氧基成為3· 8當量之比例而反應 之例) ^第1階段反應:將汐-(3, 4-環氧基環己基)乙基三甲 氧基碎燒147. 8份(燒氣當量82.丨)、重量平均分子量1060 &lt;^PC測疋值)之石夕醇末端二甲基聚矽氧油252. 8份(矽醇當 置356)、0· 5% Κ0Η甲醇溶液2〇. 〇份(K〇H份數為〇. 1份) 裝入反應谷器中,使液溫升高至75它。升溫後,在回流下 於75°C反應8小時。 第2階段反應·追加甲醇255份後,以⑼分鐘滴入 50/。洛餾水甲醇溶液64. 8份’使其在回流下於75。〇中反應 8小時。反應結束後,以5%磷酸二氫鈉水溶液中和後,於 8〇。(:下蒸鶴回收曱醇。添加ΜΙβΚ 352份,進行反覆3次之 水洗。接著將有機相在減壓、1〇〇。〇下去除溶媒,藉此而^ 到具有反應性官能基之嵌段型石夕氧烧化合物(a_13)333于 份。所得化合物之環氧當量為578g/eq,重量平均分子旦 為5250,黏度為257mPa.s,外觀為無色透明。 里 屬於倍㈣氧賴段之⑦料比㈣149莫耳% 樣地,屬於鏈狀聚石夕氧鏈段之石夕原子比例為奶 冋 比較例4 、咔%。 如考慮以二甲基石夕氧烧為單元構造時,則以使用 式(6)之二甲基二甲氧魏作為原料並使化合物中所含二4 321483 62 201020279 甲基矽氧烷單元構造之含量遭度(莫耳%)成為與上述實施 例6相同之濃度(莫鼻幻進行合成。Alcohol terminal dimethyl polyphosphonium 17 ^ knife I 1 〇 6 〇 (GPC measured value) 矽 methanol, liquid solution 7 〇. 9 parts (sterol equivalent 530), 0.5% KOH = ϊ 7 parts of coffee for. .06 parts) was charged into the reaction vessel, and after the dish was raised by two to 75 〇rw, the reactant was reacted at 75 ° C for 4 hours under L. Reference Example 1 was a gelling agent ( A-6). ❹ if the phase of the alcohol group 1 when the neooxyl is 5 to 5 equivalents and in the case of the reaction of water in the case) (burning oxygen / amount Ϊ ^ epoxy fluorenyl) ethyl trimethoxy sulphur (10)· 6 parts of mouth--, weight average molecular weight l〇60 (GPC measured value) of sterol-terminated dimercapto-polyoxyl oil 118.7 parts (incineration of 53 〇), methanol i3i parts, 0.5% Κ0Η曱The alcohol solution 10·0 parts (10) parts (10) parts were shaken into the reaction vessel to raise the liquid temperature to 75 Torr. After the temperature was raised, 43.2 parts of a 50 M aqueous methanol solution was added dropwise thereto over 6 minutes, and it was allowed to react under reflux for 8 hours under π. After completion of the reaction, the mixture was neutralized with a 5% aqueous sodium dihydrogen phosphate solution, and then methanol was distilled off at 80 °C. 191 parts of MIBK were added and washed three times. Next, the organic phase was subjected to a solvent under reduced pressure at 1 Torr to obtain 176 parts of a oxoxane compound (A-7) having a reactive functional group. The obtained compound had an epoxy equivalent of 459 g/eq and a weight average molecular weight of 33 Å, and the appearance was white turbidity and could not be used as a composition for an optical semiconductor sealing material. Reference Example 2 (Example in which 1 equivalent of alkoxy group relative to a sterol group is 3 〇. 7 equivalents and reacted in the presence of water) 321483 57 201020279 The same operation as the synthesis method of Patent Document 1, /5- (3, 4-Ethoxycyclohexyl)ethyltrimethoxy decane 45.4 parts (alkoxy equivalent weight 82.1), weight average molecular weight 6120 CGPC measured value) sterol terminal dimercapto polyoxyl sulfonate 54. 6 Parts (sterol equivalent 3060), triethylamine 10.0 parts, MIBK 500 parts were placed in a reaction vessel, stirred at room temperature, and 100 parts of distilled water was added dropwise over 30 minutes, and the temperature was raised to 80 ° C to react. 6 hours. After completion of the reaction, the mixture was neutralized with a 20% aqueous solution of dihydrogen chloride, and washed with water three times. Then, the organic phase was removed under reduced pressure at 10 ° C to obtain 85 parts of a white turbid liquid (A-8), which was not used as a composition for an optical semiconductor sealing material. © Reference Example 3 (Example of making 1 equivalent of alkoxy group relative to sterol group to 31.0 equivalents and reacting in the presence of water) /3-(3,4-Ethoxycyclohexyl)ethyl 7 parts of tridecyloxydecane (alkoxy equivalent: 82.1), weight average molecular weight 6120 (GPC measured value) of sterol terminal dimethyl polyfluorene oxide 94.0 parts (sterol equivalent 3060), methanol 104 parts 0. 5% KOH methanol solution 8. 0 parts (KOH part is 0.04 parts) was placed in the reaction container to raise the liquid temperature to 75 °C. After the temperature was raised, 34.6 parts of a 50% distilled water sterol solution was added dropwise thereto over 60 minutes, and the mixture was reacted at 75 ° C for 8 hours under reflux. After completion of the reaction, the mixture was neutralized with a 5% aqueous sodium dihydrogen phosphate solution, and then decyl alcohol was distilled at 80 °C. 152 parts of MIBK were added and washed three times. Then, the organic phase was removed under reduced pressure at 10 ° C to obtain 151 parts of a white turbid liquid (A-9), which was not used as a composition for an optical semiconductor sealing material. Reference Example 4 58 321483 201020279 (Example in which 1 equivalent of alkoxy group relative to a sterol group is made to a ratio of 80. 0 equivalent and reacted in the presence of water) 5-(3,4-epoxycyclohexyl) 7份(矽醇当量7900), methanol, ethyl methoxy methoxy decane 98. 6 parts (alkoxy equivalents 82.1), weight average molecular weight 15800 CGPC 'determination value) sterol terminal dimethyl polyfluorene oxide 118. 7 parts (sterol equivalent 7900), methanol 142 parts, 0.5% sterol solution 10.0 parts (parts of 0.05 parts) were charged into the reaction vessel to raise the temperature to 75 °C. After the temperature was raised, 43.2 parts of a 50% distilled water methanol solution was added dropwise thereto at 60 minutes, and the mixture was reacted at 75 ° C for 8 hours under reflux. After completion of the reaction, the mixture was neutralized with a 5% aqueous solution of sodium diphosphate phosphate, and then methanol was distilled off at 80 °C. 191 parts of MIBK were added and washed three times. Then, the organic phase was removed under reduced pressure at 100 ° C to obtain 189 parts of a white turbid liquid (A-10). Comparative Example 2 A polyoxyphthalic acid ester having an alkoxy group represented by the following formula (5) was used instead of the decyl alcohol-terminated polyoxyxene oil of the formula (2) used in Examples 1 to 5 to carry out the synthesis. H3C-0-4—Si—0—j—CH3 (5) ^ ch3 /m 10,000-(3,4-epoxycyclohexyl)ethyltrimethoxy decane 37.0 parts (alkoxy equivalent 82 5% KOH溶液溶液 5. 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 The fraction (0.0 parts by weight of KOH) was placed in a reaction vessel to raise the temperature of the liquid to 75 °C. After the temperature was raised, 16.2 parts of a 50% aqueous methanol solution was added dropwise thereto at 60 minutes, 59 321483, 201020279, and allowed to react at 75 ° C for 8 hours under reflux. After completion of the reaction, the mixture was neutralized with a 5% aqueous sodium dihydrogen phosphate solution, and then methanol was distilled off at 80 °C. 88 parts of MIBK were added and washed three times with repeated washing. Then, the organic phase was removed under reduced pressure at 100 ° C to obtain a white turbid liquid (A-11) of 80.6 parts, which was not used as a composition for an optical semiconductor sealing material. The properties of the resins A-1 to A-Π obtained in Examples 1 to 5, Comparative Examples 1 and 2, and Reference Examples 1 to 4 are summarized in Table 1. Table 1 Compound Addition Equivalent Value (Alkoxy/Calcitol Group) Example 1 A-1 5.3 Example 2 A-2 30.8 Example 3 A-3 80.1 Example 4 A-4 8.6 Example 5 A-5 8.6 Comparative Example 1 A-6 1.4 Reference Example 1 A-7 5.5 Reference Example 2 A-8 30.7 Reference Example 3 A-9 31.0 Reference Example 4 A-10 80.0 Comparative Example 2 A-11 — Epoxy Equivalent Molecular Weight Property 457 3700 Colorless transparent liquid 468 4160 Colorless transparent liquid 447 4130 Colorless transparent liquid 874 2630 Colorless transparent liquid 832 5830 Colorless transparent liquid - gelled - white turbid liquid - white turbid liquid - white turbid liquid - white turbid liquid - white turbid liquid by the above As a result, it was confirmed that Comparative Example 1 in which the alkoxy/sterol group of the compound represented by the formula (1) and the alkoxy group/sterol group of the compound represented by the formula (2) were fed was made into a solvent-insoluble gel. Cannot be used as an epoxy resin. Further, Reference Example 1, Reference Example 2, Reference Example 3, and Reference Example 4 (A-7, A) in which a compound represented by the formula (1) and a compound represented by the formula (2) are added with a base catalyst and water at a time. -8, A-9, A-10) become a turbid liquid, can be confirmed and 60 321483 201020279 is not suitable for optical use. Further, A-ll (Comparative Example 2) in which the compound represented by the formula (2) is substituted with the compound of the formula (2) having the oxygenated gas of the compound (2) at the end is also a white turbid liquid. , 矣] is not suitable for optical use. On the other hand, the general formula (1, 3, Α-1, Α-2, Α~3) of the general formula (υ, the general formula (2) = the two-stage reaction of the second step 2) The compounds shown in (2) and (3) can be obtained as colorless and transparent resins by using the two-stage reaction of Examples 4 and 5 (A_4, A-5). Comparative Example 3 ❹ ❹ When the sulphur is calcined in the early structure, the dimethyl dioxane which uses the following formula (6) is used as a raw material 'and the content concentration of the dimethyl methoxy siloxane unit structure contained in the compound ( Mohr was synthesized at the same concentration (mol%) as in the above Examples 1 to 3. ch3 (6) H3C-0-Si-O-CH-s CH, and the synthesis system was the same as the method described in Patent Document i. Operation, '=epoxycyclohexyl)ethyltrimethoxy zebra burned 33.9 parts (burning oxygen equivalent =•1), dimethyldimethoxy-we (throwing oxygen equivalent), ^^face 5〇 0 parts were put into the reaction vessel and stirred at room temperature. The mixture was added dropwise for 30 minutes, and the temperature was raised to 8 (the reaction was allowed to proceed for 6 hours after rc. Reaction, . . , after the bundle, covered with 20% aqueous sodium dihydrogen phosphate solution 3 times of washing. Then will The machine phase is under reduced pressure, (10) the money-burning compound having a reactive functional group ("2):= 321483 61 201020279 has a % oxygen equivalent of 459 g/eq, a weight average molecular weight of 940, and is colorless and transparent in appearance. Example 6 ( An example of reacting with an equivalent of an alkoxy group in an equivalent ratio of alkoxyl group to 3.8 equivalents) ^1st stage reaction: ruthenium-(3,4-epoxycyclohexyl)ethyltrimethoxy 8份(矽醇为置356), burned 147. 8 parts (burning gas equivalent 82. 丨), weight average molecular weight 1060 &lt; ^ PC measured value) 0· 5% Κ0Η MeOH solution 2 〇. 〇 (K 〇H part is 〇. 1 part) into the reaction bar, the liquid temperature is raised to 75. After heating, under reflux at 75 ° C The reaction was carried out for 8 hours. In the second-stage reaction, 255 parts of methanol was added, and then 50/min was added dropwise in (9) minutes. 64 parts of the methanol solution of the cold-distilled water was allowed to react under reflux for 75 hours in 75. After the reaction was completed. After neutralizing with 5% aqueous solution of sodium dihydrogen phosphate, it was recovered at 8 〇. (: The oxime was recovered by steaming the crane. 352 parts of ΜΙβΚ was added, and the washing was repeated three times. Then the organic phase was reduced. Pressing, 1 〇〇. The solvent is removed under the crucible, whereby the block type oxalate compound (a-13) having a reactive functional group is 333 parts by weight. The obtained compound has an epoxy equivalent of 578 g/eq, and the weight average The molecular denier is 5250, the viscosity is 257mPa.s, and the appearance is colorless and transparent. The ratio of the material in the octave (four) oxygen lag is (149) 149 mol%. The sample is the proportion of the stone atom of the chain polystone.冋Comparative Example 4, 咔%. When considering the structure of dimethyl oxalate as a unit, the dimethyl dimethyl oxime of formula (6) is used as a raw material and the compound contains 2 4 321483 62 201020279 The content of the methyloxane unit structure (% by mole) became the same concentration as that of the above Example 6 (the synthesis was carried out by Mo Yan.

合成係與專利文獻1所記載之方法同樣操作,將石-(3, 4-環氧基環己基)乙基三甲氧基矽烷26. 6份(烷氧當量 ❹82. 1)、二甲基二甲氧矽烷73· 4份(烷氧當量60. 1)、三乙 基胺10.0份、MIBK 500份襞入反應容器中,在室溫下攪 拌,將蒸餾水1〇〇份以30分鐘滴入,升溫至8〇〇c後使反 應6小時。反應結束後,以20%填酸二氫鈉水溶液中和後, 進行反覆3次之水洗。接著將有機相在減壓、丨⑽。c下去除 溶媒,得到具有反應性官能基之矽氧烷化合物(A_14)6〇 份。所得化合物之環氧當量為561g/eq,重量平均分子量 ❹為830 ’外觀為無色透明。 實施例7 (使相對於石夕醇基1 之例) 虽量燒氧基成為4. 8當量之此例而反應 第1階段反應: 氧基矽烷59. 1份 將点-(3, 4-環氧基環己基)乙基三甲 (GPC測定值)之發醇 當量 850)、0.5%κ〇η 裝入反應容器中, 1份(烷氧當量82. υ、重量平均分子量1 =矽醇末端甲基苯基聚矽氧油W 5%Κ〇Η甲辟、........... 〇物(石夕醇 j氧^量82.1)、重量平均分子量17〇〇 末端甲基苯基料氧油13M份( 甲醇溶液10. 〇份(KOH份數為〇 甲醇溶液10. 〇份(KOH份數為〇 中’使液溫升高至75。°。升溫後,在丄 功483 63 201020279 於75°C反應8小時。 第2階段反應:追加曱醇135份後,以60分鐘滴入 50%蒸餾水甲醇溶液25. 9份,使其在回流下於75°C中反應 8小時。反應結束後,以5%磷酸二氫鈉水溶液中和後,於 80°C下蒸餾回收曱醇。其後,為了清洗而添加MIBK 170 份,進行反覆3次之水洗。接著將有機相在減壓、100°C下 去除溶媒,藉此而得到具有反應性官能基之嵌段型矽氧烷 化合物(A-15)162份。所得化合物之環氧當量為707g/eq, 重量平均分子量為2680,黏度為727mPa · s,外觀為無色 Θ 透明。 屬於倍半矽氧烷鏈段之矽原子比例為13.6莫耳%。同 樣地,屬於鏈狀聚矽氧鏈段之矽原子比例為86.4莫耳%。 實施例8至13、比較例5至7 將上述合成之矽氧烷化合物(A-1至3、12至15之任 一者)或以往光半導體密封用所使用之市售的脂環型環氧 樹脂(ERL-4221)、硬化劑(B-1至B-3)或者硬化劑(B-3)與 ^ 硬化促進劑C-1兩者,以表2、3、4或5所示重量份進行 混合,得到本發明之實施例8至13以及比較例5至7之組 成物。 表2所記載之實施例以及比較例係如下述。 實施例8 :使用化合物A-1與硬化劑B-1之組成物 實施例9 :使用化合物A-2與硬化劑B-1之組成物 實施例10 :使用化合物A-3與硬化劑B-1之組成物 比較例5 :使用化合物A-12與硬化劑B-1之組成物 64 321483 201020279 比較例6 :使用ERL-4221與硬化齊彳Β-l之組成物 表3所記載之實施例以及比較例係如下述。 實施例11 :使用化合物A-13、硬化劑B-3以及硬化促進剩 C-1之組成物 比較例7 :使用化合物A-14、硬化劑B-3以及硬化促進劑 C-1之組成物 表4所記載之實施例以及比較例係如下述。 實施例12 :使用化合物A-15、硬化劑B-3以及硬化促進劑 ❹ C-1之組成物 表5所記載之實施例以及比較例係如下述。 實施例13 :使用化合物A-13、硬化劑B-3以及硬化促進劑 C-1之組成物 比較例6 :使用ERL-4221與硬化劑B-1之組成物 對於實施例8至13、比較例5直7中所得硬化性樹脂 組成物進行下述穿透率試驗、機械特性試驗(動態黏彈性試 ◎ 驗)、LED照明試驗,將其結果示於表2、3、4、5。 (UV耐久性穿透率試驗) 將實施例8至13、比較例5至7所得之硬化性樹脂組 成物實施真空脫泡20分鐘後,輕輕地倒入底面直徑5cm, 高度2cm之鋁箔杯中鑄造。將該鑄造物在預定之硬化條件 下放入烤箱中使之硬化,得到厚度2mm之穿透性用試驗片。 使用該等試驗片,經由分光光度計測定紫外線照射前後之 穿透率(測定波長:375nm、400nm、465nm),算出其變化率。 紫外線照射條件如下。 65 321483 201020279 紫外線照射機:EYE SUPER UV TESTER SUV-Wll 溫度:60°c 照射能量:65mW/cm2 照射時間:100小時 (熱对久性穿透率試驗) 將實施例8至13、比較例5至7所得之硬化性樹月'会 成物實施真空脫泡20分鐘後,輕輕地倒入底面直經 高度2cm之鋁箔杯中鑄造。將該鑄造物在預定之硬化條件 下放入烤箱中使之硬化’得到厚度2mm之穿透性用試檢 片。使用該等試驗片,以分光光度計測定於l5(rc烤箱中 放置96小時前後之穿透率(測定波長:375nm、400i!in、 465nm),算出其變化率。 (機械特性試驗) 將實施例8至13、比較例5至7所得之硬化性樹脂組 成物實施真空脫泡20分鐘後,輕輕地倒入寬7mm、長5cm、 厚度約800 # m之試驗片用模型中鑄造,然後從上方以聚酿 亞胺膜蓋住。將該鑄造物依表2、3記載之硬化條件硬化而 得到動態黏彈性用試驗片。使用該等試驗片,依下述條件 實施動態黏彈性試驗。 測定條件 動態黏彈性測定器:TA-instrument製,DMA-2980 測定溫度範圍:-30°C至280°C 升溫速度:2t:/分鐘 試驗片尺寸:使用切成5mmx50mm者(厚度約gooAm)。 66 321483 201020279 解析條件:The synthesis system is operated in the same manner as in the method described in Patent Document 1, 2. 6 parts (alkoxy equivalent ❹ 82.1), dimethyl 2 7 parts of methoxydecane (alkoxy equivalent of 60.1), 10.0 parts of triethylamine, and 500 parts of MIBK were poured into a reaction vessel, and stirred at room temperature, and 1 part of distilled water was added dropwise thereto for 30 minutes. The temperature was raised to 8 ° C and the reaction was allowed to proceed for 6 hours. After completion of the reaction, the mixture was neutralized with a 20% aqueous solution of sodium hydrogencarbonate, and washed with water three times. The organic phase is then depressurized and enthalpy (10). The solvent was removed under c to obtain 6 parts of a oxoxane compound (A-14) having a reactive functional group. The obtained compound had an epoxy equivalent of 561 g/eq and a weight average molecular weight of 830 Å. The appearance was colorless and transparent. Example 7 (Example of relative to the base of the alcoholic group 1) Although the amount of the alkoxy group is 4.8 equivalents and the reaction of the first stage reaction: oxydecane 59. 1 part will be a point - (3, 4- Epoxycyclohexyl)ethyltrimethyl (GPC measurement), alcohol equivalent 850), 0.5% κ〇η charged into the reaction vessel, 1 part (alkoxy equivalent 82. υ, weight average molecular weight 1 = sterol end Methyl phenyl polyfluorene oxide W 5% Κ〇Η 辟 , ........... 〇 ( 石 石 石 石 ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( 13 M parts of phenyloxyl oil (methanol solution 10. 〇 parts (the KOH fraction is 〇 methanol solution 10. 〇份 (the KOH fraction is 〇中', the liquid temperature is raised to 75 ° °. After heating up, 483 63 201020279 Reaction at 75 ° C for 8 hours. Stage 2 reaction: After adding 135 parts of decyl alcohol, 25.9 parts of 50% distilled water methanol solution was added dropwise over 60 minutes, and it was reacted under reflux at 75 ° C. After the completion of the reaction, the mixture was neutralized with a 5% aqueous sodium dihydrogen phosphate solution, and then decyl alcohol was distilled off at 80 ° C. Thereafter, 170 parts of MIBK was added for washing, and water washing was repeated three times. Under decompression The solvent was removed at 100 ° C, thereby obtaining 162 parts of a block type oxoxane compound (A-15) having a reactive functional group. The obtained compound had an epoxy equivalent of 707 g/eq, a weight average molecular weight of 2680, and a viscosity. The appearance was 727 mPa · s, and the appearance was colorless 透明 transparent. The proportion of ruthenium atoms belonging to the sesquioxane chain segment was 13.6 mol%. Similarly, the proportion of ruthenium atoms belonging to the chain polyoxynene segment was 86.4 mol%. Examples 8 to 13 and Comparative Examples 5 to 7 Commercially available alicyclic rings for use in the above-described synthesized oxoxane compounds (any of A-1 to 3, 12 to 15) or conventional optical semiconductors. Oxygen resin (ERL-4221), hardener (B-1 to B-3) or hardener (B-3) and ^ hardening accelerator C-1, as shown in Table 2, 3, 4 or 5 The mixture was mixed to obtain the compositions of Examples 8 to 13 and Comparative Examples 5 to 7. The examples and comparative examples described in Table 2 are as follows. Example 8: Using Compound A-1 and Hardener B Composition of -1 Example 9: Composition using Compound A-2 and Hardener B-1 Example 10: Composition using Compound A-3 and Hardener B-1 Comparative Example 5: Composition using Compound A-12 and Hardener B-1 64 321483 201020279 Comparative Example 6: Composition using ERL-4221 and hardened 彳Β-l Example and Comparative Example described in Table 3 The following are the following. Example 11: Composition using Compound A-13, Hardener B-3, and hardening promoting residual C-1 Comparative Example 7: Using Compound A-14, Hardener B-3, and Hardening Accelerator C- The composition and the comparative examples described in Table 4 of the composition are as follows. Example 12: Use of Compound A-15, Hardener B-3, and Curing accelerator 组成 Composition of C-1 The examples and comparative examples described in Table 5 are as follows. Example 13: Composition using Compound A-13, Hardener B-3, and Hardening Accelerator C-1 Comparative Example 6: Composition using ERL-4221 and Hardener B-1 For Examples 8 to 13, The curable resin composition obtained in Example 5 was subjected to the following transmittance test, mechanical property test (dynamic viscoelasticity test), and LED illumination test, and the results are shown in Tables 2, 3, 4, and 5. (UV Durability Transmittance Test) The curable resin compositions obtained in Examples 8 to 13 and Comparative Examples 5 to 7 were subjected to vacuum defoaming for 20 minutes, and then gently poured into an aluminum foil cup having a bottom surface diameter of 5 cm and a height of 2 cm. Casting in. The cast product was placed in an oven under predetermined hardening conditions to be hardened to obtain a test piece for penetration of 2 mm in thickness. Using these test pieces, the transmittance (measuring wavelength: 375 nm, 400 nm, 465 nm) before and after ultraviolet irradiation was measured by a spectrophotometer, and the rate of change was calculated. The ultraviolet irradiation conditions are as follows. 65 321483 201020279 UV irradiation machine: EYE SUPER UV TESTER SUV-Wll Temperature: 60°c Irradiation energy: 65mW/cm2 Irradiation time: 100 hours (heat versus long-term penetration test) Examples 8 to 13 and Comparative Example 5 The sclerosing tree obtained by the method of 7 was subjected to vacuum defoaming for 20 minutes, and then gently poured into an aluminum foil cup having a bottom surface height of 2 cm and cast. The cast product was placed in an oven under predetermined hardening conditions to be hardened to obtain a test piece for penetration of a thickness of 2 mm. Using these test pieces, the transmittance (measurement wavelength: 375 nm, 400 i! in, 465 nm) at a time of 96 hours in a rc oven was measured by a spectrophotometer, and the rate of change was calculated. (Mechanical property test) The hardened resin compositions obtained in Examples 8 to 13 and Comparative Examples 5 to 7 were subjected to vacuum defoaming for 20 minutes, and then gently poured into a test piece having a width of 7 mm, a length of 5 cm, and a thickness of about 800 #m, and then casting in a model, and then The test piece was covered with a polyimide film. The test piece was cured under the curing conditions described in Tables 2 and 3 to obtain a test piece for dynamic viscoelasticity. Using these test pieces, a dynamic viscoelasticity test was carried out under the following conditions. Measurement conditions Dynamic viscoelasticity tester: TA-instrument, DMA-2980 Measurement temperature range: -30 ° C to 280 ° C Heating rate: 2 t: / min Test piece size: use cut into 5 mm x 50 mm (thickness about gooAm). 66 321483 201020279 Analysis conditions:

Tg :以ΜΑ測定之Tan-5波峰點為Tg。 -30°C彈性率:測定-30°C時之彈性率。 (LED照明試驗) 將實施例8至13、比較例5至7所得硬化性樹脂組成 物實施真空脫泡20分鐘後,錢於注射器並使用精密吐出 裝置’在搭載有具發光波長375nm之發光元件的表面封裝 型LED中鑄造。其後,在預定之硬化條件下使之硬化,得 Ό到照明試驗用LED。照明試驗係為了進行加速條件下之試 驗,而在相當於規定電流之3倍的60lnA下進行照明試驗。 詳細條件係如下所示。測定項目係將1〇〇小時昭明前後之 照度使用積分球測定,算出照度之維持率。再二1〇〇小時 照明後’觀察發光元件之表面狀態。 、 [照明之詳細條件] 發光波長:375nm ❹驅動方式:定電流方式、60mA(發光元件之規定電流為施a) 驅動環境:25°C、65% 321483 67 201020279 表2 實施例8實施例9實施例10比較例5比較例6 (調配) 化合物A-1 100 ....... _ _ _ 化合物A-2 化合物A-3 — 100 100 . .. 化合物A-12 — — — 100 — ERL-4221 — — — — 100 硬化劑B-1 30. 5 30. 0 31. 1 30. 3 — 硬化劑B-2 — — — — 71.8 (機械特性試驗) Tg 113 113 116 92 254 -30°C彈性率 1449 1515 1615 1801 4567 表面黏性 無 無 益 無 無 (UV耐久性穿透試驗) 375nra 95% 95% 95% 94% 72% 穿透維持率 400nm 98% 98% 98% 96% 76% 穿透維持率 465nm 100% 100% 100% 99% 90% 穿透維持率 *硬化劑B-1 :硬化劑係預先準備1,3, 4-環己烷三羧酸-3, 4-酐(三菱氣體化學(股)製造之「Η-TMA」)30份與甲基六氫鄰 苯二曱酸酐、六氫鄰苯二甲酸酐之混合物的「MH-700G」(新 日本理化(股)製造)70份混合之物作為硬化劑B-1。 *硬化劑B-2:硬化劑係預先準備1,3, 4-環己烷三羧酸-3, 4-酐(三菱氣體化學(股)製造之「H-TMA」)50份與曱基六氫鄰 苯二曱酸酐、六氫鄰苯二曱酸酐之混合物的「MH-700G」(新 日本理化(股)製造)50份混合之物作為硬化劑B-2。 *ERL-4221 :陶氏化學公司製造之脂環型環氧樹脂。 *硬化條件:120°C 2hr+140°C 2hr(實施例 8、9、10、比 較例5、6) *Tg之單位為[°C]、-30°C彈性率之單位為[MPa]。 68 321483 201020279 由以上結果可知,使用以2階段反應合成之本發明的 矽氧烷化合物(A)的實施例8至10之硬化性樹脂組成物, 相較於使用與二甲基矽氧烷單元構造之含量濃度(莫耳°/〇) 相同的化合物之比較例5,Tg較高且财熱性優異,並且低 溫下之彈性率減低,係耐熱性、低彈性率特性優異者。更 且,相較於以往之脂環式環氧樹脂的比較例6,可確認其 耐光性、低彈性率特性更優越。Tg: The Tan-5 peak point measured by ΜΑ is Tg. -30 ° C modulus: the modulus of elasticity at -30 ° C was measured. (LED illumination test) The curable resin compositions obtained in Examples 8 to 13 and Comparative Examples 5 to 7 were subjected to vacuum defoaming for 20 minutes, and then a precise discharge device was used in a syringe to mount a light-emitting element having an emission wavelength of 375 nm. Cast in a surface-mount LED. Thereafter, it is hardened under predetermined hardening conditions to obtain an LED for illumination test. In the illumination test, an illumination test was performed at 60 lnA equivalent to three times the predetermined current in order to perform the test under accelerated conditions. The detailed conditions are as follows. The measurement item was measured by using an integrating sphere for the illuminance around 1 hour and before and after the illumination, and the illuminance retention rate was calculated. After another two hours, after illumination, the surface state of the light-emitting element was observed. [Detailed conditions of illumination] Illumination wavelength: 375 nm ❹ Drive mode: constant current mode, 60 mA (specified current of light-emitting element is a) Driving environment: 25 ° C, 65% 321483 67 201020279 Table 2 Example 8 Example 9 Example 10 Comparative Example 5 Comparative Example 6 (Formulation) Compound A-1 100 ....... _ _ _ Compound A-2 Compound A-3 - 100 100 . . . Compound A-12 — — — 100 — ERL-4221 — — — — 100 Hardener B-1 30. 5 30. 0 31. 1 30. 3 — Hardener B-2 — — — — 71.8 (Mechanical property test) Tg 113 113 116 92 254 -30° C modulus 1449 1515 1615 1801 4567 Surface viscosity is no benefit (UV durability penetration test) 375nra 95% 95% 95% 94% 72% penetration maintenance rate 400nm 98% 98% 98% 96% 76% wear Permeation maintenance rate 465nm 100% 100% 100% 99% 90% Penetration maintenance rate* Hardener B-1: Hardener is prepared by preparing 1,3, 4-cyclohexanetricarboxylic acid-3, 4-anhydride (Mitsubishi) "MH-700G" ("Nippon Chemical and Chemical Co., Ltd."), which is a mixture of 30 parts of methyl hexahydrophthalic anhydride and hexahydrophthalic anhydride, manufactured by Gas Chemical Co., Ltd. 70 parts of the mixture was used as curing agent B-1. * Hardener B-2: Hardener is prepared by preliminarily preparing 1,3, 4-cyclohexanetricarboxylic acid-3, 4-anhydride ("H-TMA" manufactured by Mitsubishi Gas Chemical Co., Ltd.) "MH-700G" (manufactured by Shin Nippon Chemical & Chemical Co., Ltd.) of a mixture of hexahydrophthalic anhydride and hexahydrophthalic anhydride was used as a hardener B-2. *ERL-4221: An alicyclic epoxy resin manufactured by The Dow Chemical Company. * Hardening conditions: 120 ° C 2 hr + 140 ° C 2 hr (Examples 8, 9, 10, Comparative Examples 5, 6) * The unit of Tg is [°C], and the unit of modulus of elasticity at -30 °C is [MPa] . 68 321483 201020279 From the above results, it is understood that the curable resin compositions of Examples 8 to 10 using the oxoxane compound (A) of the present invention synthesized in a two-stage reaction are used as compared with the dimethyl siloxane unit. Content Concentration of Structure (Mohr/〇) Comparative Example 5 of the same compound has a high Tg and excellent heat recovery, and has a low elastic modulus at a low temperature, and is excellent in heat resistance and low modulus. Further, in Comparative Example 6 of the conventional alicyclic epoxy resin, it was confirmed that the light resistance and the low modulus of elasticity were superior.

69 321483 201020279 表369 321483 201020279 Table 3

(調配) 化合物A-13 化合物A-14 硬化劑B-3 硬化促進劑C-1 (機械特性試驗)(Formulation) Compound A-13 Compound A-14 Hardener B-3 Hardening accelerator C-1 (mechanical property test)

Tg -30°C彈性率 表面黏性 (UV耐久性穿透試驗) 375nm 穿透維持率 400nm 穿透維持率 465nra 穿透維持率 (熱耐久性穿透試驗) 375nm 穿透維持率 400nm 穿透維持率 465nm 穿透維持率 (硬化後重量變化)13) 重量保持率 實施例11比較例7 100 -- 100 28. 9 29. 9 0.1 0· 1 97.4% 84.0% 99. 1% 89. 4% 100% 96. 1°/〇 95% 91°/〇 70 321483 1 硬化劑B-3 :使用曱基六氫鄰苯二曱酸酐、六氫鄰苯二曱 酸酐之混合物(新日本理化(股)製「MH-700G」)。 *硬化促進劑C-1 :環氧樹脂與酸酐之反應促進劑係使用 San-apro(股)公司販售之「U-CAT 18X」(商品名稱)。 *硬化條件:統一為 120°C 2hr+140°C 2hr 201020279 *Tg之單位為[°C]、-3〇°C彈性率之單位為[Mpa]。 *2 )有起泡痕跡’而無法獲得適當的試樣作為動態黏彈性用 硬化物。 *3)由於確認出*2)中比較例7的起泡痕跡,因而在製作ϋν 耐久性穿透試驗用試樣時,測定樹脂所減少之量而確認重 量維持率。 另外,重量維持率係以(硬化後鑄造物之重量/硬化前 鑄造物之重量)χ100而算出。 ® 在比較例7之硬化性樹脂組成物中產生起泡痕跡而無 法作成作為動態黏彈性測定用之正常硬化物,相對於此, 可判明實施例11之硬化性樹脂組成物可作成無黏性之硬 化物且成為低彈性率之硬化物。而且,在比較例7之硬化 - 性樹脂組成物中,測定UV耐久性穿透試驗用試樣在硬化前 後樹脂的減量結果,為減少9%之量,相對於此,實施例 之硬化性樹脂組成物中所減少之量止於5%左右,本發明之 ❹硬化性樹脂組成物在硬化前後之減量亦少,LED封裝用铸 造物在硬化後之凹陷亦少,因而可判明本發明之硬化性樹 脂組成物在此點上亦適用為LED密封用組成r物Ί此.外,與 比較例7相較,亦判明實施例11穿透率之UV耐久性及耐 熱性亦均優越。 71 321483 201020279 表4 實施例12 100 21. 4 0. 1 45〇C 1539 盔 88. 1% 93. 9°/〇 99. 2°/〇 (調配) 化合物A-15 硬化劑B-3 硬化促進劑C-1 (機械特性試驗)Tg -30°C Elasticity Surface Viscosity (UV Durability Penetration Test) 375nm Penetration Maintenance Rate 400nm Penetration Maintenance Rate 465nra Penetration Maintenance Rate (Heat Durability Penetration Test) 375nm Penetration Maintenance Rate 400nm Penetration Maintenance Rate 465 nm Penetration maintenance rate (weight change after hardening) 13) Weight retention rate Example 11 Comparative Example 7 100 -- 100 28. 9 29. 9 0.1 0· 1 97.4% 84.0% 99. 1% 89. 4% 100 % 96. 1°/〇95% 91°/〇70 321483 1 Hardener B-3: a mixture of mercaptohexahydrophthalic anhydride and hexahydrophthalic anhydride (New Japan Physical and Chemical Co., Ltd.) "MH-700G"). * Hardening accelerator C-1: A reaction accelerator for an epoxy resin and an acid anhydride is "U-CAT 18X" (trade name) sold by San-apro Co., Ltd. * Hardening conditions: unified to 120 ° C 2 hr + 140 ° C 2 hr 201020279 * Tg unit is [ ° C], -3 〇 ° C modulus of the unit is [Mpa]. *2) There is a foaming mark' and an appropriate sample cannot be obtained as a cured material for dynamic viscoelasticity. *3) Since the foaming trace of Comparative Example 7 in *2) was confirmed, when the ϋν durability penetration test sample was produced, the amount of reduction in the resin was measured to confirm the weight retention ratio. Further, the weight maintenance ratio was calculated by (weight of the cast product after hardening/weight of the cast product before hardening) χ100. In the curable resin composition of Comparative Example 7, a foaming mark was generated and it was not possible to form a normal cured product for dynamic viscoelasticity measurement. On the other hand, it was found that the curable resin composition of Example 11 can be made non-tacky. The cured product is a cured product having a low modulus of elasticity. Further, in the hardenable resin composition of Comparative Example 7, the amount of reduction of the resin before and after curing of the sample for UV durability penetration test was measured to be 9% by weight, and the curable resin of the example was used. The amount of reduction in the composition is limited to about 5%, and the amount of the curable resin composition of the present invention is reduced before and after hardening, and the casting of the LED package has less depression after hardening, so that the hardening of the present invention can be confirmed. In this regard, the resin composition was also applied to the composition for LED sealing. In addition, compared with Comparative Example 7, it was also found that the UV durability and heat resistance of the transmittance of Example 11 were also excellent. 71 321483 201020279 Table 4 Example 12 100 21. 4 0. 1 45〇C 1539 Helmet 88. 1% 93. 9°/〇99. 2°/〇 (Material) Compound A-15 Hardener B-3 Hardening promotion Agent C-1 (mechanical property test)

Tg -30°C彈性率 表面黏性 (UV耐久性穿透試驗) 375nm 穿透維持率 400nm 穿透維持率 465nm 穿透維持率 *硬化劑B-3:使用曱基六氳鄰笨二曱酸酐、六氫鄰笨二曱 酸酐之混合物(新日本理化(股)製造「MH-700G」)。 *硬化促進劑C-1 :環氧樹脂與酸酐之反應促進劑係使用 San-apro(股)公司販售之「U-CAT 18X」(商品名稱)。 *硬化條件:120°C lhr+150°C 3hr *Tg之單位為[°C]、-30°C彈性率之單位為[MPa]。 判明使用2階段反應所合成之本發明的矽氧烷化合物 (A)的實施例12之硬化性樹脂組成物,成為低溫下彈性率 亦低之硬化物。 72 321483 201020279 表5 ❹ 實施例13比較例6 未密封 (調配) 化合物A-13 100 ERL-4221 一 硬化劑B-2 -— 硬化劑B-3 29. 1 硬化促進劑C-i 0. 1 (UV耐久性穿透試驗) 375nm 92. 5°/〇 穿透維持率 400nm 96. 5% 穿透維持率 465nm 穿透維持率 (LED照明試驗) 照度維持率 元件表面狀態 100 71. 8 72% 76% 99. 7% 90% 91% 無色 21% 茶色 劣化’將未注入樹脂的無密封者 83% 無色 同時進Tg -30°C Elasticity Surface Viscosity (UV Durability Penetration Test) 375nm Penetration Maintenance Rate 400nm Penetration Maintenance Rate 465nm Penetration Maintenance Rate* Hardener B-3: Use of fluorenyl hexamethylene phthalate , a mixture of hexahydro-dosing phthalic anhydride ("MH-700G" manufactured by Nippon Chemical and Chemical Co., Ltd.). * Hardening accelerator C-1: A reaction accelerator for an epoxy resin and an acid anhydride is "U-CAT 18X" (trade name) sold by San-apro Co., Ltd. * Hardening conditions: 120 ° C lhr + 150 ° C 3 hr * Tg unit is [ ° C], -30 ° C modulus of the unit is [MPa]. The curable resin composition of Example 12 of the present invention, which is synthesized using the two-stage reaction, is a cured product having a low modulus at a low temperature. 72 321483 201020279 Table 5 实施 Example 13 Comparative Example 6 Unsealed (mixed) Compound A-13 100 ERL-4221 A hardener B-2 - Hardener B-3 29. 1 Hardening accelerator Ci 0. 1 (UV Durability penetration test) 375nm 92. 5°/〇 penetration retention rate 400nm 96. 5% penetration maintenance rate 465nm penetration maintenance rate (LED illumination test) illuminance maintenance rate component surface state 100 71. 8 72% 76% 99. 7% 90% 91% colorless 21% brown color deterioration 'no sealant without resin injection 83% colorless simultaneous

*硬化劑B—2 :硬化劑係預先準備1,3, 4-環己院三竣酸 一3;4—酐(三菱氣體化學(股)製造之「H-TMA」)50份與曱基 :氫鄰苯二甲酸酐、六氫鄰苯二甲酸酐之混合物的 「’7_」(新日本理化(股)製造)5〇份混合之物 化劑B-2。 更化Μ B 3 .使用甲基六氫鄰苯二甲酸軒、六氫鄰苯二甲 I酐之此合物的「ΜΗ_7⑽G」(新日本理化(股)製造 促進剤C 1 ·環氧樹脂與酸酐之反應促進劑孫使用 細aPr〇(股)公司販售之「U-CAT 18X」(商品名稱)。 73 321483 201020279 *ERL-4221 :陶氏化學公司製造之脂環变環氧樹脂。 *硬化條件:110¾ 6hr(實施例13) *硬化條件:12〇°c ihr+lSiTC 3hr(比較例 6) *Tg之單位為[°C ]、—3〇°c彈性率之單位為[MPa]。 由以上結果可判明,將使用以2階段反應所合成之4 發明的矽氧烷化合物(A)的實施例13之硬化性樹脂組成物 使用在LED密封材時,相較於以往使用脂環型環氧樹脂之* Hardener B-2: Hardener is prepared by pre-comprising 1,3, 4-cyclohexyl tridecanoic acid-3; 4-anhydride ("H-TMA" manufactured by Mitsubishi Gas Chemical Co., Ltd.) : "7_" (manufactured by Shin Nippon Chemical & Chemical Co., Ltd.) of a mixture of hydrogen phthalic anhydride and hexahydrophthalic anhydride, 5 parts of the mixed physicochemical agent B-2.更B 3 . "ΜΗ_7(10)G" which is a compound of methyl hexahydrophthalate or hexahydrophthalic anhydride (Nippon Chemical and Chemical Co., Ltd.) promotes 剤C 1 · epoxy resin and "U-CAT 18X" (trade name) sold by the company of fine aPr(R) Co., Ltd. for the reaction promoter of the acid anhydride. 73 321483 201020279 *ERL-4221: Epoxy resin modified by Dow Chemical Co., Ltd. * Hardening conditions: 1103⁄4 6 hr (Example 13) * Hardening conditions: 12 〇 ° c ihr + lSiTC 3 hr (Comparative Example 6) * The unit of Tg is [°C], and the unit of elastic modulus of -3 〇 °c is [MPa] From the above results, it has been found that the curable resin composition of Example 13 using the siloxane compound (A) synthesized in the two-stage reaction is used in an LED sealing material, and the alicyclic ring is used in comparison with the conventional one. Epoxy resin

比較例6的硬化性樹脂組成物,照度維持率明顯優異。由 ,可確es本發明之硬化性樹脂組成物適 【圖式簡單說明】無 珂材。 【主要元件符號說明】盔In the curable resin composition of Comparative Example 6, the illuminance maintenance ratio was remarkably excellent. It is confirmed that the curable resin composition of the present invention is suitable. [Simple description of the drawing] No coffin. [Main component symbol description] helmet

321483 74321483 74

Claims (1)

201020279 七、申請專利範圍: • 1_ 一種含反應性官能基之矽氧烷化合物,係具有鏈狀聚矽 氧鏈段,與具有選自含環氧基之反應性官能基、曱基以 及苯基所成組群之基的三(Π-Cio)烷氧基矽烷之水解 , 縮合鏈段的嵌段型矽氧烷低聚物,且至少一部分之水解 縮合鏈段係含有至少具有一個環氧基之反應性官能基 的鏈段者。 2.如申請專利範圍第1項之含反應性官能基之矽氧烷化 ❿ 合物’其中,水解縮合鏈段係倍半矽氧烷201020279 VII. Patent application scope: • 1_ A reactive functional group-containing oxane compound having a chain polyoxynized segment and having a reactive functional group selected from an epoxy group, a fluorenyl group and a phenyl group Hydrolysis of a tris(C-Cio) alkoxydecane group based on a group, a block type oxane oxide oligomer of a condensed segment, and at least a portion of the hydrolyzed condensed segment containing at least one epoxy group The segment of the reactive functional group. 2. The oxoalkylated oxime containing a reactive functional group as claimed in claim 1 wherein the hydrolyzed condensed segment is sesquiterpene oxide 3.如申請專利範圍第1項或第2項之含反應性官能基之石夕 氧烷化合物,其係經由下述之兩階段反應而得,第j 階段反應係使通式(2)所示矽醇末端聚矽氧油(b)與通 式(1)所示烷氧矽烷化合物(a),在相對於矽醇末端聚矽 氧油(b)之矽醇基1當量,烷氧矽烷化合物之烷氧當量 為1. 5至200當量之範圍内反應並縮合,其後進行之第 2階段反應係將水添加在所得反應液中,使剩餘的烷氧 基水解•縮合;3. The reactive functional group-containing oxaxoxane compound of claim 1 or 2, which is obtained by the following two-stage reaction, the j-stage reaction is carried out by the formula (2) The decyl alcohol terminal polyoxyxane oil (b) is alkoxy decane compound (a) represented by the formula (1), and the sterol group is 1 equivalent with respect to the sterol terminal polyoxyxanic oil (b). The alkoxy equivalent of the compound is reacted and condensed in the range of 1.5 to 200 equivalents, and the second stage reaction thereafter is carried out by adding water to the obtained reaction liquid to hydrolyze and condense the remaining alkoxy group; (式中,存在複數個之R3可互同或互異,表示碳數j至 10之直鏈狀、分支狀或環狀之烷基、碳數6至14之芳 基或碳數2至10之烯基;m表示平均值為2至2〇〇〇) 75 321483 (1) 201020279 XSi(0R2)3 (式中,X表不具有環氧基之反應性官能基;Ra表示碳 數1至10之烷基)。 4. 如申凊專利範圍第3項之含反應性官能基之矽氧烷化 合物’其中,m為2至200。 5. 如申#專利範圍第丨項之含反應性官能基之矽氧烷化 s物,其中,第1階段反應係使通式(2)所示矽醇末端 聚矽氧油(b) ’與通式(1)所示烷氧矽烷化合物(a)以及 通式(3)所示烷氧矽烷化合物(c)兩者,在相對於矽醇末 端聚石夕氧油⑻之石夕醇基i當量,炫氧石夕烧化合物⑷ 以及(c)之烷氧基總當量為丨.5至2〇〇當量之範圍内反 應並縮合,其後進行之第2階段反應係將水添加在所得 反應液中,使剩餘的烷氧基水解·縮合;(wherein a plurality of R3s may be mutually identical or mutually different, and represent a linear, branched or cyclic alkyl group having a carbon number of j to 10, an aryl group having 6 to 14 carbon atoms or a carbon number of 2 to 10 Alkenyl; m means an average of 2 to 2 〇〇〇) 75 321483 (1) 201020279 XSi(0R2)3 (wherein X represents a reactive functional group having no epoxy group; Ra represents a carbon number of 1 to 10 alkyl). 4. The reactive functional group-containing oxoxane compound of claim 3, wherein m is from 2 to 200. 5. The oxo-alkylated s-containing reactive functional group according to the ninth aspect of the patent, wherein the first-stage reaction is a sterol-terminated polyoxyxene oil (b) represented by the general formula (2). And the alkoxy decane compound (a) represented by the formula (1) and the alkoxy decane compound (c) represented by the formula (3), in the case of the octa alcoholic oil (8) relative to the sterol terminal i equivalent, the oxysphate compound (4) and the total equivalent of the alkoxy group of (c) are reacted and condensed in the range of 丨. 5 to 2 〇〇 equivalent, and the second stage reaction thereafter is carried out by adding water to the obtained In the reaction liquid, the remaining alkoxy group is hydrolyzed and condensed; (式中,存在複數個之R3可互同或互異,表示碳數i至 10之直鏈狀、分支狀或環狀之烷基、碳數6至14之芳 基或碳數2至10之烯基;m表示平均值為2至2〇〇) XSi(OR2)3 ⑴ (式中,X表示具有環氧基之反應性官能基;匕表示碳 數1至10之烷基) (3) R4Si(0R2)3 之R2相同或 (式中,R4表示甲基或苯基;只2可與通式(1) 321483 76 201020279 相異’係各自獨立,表示碳數1至1〇之烧基)。 •如申請專利範圍第3至5項中任-項之含^性官能基 之石夕氧烧化合物,其中,通式⑵之1各自獨立,表示 甲基或苯基;通式⑴之匕各自獨立,表示甲基或乙其. 通式⑶之只2可與通式⑴之R2相同或相異,係各自^ 立’表示甲基或乙基。(wherein a plurality of R3s may be mutually identical or mutually different, and represent a linear, branched or cyclic alkyl group having a carbon number of i to 10, an aryl group having a carbon number of 6 to 14 or a carbon number of 2 to 10 Alkenyl; m represents an average of 2 to 2 〇〇) XSi(OR2)3 (1) (wherein X represents a reactive functional group having an epoxy group; 匕 represents an alkyl group having 1 to 10 carbon atoms) (3) R4Si(0R2)3 has the same R2 or (wherein R4 represents a methyl group or a phenyl group; only 2 can be distinguished from the general formula (1) 321483 76 201020279', which means that the carbon number is 1 to 1 〇. base). The compound according to any one of claims 3 to 5, wherein the compound of the formula (2) is independently represented by a methyl group or a phenyl group; and each of the formula (1) Independently, it means methyl or ethyl. The only two of the formula (3) may be the same as or different from R2 of the formula (1), and each of them represents a methyl group or an ethyl group. _請__^6項作Κ含反應性官能基 切氧烧化合物,其中,通式⑴之χ為職基環己基 =請專利範圍第3至6項中任1之含反應性官能基 氧燒化合物’其巾,通式⑵末端聚梦氧油 之重量平均分子量(MW)為300至18〇〇〇。 2請專利範圍第項中任1之含反應性官能基 钱化合物,其中,重量平均分子量(Mw)為議 芝 2〇〇〇〇 。 馨1〇·如φ试車立 卜專利範圍第i項或第2項之含反應性官能基之矽 2合物’其中,鏈狀㈣氧鏈段中之聚魏上的取 U 土為甲基或苯基之任一者或兩者。 ·=請專利範圍第i項或第10項之含反應性官能基之 尺燒化合物’其巾’倍半錢朗段巾之具有環氧基 12〜應性官能基係含有環氧基環己基者。 應性官能基之魏純合物_造方法,其特 所,Γ匕3下述之兩階段反應;第1階段反應係使通式(2) π矽醇末端聚矽氧油(b),與通式(1)所示烷氧矽烷化 321483 77 201020279 &amp;物(a) ’在相對於石夕醇末端聚石夕氧油(匕)之;g夕醇基1 當i ’烷氧矽烷化合物(a)之烷氧當量為丨.5至2〇〇當 里之範圍内,於觸媒之存在下反應並縮合,其後進行之 第2階段反應係將水添加在所得反應液中,使剩餘的烷 氧基水解•縮合者:_ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The calcined compound's towel has a weight average molecular weight (MW) of 300 to 18 Å at the end of the formula (2). (2) The reactive functional group-containing compound according to any one of the first aspect of the invention, wherein the weight average molecular weight (Mw) is 2, 议.馨1〇·如 φ 立 立 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利Either or both of the base or phenyl. ·=Please refer to the range of i or 10 of the patent range of the reactive functional group-containing calcined compound 'the towel' 1/2 half-dollar segment has an epoxy group 12~-functional functional group containing epoxycyclohexyl By. The functional group-based Wei pure compound_making method, the special one, the following two-stage reaction; the first-stage reaction system is the general formula (2) π sterol terminal polyfluorene oxide oil (b), Alkoxyalkylation of formula (1) 321483 77 201020279 &amp; (a) 'in the end of the polyoxo-oxygen oil (匕) relative to the linalool; g-alcohol 1 as i 'alkoxydecane compound ( a) the alkoxy equivalent of a.5 to 2 〇〇, reacts and condenses in the presence of a catalyst, and then the second stage of the reaction is carried out by adding water to the obtained reaction solution to make the remaining Alkoxy hydrolysis/condensation: (式中,存在複數個之Rs可互同或互異,係各自獨立,❹ 表不碳數1至1〇之直鏈狀、分支狀或環狀之烷基、碳 數6至14之芳基或碳數2至10之烯基;m表示平均值 為2至2000) XSi(〇R2)3 (1) (式中’ X表不具有環氧基之反應性官能基;R2表示碳 數1至10之烷基)。 · 13. 如申請專利範圍第12項之含反應性官能基之矽氧烷化 合物之製造方法,其中,m為2至200。 14. —種含反應性官能基之矽氧烷化合物的製造方法,其特 徵係包含下述之兩階段反應,第1階段反應係使通式(2) 所不石夕醇末端聚石夕氧油(b),與通式(1)所示烷氧矽烷化 合物(a)以及通式(3)所示烷氧矽烷化合物(c) ,在相對 於石夕醇末端聚石夕氧油(b)之矽醇基1當量,烷氧矽烷化 合物(a)以及(c)之烷氧基總當 量為1. 5至200當量之範 圍内’於觸媒之存在下進行縮合反應,其後進行之第2 78 321483 201020279 m 脂長反應係將水添加在所得 氧基水解·縮合;(In the formula, there are a plurality of Rs which may be mutually the same or different from each other, and are independent of each other, and the linear, branched or cyclic alkyl group having a carbon number of 1 to 1 、, and the carbon number of 6 to 14 are Or an alkenyl group having 2 to 10 carbon atoms; m represents an average value of 2 to 2000) XSi(〇R2)3 (1) (wherein X represents a reactive functional group having no epoxy group; R2 represents a carbon number 1 to 10 alkyl groups). 13. The method for producing a reactive functional group-containing oxoxane compound according to claim 12, wherein m is from 2 to 200. A method for producing a reactive functional group-containing oxoxane compound, which comprises the following two-stage reaction, wherein the first-stage reaction is carried out by the general formula (2) The oil (b), and the alkoxy decane compound (a) represented by the formula (1) and the alkoxy decane compound (c) represented by the formula (3), in the end of the oxy-alcoholic acid (b) a sterol group of 1 equivalent, the alkoxy decane compound (a) and the total alkoxy group of (c) are in the range of 1.5 to 200 equivalents. The condensation reaction is carried out in the presence of a catalyst, and thereafter No. 2 78 321483 201020279 m The fat-long reaction system adds water to the obtained oxyhydrolysis/condensation; 反應生成物中,使剰餘的烷 (2) ^一中,存在複數個之①可互同或互異,係各自獨立, 不蚊數1至1〇之直鏈狀、分支狀或環狀之燒基、碳In the reaction product, in the remaining alkane (2) ^, a plurality of ones may be mutually identical or different from each other, and each of them is independent, and the linear number, branch or ring shape of the mosquitoes is not 1 to 1 〇. Burning base, carbon 數6至14之芳基或碳數2至1()之烯基^表示平均值 為2至200) (1) 應性官能基;r2表示碳 XSi(〇R2)3 (式中,X表示具有環氧基之反 數1至10之烷基) \ R4Si(0R2)3 ⑶ ' (式中,R4表不甲基、苯基;R2可與通式(1)之R2相同或 相異,係各自獨立,表示碳數i至10之烷基)。 ❿15·如申請專利範圍第12項至第14項中任―項之含反應性 官能基之矽氧烷化合物的製造方法,其中,製造步驟係 以一锅式依序進行第1觀反A〜、12.階段反應者。 16.如申5月專利⑻圍第丨丨項至第15項中任—項之含反應性 吕忐基之矽氧烷化合物的製造方法,其中,通式(1)所 :烷氧矽烷化合物係y? -(3, 4~環氧基環己基)乙基三甲 氧基矽烷、或石-(3, 4-環氧基環己基)乙基三乙氧基矽 燒。 ……· Λ 7·如申明專利範圍第12項至第ι6項中任一項之含反應性 321483 79 201020279 官能基之矽氧烷化合物的製造方法,其中,通式(2)所 示矽醇末端聚矽氧油(b)之R3可互同或互異,係各自獨 立之甲基或苯基。 18. 如申請專利範圍第13項至第15項中任一項之含反應性 官能基之矽氧烷化合物的製造方法,其中,通式(3)所 示烷氧矽烷化合物係選自甲基三甲氧基矽烷、苯基三甲 氧基矽烷、曱基三乙氧基矽烷以及苯基三乙氧基矽烷所 成組群中之至少一種。 19. 一種硬化性樹脂組成物,係含有如申請專利範圍第1 ❹ 項至第11項中任一項之含反應性官能基之矽氧烷化合 物(A)以及硬化劑(B)者。— 20. 如申請專利範圍第19項之硬化性樹脂組成物,其中, 復含有硬化促進劑(C)。 21. —種光半導體用硬化物,係使申請專利範圍第19項或 ' r 第20項之硬化性樹脂組成物進行熱硬化而得者。 22. —種光半導體元件,係以申請專利範圍第20項之光半 ^ 導體用硬化物密封者。 80 321483 201020279 四、指定代表圖:本案無圖式 (一) 本案指定代表圖為:第()圖。 (二) 本代表圖之元件符號簡單說明: 五、本案若有化學式時,請揭示最能顯示發明特徵的化學式:The aryl group of 6 to 14 or the alkenyl group of carbon number 2 to 1 () represents an average value of 2 to 200) (1) an functional group; r2 represents carbon XSi(〇R2)3 (wherein, X represents An alkyl group having an inverse number of 1 to 10 of an epoxy group) \ R4Si(0R2)3 (3) ' (wherein R4 represents a methyl group or a phenyl group; and R2 may be the same as or different from R2 of the formula (1), Each is independent, representing an alkyl group having a carbon number of i to 10). ❿15. The method for producing a reactive functional group-containing oxane compound according to any one of claims 12 to 14, wherein the manufacturing step is performed in a one-pot manner. 12. Stage responders. 16. The method for producing a reactive sulfonium-containing oxane compound according to any one of the items (8) of the fifth aspect of the invention, wherein the alkoxy decane compound of the formula (1): It is y?-(3,4~epoxycyclohexyl)ethyltrimethoxynonane or stone-(3,4-epoxycyclohexyl)ethyltriethoxy oxime. The method for producing a functional group-containing oxane compound according to any one of claims 12 to 71, wherein the sterol represented by the formula (2) The R3 of the terminal polyoxygenated oil (b) may be mutually identical or mutually different, and are each independently a methyl group or a phenyl group. The method for producing a reactive functional group-containing oxoxane compound according to any one of claims 13 to 15, wherein the alkoxy decane compound represented by the formula (3) is selected from a methyl group. At least one of trimethoxydecane, phenyltrimethoxydecane, decyltriethoxydecane, and phenyltriethoxydecane. A curable resin composition comprising the reactive functional group-containing oxosiloxane compound (A) and the curing agent (B) according to any one of claims 1 to 11. — 20. The curable resin composition of claim 19, wherein the hardening accelerator (C) is further contained. 21. A cured product for a photo-semiconductor, which is obtained by thermally curing a curable resin composition of claim 19 or 'r item 20. 22. An optical semiconductor component which is sealed by a hardened material for a light semi-conductor of claim 20. 80 321483 201020279 IV. Designated representative map: There is no schema in this case (1) The representative representative map of this case is: (). (2) A brief description of the symbol of the representative figure: 5. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: (2) 321483 201020279 發明糞利說明書(2) 321483 201020279 Invention of manure instructions (本說明書輅式、順序,請勿任意更動’※記號部分請勿 ※申請案號: ※申請曰:(This manual is in the style and order, please do not change it arbitrarily.] ※Please note the number of the application. ※Application number: ※Application曰: (2006.01) 一、發明名稱:(中文/英文) ^ % ί2〇〇6*〇1&gt; 矽氧烷化合物、硬化性樹脂組成物、其硬化物及光半導體元件 SILOXANE, HARDENING RESIN COMPOSITION, HARDENED SUBSTANCE THEREOF, AND OPTICAL SEMICONDUCTOR COMPONENT 二、中文發明摘要: 吸方 f2006 0n ❹ % (2〇〇6.0l\ 本發明係有關新穎的含反應性官能基之石夕氧院化合 物(A)、含有此梦氧烧化合物(A)與硬化劑(β)之硬化性樹脂 組成物,及以其硬化物密封之光半導體元件(例如led) 者,而該經密封之光半導體元件之耐光性以及低溫下之低 彈性率優異。上述之矽氧烷化合物(A)係具有鏈狀聚矽氧鏈 段,與具有選自含有環氧基之反應性官能基、曱基以及苯 基所成組群之基的三(C1-C10)烷氧基矽烷之水解縮合鏈段 ❹的篏段型石夕氧烧低聚物,且至少一部分之水解縮合鍵段係 含有至少具有-個環氧基之反應性官能基的鍵段者。該梦 氧烧化合物可經由下述第1階段反應與之後的第2階段反 應而得, 第1階段反應:相對於_末端㈣氧油(b)之鹤 當量,使錄魏化合物之純基在當量值為 之範圍内進行反應; ’ I 第2階段反應:在水的存在下吏 段反應之生祕巾的料基特挪縮^應讀第1階 321483修正版 1 201020279 比較例6 :使用ERL-4221與硬化劑之組成物 表3所記載之實施例以及比較例係如下述。 實施例11 :使用化合物Α-13、硬化劑Β~3以及硬化促進劑 C-1之組成物 比較例7 :使用化合物Α-14、硬化劑以及硬化促進劑 C-1之組成物 表4所記載之實施例係如下述。 實施例12:使用化合物Α-15、硬化劑Β-3以及硬化促進劍 〇 c-i之組成物 表5所記載之實施例以及比較例係如下述。 , 實施例13 :使用化合物Α-13、硬化劑Β·~3以及硬化促進劑 4 C-1之組成物 比較例6 :使用ERL-4221與硬化劑Β-1之組成物 對於實施例8至13、比較例5至7中所得硬化性樹月旨 組成物進行下述穿透率試驗、機械特性試驗(動態黏彈性言式 ❹ 驗)、LED照明試驗,將其結果示於表2、3、4、5。 (UV耐久性穿透率試驗) 將實施例8至13、比較例5至7所得之硬化性樹腊組 成物實施真空脫泡20分鐘後,輕輕地倒入底面直徑5cm, 高度2cm之鋁箔杯中鑄造。將該鑄造物在預定之硬化條件 下放入烤箱中使之硬化,得到厚度2mm之穿透性用試驗片。 使用該等試驗片,經由分光光度計測定紫外線照射前後之 穿透率(測定波長:375nm、400nm、465nm),算出其變化率。 紫外線照射條件如下。 65 321483修正版 201020279 紫外線照射機:EYE SUPER UV TESTER SUV-Wll 溫度:60°C 照射能量:65mW/cm2 照射時間:100小時 (熱耐久性穿透率試驗) 、,實施例8至13、比較例5至7所得之硬化性樹脂組 成物實施真空脫泡20分鐘後,輕輕地倒入底面直徑, 高度2cm之鋁箔杯中鑄造。將該鑄造物在預定之硬化條件 下放入烤箱中使之硬化,得到厚度2襲之穿透性用試驗 片。使用該等試驗片,以分光光度計測定於15〇£&gt;c烤箱中 放置96小時前後之穿透率(測定波長:375nm、4〇〇⑽、 465nm),算出其變化率。 (機械特性試驗) 將實施例8至13、比較例5至7所得之硬化性樹脂組 成物實施真空脫泡20分鐘後,輕輕地倒入寬7mm、長5cm、 厚度約800 //m之試驗片用模型中鎊造,然後從上方以聚醯 亞胺膜蓋住。將該鑄造物依表2、3記載之硬化條件硬化而 仔到動態黏彈性用試驗片。使用該等試驗片,依下述條件 實施動態黏彈性試驗。 測定條件 動態黏彈性測定器:TA-instrument製,DMA-2980 測定溫度範圍:-30°C至280°C 升溫速度:2°C/分鐘 試驗片尺寸:使用切成5mmx50丽者(厚度約800 /i m)。 66 321483 201020279 發明糞利說明書(2006.01) I. Name of the invention: (Chinese/English) ^ % ί2〇〇6*〇1&gt; Hydroxane compound, hardenable resin composition, hardened material and optical semiconductor element SILOXANE, HARDENING RESIN COMPOSITION, HARDENED SUBSTANCE THEREOF , AND OPTICAL SEMICONDUCTOR COMPONENT II. Abstract of Chinese Abstract: Suction side f2006 0n ❹ % (2〇〇6.0l\ The present invention relates to a novel reactive compound-containing Shihe oxygen compound (A), containing this dream oxygen burning a curable resin composition of the compound (A) and the curing agent (β), and an optical semiconductor element (for example, led) sealed with the cured product, and the light-resistant property of the sealed optical semiconductor element and low elasticity at a low temperature The above-mentioned oxoxane compound (A) has a chain polyfluorene chain segment and three having a group selected from the group consisting of a reactive functional group containing an epoxy group, a fluorenyl group, and a phenyl group. C1-C10) a hydrolyzed condensed segment of alkoxydecane, a hydrazine-type oxo-oxygenated oligomer, and at least a portion of the hydrolyzed condensed bond segment contains a bond having at least one reactive group of an epoxy group segment The dream oxygen-burning compound can be obtained by the following first-stage reaction and the subsequent second-stage reaction, the first-stage reaction: the pure base of the recorded compound relative to the crane equivalent of the _ terminal (tetra) oxy-oil (b) The reaction is carried out within the range of the equivalent value; 'I Phase 2 reaction: the base of the sputum reaction in the presence of water in the presence of water. The first step 321483 revision 1 201020279 Comparative Example 6 : Compositions using ERL-4221 and a curing agent Examples and comparative examples described in Table 3 are as follows. Example 11: Composition using Compound Α-13, Hardener Β~3, and Hardening Accelerator C-1 Comparative Example 7: Composition using Compound Α-14, Hardener, and Hardening Accelerator C-1 The examples described in Table 4 are as follows. Example 12: Using Compound Α-15, Hardener Β-3, and Hardening Compositions for promoting the sword ci The examples and comparative examples described in Table 5 are as follows. Example 13: Comparison of the composition of the compound Α-13, the hardener Β·~3, and the hardening accelerator 4 C-1 Example 6: Using ERL-4221 and the composition of hardener Β-1 The curable tree compositions obtained in Examples 8 to 13 and Comparative Examples 5 to 7 were subjected to the following penetration test, mechanical property test (dynamic viscoelastic test), and LED illumination test, and the results were shown in Tables 2, 3, 4, and 5. (UV Durability Penetration Test) The curable wax compositions obtained in Examples 8 to 13 and Comparative Examples 5 to 7 were subjected to vacuum defoaming for 20 minutes, and then gently poured. Cast into an aluminum foil cup with a bottom diameter of 5 cm and a height of 2 cm. The cast product was placed in an oven under predetermined hardening conditions to be hardened to obtain a test piece for penetration of 2 mm in thickness. Using these test pieces, the transmittance (measuring wavelength: 375 nm, 400 nm, 465 nm) before and after ultraviolet irradiation was measured by a spectrophotometer, and the rate of change was calculated. The ultraviolet irradiation conditions are as follows. 65 321483 Revised 201020279 Ultraviolet Irradiation Machine: EYE SUPER UV TESTER SUV-Wll Temperature: 60°C Irradiation Energy: 65mW/cm2 Irradiation Time: 100 Hours (Heat Durability Penetration Test), Examples 8 to 13, Comparison The curable resin composition obtained in Examples 5 to 7 was subjected to vacuum defoaming for 20 minutes, and then gently poured into an aluminum foil cup having a bottom diameter of 2 cm in height and cast. The cast product was placed in an oven under predetermined hardening conditions to be hardened to obtain a test piece having a thickness of 2 for penetration. Using these test pieces, the transmittance (measurement wavelength: 375 nm, 4 〇〇 (10), 465 nm) was measured by a spectrophotometer in a 15 ounce oven for 96 hours, and the rate of change was calculated. (Mechanical property test) The curable resin compositions obtained in Examples 8 to 13 and Comparative Examples 5 to 7 were subjected to vacuum defoaming for 20 minutes, and then gently poured into a width of 7 mm, a length of 5 cm, and a thickness of about 800 //m. The test piece was made of pounds in the model and then covered with a polyimide film from above. The cast product was cured according to the hardening conditions described in Tables 2 and 3, and was taken to a test piece for dynamic viscoelasticity. Using these test pieces, a dynamic viscoelasticity test was carried out under the following conditions. Measurement conditions Dynamic viscoelasticity tester: TA-instrument, DMA-2980 Measurement temperature range: -30 ° C to 280 ° C Heating rate: 2 ° C / min Test piece size: use cut into 5 mm x 50 丽 (thickness of about 800 /im). 66 321483 201020279 Invention of manure instructions (本說明書輅式、順序,請勿任意更動’※記號部分請勿 ※申請案號: ※申請曰:(This manual is in the style and order, please do not change it arbitrarily.] ※Please note the number of the application. ※Application number: ※Application曰: (2006.01) 一、發明名稱:(中文/英文) ^ % ί2〇〇6*〇1&gt; 矽氧烷化合物、硬化性樹脂組成物、其硬化物及光半導體元件 SILOXANE, HARDENING RESIN COMPOSITION, HARDENED SUBSTANCE THEREOF, AND OPTICAL SEMICONDUCTOR COMPONENT 二、中文發明摘要: 吸方 f2006 0n ❹ % (2〇〇6.0l\ 本發明係有關新穎的含反應性官能基之石夕氧院化合 物(A)、含有此梦氧烧化合物(A)與硬化劑(β)之硬化性樹脂 組成物,及以其硬化物密封之光半導體元件(例如led) 者,而該經密封之光半導體元件之耐光性以及低溫下之低 彈性率優異。上述之矽氧烷化合物(A)係具有鏈狀聚矽氧鏈 段,與具有選自含有環氧基之反應性官能基、曱基以及苯 基所成組群之基的三(C1-C10)烷氧基矽烷之水解縮合鏈段 ❹的篏段型石夕氧烧低聚物,且至少一部分之水解縮合鍵段係 含有至少具有-個環氧基之反應性官能基的鍵段者。該梦 氧烧化合物可經由下述第1階段反應與之後的第2階段反 應而得, 第1階段反應:相對於_末端㈣氧油(b)之鹤 當量,使錄魏化合物之純基在當量值為 之範圍内進行反應; ’ I 第2階段反應:在水的存在下吏 段反應之生祕巾的料基特挪縮^應讀第1階 321483修正版 1 201020279 三、英文發明摘要: The present invention relates to a novel reactive functional groupcontaining a siloxane (A), a hardening resin composition including the siloxane (A) and a hardening agent (B), and an optical semiconductor component (such as LED) hermetically sealed by a hardened substance thereof, wherein the hermetically sealed optical semiconductor component demonstrates excellent resistance to light and low elasticity at low temperature. The siloxane (A) is a block-type siloxane oligomer having a chain of silicone segment and a hydrolysis and condensation segment of trialkoxysilane (Cl-CIO) containing a group selected from the group consisting of epoxy-containing reactive functional group, methyl, and ethyl, wherein at least a portion of the hydrolysis and condensation segment contains at least an epoxy-containing reactive functional group. The siloxane is obtained by the first step reaction and the ensuing second step reaction described hereunder. 1st step reaction: Reacting the siloxane compound in the condition that the alkoxy equivalent is within 1.5 to 200, relative to one equivant of silanol group of silanol ending polysilicone oil; 2nd step reaction: In the presence of water, subject the said alkoxysilane and the alkoxy group of the product obtained from 1st step reaction, to undergo hydrolysis and condensation reaction. 2 321483(2006.01) I. Name of the invention: (Chinese/English) ^ % ί2〇〇6*〇1&gt; Hydroxane compound, hardenable resin composition, hardened material and optical semiconductor element SILOXANE, HARDENING RESIN COMPOSITION, HARDENED SUBSTANCE THEREOF , AND OPTICAL SEMICONDUCTOR COMPONENT II. Abstract of Chinese Abstract: Suction side f2006 0n ❹ % (2〇〇6.0l\ The present invention relates to a novel reactive compound-containing Shihe oxygen compound (A), containing this dream oxygen burning a curable resin composition of the compound (A) and the curing agent (β), and an optical semiconductor element (for example, led) sealed with the cured product, and the light-resistant property of the sealed optical semiconductor element and low elasticity at a low temperature The above-mentioned oxoxane compound (A) has a chain polyfluorene chain segment and three having a group selected from the group consisting of a reactive functional group containing an epoxy group, a fluorenyl group, and a phenyl group. C1-C10) a hydrolyzed condensed segment of alkoxydecane, a hydrazine-type oxo-oxygenated oligomer, and at least a portion of the hydrolyzed condensed bond segment contains a bond having at least one reactive group of an epoxy group segment The dream oxygen-burning compound can be obtained by the following first-stage reaction and the subsequent second-stage reaction, the first-stage reaction: the pure base of the recorded compound relative to the crane equivalent of the _ terminal (tetra) oxy-oil (b) The reaction is carried out within the range of the equivalent value; 'I Phase 2 reaction: in the presence of water, the base of the reaction of the sputum reaction, the base of the stalk of the stalk, should be read. The first order 321483 revision 1 201020279 III. Abstract: The present invention relates to a novel reactive functional group containing a siloxane (A), a hardening resin composition including the siloxane (A) and a hardening agent (B), and an optical semiconductor component (such as LED) hermetically sealed by a hardened substance thereof, the hermetically sealed optical semiconductor component demonstrates excellent resistance to light and low elasticity at low temperature. The siloxane (A) is a block-type siloxane oligomer having a chain of silicone segment and a hydrolysis and condensation segment of trialkoxysilane (Cl-CIO) containing a gro Up selected from the group consisting of epoxy-containing reactive functional group, methyl, and ethyl, at least a portion of the hydrolysis and condensation segment contains at least an epoxy-containing reactive functional group. The siloxane is obtained by the first step reaction And the ensuing second step reaction described hereunder. 1st step reaction: Reacting the siloxane compound in the condition that the alkoxy equivalent is within 1.5 to 200, relative to one equivant of silanol group of silanol ending polysilicone oil; 2nd step reaction: In the presence Of water, subject the said alkoxysilane and the alkoxy group of the product obtained from 1st step reaction, to undergo hydrolysis and condensation reaction. 2 321483
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Families Citing this family (24)

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Publication number Priority date Publication date Assignee Title
TW201113330A (en) * 2009-08-21 2011-04-16 Jsr Corp Photo-semiconductor package composition
JP5700618B2 (en) * 2009-11-30 2015-04-15 日本化薬株式会社 Epoxy resin composition, curable resin composition
WO2011108588A1 (en) * 2010-03-02 2011-09-09 日本化薬株式会社 Curable resin composition and cured article thereof
KR20130018670A (en) * 2010-03-02 2013-02-25 닛뽄 가야쿠 가부시키가이샤 Process for production of organopolysiloxane, organopolysiloxane obtained by the process, and composition that contains the organopolysiloxane
JP5585529B2 (en) * 2011-05-06 2014-09-10 信越化学工業株式会社 Terminal alkoxy-modified organopolysiloxane and method for producing the same
JP5891617B2 (en) * 2011-05-17 2016-03-23 三菱化学株式会社 Thermosetting resin composition, semiconductor device member, and semiconductor device using the same
EP2722366B1 (en) * 2011-06-17 2023-01-04 LG Chem, Ltd. Curable composition
CN102299216A (en) * 2011-08-15 2011-12-28 广东银雨芯片半导体有限公司 LED packaging technology
JP6031739B2 (en) * 2011-09-08 2016-11-24 三菱化学株式会社 Thermosetting resin composition, semiconductor device member, and semiconductor device using the same
JP6004581B2 (en) * 2013-03-25 2016-10-12 日本化薬株式会社 Epoxy group-containing silicone resin, epoxy group-containing silicone resin composition, and cured product thereof
WO2014208619A1 (en) * 2013-06-26 2014-12-31 日本化薬株式会社 Epoxy-group-containing polyorganosiloxane and curable resin composition containing same
WO2015193555A1 (en) 2014-06-19 2015-12-23 Inkron Oy Led lamp with siloxane particle material
TWI570187B (en) * 2015-12-17 2017-02-11 財團法人工業技術研究院 Optical solid state prepolymer and molding composition
KR101871574B1 (en) * 2016-05-12 2018-06-27 삼성에스디아이 주식회사 Epoxy resin composition for encapsulating semicomductor device and semiconductor device encapsulated using the same
KR102146668B1 (en) * 2017-05-31 2020-08-21 코오롱인더스트리 주식회사 Composition For Coating and Coating Film Including Cured Product Of The Same As The Coating Layer
CN107353871B (en) * 2017-08-21 2020-09-08 山东省科学院新材料研究所 High-temperature-resistant bonding sealing silicone resin and preparation method thereof
JP7218604B2 (en) * 2018-02-26 2023-02-07 三菱ケミカル株式会社 Curable resin composition containing epoxy group-containing polyorganosiloxane and cured product thereof
KR20220055461A (en) * 2019-08-27 2022-05-03 미쯔비시 케미컬 주식회사 Epoxy group-containing polyorganosiloxane, curable resin composition containing epoxy group-containing polyorganosiloxane, and cured product thereof
KR102252385B1 (en) * 2019-12-09 2021-05-14 주식회사 티에스엘켐 UV adhesive composition
CN115003759B (en) * 2020-01-15 2023-12-01 株式会社钟化 Resin composition, method for producing same, and multicomponent curable resin composition
CN111234233B (en) * 2020-03-26 2022-05-27 兆舜科技(广东)有限公司 Phenyl silicone resin and preparation method thereof
CN111574715A (en) * 2020-05-22 2020-08-25 中国乐凯集团有限公司 Composition, packaging film containing composition, preparation method of packaging film and electronic device
KR20220039206A (en) * 2020-09-22 2022-03-29 ㈜ 엘프스 Self-sealing type conductive connection material, bonding module including same, and manufacturing method thereof
TWI773424B (en) * 2021-07-08 2022-08-01 碁達科技股份有限公司 Thermal interface composition, thermal interface material and preparation method thereof

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3681582B2 (en) * 1999-07-30 2005-08-10 信越化学工業株式会社 Epoxy group-containing silicone resin
JPWO2005100445A1 (en) * 2004-04-16 2008-03-06 Jsr株式会社 Optical semiconductor sealing composition, optical semiconductor sealing material, and method for producing optical semiconductor sealing composition
JP2006104249A (en) * 2004-10-01 2006-04-20 Nippon Kayaku Co Ltd Epoxy resin composition for sealing optical semiconductor
JP2006336010A (en) * 2005-05-02 2006-12-14 Jsr Corp Siloxane-based condensate, method for producing the same and polysiloxane composition
JP2007070560A (en) * 2005-09-09 2007-03-22 Nippon Kayaku Co Ltd Epoxy resin composition for encapsulation of optical semiconductor
JP2007277320A (en) * 2006-04-03 2007-10-25 Jsr Corp Adhesive for optical semiconductor
JP5524480B2 (en) * 2006-05-18 2014-06-18 日本化薬株式会社 Thermosetting resin composition and cured product thereof
JP5158739B2 (en) * 2006-06-13 2013-03-06 学校法人 関西大学 Thermosetting polymer composition and cured product thereof
JPWO2008090971A1 (en) * 2007-01-25 2010-05-20 Jsr株式会社 Epoxy group-terminated polydimethylsiloxane, method for producing the same, and curable polysiloxane composition
JPWO2009072632A1 (en) * 2007-12-07 2011-04-28 Jsr株式会社 Curable composition, optical element coating composition, LED sealing material, and method for producing the same
JP5246749B2 (en) * 2008-03-04 2013-07-24 日本化薬株式会社 Thermosetting resin composition and cured product thereof

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