JP5696798B2 - Polysiloxane - Google Patents

Description

  The present invention relates to a curable composition, a cured product, an optical semiconductor device, and polysiloxane.

  A hydrosilylation reaction curable polysiloxane composition (hereinafter also referred to as a hydrosilyl polysiloxane composition) used for a sealing material of a semiconductor light emitting device (LED) is a technology for improving adhesion to an LED package or the like. Is required.

  As a technique for improving the adhesion of the hydrosilyl polysiloxane composition, a technique of adding an adhesion promoter such as an epoxy group-containing polysiloxane to the hydrosilyl polysiloxane composition is known.

  Patent Document 1 discloses a hydrosilyl polysiloxane composition containing 0.01 to 50 parts by weight of an epoxy group-containing polysiloxane having an alkenyl group, which is an adhesion promoter, with respect to 100 parts by weight of an organopolysiloxane as a main agent. Have been described.

  In Patent Document 2, an epoxy group-containing polysiloxane as an adhesion promoter is contained in an amount of 0.01 to 20 parts by weight with respect to 100 parts by weight of an organopolysiloxane resin containing alkenyl groups and phenyl groups as main components. A polysiloxane composition is described.

  Patent Document 3 discloses a hydrosilyl system containing 0.01 to 10 parts by mass of an epoxy group-containing polysiloxane having an alkenyl group, which is an adhesion promoter, with respect to 100 parts by mass of an organopolysiloxane component containing an alkenyl group as a main component. A polysiloxane composition is described.

JP 2007-327019 A JP 2007-008996 A JP 2010-229402 A

  In order to improve the adhesion between the substrate or the metal wiring and the sealing material, it is necessary to increase the epoxy group content of the epoxy group-containing polysiloxane which is an adhesion promoter. However, when many such adhesion promoters are used, there is a risk that the luminance will decrease.

  The subject of this invention is providing the curable composition which can form the hardened | cured material which can make the adhesiveness with respect to a board | substrate, a metal wiring, etc. and a brightness | luminance compatible in a hydrosilyl type polysiloxane composition.

  The present invention provides the following chemical formula (2):

（式中、Ｒ^Viは、アルケニル基を有する基を示す。Ｒ^Epは、エポキシ基を有する基を示す。Ｒ¹はそれぞれ独立に、１価の炭化水素基（ただし、アルケニル基を有する基をのぞく。）を示す。Ｘは水素原子または炭素数１から３のアルキル基を示す。ａは０以上の整数、ｂは０以上の整数、ｃは０以上の整数、ｄは１以上の整数、ｅは０以上の整数、ｆは０以上の整数、ｈは０以上の整数を示す。iは０以上の整数を示す。ただし、ａ＋ｃは１以上の整数である。）で示されるポリシロキサンであって、
前記ポリシロキサン中に含まれるＳｉ原子の数を１００モル％とするとき、前記ポリシロキサンのアルケニル基の含有量が３〜５０モル％であり、前記ポリシロキサンのエポキシ基の含有量が０．０１〜１０モル％であり、前記ポリシロキサンのアリール基の含有量が３０〜１２０モル％であるポリシロキサンである。

(In the formula, R ^Vi represents a group having an alkenyl group. R ^Ep represents a group having an epoxy group. R ¹ independently represents a monovalent hydrocarbon group (however, a group having an alkenyl group represents X represents a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, a is an integer of 0 or more, b is an integer of 0 or more, c is an integer of 0 or more, d is an integer of 1 or more, e is an integer of 0 or more, f is an integer of 0 or more, h is an integer of 0 or more, i is an integer of 0 or more, provided that a + c is an integer of 1 or more). There,
When the number of Si atoms contained in the polysiloxane is 100 mol%, the content of the alkenyl group of the polysiloxane is 3 to 50 mol%, and the content of the epoxy group of the polysiloxane is 0.01 10 to 10 mol%, and the polysiloxane has an aryl group content of 30 to 120 mol%.

  In the polysiloxane, the ratio of f to the total of a, b, c, d, e, f, g, h and i in the chemical formula is preferably 20 to 90%.

The curable composition of the present invention is a hydrosilyl-based polysiloxane composition capable of forming a cured product capable of achieving both adhesion to a substrate and metal wiring and luminance.
Therefore, an optical semiconductor device obtained by coating a semiconductor light emitting element with a cured product obtained from this curable composition is an optical semiconductor device with excellent reliability.

FIG. 1 is a schematic diagram showing a specific example of an optical semiconductor device.

<Curable composition>
The curable composition of the present invention comprises a polysiloxane (A) having an alkenyl group and an adhesive group and a polysiloxane (B) having at least two silicon-bonded hydrogen atoms per molecule (provided that the polysiloxane (A )) And a hydrosilylation reaction catalyst (C), and when the total content of all components contained in the curable composition is 100% by mass, The content ratio of polysiloxane (A) is 40 to 90% by mass.
In the present invention, “polysiloxane” means a siloxane having a molecular skeleton in which two or more siloxane units (Si—O) are bonded.

Polysiloxane (A)
The polysiloxane (A) is a polysiloxane having an alkenyl group and an adhesive group. The polysiloxane (A) is a main component of the present composition and is cured by a hydrosilylation reaction with the polysiloxane (B) to become a main product of the cured product. Moreover, since polysiloxane (A) has an adhesive group, it also has a function of improving the adhesion between the cured product and the LED package.

  Examples of the alkenyl group that the polysiloxane (A) has include a vinyl group, an allyl group, a propenyl group, an isopropenyl group, a butenyl group, an isobutenyl group, a pentenyl group, a heptenyl group, a hexenyl group, and a cyclohexenyl group. Among these, a vinyl group, an allyl group, and a hexenyl group are preferable.

  The alkenyl group content in the polysiloxane (A) is preferably 3 to 50 mol%, more preferably 5 when the number of all Si atoms contained in the polysiloxane (A) is 100 mol%. It is -40 mol%, More preferably, it is 10-30 mol%. When the content of the alkenyl group is within the above range, the hydrosilylation reaction between the polysiloxane (A) and the polysiloxane (B) occurs in a suitable range, and a cured product having high strength is obtained.

The adhesion group means a group having adhesion to a metal or an organic resin that is a material of a substrate such as a semiconductor device.
Examples of the adhesive group possessed by the polysiloxane (A) include groups having an epoxy group, a thionyl group, an isocyanate group, a triallyl isocyanate group, and the like.

  Among these, it is difficult to inhibit the hydrosilylation reaction that occurs when the curable composition is cured, and forms a cured product that can achieve both high adhesion and brightness to a substrate or metal wiring. The group having is preferable.

  Examples of the group having an epoxy group include glycidoxyalkyl groups such as glycidoxy group and 3-glycidoxypropyl group, 3,4-epoxycyclopentyl group, 3,4-epoxycyclohexyl group, 2- (3 , 4-epoxycyclopentyl) ethyl group, and epoxycycloalkyl groups such as 2- (3,4-epoxycyclohexyl) ethyl group. Specific examples of the group having an epoxy group include groups represented by the following structural formulas (1) to (4). When the group having the epoxy group is such a group, the cured product can be molded in the mm order.

〔構造式（１）中Ｒ²はメチレン基または２価の炭素数２〜１０の直鎖状アルキレン基または炭素数３〜１０の分岐鎖状アルキレン基を示す。〕

[In Structural Formula (1), R ² represents a methylene group, a divalent linear alkylene group having 2 to 10 carbon atoms, or a branched alkylene group having 3 to 10 carbon atoms. ]

〔構造式（２）中Ｒ³はメチレン基または２価の炭素数２〜１０の直鎖状アルキレン基または炭素数３〜１０の分岐鎖状アルキレン基を示す。〕

[In Structural Formula (2), R ³ represents a methylene group, a divalent linear alkylene group having 2 to 10 carbon atoms, or a branched alkylene group having 3 to 10 carbon atoms. ]

〔構造式（３）中Ｒ⁴はメチレン基または２価の炭素数２〜１０の直鎖状アルキレン基または炭素数３〜１０の分岐鎖状アルキレン基を示す。〕

[In Structural Formula (3), R ⁴ represents a methylene group, a divalent linear alkylene group having 2 to 10 carbon atoms or a branched alkylene group having 3 to 10 carbon atoms. ]

〔構造式（４）中Ｒ⁵はメチレン基または２価の炭素数２〜１０の直鎖状アルキレン基または炭素数３〜１０の分岐鎖状アルキレン基を示す。〕

[In Structural Formula (4), R ⁵ represents a methylene group, a divalent linear alkylene group having 2 to 10 carbon atoms, or a branched alkylene group having 3 to 10 carbon atoms. ]

Specific examples of the group represented by the structural formula (1) include 2- (3,4-epoxycyclohexyl) ethyl group.
Specific examples of the group represented by the structural formula (2) include a glycidyl group.
Specific examples of the group represented by the structural formula (3) include a 3-glycidoxypropyl group.
Specific examples of the group represented by the structural formula (4) include a 2- (4-methyl-3, 4-epoxycyclohexyl) ethyl group.

  The content of the adhesive group in the polysiloxane (A) is preferably 0.01 to 10 mol% when the number of all Si atoms contained in the polysiloxane (A) is 100 mol%, Preferably it is 0.05-5 mol%, More preferably, it is 0.05-3 mol%. When the content of the adhesive group is within the above range, a cured film having high adhesion and high brightness between the cured product obtained from the present composition and the LED package or the like can be obtained.

  Content of polysiloxane (A) contained in the curable composition of this invention is 40-90 mass% when the sum total of content of all the components contained in this composition is 100 mass%. , Preferably it is 50-85 mass%, More preferably, it is 65-85 mass%.

  In the conventional hydrosilyl-based polysiloxane composition, in order to enhance the adhesiveness, an epoxy group-containing polysiloxane as an adhesion promoter is 0.01 to 20% by mass based on the entire composition, in addition to the polysiloxane as the main component. To some extent added. On the other hand, in the curable composition of this invention, the polysiloxane (A) which is an epoxy group containing polysiloxane is used as a main ingredient, and the content is 40-90 mass% as above-mentioned. When the content of the polysiloxane (A) is in the above range, the cured product obtained from the composition has high adhesion to a substrate or a metal wiring, and when used as a sealing material such as an LED. Maintain a high initial brightness.

  The polysiloxane (A) preferably has an aryl group. When the polysiloxane (A) has an aryl group, a characteristic that high luminance is obtained when used as an LED sealing material is exhibited. When the number of all Si atoms contained in the polysiloxane (A) is 100 mol%, the content of aryl groups contained in the polysiloxane (A) is preferably 30 to 120 mol%, more preferably It is 50-110 mol%, More preferably, it is 70-100 mol%. When the aryl group content is in the range of 30 to 120 mol%, a cured film having high luminance and high refractive index can be obtained from the present composition. Examples of the aryl group include a phenyl group, a tolyl group, a xylyl group, and a naphthyl group.

Polysiloxane (A) preferably has a polystyrene-equivalent weight average molecular weight measured by gel permeation chromatography in the range of 100 to 50000, and more preferably in the range of 500 to 5000. When the weight average molecular weight of the polysiloxane (A) is within the above range, it is easy to handle when producing a sealing material using the composition, and the cured product obtained from the composition is used as an optical semiconductor sealing material. Has sufficient material strength and properties.
As polysiloxane (A), the following chemical formula (1):

（式中、Ｒ^Viは、アルケニル基を有する基を示す。Ｒ^Adは、密着性基を有する基を示す。Ｒ¹はそれぞれ独立に、１価の炭化水素基（ただし、アルケニル基を有する基をのぞく。）を示す。Ｘは水素原子または炭素数１から３のアルキル基を示す。ａは０以上の整数、ｂは０以上の整数、ｃは０以上の整数、ｄは０以上の整数、ｅは０以上の整数、ｆは０以上の整数、ｇは０以上の整数、ｈは０以上の整数を示す。iは０以上の整数を示す。ただし、ａ＋ｃは１以上の整数である。ｄ＋ｇは１以上の整数である。）で示されるポリシロキサンが挙げられる。

(In the formula, R ^Vi represents a group having an alkenyl group. R ^Ad represents a group having an adhesive group. R ¹ independently represents a monovalent hydrocarbon group (however, a group having an alkenyl group). X represents a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, a is an integer of 0 or more, b is an integer of 0 or more, c is an integer of 0 or more, and d is an integer of 0 or more. , E is an integer of 0 or more, f is an integer of 0 or more, g is an integer of 0 or more, h is an integer of 0 or more, i is an integer of 0 or more, where a + c is an integer of 1 or more D + g is an integer of 1 or more).

  The ratio of a to the total of a, b, c, d, e, f, g, h and i is preferably 0% or more and 60% or less, more preferably 5%, when the total is 100%. % To 40%. The ratio of b is preferably 0% or more and 50% or less, and more preferably 0% or more and 20% or less. The ratio of c is preferably 0% or more and 30% or less, and more preferably 0% or more and 20% or less. The ratio of d is preferably 0% or more and 10% or less, and more preferably 0% or more and 5% or less. The ratio of e is preferably 0% or more and 50% or less, and more preferably 0% or more and 30% or less. The ratio of f is 0% or more and 90% or less, preferably 20% or more and 90% or less, and more preferably 40% or more and 80% or less. The ratio of g is preferably 0% or more and 10% or less, and more preferably 0% or more and 5% or less. The ratio of h is preferably 0% or more and 50% or less, and more preferably 0% or more and 30% or less. The ratio of i is preferably 0% or more and 10% or less, and more preferably 0% or more and 5% or less. However, the ratio of a + c is larger than 0%, and the ratio of d + g is larger than 0%.

  Among the polysiloxanes represented by the chemical formula (1), the polysiloxane represented by the following chemical formula (2) is preferable because it forms a cured product that can achieve both high adhesion and brightness to a substrate or a metal wiring. .

（式中、Ｒ^Viは、アルケニル基を有する基を示す。Ｒ^Epは、エポキシ基を有する基を示す。Ｒ¹はそれぞれ独立に、１価の炭化水素基（ただし、アルケニル基を有する基をのぞく。）を示す。Ｘは水素原子または炭素数１から３のアルキル基を示す。ａは０以上の整数、ｂは０以上の整数、ｃは０以上の整数、ｄは１以上の整数、ｅは０以上の整数、ｆは０以上の整数、ｈは０以上の整数を示す。iは０以上の整数を示す。ただし、ａ＋ｃは１以上の整数である。）

(In the formula, R ^Vi represents a group having an alkenyl group. R ^Ep represents a group having an epoxy group. R ¹ independently represents a monovalent hydrocarbon group (however, a group having an alkenyl group represents X represents a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, a is an integer of 0 or more, b is an integer of 0 or more, c is an integer of 0 or more, d is an integer of 1 or more, e is an integer greater than or equal to 0, f is an integer greater than or equal to 0, h is an integer greater than or equal to 0. i is an integer greater than or equal to 0. However, a + c is an integer greater than or equal to 1.)

  Examples of the group having an alkenyl group include the same groups as the above-described groups having an alkenyl group. Examples of the group having an adhesive group include groups having the same group as the above-mentioned adhesive group. As group which has an epoxy group, the same group as the group which has the above-mentioned epoxy group is illustrated. Examples of monovalent hydrocarbon groups include alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl, and heptyl groups; aryl groups such as phenyl, tolyl, xylyl, and naphthyl groups; Examples include aralkyl groups such as benzyl group and phenethyl group; and substituted alkyl groups such as chloromethyl group, 3-chloropropyl group, 3,3,3-trifluoropropyl group, and nonafluorobutylethyl group.

  As a method for producing the polysiloxane (A), JP-A-6-9659, JP-A-2003-183582, JP-A-2007-008996, JP-A-2007-106798, JP-A-2007-169427 are disclosed. And known methods described in JP 2010-059359 A, for example, a method of co-hydrolyzing chlorosilane and alkoxysilane serving as each unit source, and an equilibration reaction of the co-hydrolyzed product with an alkali metal catalyst or the like. The method etc. are mentioned.

  By using such a polysiloxane, the cured product obtained from the curable composition of the present application has the required strength, exhibits adhesion to a metal or an organic resin film, and as an LED sealing material The characteristic that high brightness is obtained when used is developed.

Polysiloxane (B)
The polysiloxane (B) is a polysiloxane having at least two silicon-bonded hydrogen atoms per molecule (except for the polysiloxane (A)). That is, the polysiloxane (B) has at least two Si—H groups (hydrosilyl groups) per molecule. Polysiloxane (B) is a crosslinking agent for polysiloxane (A), and forms a cured product by a hydrosilylation reaction with polysiloxane (A).

  The polysiloxane (B) is not particularly limited as long as it is a polysiloxane having at least two silicon-bonded hydrogen atoms per molecule, which is used as a crosslinking agent in the conventional hydrosilyl polysiloxane composition. Can be used.

Specific examples of the polysiloxane (B) include organohydrogenpolysiloxanes described in Patent Documents 1 to 3.
The polysiloxane (B) is obtained by, for example, reacting an alkoxysilane such as phenyltrimethoxysilane or diphenyldimethoxysilane with a hydrogensiloxane such as 1,1,3,3-tetramethyldisiloxane by a known method. Can be obtained.

  As content of polysiloxane (B) in the curable composition of this invention, the molar ratio of the silicon atom bond hydrogen atom amount in polysiloxane (B) with respect to the amount of alkenyl groups in polysiloxane (A) is 0.1-0.1. 5 is preferable, more preferably 0.5 to 2, and still more preferably 0.7 to 1.4. When the content of the polysiloxane (B) is within the above range, the composition is sufficiently cured, and sufficient heat resistance is obtained for the obtained cured product.

Catalyst for hydrosilylation reaction (C)
The catalyst for hydrosilylation reaction (C) is a catalyst for hydrosilylation reaction of polysiloxane (A) and polysiloxane (B).

  The hydrosilylation reaction catalyst (C) can be used without any particular limitation as long as it is a catalyst used as a hydrosilylation reaction catalyst in a conventional hydrosilyl polysiloxane composition.

  Specific examples of the hydrosilylation catalyst (C) include a platinum-based catalyst, a rhodium-based catalyst, and a palladium-based catalyst. Among these, a platinum-based catalyst is preferable from the viewpoint of promoting the curing of the present composition. Examples of the platinum-based catalyst include a platinum-alkenylsiloxane complex. Examples of the alkenylsiloxane include 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane. Etc. In particular, 1,3-divinyl-1,1,3,3-tetramethyldisiloxane is preferable from the viewpoint of the stability of the complex.

The hydrosilylation reaction catalyst (C) in the curable composition of the present invention is used in such an amount that the hydrosilylation reaction of the polysiloxane (A) and the polysiloxane (B) can actually proceed.
As long as the object of the present invention is achieved, the curable composition of the present invention can contain, for example, fumed silica, fine particle silica such as quartz powder, titanium oxide, zinc oxide, etc. Inorganic fillers, retarders such as cyclo-tetramethyltetravinyltetrasiloxane, diluents such as diphenylbis (dimethylvinylsiloxy) silane, phenyltris (dimethylvinylsiloxy) silane, pigments, flame retardants, heat-resistant agents, antioxidants An agent etc. can be contained.

The curable composition of this invention can be prepared by mixing each said component uniformly by well-known methods, such as a mixer.
As a viscosity in 25 degreeC of the curable composition of this invention, Preferably it is 1-1000000 mPa * s, More preferably, it is 10-10000 mPa * s. When the viscosity is within this range, the operability of the composition is improved.

  The curable composition of the present invention can be prepared as one liquid, or can be prepared by dividing into two liquids, and the two liquids can be mixed and used at the time of use. If necessary, a small amount of a curing inhibitor such as acetylene alcohol may be added.

<Hardened product>
A cured product is obtained by curing the curable composition of the present invention. If a semiconductor element is sealed with the curable composition of the present invention and cured, a cured product as a sealing material is obtained.

Examples of the method for curing the curable composition of the present invention include a method in which the curable composition is applied on a substrate and then heated at 100 to 180 ° C. for 1 to 13 hours.
As described above, a cured product obtained by curing the curable composition of the present invention has high adhesion to a substrate, a metal wiring, and the like, and realizes high initial luminance such as an LED.

<Optical semiconductor device>
The optical semiconductor device of the present invention includes a semiconductor light emitting element and the cured product that covers the semiconductor light emitting element. The optical semiconductor device of the present invention is obtained by coating a semiconductor light emitting element with the curable composition and curing the composition. The method for curing the curable composition is as described above.
Examples of the optical semiconductor device include an LED (Light Emitting Diode) and an LD (Laser Diode).

  FIG. 1 is a schematic view of a specific example of the optical semiconductor device of the present invention. The optical semiconductor device 1 includes an electrode 6, a semiconductor light emitting element 2 that is installed on the electrode 6 and electrically connected to the electrode 6 through a wire 7, and a reflector 3 that is disposed so as to accommodate the semiconductor light emitting element 2. The sealing material 4 is filled in the reflector 3 and seals the semiconductor light emitting element 2. The sealing material 4 is obtained by curing the curable composition of the present invention. In the sealing material 4, particles 5 such as silica and phosphor are dispersed.

  As described above, the encapsulant obtained by curing the curable composition of the present invention has a strong adhesive force to an organic resin film that is a reflector material, a metal that is an electrode material, etc. Even in this case, the sealing material is not peeled off from the LED package. Moreover, the said sealing material maintains high initial luminance, such as LED. That is, both high adhesiveness and high initial luminance are realized.

(1) Synthesis of polysiloxane (1-1) Synthesis of polysiloxane [Synthesis Example 1] Synthesis of polysiloxane (AR1) 1,3-divinyl- in a four-necked flask equipped with a stirrer, a reflux condenser, an inlet, and a thermometer 82 g of 1,1,3,3-tetramethyldisiloxane, 525 g of phenyltrimethoxysilane, 143 g of water, 0.4 g of trifluoromethanesulfonic acid and 500 g of toluene were added and mixed, followed by heating under reflux for 1 hour. After cooling, the lower layer was separated and removed, and the upper toluene solution layer was washed with water. To the toluene solution layer washed with water, 0.4 g of potassium hydroxide was added and refluxed while removing water from the water separation tube. After the removal of water was completed, the solution was concentrated until the solid concentration became 75% by mass, and further refluxed for 5 hours. After cooling, 0.6 g of acetic acid was added to neutralize, and the toluene solution obtained by filtration was washed with water. Then, it concentrated under reduced pressure and obtained polysiloxane (AR1). It was 2000 when the polystyrene conversion weight average molecular weight of polysiloxane (AR1) was measured by the gel permeation chromatography. The chemical formula of polysiloxane (AR1) is (ViMe ₂ SiO _1/2 ) ₂₅ (PhSiO _3/2 ) ₇₅ (Vi represents a vinyl group, Me represents a methyl group, Ph represents a phenyl group, and the subscript represents mol%) Met.

[Synthesis Example 2] Synthesis of polysiloxane (A1) Stirrer, reflux condenser, charging port, 4-neck flask with thermometer, 82 g of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 143 g of water Then, 521 g of phenyltrimethoxysilane, 0.4 g of trifluoromethanesulfonic acid and 500 g of toluene were added and mixed, followed by heating under reflux for 1 hour. After cooling, the lower layer was separated and removed, and the upper toluene solution layer was washed with water. To the toluene solution layer washed with water, 4 g of 3-glycidoxypropylmethyldimethoxysilane and 0.5 g of potassium hydroxide were added and heated to reflux for 1 hour. Subsequently, methanol was distilled off and excess water was removed by azeotropic dehydration. Subsequently, the mixture was heated to reflux for 4 hours. The toluene solution after the reaction was cooled, neutralized with 0.6 g of acetic acid and washed with water. After removing water, toluene is distilled off and concentrated under reduced pressure to have 25 mol% of alkenyl groups and 0.5 mol% of epoxy groups (the number of all Si atoms contained in the polysiloxane is 100 mol%). (A1) was obtained. It was 2000 when the polystyrene conversion weight average molecular weight of polysiloxane (A1) was measured by the gel permeation chromatography. The chemical formula of polysiloxane (A1) is (ViMe ₂ SiO _1/2 ) ₂₅ (PhSiO _3/2 ) _74.5 (EpMeSiO _2/2 ) _0.5 (Vi is a vinyl group, Me is a methyl group, Ph is a phenyl group, Ep is a glycerin) It represents a sidoxypropyl group, and the subscript indicates mol%). When the number of all Si atoms contained in the polysiloxane (A1) is 100 mol%, the alkenyl group content is 25 mol%, the epoxy group content is 0.5 mol%, and the aryl group content is 74.%. It was 5 mol%.

[Synthesis Example 3] Synthesis of polysiloxane (A2) Stirrer, reflux condenser, charging port, 4-neck flask with thermometer, 82 g of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, phenyltri 518 g of methoxysilane, 143 g of water, 0.4 g of trifluoromethanesulfonic acid and 500 g of toluene were added and mixed, and the mixture was heated to reflux for 1 hour. After cooling, the lower layer was separated and removed, and the upper toluene solution layer was washed with water. To the toluene solution layer washed with water, 8 g of 3-glycidoxypropylmethyldimethoxysilane and 0.5 g of potassium hydroxide were added and heated under reflux for 1 hour. Subsequently, methanol was distilled off and excess water was removed by azeotropic dehydration. Subsequently, the mixture was heated to reflux for 4 hours. The toluene solution after the reaction was cooled, neutralized with 0.6 g of acetic acid and washed with water. After removing water, toluene was distilled off and concentrated under reduced pressure to have 25 mol% of alkenyl groups and 1 mol% of epoxy groups (the number of all Si atoms contained in the polysiloxane was 100 mol%) (A2 ) It was 2000 when the polystyrene conversion weight average molecular weight of polysiloxane (A2) was measured by the gel permeation chromatography. The chemical formula of polysiloxane (A2) is (ViMe ₂ SiO _1/2 ) ₂₅ (PhSiO _3/2 ) ₇₄ (EpMeSiO _2/2 ) ₁ (Vi is a vinyl group, Me is a methyl group, Ph is a phenyl group, and Ep is a glycerin. It represents a sidoxypropyl group, and the subscript indicates mol%). When the total number of Si atoms contained in the polysiloxane (A2) is 100 mol%, the alkenyl group content is 25 mol%, the epoxy group content is 1 mol%, and the aryl group content is 74 mol%. It was.

[Synthesis Example 4] Synthesis of polysiloxane (A3) Stirrer, reflux condenser, charging port, 4-neck flask with thermometer, 82 g of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, phenyltri 511 g of methoxysilane, 143 g of water, 0.4 g of trifluoromethanesulfonic acid and 500 g of toluene were added and mixed, and the mixture was heated to reflux for 1 hour. After cooling, the lower layer was separated and removed, and the upper toluene solution layer was washed with water. To the toluene solution layer washed with water, 16 g of 3-glycidoxypropylmethyldimethoxysilane and 0.5 g of potassium hydroxide were added and heated to reflux for 1 hour. Subsequently, methanol was distilled off and excess water was removed by azeotropic dehydration. Subsequently, the mixture was heated to reflux for 4 hours. The toluene solution after the reaction was cooled, neutralized with 0.6 g of acetic acid and washed with water. After water removal, toluene was distilled off and concentrated under reduced pressure to obtain 25% by mole of alkenyl groups and 2% by mole of epoxy groups (with the total number of Si atoms contained in the polysiloxane being 100% by mole) ( A3) was obtained. It was 2000 when the polystyrene conversion weight average molecular weight of polysiloxane (A3) was measured by the gel permeation chromatography. The chemical formula of polysiloxane (A3) is (ViMe ₂ SiO _1/2 ) ₂₅ (PhSiO _3/2 ) ₇₃ (EpMeSiO _2/2 ) ₂ (Vi is a vinyl group, Me is a methyl group, Ph is a phenyl group, Ep is a glycerin) It represents a sidoxypropyl group, and the subscript indicates mol%). When the total number of Si atoms contained in the polysiloxane (A3) is 100 mol%, the alkenyl group content is 25 mol%, the epoxy group content is 2 mol%, and the aryl group content is 73 mol%. It was.

[Synthesis Example 5] Synthesis of polysiloxane (A4) 49 g of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane was added to a four-necked flask equipped with a stirrer, a reflux condenser, an inlet, and a thermometer, 442 g of methoxysilane, 85 g of dimethyldimethoxysilane, 143 g of water, 0.4 g of trifluoromethanesulfonic acid and 500 g of toluene were added and mixed, followed by heating under reflux for 1 hour. After cooling, the lower layer was separated and removed, and the upper toluene solution layer was washed with water. To the toluene solution layer washed with water, 8 g of 3-glycidoxypropylmethyldimethoxysilane and 0.5 g of potassium hydroxide were added and heated under reflux for 1 hour. Subsequently, methanol was distilled off and excess water was removed by azeotropic dehydration. Subsequently, the mixture was heated to reflux for 4 hours. The toluene solution after the reaction was cooled, neutralized with 0.6 g of acetic acid and washed with water. After removal of water, toluene is distilled off and concentrated under reduced pressure to obtain a polysiloxane having 15 mol% of alkenyl groups and 1 mol% of epoxy groups (with the total number of Si atoms contained in the polysiloxane being 100 mol%). A4) was obtained. It was 1800 when the polystyrene conversion weight average molecular weight of polysiloxane (A4) was measured by the gel permeation chromatography. The chemical formula of polysiloxane (A4) is (ViMe ₂ SiO _1/2 ) ₁₅ (PhSiO _3/2 ) ₆₄ (Me ₂ SiO _2/2 ) ₂₀ (EpMeSiO _2/2 ) ₁ (Vi is a vinyl group, Me is a methyl group Ph represents a phenyl group, Ep represents a glycidoxypropyl group, and the subscript represents mol%). When the total number of Si atoms contained in the polysiloxane (A4) is 100 mol%, the alkenyl group content is 15 mol%, the epoxy group content is 1 mol%, and the aryl group content is 64 mol%. It was.

[Synthesis Example 6] Synthesis of polysiloxane (A5) Stirrer, reflux condenser, charging port, 4-neck flask with thermometer, 82 g of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, phenyltri 525 g of methoxysilane, 143 g of water, 0.4 g of trifluoromethanesulfonic acid and 500 g of toluene were added and mixed, and the mixture was heated to reflux for 1 hour. After cooling, the lower layer was separated and removed, and the upper toluene solution layer was washed with water. To the toluene solution layer washed with water, 314 g of 3-glycidoxypropylmethyldimethoxysilane, 130 g of water and 0.5 g of potassium hydroxide were added and heated under reflux for 1 hour. Subsequently, methanol was distilled off and excess water was removed by azeotropic dehydration. Subsequently, the mixture was heated to reflux for 4 hours. The toluene solution after the reaction was cooled, neutralized with 0.6 g of acetic acid and washed with water. After water removal, toluene was distilled off and concentrated under reduced pressure to obtain 25% by mole of alkenyl groups and 40% by mole of epoxy groups (with the total number of Si atoms contained in the polysiloxane being 100% by mole) ( A5) was obtained. It was 1600 when the polystyrene conversion weight average molecular weight of polysiloxane (A5) was measured by the gel permeation chromatography. The chemical formula of polysiloxane (A5) is (ViMe ₂ SiO _1/2 ) ₂₅ (PhSiO _3/2 ) ₇₅ (EpMeSiO _2/2 ) ₄₀ (Vi is a vinyl group, Me is a methyl group, Ph is a phenyl group, and Ep is a glycerin. It represents a sidoxypropyl group, and the subscript indicates mol%). When the total number of Si atoms contained in the polysiloxane (A5) is 100 mol%, the alkenyl group content is 25 mol%, the epoxy group content is 40 mol%, and the aryl group content is 35 mol%. It was.

[Synthesis Example 7] Synthesis of polysiloxane (A6) Stirrer, reflux condenser, charging port, 4-neck flask with thermometer, 33 g of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, phenyltri 442 g of methoxysilane, 85 g of dimethyldimethoxysilane, 43 g of diphenyldimethoxysilane, 155 g of water, 0.4 g of trifluoromethanesulfonic acid and 500 g of toluene were mixed and heated to reflux for 1 hour. After cooling, the lower layer was separated and removed, and the upper toluene solution layer was washed with water. To the toluene solution layer washed with water, 8 g of 3-glycidoxypropylmethyldimethoxysilane and 0.5 g of potassium hydroxide were added and heated under reflux for 1 hour. Subsequently, methanol was distilled off and excess water was removed by azeotropic dehydration. Subsequently, the mixture was heated to reflux for 4 hours. The toluene solution after the reaction was cooled, neutralized with 0.6 g of acetic acid and washed with water. After water removal, toluene was distilled off and concentrated under reduced pressure to have a polysiloxane having an alkenyl group of 10 mol% and an epoxy group of 1 mol% (the total number of Si atoms contained in the polysiloxane was 100 mol%). A6) was obtained. It was 1800 when the polystyrene conversion weight average molecular weight of polysiloxane (A6) was measured by the gel permeation chromatography. The chemical formula of polysiloxane (A6) is (ViMe ₂ SiO _1/2 ) ₁₀ (PhSiO _3/2 ) ₆₄ (Ph ₂ SiO _2/2 ) ₅ (Me ₂ SiO _2/2 ) ₂₀ (EpMeSiO _2/2 ) ₁ ( Vi represents a vinyl group, Me represents a methyl group, Ph represents a phenyl group, Ep represents a glycidoxypropyl group, and the subscript represents mol%). When the total number of Si atoms contained in the polysiloxane (A6) is 100 mol%, the alkenyl group content is 10 mol%, the epoxy group content is 1 mol%, and the aryl group content is 74 mol%. It was.

[Synthesis Example 8] Synthesis of polysiloxane (B1) 195 g of phenyltrimethoxysilane and 0.2 g of trifluoromethanesulfonic acid were added to a stirrer, a reflux condenser, an inlet, and a four-necked flask equipped with a thermometer, mixed and stirred. While adding 13 g of water dropwise over 15 minutes, the mixture was heated to reflux for 1 hour after the completion of the dropwise addition. After cooling to room temperature, 119 g of 1,1,3,3-tetramethyldisiloxane was added, and 88 g of acetic acid was added dropwise with stirring. After completion of the dropwise addition, the mixture was heated to 50 ° C. with stirring and reacted for 3 hours. After cooling to room temperature, toluene and water were added, mixed well and allowed to stand, and the aqueous layer was separated and removed. The upper toluene solution layer was washed with water and then concentrated under reduced pressure to obtain methylphenylhydrogenpolysiloxane (B1). The chemical formula of the polysiloxane (B1) was (HMe ₂ SiO _1/2 ) ₆₀ (PhSiO _3/2 ) ₄₀ (Me represents a methyl group, Ph represents a phenyl group, and the subscript represents mol%).

[Synthesis Example 9] Synthesis of polysiloxane (B2) 220 g of diphenyldimethoxysilane and 0.6 g of trifluoromethanesulfonic acid were added to a stirrer, a reflux condenser, a charging port, and a four-necked flask with a thermometer, and mixed. , 3,3-tetramethyldisiloxane 147 g was added, and 108 g of acetic acid was added dropwise over 30 minutes while stirring. After completion of dropping, the mixture was stirred and heated to 50 ° C. and reacted for 3 hours. After cooling to room temperature, toluene and water were added, mixed well and allowed to stand, and the aqueous layer was separated and removed. The upper toluene solution layer was washed with water three times and then concentrated under reduced pressure to obtain diphenylhydrogenpolysiloxane (B2). The chemical formula of polysiloxane (B2) is (HMe ₂ SiO _1/2 ) ₅₀ (Ph ₂ SiO _2/2 ) ₅₀ (Me represents a methyl group, Ph represents a phenyl group, and the subscript represents mol%)
Met.

(1-2) Weight average molecular weight The weight average molecular weight (Mw) of the obtained polysiloxane was measured by gel permeation chromatography (GPC) under the following conditions and determined as a polystyrene equivalent value.
Apparatus: HLC-8120C (manufactured by Tosoh Corporation)
Column: TSK-gel Multipore HXL-M (manufactured by Tosoh Corporation)
Eluent: THF, flow rate 0.5 mL / min, load 5.0%, 100 μL

(1-3) Alkenyl Group, Epoxy Group, and Aryl Group Content Ratio, and Polysiloxane Chemical Formula The alkenyl group, epoxy group, and aryl group content ratios contained in the obtained polysiloxane (total content in the polysiloxane) The chemical formula of polysiloxane was calculated by ²⁹ Si NMR and ¹³ C NMR.

(2) Preparation of curable composition [Examples 1 to 5 and Comparative Examples 1 and 2]
At 95 ° C. under normal pressure, the components shown in Table 1 below were mixed in the blending amounts shown in Table 1 to obtain curable compositions of Examples 1 to 4 and Comparative Examples 1 and 2. Numerical values in Table 1 indicate parts by mass. The details of each component in Table 1 are as follows.

Ｃ１：白金と１，３−ジビニル−１，１，３，３−テトラメチルジシロキサンとの錯体(白金金属量４質量％)
Ｄ１：シクロ−テトラメチルテトラビニルテトラシロキサン
Ｄ２：ジフェニルビス（ジメチルビニルシロキシ）シラン
Ｄ３：フェニルトリス（ジメチルビニルシロキシ）シラン

C1: Complex of platinum and 1,3-divinyl-1,1,3,3-tetramethyldisiloxane (platinum metal amount 4% by mass)
D1: Cyclo-tetramethyltetravinyltetrasiloxane D2: Diphenylbis (dimethylvinylsiloxy) silane D3: Phenyltris (dimethylvinylsiloxy) silane

(3) Evaluation of curable composition About the curable composition of Examples 1-4 and Comparative Examples 1 and 2, it evaluated by the method of the following (3-1)-(3-6). The evaluation results are shown in Table 2.
(3-1) Viscosity The viscosity of the curable composition was measured at 25 ° C. using an E-type viscometer.

(3-2) Hardness Applying a curable composition to a Teflon (registered trademark) flat plate with a 2 mm thick frame so as to be the height of the fitting frame, and heating in a hot air circulation oven at 150 ° C. for 5 hours Thus, a cured product of 50 mm × 50 mm × 1 mm was produced. The hardness of the cured product was measured with a type D durometer defined in JIS K6253.

(3-3) Refractive Index Using a cured product prepared from a curable composition for hardness measurement, the refractive index at 25 ° C. was measured with a Model 2010 total reflection refractometer manufactured by Metricon. The measurement wavelength is 408 nm.

(3-4) Light transmittance change A circular (diameter: 2 cm, thickness: 1 mm) frame is placed on a 1 mm quartz plate, and the curable composition is filled in this frame. The light transmittance at a wavelength of 460 nm at 25 ° C. of a cured product (optical path length: 1.0 mm) prepared by curing by heating for 5 hours was measured. Next, in order to examine the degree of coloration after the accelerated deterioration test, the light transmittance at a wavelength of 460 nm at 25 ° C. after the cured product was heat-aged in a heat circulation oven at 150 ° C. for 1000 hours was similarly measured. From the ratio of the light transmittance after heating aging to the light transmittance before heating aging, the change in light transmittance was evaluated according to the following criteria.
A: The ratio is 98% or more B: The ratio is 90% or more and less than 98% C: The ratio is less than 90%

(3-5) Adhesive strength 5 mm in diameter 5 mm in diameter 5 mm in height by applying a curable composition to the bottom of an aluminum circle and pasting it on various test panels and leaving it in a hot air circulation oven at 150 ° C. for 1 hour. A test piece was obtained in which a 5 mm aluminum cylinder was adhered to a test panel with a curable composition. The aluminum cylinders closely attached to the various test panels were peeled off at a speed of 50 μm / second using a Dage series-4000PXY as a measuring device, the load at that time was measured to determine the adhesive strength, and evaluated according to the following criteria.
A: Adhesive strength is 10 kg or more B: Adhesive strength is 5 kg or more and less than 10 kg

(3-6) Heat resistance After applying the curable composition on quartz glass so that the dry film thickness becomes 1 mm, it is dried and cured at 100 ° C. for 1 hour, and then dried and cured at 150 ° C. for 5 hours to obtain a cured product. Was made. This hardened | cured material was stored at 150 degreeC for 500 hours, the external appearance of the hardened | cured material after storage was observed visually, and heat resistance was evaluated on the following reference | standard.
(Color change)
A: No color change B: Slightly yellow C: Clearly yellow

(3-7) Total radiant flux measurement (luminance evaluation)
The curable composition is applied to an optical semiconductor surface-mounting type package (top view type, consisting of a portion composed of the optical semiconductor 2, the electrode 6, the wire 7, and the reflector 3 in FIG. 1). An evaluation sample was prepared by heating for a period of time.

Using the total radiant flux measuring device (instant multiphotometric detector MCPD-3700, Φ300 mm integrating sphere (hemispheric integrating sphere)), the radiant flux of the sample for evaluation was measured. The ratio of the radiant flux of the sample for evaluation to the initial radiant flux measured by energizing the package before applying the sealing material to emit light was calculated in%, and evaluated according to the following criteria.
A: The ratio is 110% or more B: The ratio is less than 110% 100% or more C: The ratio is less than 100%

  From the results shown in Table 2, in Comparative Examples 1 and 2 in which polysiloxane (A), which is an epoxy group-containing polysiloxane, was used as an adhesion promoter, a comparative example in which polysiloxane (A5) having many epoxy groups was used. In Comparative Example 2 using Polysiloxane (A3) having a low total radiant flux, that is, a low brightness and a small number of epoxy groups, the adhesive strength was low, and both high brightness and high adhesiveness were not realized. On the other hand, in Examples 1 to 5 whose main component is polysiloxane (A), which is an epoxy group-containing polysiloxane, both the total radiant flux and the adhesive strength are high, realizing both high brightness and high adhesiveness. I found out.

  In the curable composition of the present invention, the cured product is transparent, and even when placed in a high-temperature atmosphere, the decrease in light transmittance is small and it has high adhesiveness. It is useful as a sealing material, adhesive, potting agent, protective coating agent, underfill agent and the like. The cured product of the present invention is characterized in that the decrease in light transmittance is small even when exposed to high temperatures, so that the decrease in light transmittance is small even in the production process under high temperature conditions, and the long-term reliability is excellent. The cured product of the present invention is useful as an optical member used in the vicinity of a high-intensity light source because the total radiant flux increases when used in an optical semiconductor device such as a high-intensity light emitting element.

DESCRIPTION OF SYMBOLS 1 Optical semiconductor device 2 Semiconductor light emitting element 3 Reflector 4 Sealing material 5 Particle 6 Electrode 7 Wire

Claims (2)

The following chemical formula (2):

(In the formula, R ^Vi represents a group having an alkenyl group. R ^Ep represents a group having an epoxy group. R ¹ independently represents a monovalent hydrocarbon group (however, a group having an alkenyl group represents X represents a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, a is an integer of 0 or more, b is an integer of 0 or more, c is an integer of 0 or more, d is an integer of 1 or more, e is an integer of 0 or more, f is an integer of 0 or more, h is an integer of 0 or more, i is an integer of 0 or more, provided that a + c is an integer of 1 or more). There,
When the number of Si atoms contained in the polysiloxane is 100 mol%, the content of alkenyl groups in the polysiloxane is 10 to 25 mol%, and the content of epoxy groups in the polysiloxane is 0.5. ~ a 2 mol%, the polysiloxane content of the aryl groups of said polysiloxane is from 64 to 74.5 mol%.   2. The polysiloxane according to claim 1, wherein in the chemical formula (2), a ratio of f to a total of a, b, c, d, e, f, g, h and i is 20 to 90%.

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