JP5160487B2 - Optical lens - Google Patents

Description

  The present invention relates to an optical lens obtained by curing a modified resin composition obtained by cohydrolyzing and condensing an epoxy resin and an alkoxysilane compound.

In recent years, the market related to electronic materials has expanded rapidly. Accordingly, various camera lenses such as digital cameras and video cameras, “pick-up lenses such as CD, DVD, MO, Blu-ray disc”, LED lenses, mobile phones, etc. There is also an increasing demand for optical lenses, such as flash lenses for cameras, lenses for office automation equipment such as copiers and printers.
Conventionally, inorganic glass has been used for these optical lenses. However, for example, a final product on which these optical lenses are mounted, such as a notebook computer, a digital camera, and a mobile phone, is becoming lighter and lower in price. Therefore, a resin optical lens is required.
Epoxy resins and silicone resins are known as resin-made optical lenses. However, epoxy resins are inferior in light resistance and severe yellowing due to long-term use, which does not satisfy market needs. Moreover, although silicone resin is also examined, although silicone resin is excellent in light resistance, since it is very expensive compared with epoxy resin and inorganic glass, it has a problem in practical use ( Patent Literatures 1 to 3).

JP-A-10-158400 JP 2000-17176 A JP 2000-23002 A

However, with the rapid advancement of the market of electronic materials in recent years, it has been required to develop optical lenses that are excellent in light resistance and inexpensive, and the above-described conventional optical lenses are still in performance and price. There are many points to be improved.
In view of the above circumstances, an object of the present invention is to provide an optical lens that is excellent in light resistance and inexpensive.

  As a result of diligent research on the above problems, the present inventors use a resin composition obtained by cohydrolyzing and condensing an epoxy resin and a specific alkoxysilane compound as a material, thereby improving light resistance. The present invention has been completed by finding that an excellent and inexpensive optical lens can be provided.

That is, the present invention is as follows.
[1]
(A) an epoxy resin;
An alkoxysilane compound represented by the following general formula (1):
A resin composition obtained by cohydrolyzing and condensing

(In the formula (1), n = 0 to 3, and R ¹ represents a hydrogen atom or an organic group. The plurality of R ² may be the same or different, and may be a hydrogen atom or a carbon number of 1 to 8. Represents an alkyl group of
The alkoxysilane compound is
(B) n = 1-2, and as R ¹ , at least one alkoxysilane compound having at least one cyclic ether group;
(C) n = 1-2, and as R ¹ , at least one alkoxysilane compound having at least one aryl group;
A blending index α of (B) and (C) represented by the following formula (2) is 0.001 to 19, and a resin composition:
Mixing index α = (αc) / (αb) (2)
(In formula (2), αb: content (mol%) of component (B), αc: content (mol%) of component (C))
A curing agent;
An optical lens obtained by curing a curing accelerator.
[2]
As the alkoxysilane compound,
(D) The optical lens according to [1], further including at least one alkoxysilane compound in which n = 0 in the general formula (1).
[3]
The optical lens according to [1] or [2] above, wherein a mixing index β of the alkoxysilane compound represented by the following formula (3) is 0.01 to 1.4;
Mixing index β = {(β ⁿ² ) / (β ⁿ⁰ + β ⁿ¹ )} (3)
(In formula (3),
β ⁿ² : content (mol%) of the alkoxysilane compound in which n = 2 in the general formula (1),
β ⁿ⁰ : the content (mol%) of the alkoxysilane compound in which n = 0 in the general formula (1),
β ⁿ¹ : content (mol%) of the alkoxysilane compound in which n = 1 in the general formula (1),
Here, 0 ≦ {(β ⁿ⁰ ) / (β ⁿ⁰ + β ⁿ¹ + β ⁿ² )} ≦ 0.1).
[4]
The optical system according to any one of [1] to [3], wherein a mixing index γ of the (A) epoxy resin and the alkoxysilane compound represented by the following formula (4) is 0.02 to 15. Lens;
Mixing index γ = (γa) / (γs) (4)
(In formula (4),
γa: mass of epoxy resin (g),
γs: mass (g) of alkoxysilane compound in which n = 0 to 2 in the general formula (1)

  According to the present invention, it is possible to obtain an optical lens that is excellent in light resistance and inexpensive.

  Hereinafter, a mode for carrying out the present invention (hereinafter referred to as “the present embodiment”) will be described in detail. The present invention is not limited to the following embodiment, and can be implemented with various modifications within the scope of the gist.

The optical lens of this embodiment is
(A) an epoxy resin;
An alkoxysilane compound represented by the following general formula (1):
A resin composition obtained by cohydrolyzing and condensing

(In the formula (1), n = 0 to 3, and R ¹ represents a hydrogen atom or an organic group. The plurality of R ² may be the same or different, and may be a hydrogen atom or a carbon number of 1 to 8. Represents an alkyl group of
The alkoxysilane compound is
(B) n = 1-2, and as R ¹ , at least one alkoxysilane compound having at least one cyclic ether group;
(C) n = 1-2, and as R ¹ , at least one alkoxysilane compound having at least one aryl group;
A blending index α of (B) and (C) represented by the following formula (2) is 0.001 to 19, and a resin composition:
Mixing index α = (αc) / (αb) (2)
(In formula (2), αb: content (mol%) of component (B), αc: content (mol%) of component (C))
A curing agent;
An optical lens obtained by curing a curing accelerator.

(Resin composition)
The resin composition of the present embodiment is
(A) an epoxy resin;
An alkoxysilane compound represented by the general formula (1),
A resin composition obtained by cohydrolyzing and condensing
The alkoxysilane compound represented by the general formula (1) is (B) at least one alkoxysilane compound having n = 1 to 2 and having at least one cyclic ether group as R ¹ , and (C) n = 1 to 2 and R ¹ having at least one aryl group and at least one alkoxysilane compound, and represented by the above formula (2) (B) and (C) The mixing index α is 0.001 to 19.

  The present inventors use a resin composition obtained by cohydrolytic condensation of an epoxy resin and a specific alkoxysilane compound as a material, so that an optical lens having excellent light resistance and low cost can be obtained. It was found that it can be obtained.

((A) Epoxy resin)
The (A) epoxy resin in the present embodiment refers to a compound having an oxirane ring, usually two or more oxirane rings in the molecule, excluding an alkoxysilane compound and a condensate thereof described later, and satisfying the above requirements. If it is, it will not specifically limit. These may be used alone or in combination.

  The epoxy equivalent (WPE) of the epoxy resin is preferably 100 to 600 g / eq, more preferably 100 to 500 g / eq, and still more preferably 100 to 300 g / eq. Depending on the composition balance with the alkoxysilane compound represented by the general formula (1), when the epoxy equivalent (WPE) is less than 100 g / eq, the storage stability of the resin composition may be lowered, and 600 g / eq. If it exceeds 1, there is a risk of cracks occurring in the optical lens obtained by curing the resin composition.

  The epoxy resin is preferably a liquid having a viscosity at 25 ° C. of 1000 Pa · s or less, more preferably 500 Pa · s or less, and still more preferably 100 Pa · s or less. When the viscosity at 25 ° C. exceeds 1000 Pa · s, the fluidity as a liquid is lost, and the compatibility with the alkoxysilane compound described later tends to deteriorate. In addition, when the viscosity at 25 ° C. is more than 500 Pa · s and 1000 Pa · s or less (500 Pa · s <viscosity ≦ 1000 Pa · s), it can be used by adjusting the temperature at the time of production, selecting a solvent, etc. Since manufacturing conditions tend to be somewhat limited, it is preferably 500 Pa · s or less.

  The type of epoxy resin is not particularly limited, and specific examples include alicyclic epoxy resins, aliphatic epoxy resins, polyfunctional epoxy resins that are glycidyl ethers of polyphenol compounds, and glycidyl ethers of various novolac resins. Polyfunctional epoxy resin, aromatic epoxy resin nuclear hydride, aliphatic epoxy resin, heterocyclic epoxy resin, glycidyl ester epoxy resin, glycidylamine epoxy resin, epoxy glycidylated from halogenated phenols Examples thereof include resins. Among them, alicyclic epoxy resins and aliphatic epoxy resins are preferred because they are readily available and optical lenses obtained by curing the resin composition tend to have good physical properties. A formula epoxy resin is more preferable. These epoxy resins may be used alone or in combination.

(Polyfunctional epoxy resin)
The polyfunctional epoxy resin which is a glycidyl etherified product of a polyphenol compound is not particularly limited, and specifically, bisphenol A, bisphenol F, bisphenol S, 4,4′-biphenol, tetramethylbisphenol A, dimethyl Bisphenol A, tetramethyl bisphenol F, dimethyl bisphenol F, tetramethyl bisphenol S, dimethyl bisphenol S, tetramethyl-4,4′-biphenol, dimethyl-4,4′-biphenylphenol, 1- (4-hydroxyphenyl)- 2- [4- (1,1-bis- (4-hydroxyphenyl) ethyl) phenyl] propane, 2,2′-methylene-bis (4-methyl-6-tert-butylphenol), 4,4′-butylidene -Bis (3-methyl-6-tert-butyl) Ruphenol), trishydroxyphenylmethane, resorcinol, hydroquinone, 2,6-di (t-butyl) hydroquinone, pyrogallol, phenols having a diisopropylidene skeleton, 1,1-di (4-hydroxyphenyl) fluorene, etc. Examples thereof include phenols having a fluorene skeleton, polyfunctional epoxy resins which are glycidyl etherified products of polyphenol compounds of phenolized polybutadiene. Among the above, many of the types that are excellent in transparency and fluidity are commercially available and can be obtained at low cost, and tend to be excellent in crack resistance of an optical lens obtained by curing a resin composition. A polyfunctional epoxy resin that is a glycidyl etherified product of a phenol having a bisphenol A skeleton is preferred. A typical example of a polyfunctional epoxy resin which is a glycidyl etherified product of phenols having a bisphenol skeleton is shown below.

  When a polyfunctional epoxy resin that is a glycidyl etherified product of a polyphenol compound is used as the epoxy resin, these repeating units (n in the chemical formula showing the above representative examples) are not particularly limited, but preferably Is less than 50, more preferably 0.001 to 10, and still more preferably 0.01 to 2. When the repeating unit is less than 0.001, the reactivity with the alkoxysilane compound may be deteriorated, and when it exceeds 50, the fluidity is lowered, which may cause a practical problem. From the viewpoint of the balance between the above-described reactivity and fluidity, the repeating unit is particularly preferably from 0.01 to 2.

(Alicyclic epoxy resin)
The alicyclic epoxy resin is not particularly limited as long as it is an epoxy resin having an alicyclic epoxy group, and examples thereof include an epoxy resin having a cyclohexene oxide group, a tricyclodecene oxide group, a cyclopentene oxide group, and the like. Can be mentioned.

  Specific examples of the alicyclic epoxy resin include monofunctional alicyclic epoxy compounds such as 4-vinylepoxycyclohexane, dioctyl epoxyhexahydrophthalate, di-2-ethylhexyl epoxyhexahydrophthalate, and ETHB. Examples of the bifunctional alicyclic epoxy compound include 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxycyclohexyloctyl-3,4-epoxycyclohexanecarboxylate, 2- (3,4 -Epoxycyclohexyl-5,5-spiro-3,4-epoxy) cyclohexane-meta-dioxane, bis (3,4-epoxycyclohexylmethyl) adipate, vinylcyclohexene dioxide, bis (3,4-epoxy-6-methyl) (Cyclohexylmethyl) adipate, 3,4-epoxy-6-methylcyclohexyl-3,4-epoxy-6-methylcyclohexanecarboxylate, methylenebis (3,4-epoxycyclohexane), dicyclopentadiene diepoxide, ethyl Glycol di (3,4-epoxycyclohexylmethyl) ether, ethylenebis (3,4-epoxycyclohexane carboxylate), 1,2,8,9- diepoxylimonene, and the like. Examples of the polyfunctional alicyclic epoxy compound include 1,2-epoxy-4- (2-oxiranyl) cyclohexene adduct of 2,2-bis (hydroxymethyl) -1-butanol. In addition, as the polyfunctional alicyclic epoxy compound, epoxidized butanetetracarboxylic acid tetrakis- (3-cyclohexenylmethyl) modified ε-caprolactone or the like can also be used. Typical examples of the alicyclic epoxy resin are shown below.

(Aliphatic epoxy resin)
The aliphatic epoxy resin is not particularly limited, and specifically, 1,4-butanediol, 1,6-hexanediol, polyethylene glycol, polypropylene glycol, pentaerythritol, xylylene glycol derivatives, etc. Examples thereof include glycidyl ethers of polyhydric alcohols. Typical examples of the aliphatic epoxy resin are shown below.

(Polyfunctional epoxy resin that is glycidyl etherified product of novolak resin)
The polyfunctional epoxy resin that is a glycidyl etherified product of novolak resin is not particularly limited, and examples thereof include phenol, cresols, ethylphenols, butylphenols, octylphenols, bisphenol A, bisphenol F, bisphenol S, and naphthol. Glycidyl etherification products of various novolac resins such as novolak resins made from various phenols such as phenols, xylylene skeleton-containing phenol novolak resins, dicyclopentadiene skeleton-containing phenol novolak resins, biphenyl skeleton-containing phenol novolak resins, and fluorene skeleton-containing phenol novolak resins. Etc. A typical example of a polyfunctional epoxy resin which is a glycidyl etherified product of a novolak resin is shown below.

(Nuclear hydride of aromatic epoxy resin)
The nuclear hydride of the aromatic epoxy resin is not particularly limited, and examples thereof include glycidyl etherified products of phenol compounds (bisphenol A, bisphenol F, bisphenol S, 4,4′-biphenol, etc.) or various phenols (phenols). , Cresols, ethylphenols, butylphenols, octylphenols, bisphenol A, bisphenol F, bisphenol S, naphthols, etc.) and hydrides of glycidyl ethers of novolac resins. Can be mentioned.

(Heterocyclic epoxy resin)
The heterocyclic epoxy resin is not particularly limited, and examples thereof include heterocyclic epoxy resins having a heterocyclic ring such as an isocyanuric ring and a hydantoin ring.

(Glycidyl ester epoxy resin)
The glycidyl ester-based epoxy resin is not particularly limited, and examples thereof include epoxy resins composed of carboxylic acids such as hexahydrophthalic acid diglycidyl ester and tetrahydrophthalic acid diglycidyl ester.

(Glycidylamine epoxy resin)
The glycidylamine epoxy resin is not particularly limited. For example, an epoxy resin obtained by glycidylating amines such as aniline, toluidine, p-phenylenediamine, m-phenylenediamine, diaminodiphenylmethane derivative, and diaminomethylbenzene derivative. Etc.

(Epoxy resin obtained by glycidylation of halogenated phenols)
Epoxy resins obtained by glycidylation of halogenated phenols are not particularly limited. For example, brominated bisphenol A, brominated bisphenol F, brominated bisphenol S, brominated phenol novolac, brominated cresol novolac, chlorinated Examples thereof include epoxy resins obtained by glycidyl etherification of halogenated phenols such as bisphenol S and chlorinated bisphenol A.

  A polyol can be used in combination with the epoxy resin described above. The polyol is not particularly limited as long as it is a compound having two or more hydroxyl groups in the molecule. For example, ethylene glycol, diethylene glycol, propylene glycol, trimethylene glycol, 1,2-hexanediol, 1,6- Examples include hexanediol.

(Alkoxysilane compound)
The alkoxysilane compound in this embodiment shows the silicon compound which has 1-4 alkoxyl groups, and is represented by following General formula (1).

In formula (1), n = 0 to 3, and R ¹ represents a hydrogen atom or an organic group. Moreover, several R < ² > is the same or different and shows a hydrogen atom or a C1-C8 alkyl group.

R ¹ in the general formula (1) represents a hydrogen atom or an organic group and is not particularly limited. Examples of the organic group include an organic group having a cyclic ether group and an organic group having an aryl group, which will be described later. Examples include an organic group having an alkyl group, a vinyl group, a methacryl group, a mercapto group, and an isocyanate group, and among them, an alkyl group is preferable.

  Here, examples of the alkyl group include a methyl group, an ethyl group, an n-propyl group, an i-propyl group, a butyl group (n-butyl, i-butyl, t-butyl, sec-butyl), and a pentyl group (n -Pentyl, i-pentyl, neopentyl, etc.), hexyl group (n-hexyl, i-hexyl, etc.), heptyl (n-heptyl, i-heptyl, etc.), octyl group (n-octyl, i-octyl, t-octyl) Etc.), nonyl (n-nonyl, i-nonyl etc.), decyl group (n-decyl, i-decyl etc.), dodecyl group (n-dodecyl, i-dodecyl etc.), and these are linear or Any of a branched alkyl group may be used.

  Among these, an alkyl group having 10 or less carbon atoms is preferable, and a methyl group, ethyl group, n-propyl group, n-butyl group, n-pentyl group, and n-hexyl group are more preferable. In addition, hydrogen atoms or a part or all of the main chain skeleton of these alkyl groups are ether groups, ester groups, carbonyl groups, siloxane groups, halogen atoms such as fluorine, methacryl groups, acrylic groups, mercapto groups, amino groups, It may be substituted with at least one group selected from the group consisting of hydroxyl groups.

Moreover, several R < ² > in the above-mentioned general formula (1) is the same or different, respectively, and shows a hydrogen atom or a C1-C8 alkyl group. R ² is not particularly limited as long as it satisfies the above requirements, but is preferably a methyl group or an ethyl group.

((B) component)
The component (B) of the alkoxysilane compound represented by the general formula (1) is n = 1 to 2 in the general formula (1), and R ¹ has at least one cyclic ether group. This is an alkoxysilane compound.

  The cyclic ether group refers to an organic group having an ether in which carbon of a cyclic hydrocarbon is substituted with oxygen, and usually means a cyclic ether group having a 3- to 6-membered ring structure. Among them, a 3-membered or 4-membered cyclic ether group having a large ring strain energy and high reactivity is preferable, and a 3-membered ether group is particularly preferable.

  Specific examples of the cyclic ether group include, for example, a glycidoxyalkyl group having oxyglycidyl groups having 4 or less carbon atoms such as β-glycidoxyethyl, γ-glycidoxypropyl, γ-glycidoxybutyl, and the like, glycidyl Group, β- (3,4-epoxycyclohexyl) ethyl group, γ- (3,4-epoxycyclohexyl) propyl group, β- (3,4-epoxycycloheptyl) ethyl group, β- (3,4 epoxyepoxycyclohexyl) ) Alkyl substituted with a cycloalkyl group having 5 to 8 carbon atoms having an oxirane group such as propyl group, β- (3,4-epoxycyclohexyl) butyl group, β- (3,4-epoxycyclohexyl) pentyl group Groups and the like.

  Among the above, glycidoxy in which an oxyglycidyl group is bonded to a C1-C3 alkyl group such as β-glycidoxyethyl group, γ-glycidoxypropyl group, β- (3,4-epoxycyclohexyl) ethyl group, etc. An alkyl group having 3 or less carbon atoms substituted with a C5-C8 cycloalkyl group having an alkyl group or an oxirane group is preferred.

  Specific examples of the component (B) include, for example, 3-glycidoxypropyl (methyl) dimethoxysilane, 3-glycidoxypropyl (methyl) diethoxysilane, 3-glycidoxypropyl (methyl) dibutoxysilane, 2- (3,4-epoxycyclohexyl) ethyl (methyl) dimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyl (phenyl) diethoxysilane, 2,3-epoxypropyl (methyl) dimethoxysilane, 2,3 -Epoxypropyl (phenyl) dimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropyltributoxysilane, 2- (3,4-epoxycyclohexyl) ethyl Trimethoxysilane, 2- (3,4-epoxy Hexyl) ethyl triethoxysilane, 2,3-epoxypropyl trimethoxysilane, 2,3-epoxy propyl triethoxy silane, and the like. These may be used alone or in combination.

((C) component)
The component (C) of the alkoxysilane compound represented by the general formula (1) is at least one kind in which n = 1 to 2 and at least one aryl group as R ¹ in the general formula (1). It is an alkoxysilane compound.

  An aryl group refers to a functional group or substituent derived from an aromatic hydrocarbon (simple aromatic ring or polycyclic aromatic hydrocarbon). The aryl group is not particularly limited as long as it matches this, but in consideration of steric hindrance in the higher order structure, a phenyl group, a benzyl group, and the like are preferable.

  Specific examples of the component (C) include, for example, dimethoxymethylphenylsilane, diethoxymethylphenylsilane, phenyltriethoxysilane, trimethoxy [3- (phenylamino) propyl] silane, dimethoxydiphenylsilane, diphenyldiethoxysilane, phenyl Examples include trimethoxysilane and N-phenyl-3-aminopropyltrimethoxysilane. These may be used alone or in combination.

“(B) at least one alkoxysilane compound having general formula (1) where n = 1 to 2 and R ¹ having at least one cyclic ether group”, and “(C) general formula In (1), n = 1 to 2 and R ¹ has at least one aryl group, and the mixing ratio of “at least one alkoxysilane compound” is a mixing index calculated by the following formula (2): It is represented by α.
Mixing index α = (αc) / (αb) (2)
(In the formula (2), αb: mol% of the component (B), αc: mol% of the component (C).)

  In the present embodiment, it is important that the mixing index α is in the range of 0.001 to 19. When the mixing index α is less than 0.001, the fluidity and storage stability of the resin composition are reduced, and when it exceeds 19, the light resistance of an optical lens obtained by curing the resin composition is deteriorated. There is. In particular, when a final product equipped with an optical lens is used for a long period of time, higher light resistance is required. Therefore, the mixing index α is preferably 0.2 to 5, more preferably 0.3 to 2. It is.

((D) component)
In the resin composition in the present embodiment, in addition to the components (A) to (C) described above, as the component (D), n = 0 indicating the number of R ¹ in the general formula (1), that is, (OR ² ) An alkoxysilane compound having 4 may be further cohydrolyzed and condensed.

  Examples of the component (D) include tetramethoxysilane and tetraethoxysilane. These may be used alone or in combination.

(Other alkoxysilane compounds)
The resin composition in this embodiment may further cohydrolyze and condense the alkoxysilane compound represented by the general formula (1) other than the components (B) to (D) described above. Examples of such compounds include dimethyldimethoxysilane, dimethylethoxysilane, hydroxymethyltrimethylsilane, methoxytrimethylsilane, methyltrimethoxysilane, mercaptomethyltrimethoxysilane, methoxydimethylvinylsilane, trimethoxyvinylsilane, bis (2-chloro Ethoxy) methylsilane, ethoxytrimethylsilane, diethoxymethylsilane, ethyltriethoxysilane, dimethoxymethyl-3,3,3-trifluoropropylsilane, ethoxydimethylvinylsilane, 3-chloropropyldimethoxymethylsilane, chloromethyldiethoxymethylsilane , Methyltris (ethylmethylketoxime) silane, trimethylpropoxysilane, trimethoxyisopropoxysilane, diethoxydi Tilsilane, 3- [dimethoxy (methyl) silyl] propane-1-thiol, trimethoxy (propyl) silane, (3-mercaptopropyl) trimethoxysilane, 3-aminopropyltrimethoxysilane, diethoxymethylvinylsilane, butoxytrimethylsilane, Butyltrimethoxysilane, methyltriethoxysilane, methoxyltriethoxysilane, triethoxyvinylsilane, diethoxydiethylsilane, dimethoxyldipropoxysilane, ethyltriethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane Allyltriethoxysilane, 3-bromopropyltriethoxysilane, 3-allylaminopropyltrimethoxysilane, hexyloxytrimethylsilane, propyltriethoxysilane, Xyltriethoxysilane, 3-aminopropyltriethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3- (triethoxysilyl) propyl isocyanate, 3-ureidopropyltriethoxysilane, Methoxytripropylsilane, dibutoxydimethylsilane, methyltripropoxysilane, methyltriisopropoxysilane, octyloxytrimethylsilane, pentyltriethoxysilane, 3- (2-aminoethylamino) propyltriethoxysilane, hexyltriethoxysilane, Examples include 3-methacryloxypropyltriethoxysilane, octyltriethoxysilane, dodecyloxytrimethylsilane, and diethoxydodecylmethylsilane.

In this embodiment, the mixing ratio of the “alkoxysilane compound where n = 2”, “alkoxysilane compound where n = 1” and “alkoxysilane compound where n = 0” of the alkoxysilane compound is expressed by the following formula ( It is represented by the mixture index β calculated in 3).
Mixing index β = {(β ⁿ² ) / (β ⁿ⁰ + β ⁿ¹ )} (3)
(In formula (3),
β ⁿ² : content (mol%) of the alkoxysilane compound in which n = 2 in the general formula (1),
β ⁿ⁰ : the content (mol%) of the alkoxysilane compound in which n = 0 in the general formula (1),
β ⁿ¹ : content (mol%) of an alkoxysilane compound in which n = 1 in the general formula (1),
And 0 ≦ {(β ⁿ⁰ ) / (β ⁿ⁰ + β ⁿ¹ + β ⁿ² )} ≦ 0.1. )

  In the resin composition of the present embodiment, the mixing index β is preferably 0.01 to 1.4, more preferably 0.03 to 1.2, and still more preferably 0.05 to 1.0. Depending on the composition, if the mixing index β is less than 0.01, the fluidity of the resin composition may be deteriorated. If it exceeds 1.4, the resin composition will be normal when producing an optical lens. May not cure.

The mixing ratio of the (A) epoxy resin and the alkoxysilane compound “alkoxysilane compound where n = 0 to 2” in the present embodiment is represented by a mixing index γ calculated by the following formula (4).
Mixing index γ = (γa) / (γs) (4)
(In formula (4),
γa: mass of epoxy resin (g),
γs: mass (g) of the alkoxysilane compound in which n = 0 to 2 in the general formula (1). )

  In the resin composition of the present embodiment, the mixing index γ is preferably 0.02 to 15, more preferably 0.04 to 7, and still more preferably 0.08 to 5. Depending on the composition, if the mixing index γ is less than 0.02, the resin composition may not be cured normally when an optical lens is produced, and if it exceeds 15, the light resistance may be deteriorated.

(Cohydrolytic condensation)
In this embodiment, the resin composition can be obtained by cohydrolyzing and condensing the above-described (A) epoxy resin and the alkoxysilane compound represented by the formula (1).

  The “cohydrolytic condensation” in the present embodiment means a hydrolysis condensation reaction performed in the presence of an epoxy resin, and is clearly distinguished from a reaction in the absence of an epoxy resin. The “cohydrolytic condensation” in the present embodiment is composed of at least two steps of a reflux step without dehydration and a subsequent dehydration condensation step.

  The above-mentioned “refluxing process without dehydration” means that the reaction is carried out while returning the water and solvent blended for cohydrolysis and the water and solvent derived from the alkoxysilane compound generated during the reaction to the reaction solution. It is a process. Although the method is not particularly limited, the reaction is usually carried out by attaching a cooling pipe to the upper part of the reaction vessel and refluxing the generated water or solvent.

  The above-mentioned “dehydration condensation step” is a step in which the condensation reaction is performed while removing the blended water and solvent and the water and solvent generated in the above “refluxing step without dehydration”. The method is not particularly limited, but usually the reaction is carried out by distillation under reduced pressure using a rotary evaporator or the like.

  The heating temperature during the cohydrolysis condensation reaction is preferably 130 ° C. or lower, more preferably 0 to 120 ° C., and still more preferably 0 to 100 ° C. If it exceeds 130 ° C., the resin composition may be altered depending on the composition. The reaction time for cohydrolytic condensation is preferably 0.5 to 24 hours, more preferably 1 to 12 hours. If it is less than 0.5 hour, the remaining amount of unreacted substances may increase depending on the composition.

  The resin composition of this embodiment may be performed by adding a hydrolysis-condensation catalyst during the co-hydrolysis condensation of the above-described (A) epoxy resin and alkoxysilane compound. The hydrolysis condensation catalyst is not particularly limited as long as it promotes a conventionally known hydrolysis condensation reaction. For example, a metal (lithium, sodium, potassium, rubidium, cesium, magnesium, calcium, barium, Strontium, zinc, aluminum, titanium, cobalt, germanium, tin, lead, antimony, arsenic, cerium, boron, cadmium, manganese, bismuth, etc., organic metals (lithium, sodium, potassium, rubidium, cesium, magnesium, calcium, barium) Strontium, zinc, aluminum, titanium, cobalt, germanium, tin, lead, antimony, arsenic, cerium, boron, cadmium, manganese, bismuth and other organic oxides, organic acid salts, organic halides, alkoxides, etc.), inorganic bases Magnesium hydroxide, calcium hydroxide, strontium hydroxide, barium hydroxide, sodium hydroxide, potassium hydroxide, lithium hydroxide, cesium hydroxide, sodium carbonate, potassium carbonate, sodium bicarbonate, potassium bicarbonate, etc.), organic base (Ammonia, tetramethylammonium hydroxide, etc.).

  Among the above organic metals, organic tin is preferable. Organotin refers to those in which at least one organic group is bonded to a tin atom, and examples of the structure include monoorganotin, diorganotin, triorganotin, tetraorganotin, etc. Among them, Diorganotin is preferred.

  Examples of the organic tin include tin tetrachloride, monobutyltin trichloride, monobutyltin oxide, monooctyltin trichloride, tetra n-octyltin, tetra n-butyltin, dibutyltin oxide, dibutyltin diacetate, dibutyltin dioctate, dibutyl Tin diversate, dibutyltin dilaurate, dibutyltin oxylaurate, dibutyltin stearate, dibutyltin dioleate, dibutyltin / silicon ethyl reactant, dibutyltin salt and silicate compound, dioctyltin salt and silicate compound, dibutyltin bis ( Acetylacetonate), dibutyltin bis (ethyl malate), dibutyltin bis (butylmalate), dibutyltin bis (2-ethylhexylmalate), dibutyltin bis (benzylmalate), dibutyltin bis Allyl malate), dibutyltin bis (oleylmalate), dibutyltin malate, dibutyltin bis (O-phenylphenoxide), dibutyltin bis (2-ethylhexylmercaptoacetate), dibutyltin bis (2-ethylhexylmercaptopropionate) Dibutyltin bis (isononyl 3-mercaptopropionate), dibutyltin bis (isooctylthioglycolate), dibutyltin bis (3-mercaptopropionate), dioctyltin oxide, dioctyltin dilaurate, dioctyltin diacetate, Dioctyltin dioctate, dioctyltin didodecyl mercapto, dioctyltin versatate, dioctyltin distearate, dioctyltin bis (ethyl malate), dioctyltin bis (octylmalate), dioctyl Rutin malate, dioctyltin bis (isooctylthioglycolate), dioctyltin bis (2-ethylhexyl mercaptoacetate), dibutyltin dimethoxide, dibutyltin diethoxide, dibutyltin dibutoxide, dioctyltin dimethoxide, dioctyltin diethoxide, dioctyltin dibutoxide, Examples include tin octylate and tin stearate. Among these, dibutyltin diacetate, dibutyltin dilaurate, dioctyltin dilaurate, dioctyltin diacetate, dibutyltin dimethoxide, dibutyltin diethoxide, dibutyltin dibutoxide, dioctyltin dimethoxide, dioctyltin diethoxide, dioctyltin dibutoxide are preferred.

  These hydrolytic condensation catalysts may be used alone or in combination. For example, organic acid tin and alkaline organic tin can be used in combination, or after reacting with an organic acid salt such as tin, treatment with an inorganic base is also possible. In this case, the inorganic base is preferably a hydroxide of a polyvalent cation such as magnesium hydroxide, calcium hydroxide, strontium hydroxide or barium hydroxide.

The addition amount of the hydrolysis-condensation catalyst is not particularly limited, but the preferable addition amount can be obtained from the mixing index δ which is a ratio to (OR ² ) in the above general formula (1). Here, the mixing index δ is expressed by the following formula (5).
Mixing index δ = (δe) / (δs) (5)
(In Formula (5),
δe: addition amount of hydrolytic condensation catalyst (mol number),
δs: the amount (mol number) of (OR ² ) in the general formula (1). )

  The mixing index δ is preferably 0.0005 to 5, more preferably 0.001 to 1, and still more preferably 0.005 to 0.5. Depending on the composition of the resin composition, if the mixing index δ is less than 0.0005, the effect of promoting hydrolysis condensation may be difficult to obtain. If it exceeds 5, the ring opening of the cyclic ether group may be promoted. The storage stability of the resin composition may be reduced.

In the step of obtaining the resin composition of the present embodiment by cohydrolysis condensation, the amount of water added is not particularly limited, but the preferred amount added is the ratio to (OR ² ) in the above general formula (1). Can be obtained from the mixing index ε. Here, the mixing index ε is expressed by the following formula (6).
Mixing index ε = (εw) / (εs) (6)
(In Formula (6),
εw: amount of water added (in mol),
εs: the amount (mol number) of (OR ² ) in the general formula (1). )

  The mixing index ε is preferably 0.1 to 5, more preferably 0.2 to 3, and still more preferably 0.3 to 1.5. Depending on the composition of the resin composition, if the mixing index ε is less than 0.1, the hydrolysis reaction may not proceed. If it exceeds 5, the storage stability of the resin composition may be reduced.

  The addition of water in the co-hydrolysis condensation described above is mainly performed by hydrolysis of the alkoxysilane compound, and therefore needs to be performed in the “refluxing process without dehydration”. The timing of the addition is not particularly limited, and may be added first or gradually during the reaction using a feed pump or the like.

  The cohydrolysis condensation reaction of the present embodiment can be performed without a solvent or in a solvent. The solvent is not particularly limited as long as it is an organic solvent that can dissolve an epoxy resin and an alkoxysilane compound and is inactive to these, and for example, an aprotic polar solvent such as tetrahydrofuran or dioxane is preferably used. Can be used. Moreover, since it is easy to obtain, alcohol solvents such as methanol, ethanol, butanol, isopropanol, and n-butanol can be used. However, these promote the ring opening of the epoxy group. May not be suitable for use.

  The amount of the solvent added is preferably 0.01 to 20 times, more preferably 0.02 to 15 times, and more preferably 0.02 to 15 times the total mass of the epoxy resin and alkoxysilane compound subjected to the cohydrolysis condensation reaction. The amount is preferably 0.03 to 10 times. Since the molecular weight of the resin composition can be controlled by adjusting the addition amount of the solvent, it is possible to obtain a resin composition having an appropriate molecular weight and thus an appropriate viscosity by setting the range of the addition amount described above. it can.

  The optical lens of this embodiment is obtained by curing the resin composition described above, (F) a curing agent, and (G) a curing accelerator. (F) The curing agent and (G) the curing accelerator will be described below.

(Curing agent)
A hardening | curing agent is a substance used in order to harden a resin composition, and is not specifically limited. As the curing agent, for example, acid anhydride compounds, amine compounds, amide compounds, phenol compounds and the like can be used, and in particular, aromatic acid anhydrides, cyclic aliphatic acid anhydrides, aliphatic acid anhydrides, and the like. An acid anhydride compound is preferred, and a carboxylic acid anhydride is more preferred.

  The acid anhydride compounds include alicyclic acid anhydrides, and alicyclic carboxylic acid anhydrides are preferred among carboxylic acid anhydrides. These curing agents may be used alone or in combination of two or more.

  Specific examples of the curing agent include phthalic anhydride, succinic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methyl nadic anhydride, hexahydrophthalic anhydride. , Methylhexahydrophthalic anhydride, diaminodiphenylmethane, diethylenetriamine, triethylenetetramine, diaminodiphenylsulfone, isophoronediamine, dicyandiamide, tetraethylenepentamine, dimethylbenzylamine, ketimine compound, linolenic acid dimer and ethylenediamine Polyamide resin, bisphenols, phenols (phenol, alkyl-substituted phenol, naphthol, alkyl-substituted naphthol, dihydroxybenzene, dihydroxynaphthalene, etc. Biphenols such as polycondensates of aldehydes with various aldehydes, polymers of phenols with various diene compounds, polycondensates of phenols with aromatic dimethylol, or condensates of bismethoxymethylbiphenyl with naphthols or phenols And modified products thereof, imidazole, boron trifluoride-amine complex, guanidine derivatives and the like.

  Specific examples of the alicyclic carboxylic acid anhydride include 1,2,3,6-tetrahydrophthalic anhydride, 3,4,5,6-tetrahydrophthalic anhydride, hexahydrophthalic anhydride, “4-methylhexahydro Phthalic anhydride / hexahydrophthalic anhydride = 70/30 ”, 4-methylhexahydrophthalic anhydride,“ methylbicyclo [2.2.1] heptane-2,3-dicarboxylic anhydride / bicyclo [2.2. 1] heptane-2,3-dicarboxylic anhydride "and the like.

The addition amount of the curing agent is obtained from the mixed index ζ which is a ratio to the cyclic ether group contained in the above-described epoxy resin and alkoxysilane compound.
The mixing index ζ is expressed by the following formula (7).
Mixing index ζ = (ζf) / (ζk) (7)
(In formula (7),
ζf: addition amount (number of moles) of curing agent,
ζk: The amount (mol number) of cyclic ether groups contained in the epoxy resin and the alkoxysilane compound. )

  The mixing index ζ is preferably 0.1 to 1.5, more preferably 0.2 to 1.3, and still more preferably 0.3 to 1.5. If the mixing index ζ is less than 0.1, the curing rate may decrease, and if it exceeds 1.5, the moisture resistance as a cured product may deteriorate.

(Curing accelerator)
A curing accelerator is a curing catalyst used for the purpose of promoting the curing reaction. As the curing accelerator, tertiary amines and salts thereof are preferable. Specific examples of the curing accelerator include those shown in the following (1) to (8).
(1) Tertiary amines: benzyldimethylamine, 2,4,6-tris (dimethylaminomethyl) phenol, cyclohexyldimethylamine, triethanolamine and the like.
(2) Imidazoles: 2-methylimidazole, 2-n-heptylimidazole, 2-n-undecylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1 -Benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 1- (2-cyanoethyl) -2-methylimidazole, 1- (2-cyanoethyl) -2-n-un Decylimidazole, 1- (2-cyanoethyl) -2-phenylimidazole, 1- (2-cyanoethyl) -2-ethyl-4-methylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl -4,5-di (hydroxymethyl) imidazole, 1- (2- Anoethyl) -2-phenyl-4,5-di [(2′-cyanoethoxy) methyl] imidazole, 1- (2-cyanoethyl) -2-n-undecylimidazolium trimellitate, 1- (2-cyanoethyl) ) -2-Phenylimidazolium trimellitate, 1- (2-cyanoethyl) -2-ethyl-4-methylimidazolium trimellitate, 2,4-diamino-6- [2′-methylimidazolyl- (1 ′) )] Ethyl-s-triazine, 2,4-diamino-6- (2'-n-undecylimidazolyl) ethyl-s-triazine, 2,4-diamino-6- [2'-ethyl-4'-methyl Imidazolyl- (1 ′)] ethyl-s-triazine, isocyanuric acid adduct of 2-methylimidazole, isocyanuric acid adduct of 2-phenylimidazole, 2,4-dia Roh-6- [2'-methylimidazolyl- - (1 &apos;)] isocyanuric acid adduct of ethyl -s- triazine.
(3) Organophosphorus compounds: diphenylphosphine, triphenylphosphine, triphenyl phosphite and the like.
(4) Quaternary phosphonium salts: benzyltriphenylphosphonium chloride, tetra-n-butylphosphonium bromide, methyltriphenylphosphonium bromide, ethyltriphenylphosphonium bromide, n-butyltriphenylphos Phonium bromide, tetraphenylphosphonium bromide, ethyltriphenylphosphonium iodide, ethyltriphenylphosphonium acetate, tetra-n-butylphosphonium o, o-diethylphosphorodithionate, tetra-n- Butylphosphonium benzotriazolate, tetra-n-butylphosphonium tetrafluoroborate, tetra-n-butylphosphonium tetraphenylborate, tetraphenylphenol Scan follower tetra Tsu tetraphenylborate and the like.
(5) Diazabicycloalkenes: 1,8-diazabicyclo [5.4.0] undecene-7 and organic acid salts thereof.
(6) Organometallic compounds: zinc octylate, tin actylate, aluminum acetylacetone complex, and the like.
(7) Quaternary ammonium salts: tetraethylammonium bromide, tetra-n-butylammonium bromide and the like.
(8) Metal halide compounds: Boron compounds such as boron trifluoride and triphenyl borate; zinc chloride, stannic chloride and the like.

The addition amount of a hardening accelerator is calculated | required from the following mixing parameter | index (eta) which is a ratio with respect to the mass of the above-mentioned epoxy resin and alkoxysilane compound. The mixing index η is represented by the following formula (8).
Mixing index η = (ηg) / (ηk) × 100 (8)
(In Formula (8),
ηg: mass (g) of curing accelerator,
ηk: mass (g) of epoxy resin and alkoxysilane compound. )

  The mixing index η is preferably 0.01 to 5, more preferably 0.05 to 3, and further preferably 0.1 to 1. If the mixing index η is less than 0.01, curing may not proceed well, and if it exceeds 5, the optical lens obtained by curing the resin composition may be colored.

  In the present embodiment, curing refers to obtaining a cured product (thermosetting) by applying heat to the above-described resin composition to cause a three-dimensional cross-linking bond between molecules. Thermal curing is a method of obtaining a cured product by causing a chemical reaction by heat and generating three-dimensional cross-linking between molecules. As the thermosetting method, a method of heat-treating a resin composition containing a curing agent or a curing accelerator is used.

(Additive for resin composition)
In the resin composition of the present embodiment, various organic resins, inorganic fillers, colorants, leveling agents, lubricants, surfactants, silicone compounds, reactivity, as long as their functions are not impaired. Diluents, non-reactive diluents, antioxidants, light stabilizers and the like can be added as appropriate. In addition, plasticizers, flame retardants, stabilizers, antistatic agents, impact strengthening agents, foaming agents, antibacterial / antifungal agents, conductive fillers, antifogging agents, and crosslinks that are generally used as additives for resins An agent or the like can be blended.

  The organic resin is not particularly limited, and examples thereof include an epoxy resin, an acrylic resin, a polyester resin, a polyimide resin, and a phenol resin. In particular, those having highly reactive organic groups such as epoxy resins are preferred.

  Examples of inorganic fillers include silicas (melted crushed silica, crystal crushed silica, spherical silica, fumed silica, colloidal silica, precipitated silica, etc.) silicon carbide, silicon nitride, boron nitride, calcium carbonate, magnesium carbonate, sulfuric acid Barium, calcium sulfate, mica, talc, clay, aluminum oxide, magnesium oxide, zirconium oxide, aluminum hydroxide, magnesium hydroxide, calcium silicate, aluminum silicate, lithium aluminum silicate, zirconium silicate, barium titanate, glass fiber, carbon fiber And molybdenum disulfide. In particular, silicas, calcium carbonate, aluminum oxide, aluminum hydroxide, calcium silicate and the like are preferable, and silicas are more preferable in consideration of physical properties of the cured product. These inorganic fillers may be used alone or in combination of two or more.

  The colorant is not particularly limited as long as it is a substance used for the purpose of coloring. For example, phthalocyanine, azo, disazo, quinacridone, anthraquinone, flavantron, perinone, perylene, dioxazine, condensed azo, azomethine series Inorganic pigments such as titanium oxide, lead sulfate, chromium yellow, zinc yellow, chromium vermillion, valve shell, cobalt purple, bitumen, ultramarine, carbon black, chromium green, chromium oxide, cobalt green, and the like. These colorants may be used alone or in combination of two or more.

  The leveling agent is not particularly limited, and examples thereof include oligomers having a molecular weight of 4000 to 12000 made of acrylates such as ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, epoxidized soybean fatty acid, epoxidized abiethyl alcohol, Examples include hydrogenated castor oil and titanium-based coupling agents. These leveling agents may be used alone or in combination of two or more.

  The lubricant is not particularly limited, and examples thereof include hydrocarbon lubricants such as paraffin wax, microwax, and polyethylene wax, and higher fatty acids such as lauric acid, myristic acid, palmitic acid, stearic acid, arachidic acid, and behenic acid. Lubricants, stearylamide, palmitylamide, oleylamide, higher fatty acid amide lubricants such as methylene bisstearamide, hardened castor oil, butyl stearate, ethylene glycol monostearate, pentaerythritol (mono- , Di-, tri-, or tetra-) stearate and other higher fatty acid ester lubricants, cetyl alcohol, stearyl alcohol, polyethylene glycol, polyglycerol and other alcohol lubricants, lauric acid, myristic acid, palmitic Natural waxes such as metal soaps such as magnesium, calcium, cadmium, barium, zinc, lead, etc., such as acid, stearic acid, arachidic acid, behenic acid, ricinoleic acid, naphthenic acid, carnauba wax, candelilla wax, beeswax, montan wax And the like. These lubricants may be used alone or in combination of two or more.

  The surfactant is an amphiphilic substance having a hydrophobic group having no affinity for the solvent in the molecule and an amphiphilic group (usually a hydrophilic group) having an affinity for the solvent. The type of the surfactant is not particularly limited, and examples thereof include silicone surfactants and fluorine surfactants. Surfactants may be used alone or in combination of two or more.

  The silicone compound is not particularly limited, and examples thereof include silicone resin, silicone condensate, silicone partial condensate, silicone oil, silane coupling agent, silicone oil, polysiloxane and the like. These may be modified by introducing organic groups into both ends, one end, or side chains. The modification method is not particularly limited. For example, amino modification, epoxy modification, alicyclic epoxy modification, carbinol modification, methacryl modification, polyether modification, mercapto modification, carboxyl modification, phenol modification, silanol modification, Examples include polyether modification, polyether / methoxy modification, and diol modification.

  The reactive diluent is not particularly limited. For example, alkyl glycidyl ether, alkylphenol monoglycidyl ether, neopentyl glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, alkanoic acid glycidyl ester, ethylene Examples include glycol diglycidyl ether and propylene glycol diglycidyl ether.

  The non-reactive diluent is not particularly limited, and examples thereof include high-boiling solvents such as benzyl alcohol, butyl diglycol, and propylene glycol monomethyl ether.

  The antioxidant is not particularly limited, and examples thereof include organic phosphorus antioxidants such as triphenyl phosphate and phenylisodecyl phosphite, and organic sulfurs such as distearyl-3,3′-thiodipropinate. Examples of the antioxidant include phenolic antioxidants such as 2,6-di-tert-butyl-p-cresol.

  The light stabilizer is not particularly limited, and examples thereof include benzotriazole-based, benzophenone-based, salicylate-based, cyanoacrylate-based, nickel-based, and triazine-based ultraviolet absorbers, hindered amine-based light stabilizers, and the like.

  Other substances may be further added to the resin composition and the optical lens of the present embodiment as long as the effects of the present invention are not impaired. Examples of such other substances include solvents, oils and fats, processed oils and fats, natural resins, synthetic resins, pigments, dyes, pigments, release agents, preservatives, adhesives, deodorizers, flocculants, cleaning agents, and deodorizers. Agent, pH adjuster, photosensitive material, ink, electrode, plating solution, catalyst, resin modifier, plasticizer, softener, agricultural chemical, insecticide, fungicide, pharmaceutical raw material, emulsifier / surfactant, rust inhibitor, Metal compounds, fillers, cosmetics / pharmaceutical raw materials, dehydrating agents, desiccants, antifreezes, adsorbents, colorants, rubber, foaming agents, colorants, abrasives, mold release agents, flocculants, antifoaming agents, curing agents, reducing agents Agent, flux agent, film treatment agent, casting raw material, mineral, acid / alkali, shot agent, antioxidant, surface coating agent, additive, oxidant, explosives, fuel, bleach, light emitting element, fragrance, concrete, Fiber (carbon fiber, aramid fiber, glass fiber, etc.), gas Scan, metal, excipients, disintegrants, binders, fluidizing agents, gelling agents, stabilizers, preservatives, buffering agents, suspending agents, thickeners, and the like.

  If the resin composition is used as a material for an optical lens, the use purpose and use site thereof are not particularly limited, but it is particularly preferable to use the resin composition for applications described later.

(Manufacturing method of optical lens)
The method for producing the optical lens of the present embodiment is not particularly limited, but the raw material containing the above-described resin composition, curing agent and curing accelerator is mixed and defoamed, and then injection-molded at a predetermined temperature. The method is preferred.

(Applications for optical lenses)
The use of the optical lens of the present embodiment is not particularly limited. For example, various camera lenses such as digital cameras and video cameras, “pick-up lenses such as CD, DVD, MO, and Blu-ray disc”, LED lenses They can be used as flash lenses for mobile phones and cameras, lenses for office automation equipment such as copiers and printers, and the like.

Examples that specifically describe the present embodiment will be described below, but the present embodiment is not limited to the following examples unless it exceeds the gist.
The physical properties in Examples and Comparative Examples were evaluated as follows.
<Epoxy equivalent (WPE)>
It was measured according to “JIS K 7236: 2001 (How to determine epoxy equivalent of epoxy resin)”.

<Viscosity>
Measurement was performed under the following conditions.
Rotating E-type viscometer: “TV-22” manufactured by Toki Sangyo Co., Ltd.
Rotor: 3 ° × R14 (Other rotors may be selected as necessary.)
Measurement temperature: 25 ° C
Sample volume: 0.4mL

<Calculation of mixing index α>
The mixing index α was calculated from the following formula (2).
Mixing index α = (αc) / (αb) (2)
here,
αb: (B) In the general formula (1), n = 1 to 2, and R ¹ is an alkoxysilane compound content (mol%) having at least one cyclic ether group,
αc: (C) Content (mol%) of an alkoxysilane compound having n = 1 to 2 and having at least one aryl group as R ¹ in the general formula (1).

<Calculation of mixing index β>
The mixing index β was calculated from the following formula (3).
Mixing index β = {(β ⁿ² ) / (β ⁿ⁰ + β ⁿ¹ )} (3)
here,
β ⁿ² : content (mol%) of the alkoxysilane compound in which n = 2 in the general formula (1),
β ⁿ⁰ : the content (mol%) of the alkoxysilane compound in which n = 0 in the general formula (1),
β ⁿ¹ : content (mol%) of an alkoxysilane compound in which n = 1 in the general formula (1),
At this time, 0 ≦ {(β ⁿ⁰ ) / (β ⁿ⁰ + β ⁿ¹ + β ⁿ² )} ≦ 0.1.

<Calculation of mixing index γ>
The mixing index γ was calculated from the following equation (4).
Mixing index γ = (γa) / (γs) (4)
here,
γa: mass of epoxy resin (g),
γs: Mass (g) of the alkoxysilane compound in which n = 0 to 2 in the general formula (1).

<Calculation of mixing index δ>
The mixing index δ was calculated from the following equation (5).
Mixing index δ = (δe) / (δs) (5)
here,
δe: addition amount of hydrolytic condensation catalyst (mol number),
δs: The amount (mol number) of (OR ² ) in the general formula (1).

<Calculation of mixing index ε>
The mixing index ε was calculated from the following equation (6).
Mixing index ε = (εw) / (εs) (6)
here,
εw: amount of water added (in mol),
.epsilon.s: The amount of the general formula ^{(1) (OR 2) (} mol number).

<Calculation of mixing index ζ>
The mixing index ζ was calculated from the following equation (7).
Mixing index ζ = (ζf) / (ζk) (7)
here,
ζf: addition amount (number of moles) of curing agent,
ζk: The amount (mol number) of cyclic ether groups contained in the epoxy resin and the alkoxysilane compound.

<Calculation of mixing index η>
The mixing index η was calculated from the following formula (8).
Mixing index η = (ηg) / (ηk) × 100 (8)
here,
ηg: mass (g) of curing accelerator,
ηk: mass (g) of epoxy resin and alkoxysilane compound.

<Calculation of storage stability index θ and storage stability of resin composition>
The storage stability in the resin composition was evaluated by a storage stability index θ represented by the following general formula (9).
Storage stability index θ = (storage viscosity) / (starting viscosity) (9)
The container containing the resin composition immediately after production was sealed and the temperature was adjusted at 25 ° C. for 2 hours, and then the viscosity at 25 ° C. was measured, which was defined as “starting viscosity”.
Further, the container containing the resin composition was sealed and stored in a constant temperature incubator at 25 ° C. for 2 weeks. After storage, the viscosity at 25 ° C. was measured, and this was designated as “storage viscosity”.
When the resin composition has fluidity (viscosity is 1000 Pa · s or less) and the storage stability index θ is 4 or less, it was judged to have storage stability.

<Light resistance test of optical lens (cured product)>
Since it is difficult to cut out a sample after manufacturing the optical lens, a cured product was prepared by the following method, and the evaluation result was used as a light resistance evaluation of the optical lens.
(1) The cured product solution prepared by the method described later was cured to produce a cured product of 20 mm × 10 mm × thickness 3 mm.
(2) The cured product was covered with a black mask of 25 mm × 15 mm × thickness 1.2 mm with a hole having a diameter of 5.5 mm to obtain a sample for light resistance test.
(3) A device that can irradiate UV light from the UV irradiation device (USHIO INC., “Spot Cure SP7-250DB”) to the sample in a constant temperature incubator made constant at 50 ° C. via an optical fiber. Prepared.
(4) The sample was set in a constant temperature incubator at 50 ° C. with the black mask on top.
(5) UV light of 2 W / cm 2 was irradiated from the upper part of the black mask for 96 hours so that UV light could be irradiated to a hole having a diameter of 5.5 mm.
(6) The UV-irradiated sample was measured with a spectrocolorimeter (Nippon Denshoku Industries Co., Ltd., “SD5000”) with an integrating sphere opening modified to a diameter of 10 mm.
(7) Yellowness (YI) was determined according to “ASTM D1925-70 (1988): Test Method for Yellowness Index of Plastics”. When this YI was 13 or less, it was judged as passing.

<Cool thermal shock test of optical lens>
(1) Ten optical lenses manufactured by the method described later are set in a thermal shock device (manufactured by ESPEC Corporation, “TSE-11-A”), and “(−40 ° C. to 120 ° C.) / Cycle: exposure A heat cycle was applied under the conditions of “time 14 minutes, temperature rise / fall time 1 minute”.
(2) The sample is taken out after 100 heat cycles, sprayed with a penetrating solution (manufactured by Kosai Co., Ltd., “Microcheck”), and visually checked for abnormalities (peeling or cracking) under a magnifying glass. Observe and record the number.
(3) Samples in which no abnormality was confirmed in the above (4) were put in the apparatus again, and evaluated by the same method over 100 heat cycles. These operations were repeated and evaluated.
(4) The evaluation was interrupted when an abnormality was observed in 1/10 samples, and the “number of cold shock resistance = (number of interrupted heat cycles) − (100 times)” was determined.
When the number of cold and thermal shock resistances was 200 times or more, it was judged that the cold and thermal shock resistance was acceptable.

<Surface tackiness test of optical lens>
When the surface of the optical lens manufactured by the method described later was lightly pressed with a thumb wearing a latex glove and no stickiness was observed, it was judged that the surface tackiness was acceptable.

<Void test of optical lens>
Ten optical lenses manufactured by the method described later were visually confirmed under a magnifying glass, and it was determined that the optical lens was acceptable when all 10 had no voids.

  When all of the light resistance test, the thermal shock resistance test, the surface tack test, and the void test described above passed, it was determined as a pass as a comprehensive judgment.

About the raw material used by the Example and the comparative example, it shows to the following (1)-(7).
(1) Epoxy resin (1-1) Epoxy resin A: Poly (bisphenol A-2-hydroxypropyl ether) (hereinafter referred to as Bis-A epoxy resin)
・ Product name: “AER”, manufactured by Asahi Kasei Epoxy Corporation
Moreover, the epoxy equivalent (WPE) and viscosity measured by the above-mentioned method were as follows.
Epoxy equivalent (WPE): 187 g / eq
Viscosity (25 ° C.): 14.3 Pa · s
(1-2) Epoxy resin B: 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexylcarboxylate (hereinafter referred to as alicyclic epoxy resin)
・ Product name: “Celoxide 2021P” manufactured by Daicel Chemical Industries, Ltd.
Moreover, the epoxy equivalent (WPE) and viscosity measured by the above-mentioned method were as follows.
Epoxy equivalent (WPE): 131 g / eq
Viscosity (25 ° C.): 227 mPa · s

(2) Alkoxysilane compound (2-1) Alkoxysilane compound H: 3-glycidoxypropyltrimethoxysilane (hereinafter referred to as GPTMS)
・ Product name: “KBM-403”, manufactured by Shin-Etsu Chemical Co., Ltd.
(2-2) Alkoxysilane Compound I: Phenyltrimethoxysilane (hereinafter referred to as PTMS)
・ Product name: “KBM-103” manufactured by Shin-Etsu Chemical Co., Ltd.
(2-3) Alkoxysilane Compound J: Dimethyldimethoxysilane (hereinafter referred to as DMDMS)
・ Product name: “KBM-22” manufactured by Shin-Etsu Chemical Co., Ltd.
(2-4) Alkoxysilane Compound K: Tetraethoxysilane (hereinafter referred to as TEOS)
・ Product name: “KBE-04”, manufactured by Shin-Etsu Chemical Co., Ltd.

(3) Solvent: Tetrahydrofuran (Wako Pure Chemical Industries, Ltd., stabilizer-free type) (hereinafter referred to as THF)

(4) Hydrolysis condensation catalyst (4-1) Dibutyltin dilaurate (manufactured by Wako Pure Chemical Industries, Ltd., hereinafter referred to as DBTDL)
(4-2) Dibutyltin dimethoxide (manufactured by Sigma-Aldrich, hereinafter referred to as DBTDM)

(5) Curing agent: “4-methylhexahydrophthalic anhydride / hexahydrophthalic anhydride = 70/30”
-Product name: “Rikacid MH-700G” manufactured by Shin Nippon Rika Co., Ltd.

(6) Curing accelerator: amine compound-Product name: "S-APRO", "U-CAT 18X"

(7) Silicone resin ・ Product name: “EG6301 (liquid A / liquid B)” manufactured by Toray Dow Corning Co., Ltd.

[Synthesis Example 1]
The resin composition was manufactured by the following process.
(1) Preparation: A circulating water bath was set at 5 ° C. and refluxed to the cooling pipe. Further, an oil bath at 80 ° C. was placed on the magnetic stirrer.
(2) According to the composition ratio shown in Table 1 below, the Bis-A1 epoxy resin, the alkoxysilane compound, and THF are placed in a flask containing a stirrer and mixed and stirred in an atmosphere at 25 ° C. Water and a hydrolysis condensation catalyst were added and mixed and stirred.
(3) Subsequently, a cooling tube was set on the flask, and the flask was immediately immersed in an oil bath at 80 ° C. to start stirring, and reacted for 20 hours while refluxing (refluxing step).
(4) After completion of the reaction, the tube was cooled to 25 ° C., and then the cooling tube was removed from the flask.
(5) The solution after completion of the refluxing process was distilled off at 400 Pa and 50 ° C. for 1 hour using an evaporator, and then further subjected to a dehydration condensation reaction while being distilled off at 80 ° C. for 10 hours (dehydration condensation). Process).
(6) After completion of the dehydration condensation reaction, the mixture was cooled to 25 ° C. to obtain a resin composition.
(7) The mixing indices α1 to ε1 of the obtained resin composition are shown in Table 3 below.
(8) Furthermore, according to the above-mentioned method, the epoxy equivalent (WPE), the starting viscosity and the storage viscosity of the resin composition obtained in the above (6) were measured. Furthermore, the storage stability index θ1 was obtained and shown in Table 3.
As shown in Table 3, the resin composition of Synthesis Example 1 had an epoxy equivalent (WPE) of 230 g / eq, and showed an appropriate value. Further, the starting viscosity = 33.7 Pa · s <1000 Pa · s and the storage viscosity = 47.0 Pa · s <1000 Pa · s, both were fluid liquids. The storage stability index θ1 = 1.39 ≦ 4, and it was found that the resin composition had storage stability.

[Synthesis Example 2]
Resin compositions were produced according to Tables 1 and 2 in the same manner as in Synthesis Example 1, except that the refluxing process time was 25 hours. Evaluation was performed in the same manner as in Synthesis Example 1, and the evaluation results, mixing indices α2 to ε2, and storage stability index θ2 are shown in Table 3.
As shown in Table 3, the resin composition of Synthesis Example 2 had an epoxy equivalent (WPE) of 238 g / eq, and showed an appropriate value. In addition, the starting viscosity = 15.2 Pa · s <1000 Pa · s and the storage viscosity = 20.3 Pa · s <1000 Pa · s, both were fluid liquids. In addition, the storage stability index θ2 = 1.33 ≦ 4, and it was found that the resin composition had storage stability.

[Synthesis Example 3]
Resin compositions were produced according to Tables 1 and 2 in the same manner as in Synthesis Example 1. Evaluation was performed in the same manner as in Synthesis Example 1, and the evaluation results, mixing indices α3 to ε3, and storage stability index θ3 are shown in Table 3.
As shown in Table 3, the resin composition of Synthesis Example 3 had an epoxy equivalent (WPE) of 228 g / eq, and showed an appropriate value. Further, the starting viscosity = 38.2 Pa · s <1000 Pa · s and the storage viscosity = 61.1 Pa · s <1000 Pa · s, both were fluid liquids. The storage stability index θ3 = 1.60 ≦ 4, and it was found that the resin composition had storage stability.

[Synthesis Example 4]
Resin compositions were produced according to Tables 1 and 2 in the same manner as in Synthesis Example 1 except that the time for the refluxing process was 7 hours. Evaluation was performed in the same manner as in Synthesis Example 1, and the evaluation results, mixing indices α4 to ε4, and storage stability index θ4 are shown in Table 3.
As shown in Table 3, the resin composition of Synthesis Example 4 was epoxy equivalent (WPE) = 214 g / eq, and showed an appropriate value. In addition, the starting viscosity = 4.9 Pa · s <1000 Pa · s and the storage viscosity = 9.4 Pa · s <1000 Pa · s, both of which were fluid fluids. Further, the storage stability index θ4 = 1.91 ≦ 4, and it was found that the resin composition had storage stability.

[Comparative Synthesis Example 1]
Resin compositions were produced according to Tables 1 and 2 in the same manner as in Synthesis Example 1. Evaluation was performed in the same manner as in Synthesis Example 1, and the evaluation results, mixing indices α4 to ε4, and storage stability index θ4 are shown in Table 3.
As shown in Table 3, the resin composition of Comparative Synthesis Example 1 was epoxy equivalent (WPE) = 295 g / eq, and showed an appropriate value. Further, the starting viscosity = 33.4 Pa · s <1000 Pa · s and the storage viscosity = 48.2 Pa · s <1000 Pa · s, both were fluid liquids. In addition, the storage stability index θ4 = 1.44 ≦ 4, and it was found that the resin composition had storage stability.

[Comparative Synthesis Example 2]
Resin compositions were produced according to Tables 1 and 2 in the same manner as in Synthesis Example 1. Evaluation was performed in the same manner as in Synthesis Example 1, and the evaluation results, mixing indices α5 to ε5, and storage stability index θ5 are shown in Table 3.
As shown in Table 3, the resin composition of Comparative Synthesis Example 2 was epoxy equivalent (WPE) = 295 g / eq, and showed an appropriate value. Further, the starting viscosity = 29.0 Pa · s <1000 Pa · s, which was a fluid liquid. However, storage viscosity> 1000 Pa · s, no fluidity, storage stability index θ5> 35 and storage stability were poor, and it was not possible to produce an optical lens evaluation sample.

[Example 1]
Using the resin composition of Synthesis Example 1 stored at 25 ° C. for 2 weeks, a cured product was produced by the following steps, and a light resistance test was performed. The results are shown in Table 3.
(1) Under an atmosphere of 25 ° C., the resin composition, the curing agent, and the curing accelerator were mixed and stirred according to the composition ratio in Table 2, and deaerated under vacuum to obtain a cured product solution.
(2) A 3 mm thick, U-shaped silicon rubber was sandwiched between two stainless steel plates coated with a release agent to prepare a molding jig.
(3) The above-mentioned solution for cured product was poured into this molding jig and subjected to curing treatment at 120 ° C. for 1 hour and further at 150 ° C. for 1 hour to produce a cured product.
(4) After the oven internal temperature fell to 30 ° C. or lower, the cured product was taken out, and a sample for light resistance test was prepared according to the method described above.
(5) Using the sample, a light resistance test was performed by the method described above, and the test results are shown in Table 3. YI = 10.1 ≦ 13, which is an index of the light resistance test of the cured product, and the light resistance was judged to be acceptable.

Next, using the resin composition of Synthesis Example 1, an optical lens was manufactured by the following steps, and a thermal shock test, a surface tack test, and a void test were performed. The results are shown in Table 3.
(6) In accordance with the formulation shown in Table 2, the raw materials were mixed, defoamed in vacuum, and then set in an injection molding machine (manufactured by Sodick Co., Ltd.)
(7) Further, it was cured at 140 ° C. for 15 minutes, allowed to cool to room temperature, and released from the mold to obtain an optical lens having a diameter of about 1 cm.
As a result of performing the thermal shock resistance test by the above-described method, the number of thermal shock tests was 400 times ≧ 200 times, and the thermal thermal shock resistance was judged to be acceptable.
As a result of performing the surface tack test by the above-mentioned method, no stickiness was observed, and it was judged to be acceptable.
As a result of performing the void property test by the above-described method, no void was confirmed, and it was judged to be acceptable.
From the above results, the optical lens of Example 1 passed all of the light resistance test, the thermal shock test, the surface tack test, and the void test, and was determined to be acceptable as a comprehensive judgment.

[Example 2]
Using the resin composition of Synthesis Example 2 instead of the resin composition of Synthesis Example 1, a cured product and an optical lens were produced in the same manner as in Example 1, and the light resistance test, the thermal shock test, A surface tack test and a void test were performed. The results are shown in Table 3.
YI = 8.1 ≦ 13, which is an index of light resistance test, and light resistance was judged to be acceptable.
As a result of performing the thermal shock resistance test by the above-described method, the number of thermal shock tests was 300 times ≧ 200 times, and the thermal thermal shock resistance was judged to be acceptable.
As a result of performing the surface tack test by the above-mentioned method, no stickiness was observed, and it was judged to be acceptable.
As a result of performing the void property test by the above-described method, no void was confirmed, and it was judged to be acceptable.
From the above results, the optical lens of Example 2 passed all of the light resistance test, the thermal shock test, the surface tack test, and the void test, and was determined to be acceptable as a comprehensive judgment.

[Example 3]
Using the resin composition of Synthesis Example 3 instead of the resin composition of Synthesis Example 1, a cured product and an optical lens were produced in the same manner as in Example 1, and the light resistance test, the thermal shock test, A surface tack test and a void test were performed. The results are shown in Table 3.
YI = 8.9 ≦ 13, which is an index of light resistance test, and light resistance was judged to be acceptable.
As a result of the above thermal shock test, the number of thermal shock tests was 500 times or more and ≧ 200 times, and the thermal shock resistance was judged to be acceptable.
As a result of performing the surface tack test by the above-mentioned method, no stickiness was observed, and it was judged to be acceptable.
As a result of performing the void property test by the above-described method, no void was confirmed, and it was judged to be acceptable.
From the above results, the optical lens of Example 3 passed all of the light resistance test, the thermal shock test, the surface tack test, and the void test, and was determined to be acceptable as a comprehensive judgment.

[Example 4]
Using the resin composition of Synthesis Example 4 instead of the resin composition of Synthesis Example 1, a cured product and an optical lens were produced in the same manner as in Example 1, and the light resistance test, the thermal shock test, A surface tack test and a void test were performed. The results are shown in Table 3.
YI = 8.3 ≦ 13, which is an index of light resistance test, and light resistance was judged to be acceptable.
As a result of performing the thermal shock resistance test by the above-described method, the number of thermal shock tests was 300 times ≧ 200 times, and the thermal thermal shock resistance was judged to be acceptable.
As a result of performing the surface tack test by the above-mentioned method, no stickiness was observed, and it was judged to be acceptable.
As a result of performing the void property test by the above-described method, no void was confirmed, and it was judged to be acceptable.
From the above results, the optical lens of Example 4 passed all of the light resistance test, the thermal shock test, the surface tack test, and the void test, and was determined to be acceptable as a comprehensive judgment.

[Comparative Example 1]
Using the resin composition of Comparative Synthesis Example 1 instead of the resin composition of Synthesis Example 1, a cured product and an optical lens are produced in the same manner as in Example 1, and the light resistance test and the thermal shock test are performed. A surface tack test and a void test were performed. The results are shown in Table 3.
YI = 8.4 ≦ 13, which is an index of the light resistance test, and the light resistance was judged to be acceptable.
As a result of performing the thermal shock resistance test by the above-described method, the number of thermal shock tests was 100 times <200 times, and the thermal thermal shock resistance was judged to be unacceptable.
As a result of performing the surface tack test by the above-mentioned method, no stickiness was observed, and it was judged to be acceptable.
As a result of performing the void property test by the above-described method, no void was confirmed, and it was judged to be acceptable.
From the above results, the optical lens of Comparative Example 1 passed the light resistance test, the surface tack test, and the void test, but failed the thermal shock test, and therefore failed as a comprehensive judgment. It was judged.

[Comparative Example 2]
Using the resin composition of Comparative Synthesis Example 2 instead of the resin composition of Synthesis Example 1, a cured product and an optical lens were produced in the same manner as in Example 1, and the light resistance test and the thermal shock test were performed. Attempts were made to carry out a surface tack test and a void test, but the storage stability of the resin composition was poor, and it was impossible to produce cured products and optical lenses. Therefore, it judged that it was unacceptable as comprehensive judgment.

[Comparative Example 3]
A cured product and an optical lens were produced in the same manner as in Example 1 using Bis-A epoxy resin instead of the resin composition of Synthesis Example 1, and light resistance test, surface tack test, void A test was conducted. The results are shown in Table 3.
YI = 17.2> 13, which is an index of the light resistance test, and the light resistance was judged to be unacceptable.
As a result of performing the thermal shock test by the above-mentioned method, the number of thermal shock tests was 500 times or more and ≧ 200 times, and the thermal shock resistance was judged to be acceptable.
As a result of performing the surface tack test by the above-mentioned method, no stickiness was observed, and it was judged to be acceptable.
As a result of performing the void property test by the above-described method, no void was confirmed, and it was judged to be acceptable.
From the above results, although the optical lens of Comparative Example 3 passed the thermal shock test, the surface tack test, and the void test, it was judged to be rejected as a comprehensive judgment because the light resistance was rejected. did.

[Comparative Example 4]
In place of the resin composition of Synthesis Example 1, liquid A and liquid B were mixed and stirred at a mass ratio of 1: 1, and the above silicone resin was used in the same manner as in Example 1 to obtain a cured product and an optical material. A lens was manufactured and subjected to a light resistance test, a surface tack test, and a void test. The results are shown in Table 3.
YI = 2.0 ≦ 13, which is an index of the light resistance test, and the light resistance was judged to be acceptable.
As a result of performing the thermal shock resistance test by the above-described method, the number of thermal shock tests was 100 times <200 times, and the thermal thermal shock resistance was judged to be unacceptable.
As a result of performing the surface tack test by the above-mentioned method, no stickiness was observed, and it was judged to be acceptable.
As a result of performing the void property test by the above-described method, no void was confirmed, and it was judged to be acceptable.
From the above results, the optical lens of Comparative Example 4 passed the light resistance test, the surface tack test, and the void test, but failed the thermal shock test, and therefore failed as a comprehensive judgment. It was judged.

[Comparative Example 5]
In place of the resin composition of Synthesis Example 1, a composition obtained by mixing Bis-A epoxy resin, GPTMS, and PTMS in accordance with the composition shown in Table 1, and using the same method as in Example 1, cured product and optical lens Were manufactured and subjected to a light resistance test, a surface tack test, and a void test. The results are shown in Table 3.
In the light resistance test, a plurality of voids were generated in the test sample, and the light resistance was not measurable.
As a result of performing the thermal shock resistance test by the above-described method, the number of thermal shock tests was 200 times ≧ 200 times, and the thermal thermal shock resistance was judged to be acceptable.
As a result of performing the surface tack test by the above-mentioned method, stickiness was recognized and it was judged as rejected.
As a result of performing the void property test by the above-described method, voids were observed in 8/10 samples, and it was judged as rejected.
From the above results, the optical lens of Comparative Example 5 passed the thermal shock test, but the light resistance test, the surface tack test, and the void test were rejected. It was judged.

  The optical lens of the present embodiment includes, for example, various camera lenses such as digital cameras and video cameras, “pickup lenses such as CD, DVD, MO, and Blu-ray disc”, LED lenses, mobile phone and camera flash lenses, and copy lenses. Industrial applicability as lenses for OA equipment such as printers and printers.

Claims (4)

(A) an epoxy resin;
An alkoxysilane compound represented by the following general formula (1):
A resin composition obtained by cohydrolyzing and condensing
(In the formula (1), n = 0 to 3, and R ¹ represents a hydrogen atom or an organic group. The plurality of R ² may be the same or different, and may be a hydrogen atom or a carbon number of 1 to 8. Represents an alkyl group of
The alkoxysilane compound is
(B) n = 1-2, and as R ¹ , at least one alkoxysilane compound having at least one cyclic ether group;
(C) n = 1-2, and as R ¹ , at least one alkoxysilane compound having at least one aryl group;
A blending index α of (B) and (C) represented by the following formula (2) is 0.001 to 19, and a resin composition:
Mixing index α = (αc) / (αb) (2)
(In formula (2), αb: content (mol%) of component (B), αc: content (mol%) of component (C))
A curing agent;
An optical lens obtained by curing a curing accelerator. As the alkoxysilane compound,
(D) The optical lens according to claim 1, further comprising at least one alkoxysilane compound in which n = 0 in the general formula (1). The optical lens according to claim 1 or 2, wherein a mixing index β of the alkoxysilane compound represented by the following formula (3) is 0.01 to 1.4;
Mixing index β = {(β ⁿ² ) / (β ⁿ⁰ + β ⁿ¹ )} (3)
(In formula (3),
β ⁿ² : content (mol%) of the alkoxysilane compound in which n = 2 in the general formula (1),
β ⁿ⁰ : the content (mol%) of the alkoxysilane compound in which n = 0 in the general formula (1),
β ⁿ¹ : content (mol%) of the alkoxysilane compound in which n = 1 in the general formula (1),
Here, 0 ≦ {(β ⁿ⁰ ) / (β ⁿ⁰ + β ⁿ¹ + β ⁿ² )} ≦ 0.1). The optical index according to any one of claims 1 to 3, wherein a mixing index γ of the (A) epoxy resin and the alkoxysilane compound represented by the following formula (4) is 0.02 to 15. lens;
Mixing index γ = (γa) / (γs) (4)
(In formula (4),
γa: mass of epoxy resin (g),
γs: mass (g) of alkoxysilane compound in which n = 0 to 2 in the general formula (1)