TWI761555B - 檢查系統 - Google Patents

檢查系統 Download PDF

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Publication number
TWI761555B
TWI761555B TW107124558A TW107124558A TWI761555B TW I761555 B TWI761555 B TW I761555B TW 107124558 A TW107124558 A TW 107124558A TW 107124558 A TW107124558 A TW 107124558A TW I761555 B TWI761555 B TW I761555B
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TW
Taiwan
Prior art keywords
inspection
inspected
unit
units
conveying
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TW107124558A
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English (en)
Chinese (zh)
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TW201909301A (zh
Inventor
小西顯太朗
鹿川大紀
藤原潤
Original Assignee
日商東京威力科創股份有限公司
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
    • G01J5/0007—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter of wafers or semiconductor substrates, e.g. using Rapid Thermal Processing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2648—Characterising semiconductor materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J2005/0077—Imaging
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/48—Thermography; Techniques using wholly visual means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Environmental & Geological Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Robotics (AREA)
TW107124558A 2017-07-19 2018-07-17 檢查系統 TWI761555B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017139936A JP6887332B2 (ja) 2017-07-19 2017-07-19 検査システム
JP2017-139936 2017-07-19

Publications (2)

Publication Number Publication Date
TW201909301A TW201909301A (zh) 2019-03-01
TWI761555B true TWI761555B (zh) 2022-04-21

Family

ID=65015135

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107124558A TWI761555B (zh) 2017-07-19 2018-07-17 檢查系統

Country Status (5)

Country Link
US (1) US11067624B2 (cg-RX-API-DMAC7.html)
JP (2) JP6887332B2 (cg-RX-API-DMAC7.html)
KR (1) KR102413295B1 (cg-RX-API-DMAC7.html)
TW (1) TWI761555B (cg-RX-API-DMAC7.html)
WO (1) WO2019017050A1 (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220206058A1 (en) * 2019-05-28 2022-06-30 Tokyo Electron Limited Transport system, inspection system, and inspection method

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018235411A1 (ja) * 2017-06-21 2018-12-27 東京エレクトロン株式会社 検査システム
TWI797461B (zh) * 2019-07-26 2023-04-01 日商新川股份有限公司 封裝裝置
CN113053774A (zh) * 2019-12-27 2021-06-29 迪科特测试科技(苏州)有限公司 探测装置
JP7390934B2 (ja) 2020-03-03 2023-12-04 東京エレクトロン株式会社 検査装置
JP6989734B1 (ja) * 2020-06-02 2022-01-05 川崎重工業株式会社 検査システム
EP4318246A4 (en) * 2021-03-23 2025-02-19 Kioxia Corporation STORAGE SYSTEM
JP7784890B2 (ja) * 2021-12-27 2025-12-12 東京エレクトロン株式会社 検査装置及び検査方法
JP2024020816A (ja) * 2022-08-02 2024-02-15 東京エレクトロン株式会社 検査システム
JP2025082689A (ja) * 2023-11-17 2025-05-29 東京エレクトロン株式会社 搬送システム、および搬送方法
JP7668407B1 (ja) * 2024-05-22 2025-04-24 川崎重工業株式会社 基板搬送システム
WO2025243755A1 (ja) * 2024-05-22 2025-11-27 川崎重工業株式会社 基板搬送システム

Citations (7)

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US20110037492A1 (en) * 2007-05-15 2011-02-17 Rudolph Technologies, Inc. Wafer probe test and inspection system
US20110316571A1 (en) * 2009-02-12 2011-12-29 Advantest Corporation Semiconductor wafer test apparatus
TW201415050A (zh) * 2012-06-06 2014-04-16 東京威力科創股份有限公司 晶圓檢查用介面及晶圓檢查裝置
US20140145742A1 (en) * 2012-11-29 2014-05-29 Advantest Corporation Probe apparatus and test apparatus
TW201428312A (zh) * 2012-10-09 2014-07-16 Tokyo Electron Ltd 探針卡安裝方法
TW201440162A (zh) * 2013-01-15 2014-10-16 東京威力科創股份有限公司 基板收納處理裝置、基板收納處理方法及基板收納處理用記憶媒體
TW201614250A (en) * 2014-08-20 2016-04-16 Tokyo Electron Ltd Wafer inspection apparatus

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JPS63229836A (ja) * 1987-03-19 1988-09-26 Nikon Corp ウエハ検査装置
JP2952331B2 (ja) 1990-04-05 1999-09-27 東京エレクトロン株式会社 プローブ装置
JP3312748B2 (ja) * 1992-06-05 2002-08-12 株式会社東京精密 ウエハ検査装置及びウエハ検査方法
JPH08335614A (ja) * 1995-06-08 1996-12-17 Tokyo Electron Ltd プロ−ブシステム
KR101138194B1 (ko) * 2007-06-29 2012-05-10 가부시키가이샤 어드밴티스트 시험 장치
KR100892756B1 (ko) 2007-12-27 2009-04-15 세메스 주식회사 기판 처리 장치 및 이를 이용한 기판 이송 방법
JP5139253B2 (ja) 2008-12-18 2013-02-06 東京エレクトロン株式会社 真空処理装置及び真空搬送装置
JP2011009362A (ja) * 2009-06-24 2011-01-13 Tokyo Electron Ltd インプリントシステム、インプリント方法、プログラム及びコンピュータ記憶媒体
JP6418394B2 (ja) * 2015-02-27 2018-11-07 株式会社東京精密 プローバ及びプローブカードのプリヒート方法
JP6652361B2 (ja) * 2015-09-30 2020-02-19 東京エレクトロン株式会社 ウエハ検査装置及びウエハ検査方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110037492A1 (en) * 2007-05-15 2011-02-17 Rudolph Technologies, Inc. Wafer probe test and inspection system
US20110316571A1 (en) * 2009-02-12 2011-12-29 Advantest Corporation Semiconductor wafer test apparatus
TW201415050A (zh) * 2012-06-06 2014-04-16 東京威力科創股份有限公司 晶圓檢查用介面及晶圓檢查裝置
TW201428312A (zh) * 2012-10-09 2014-07-16 Tokyo Electron Ltd 探針卡安裝方法
US20140145742A1 (en) * 2012-11-29 2014-05-29 Advantest Corporation Probe apparatus and test apparatus
TW201440162A (zh) * 2013-01-15 2014-10-16 東京威力科創股份有限公司 基板收納處理裝置、基板收納處理方法及基板收納處理用記憶媒體
TW201614250A (en) * 2014-08-20 2016-04-16 Tokyo Electron Ltd Wafer inspection apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220206058A1 (en) * 2019-05-28 2022-06-30 Tokyo Electron Limited Transport system, inspection system, and inspection method
US12013429B2 (en) * 2019-05-28 2024-06-18 Tokyo Electron Limited Transport system, inspection system, and inspection method

Also Published As

Publication number Publication date
JP2021119638A (ja) 2021-08-12
KR102413295B1 (ko) 2022-06-27
WO2019017050A1 (ja) 2019-01-24
JP6887332B2 (ja) 2021-06-16
TW201909301A (zh) 2019-03-01
JP2019021804A (ja) 2019-02-07
US20200158775A1 (en) 2020-05-21
KR20200033288A (ko) 2020-03-27
US11067624B2 (en) 2021-07-20

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