JP6631752B2 - ネガ型感光性樹脂組成物、半導体装置および電子機器 - Google Patents

ネガ型感光性樹脂組成物、半導体装置および電子機器 Download PDF

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Publication number
JP6631752B2
JP6631752B2 JP2019522344A JP2019522344A JP6631752B2 JP 6631752 B2 JP6631752 B2 JP 6631752B2 JP 2019522344 A JP2019522344 A JP 2019522344A JP 2019522344 A JP2019522344 A JP 2019522344A JP 6631752 B2 JP6631752 B2 JP 6631752B2
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photosensitive resin
resin composition
layer
semiconductor device
film
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Japanese (ja)
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JPWO2019044817A1 (ja
Inventor
咲子 鈴木
咲子 鈴木
雄大 山川
雄大 山川
泰典 高橋
泰典 高橋
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0755Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials For Photolithography (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2019522344A 2017-08-28 2018-08-28 ネガ型感光性樹脂組成物、半導体装置および電子機器 Active JP6631752B2 (ja)

Applications Claiming Priority (3)

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JP2017163704 2017-08-28
JP2017163704 2017-08-28
PCT/JP2018/031738 WO2019044817A1 (ja) 2017-08-28 2018-08-28 ネガ型感光性樹脂組成物、半導体装置および電子機器

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JP6631752B2 true JP6631752B2 (ja) 2020-01-15

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JP2019221885A Active JP6870724B2 (ja) 2017-08-28 2019-12-09 ネガ型感光性樹脂組成物、半導体装置および電子機器

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JP (2) JP6631752B2 (ko)
KR (2) KR20200087876A (ko)
CN (1) CN111033379A (ko)
TW (1) TWI768111B (ko)
WO (1) WO2019044817A1 (ko)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023286747A1 (ja) * 2021-07-16 2023-01-19 富士フイルム株式会社 電子デバイス及び電子デバイスの製造方法
WO2023286748A1 (ja) * 2021-07-16 2023-01-19 富士フイルム株式会社 電子デバイス及び電子デバイスの製造方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
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TW538092B (en) * 2001-05-24 2003-06-21 Ind Tech Res Inst Photo/thermo-curable resin composition
JP2003209104A (ja) 2002-01-15 2003-07-25 Hitachi Chemical Dupont Microsystems Ltd 半導体装置及びその材料
WO2005093514A1 (ja) * 2004-03-26 2005-10-06 Tokyo Ohka Kogyo Co., Ltd. 感光性樹脂組成物および該組成物を用いたパターン形成方法
CN1737072B (zh) * 2004-08-18 2011-06-08 播磨化成株式会社 导电粘合剂及使用该导电粘合剂制造物件的方法
JP4711208B2 (ja) * 2006-03-17 2011-06-29 山栄化学株式会社 感光性熱硬化性樹脂組成物、並びにレジスト膜被覆平滑化プリント配線基板及びその製造法。
CN101416111B (zh) * 2006-03-28 2012-07-04 富士胶片株式会社 感光性组合物及感光性薄膜、以及图案的形成方法及印制电路板
JP5465453B2 (ja) * 2009-03-26 2014-04-09 パナソニック株式会社 光導波路形成用エポキシ樹脂組成物、光導波路形成用硬化性フィルム、光伝送用フレキシブルプリント配線板、及び電子情報機器
JP5364460B2 (ja) * 2009-06-16 2013-12-11 株式会社デンソー 光硬化性エポキシ接着剤
JPWO2011086981A1 (ja) 2010-01-12 2013-05-20 旭硝子株式会社 ネガ型感光性樹脂組成物ならびにこれを用いた硬化膜および基板の製造方法
CN102162996B (zh) * 2010-02-16 2013-07-17 旭化成电子材料株式会社 负型感光性树脂组合物、固化浮雕图案的制造方法
TWI504681B (zh) * 2010-03-08 2015-10-21 Lintec Corp A hardening composition, a hardened product, and a hardening composition
JP5583467B2 (ja) * 2010-04-30 2014-09-03 パナソニック株式会社 金属張積層板、光電複合配線板、金属張積層板の製造方法、及び光電複合配線板の製造方法
TWI459051B (zh) 2012-03-01 2014-11-01 Chi Mei Corp 感光性樹脂組成物、黑色矩陣、彩色濾光片及其液晶顯示元件
JP6190805B2 (ja) * 2012-05-07 2017-08-30 旭化成株式会社 ネガ型感光性樹脂組成物、硬化レリーフパターンの製造方法、及び半導体装置
JP6237030B2 (ja) * 2013-09-18 2017-11-29 三菱ケミカル株式会社 硬化性樹脂組成物、硬化物及び積層体
KR102053369B1 (ko) * 2014-06-20 2019-12-06 오사카 유키가가쿠고교 가부시키가이샤 감광성 조성물 및 그 경화막
CN104241210A (zh) * 2014-09-29 2014-12-24 华进半导体封装先导技术研发中心有限公司 一种低成本超薄扇出型封装结构及其制作方法
WO2016125350A1 (ja) * 2015-02-03 2016-08-11 日立化成株式会社 エポキシ樹脂組成物、フィルム状エポキシ樹脂組成物、硬化物及び電子装置
JP6418248B2 (ja) 2015-09-30 2018-11-07 東レ株式会社 ネガ型感光性樹脂組成物、硬化膜、硬化膜を具備する素子及び表示装置、並びにその製造方法
JP6707854B2 (ja) 2015-12-18 2020-06-10 住友ベークライト株式会社 ポジ型感光性樹脂組成物、硬化膜、保護膜、絶縁膜および電子装置
US10745559B2 (en) * 2015-12-22 2020-08-18 Lintec Corporation Curable composition, method for producing curable composition, cured product, and use of curable composition
JP2018164072A (ja) 2017-03-27 2018-10-18 住友ベークライト株式会社 電子デバイスの製造方法、および、感光性接着剤樹脂組成物

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Publication number Publication date
JPWO2019044817A1 (ja) 2019-11-07
CN111033379A (zh) 2020-04-17
TWI768111B (zh) 2022-06-21
JP6870724B2 (ja) 2021-05-12
WO2019044817A1 (ja) 2019-03-07
JP2020060773A (ja) 2020-04-16
KR20200027032A (ko) 2020-03-11
TW201917489A (zh) 2019-05-01
KR102135599B1 (ko) 2020-07-20
KR20200087876A (ko) 2020-07-21

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