WO2014208619A1

WO2014208619A1 - Epoxy-group-containing polyorganosiloxane and curable resin composition containing same

Info

Publication number: WO2014208619A1
Application number: PCT/JP2014/066888
Authority: WO
Inventors: 直房宮川; 直佑谷口; 窪木　健一; 智江佐々木
Original assignee: 日本化薬株式会社
Priority date: 2013-06-26
Filing date: 2014-06-25
Publication date: 2014-12-31
Also published as: JP6239616B2; TW201518343A; JPWO2014208619A1

Abstract

　An epoxy-group-containing polyorganosiloxane in which a silicone resin structure (A) having a specific structure, an epoxy-group-containing silsesquioxane structure (B) having a specific structure, and a silicone oil structure (C) having a specific structure are linked, with the terminals being an alkoxy group having 1 to 10 carbon atoms and/or a silanol group.

Description

Epoxy group-containing polyorganosiloxane and curable resin composition containing the same

The present invention relates to an epoxy group-containing polyorganosiloxane suitable for use in a portion requiring high transparency, particularly for optical semiconductor sealing, and a curable resin composition containing the epoxy group.

The curable resin composition is a thermosetting resin composition that has excellent workability and excellent electrical properties, heat resistance, adhesion, moisture resistance, etc. It is widely used in such fields.
Until now, curable resin compositions have been used as resins for encapsulating optical semiconductors such as red and green colored LEDs (light emitting diodes).
However, as a resin for sealing an LED that emits white light, high light resistance and heat-resistant transparency are required. Therefore, a silicone using an unsaturated hydrocarbon group-containing dimethylpolysiloxane and an organohydrogendimethylpolysiloxane which are excellent in them. Resin sealing materials have been used (see Patent Document 1).

In recent years, it has become a problem that the copper wire with silver plating inside the LED package is corroded (sulfurized silver) by sulfurous gas present in the air, and its brightness decreases, Sulfide resistance has been demanded. Accordingly, phenyl silicone-based encapsulants in which phenyl groups are introduced into dimethylpolysiloxane containing unsaturated hydrocarbon groups have been developed and marketed, but their sulfidation resistance has not yet been satisfactory. In addition, the silicone-based resin sealing material has a problem that the adhesion of the LED package made of polyamide resin or the like to the substrate resin is poor.
Therefore, a sealing material has been developed that compensates for the weakness of the adhesion and sulfidation resistance of the silicone resin sealing material by using a polyorganosiloxane having an epoxy group introduced into a silicone skeleton excellent in light resistance and heat resistance. (See Patent Document 2).
Similarly, a polyorganosiloxane resin containing an epoxy group having a phenyl group introduced for the purpose of improving sulfidation resistance has also been investigated, and although sulfidation resistance is improved, the stickiness between the cured products (tackiness) is improved. For this reason, there is a problem that the yield at the time of manufacturing the LED deteriorates. In addition, acid anhydride compounds used for epoxy curing may volatilize during heat curing or may be hydrolyzed by water present in the air before curing, resulting in changes in the properties of the cured product. Have

Japanese Patent No. 4636242 Japanese Patent No. 4935972

The present invention relates to an epoxy group-containing polyorganosiloxane that provides a cured product having excellent heat-resistant transparency, excellent sulfidation resistance, and low tack, and a method for producing the same, and a curable resin containing the epoxy group-containing polyorganosiloxane. An object is to provide a composition.

As a result of intensive investigations in view of the above-described actual situation, the present inventors have found that an epoxy group-containing polyorganosiloxane having a specific structure or an epoxy group-containing polyorganosiloxane produced using a specific compound as a raw material and a curability containing the same The present inventors have found that a resin composition solves the above problems and have completed the present invention.
That is, the present invention relates to the following (1) to (14).

(1) Silicone resin structure (A) represented by average formula (A), epoxy group-containing silsesquioxane structure (B) represented by formula (B), and silicone represented by formula (C) Epoxy group-containing polyorganosiloxane in which the oil structure (C) is linked and the terminal is a silanol group and / or an alkoxy group having 1 to 10 carbon atoms:

(In the formula, R ′ ¹ , R ′ ² , R ′ ³ , R ′ ⁴ , R ′ ⁵ , R ′ ⁶ may be the same as or different from each other, and may be a monovalent hydrocarbon group or a hydroxyl group. And the total amount of R ′ ¹ to R ′ ⁶ in the molecule is 100 mol%, the hydroxyl group is 5 to 50 mol%, the phenyl group is 30 to 95 mol%, and a / (a + b + c + d) = 0.01 to 1.0, b / (a + b + c + d) = 0 to 0.7, c / (a + b + c + d) = 0 to 0.3, d / (a + b + c + d) = 0 to 0.3, where numerator And at least two hydroxyl groups of R ′ ¹ to R ′ ⁶ are eliminated, and a silicon atom is bonded to an oxygen atom of the epoxy group-containing silsesquioxane structure (B)).

(Wherein Y is independently a hydrogen atom, a reactive functional group having an epoxy group, an alkyl group having 1 to 3 carbon atoms, or a phenyl group, at least one of Y is a reaction having an epoxy group) L represents an integer greater than or equal to 2. * represents a bond to a silicon atom of the silicone resin structure (A) or the silicone oil structure (C));

(In the formula, a plurality of R ^{9 s} may be the same or different and each represents an alkyl group having 1 to 3 carbon atoms or an aryl group having 6 to 10 carbon atoms, and g represents an average value of 2 to 2000. * Represents a bond to the oxygen atom of the epoxy group-containing silsesquioxane structure (B).

(2) Silicone resin represented by average formula (1) (component a); epoxy group-containing silicon compound represented by formula (2) (component b); and silanol-terminated silicone represented by formula (3) Epoxy group-containing polyorganosiloxane produced from oil (component c) as a raw material:

(In the formula, R ¹ , R ² , R ³ , R ⁴ , R ⁵ and R ⁶ may be the same or different from each other, and are a monovalent hydrocarbon group or a hydroxyl group, and R in the molecule) When the total amount of ' ¹ to R' ⁶ is 100 mol%, the hydroxyl group is 5 to 50 mol%, the phenyl group is 30 to 95 mol%, and a / (a + b + c + d) = 0.01 to 1 0.0, b / (a + b + c + d) = 0-0.7, c / (a + b + c + d) = 0-0.3, d / (a + b + c + d) = 0-0.3);

(Wherein X has a reactive functional group having an epoxy group, R ⁷ has a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms or an aromatic hydrocarbon group having 6 to 10 carbon atoms. An aryl group, R ⁸ represents a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms, e represents 0, 1 or 2, and f represents (3-e));

(In the formula, a plurality of R ^{9 s} may be the same or different and each represents an alkyl group having 1 to 3 carbon atoms or an aryl group having 6 to 10 carbon atoms, and g represents an average value of 2 to 2000. Show).

(3) The epoxy group-containing polyorganosiloxane according to (2), produced through the following two-stage production process:
[Manufacturing step I] A step of dealcoholizing a silanol group of component a and c and an alkoxy group of component b in the presence of an inorganic base compound [Manufacturing step II] After manufacturing step I, water is added to remain. The step of condensing the alkoxy groups.

(4) The epoxy group-containing polyorganosiloxane according to (2), produced through the following three-stage production process:
[Manufacturing step 1] A step of dealcoholizing a silanol group of component a and an alkoxy group of component b in the presence of an inorganic base compound [Manufacturing step 2] After manufacturing step 1, component c is added and manufacturing step 1 is performed. Step of performing dealcoholization condensation between alkoxy group remaining after passing and silanol group of component c [Manufacturing step 3] Step of adding water after manufacturing step 2 and condensing remaining alkoxy groups .

(5) Silicone resin (component a) represented by average formula (1); epoxy group-containing silicon compound (component b) represented by formula (2); and silanol-terminated silicone represented by formula (3) A method for producing an epoxy group-containing polyorganosiloxane produced using oil (component c) as a raw material, comprising the following two-stage production steps:
[Manufacturing step I] A step of dealcoholizing the silanol groups of component a and c and the alkoxy group of component b in the presence of an inorganic base compound [Manufacturing step II] After manufacturing step I, water is added to remain. The step of condensing the alkoxy groups together:

(In the formula, R ¹ , R ² , R ³ , R ⁴ , R ⁵ and R ⁶ may be the same or different from each other, and are a monovalent hydrocarbon group or a hydroxyl group, and R in the molecule) When the total amount of ' ¹ to R' ⁶ is 100 mol%, the hydroxyl group is 5 to 50 mol%, the phenyl group is 30 to 95 mol%, and a / (a + b + c + d) = 0.01 to 1.0, b / (a + b + c + d) = 0 to 0.7, c / (a + b + c + d) = 0 to 0.3, d / (a + b + c + d) = 0 to 0.3);

(6) Silicone resin represented by average formula (1) (component a); epoxy group-containing silicon compound represented by formula (2) (component b); and silanol-terminated silicone represented by formula (3) A method for producing an epoxy group-containing polyorganosiloxane produced from oil (component c) as a raw material, comprising the following three steps:
[Manufacturing step 1] A step of dealcoholizing a silanol group of component a and an alkoxy group of component b in the presence of an inorganic base compound.
[Manufacturing step 2] A step of adding a component c after the manufacturing step 1 and performing dealcoholization condensation between the alkoxy group remaining after the manufacturing step 1 and silanol of the component c.
[Manufacturing step 3] After manufacturing step 2, water is added to condense the remaining alkoxy groups:

(7) A curable resin composition comprising the epoxy group-containing polyorganosiloxane according to any one of (1) to (4) and an epoxy resin curing agent.
(8) The curable resin composition according to (7), wherein the epoxy resin curing agent is a polyvalent carboxylic acid compound.
(9) The polycarboxylic acid compound is a carbinol-modified silicone oil (d) at both terminals, a polyhydric alcohol compound (e) having two or more hydroxyl groups in the molecule, and one carboxylic acid anhydride in the molecule. The curable resin composition according to (8), which is a polyvalent carboxylic acid resin which is an addition polymer containing a group-containing compound (f) as a polymerization unit.

(10) The curable resin composition according to any one of (7) to (9), further comprising a curing accelerator.
(11) The curable resin composition according to (10), wherein the curing accelerator is a metal soap curing accelerator.
(12) The curable resin composition according to any one of (7) to (11), which is used for optical semiconductor sealing.
(13) A cured product obtained by curing the curable resin composition according to any one of (7) to (12).
(14) An optical semiconductor comprising the cured product according to (13).

According to the present invention, an epoxy group-containing polyorganosiloxane having a specific structure or an epoxy group-containing polyorganosiloxane produced using a specific compound as a raw material and a curable resin composition containing the epoxy group-containing polyorganosiloxane have heat resistant transparency, In order to give a cured product having excellent sulfidity and low tackiness, it is extremely useful as a sealing resin for materials that require high transparency and low tackiness, particularly optical semiconductors (LEDs, etc.).

The epoxy group-containing polyorganosiloxane of the present invention is an epoxy resin produced using the following components a to c as raw materials.
(A component) Silicone resin (b component) Epoxy group-containing silicon compound (c component) Silanol-terminated silicone oil

Hereafter, each of the a component to the c component will be described in detail.
The silicone resin (component a) in the present invention is a silicone resin represented by the following average formula (1). It is a component for introducing a phenyl group into the epoxy group-containing siloxane of the present invention without excessively increasing the viscosity and improving the sulfidation resistance of the cured product for optical semiconductor encapsulation of the present invention.

In the formula (1), R ¹ , R ² , R ³ , R ⁴ , R ⁵ , and R ⁶ are monovalent hydrocarbon groups or hydroxyl groups, preferably linear or branched having 1 to 10 carbon atoms in total. Alternatively, it is a cyclic alkyl group or an aryl group having an aromatic hydrocarbon group having 6 to 10 carbon atoms. A plurality of R ¹ to R ⁶ present in the formula may be the same or different, but when R ¹ to R ⁶ in the molecule is 100 mol%, a hydroxyl group (silanol group, Si—OH) is present. 5 to 50 mol%, and the phenyl group is 30 to 95 mol%. Examples of R ¹ to R ⁶ other than hydroxyl group and phenyl group include methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, i-butyl group, tert-butyl group, and n-pentyl group. N-hexyl group, cyclopentyl group, cyclohexyl group, phenyl group, naphthyl group, hydroxyl group and the like. Among these, a methyl group and an n-propyl group are preferable from the viewpoints of compatibility and heat-resistant transparency of the cured product.
Here, when the total amount of R ¹ to R ⁶ in the molecule is 100 mol%, the hydroxyl group (silanol group, Si—OH) is preferably 20 to 45 mol%, particularly preferably 25 to 40 mol%.
Further, when the total amount of R ¹ to R ⁶ in the molecule is 100 mol%, the phenyl group is preferably 35 to 95 mol%, more preferably 40 to 90 mol%, and particularly preferably 50 to 85 mol%.

The hydroxyl group contained in R ¹ to R ⁶ is bonded with an alkoxy group in an epoxy group-containing silicon compound (component b), which will be described later, through a dealcoholization condensation reaction. The hydroxyl group is 5 to 50 mol% when the total amount of R ¹ to R ⁶ is 100 mol%. If it is less than 5 mol%, the bond with the epoxy group-containing silicon compound (component b) will be insufficient, and the unreacted silicone resin component will be contained in the epoxy group-containing polyorganosiloxane. On the other hand, if it exceeds 50 mol%, the viscosity of the epoxy group-containing polyorganosiloxane becomes too high and the workability may be inferior.

Phenyl groups contained in R ¹ - ^{R 6} are compatible, from the viewpoint of improving the sulfidation resistance of the cured ^product, when the entire R 1 - ^{R 6} is 100 mol%, 30 mol% to 95 mol% . If the phenyl group is less than 30 mol%, the compatibility of the epoxy group-containing polyorganosiloxane and the sulfidation resistance of the cured product may be inferior.

The relationship between a and d in the formula (1) is expressed by the following formula.
a / (a + b + c + d) = 0.01 to 1.0, b / (a + b + c + d) = 0 to 0.7, c / (a + b + c + d) = 0 to 0.3, d / (a + b + c + d) = 0 to 0.3 Show.
This indicates that all of the silicone resin (component a) may be a structure, b structure is 0.7 or less, and c and d structures are each 0.3 or less. When there are more c, d structures than 0.3, there exists a possibility that the sulfidation resistance of a hardened material may be inferior. There is a tendency to be inferior.
Among these, the a structure is preferably 0.2 to 0.7, and particularly preferably 0.3 to 0.6. The b structure is preferably from 0.3 to 0.7, particularly preferably from 0.4 to 0.7.

The content of R ¹ to R ^{6 and} the ratio of the ad structures contained in the silicone resin (component a) can be analyzed by ¹ H-NMR, ¹³ C-NMR, ²⁹ Si-NMR, and the like. As an analysis method, for example, the following method can be applied.
-Nuclear magnetic resonance spectrum ( ¹ H-NMR) [JNM-ECA400, manufactured by JEOL Ltd.] was used to measure ¹ H nuclear magnetic resonance spectrum (NMR), and a CDCl ₃ solution was used as the solvent.
• Nuclear magnetic resonance spectrum ( ²⁹ Si-NMR) [Model 500 NMR, manufactured by Agilent Technologies, Inc.] was used to measure the nuclear magnetic resonance spectrum (NMR) of ²⁹ Si, and the solvent was a mixed solution of THF (tetrahydrofuran) and acetone. use.
(In addition, Cr (AcAc) ₃ can be added to 15 mM as a relaxation reagent.)

The weight average molecular weight (Mw) of the silicone resin (component a) is preferably in the range of 400 to 10,000 (GPC). If the weight average molecular weight is less than 400, the cured product may have poor sulfidation resistance, and if it exceeds 10,000, the epoxy group-containing polyorganosiloxane may have too high a viscosity and poor workability. Here, the weight average molecular weight (Mw) is more preferably 1000 to 5000, and particularly preferably 1500 to 3000.
In the present invention, the weight average molecular weight of the silicone resin (component a) is a weight average molecular weight (Mw) calculated in terms of polystyrene based on a value measured under the following conditions using GPC (gel permeation chromatography). Means.

Various conditions of GPC Manufacturer: Shimadzu Corporation Column: Guard column SHODEX GPC LF-G LF-804 (3)
Flow rate: 1.0 ml / min.
Column temperature: 40 ° C
Solvent: THF (tetrahydrofuran)
Detector: RI (differential refraction detector)

The hydroxyl group equivalent (g / eq) of the silicone resin (component a) is preferably from 100 to 1,000, more preferably from 150 to 800, from the viewpoint of ease of reaction control and appropriate viscosity of the resulting epoxy group-containing polyorganosiloxane. To 200 to 600 are particularly preferred.
Silicone resin (component a) includes, for example, tetraalkoxysilane, tetrachlorosilane, phenyltrialkoxysilane, phenyltrichlorosilane, diphenyl dialkoxysilane, diphenyldichlorosilane, alkyltrialkoxysilane having 1 to 10 carbon atoms, 1 to carbon atoms It can be obtained by hydrolytic condensation of a hydrolyzable silane compound such as 10 alkyltrichlorosilanes.

Specific examples of preferable silicone resin (component a) include the following product names. For example, Z-6018, 217FLAKE, FCA-107, 220FLAKE, 233FLAKE, 249FLAKE are manufactured by Toray Dow Corning, and SILRES 603, SILRES 604, SILRES 605, SILRES H44, SILRES4 SY300, SILRES4 SY300, SILRES SY300, SILRES4 SY300, SILRES4 SY300 , SILRES IC836, manufactured by Momentive, Inc. include TSR160. Among these, Z-6018, 217FLAKE, FCA-107, 233FLAKE, SILRES603, and SILRES604 are preferable from the viewpoint of compatibility, molecular weight, and sulfidation resistance of the cured product. These silicone resins (component a) may be used alone or in combination of two or more.

Next, the epoxy group-containing silicon compound (component b) will be described.
The epoxy group-containing silicon compound (component b) in the present invention is an alkoxysilicon compound represented by the formula (2). The epoxy group-containing silicon compound (component b) is a compound for introducing an epoxy group into the epoxy group-containing polyorganosiloxane of the present invention. An epoxy group is introduced by dealcohol condensation with a silanol group (Si—OH group) of the silanol-terminated silicone oil (component c).

In formula (2), X is not particularly limited as long as X is a reactive functional group having an epoxy group.
For example, an alkyl group having 1 to 4 carbon atoms substituted with a glycidoxy group such as β-glycidoxyethyl, γ-glycidoxypropyl, γ-glycidoxybutyl, glycidyl group, β- (3,4-epoxy Cyclohexyl) ethyl group, γ- (3,4-epoxycyclohexyl) propyl group, β- (3,4-epoxycycloheptyl) ethyl group, 4- (3,4-epoxycyclohexyl) butyl group, 5- (3 And an alkyl group having 1 to 5 carbon atoms substituted with a cycloalkyl group having 5 to 8 carbon atoms having an oxirane group such as 4-epoxycyclohexyl) pentyl group. Among these, as an alkyl group having 1 to 3 carbon atoms substituted with a glycidoxy group and an alkyl group having 1 to 3 carbon atoms substituted with a cycloalkyl group having 5 to 8 carbon atoms having an epoxy group, for example, β -Glycidoxyethyl group, γ-glycidoxypropyl group, β- (3,4-epoxycyclohexyl) ethyl group are preferable, and since β- (3,4-epoxycyclohexyl) ethyl group can be particularly suppressed in coloration Is preferred.

In the formula (2), R ⁷ represents an aryl group having a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms or an aromatic hydrocarbon group having 6 to 10 carbon atoms. For example, methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, i-butyl group, tert-butyl group, n-pentyl group, n-hexyl group, cyclopentyl group, cyclohexyl group, phenyl Group, naphthyl group and the like. Among these, a methyl group and a phenyl group are preferable from the viewpoints of compatibility and heat-resistant transparency of the cured product.

R ⁸ in the formula (2) represents a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms. For example, methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, i-butyl group, tert-butyl group, n-pentyl group, n-hexyl group, cyclopentyl group, cyclohexyl group, etc. Can be mentioned. Among these, from the viewpoint of reaction conditions such as compatibility and reactivity, a methyl group or an ethyl group is preferable, and a methyl group is particularly preferable.

E in the formula (2) is an integer representing 0, 1, 2 and f represents (3-e), respectively. From the viewpoint of the viscosity of the epoxy group-containing polyorganosiloxane and the mechanical strength of the cured product, e is preferably 0 or 1.

Specific examples of preferable epoxy group-containing silicon compounds (component b) include β-glycidoxyethyltrimethoxysilane, β-glycidoxyethyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, and γ-glycid. Xylpropyltriethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, γ-glycidoxypropylphenyldimethoxysilane, γ-glycidoxypropylcyclohexyldimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane 2- (3,4-epoxycyclohexyl) ethyltriethoxysilane, 2- (3,4-epoxycyclohexyl) ethylmethyldimethoxysilane, 2- (3,4-epoxycyclohexyl) ethylphenyldimethoxysilane, 2- (3 , -Epoxycyclohexyl) ethylcyclohexyldimethoxysilane, etc., and particularly excellent in reactivity and transparency of a cured product obtained by curing the epoxy group-containing polyorganosiloxane of the present invention. Therefore, 2- (3,4-epoxycyclohexyl) is particularly preferable. ) Ethyltrimethoxysilane is preferred. These epoxy group-containing silicon compounds (component b) may be used alone or in combination of two or more, and may also be used in combination with the following alkoxysilicon compounds (component g).

As the raw material for the epoxy group-containing polyorganosiloxane of the present invention, an alkoxy silicon compound (g component) represented by the following formula (4) can be used together with the epoxy group-containing silicon compound (component b). By using the alkoxysilicon compound (g component) in combination, the viscosity, refractive index and the like of the epoxy group-containing polyorganosiloxane of the present invention can be adjusted.

In the formula (4), R ⁷ and R ⁸ are the same as described above, h is an integer, 0, 1, 2, 3 and i is (4-h).

Specific examples of preferable alkoxysilicon compounds (component g) that can be used in combination include methyltrimethoxysilane, phenyltrimethoxysilane, cyclohexyltrimethoxysilane, methyltriethoxysilane, phenyltriethoxysilane, dimethyldimethoxysilane, methylcyclohexyldimethoxysilane, Examples include dimethyldiethoxysilane, diphenyldimethoxysilane, and diphenyldidiethoxysilane. Among these, methyltrimethoxysilane, phenyltrimethoxysilane, dimethyldimethoxysilane, and diphenyldimethoxysilane are preferable.

Next, the silanol-terminated silicone oil (component c) will be described. In the present invention, the silanol-terminated silicone oil (component c) refers to a silicone resin represented by the following formula (3) and having silanol groups at both ends.

In the formula (3), R ⁹ represents an alkyl group having 1 to 3 carbon atoms such as a methyl group or an aryl group having 6 to 10 carbon atoms such as a phenyl group. A plurality of R ⁹ may be the same or different.

In the formula (3), g represents an average value of 2 to 2000, preferably 3 to 200, more preferably 3 to 100, and further preferably 3 to 50. When g is less than 3, the cured product becomes too hard, and the heat cycle resistance may be inferior. If g exceeds 200, the mechanical strength of the cured product tends to decrease, such being undesirable.

The weight average molecular weight (Mw) of the silanol-terminated silicone oil (component c) is preferably in the range of 400 to 3000 (GPC). When the weight average molecular weight is less than 400, the viscosity of the epoxy group-containing polyorganosiloxane increases, so there is a concern that the workability is inferior. May be difficult to use because of poor permeability.
In the present invention, the weight average molecular weight of the silanol-terminated silicone oil (component c) is a weight average molecular weight (calculated in terms of polystyrene) based on values measured under the following conditions using GPC (gel permeation chromatography). Mw).

Silanol-terminated silicone oil (component c) can be produced, for example, by hydrolyzing and condensing dimethyl dialkoxysilane and dimethyldichlorosilane.

Specific examples of preferable silanol-terminated silicone oil (component c) include the following product names. For example, PRX413, BY16-873 manufactured by Toray Dow Corning Co., Ltd., X-21-5841, KF-9701 manufactured by Shin-Etsu Chemical Co., Ltd., XC96-723, TSR160, YR3370, YF3800, manufactured by Momentive XF3905, YF3057, YF3807, YF3802, YF3897, XF3905, YF3804, Asahi Kasei Wacker Silicone, FINISH WS 62M, CT 601M, CT 5000M, Gelest, DMS-S12, DMS-S14, DMS-S15 , DMS-S21, DMS-S27, DMS-S31, DMS-S32, DMS-S33, DMS-S35, DMS-S42, DMS-S45, DMS-S51, PDS-0332, PDS-1 15, such as PDS-9931 and the like. Among these, from the viewpoint of molecular weight and kinematic viscosity, PRX413, BY16-873, X-21-5841, KF-9701, XC96-723, YF3800, FINISH WS 62 M, DMS-S12, DMS-S14, DMS-S15, DMS-S21 and PDS-1615 are preferred. Among these, X-21-5841, XC96-723, YF3800, FINISH WS 62 M, DMS-S14, and PDS-1615 are particularly preferable from the viewpoint of molecular weight. These silanol-terminated silicone oils (component c) may be used alone or in combination of two or more.

In the production of the epoxy group-containing polyorganosiloxane of the present invention, the epoxy group-containing silicon compound (component b) (for the total amount of silanol groups in the silicone resin (component a) and silanol-terminated silicone oil (component c) 1 equivalent) ( And if necessary, the alkoxy group of the alkoxy silicon compound (g component)) is reacted in an amount smaller than 1.5 equivalents to give an epoxy group-containing silicon compound (component b) (and if necessary, the alkoxy silicon compound (g Two or more alkoxy groups in the component)) will react with the silanol groups of the silicone resin (component a) and / or the silanol-terminated silicone oil (component c), resulting in too much polymer during production and gelation. There is a risk of it. For this reason, it is preferable to make an alkoxy group react with 1.5 equivalent or more with respect to 1 equivalent of silanol groups. From the viewpoint of reaction control, 2.0 equivalents or more is more preferable.

Next, the production process of the epoxy group-containing polyorganosiloxane of the present invention will be described.
The epoxy group-containing polyorganosiloxane of the present invention can be obtained through the production steps I and II or the production steps 1 to 3.
First, the manufacturing steps I and II will be described.
[Production Process I] Silanol group of silicone resin (component a) and silanol-terminated silicone oil (component c), and alkoxy of epoxy group-containing silicon compound (component b) (and alkoxy silicon compound (g) as required) A step of subjecting a group to dealcohol condensation in the presence of an inorganic base compound [Production Step II] A step of adding water after the production step I to condense the remaining alkoxy groups.

By dividing the production process into two stages, first, the silanol group and the alkoxy group are surely reacted to obtain a modified silicone resin and a modified silicone oil, and then the remaining alkoxy groups are dealcoholized and hydrolyzed and condensed to achieve uniform stability. Product can be obtained.

When water is added from the beginning of the manufacturing process as one step, a condensation reaction between a silanol group and an alkoxy group, an epoxy group-containing silicon compound (component b) (and an alkoxy silicon compound (component g) as necessary) ) Polymerization reaction becomes a competitive reaction, resulting in heterogeneous compounds due to differences in reaction rates and compatibility of products, silicone resins that do not have epoxy groups (component a) and silanol-terminated silicones A large amount of oil (component c) may adversely affect the product.
Further, depending on the reaction temperature and the reaction concentration of the raw material, the polymerization of the epoxy group-containing silicon compound (component b) (and the alkoxy silicon compound (component g as necessary)) is caused by the condensation reaction between the silanol group and the alkoxy group. May progress further, become an excessively high molecular weight body and become a solvent-insoluble component (gelation).

In the production process I, the reaction can be carried out without solvent, but the reaction is preferably carried out in the presence of a solvent, and alcohol is particularly preferred among the solvents from the viewpoint of reaction control. Examples of alcohols that can be used include alcohols having 1 to 10 carbon atoms, such as methanol, ethanol, propanol, isopropanol, butanol, t-butanol, hexanol, octanol, nonane alcohol, decane alcohol, cyclohexanol, and cyclopentanol. Etc. In the present invention, primary alcohols and secondary alcohols are preferable, and it is particularly preferable to use primary alcohols or a mixture of primary alcohols and secondary alcohols. Examples of primary alcohols include methanol, ethanol, propanol, butanol, hexanol, octanol, nonane alcohol, decane alcohol, propylene glycol and the like, and examples of secondary alcohols include isopropanol, cyclohexanol, propylene glycol. Etc. From the viewpoint of subsequent removal performance, a low molecular weight alcohol having 1 to 4 carbon atoms such as methanol, ethanol, propanol, isopropanol, butanol, and t-butanol is preferable. These alcohols may be used as a mixture. When they are mixed, they are preferably two or more selected from primary alcohols and secondary alcohols, and at least one component contains primary alcohols. It is preferable because the solubility of the catalyst described later is excellent. The amount of primary alcohol is preferably 5% by weight or more, more preferably 8% by weight or more of the total alcohol amount.
By using a secondary alcohol in combination with this reaction, the amount of change in the weight average molecular weight per unit time in the reaction system of production process I is smaller than when only a primary alcohol is used, making it easier to control the reaction. It is. In general, in the case of large-scale reactions such as industrial production, it becomes difficult to strictly control the reaction time and reaction temperature, so the combined use of secondary alcohols is particularly important for large-scale reactions such as industrial production from the viewpoint of reaction control. Useful for.

In the production process I, the amount of alcohol used is silicone resin (a component), silanol-terminated silicone oil (c component) and epoxy group-containing silicon compound (b component) (and alkoxy silicon compound (g component) if necessary). It is preferable to contain 2% by weight or more based on the total weight. It is more preferably 2 to 100% by weight, further preferably 3 to 50% by weight, particularly preferably 4 to 40% by weight.
When the amount exceeds 100% by weight, the progress of the reaction may be extremely slow. When the amount is less than 2% by weight, the reaction other than the target reaction proceeds, the molecular weight increases, gelation, increase in viscosity, and curing. There may be a problem such as an increase in elastic modulus that makes it difficult to use as an object.
In this reaction, other solvents may be used in combination as necessary.
Examples of solvents that can be used in combination include ketones such as methyl ethyl ketone, methyl isobutyl ketone, and cyclopentanone, esters such as ethyl acetate, butyl acetate, ethyl lactate, and isopropyl butanoate, hexane, hydrocarbons such as cyclohexane, toluene, and xylene. it can.

Since many silicone resins (component a) used in this reaction are in a solid state, it is desirable to use a solvent that dissolves the silicone resin (component a). In that case, methyl isobutyl ketone, butyl acetate, and toluene are preferable from the viewpoint of workability such as the solubility, versatility, and boiling point of the silicone resin (component a) are not too low. Among them, the stability of the epoxy group-containing organopolysiloxane is preferred. From the viewpoint of transparency, methyl isobutyl ketone and toluene are particularly preferable.

The reaction in the production step I of the present invention is performed in the presence of an inorganic base compound. In the reaction of the present invention, the inorganic base compound acts as a catalyst for the reaction. When the reaction is carried out without addition, the reaction progress is slow and the reaction efficiency is remarkably poor. In addition, in the presence of an organic base such as triethylamine, the reaction efficiency is poor because the basicity is weak, the viscosity of the resulting epoxy group-containing polyorganosiloxane is too low, the hardness of the cured product is insufficient, and depending on the reaction temperature The reaction may not proceed.

By using an inorganic base compound, not only can the reaction sufficiently proceed, but it can be easily removed from the product.
Examples of the inorganic base compound include alkali metal inorganic salts such as sodium hydroxide, potassium hydroxide and calcium hydroxide, or alkaline earth metal inorganic salts, and hydroxides are particularly preferable. Among these, potassium hydroxide is particularly preferable from the viewpoint of catalytic ability and solubility in alcohol.

The addition method of an inorganic base compound is used in the state added directly or in the state melt | dissolved in the soluble solvent. Among them, it is preferable to add the catalyst in a state in which the catalyst is dissolved in advance in alcohols such as methanol, ethanol, propanol and butanol. In this case, addition as an aqueous solution using water or the like causes a sol-gel reaction other than the target reaction to proceed competitively, and an epoxy group-containing silicon compound (component b) (and alkoxysilicon when used) Since the polycondensation of the alkoxy group of the compound (component (g)) is allowed to proceed unilaterally, the resulting reaction product and the silanol-terminated silicone oil (component c) may not be compatible and may become cloudy. is necessary.
The allowable range of moisture at this time is the total of silicone resin (a component), silanol-terminated silicone oil (c component) and epoxy group-containing silicon compound (b component) (and alkoxy silicon compound (g component) if necessary) It is preferably 0.5% by weight or less, more preferably 0.3% by weight or less, and more preferably no water as much as possible.

The amount of the inorganic base compound that can be used in the production step I of the present invention is as follows: silicone resin (a component), silanol-terminated silicone oil (c component) and epoxy group-containing silicon compound (b component) used for the reaction (and necessary Accordingly, it is usually preferably 0.001 to 5% by weight, more preferably 0.01 to 2% by weight, based on the total weight of the alkoxysilicon compound (component g).

The reaction temperature in the production step I is usually preferably 20 to 160 ° C., more preferably 40 to 100 ° C., particularly preferably 50 to 95 ° C., although it depends on the amount of inorganic base compound added and the solvent used. The reaction time is usually preferably 1 to 20 hours, more preferably 3 to 12 hours.

Next, the manufacturing process II will be described in detail.
In the production process II, after completion of the reaction in the production process I, water is added, the alkoxy group remaining in the modified silicone resin and the modified silicone oil obtained in the production process I, and the epoxy group-containing silicon compound remaining unreacted Hydrolysis dealcohol condensation of the alkoxy group of (component b) (and alkoxysilicon compound (component g) if used) is performed.
This reaction is carried out by using (1) modified silicone resins and / or (2) modified silicone oils and / or (3) silicon compounds containing epoxy groups (component b). And alkoxy silicon compound (component g)) and / or (4) between modified silicone resin and modified silicone oil and / or (5) silicon compound containing modified silicone resin and epoxy group (b) Component) (and alkoxy silicon compound (g component) if used) and / or (6) silicon compound containing modified silicone oil and epoxy group (b component) (and if used) And / or (7) a silicon compound containing an epoxy group (b component). ) (And alkoxy silicon compound (g component) if used) between the partial polymer and modified silicone resin and / or (8) silicon compound containing epoxy group (b component) (and use) In this case, a polymerization reaction is carried out between the partially polymerized alkoxysilicon compound (component g) and the modified silicone oil. The polymerization reactions (1) to (8) are considered to proceed simultaneously in parallel.
In particular, in the production process II, as before, the basic inorganic compound is necessary as a catalyst, and the necessary amount may be added in the production process I first. However, it is not preferable to exceed the range described as a preferred embodiment in the production process I.

In the production step II, it is preferable to add a solvent.
As in the production process I, alcohol is preferably used as the solvent in the production process II. Examples of alcohols that can be used include alcohols having 1 to 10 carbon atoms, such as methanol, ethanol, propanol, isopropanol, butanol, t-butanol, hexanol, octanol, nonane alcohol, decane alcohol, cyclohexanol, and cyclopentanol. Etc. In the present invention, primary alcohols and secondary alcohols are particularly preferred, and primary alcohols are particularly preferred. From the viewpoint of subsequent removal performance, a low molecular weight alcohol having 1 to 4 carbon atoms such as methanol, ethanol, propanol, isopropanol, butanol, and t-butanol is preferable. These alcohols may be used as a mixture. The presence of these alcohols can contribute to molecular weight control and stability.
As the addition amount of alcohol, the silicone resin (a component) charged in the production process I, the silicon compound (b component) containing an epoxy group (and the alkoxy silicon compound (g component) if necessary), and a silanol-terminated silicone oil are used. It is preferably 20 to 200% by weight, more preferably 20 to 150% by weight, and particularly preferably 30 to 120% by weight based on the total weight of the component (c).

In the production process II, water is added (ion exchange water, distilled water, or clean water can be used). The amount of water used is preferably 0.5 to 8.0 equivalents, more preferably 0.6 to 5.0 equivalents, particularly preferably 0.65 to 2.0 equivalents relative to the amount of remaining alkoxy groups. is there.
When the amount of water is less than 0.5 equivalent, the progress of the reaction is slowed, and the silicon compound containing the epoxy group (component b) (and the alkoxy silicon compound (component g) if necessary) does not react. There is a possibility that a problem such as remaining may occur, a sufficient network may not be formed, and a curing failure may occur even after curing after a subsequent curable resin composition. On the other hand, if it exceeds 8.0 equivalents, the molecular weight control is not effective, and the molecular weight may be higher than necessary. Furthermore, there is a possibility of inhibiting the stability of the epoxy group-containing polyorganosiloxane.

The reaction temperature in the production step II is preferably 20 to 160 ° C., more preferably 40 to 100 ° C., particularly preferably 50 to 95 ° C., although it depends on the amount of catalyst and the solvent used. The reaction time is usually 1 to 20 hours, preferably 3 to 12 hours.

After completion of the reaction, the catalyst can be removed by quenching and / or washing with water as necessary. When washing with water, depending on the type of solvent used, it is preferable to add a solvent that can be separated from water. Examples of preferable solvents include ketones such as methyl ethyl ketone, methyl isobutyl ketone and cyclopentanone, esters such as ethyl acetate, butyl acetate, ethyl lactate and isopropyl butanoate, hydrocarbons such as hexane, cyclohexane, toluene and xylene. it can.

In this reaction, the catalyst may be removed only by washing with water. However, since the reaction is carried out under basic conditions, the catalyst is adsorbed by using an adsorbent after washing with water after quenching by a neutralization reaction. It is preferable to remove the adsorbent later by filtration.
Any compound that exhibits acidity can be used for the neutralization reaction. Examples of the compound exhibiting acidity include inorganic acids such as hydrochloric acid, sulfuric acid and nitric acid, and organic acids such as formic acid, acetic acid and oxalic acid. Among these, an inorganic acid is preferable because it can be easily removed from the product, and phosphates and the like that can more easily adjust the pH to near neutral are more preferable.

Examples of the adsorbent include activated clay, activated carbon, zeolite, inorganic / organic synthetic adsorbent, ion exchange resin, and the like, and specific examples include the following products.
As the activated clay, for example, manufactured by Toshin Kasei Co., Ltd., activated clay, SA35, SA1, T, R-15, E, Nikkanite (trade names) G-36, G-153, G-168, Mizusawa Chemical Industries As a product made by the company, Galeon Earth (trade name), Mizuka Ace (trade name) and the like can be mentioned. As the activated carbon, for example, CL-H, Y-10S, Y-10SF manufactured by Ajinomoto Fine Techno Co., Ltd., S, Y, FC, DP, SA1000, K, A, KA, M, CW130BR manufactured by Phutamura Chemical Co., Ltd. , CW130AR, GM130A, and the like. Examples of the zeolite include, for example, molecular sieves (trade names) 3A, 4A, 5A, and 13X manufactured by Union Showa. Examples of the synthetic adsorbent include Kyowa Chemical Co., Ltd., Kyoward (trade name) 100, 200, 300, 400, 500, 600, 700, 1000, 2000, and Rohm and Haas Co., Ltd. (Product Name) 15JWET, 15DRY, 16WET, 31WET, A21, Amberlite (Product Name) IRA400JCl, IRA403BLCl, IRA404JCl, manufactured by Dow Chemical Co., Dowex (Product Name) 66, HCR-S, HCR-W2, MAC- 3 etc. are mentioned.
The adsorbent is added to the reaction solution, followed by treatment such as stirring and heating to adsorb the catalyst, and then the adsorbent is filtered and the residue is washed with water to remove the catalyst and adsorbent.

After completion of the reaction or after quenching, it can be purified by conventional separation and purification means other than water washing and filtration. Examples of the purification means include column chromatography, vacuum concentration, distillation, extraction and the like. These purification means may be performed singly or in combination.

When the reaction is performed using a solvent mixed with water as a reaction solvent, the reaction solvent mixed with water is removed from the system by distillation or vacuum concentration after quenching, and then washed with a solvent that can be separated from water. It is preferable.

After washing with water, the epoxy group-containing polyorganosiloxane of the present invention can be obtained by removing the solvent by vacuum concentration or the like.

The production steps I and II in the present invention and the quenching, water washing, adsorption and separation / purification methods of the epoxy group-containing polyorganosiloxane obtained through the above have been described above.

Next, manufacturing steps 1 to 3 will be described.
[Production Process 1] The silanol group of the silicone resin (component a) and the epoxy group-containing silicon compound (component b) (and the alkoxy group of the alkoxy silicon compound (component g as necessary)) are removed in the presence of an inorganic base compound. Step of alcohol condensation [Manufacturing step 2] After manufacturing step 1, silanol-terminated silicone oil (component c) is added, and dealcoholization of the alkoxy group remaining through manufacturing step 1 and the silanol group of component c Step of performing condensation [Manufacturing step 3] A step of adding water after manufacturing step 2 to condense the remaining alkoxy groups.

By dividing the production process into three stages, first, a silanol group and an alkoxy group of the silicone resin (component a) having relatively low reactivity in the production process 1 are surely reacted to obtain a modified silicone resin, and then the production process 2 In Step 3, the silanol-terminated silicone oil (component c) is added and the silanol group of the relatively highly reactive silanol-terminated silicone oil (component c) is reacted with the alkoxy group to obtain a modified silicone oil. The remaining alkoxy group can be dealcoholized and hydrolyzed to obtain a uniform and stable product.

By making the manufacturing process into three stages, it is possible to obtain a more uniform and stable product than the above-described two-stage manufacturing processes I and II.

When water is added from the beginning of the manufacturing process in one step, the condensation reaction between the silanol group and the alkoxy group and the polymerization reaction between the alkoxysilanes become a competitive reaction, resulting in a difference in the reaction rate between the products and the compatibility of the products. Due to the difference, a heterogeneous compound can be obtained, or a large amount of silicone resin (a component) or silanol-terminated silicone oil (c component) having no epoxy group can be adversely affected.

In the production process 1, the reaction can be carried out without a solvent, but the reaction is preferably carried out in the presence of a solvent, and among the solvents, alcohol is particularly preferred from the viewpoint of reaction control. Examples of alcohols that can be used include alcohols having 1 to 10 carbon atoms, such as methanol, ethanol, propanol, isopropanol, butanol, t-butanol, hexanol, octanol, nonane alcohol, decane alcohol, cyclohexanol, and cyclopentanol. Etc. In the present invention, primary alcohols and secondary alcohols are preferable, and it is particularly preferable to use primary alcohols or a mixture of primary alcohols and secondary alcohols. Examples of primary alcohols include methanol, ethanol, propanol, butanol, hexanol, octanol, nonane alcohol, decane alcohol, propylene glycol, and the like. Examples of secondary alcohols include isopropanol, cyclohexanol, propylene glycol. Etc. In view of the problem of removal performance later, a low molecular weight alcohol having 1 to 4 carbon atoms such as methanol, ethanol, propanol, isopropanol, butanol and t-butanol is preferred. These alcohols may be used as a mixture. When they are mixed, they are preferably two or more selected from primary alcohols and secondary alcohols, and at least one component contains primary alcohols. It is preferable because the solubility of the catalyst described later is excellent. The amount of primary alcohol is preferably 5% by weight or more, more preferably 10% by weight or more of the total alcohol amount.

By using a secondary alcohol in combination with this reaction, the amount of change in the weight average molecular weight per unit time in the reaction system of production process 1 is smaller than when only the primary alcohol is used, so the reaction is more easily controlled. It is. In general, in the case of large-scale reactions such as industrial production, it becomes difficult to strictly control the reaction time and reaction temperature, so the combined use of secondary alcohols is particularly important for large-scale reactions such as industrial production from the viewpoint of reaction control. Useful for.

In production step 1, the amount of alcohol used is 2% by weight based on the total weight of the silicone resin (component a) and the epoxy group-containing silicon compound (component b) (and the alkoxysilicon compound (component g) as required). It is preferable to contain above. It is more preferably 2 to 100% by weight, further preferably 3 to 50% by weight, particularly preferably 4 to 40% by weight.
If it exceeds 100% by weight, the progress of the reaction may be extremely slow. If it is less than 2% by weight, the reaction other than the intended reaction proceeds, the molecular weight increases, gelation, increase in viscosity, and curing. There is a possibility that a problem such as an increase in elastic modulus that makes it difficult to use as an object may occur.
In this reaction, other solvents may be used in combination as necessary.
Examples of solvents that can be used in combination include ketones such as methyl ethyl ketone, methyl isobutyl ketone, and cyclopentanone, esters such as ethyl acetate, butyl acetate, ethyl lactate, and isopropyl butanoate, hexane, cyclohexane, toluene, and xylene hydrocarbons. It can be illustrated.

Since most of the silicone resins (component a) used in this reaction are in a solid state, it is desirable to dissolve them in the initial stage of production process 1.
As the solvent, an epoxy group-containing silicon compound (component b) (and an alkoxysilicon compound (component g as necessary)) that is usually liquid may be used, or the above-described solvents that can be used in combination may be used. .
When using a solvent, methyl isobutyl ketone, butyl acetate, and toluene are preferable from the viewpoint of workability such as the solubility, versatility, and boiling point of the silicone resin (component a) are not too low. Among them, epoxy group-containing organopolysiloxanes are preferred. Methyl isobutyl ketone and toluene are particularly preferable from the viewpoints of stability and transparency.

The reaction in the production step 1 of the present invention is performed in the presence of an inorganic base compound. In the reaction of the present invention, the inorganic base compound acts as a catalyst for the reaction. When the reaction is carried out without addition, the reaction progress is slow and the reaction efficiency is remarkably poor. In the presence of an organic base such as triethylamine, the basicity is weak, the reaction efficiency is poor, the viscosity of the resulting epoxy resin is too low, the hardness of the cured product is insufficient, and the reaction proceeds depending on the reaction temperature. Sometimes it doesn't.

By using an inorganic base compound, not only can the reaction sufficiently proceed, but it can be easily removed from the product.
Examples of the inorganic base compound include alkali metal salts such as sodium hydroxide, potassium hydroxide and calcium hydroxide, or alkaline earth metal salts, and hydroxides are particularly preferable. Among these, potassium hydroxide is particularly preferable from the viewpoint of catalytic ability and solubility in alcohol.
The addition method of an inorganic base compound is used in the state added directly or in the state melt | dissolved in the soluble solvent. Among them, it is preferable to add the catalyst in a state in which the catalyst is dissolved in advance in alcohols such as methanol, ethanol, propanol and butanol. At this time, addition as an aqueous solution using water or the like causes a sol-gel reaction other than the target reaction to proceed competitively, and the epoxy group-containing silicon compound (component b) (and alkoxy if necessary) The polycondensation of the alkoxy group of the silicon compound (component g) is unilaterally advanced, the reaction product produced thereby, the silicone resin (component a), and the silanol-terminated silicone oil (component c) added in production step 2 It is necessary to be careful because it may become incompatible and become cloudy.
Throughout the production steps 1 and 2, the allowable range of moisture is silicone resin (component a), silanol-terminated silicone oil (component c) and epoxy group-containing silicon compound (component b) (and alkoxy silicon compound (component g) as required) ) Is preferably 0.5% by weight or less, more preferably 0.3% by weight or less, and more preferably as little water as possible.

The amount of the inorganic base compound that can be used in the production process 1 of the present invention includes the silicone resin (a component), silanol-terminated silicone oil (c component) and epoxy group-containing silicon compound (b component) used in the reaction (and necessary Accordingly, it is usually preferably 0.001 to 5% by weight, more preferably 0.01 to 2% by weight, based on the total weight of the alkoxysilicon compound (component g).

The reaction temperature in the production step 1 is preferably 20 to 160 ° C., more preferably 40 to 100 ° C., particularly preferably 50 to 95 ° C., although it depends on the amount of inorganic base compound added and the solvent used. The reaction time is usually preferably 1 to 20 hours, more preferably 2 to 12 hours.

Next, manufacturing process 2 will be described in detail.
In production step 2, silanol-terminated silicone oil (component c) is added after production step 1, silanol groups of silanol-terminated silicone oil (component c), and epoxy group-containing silicon compound (component b) (and necessary) Depending on the case, dealcohol condensation with the alkoxy group of the alkoxysilicon compound (g component) is carried out. Through production step 2, the silicone resin (component a) and the silanol-terminated silicone oil (component c) are condensed with an epoxy group-containing silicon compound (component b) (and, if necessary, an alkoxy silicon compound (component g)). Thus, a modified silicone resin and a modified silicone oil can be obtained.

The reaction in the production process 2 of the present invention is performed in the presence of an inorganic base compound for the same reason as in the production process 1. The inorganic base compound used in the production process 2 is used within the range of the kind and addition amount exemplified in the production process 1 described above, but a new inorganic base compound may be added in the production process 2.
The reaction in the production process 2 of the present invention can be carried out without a solvent as in the production process 1, but it is preferably carried out in the presence of a solvent. The solvent used in the manufacturing process 2 can be used within the range of the kind and addition amount exemplified in the manufacturing process 1 described above.

The reaction temperature in the production step 2 is usually preferably 20 to 160 ° C., more preferably 40 to 100 ° C., and particularly preferably 50 to 95 ° C., although it depends on the amount of inorganic base compound added and the solvent used. The reaction time is usually preferably 1 to 20 hours, more preferably 2 to 12 hours.

Next, the manufacturing process 3 will be described in detail.
In the production process 3, after completion of the reaction in the production process 2, water is added, and the alkoxy group remaining in the modified silicone resin and modified silicone oil obtained in the production processes 1 and 2 and the epoxy group remaining unreacted are contained. Hydrolytic dealcohol condensation of the alkoxy group of the silicon compound (component b) (and the alkoxysilicon compound (component g) if necessary) is performed.
At this time, if necessary, the above-mentioned epoxy compound-containing silicon compound (component b) (and, if necessary, an alkoxysilicon compound (component g)) and an inorganic base compound are added within the aforementioned amounts. It doesn't matter. This reaction is carried out by using (1) modified silicone resins and / or (2) modified silicone oils and / or (3) silicon compounds containing epoxy groups (component b). And alkoxy silicon compound (component g)) and / or (4) between modified silicone resin and modified silicone oil and / or (5) silicon compound containing modified silicone resin and epoxy group (b) Component) (and alkoxy silicon compound (g component) if used) and / or (6) silicon compound containing modified silicone oil and epoxy group (b component) (and if used) And / or (7) a silicon compound containing an epoxy group (b component). ) (And alkoxy silicon compound (g component) if used) between the partially polymerized product and the modified silicone resin and / or (8) silicon compound containing epoxy group (b component) (and use) In this case, a polymerization reaction is carried out between the alkoxysilicon compound (component g)) partial polymer and the modified silicone oil. The polymerization reactions (1) to (8) are considered to proceed simultaneously in parallel.
In particular, in the production process 3, as in the previous case, a basic inorganic compound is not necessarily required as the catalyst, and a necessary amount may be added in advance in the production processes 1 and 2. However, it is not preferable to exceed the range described in the production process 1 as a preferred embodiment.

In the production process 3, it is preferable to add a solvent.
It is preferable to use an alcohol as the solvent in the production step 3 as in the production steps 1 and 2. Examples of alcohols that can be used include alcohols having 1 to 10 carbon atoms, such as methanol, ethanol, propanol, isopropanol, butanol, t-butanol, hexanol, octanol, nonane alcohol, decane alcohol, cyclohexanol, and cyclopentanol. Etc. In the present invention, primary alcohols and secondary alcohols are particularly preferred, and primary alcohols are particularly preferred. From the viewpoint of subsequent removal performance, a low molecular weight alcohol having 1 to 4 carbon atoms such as methanol, ethanol, propanol, isopropanol, butanol, and t-butanol is preferable. These alcohols may be used as a mixture. The presence of these alcohols can contribute to molecular weight control and stability.

As the addition amount of alcohol, the silicone resin (a component) charged in the production steps 1 and 2, the silicon compound containing epoxy group (b component) (and the alkoxy silicon compound (g component) if necessary) and the silanol terminal It is preferably 20 to 200% by weight, more preferably 20 to 150% by weight, and particularly preferably 30 to 120% by weight based on the total weight with the silicone oil (component c).

In the production process 3, water is added (ion exchange water, distilled water, or clean water can be used). The amount of water used is preferably 0.5 to 8.0 equivalents, more preferably 0.6 to 5.0 equivalents, particularly preferably 0.65 to 2.0 equivalents relative to the amount of remaining alkoxy groups. is there.
When the amount of water is less than 0.5 equivalent, the progress of the reaction is slowed, and the silicon compound containing the epoxy group (component b) (and the alkoxy silicon compound (component g) if necessary) does not react. There is a possibility that a problem such as remaining may occur, a sufficient network may not be formed, and a curing failure may occur even after curing after a subsequent curable resin composition. On the other hand, if it exceeds 8.0 equivalents, the molecular weight control is not effective, and the molecular weight may be higher than necessary. Furthermore, there is a possibility of inhibiting the stability of the epoxy group-containing polyorganosiloxane.

The reaction temperature in production step 3 is usually preferably 20 to 160 ° C., more preferably 40 to 100 ° C., and particularly preferably 50 to 95 ° C., although it depends on the amount of inorganic base compound added and the solvent used. The reaction time is usually preferably 1 to 20 hours, more preferably 3 to 12 hours.

The production steps 1 to 3 of the present invention have been described above.

After the production steps 1 to 3, the quenching, washing, adsorption, separation and purification described above can be performed.

The appearance of the epoxy group-containing polyorganosiloxane obtained through the production steps I and II or the production steps 1 to 3 of the present invention is usually a colorless and transparent liquid having fluidity at 25 ° C. The molecular weight is preferably 1000 to 20000, more preferably 2000 to 10000, and particularly preferably 3000 to 7000 as the weight average molecular weight measured by GPC. When the weight average molecular weight is less than 1000, the heat resistance may be lowered. When the weight average molecular weight is more than 20000, the encapsulant may be peeled from the substrate during reflow soldering of the LED element encapsulated using the weight average molecular weight.
The weight average molecular weight is a polystyrene equivalent weight average molecular weight (Mw) measured under the following conditions using GPC (gel permeation chromatography).

The epoxy equivalent (measured by the method described in JIS K-7236) of the epoxy group-containing polyorganosiloxane of the present invention is 300 to 1500 g / eq. Preferably, 320 to 1400 g / eq, more preferably 350 to 1200 g / eq, and particularly preferably 350 to 1000 g / eq. When the epoxy equivalent is less than 300 g / eq, the cured product tends to be too hard, and when it exceeds 1500 g / eq, the mechanical properties of the cured product tend to deteriorate.

The epoxy group-containing polyorganosiloxane may be a single epoxy group-containing polyorganosiloxane or a mixture of two or more epoxy group-containing polyorganosiloxanes. Here, from the viewpoint of appropriate mechanical strength of the cured product, if the epoxy resin is a mixture of two or more epoxy group-containing polyorganosiloxanes, it is specified if it is a single epoxy group-containing polyorganosiloxane. The epoxy equivalent of the sum of the epoxy equivalent of the epoxy group-containing polyorganosiloxane x (content of the specific epoxy group-containing polyorganosiloxane / total amount of the epoxy group-containing polyorganosiloxane) is 300 to 1500 g / eq. It is preferably 350 to 1000 g / eq.

The viscosity of the epoxy group-containing polyorganosiloxane (E-type viscometer, measured at 25 ° C.) is preferably 50 to 40,000 mPa · s, more preferably 500 to 20,000 mPa · s, particularly 800 to 15, 000 mPa · s is preferred. If the viscosity is less than 50 mPa · s, the viscosity may be too low to be suitable for use as an optical semiconductor encapsulant, and if it exceeds 40,000 mPa · s, the viscosity may be too high and workability may be poor. is there.

In the epoxy group-containing polyorganosiloxane, the ratio of silicon atoms to which three oxygen atoms are bonded to the total silicon atoms is preferably 3 to 50 mol%, more preferably 5 to 40 mol%, and particularly preferably 6 to 35 mol%. . If the ratio of silicon atoms bonded to three oxygen atoms to the total silicon atoms is less than 3 mol%, the cured product tends to be too soft, and there is a concern of surface tack and scratches. Moreover, when it exceeds 50 mol%, hardened | cured material may become hard too much and is not preferable.
The proportion of silicon atoms present can be determined by ¹ H NMR, ²⁹ Si NMR, elemental analysis, etc. of the epoxy group-containing polyorganosiloxane.

The resulting epoxy group-containing polyorganopolysiloxane of the present invention has the following structure, for example.
An epoxy having the following silicone resin structure (A), epoxy group-containing silsesquioxane structure (B), and silicone oil structure (C) linked to each other and having a silanol group and / or an alkoxy group having 1 to 10 carbon atoms Group-containing polyorganosiloxane.

Silicone resin structure (A):

Epoxy group-containing silsesquioxane structure (B):

Silicone oil structure (C):

As described above, the silicone resin (component a) and the silanol-terminated silicone oil (component c) that can be obtained through the production steps I and II or the production steps 1 to 3, which are preferred embodiments of the epoxy group-containing polyorganosiloxane in the present invention. The condensate of the silanol group and the silicon compound containing the epoxy group (component b) (and, if necessary, the alkoxysilicon compound (component g)) has been described.

The resin composition for encapsulating an optical semiconductor of the present invention may be used by mixing an epoxy resin in addition to the epoxy group-containing organopolysiloxane obtained through the production steps I and II or the production steps 1 to 3 described above. it can.
Other epoxy resins that can be used include epoxy resins that are glycidyl etherified products of phenolic compounds, epoxy resins that are glycidyl etherified products of various novolak resins, alicyclic epoxy resins, aliphatic epoxy resins, heterocyclic epoxy resins, Glycidyl ester epoxy resins, glycidyl amine epoxy resins, epoxy resins obtained by glycidylation of halogenated phenols, copolymers of polymerizable unsaturated compounds having an epoxy group and other polymerizable unsaturated compounds, etc. Can be mentioned.

Examples of the epoxy resin that is a glycidyl etherified product of the phenol compound include 2- [4- (2,3-epoxypropoxy) phenyl] -2- [4- [1,1-bis [4- (2,3 -Hydroxy) phenyl] ethyl] phenyl] propane, bisphenol A, bisphenol F, bisphenol S, 4,4'-biphenol, tetramethyl bisphenol A, dimethyl bisphenol A, tetramethyl bisphenol F, dimethyl bisphenol F, tetramethyl bisphenol S, Dimethylbisphenol S, tetramethyl-4,4′-biphenol, dimethyl-4,4′-biphenol, 1- (4-hydroxyphenyl) -2- [4- (1,1-bis- (4-hydroxyphenyl) Ethyl) phenyl] propane, 2,2'-me Ren-bis (4-methyl-6-tert-butylphenol), 4,4′-butylidene-bis (3-methyl-6-tert-butylphenol), trishydroxyphenylmethane, resorcinol, hydroquinone, pyrogallol, phloroglucinol, Examples thereof include phenols having a diisopropylidene skeleton, phenols having a fluorene skeleton such as 1,1-di-4-hydroxyphenylfluorene, and epoxy resins which are glycidyl etherified products of polyphenol compounds such as phenolized polybutadiene.

Examples of epoxy resins that are glycidyl etherified products of various novolak resins include phenols, cresols, ethylphenols, butylphenols, octylphenols, bisphenols such as bisphenol A, bisphenol F and bisphenol S, and various phenols such as naphthols. And glycidyl etherified products of various novolac resins such as a novolak resin, a phenol novolac resin containing a xylylene skeleton, a phenol novolak resin containing a dicyclopentadiene skeleton, a phenol novolak resin containing a biphenyl skeleton, and a phenol novolac resin containing a fluorene skeleton.

Examples of the alicyclic epoxy resin include alicyclic rings having an aliphatic ring skeleton such as 3,4-epoxycyclohexylmethyl- (3,4-epoxy) cyclohexylcarboxylate and bis (3,4-epoxycyclohexylmethyl) adipate. An epoxy resin is mentioned.
Examples of the aliphatic epoxy resin include glycidyl ethers of polyhydric alcohols such as 1,4-butanediol, 1,6-hexanediol, polyethylene glycol, and pentaerythritol.
Examples of the heterocyclic epoxy resin include heterocyclic epoxy resins having a heterocyclic ring such as an isocyanuric ring and a hydantoin ring.
Examples of the glycidyl ester-based epoxy resin include epoxy resins made of carboxylic acid esters such as hexahydrophthalic acid diglycidyl ester.
Examples of the glycidylamine-based epoxy resin include epoxy resins obtained by glycidylating amines such as aniline and toluidine.
Examples of epoxy resins obtained by glycidylating halogenated phenols include brominated bisphenol A, brominated bisphenol F, brominated bisphenol S, brominated phenol novolac, brominated cresol novolac, chlorinated bisphenol S, chlorinated bisphenol A, and the like. An epoxy resin obtained by glycidylating any of the halogenated phenols.

As a copolymer of a polymerizable unsaturated compound having an epoxy group and another polymerizable unsaturated compound other than the above, as a product available from the market, Marproof (trade name) G-0115S, G-0130S, G-0250S, G-1010S, G-0150M, G-2050M (manufactured by NOF Corporation) and the like. Examples of polymerizable unsaturated compounds having an epoxy group include glycidyl acrylate, methacrylic acid, and the like. Examples thereof include glycidyl acid and 4-vinyl-1-cyclohexene-1,2-epoxide. Examples of other polymerizable unsaturated compound copolymers include methyl (meth) acrylate, ether (meth) acrylate, benzyl (meth) acrylate, cyclohexyl (meth) acrylate, styrene, and vinylcyclohexane.

The above epoxy resins may be used alone or in combination of two or more.

Among the above-described epoxy resins, the combined use of an alicyclic epoxy resin is preferable from the viewpoints of transparency, heat-resistant transparency, and light-resistant transparency. In the case of an alicyclic epoxy resin, a compound having an epoxycyclohexane structure in the skeleton is preferable, and an epoxy resin obtained by an oxidation reaction of a compound having a cyclohexene structure is particularly preferable.
Examples of these epoxy resins include esterification reaction of cyclohexene carboxylic acid and alcohols or esterification reaction of cyclohexene methanol and carboxylic acids (Tetrahedron vol. 36 p. 2409 (1980), Tetrahedron Letter p. 4475 (1980), etc. Described), or Tyschenko reaction of cyclohexene aldehyde (method described in Japanese Patent Application Laid-Open No. 2003-170059, Japanese Patent Application Laid-Open No. 2004-262871, etc.), and transesterification of cyclohexene carboxylic acid ester (Japan) Examples thereof include compounds obtained by oxidizing compounds that can be produced by the method described in Japanese Patent Application Laid-Open No. 2006-052187, etc. (the entire contents of these references are incorporated herein by reference).

The alcohol is not particularly limited as long as it is a compound having an alcoholic hydroxyl group, but ethylene glycol, propylene glycol, 1,3-propanediol, 1,2-butanediol, 1,4-butanediol, 1,5-pentane. Diol, 1,6-hexanediol, cyclohexanedimethanol, 2,4-diethylpentanediol, 2-ethyl-2-butyl-1,3-propanediol, neopentyl glycol, tricyclodecane dimethanol, norbornenediol, etc. Diols, glycerol, trimethylolethane, trimethylolpropane, trimethylolbutane, triols such as 2-hydroxymethyl-1,4-butanediol, tetraols such as pentaerythritol and ditrimethylolpropane And the like. Examples of carboxylic acids include, but are not limited to, oxalic acid, maleic acid, fumaric acid, phthalic acid, isophthalic acid, adipic acid, and cyclohexanedicarboxylic acid.

Furthermore, the acetal compound by acetal reaction of a cyclohexene aldehyde derivative and an alcohol body is mentioned.
Specific examples of these epoxy resins include ERL-4221, UVR-6105, ERL-4299 (all trade names, all manufactured by Dow Chemical), Celoxide 2021P, Epolide GT401, EHPE3150, EHPE3150CE (all trade names, all Daicel) (Chemical Industry) and dicyclopentadiene diepoxide, and the like, but are not limited to them (reference: review epoxy resin basic edition I p76-85, the entire contents of which are incorporated herein by reference).

When the epoxy group-containing organopolysiloxane is used in combination with another epoxy resin, the ratio of the epoxy group-containing organopolysiloxane to the total epoxy resin is preferably 60 to 99 parts by weight, preferably 90 to 97 parts by weight. Is particularly preferred. If the amount is less than 60 parts by weight, the light resistance (UV resistance) of the cured product may be inferior.

In the curable resin composition of the present invention, the blending ratio of the total epoxy resin containing the epoxy group-containing organopolysiloxane and the epoxy resin curing agent is 0.5 to 1.2 equivalents relative to 1 equivalent of the epoxy groups of all epoxy resins. It is preferable to use a curing agent. When less than 0.5 equivalent or more than 1.2 equivalent with respect to 1 equivalent of an epoxy group, curing may be incomplete and good cured properties may not be obtained.

Next, the epoxy resin curing agent will be described.
Examples of the epoxy resin curing agent include amine compounds, acid anhydride compounds, amide compounds, phenol compounds, and polyvalent carboxylic acid compounds.
In the present invention, the epoxy resin curing agent is particularly preferably an acid anhydride compound or a polyvalent carboxylic acid compound from the viewpoints of hardness, workability (being liquid at room temperature), and transparency of the cured product. , A carbinol-modified silicone oil (d) at both ends, a polyhydric alcohol compound (e) having two or more hydroxyl groups in the molecule, a compound (f) having one carboxylic anhydride group in the molecule, A polyvalent carboxylic acid resin obtained by addition reaction with a compound (h) having two or more carboxylic acid anhydride groups in the molecule as required is most preferred.

Specific examples of acid anhydride compounds include phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methyl nadic anhydride, nadic anhydride, hexahydro Phthalic anhydride, methylhexahydrophthalic anhydride, glutaric anhydride, 2,4-diethyl glutaric anhydride, 3,3-dimethyl glutaric anhydride, butanetetracarboxylic anhydride, bicyclo [2,2,1] heptane- Acids such as 2,3-dicarboxylic acid anhydride, methylbicyclo [2,2,1] heptane-2,3-dicarboxylic acid anhydride, cyclohexane-1,3,4-tricarboxylic acid-3,4-anhydride Anhydrides are mentioned.
In particular, methyltetrahydrophthalic anhydride, methylnadic anhydride, nadic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, 2,4-diethylglutaric anhydride, butanetetracarboxylic anhydride, bicyclo [2,2, 1] heptane-2,3-dicarboxylic acid anhydride, methylbicyclo [2,2,1] heptane-2,3-dicarboxylic acid anhydride, cyclohexane-1,3,4-tricarboxylic acid-3,4-anhydride Are preferable from the viewpoints of light resistance, transparency, and workability.

The polyvalent carboxylic acid compound is a compound having at least two carboxyl groups.
The polyvalent carboxylic acid is preferably a bi- to hexafunctional carboxylic acid, such as butanedioic acid, pentanedioic acid, hexanedioic acid, heptanedioic acid, octanedioic acid, nonanedioic acid, decanedioic acid, malic acid, etc. Linear alkyl diacids, alkyl tricarboxylic acids such as 1,3,5-pentanetricarboxylic acid, citric acid, phthalic acid, hexahydrophthalic acid, methylhexahydrophthalic acid, tetrahydrophthalic acid, methyltetrahydrophthalic acid, cyclohexanetricarboxylic acid An aliphatic cyclic polycarboxylic acid such as acid, nadic acid and methyl nadic acid; a multimer of unsaturated fatty acids such as linolenic acid and oleic acid; and dimer acids which are reduced products thereof; Examples include compounds obtained by reaction with acid anhydrides, bifunctional to hexafunctional polyhydric alcohols and acid anhydrides Compounds obtained by the reaction of, heat resistance, and more preferable from the viewpoint of workability. Furthermore, the polyhydric carboxylic acid whose said acid anhydride is a saturated aliphatic cyclic acid anhydride is preferable from a transparency viewpoint.

The bi- to hexafunctional polyhydric alcohol is not particularly limited as long as it is a compound having an alcoholic hydroxyl group, but ethylene glycol, propylene glycol, 1,3-propanediol, 1,2-butanediol, 1,4-butanediol. 1,5-pentanediol, 1,6-hexanediol, cyclohexanedimethanol, 2,4-diethylpentanediol, 2-ethyl-2-butyl-1,3-propanediol, neopentyl glycol, tricyclodecanedi Diols such as methanol and norbornenediol, triols such as glycerin, trimethylolethane, trimethylolpropane, trimethylolbutane, 2-hydroxymethyl-1,4-butanediol, tetraerythritol, ditrimethylolpropane and the like Raoul acids, hexaol such as dipentaerythritol, terminal alcohol polyester compound having an alcoholic hydroxyl group-terminated hydrocarbon polyhydric alcohol compound, such as an alcoholic hydroxyl group-terminated oligomer or polymer, such as a terminal alcohol polycarbonate compounds.

Preferred polyhydric alcohols are alcohols having 5 or more carbon atoms, such as 1,6-hexanediol, 1,4-cyclohexanedimethanol, 1,3-cyclohexanedimethanol, 1,2-cyclohexanedimethanol, 2,4 Compounds such as diethylpentanediol, 2-ethyl-2-butyl-1,3-propanediol, neopentyl glycol, tricyclodecane dimethanol, norbornene diol are preferred, and 2-ethyl-2-butyl-1,3 is particularly preferred Alcohols having a branched chain structure or a cyclic structure such as propanediol, neopentyl glycol, 2,4-diethylpentanediol, 1,4-cyclohexanedimethanol, tricyclodecane dimethanol, norbornenediol, Preferred from the viewpoint of transparency In particular, tricyclodecanedimethanol are preferred.

Examples of acid anhydrides to be reacted with polyhydric alcohols include methyltetrahydrophthalic anhydride, methylnadic anhydride, nadic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, glutaric anhydride, and 2,4-diethylglutaric anhydride. Acid, 3,3-dimethylglutaric anhydride, butanetetracarboxylic anhydride, bicyclo [2,2,1] heptane-2,3-dicarboxylic anhydride, methylbicyclo [2,2,1] heptane-2, 3-dicarboxylic acid anhydride, cyclohexane-1,3,4-tricarboxylic acid-3,4-anhydride and the like are preferable. Among them, methylhexahydrophthalic anhydride, 2,4-diethyl glutaric anhydride, cyclohexane-1,3 , 4-tricarboxylic acid-3,4-anhydride is preferred from the viewpoints of heat resistance, transparency and workability.
The conditions for the addition reaction can be used without any particular limitation as long as they are known methods. Specific reaction conditions include, for example, acid anhydrides and polyhydric alcohols in the absence of a catalyst and in the absence of a solvent. A method of reacting at 150 ° C. and heating, and taking it out as it is after completion of the reaction can be mentioned.

The epoxy resin curing agent in the present invention is particularly an acid anhydride (C1), a polyvalent carboxylic acid (C2) having at least two carboxyl groups and having an aliphatic hydrocarbon group as a main skeleton from the viewpoint of heat resistance. Or a polyhydric alcohol compound (E) having two or more hydroxyl groups in the molecule, a compound (f) having one carboxylic acid anhydride group in the molecule, and optionally two or more in the molecule. The polyvalent carboxylic acid resin (C3) obtained by addition reaction with the compound (h) having a carboxylic acid anhydride group is preferred. Among them, as the polyhydric alcohol compound (E) having two or more hydroxyl groups in the molecule, both ends carbinol-modified silicone oil (d) and other polyhydric alcohol compounds having two or more hydroxyl groups in the molecule ( A polycarboxylic acid resin (C3) containing e) is more preferred.

Specific examples of the acid anhydride (C1) include succinic anhydride, methyl succinic anhydride, ethyl succinic anhydride, butyl succinic anhydride, allyl succinic anhydride, phthalic anhydride, naphthalenedicarboxylic anhydride, trimellit Acid anhydride, maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methyl nadic anhydride, nadic anhydride, hexahydrophthalic anhydride, methyl hexahydrophthalic anhydride, bicyclo [ 2.2.1] heptane-2,3-dicarboxylic acid anhydride, methylbicyclo [2.2.1] heptane-2,3-dicarboxylic acid anhydride, cyclohexane-1,3,4-tricarboxylic acid-3, 4-anhydride, pentanedioic anhydride, 2,4-diethylpentanedioic anhydride, 2,2-dimethylpentanedioic anhydride 3,3-dimethylpentanedioic anhydride, 1,1-cyclopentanedioic anhydride, 1,1-cyclohexanedioic anhydride, diglycolic anhydride, maleic anhydride, itaconic anhydride, citraconic acid Anhydride, dodecyl succinic anhydride, 1,3-cyclohexanedicarboxylic anhydride, norbornane-2,3-dicarboxylic anhydride, methylnorbornane-2,3-dicarboxylic anhydride, bicyclo [2,2,2] Octane-2,3-dicarboxylic acid anhydride, 4,5-dimethyl-4-cyclohexene-1,2-dicarboxylic acid anhydride, bicyclo [2.2.2] -5-octene-2,3-dicarboxylic acid anhydride And 7-oxabicyclo [2.2.1] hept-5-ene-2,3-dicarboxylic acid anhydride.
In particular, methyltetrahydrophthalic anhydride, methylnadic acid anhydride, nadic acid anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, butanetetracarboxylic anhydride, bicyclo [2,2,1] heptane -2,3-dicarboxylic acid anhydride, methylbicyclo [2,2,1] heptane-2,3-dicarboxylic acid anhydride, cyclohexane-1,3,4-tricarboxylic acid-3,4-anhydride, 2, 4-Diethylpentanedioic anhydride is preferred from the viewpoints of light resistance, transparency, and workability.

The polyvalent carboxylic acid (C2) is a compound having at least two carboxyl groups.
The polyvalent carboxylic acid is preferably a bi- to hexafunctional carboxylic acid, such as butanedioic acid, pentanedioic acid, hexanedioic acid, heptanedioic acid, octanedioic acid, nonanedioic acid, decanedioic acid, malic acid, etc. Linear alkyl diacids such as 1,3,5-pentanetricarboxylic acid, alkyltricarboxylic acids such as citric acid, phthalic acid, hexahydrophthalic acid, methylhexahydrophthalic acid, tetrahydrophthalic acid, methyltetrahydrophthalic acid, cyclohexanetricarboxylic acid Examples include aliphatic cyclic polycarboxylic acids such as acid, nadic acid, and methyl nadic acid, multimers of unsaturated fatty acids such as linolenic acid and oleic acid, and dimer acids that are reduced products thereof, and the above acid anhydrides are saturated. A polyvalent carboxylic acid which is an aliphatic cyclic acid anhydride is preferred from the viewpoint of transparency.

The polyvalent carboxylic acid resin (C3) preferred as an epoxy resin curing agent used in the curable resin composition of the present invention is an alcoholic hydroxyl group of a polyhydric alcohol compound (E) having two or more hydroxyl groups in the molecule described below. The acid anhydride group of the compound (f) having one carboxylic anhydride group in the molecule (and optionally the compound (h) having two or more carboxylic anhydride groups in the molecule) undergoes an addition reaction. This compound is obtained by having two or more carboxylic acids in the molecule as functional groups. As the polyhydric alcohol compound (E) having two or more hydroxyl groups in the molecule, both ends carbinol-modified silicone oil (d) and the other polyhydric alcohol compound (e) having two or more hydroxyl groups in the molecule It is preferable to use together.

From here, a polyhydric alcohol compound (E) having two or more hydroxyl groups in the molecule, and a compound having one carboxylic anhydride group in the molecule (raw material, which is a raw material of the polycarboxylic acid resin (C3)) f) The compound (h) having two or more acid anhydride groups in the molecule will be described.
Examples of the polyhydric alcohol compound (E) having two or more hydroxyl groups in the molecule include those having 1 to 10 carbon atoms such as ethylene glycol, propylene glycol, butanediol, pentanediol, hexanediol, heptanediol, octanediol, and nonanediol. Alkylene diol, EO-modified bisphenol A, EO-modified bisphenol F, EO-modified bisphenol E, EO-modified naphthalene diol, PO-modified bisphenol A, both-end carbinol-modified silicone oil (d), branched alkylene diol having a branched structure (e2) A polyhydric alcohol (e3) having an alicyclic structure, a polyhydric alcohol (e4) having three or more hydroxyl groups in the molecule, a polyhydric alcohol having two or more hydroxyl groups in the molecule, and having 2 to 8 carbon atoms. Many polymers obtained by ring-opening addition polymerization of lactones Alcohol-modified lactone polymer (e5), polycyclic polyphenol compound (polycyclic polyphenol compound is a compound having two or more six-membered rings and having two or more phenolic hydroxyl groups. And an alcohol compound (e6), a terminal alcohol polyester compound (e7), and a terminal alcohol polycarbonate compound (e8) in which one or more aromatic rings having a hydroxyl group are hydrogenated, and selected from these groups At least one polyhydric alcohol compound can be used, and two or more kinds can be used in combination. Preferably both ends carbinol-modified silicone oil (d), branched alkylene diol (e2) having a branched structure, polyhydric alcohol (e3) having an alicyclic structure, polyhydric alcohol having three or more hydroxyl groups in the molecule (A4), polyhydric alcohol-modified lactone polymer (e5), alcohol compound (e6) in which one or more aromatic rings having a hydroxyl group of a polycyclic polyphenol compound are hydrogenated, and carbinol at both ends More preferably, the modified silicone oil (d) and the polyhydric alcohol compound (e) having two or more hydroxyl groups in other molecules are used in combination.

First, both terminal carbinol-modified silicone oil (d) will be described.
Both ends carbinol-modified silicone oil (d) is a silicone compound having alcoholic hydroxyl groups at both ends represented by the following formula (7).

(In the formula (7), R ₁₀ represents an alkylene group having 1 to 10 carbon atoms and an alkylene group having an ether bond, R ₉ represents an alkyl group or phenyl group having 1 to 3 carbon atoms, and v represents an average value of 1 to 100 represents each.)

In the formula (7), specific examples of R ₁₀ include methylene, ethylene, propylene, isopropylene, butylene, isobutylene, pentylene, isopentylene, hexylene, heptylene, octylene and other alkylene groups, ethoxyethylene group, propoxyethylene group propoxy Examples include an alkylene group having an ether bond such as a propylene group and an ethoxypropylene group. Particularly preferred are propoxyethylene group and ethoxypropylene group.

Next, R ₉ represents an alkyl group having 1 to 3 carbon atoms, such as a methyl group, or a phenyl group, and may be the same or different. A polyhydric alcohol compound (e) having one or more hydroxyl groups, and (optionally a compound (h) having two or more acid anhydride groups in the molecule) one carboxylic acid anhydride group in the molecule. In order for the polyvalent carboxylic acid resin obtained by addition reaction with the compound (f) to be contained to be liquid at room temperature, a methyl group is preferred compared to a phenyl group.

In the formula (7), v is an average value of 1 to 100, preferably 2 to 80, more preferably 5 to 30.

For example, X-22-160AS, KF6001, KF6002, KF6003 (all manufactured by Shin-Etsu Chemical Co., Ltd.) BY16-201, BY16-004 are used as the both-end carbinol-modified silicone oil (d) represented by the formula (7). SF8427 (both manufactured by Toray Dow Corning Co., Ltd.) XF42-B0970, XF42-C3294 (both manufactured by Momentive Performance Materials Japan GK) Silaplane (trade names) FM-4411, FM-4421, FM-4425 (both manufactured by JNC Co., Ltd.) and the like, and all are available from the market. These two terminal carbinol-modified silicone oils can be used alone or in combination. Among these, X-22-160AS, KF6001, KF6002, BY16-201, XF42-B0970, and FM-4411 are preferable.

Next, the chain alkylene diol (e2) having a branched structure which is a polyhydric alcohol compound will be described. Specific examples of the branched alkylene diol (e2) having a branched structure include, for example, neopentyl glycol, 2-ethyl-2-butylpropylene-1,3-diol, 2,4-diethylpentane-1,5-diol, Examples include, but are not limited to, dimethylbutanediol, dimethylpentanediol, diethylpropanediol, dimethylhexanediol, diethylbutanediol, dimethylheptanediol, diethylpentanediol, dimethyloctanediol, diethylhexanediol, and ethylbutylpropanediol. There is nothing. These may be used alone or in combination of two or more.
Applying a chain alkylene diol having a branched structure is preferable because the gas permeation resistance of the cured product is improved.

Next, the polyhydric alcohol (e3) which has an alicyclic structure which is a polyhydric alcohol compound is demonstrated. Specific examples of the polyhydric alcohol having an alicyclic structure which is a particularly preferred polyhydric alcohol compound include cyclohexanediol, cyclohexanedimethanol, tricyclodecane dimethanol, tricyclodecanediol, pentacyclodecane dimethanol, norbornanediol, norbornanedi. Examples thereof include, but are not limited to, methanol, dioxane glycol, and spiro glycol. These may be used alone or in combination of two or more.
It is preferable to apply a polyhydric alcohol having an alicyclic structure because gas permeability resistance is improved in the cured product.

Next, the polyhydric alcohol (e4) having three or more hydroxyl groups in the molecule, which is a polyhydric alcohol compound, will be described. Specific examples of polyhydric alcohols having three or more hydroxyl groups in the molecule, which are particularly preferred polyhydric alcohol compounds, include glycerin, trimethylolethane, trimethylolpropane, trimethylolbutane, and tris (2-hydroxyethyl) isocyanurate. , Pentaerythritol, ditrimethylolpropane, diglycerol, dipentaerythritol and the like, but are not limited thereto. These may be used alone or in combination of two or more.
It is preferable to apply a polyhydric alcohol having three or more hydroxyl groups in the molecule because the hardness of the cured product is increased.

Next, a polyhydric alcohol (e5) obtained by ring-opening addition polymerization of a lactone having 2 to 8 carbon atoms to a polyhydric alcohol having two or more hydroxyl groups in the molecule, which is a polyhydric alcohol compound, will be described. It is used to obtain a polyhydric alcohol-modified lactone polymer obtained by ring-opening addition polymerization of a lactone having 2 to 8 carbon atoms to a polyhydric alcohol having two or more hydroxyl groups in the molecule, which is a particularly preferred polyhydric alcohol. Specific examples of the polyhydric alcohol include ethylene glycol, propylene glycol, butanediol, pentanediol, hexanediol, heptanediol, octanediol, nonanediol and other alkylene diols having 1 to 10 carbon atoms, EO (ethylene oxide) modification Bisphenol A, EO-modified bisphenol F, EO-modified bisphenol E, EO-modified naphthalene diol, PO (propylene oxide) -modified bisphenol A, a branched alkylene diol having a branched structure, neopentyl glycol, 2-ethyl-2-butyl group Pyrene-1,3-diol, 2,4-diethylpentane-1,5-diol, dimethylbutanediol, dimethylpentanediol, diethylpropanediol, dimethylhexanediol, diethylbutanediol, dimethylheptanediol, diethylpentanediol, dimethyl Cyclohexanediol, cyclohexanedimethanol, tricyclodecane dimethanol, tricyclodecanediol, pentacyclodecane dimethanol, norbornanediol, which is a polyhydric alcohol having an alicyclic structure, such as octanediol, diethylhexanediol, ethylbutylpropanediol, Norbornanedimethanol, dioxane glycol, spiroglycol, 2,2-bis (4-hydroxycyclohexyl) propane, etc. Terminals represented by formula (3) such as glycerin, trimethylolpropane, isocyanuric acid tris (2-hydroxyethyl), pentaerythritol, ditrimethylolpropane, diglycerol, dipentaerythritol, etc., which are polyhydric alcohols having a hydroxyl group above Examples include alcohol polyester compounds, but are not limited thereto. Among these, alkylene oxide modified bisphenol A such as EO modified bisphenol A, alkylene oxide modified bisphenol F such as EO modified bisphenol F, polyhydric alcohol having an alicyclic structure, and chain alkylene diol having a branched structure are preferable. These may be used alone or in combination of two or more.

The lactones used for obtaining the polyhydric alcohol-modified lactone polymer are lactones having 4 to 8 carbon atoms. Specific examples include γ-butyrolactone, β-methylpropiolactone, δ-valerolactone, ε -Caprolactone, 3-methylcaprolactone, 4-methylcaprolactone, trimethylcaprolactone, β-methyl-δ-caprolactone and the like.
The polyhydric alcohol-modified lactone polymer usually contains lactones in the range of 0.1 to 10 mol, preferably 0.2 to 5 mol, more preferably 0.3 to 2 mol, per mol of the hydroxyl group of the polyhydric alcohol. And a catalyst such as an alkali metal compound, a tin compound, a titanium compound, a zinc compound, a molybdenum compound, an aluminum compound, or a tungsten compound is usually used at 80 to 230 ° C., preferably 100 to 200 ° C., more preferably 120 to 160 ° C. It is obtained by making it react.

Next, an alcohol compound (e6) in which one or more aromatic rings having a hydroxyl group of a polycyclic polyhydric phenol compound which is a polyhydric alcohol compound is hydrogenated will be described. 1 having a hydroxyl group of a polycyclic polyphenol compound (a polycyclic polyphenol compound is a compound having two or more six-membered rings and having two or more phenolic hydroxyl groups). Examples of the alcohol compound (e6) having at least one aromatic ring hydrogenated include 2,2-bis (4-hydroxycyclohexyl) propane (= hydrogenated bisphenol A), 1,1-bis (4-hydroxycyclohexyl). Ethane (= hydrogenated bisphenol E), 4,4′-bicyclohexanol (= hydrogenated biphenol), 3,3 ′, 5,5′-tetramethyl-4,4′-bicyclohexanol, methylene biscyclohexanol (= Hydrogenated bisphenol F), 4,4 ′, 4 ″ -methylidenetriscyclohexanol, 4,4 ′-[(4-hydroxycyclohexyl) Methylene] bis (2-methylhexanol) 4,4 ′-(1- {4- [1- (4-hydroxycyclohexyl) -1-methylethyl] phenyl} ethylidene) biscyclohexanol, 4,4 ′-[4 -(4-hydroxycyclohexyl) cyclohexylidene] bisphenol, 4,4 '-[4- (4-hydroxycyclohexyl) cyclohexylidene] bis (2-methylphenol), 4,4'-[4- (4- Hydroxycyclohexyl) cyclohexylidene] bis (2,6-dimethylphenol, dihydroxydecahydronaphthalene (= hydrogenated dihydroxynaphthalene), dihydroxytetradecahydroanthracene, 1,4-cyclohexylenebis (methylethanol), 5,5 '-(1-Methylethylidene) bis [1,1'-(bicyclohe Syl) -2-ol], 5,5 ′-(1,1′-cyclohexylidene) bis [1,1 ′-(bicyclohexyl) -2-ol], 5,5 ′-(cyclohexylmethylene) bis [1,1 ′-(bicyclohexyl) -2-ol], 1,1,2,2, -tetrakis (4-hydroxycyclohexyl) ethane, 1,1,2,2, -tetrakis (3,5-dimethyl) -4-hydroxycyclohexyl) ethane, but is not limited thereto, and one or more kinds may be used in combination.
Among these, hydrogenated bisphenol such as hydrogenated bisphenol A, hydrogenated biphenol, and hydrogenated dihydroxynaphthalene are preferable.

Next, the terminal alcohol polyester compound (e7) will be described.
The terminal alcohol polyester compound (e7) is a polyester compound having a hydroxyl group at the terminal represented by the following formula (8).

(In Formula (8), R ₁₁ and R ₁₂ each independently represents an alkylene group having 1 to 10 carbon atoms, and n represents an average value of 1 to 100)

In the formula (8), specific examples of R ₁₁ include linear alkylene groups having 1 to 10 carbon atoms such as ethylene, propylene, butylene, pentylene, hexylene, heptylene, octylene, isopropylene, ethylbutylpropylene, isobutylene, Examples thereof include an alkylene group having a branched chain of 1 to 10 carbon atoms such as isopentylene, neopentylene and diethylpentylene, and an alkylene group having a cyclic structure such as cyclopentanedimethylene and cyclohexanedimethylene. Among these, an alkylene group having a branched chain having 1 to 10 carbon atoms or an alkylene group having a cyclic structure is preferable, and in particular, ethylbutylpropylene, isobutylene, neopentylene, diethylpentylene, and cyclohexanedimethylene are the heat-resistant transparency of the cured product. It is preferable from the viewpoint.

In the formula (8), specific examples of R ₁₂ include linear alkylene groups having 1 to 10 carbon atoms such as ethylene, propylene, butylene, pentylene, hexylene, heptylene, octylene, isopropylene, ethylbutylpropylene, isobutylene, Examples thereof include an alkylene group having a branched chain having 1 to 10 carbon atoms such as isopentylene, neopentylene and diethylpentylene, and an alkylene group having a cyclic structure such as cyclopentanedimethylene and cyclohexanedimethylene. Among these, a linear alkylene group having 1 to 10 carbon atoms is preferable, and propylene, butylene, pentylene, and hexylene are particularly preferable from the viewpoint of adhesion of a cured product to a substrate.

In the formula (8), n is an average value of 1 to 100, preferably 2 to 40, more preferably 3 to 30.

The weight average molecular weight (Mw) of the terminal alcohol polyester (e7) is preferably 500 to 20000, more preferably 500 to 5000, and still more preferably 500 to 3000. If the weight average molecular weight is less than 500, the cured product hardness of the curable resin composition of the present invention is too high, and there is a concern that cracks may occur in a heat cycle test or the like. If the weight average molecular weight is more than 20000, the cured product becomes sticky. There is a concern that will occur. In this invention, a weight average molecular weight means the weight average molecular weight (Mw) calculated in polystyrene conversion based on the value measured on condition of the following using GPC (gel permeation chromatography).

Examples of the terminal alcohol polyester (e7) represented by the formula (8) include polyester polyols having an alcoholic hydroxyl group at the terminal. Specific examples thereof are polyester polyols such as Kyowapol (trade name) 1000PA, 2000PA, 3000PA, 2000BA (all manufactured by Kyowa Hakko Chemical Co., Ltd.); Adeka New Ace (trade name) Y9-10, YT-101 (both manufactured by ADEKA); Plaxel (trade name) 220EB, 220EC (both manufactured by Daicel Chemical Industries); Polylite (trade name) OD-X-286, OD-X- 102, OD-X-355, OD-X-2330, OD-X-240, OD-X-668, OD-X-2554, OD-X-2108, OD-X-2376 OD-X-2044, OD-X-688, OD-X-2068, OD-X-2547, OD-X-2420, OD-X-2 23, OD-X-2555 (all manufactured by DIC Corporation); HS2H-201AP, HS2H-351A, HS2H-451A, HS2H-851A, HS2N-221A, HS2N-521A, HS2H-220S, HS2N-220S, HS2N-226P, HS2B-222A, HOKOKOOL HT-110, HT-210, HT-12, HT-250, HT-310, HT-40M (all manufactured by Toyokuni Oil Co., Ltd.) Both are available from the market. These polyester compounds can be used alone or in combination of two or more. Of these, Kyowapol 1000PA, Adeka New Ace Y9-10, and HS2N-221A are preferable.

Next, the terminal alcohol polycarbonate compound (e8) will be described.
Although it does not specifically limit as a terminal alcohol polycarbonate compound, For example, the polycarbonate compound etc. which have a hydroxyl group at the terminal shown by following formula (9) are mentioned.

(In the formula (9), R ¹⁴ represents an alkylene group having 1 to 10 carbon atoms, and j represents an average value of 1 to 100)

In the formula (9), specific examples of R ¹⁴ include linear alkylene groups having 1 to 10 carbon atoms such as methylene, ethylene, propylene, butylene, pentylene, hexylene, heptylene, octylene, isopropylene, ethylbutylpropylene, Examples thereof include alkylene groups having a branched chain of 1 to 10 carbon atoms such as isobutylene, isopentylene, neopentylene, diethylpentylene, and the like, and alkylene groups having a cyclic structure such as cyclopentanedimethylene and cyclohexanedimethylene. Among these, linear alkylene groups having 4 to 7 carbon atoms such as butylene, pentylene, hexylene and heptylene are preferable from the viewpoint of workability because the viscosity of the terminal alcohol polycarbonate compound is not too high.

A plurality of R ¹⁴ present in the formula (9) may be the same or different.

In the formula (9), j is an average value of 1 to 100, preferably 2 to 40, more preferably 3 to 30.

The weight average molecular weight (Mw) of the terminal alcohol polycarbonate compound is preferably 500 to 20000, more preferably 500 to 5000, and still more preferably 500 to 3000. If the weight average molecular weight is 500 or more, the cured product hardness of the curable resin composition does not become excessively high, and there is no fear of cracking in a heat cycle test or the like, which is preferable. Moreover, if a weight average molecular weight is 20000 or less, there is no fear that stickiness of hardened | cured material generate | occur | produces and it is preferable. In this invention, a weight average molecular weight means the weight average molecular weight (Mw) calculated in polystyrene conversion based on the value measured on condition of the following using GPC (gel permeation chromatography).

When both ends carbinol-modified silicone oil (d) and other polyhydric alcohol (e) are used in combination as the polyhydric alcohol, the other polyhydric alcohol (e) is used in the amount of both ends carbinol-modified silicone oil. (D) The amount is preferably 0.5 to 200 parts by weight, more preferably 5 to 50 parts by weight, and still more preferably 10 to 30 parts by weight with respect to 100 parts by weight. If the amount is less than 0.5 parts by weight, the mechanical strength of the cured product may be inferior, and if it exceeds 200 parts by weight, the heat resistant transparency of the cured product may be inferior.

Next, the compound (h) having two or more carboxylic acid anhydride groups in the molecule is, for example, 1,2,3,4-butanetetracarboxylic dianhydride, 1,2,3,4-cyclobutanetetra. Carboxylic dianhydride, 1,2,3,4-cyclopentanetetracarboxylic dianhydride, 1,2,4,5-cyclohexanetetracarboxylic dianhydride, pyromellitic anhydride, 5- (2, 5-Dioxotetrahydrofuryl) -3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, 4- (2,5-dioxotetrahydrofuran-3-yl) -1,2,3,4-tetrahydro And naphthalene-1,2-dicarboxylic acid anhydride.
The compound (h) having two or more carboxylic acid anhydride groups in the molecule can be used alone or in combination. Among these, since the transparency of a cured product obtained by curing the polyvalent carboxylic acid resin (C3) and an epoxy resin described later is excellent, 1,2,3,4-butanetetracarboxylic dianhydride, 1,2 4,5-cyclohexanetetracarboxylic dianhydride, 4- (2,5-dioxotetrahydrofuran-3-yl) -1,2,3,4-tetrahydronaphthalene-1,2-dicarboxylic anhydride is preferred In particular, 1,2,3,4-butanetetracarboxylic dianhydride is preferred.

Next, the compound (f) having one carboxylic acid anhydride group in the molecule is, for example, succinic anhydride, methyl succinic anhydride, ethyl succinic anhydride, butyl succinic anhydride, allyl succinic anhydride, phthalic anhydride. , Naphthalene dicarboxylic anhydride, trimellitic anhydride, maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methyl nadic anhydride, nadic anhydride, hexahydrophthalic anhydride, methyl Hexahydrophthalic anhydride, bicyclo [2.2.1] heptane-2,3-dicarboxylic anhydride, methylbicyclo [2.2.1] heptane-2,3-dicarboxylic anhydride, cyclohexane-1, 3,4-tricarboxylic acid-3,4-anhydride, pentanedioic anhydride, 2,4-diethylpentanedioic anhydride, , 2-Dimethylpentanedioic anhydride, 3,3-dimethylpentanedioic anhydride, 1,1-cyclopentanedioic anhydride, 1,1-cyclohexanedioic anhydride, diglycolic anhydride, maleic acid Anhydride, itaconic anhydride, citraconic anhydride, dodecyl succinic anhydride, 1,3-cyclohexanedicarboxylic anhydride, norbornane-2,3-dicarboxylic anhydride, methylnorbornane-2,3-dicarboxylic anhydride Bicyclo [2,2,2] octane-2,3-dicarboxylic acid anhydride, 4,5-dimethyl-4-cyclohexene-1,2-dicarboxylic acid anhydride, bicyclo [2.2.2] -5 -Octene-2,3-dicarboxylic acid anhydride, 7-oxabicyclo [2.2.1] hept-5-ene-2,3-dicarboxylic acid anhydride, and the like.

The compound (f) having one carboxylic anhydride group in the molecule can be used alone or in combination. Among these, since a cured product obtained by curing a polyvalent carboxylic acid resin and an epoxy resin is excellent, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, tetrahydrophthalic anhydride, norbornane-2 3-dicarboxylic acid anhydride, methylnorbornane-2, 3-dicarboxylic acid anhydride, 1,2,4-cyclohexanetricarboxylic acid-1,2-anhydride, and 2,4-diethylpentanedioic acid anhydride are preferred. More preferred are methylhexahydrophthalic anhydride, 1,2,4-cyclohexanetricarboxylic acid-1,2-anhydride, 2,4-diethylpentanedioic anhydride, and particularly preferred is methylhexahydrophthalic anhydride. It is a thing.

The amount of compound (f) having one carboxylic anhydride group in the molecule is 100% of (h) when compound (h) having two or more carboxylic anhydride groups in the molecule is used. The amount is preferably 5 to 1000 parts by weight, more preferably 10 to 500 parts by weight, still more preferably 50 to 300 parts by weight with respect to parts by weight. If the amount is less than 5 parts by weight, the polyvalent carboxylic acid resin (C3) may be too high in molecular weight and workability may be inferior, and if it is more than 300 parts by weight, the mechanical strength of the cured product may be inferior.

The amount of the polyhydric alcohol compound (E), the compound (h) having two or more carboxylic anhydride groups in the molecule, and the compound (f) having one carboxylic anhydride group in the molecule is Compound (h) having two or more carboxylic anhydride groups in the molecule and compound (f) having one carboxylic anhydride group in the molecule with respect to 1 equivalent of the total alcoholic hydroxyl group of the alcohol compound (E) The total carboxylic acid anhydride group is preferably 0.5 to 2.0 equivalents, more preferably 0.8 to 1.5 equivalents. If it is less than 0.5 equivalent, the mechanical strength of the cured product may be inferior, and if it is more than 2.0, a large amount of acid anhydride groups may remain, resulting in poor storage stability.

The production of the polyvalent carboxylic acid resin can be performed with or without a solvent. The solvent does not react with the polyhydric alcohol compound (E), the compound (h) having two or more carboxylic anhydride groups in the molecule, and the compound (f) having one carboxylic anhydride group in the molecule. Any solvent can be used without particular limitation. Examples of solvents that can be used include aprotic polar solvents such as dimethylformamide, dimethylacetamide, dimethyl sulfoxide, tetrahydrofuran and acetonitrile, ketones such as methyl ethyl ketone, cyclopentanone and methyl isobutyl ketone, toluene and xylene. An aromatic hydrocarbon etc. are mentioned, Among these, an aromatic hydrocarbon and ketones are preferable. These solvents may be used alone or in combination of two or more. When a solvent is used, the amount used is the polyhydric alcohol compound (E), the compound (h) having two or more carboxylic anhydride groups in the molecule, and the compound having one carboxylic anhydride group in the molecule. 0.5 to 300 parts by weight is preferable with respect to 100 parts by weight of the total of (f).

The polyvalent carboxylic acid resin (C3) can be produced without a catalyst or with a catalyst. When a catalyst is used, usable catalysts are hydrochloric acid, sulfuric acid, methanesulfonic acid, trifluoromethanesulfonic acid, paratoluenesulfonic acid, nitric acid, trifluoroacetic acid, trichloroacetic acid and other acidic compounds, sodium hydroxide, potassium hydroxide, water Metal hydroxides such as calcium oxide and magnesium hydroxide, amine compounds such as triethylamine, tripropylamine and tributylamine, pyridine, dimethylaminopyridine, 1,8-diazabicyclo [5.4.0] undec-7-ene, Heterocyclic compounds such as imidazole, triazole, tetrazole, tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, trimethylethylammonium Roxide, trimethylpropylammonium hydroxide, trimethylbutylammonium hydroxide, trimethylcetylammonium hydroxide, trioctylmethylammonium hydroxide, tetramethylammonium chloride, tetramethylammonium bromide, tetramethylammonium iodide, tetramethylammonium acetate, trioctyl Quaternary ammonium salts such as methylammonium acetate, orthotitanic acid such as tetraethyl orthotitanate, tetramethyl orthotitanate, tin octylate, cobalt octylate, zinc octylate, manganese octylate, calcium octylate, sodium octylate, Examples include metal soaps such as potassium octylate.

When using a catalyst, it can also be used 1 type or in mixture of 2 or more types.
When a catalyst is used, the amount used thereof is a polyhydric alcohol compound (E), a compound (h) having two or more carboxylic anhydride groups in the molecule, and a compound having one carboxylic anhydride group in the molecule. 0.05 to 10 parts by weight is preferable with respect to 100 parts by weight in total of (f).
As a method for adding the catalyst, it is added directly or used in a state dissolved in a soluble solvent or the like. At this time, use of an alcoholic solvent such as methanol or ethanol or water means that an unreacted compound (h) having two or more carboxylic acid anhydride groups in the molecule or one carboxylic acid anhydride in the molecule. Since it reacts with the compound (f) having a physical group, it is preferable to avoid it.

The reaction temperature during the production of the polyvalent carboxylic acid resin (C3) depends on the amount of catalyst and the solvent used, but is usually preferably 20 to 160 ° C, more preferably 50 to 150 ° C, particularly preferably 60 to 145 ° C. is there. The total reaction time is usually preferably 1 to 20 hours, more preferably 3 to 12 hours. The reaction may be carried out in two or more stages. For example, the reaction may be carried out at 20 to 100 ° C. for 1 to 8 hours and then at 100 to 160 ° C. for 1 to 12 hours. In particular, the compound (f) having one carboxylic acid anhydride group in the molecule is often highly volatile. When such a compound is used, the compound (f) is reacted at 20 to 100 ° C. in advance, and then 100 to 160 By reacting at ℃, volatilization can be suppressed. Thereby, not only the diffusion of harmful substances into the atmosphere can be suppressed, but also the polyvalent carboxylic acid resin (C3) as designed can be obtained.

In the case of production using a catalyst, the catalyst can be removed by quenching and / or washing with water as necessary, but it is left as it is and used as a curing accelerator for the curable resin composition of the present invention. You can also
When performing a water washing process, it is preferable to add the solvent which can be isolate | separated from water depending on the kind of solvent currently used. Preferred solvents include ketones such as methyl ethyl ketone, methyl isobutyl ketone and cyclopentanone, esters such as ethyl acetate, butyl acetate, ethyl lactate and isopropyl butanoate, hydrocarbons such as hexane, cyclohexane, toluene and xylene. Can be illustrated.
When a solvent is used for the reaction or washing with water, it can be removed by vacuum concentration or the like.

The polycarboxylic acid resin (C3) thus obtained is usually a liquid having fluidity at 25 ° C. The molecular weight is preferably from 800 to 80,000, more preferably from 1,000 to 10,000, and particularly preferably from 1500 to 8,000 as the weight average molecular weight measured by GPC. When the weight average molecular weight is less than 800, the fluidity at 25 ° C. may decrease, and when it exceeds 80,000, when a curable resin composition using the same is used, the compatibility with the epoxy resin described later is low. May be inferior.
The weight average molecular weight is a polystyrene equivalent weight average molecular weight (Mw) measured using GPC (gel permeation chromatography) under the following conditions.

The acid value (measured by the method described in JIS K-2501) of the produced polycarboxylic acid resin (C3) is preferably 35 to 200 mgKOH / g, more preferably 50 to 180 mgKOH / g, particularly 60-150 mgKOH / g is preferred. When the functional group equivalent is less than 35 mgKOH / g, the mechanical properties of the cured product tend to deteriorate, and when it exceeds 150 mgKOH / g, the cured product tends to be hard and the elastic modulus tends to be too high.

The viscosity of the polycarboxylic acid resin (C3) (E-type viscometer, measured at 25 ° C.) is preferably from 50 to 800,000 mPa · s, more preferably from 500 to 100,000 mPa · s, particularly from 800 to The thing of 30,000 mPa * s is preferable. When the viscosity is less than 50 mPa · s, the viscosity is too low and may not be suitable when used as a sealing material or the like, and when it exceeds 800,000 mPa · s, the viscosity is too high or the sealing material or the like. May be inferior in workability.

In the curable resin composition of the present invention, two or more of acid anhydride (C1), polyvalent carboxylic acid (C2), and polyvalent carboxylic acid resin (C3) are used in combination as an epoxy resin curing agent. You can also. In particular, when solid polyvalent carboxylic acid (C2) is used in applications such as an optical semiconductor encapsulant that requires liquid at room temperature (25 ° C.), liquid acid anhydride (C1) and / or polyvalent carboxylic acid It is desirable to use the resin (C3) in combination and use it as a liquid mixture. When used in combination, the acid anhydride (C1) and / or the polyvalent carboxylic acid resin (C3) can be used in a proportion of 0.5 to 99.5% by weight of the total epoxy resin curing agent.

When the curing agent other than the above-mentioned acid anhydride and / or polyvalent carboxylic acid resin and / or polyvalent carboxylic acid resin is used in combination as the epoxy resin curing agent, the acid anhydride and / or polyvalent carboxylic acid and / or polyhydric carboxylic acid are used. The proportion of the total amount of the polyvalent carboxylic acid resin in the total curing agent is preferably 30% by weight or more, particularly preferably 40% by weight or more.
Examples of the curing agent that can be used in combination include amine compounds, amide compounds, phenol compounds, and the like. Specific examples of curing agents that can be used include amines and polyamide compounds (such as diaminodiphenylmethane, diethylenetriamine, triethylenetetramine, diaminodiphenylsulfone, isophoronediamine, dicyandiamide, and polyamide resins synthesized from linolenic acid dimer and ethylenediamine). Polyphenols (bisphenol A, bisphenol F, bisphenol S, fluorene bisphenol, terpene diphenol, 4,4′-biphenol, 2,2′-biphenol, 3,3 ′, 5,5′-tetramethyl- [ 1,1′-biphenyl] -4,4′-diol, hydroquinone, resorcin, naphthalenediol, tris- (4-hydroxyphenyl) methane, 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane, fe (Phenol, alkyl-substituted phenol, naphthol, alkyl-substituted naphthol, dihydroxybenzene, dihydroxynaphthalene, etc.) and formaldehyde, acetaldehyde, benzaldehyde, p-hydroxybenzaldehyde, o-hydroxybenzaldehyde, p-hydroxyacetophenone, o-hydroxyacetophenone, Dicyclopentadiene, furfural, 4,4'-bis (chloromethyl) -1,1'-biphenyl, 4,4'-bis (methoxymethyl) -1,1'-biphenyl, 1,4'-bis (chloro Methyl) benzene, polycondensates with 1,4′-bis (methoxymethyl) benzene and their modified products, halogenated bisphenols such as tetrabromobisphenol A, condensates of terpenes and phenols, etc. Imidazole, trifluoroborane -. Amine complex, guanidine derivatives, etc.) and the like, but the invention is not limited to these may be used alone, or two or more may be used.

Next, the curing accelerator will be described.
As the curing accelerator, any epoxy group-containing polyorganosiloxane (and an epoxy resin when used in combination) and an epoxy resin curing agent capable of accelerating the curing reaction can be used. Examples include ammonium salt curing accelerators, phosphonium salt curing accelerators, metal soap curing accelerators, imidazole curing accelerators, amine curing accelerators, phosphine curing accelerators, and phosphite curing accelerators. Agents, Lewis acid curing accelerators and the like.
In the curable resin composition of the present invention, the curing accelerator is preferably used in an amount of 0.001 to 15 parts by weight of the curing accelerator with respect to 100 parts by weight of the curable resin composition.

In the curable resin composition of the present invention, another curing catalyst (curing accelerator) can be used in combination as necessary. Specific examples of the curing catalyst that can be used include 2-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 2,4-diamino-6 (2′-methylimidazole) (1 ′)) Ethyl-s-triazine, 2,4-diamino-6 (2′-undecylimidazole (1 ′)) ethyl-s-triazine, 2,4-diamino-6 (2′-ethyl, 4 -Methylimidazole (1 ')) ethyl-s-triazine, 2,4-diamino- (2′-methylimidazole (1 ′)) ethyl-s-triazine isocyanuric acid adduct, 2-methylimidazole isocyanuric acid 2: 3 adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-3, Various imidazoles of 5-dihydroxymethylimidazole, 2-phenyl-4-hydroxymethyl-5-methylimidazole, 1-cyanoethyl-2-phenyl-3,5-dicyanoethoxymethylimidazole, and imidazoles and phthalic acid, Isophthalic acid, terephthalic acid, trimellitic acid, pyromellitic acid, naphthalene dicarboxylic acid, maleic acid, salts with polyvalent carboxylic acids such as succinic acid, amides such as dicyandiamide, 1,8-diaza-bicyclo (5.4. 0) Diaza compounds such as undecene-7 and the like Salts such as tetraphenylborate and phenol novolak, salts with the above polycarboxylic acids, or phosphinic acids, tetrabutylammonium bromide, cetyltrimethylammonium bromide, trioctylmethylammonium bromide and other ammonium salts, triphenylphosphine, triphenylphosphine (Toluyl) phosphines such as phosphine, tetraphenylphosphonium bromide, tetraphenylphosphonium tetraphenylborate, phosphonium compounds, phenols such as 2,4,6-trisaminomethylphenol, metal compounds such as amine adducts and tin octylate, etc. And a microcapsule type curing accelerator obtained by making these curing accelerators into microcapsules. Which of these curing accelerators is used is appropriately selected depending on characteristics required for the obtained transparent resin composition, such as transparency, curing speed, and working conditions. The curing accelerator is preferably used in the range of usually 0.001 to 15 parts by weight per 100 parts by weight of the epoxy resin.

Among these, from the viewpoints of transparency of the cured product and sulfidation resistance, the metal soap curing accelerator is excellent, and among the metal soap curing accelerators, a zinc carboxylate compound is particularly preferable.
Examples of the metal soap type curing accelerator include tin octylate, cobalt octylate, zinc octylate, manganese octylate, calcium octylate, sodium octylate, potassium octylate, calcium stearate, zinc stearate, magnesium stearate, stearin Aluminum oxide, barium stearate, lithium stearate, sodium stearate, potassium stearate, calcium 12-hydroxyphosphate, zinc 12-hydroxystearate, magnesium 12-hydroxystearate, aluminum 12-hydroxystearate, 12-hydroxystearic acid Barium, lithium 12-hydroxystearate, sodium 12-hydroxystearate, calcium montanate, zinc montanate, mon Magnesium phosphate, aluminum montanate, lithium montanate, sodium montanate, calcium behenate, zinc behenate, magnesium behenate, lithium behenate, sodium behenate, silver behenate, calcium laurate, zinc laurate, barium laurate , Lithium laurate, zinc undecylate, zinc ricinoleate, barium ricinoleate, zinc myristate, zinc palmitate and the like. These catalysts may be used alone or in combination of two or more.

Carbons such as zinc stearate, zinc montanate, zinc behenate, zinc laurate, zinc undecylenate, zinc ricinoleate, zinc myristate, and zinc palmitate are used to obtain cured products with excellent transparency and sulfidation resistance. Zinc salts composed of a monocarboxylic acid compound having 10 to 30 carbon atoms and having a hydroxyl group such as zinc carbonate of several tens to thirty and zinc 12-hydroxystearate can be preferably used. Among these, from the viewpoint of excellent pot life and sulfidation resistance, a zinc salt composed of a monocarboxylic acid compound having 10 to 20 carbon atoms such as zinc stearate and zinc undecylenate, and a hydroxyl group such as zinc 12-hydroxystearate. A zinc salt composed of a monocarboxylic acid compound having 15 to 20 carbon atoms can be preferably used, more preferably zinc stearate, zinc undecylenate and zinc 12-hydroxystearate, particularly preferably zinc stearate, 12- Zinc hydroxystearate can be used.

Examples of the ammonium salt curing accelerator include tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, trimethylethylammonium hydroxide, trimethylpropylammonium hydroxide, trimethylbutylammonium hydroxide. , Trimethylcetylammonium hydroxide, trioctylmethylammonium hydroxide, tetramethylammonium chloride, tetramethylammonium bromide, tetramethylammonium iodide, tetramethylammonium acetate, trioctylmethylammonium acetate and the like. Examples of the phosphonium salt curing accelerator include ethyltriphenylphosphonium bromide, tetraphenylphosphonium tetraphenylborate, methyltributylphosphonium dimethylphosphate, methyltributylphosphonium diethylphosphate, and the like.

In addition to the above-mentioned ammonium salt-based curing accelerators, phosphonium salt-based curing accelerators, metal soap-based curing accelerators, imidazole-based curing accelerators, amine-based curing accelerators, and heterocyclic compound-based curing accelerators. A phosphine-based curing accelerator, a phosphite-based curing accelerator, a Lewis acid-based curing accelerator, or the like can be used.

The curing accelerator described above can be used as a solid compound or a liquid compound at room temperature (25 ° C.). In the case where the curable resin composition of the present invention is used for optical semiconductor sealing applications, when a solid compound is used as a curing accelerator at room temperature (25 ° C.), it can be used by dissolving it in a resin in advance.

By using a coupling agent in the curable resin composition of the present invention as necessary, it is possible to supplement the viscosity adjustment of the composition and the hardness of the cured product.
Examples of coupling agents that can be used include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, and 2- (3,4-epoxycyclohexyl) ethyl. Trimethoxysilane, N- (2-aminoethyl) 3-aminopropylmethyldimethoxysilane, N- (2-aminoethyl) 3-aminopropylmethyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-mercaptopropyltri Methoxysilane, vinyltrimethoxysilane, N- (2- (vinylbenzylamino) ethyl) 3-aminopropyltrimethoxysilane hydrochloride, 3-methacryloxypropyltrimethoxysilane, 3-chloropropylmethyldimethoxysilane, 3-chloro Silane coupling agents such as propyltrimethoxysilane; isopropyl (N-ethylaminoethylamino) titanate, isopropyl triisostearoyl titanate, titanium di (dioctyl pyrophosphate) oxyacetate, tetraisopropyl di (dioctyl phosphite) titanate, Titanium coupling agents such as neoalkoxytri (pN- (β-aminoethyl) aminophenyl) titanate; Zr-acetylacetonate, Zr-methacrylate, Zr-propionate, neoalkoxyzirconate, neoalkoxytrisneodeca Noyl zirconate, neoalkoxytris (dodecanoyl) benzenesulfonyl zirconate, neoalkoxytris (ethylenediaminoethyl) zirconate, neoalco Examples thereof include zirconium such as xylitol (m-aminophenyl) zirconate, ammonium zirconium carbonate, Al-acetylacetonate, Al-methacrylate, Al-propionate, and aluminum coupling agents.
These coupling agents may be used alone or in combination of two or more.
In the curable resin composition of the present invention, the coupling agent is usually preferably 0.05 to 20 parts by weight, more preferably 0.1 to 10 parts by weight, if necessary.

In the curable resin composition of the present invention, it is possible to supplement mechanical strength without impairing transparency by using a nano-order level inorganic filler as necessary. The standard for the nano-order level is preferably an average particle diameter of 500 nm or less, and particularly preferably a filler having an average particle diameter of 200 nm or less from the viewpoint of transparency. Examples of inorganic fillers include crystalline silica, fused silica, alumina, zircon, calcium silicate, calcium carbonate, silicon carbide, silicon nitride, boron nitride, zirconia, fosterite, steatite, spinel, titania, talc, and the like. However, the present invention is not limited to these. These fillers may be used alone or in combination of two or more. The content of these inorganic fillers is preferably such that it accounts for 0 to 95% by weight in the curable resin composition of the present invention.

A phosphor can be added to the curable resin composition of the present invention as necessary. For example, the phosphor has a function of forming white light by absorbing part of blue light emitted from a blue LED element and emitting wavelength-converted yellow light. After the phosphor is dispersed in advance in the curable resin composition, the optical semiconductor is sealed. There is no restriction | limiting in particular as fluorescent substance, A conventionally well-known fluorescent substance can be used, For example, rare earth element aluminate, thio gallate, orthosilicate, etc. are illustrated. More specifically, phosphors such as a YAG phosphor, a TAG phosphor, an orthosilicate phosphor, a thiogallate phosphor, and a sulfide phosphor can be mentioned, and YAlO ₃ : Ce, Y ₃ Al ₅ O ₁₂ : Ce, Y ₄ Al ₂ O ₉ : Ce, Y ₂ O ₂ S: Eu, Sr ₅ (PO ₄ ) ₃ Cl: Eu, (SrEu) O.Al ₂ O _{3 and the} like are exemplified. As the particle size of such a phosphor, those known in this field are used, and the average particle size is preferably 1 to 250 μm, particularly preferably 2 to 50 μm. When these phosphors are used, the addition amount is preferably 1 to 80 parts by weight, more preferably 5 to 60 parts by weight with respect to 100 parts by weight of the resin component.

In the curable resin composition of the present invention, a thixotropic imparting agent such as fine silica powder (also referred to as “aerosil” or “aerosol”) can be added for the purpose of preventing sedimentation of various phosphors during curing. Examples of such silica fine powder include Aerosil (trade name) 50, Aerosil 90, Aerosil 130, Aerosil 200, Aerosil 300, Aerosil 380, Aerosil OX50, Aerosil TT600, Aerosil R972, Aerosil R974, AerosilR974, AerosilR974, AerosilR974, AerosilR974, AerosilR974, AerosilR974, AerosilR974, AerosilR974, AerosilR974, AerosilR974, AerosilR974. Aerosil R812S, Aerosil R805, RY200, RX200 (manufactured by Nippon Aerosil Co., Ltd.) and the like.

For the purpose of preventing coloring, the curable resin composition of the present invention may contain an amine compound as a light stabilizer or a phosphorus compound and a phenol compound as an antioxidant.
Examples of the amine compound include tetrakis (1,2,2,6,6-pentamethyl-4-piperidyl) -1,2,3,4-butanetetracarboxylate, tetrakis (2,2,6,6- Totramethyl-4-piperidyl) -1,2,3,4-butanetetracarboxylate, 1,2,3,4-butanetetracarboxylic acid and 1,2,2,6,6-pentamethyl-4-piperidinol and 3 , 9-bis (2-hydroxy-1,1-dimethylethyl) -2,4,8,10-tetraoxaspiro [5.5] undecane, bis (2,2,6) decanedioate , 6-Tetramethyl-4-piperidyl) sebacate, bis (1-undecanoxy-2,2,6,6-tetramethylpiperidin-4-yl) carbonate, 2,2,6,6,- Tramethyl-4-piperidyl methacrylate, bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate, bis (1,2,2,6,6-pentamethyl-4-piperidyl) sebacate, 4-benzoyloxy -2,2,6,6-tetramethylpiperidine, 1- [2- [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionyloxy] ethyl] -4- [3- (3 , 5-di-tert-butyl-4-hydroxyphenyl) propionyloxy] -2,2,6,6-tetramethylpiperidine, 1,2,2,6,6-pentamethyl-4-piperidinyl-methacrylate, bis (1,2,2,6,6-pentamethyl-4-piperidinyl) [[3,5-bis (1,1-dimethylethyl) -4-hydroxyphenyl] me L) butyl malonate, decanedioic acid bis (2,2,6,6-tetramethyl-1 (octyloxy) -4-piperidinyl) ester, reaction product of 1,1-dimethylethyl hydroperoxide and octane, N , N ′, N ″, N ′ ″-tetrakis- (4,6-bis- (butyl- (N-methyl-2,2,6,6-tetramethylpiperidin-4-yl) amino) -triazine -2-yl) -4,7-diazadecane-1,10-diamine, dibutylamine, 1,3,5-triazine, N, N′-bis (2,2,6,6-tetramethyl-4-piperidyl 1,6-hexamethylenediamine and N- (2,2,6,6-tetramethyl-4-piperidyl) butylamine polycondensate, poly [[6- (1,1,3,3-tetramethylbutyl Amino-1,3,5-tria -2,4-diyl] [(2,2,6,6-tetramethyl-4-piperidyl) imino] hexamethylene [(2,2,6,6-tetramethyl-4-piperidyl) imino]], Polymer of dimethyl succinate and 4-hydroxy-2,2,6,6-tetramethyl-1-piperidineethanol, 2,2,4,4-tetramethyl-20- (β-lauryloxycarbonyl) ethyl-7 -Oxa-3,20-diazadispiro [5 · 1 · 11 · 2] heneicosan-21-one, β-alanine, N,-(2,2,6,6-tetramethyl-4-piperidinyl) -dodecyl ester / Tetradecyl ester, N-acetyl-3-dodecyl-1- (2,2,6,6-tetramethyl-4-piperidinyl) pyrrolidine-2,5-dione, 2,2,4,4-tetramethyl-7 - Oxa-3,20-diazadispiro [5,1,11,2] heneicosan-21-one, 2,2,4,4-tetramethyl-21-oxa-3,20-diazadicyclo- [5,1,11, 2] -Heneicosane-20-propanoic acid dodecyl ester / tetradecyl ester, propanedioic acid, [(4-methoxyphenyl) -methylene] -bis (1,2,2,6,6-pentamethyl-4-piperidinyl) Ester, higher fatty acid ester of 2,2,6,6-tetramethyl-4-piperidinol, 1,3-benzenedicarboxamide, N, N′-bis (2,2,6,6-tetramethyl-4- Hindered amine compounds such as piperidinyl), benzophenone compounds such as octabenzone, 2- (2H-benzotriazol-2-yl) -4- (1,1 3,3-tetramethylbutyl) phenol, 2- (2-hydroxy-5-methylphenyl) benzotriazole, 2- [2-hydroxy-3- (3,4,5,6-tetrahydrophthalimide-methyl) -5 -Methylphenyl] benzotriazole, 2- (3-tert-butyl-2-hydroxy-5-methylphenyl) -5-chlorobenzotriazole, 2- (2-hydroxy-3,5-di-tert-pentylphenyl) Benzotriazole, the reaction product of methyl 3- (3- (2H-benzotriazol-2-yl) -5-tert-butyl-4-hydroxyphenyl) propionate and polyethylene glycol, 2- (2H-benzotriazole-2- Yl) -6-dodecyl-4-methylphenol and other benzotriazole compounds, 2 Benzoate series such as 1,4-di-tert-butylphenyl-3,5-di-tert-butyl-4-hydroxybenzoate, 2- (4,6-diphenyl-1,3,5-triazin-2-yl) Examples include triazine compounds such as -5-[(hexyl) oxy] phenol, and hindered amine compounds are particularly preferable.

The following commercially available products can be used as the amine compound that is the light stabilizer.
The commercially available amine compound is not particularly limited. For example, TINUVIN (trade name) 765, TINUVIN 770DF, TINUVIN 144, TINUVIN 123, TINUVIN 622LD, TINUVIN 152, and CHIMASSORB (trade name) 944 are manufactured by Ciba Specialty Chemicals. As ADEKA, LA-52, LA-57, LA-62, LA-63P, LA-77Y, LA-81, LA-82, LA-87 and the like can be mentioned.

The phosphorus compound is not particularly limited, and for example, 1,1,3-tris (2-methyl-4-ditridecyl phosphite-5-tert-butylphenyl) butane, distearyl pentaerythritol diphosphite, bis (2,4-di-tert-butylphenyl) pentaerythritol diphosphite, bis (2,6-di-tert-butyl-4-methylphenyl) pentaerythritol diphosphite, phenylbisphenol A pentaerythritol diphosphite, Dicyclohexylpentaerythritol diphosphite, tris (diethylphenyl) phosphite, tris (di-isopropylphenyl) phosphite, tris (di-n-butylphenyl) phosphite, tris (2,4-di-tert-butylphenyl) Hos Ite, tris (2,6-di-tert-butylphenyl) phosphite, tris (2,6-di-tert-butylphenyl) phosphite, 2,2′-methylenebis (4,6-di-tert-butyl) Phenyl) (2,4-di-tert-butylphenyl) phosphite, 2,2′-methylenebis (4,6-di-tert-butylphenyl) (2-tert-butyl-4-methylphenyl) phosphite, 2,2′-methylenebis (4-methyl-6-tert-butylphenyl) (2-tert-butyl-4-methylphenyl) phosphite, 2,2′-ethylidenebis (4-methyl-6-tert-butyl) Phenyl) (2-tert-butyl-4-methylphenyl) phosphite, tetrakis (2,4-di-tert-butylphenyl) 4,4′-biphenylenediphosphonite, tetrakis (2,4-di-tert-butylphenyl) -4,3′-biphenylenediphosphonite, tetrakis (2,4-di-tert-butylphenyl) -3, 3′-biphenylenediphosphonite, tetrakis (2,6-di-tert-butylphenyl) -4,4′-biphenylenediphosphonite, tetrakis (2,6-di-tert-butylphenyl) -4,3 ′ -Biphenylenediphosphonite, tetrakis (2,6-di-tert-butylphenyl) -3,3'-biphenylenediphosphonite, bis (2,4-di-tert-butylphenyl) -4-phenyl-phenylphospho Knight, bis (2,4-di-tert-butylphenyl) -3-phenyl-phenylphosphonite, bis (2,6- Di-n-butylphenyl) -3-phenyl-phenylphosphonite, bis (2,6-di-tert-butylphenyl) -4-phenyl-phenylphosphonite, bis (2,6-di-tert-butylphenyl) ) -3-phenyl-phenylphosphonite, tetrakis (2,4-di-tert-butyl-5-methylphenyl) -4,4'-biphenylenediphosphonite, tributyl phosphate, trimethyl phosphate, tricresyl phosphate, tri Phenyl phosphate, trichlorophenyl phosphate, triethyl phosphate, diphenyl cresyl phosphate, diphenyl monoorthoxenyl phosphate, tributoxyethyl phosphate, dibutyl phosphate, dioctyl phosphate, diisopropyl phosphate, etc. And the like.

Commercially available products can also be used as the phosphorus compound. The commercially available phosphorus compounds are not particularly limited. For example, as ADEKA, ADK STAB (trade name) PEP-4C, ADK STAB PEP-8, ADK STAB PEP-24G, ADK STAB PEP-36, ADK STAB HP-10, ADK STAB 2112, ADK STAB 260, ADK STAB 522A, ADK STAB 1178, ADK STAB 1500, ADK STAB C, ADK STAB 135A and the like.

The phenol compound is not particularly limited, and examples thereof include 2,6-di-tert-butyl-4-methylphenol and n-octadecyl-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate. Tetrakis [methylene-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate] methane, 2,4-di-tert-butyl-6-methylphenol, 1,6-hexanediol-bis -[3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], tris (3,5-di-tert-butyl-4-hydroxybenzyl) -isocyanurate, 1,3,5 -Trimethyl-2,4,6-tris (3,5-di-tert-butyl-4-hydroxybenzyl) benzene, pentae Srityl-tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], 3,9-bis- [2- [3- (3-tert-butyl-4-hydroxy-5- Methylphenyl) -propionyloxy] -1,1-dimethylethyl] -2,4,8,10-tetraoxaspiro [5,5] undecane, triethylene glycol-bis [3- (3-t-butyl-5 -Methyl-4-hydroxyphenyl) propionate], 2,2′-butylidenebis (4,6-di-tert-butylphenol), 4,4′-butylidenebis (3-methyl-6-tert-butylphenol), 2,2 '-Methylenebis (4-methyl-6-tert-butylphenol), 2,2'-methylenebis (4-ethyl-6-tert-butyl) Phenol), 2-tert-butyl-6- (3-tert-butyl-2-hydroxy-5-methylbenzyl) -4-methylphenol acrylate, 2- [1- (2-hydroxy-3,5-di-) tert-pentylphenyl) ethyl] -4,6-di-tert-pentylphenyl acrylate, 4,4′-thiobis (3-methyl-6-tert-butylphenol), 4,4′-butylidenebis (3-methyl-6) -Tert-butylphenol), 2-tert-butyl-4-methylphenol, 2,4-di-tert-butylphenol, 2,4-di-tert-pentylphenol, 4,4'-thiobis (3-methyl-6) -Tert-butylphenol), 4,4'-butylidenebis (3-methyl-6-tert-butylphenol) Bis- [3,3-bis- (4′-hydroxy-3′-tert-butylphenyl) -butanoic acid] -glycol ester, 2,4-di-tert-butylphenol, 2,4-di- tert-pentylphenol, 2- [1- (2-hydroxy-3,5-di-tert-pentylphenyl) ethyl] -4,6-di-tert-pentylphenyl acrylate, bis- [3,3-bis- (4′-hydroxy-3′-tert-butylphenyl) -butanoic acid] -glycol ester and the like.

Commercially available products can also be used as the phenolic compound. The commercially available phenolic compound is not particularly limited. For example, IRGANOX (trade name) 1010, IRGANOX 1035, IRGANOX 1076, IRGANOX 1135, IRGANOX 245, IRGANOX 259, IRGANOX 295, IRGANOX 3114, IRGANOX manufactured by Ciba Specialty Chemicals 1098, IRGANOX 1520L, manufactured by Adeka include Adeka Stub (trade name) AO-20, Adeka Stub AO-30, Adeka Stub AO-40, Adeka Stub AO-50, Adeka Stub AO-60, Adeka Stub AO-70, Adeka Stub AO-80, Adeka Stub AO-90, ADK STAB AO-330, manufactured by Sumitomo Chemical Co., Ltd., Sumilizer (trade name) GA- 0, Sumilizer MDP-S, Sumilizer BBM-S, Sumilizer GM, Sumilizer GS (F), and the like Sumilizer GP.

In addition, commercially available additives can be used as resin coloring inhibitors. For example, THINUVIN (trade name) 328, THINUVIN 234, THINUVIN 326, THINUVIN 120, THINUVIN 477, THINUVIN 479, CHIMASSORB (trade name) 2020FDL, CHIMASSORB 119FL and the like can be cited as products manufactured by Ciba Specialty Chemicals.

It is preferable to contain at least one or more of the phosphorus compounds, amine compounds, and phenol compounds, and the amount of the compound is not particularly limited, but with respect to the total weight of the curable resin composition of the present invention, A range of 0.005 to 5.0% by weight is preferred.

The curable resin composition of the present invention can be obtained by uniformly mixing the above components at room temperature or under heating. For example, mix thoroughly until uniform using an extruder, kneader, three rolls, universal mixer, planetary mixer, homomixer, homodisper, bead mill, etc., and if necessary, filter with SUS mesh etc. Prepared.

The curable resin composition of the present invention is obtained by thoroughly mixing additives such as an epoxy group-containing polyorganosiloxane, an epoxy resin curing agent, a curing accelerator, an antioxidant, and a light stabilizer. It can be prepared and used as a sealing material. As a mixing method, mixing can be performed at room temperature or by heating using a kneader, a triple roll, a universal mixer, a planetary mixer, a homomixer, a homodisper, a bead mill, or the like.

Optical semiconductor elements such as high-intensity white LEDs are generally GaAs, GaP, GaAlAs, GaAsP, AlGa, InP, GaN, InN, AlN, InGaN laminated on a substrate of sapphire, spinel, SiC, Si, ZnO or the like. Such a semiconductor chip is bonded to a lead frame, a heat sink, or a package using an adhesive (die bond material). There is also a type in which a wire such as a gold wire is connected to pass an electric current. The semiconductor chip is sealed with a sealing material such as an epoxy resin in order to protect it from heat and moisture and play a role of a lens. The curable resin composition of this invention can be used for this sealing material.

As a molding method of the sealing material, an injection method in which the sealing material is injected into the mold frame in which the optical semiconductor element is fixed is inserted and then heat-cured and then molded, and the sealing material is injected on the mold in advance. A compression molding method is used in which an optical semiconductor element fixed on a substrate is immersed therein and heat-cured and then released from a mold.
Examples of the injection method include a dispenser.
For the heating, methods such as hot air circulation, infrared rays and high frequency can be used. For example, the heating conditions are preferably 80 to 230 ° C. for about 1 minute to 24 hours. For the purpose of reducing internal stress generated during heat-curing, for example, after pre-curing at 80 to 120 ° C. for 30 minutes to 5 hours, post-curing is performed at 120 to 180 ° C. for 30 minutes to 10 hours. it can.
In the present specification, ratios, percentages, parts and the like are based on weight unless otherwise specified. In this specification, the expression “X to Y” indicates a range from X to Y, and the range includes X and Y.

Hereinafter, the present invention will be described in more detail with reference to synthesis examples and examples. The present invention is not limited to these synthesis examples and examples. In addition, each physical-property value in a synthesis example and an Example was measured with the following method. Here, the part represents part by weight unless otherwise specified.
1. Weight average molecular weight: Polystyrene conversion and weight average molecular weight measured under the following conditions were calculated by the GPC method.

2. Epoxy equivalent: Measured by the method described in JIS K-7236.
3. Viscosity: Measured using an E-type viscometer at 25 ° C.
4). Nuclear magnetic resonance spectrum ( ¹ H-NMR): JN-ECA400 manufactured by JEOL Ltd. was used to measure 1H nuclear magnetic resonance spectrum (NMR), and a CDCl ₃ solution was used as a solvent. Used to measure phenyl group mol% and hydroxyl group mol%.
5. Nuclear magnetic resonance spectra ⁽²⁹ Si-NMR) manufactured by Agilent Technologies Inc., measure the nuclear magnetic resonance spectra (NMR) the 29Si using Model 500 NMR, solvent using a mixed solution of acetone and THF (tetrahydrofuran). Used to calculate a to d.
(In addition, Cr (AcAc) 3 is added to 15 mM as a relaxation reagent.)

Example 1: Synthesis of an epoxy group-containing polyorganosiloxane through production steps I and II (production step I)
In a 500 ml four-necked flask made of glass, FCA107 (manufactured by Dow Corning Toray Co., Ltd., weight average molecular weight 1750, silanol equivalent 283 g / eq, 61.9 mol% phenyl group and 38.1 hydroxyl group in the above formula (1). Silicone that is mol% and calculated by 29Si-NMR, a / (a + b + c + d) = 0.38, b / (a + b + c + d) = 0.62, c / (a + b + c + d) = 0, d / (a + b + c + d) = 0 Resin) 25.7 parts, 2- (3,4 epoxycyclohexyl) ethyltrimethoxysilane 94.1 parts, FINISH WS62M (manufactured by Asahi Kasei Wacker, silanol-terminated silicone oil having a weight average molecular weight of 6600, silanol equivalent of 3300 g / eq) 70 .3 parts, 0.8 parts of 5 wt% KOH methanol solution, isopropyl alcohol 7.3 parts of water and 110 parts of toluene were installed, a Dimroth condenser, a sales expansion device and a thermometer were installed, and the flask was immersed in a water bath. The water bath was heated, the internal temperature was kept at 72 ° C., and the reaction was performed for 6 hours.

(Manufacturing process II)
After the production step I, 57 parts of methanol was added, and 41.2 parts of 50 wt% ion-exchanged water methanol solution was added dropwise over 30 minutes, and the reaction was carried out at an internal temperature of 66 ° C. for 10 hours.
After production step II, 3.5 parts of a 5 wt% aqueous sodium dihydrogen phosphate solution was added and neutralized, and then methanol was distilled and recovered at a water bath temperature of 80 ° C. Thereafter, for washing, 152 parts of methyl isobutyl ketone was added, and then washing with water was repeated three times. Next, the organic layer was removed at 100 ° C. under reduced pressure to obtain 157.3 parts of the epoxy group-containing polyorganosiloxane (A-1) of the present invention.
The epoxy equivalent of the obtained compound was 437 g / eq, the weight average molecular weight was 3,800, the viscosity was 9651 mPa · s, and the appearance was a colorless transparent liquid.

Example 2: Synthesis of an epoxy group-containing polyorganosiloxane through production steps I and II (production step I)
In a 500 ml four-necked flask made of glass, 21.5 parts of FCA107 (silicone resin manufactured by Toray Dow Corning, Inc.), 82.0 parts of 2- (3,4 epoxycyclohexyl) ethyltrimethoxysilane, FINISH WS62M (described above) Asahi Kasei Wacker's silanol-terminated silicone oil) 86.5 parts, 0.8% by weight KOH methanol solution, 7.3 parts of isopropyl alcohol, 124 parts of toluene, and Jimroth condenser, sales expansion device, thermometer installed And the flask was immersed in a water bath. The water bath was heated, the internal temperature was kept at 72 ° C., and the reaction was performed for 6 hours.

(Manufacturing process II)
After the production step I, 49.7 parts of methanol was added, and 36 parts of a 50 wt% ion-exchanged water methanol solution was added dropwise over 30 minutes, followed by reaction at an internal temperature of 66 ° C for 10 hours.
After production step II, 3.5 parts of a 5 wt% aqueous sodium dihydrogen phosphate solution was added and neutralized, and then methanol was distilled and recovered at a water bath temperature of 80 ° C. Thereafter, for washing, 152 parts of methyl isobutyl ketone was added, and then washing with water was repeated three times. Next, the organic layer was removed under reduced pressure at 100 ° C. to obtain 160.7 parts of the epoxy group-containing polyorganosiloxane (A-2) of the present invention.
The epoxy equivalent of the obtained compound was 496 g / eq, the weight average molecular weight was 4444, the viscosity was 1731 mPa · s, and the appearance was a colorless transparent liquid.

Example 3 Production Example of Epoxy Group-Containing Polysiloxane via Production Processes 1 to 3 (Production Process 1)
In a 500 ml glass four-necked flask, 20 parts of FCA 107 (silicone resin manufactured by Toray Dow Corning Co., Ltd.), 95.4 parts of 2- (3,4 epoxycyclohexyl) ethyltrimethoxysilane, 7.3 parts of isopropyl alcohol The Dimroth condenser, the sales expansion device and the thermometer were installed, and the flask was immersed in a water bath. Heat the water bath, keep the internal temperature at 60 ° C., and confirm that FCA107 was dissolved in 2- (3,4 epoxycyclohexyl) ethyltrimethoxysilane, and then add 0.8 part of 5 wt% KOH methanol solution. The charged internal temperature was 72 ° C. and reacted for 4 hours.

(Manufacturing process 2)
After manufacturing step 1, the flask was cooled to 40 ° C. and charged with 74.7 parts of FINISH WS62M (manufactured by Asahi Kasei Wacker, silanol-terminated silicone oil), heated in a water bath, and maintained at 72 ° C. for 6 hours. Reacted.

(Manufacturing process 3)
After the production step 2, 152 parts of methanol was added, and 41.8 parts of a 50 wt% ion-exchanged water methanol solution was added dropwise over 30 minutes, and the mixture was reacted at an internal temperature of 66 ° C for 10 hours.
After the production step 3, 3.5 parts of 5% by weight aqueous sodium dihydrogen phosphate solution was added for neutralization, and then methanol was recovered by distillation at a water bath temperature of 80 ° C. Thereafter, for washing, 152 parts of methyl isobutyl ketone was added, and then washing with water was repeated three times. Next, the solvent was removed from the organic layer at 100 ° C. under reduced pressure to obtain 158.5 parts of the epoxy group-containing polyorganosiloxane (A-3) of the present invention.
The epoxy equivalent of the obtained compound was 432 g / eq, the weight average molecular weight was 5051, the viscosity was 6533 mPa · s, and the appearance was a colorless transparent liquid.

Example 4 Production Example of Epoxy Group-Containing Polysiloxane via Production Processes 1 to 3 (Production Process 1)
In a glass 500 ml four-necked flask, 20 parts of FCA107 (the above-mentioned silicone resin manufactured by Toray Dow Corning), 95.4 parts of 2- (3,4 epoxycyclohexyl) ethyltrimethoxysilane, 7.3 parts of isopropyl alcohol The Dimroth condenser, the sales expansion device and the thermometer were installed, and the flask was immersed in a water bath. Heat the water bath, keep the internal temperature at 60 ° C., and confirm that FCA107 was dissolved in 2- (3,4 epoxycyclohexyl) ethyltrimethoxysilane, and then add 0.8 part of 5 wt% KOH methanol solution. The charged internal temperature was 72 ° C. and reacted for 4 hours.

(Manufacturing process 2)
After the production step 1, the flask was cooled to 40 ° C, charged with 74.7 parts of XC96-723 (manufactured by Momentive, silanol-terminated silicone oil having a weight average molecular weight of 997 and a silanol equivalent of 499), and the water bath was heated. The internal temperature was kept at 72 ° C. and reacted for 6 hours.

(Manufacturing process 3)
After the production step 2, 152 parts of methanol was added, and 41.8 parts of a 50 wt% ion-exchanged water methanol solution was added dropwise over 30 minutes, and the mixture was reacted at an internal temperature of 66 ° C for 10 hours.
After the production step 3, 3.5 parts of 5% by weight aqueous sodium dihydrogen phosphate solution was added for neutralization, and then methanol was recovered by distillation at a water bath temperature of 80 ° C. Thereafter, for washing, 152 parts of methyl isobutyl ketone was added, and then washing with water was repeated three times. Subsequently, the solvent was removed from the organic layer under reduced pressure at 100 ° C. to obtain 154.2 parts of the epoxy group-containing polyorganosiloxane (A-4) of the present invention.
The epoxy equivalent of the obtained compound was 426 g / eq, the weight average molecular weight was 6094, the viscosity was 9216 mPa · s, and the appearance was a colorless transparent liquid.

Example 5: Production Example of Epoxy Group-Containing Polysiloxane after Production Process I / II (Production Process I)
In a 500 ml four-necked flask made of glass, SILRES 604 (manufactured by Asahi Kasei Wacker Co., Ltd., weight average molecular weight 2176, silanol equivalent 485 g / eq, 40.6 mol% phenyl group in the above formula (1), 27.4 mol% hydroxyl group. Silicone resin in which a / (a + b + c + d) = 0.55, b / (a + b + c + d) = 0.45, c / (a + b + c + d) = 0, d / (a + b + c + d) = 0, calculated by 29Si-NMR 17.2 parts, 2- (3,4 epoxycyclohexyl) ethyltrimethoxysilane 108.1 parts, FINISH WS62M (the aforementioned silanol-terminated silicone oil manufactured by Asahi Kasei Wacker Co., Ltd.) 84.7 parts, 5 wt% KOH methanol solution 0 9 parts, 8.1 parts isopropyl alcohol, 105 parts methyl isobutyl ketone A flask, a Jimroth condenser, a sales expansion device, and a thermometer were installed, and the flask was immersed in a water bath. The water bath was heated, the internal temperature was kept at 72 ° C., and the reaction was performed for 6 hours.

(Manufacturing process II)
After the production step I, 58.6 parts of methanol was added, and 47.4 parts of a 50 wt% ion-exchanged water methanol solution was added dropwise over 30 minutes, followed by reaction at an internal temperature of 66 ° C for 10 hours.
After the production step II, 3.9 parts of a 5 wt% aqueous solution of sodium dihydrogen phosphate was added for neutralization, and then methanol was recovered by distillation at a water bath temperature of 80 ° C. Thereafter, for additional washing, 105 parts of methyl isobutyl ketone was added, and washing with water was repeated three times. Next, the organic layer was removed under reduced pressure at 100 ° C. to obtain 168 parts of the epoxy group-containing polyorganosiloxane (A-5) of the present invention.
The epoxy equivalent of the obtained compound was 410 g / eq, the weight average molecular weight was 4267, the viscosity was 5328 mPa · s, and the appearance was a colorless transparent liquid.

Example 6: Production Example of Epoxy Group-Containing Polysiloxane via Production Steps I and II (Production Step I)
To a 500 ml four-necked flask made of glass, 33.8 parts of SILRES 604 (the above-mentioned silicone resin manufactured by Asahi Kasei Wacker), 106.0 parts of 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, FINISH WS62M (described above, Asahi Kasei Wacker's silanol-terminated silicone oil) 70.2 parts, 0.9 parts by weight of KOH methanol solution, 8.1 parts of isopropyl alcohol, 105 parts of methyl isobutyl ketone, Jimroth condenser, sales expansion equipment, thermometer installed And the flask was immersed in a water bath. The water bath was heated, the internal temperature was kept at 72 ° C., and the reaction was performed for 6 hours.

(Manufacturing process II)
After the production step I, 59.5 parts of methanol was added, and 46.4 parts of a 50 wt% ion-exchanged water methanol solution was added dropwise over 30 minutes, followed by reaction at an internal temperature of 66 ° C for 10 hours.
After the production step II, 3.9 parts of a 5 wt% aqueous solution of sodium dihydrogen phosphate was added for neutralization, and then methanol was recovered by distillation at a water bath temperature of 80 ° C. Thereafter, for additional washing, 105 parts of methyl isobutyl ketone was added, and washing with water was repeated three times. Next, the organic layer was removed under reduced pressure at 100 ° C. to obtain 165 parts of the epoxy group-containing polyorganosiloxane (A-6) of the present invention.
The epoxy equivalent of the obtained compound was 422 g / eq, the weight average molecular weight was 5204, the viscosity was 36600 mPa · s, and the appearance was a colorless transparent liquid.

Example 7: Production Example of Epoxy Group-Containing Polysiloxane after Production Process I / II (Production Process I)
In a glass 500 ml four-necked flask, 36.4 parts of SILRES 604 (the aforementioned silicone resin manufactured by Asahi Kasei Wacker), 91.2 parts of 2- (3,4 epoxycyclohexyl) ethyltrimethoxysilane, FINISH WS62M (described above, Asahi Kasei Wacker Co., Ltd. Silanol-terminated silicone oil) 82.4 parts, 0.9 parts by weight of 5% by weight KOH methanol solution, 8.1 parts of isopropyl alcohol, 105 parts of methyl isobutyl ketone, charged with Jimroth condenser, sales expansion device and thermometer And the flask was immersed in a water bath. The water bath was heated, the internal temperature was kept at 72 ° C., and the reaction was performed for 6 hours.

(Manufacturing process II)
After the production step I, 66.0 parts of methanol was added, and 40.0 parts of 50 wt% ion-exchanged water methanol solution was added dropwise over 30 minutes, and the reaction was carried out at an internal temperature of 66 ° C. for 10 hours.
After the production step II, 3.9 parts of a 5 wt% aqueous solution of sodium dihydrogen phosphate was added for neutralization, and then methanol was recovered by distillation at a water bath temperature of 80 ° C. Thereafter, for additional washing, 105 parts of methyl isobutyl ketone was added, and washing with water was repeated three times. Next, the organic layer was removed under reduced pressure at 100 ° C. to obtain 161 parts of the epoxy group-containing polyorganosiloxane (A-7) of the present invention.
The epoxy equivalent of the obtained compound was 499 g / eq, the weight average molecular weight was 5476, the viscosity was 10033 mPa · s, and the appearance was a colorless transparent liquid.

Example 8: Production Example of Epoxy Group-Containing Polysiloxane after Production Process I / II (Production Process I)
In a glass 500 ml four-necked flask, 18.6 parts of SILRES 604 (the aforementioned silicone resin manufactured by Asahi Kasei Wacker), 93.2 parts of 2- (3,4 epoxycyclohexyl) ethyltrimethoxysilane, FINISH WS62M (described above, Asahi Kasei Wacker's Silanol-terminated silicone oil) 98.2 parts, 0.9 parts of 5 wt% KOH methanol solution, 8.1 parts of isopropyl alcohol, 116 parts of methyl isobutyl ketone, and Jimroth condenser, sales expansion device, thermometer installed And the flask was immersed in a water bath. The water bath was heated, the internal temperature was kept at 72 ° C., and the reaction was performed for 6 hours.

(Manufacturing process II)
After production step I, 39.7 parts of methanol was added, and 40.8 parts of 50 wt% ion-exchanged water methanol solution was added dropwise over 30 minutes, and the reaction was carried out at an internal temperature of 66 ° C for 10 hours.
After the production step II, 3.9 parts of a 5 wt% aqueous solution of sodium dihydrogen phosphate was added for neutralization, and then methanol was recovered by distillation at a water bath temperature of 80 ° C. Thereafter, 110 parts of methyl isobutyl ketone was added for washing, and washing with water was repeated three times. Subsequently, the solvent was removed from the organic layer under reduced pressure at 100 ° C. to obtain 174 parts of the epoxy group-containing polyorganosiloxane (A-8) of the present invention.
The epoxy equivalent of the obtained compound was 482 g / eq, the weight average molecular weight was 5181, the viscosity was 2458 mPa · s, and the appearance was a colorless transparent liquid.

Example 9: Production example of epoxy group-containing polysiloxane through production steps 1 to 3 (production step 1)
In a 500 ml four-necked flask made of glass, 11.0 parts of FCA107 (the above-mentioned silicone resin manufactured by Toray Dow Corning), 84.1 parts of 2- (3,4 epoxycyclohexyl) ethyltrimethoxysilane, 7. 3 parts were charged, a Jimroth condenser, a sales expansion device and a thermometer were installed, and the flask was immersed in a water bath. Heat the water bath, keep the internal temperature at 60 ° C., and confirm that FCA107 was dissolved in 2- (3,4 epoxycyclohexyl) ethyltrimethoxysilane, and then add 0.8 part of 5 wt% KOH methanol solution. The charged internal temperature was 72 ° C. and reacted for 4 hours.

(Manufacturing process 2)
After the production step 1, the flask was cooled to 40 ° C., charged with 94.9 parts of XC96-723 (the aforementioned Silanol-terminated silicone oil manufactured by Momentive), the water bath was heated, and the internal temperature was kept at 72 ° C. The reaction was performed for 6 hours.

(Manufacturing process 3)
After production step 2, 152 parts of methanol was added, and 36.8 parts of a 50 wt% ion-exchanged water methanol solution was added dropwise over 30 minutes, and the reaction was carried out at an internal temperature of 66 ° C. for 10 hours.
After the production step 3, 3.5 parts of 5% by weight aqueous sodium dihydrogen phosphate solution was added for neutralization, and then methanol was recovered by distillation at a water bath temperature of 80 ° C. Thereafter, for washing, 152 parts of methyl isobutyl ketone was added, and then washing with water was repeated three times. Subsequently, the organic layer was removed under reduced pressure at 100 ° C. to obtain 156 parts of the epoxy group-containing polyorganosiloxane (A-9) of the present invention.
The epoxy equivalent of the obtained compound was 474 g / eq, the weight average molecular weight was 6009, the viscosity was 1454 mPa · s, and the appearance was a colorless transparent liquid.

Example 10: Production example of epoxy group-containing polysiloxane after production steps 1 to 3 (production step 1)
In a glass 500 ml four-necked flask, 12.0 parts of FCA107 (the above-mentioned silicone resin manufactured by Toray Dow Corning Co., Ltd.), 68.4 parts of 2- (3,4 epoxycyclohexyl) ethyltrimethoxysilane, isopropyl alcohol 7. 3 parts were charged, a Jimroth condenser, a sales expansion device and a thermometer were installed, and the flask was immersed in a water bath. Heat the water bath, keep the internal temperature at 60 ° C., and confirm that FCA107 was dissolved in 2- (3,4 epoxycyclohexyl) ethyltrimethoxysilane, and then add 0.8 part of 5 wt% KOH methanol solution. The charged internal temperature was 72 ° C. and reacted for 4 hours.

(Manufacturing process 2)
After the production step 1, the flask was cooled to 40 ° C., charged with 109.7 parts of XC96-723 (the aforementioned silanol-terminated silicone oil manufactured by Momentive), the water bath was heated, and the internal temperature was kept at 72 ° C. The reaction was performed for 6 hours.

(Manufacturing process 3)
After the production step 2, 152 parts of methanol was added, and 30.0 parts of a 50 wt% ion-exchanged water methanol solution was added dropwise over 30 minutes, followed by reaction at an internal temperature of 66 ° C. for 10 hours.
After the production step 3, 3.5 parts of 5% by weight aqueous sodium dihydrogen phosphate solution was added for neutralization, and then methanol was recovered by distillation at a water bath temperature of 80 ° C. Thereafter, for washing, 152 parts of methyl isobutyl ketone was added, and then washing with water was repeated three times. Next, the organic layer was removed under reduced pressure at 100 ° C. to obtain 158 parts of the epoxy group-containing polyorganosiloxane (A-10) of the present invention.
The epoxy equivalent of the obtained compound was 566 g / eq, the weight average molecular weight was 10158, the viscosity was 1910 mPa · s, and the appearance was a colorless transparent liquid.

Example 13: Production Example of Epoxy Group-Containing Polysiloxane after Production Process I / II (Production Process I)
In a glass 500 ml four-necked flask, SILRES 603 (manufactured by Asahi Kasei Wacker, weight average molecular weight 1500, silanol equivalent 567 g / eq, in the above formula (1), the phenyl group is 83.7 mol%, the hydroxyl group is 16.3 mol%. Silicone resin in which a / (a + b + c + d) = 0.45, b / (a + b + c + d) = 0.55, c / (a + b + c + d) = 0, d / (a + b + c + d) = 0, calculated by 29Si-NMR 25.8 parts and 94.1 parts of 2- (3,4 epoxycyclohexyl) ethyltrimethoxysilane were charged, a Dimroth condenser, a sales expansion device and a thermometer were installed, and the flask was immersed in a water bath. SILRES 603 was dissolved in 2- (3,4 epoxycyclohexyl) ethyltrimethoxysilane while maintaining the internal temperature at 60 ° C. and stirring for 30 minutes. Thereafter, X-21-5841 (manufactured by Shin-Etsu Chemical Co., Ltd., silanol-terminated silicone oil having a weight average molecular weight of 1000 and a silanol equivalent of 500 g / eq) 80.1 parts, 0.9 parts of 5 wt% KOH methanol solution, isopropyl alcohol 8. 1 part was charged, the water bath was heated, the internal temperature was kept at 72 ° C., and the reaction was carried out for 8 hours.

(Manufacturing process II)
After the production step I, 160 parts of methanol was added, and 41.2 parts of 50% by weight ion-exchanged water methanol solution was added dropwise over 30 minutes, and reacted at an internal temperature of 66 ° C. for 10 hours.
After the production step II, 0.96 part of a 20 wt% aqueous sodium dihydrogen phosphate solution was added for neutralization, and then methanol was recovered by distillation at a water bath temperature of 80 ° C. Thereafter, 160 parts of methyl isobutyl ketone was added for washing, and washing with water was repeated three times. Next, the solvent was removed from the organic layer at 100 ° C. under reduced pressure to obtain the epoxy group-containing polyorganosiloxane (A-13) part of the present invention.
The epoxy equivalent of the obtained compound was 463 g / eq, the weight average molecular weight was 7445, the viscosity was 6835 mPa · s, and the appearance was a colorless transparent liquid.

Comparative Example 1: Example using an organic base compound as a catalyst (Production Process 1)
In a glass 500 ml four-necked flask, 20 parts of FCA107 (the above-mentioned silicone resin manufactured by Toray Dow Corning), 95.4 parts of 2- (3,4 epoxycyclohexyl) ethyltrimethoxysilane, 7.3 parts of isopropyl alcohol The Dimroth condenser, the sales expansion device and the thermometer were installed, and the flask was immersed in a water bath. The water bath was heated and the internal temperature was kept at 60 ° C. After confirming that FCA107 was dissolved in 2- (3,4 epoxycyclohexyl) ethyltrimethoxysilane, 19 parts of triethylamine was added, and the internal temperature was 72 When reacted at 4 ° C. for 4 hours, no peak change occurred in GPC, and the reaction did not proceed. Even when the reaction was continued for an additional 6 hours, the peak change of GPC did not occur.

Tables showing the raw material charge ratio, alkoxy / silanol group ratio, catalyst used, production process, epoxy equivalent, weight average molecular weight, viscosity, and appearance of the resins obtained in Examples 1 to 10, 13 and Comparative Example 1. It is shown in 1.

a-1; Silicone resin FCA107 manufactured by Toray Dow Corning
a-2; Silicone resin SILRES604 manufactured by Asahi Kasei Wacker
a-3; Silicone resin SILRES603 manufactured by Asahi Kasei Wacker
b-1; 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane c-1; silicone oil from Asahi Kasei Wacker, FINISH WS62M
c-2; Silicone oil XC96-723 manufactured by Momentive
c-3: Silicone oil X-21-5841 manufactured by Shin-Etsu Chemical Co., Ltd.

As is clear from the results shown in Table 1, in Comparative Example 1, the reaction did not proceed and the desired resin could not be obtained. On the other hand, Examples 1 to 10 and 13 are all obtained with a colorless and transparent liquid resin, and can be obtained with appropriate epoxy equivalent, viscosity, and weight average molecular weight, and are particularly suitable as a liquid epoxy resin for optical applications. It could be confirmed.

Synthesis Example 1: Production Example of Epoxy Group-Containing Polysiloxane Using Silicone Resin through Production Process I / II (Production Process I)
In a glass 500 ml four-necked flask, 86.9 parts of 2- (3,4 epoxycyclohexyl) ethyltrimethoxysilane, XC96-723 (the aforementioned Silanol-terminated silicone oil made by Momentive) 103.8 parts, 5% by weight A KOH methanol solution 0.8 part and isopropyl alcohol 7.3 parts were charged, a Dimroth condenser, a sales expansion device, and a thermometer were installed, and the flask was immersed in a water bath. The water bath was heated, the internal temperature was kept at 72 ° C., and the reaction was carried out for 10 hours.

(Manufacturing process II)
After the production step I, 152 parts of methanol was added, and 38.0 parts of a 50 wt% ion-exchanged water methanol solution was added dropwise over 30 minutes, followed by reaction at an internal temperature of 66 ° C. for 10 hours.
After production step II, 3.5 parts of a 5 wt% aqueous sodium dihydrogen phosphate solution was added and neutralized, and then methanol was distilled and recovered at a water bath temperature of 80 ° C. Thereafter, for washing, 152 parts of methyl isobutyl ketone was added, and then washing with water was repeated three times. Subsequently, the solvent was removed from the organic layer under reduced pressure at 100 ° C. to obtain 154 parts of an epoxy group-containing polyorganosiloxane (A-11) containing no silicone resin.
The epoxy equivalent of the obtained compound was 473 g / eq, the weight average molecular weight was 6511, the viscosity was 845 mPa · s, and the appearance was a colorless transparent liquid.

Synthesis Example 2: Production Example of Epoxy Group-Containing Polysiloxane Using Silanol-Terminated Silicone Oil Containing Phenyl Group as Silanol-Terminated Silicone Oil without Using Silicone Resin through Production Process I / II (Production Process I)
In a glass 2000 ml four-neck flask, 394 parts of 2- (3,4 epoxycyclohexyl) ethyltrimethoxysilane, silanol-terminated polydimethyldiphenyl silicone oil (weight average molecular weight 1700, silanol equivalent 850, phenyl group content 33 wt% silanol) (Terminal silicone oil) 475 parts, 4 parts by weight of 5% by weight KOH methanol solution and 36 parts of isopropyl alcohol were charged, a Dimroth condenser, a sales expansion device and a thermometer were installed, and the flask was immersed in a water bath. The water bath was heated, the internal temperature was kept at 72 ° C., and the reaction was carried out for 10 hours.

(Manufacturing process II)
After the production step I, 656 parts of methanol was added, and 173 parts of a 50 wt% ion-exchanged water methanol solution was added dropwise over 60 minutes, and reacted at an internal temperature of 66 ° C. for 10 hours.
After the production step II, 17.5 parts of 5% by weight aqueous sodium dihydrogen phosphate solution was added for neutralization, and methanol was recovered by distillation at a water bath temperature of 80 ° C. Thereafter, 780 parts of methyl isobutyl ketone was added for washing, and washing with water was repeated three times. Next, by removing the solvent at 100 ° C. under reduced pressure, the organic layer contains an epoxy group using a silanol-terminated silicone oil containing a phenyl group as a silanol-terminated silicone oil without using a silicone resin that has undergone production steps I and II. 731 parts of polysiloxane (A-12) were obtained. The epoxy equivalent of the obtained compound was 491 g / eq, the weight average molecular weight was 2090, the viscosity was 3328 mPa · s, and the appearance was a colorless transparent liquid.

Synthesis Example 3: Carbinol-modified silicone oil (d) at both ends, terminal alcohol polyester compound (i), compound (h) having two or more carboxylic anhydride groups in the molecule, and one in the molecule Synthesis example of polyvalent carboxylic acid resin which is epoxy resin curing agent (B) obtained by addition reaction with compound (f) having carboxylic anhydride group Glass equipped with stirrer, Dimroth condenser and thermometer In a separable flask, 47.1 parts of both-end carbinol-modified silicone X22-160AS (manufactured by Shin-Etsu Chemical Co., Ltd.), Adeka New Ace Y9-10 (made by ADEKA Corporation), a polyester polyol, the above formula (6 polyester polyol) 11.8 parts ^{R 12} is butyl ^{and R 11} is neopentyl group in), RIKACID BT-10 (1,2,3,4-butanetetracarboxylic dianhydride, manufactured by Shin Nippon Rika Co., Ltd.) 2.5 parts, Ricacid MH (methylhexahydrophthalic anhydride, manufactured by Shin Nippon Rika Co., Ltd.) 16 .6 parts were charged and reacted at 140 ° C. for 10 hours to obtain 77.5 parts of a polycarboxylic acid resin (B-1). At this time, the peaks of Ricacid BT-100 and Ricacid MH disappeared in the GPC measurement. This polycarboxylic acid resin was a colorless and transparent liquid at the end of the reaction, but became a cloudy liquid as the temperature of the reaction liquid decreased. The acid value of the obtained compound was 88.8 mgKOH / g, the weight average molecular weight was 3452, the viscosity was 5730 mPa · s, and the appearance was a white liquid.

Example 11: 100 parts of the epoxy group-containing polyorganosiloxane (A-2) obtained in Example 2, 63.2 parts of the polyvalent carboxylic acid resin (B-1) obtained in Synthesis Example 3, and a curing accelerator As described above, 0.5 part of zinc 2-ethylhexanoate was placed in a polypropylene container, mixed and degassed for 5 minutes to obtain a curable resin composition for sealing an optical semiconductor of the present invention.

Example 12: 100 parts of the epoxy group-containing polyorganosiloxane (A-9) obtained in Example 9, 66.7 parts of the polyvalent carboxylic acid resin (B-1) obtained in Synthesis Example 3, and a curing accelerator As described above, 0.5 part of zinc 2-ethylhexanoate was placed in a polypropylene container, mixed and degassed for 5 minutes to obtain a curable resin composition for sealing an optical semiconductor of the present invention.

Comparative Example 2: 100 parts of an epoxy group-containing polyorganosiloxane (A-11) not using the silicone resin obtained in Synthesis Example 1 as a raw material, and the polyvalent carboxylic acid resin (B-1) 66 obtained in Synthesis Example 3 .8 parts and 0.5 parts of zinc 2-ethylhexanoate as a curing accelerator were placed in a polypropylene container, mixed and degassed for 5 minutes to obtain a curable resin composition for optical semiconductor encapsulation.

Comparative Example 3; 100 parts of an epoxy group-containing polysiloxane (A-12) using a silanol-terminated silicone oil containing a phenyl group as a silanol-terminated silicone oil without using the silicone resin obtained in Synthetic Example 2, Synthetic Example 3 64.9 parts of the polyvalent carboxylic acid resin (B-1) obtained in 1 above and 0.5 part of zinc 2-ethylhexanoate as a curing accelerator are placed in a polypropylene container, mixed and degassed for 5 minutes. A curable resin composition for optical semiconductor encapsulation was obtained.

[Evaluation test]
Table 2 shows the blending ratios of the curable resin compositions for sealing an optical semiconductor obtained in Examples 11 to 12 and Comparative Examples 2 to 3, and the results of hardness, transmittance, sulfidation resistance, and tack test of the cured products. Shown in The test in Table 2 was performed as follows.

(1) Hardness The durometer A hardness was measured by the method described in JIS K-7215.
(2) Cured product transmittance and cured post-heat cured product transmittance The curable resin composition for sealing an optical semiconductor obtained in Examples 11 to 12 and Comparative Examples 2 to 3 was vacuum degassed for 5 minutes, and then 30 mm × The mold was gently cast on a glass substrate on which a dam was created with a heat-resistant tape so that the height was 20 mm and the height was 0.8 mm. The cast was cured at 120 ° C. for 3 hours after pre-curing at 120 ° C. for 1 hour to obtain a test piece for transmittance having a thickness of 0.8 mm. The obtained specimen was measured for light transmittance at 400 nm under the following conditions.

Spectrophotometer measurement conditions Manufacturer: Hitachi High-Technologies Corporation Model: U-3300
Slit width: 2.0nm
Scan speed: 120 nm / min

(3) Sulfurization resistance test The curable resin composition for optical semiconductor encapsulation obtained in Examples 11 to 12 and Comparative Examples 2 to 3 was vacuum degassed for 5 minutes, then filled into a syringe, and a precision dispensing device was used. In addition, a light-emitting element having an emission wavelength of 450 nm is mounted on a 3.0 mm × 1.4 mm × 1.4 mmt (sealing portion 0.6 mmt) surface-mount type LED package having a copper electrode with silver plating on the bottom surface. The surface-mounted LED was cast so that the opening was flat. After pre-curing at 120 ° C. for 1 hour, it was cured at 150 ° C. for 3 hours to seal the surface-mounted LED. 120mm x 180mm x 36mmt polypropylene made from a sealed surface-mount LED with two glass containers (open lid) with an opening diameter of 0.6cm and a height of 3.5cm containing 1ml of 20% ammonium sulfide aqueous solution It put into the airtight container and left to stand in a 25 degreeC thermostat. The discoloration of the silver-plated portion on the bottom surface was visually confirmed every 2 hours. The time when it was confirmed that the silver plating on the bottom surface was severely discolored was entered.

(4) Tack test The curable resin composition for sealing an optical semiconductor obtained in Examples 11 to 12 and Comparative Examples 2 to 3 was vacuum degassed for 5 minutes, then filled into a syringe, and using a precision dispensing device. A surface on which a light emitting element having an emission wavelength of 450 nm is mounted on a 5.0 mm × 5.0 mm × 1.4 mmt (mounting portion 0.6 mmt) surface-mount LED package having a copper electrode with silver plating on the bottom surface Light emitting wavelength 450nm on surface mounted LED package of 3.2mm x 2.8mm x 1.4mmt (sealing part 0.6mmt) with mounted LED (LED-A) and copper electrode with silver plating on the bottom Each surface-mounting type LED (LED-B) mounted with a light emitting device having a shape was cast so that the opening was flat. After pre-curing at 120 ° C. for 1 hour, it was cured at 150 ° C. for 3 hours to seal the surface-mounted LED.

The LED-A after sealing is fixed to a 1 g aluminum plate using double-sided tape so that the opening is on top, and the LED-B is placed on the LED-A so that the respective openings are in contact with each other. The LED-B was pressed for 5 seconds.
After that, when only LED-B is lifted with tweezers, the sample lifted with 1 g of aluminum metal plate makes a judgment (D) that there is tack (stickiness), and LED-B peels off from LED-A. The sample which raised only B was judged (A) without tack (stickiness).

* A-2, A-9, A-11, A-12, and B-1 represent the compounds obtained in the above Examples and Comparative Examples.

As is clear from the results shown in Table 2, Comparative Example 2 using an epoxy group-containing polysiloxane that does not use a silicone resin as a raw material is suitable for optical semiconductor sealing applications in terms of viscosity, hardness, and cured product transmittance after mixing. There is an epoxy group-containing polysiloxane using a silanol-terminated silicone oil containing a phenyl group as a silanol-terminated silicone oil without using a silicone resin, and the silver plating is severely discolored after 2 hours in the sulfidation-resistant test and inferior in sulfidation resistance. In Comparative Example 3 used, the viscosity and hardness after mixing and the cured product transmittance are suitable for optical semiconductor sealing applications, but they are excellent in sulfidation resistance but inferior in tackiness. In Examples 11 to 12, In addition to its appropriate physical properties, it has excellent sulfidation resistance and tackiness.

Although the invention has been described in detail with reference to specific embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention.
In addition, this application is based on the Japan patent application (2013-133600) for which it applied on June 26, 2013, The whole is used by reference. Also, all references cited herein are incorporated as a whole.

The epoxy group-containing polyorganosiloxane of the present invention and the curable resin composition containing the epoxy group are excellent in heat-resistant transparency and sulfidation resistance, and further provide a low-tack cured product. Therefore, it can be suitably used as a sealing resin for optical semiconductors (such as LEDs).

Claims

Silicone resin structure (A) represented by average formula (A), epoxy group-containing silsesquioxane structure (B) represented by formula (B), and silicone oil structure represented by formula (C) ( Epoxy group-containing polyorganosiloxane in which C) is linked and the terminal is a silanol group and / or an alkoxy group having 1 to 10 carbon atoms:

(In the formula, R ′ 1 , R ′ 2 , R ′ 3 , R ′ 4 , R ′ 5 , R ′ 6 may be the same as or different from each other, and may be a monovalent hydrocarbon group or a hydroxyl group. And the total amount of R ′ 1 to R ′ 6 in the molecule is 100 mol%, the hydroxyl group is 5 to 50 mol%, the phenyl group is 30 to 95 mol%, and a / (a + b + c + d) = 0.01 to 1.0, b / (a + b + c + d) = 0 to 0.7, c / (a + b + c + d) = 0 to 0.3, d / (a + b + c + d) = 0 to 0.3, where numerator And at least two hydroxyl groups of R ′ 1 to R ′ 6 are eliminated, and a silicon atom is bonded to an oxygen atom of the epoxy group-containing silsesquioxane structure (B)).

(Wherein Y is independently a hydrogen atom, a reactive functional group having an epoxy group, an alkyl group having 1 to 3 carbon atoms, or a phenyl group, at least one of Y is a reaction having an epoxy group) L represents an integer greater than or equal to 2. * represents a bond to a silicon atom of the silicone resin structure (A) or the silicone oil structure (C));

(In the formula, a plurality of R 9 s may be the same or different and each represents an alkyl group having 1 to 3 carbon atoms or an aryl group having 6 to 10 carbon atoms, and g represents an average value of 2 to 2000. * Represents a bond to the oxygen atom of the epoxy group-containing silsesquioxane structure (B).
Silicone resin represented by average formula (1) (component a); epoxy group-containing silicon compound represented by formula (2) (component b); and silanol-terminated silicone oil represented by formula (3) (c) Component-containing epoxy group-containing polyorganosiloxane manufactured from:

(In the formula, R 1 , R 2 , R 3 , R 4 , R 5 and R 6 may be the same or different from each other, and are a monovalent hydrocarbon group or a hydroxyl group, and R in the molecule) When the total amount of ' 1 to R' 6 is 100 mol%, the hydroxyl group is 5 to 50 mol%, the phenyl group is 30 to 95 mol%, and a / (a + b + c + d) = 0.01 to 1 0.0, b / (a + b + c + d) = 0-0.7, c / (a + b + c + d) = 0-0.3, d / (a + b + c + d) = 0-0.3);

(Wherein X has a reactive functional group having an epoxy group, R 7 has a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms or an aromatic hydrocarbon group having 6 to 10 carbon atoms. An aryl group, R 8 represents a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms, e represents 0, 1 or 2, and f represents (3-e));

(In the formula, a plurality of R 9 s may be the same or different and each represents an alkyl group having 1 to 3 carbon atoms or an aryl group having 6 to 10 carbon atoms, and g represents an average value of 2 to 2000. Show).
The epoxy group-containing polyorganosiloxane according to claim 2, which is produced through the following two-stage production process:
[Manufacturing step I] A step of dealcoholizing a silanol group of component a and c and an alkoxy group of component b in the presence of an inorganic base compound [Manufacturing step II] After manufacturing step I, water is added to remain. The step of condensing the alkoxy groups.
The epoxy group-containing polyorganosiloxane according to claim 2, which is produced through the following three-stage production process:
[Manufacturing step 1] A step of dealcoholizing a silanol group of component a and an alkoxy group of component b in the presence of an inorganic base compound [Manufacturing step 2] After manufacturing step 1, component c is added and manufacturing step 1 is performed. Step of performing dealcoholization condensation between alkoxy group remaining after passing and silanol group of component c [Manufacturing step 3] Step of adding water after manufacturing step 2 and condensing remaining alkoxy groups .
Silicone resin represented by average formula (1) (component a); epoxy group-containing silicon compound represented by formula (2) (component b); and silanol-terminated silicone oil represented by formula (3) (c) A method for producing an epoxy group-containing polyorganosiloxane produced using a component) as a raw material, comprising the following two-stage production steps:
[Manufacturing step I] A step of dealcoholizing the silanol groups of component a and c and the alkoxy group of component b in the presence of an inorganic base compound [Manufacturing step II] After manufacturing step I, water is added to remain. The step of condensing the alkoxy groups together:

(In the formula, R 1 , R 2 , R 3 , R 4 , R 5 and R 6 may be the same or different from each other, and are a monovalent hydrocarbon group or a hydroxyl group, and R in the molecule) When the total amount of ' 1 to R' 6 is 100 mol%, the hydroxyl group is 5 to 50 mol%, the phenyl group is 30 to 95 mol%, and a / (a + b + c + d) = 0.01 to 1.0, b / (a + b + c + d) = 0 to 0.7, c / (a + b + c + d) = 0 to 0.3, d / (a + b + c + d) = 0 to 0.3);

(Wherein X has a reactive functional group having an epoxy group, R 7 has a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms or an aromatic hydrocarbon group having 6 to 10 carbon atoms. An aryl group, R 8 represents a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms, e represents 0, 1 or 2, and f represents (3-e));

(In the formula, a plurality of R 9 s may be the same or different and each represents an alkyl group having 1 to 3 carbon atoms or an aryl group having 6 to 10 carbon atoms, and g represents an average value of 2 to 2000. Show).
Silicone resin represented by average formula (1) (component a); epoxy group-containing silicon compound represented by formula (2) (component b); and silanol-terminated silicone oil represented by formula (3) (c) A method for producing an epoxy group-containing polyorganosiloxane produced using a component) as a raw material, comprising the following three-stage production steps:
[Manufacturing step 1] A step of dealcoholizing a silanol group of component a and an alkoxy group of component b in the presence of an inorganic base compound.
[Manufacturing step 2] A step of adding a component c after the manufacturing step 1 and performing dealcoholization condensation between the alkoxy group remaining after the manufacturing step 1 and silanol of the component c.
[Manufacturing step 3] After manufacturing step 2, water is added to condense the remaining alkoxy groups:

(In the formula, R 1 , R 2 , R 3 , R 4 , R 5 and R 6 may be the same or different from each other, and are a monovalent hydrocarbon group or a hydroxyl group, and R in the molecule) When the total amount of ' 1 to R' 6 is 100 mol%, the hydroxyl group is 5 to 50 mol%, the phenyl group is 30 to 95 mol%, and a / (a + b + c + d) = 0.01 to 1.0, b / (a + b + c + d) = 0 to 0.7, c / (a + b + c + d) = 0 to 0.3, d / (a + b + c + d) = 0 to 0.3);

(Wherein X has a reactive functional group having an epoxy group, R 7 has a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms or an aromatic hydrocarbon group having 6 to 10 carbon atoms. An aryl group, R 8 represents a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms, e represents 0, 1 or 2, and f represents (3-e));

(In the formula, a plurality of R 9 s may be the same or different and each represents an alkyl group having 1 to 3 carbon atoms or an aryl group having 6 to 10 carbon atoms, and g represents an average value of 2 to 2000. Show).
A curable resin composition comprising the epoxy group-containing polyorganosiloxane according to any one of claims 1 to 4 and an epoxy resin curing agent.
The curable resin composition according to claim 7, wherein the epoxy resin curing agent is a polyvalent carboxylic acid compound.
The polyvalent carboxylic acid compound has a carbinol-modified silicone oil (d) at both terminals, a polyhydric alcohol compound (e) having two or more hydroxyl groups in the molecule, and one carboxylic anhydride group in the molecule. The curable resin composition according to claim 8, which is a polyvalent carboxylic acid resin which is an addition polymer containing the compound (f) as a polymerization unit.
The curable resin composition according to any one of claims 7 to 9, further comprising a curing accelerator.
The curable resin composition according to claim 10, wherein the curing accelerator is a metal soap curing accelerator.
The curable resin composition according to any one of claims 7 to 11, which is used for optical semiconductor sealing.
A cured product obtained by curing the curable resin composition according to any one of claims 7 to 12.
An optical semiconductor comprising the cured product according to claim 13.