TWI755745B - 以Ag合金為主要成分的接點用材料， 使用該接點用材料的接點以及電子機器 - Google Patents

以Ag合金為主要成分的接點用材料， 使用該接點用材料的接點以及電子機器 Download PDF

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TWI755745B
TWI755745B TW109118060A TW109118060A TWI755745B TW I755745 B TWI755745 B TW I755745B TW 109118060 A TW109118060 A TW 109118060A TW 109118060 A TW109118060 A TW 109118060A TW I755745 B TWI755745 B TW I755745B
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alloy
oxide
weight
metal
less
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TW109118060A
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TW202046355A (zh
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田中純一
三角修一
森哲也
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日商歐姆龍股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/0005—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with at least one oxide and at least one of carbides, nitrides, borides or silicides as the main non-metallic constituents
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/001—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
    • C22C32/0015—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides with only single oxides as main non-metallic constituents
    • C22C32/0021—Matrix based on noble metals, Cu or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/0047—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents
    • C22C32/0052—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents only carbides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/023—Composite material having a noble metal as the basic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/023—Composite material having a noble metal as the basic material
    • H01H1/0233—Composite material having a noble metal as the basic material and containing carbides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/023—Composite material having a noble metal as the basic material
    • H01H1/0237—Composite material having a noble metal as the basic material and containing oxides
    • H01H1/02372—Composite material having a noble metal as the basic material and containing oxides containing as major components one or more oxides of the following elements only: Cd, Sn, Zn, In, Bi, Sb or Te
    • H01H1/02376—Composite material having a noble metal as the basic material and containing oxides containing as major components one or more oxides of the following elements only: Cd, Sn, Zn, In, Bi, Sb or Te containing as major component SnO2
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/027—Composite material containing carbon particles or fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10—Processes characterised by the sequence of their steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/023—Composite material having a noble metal as the basic material
    • H01H1/0237—Composite material having a noble metal as the basic material and containing oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/023—Composite material having a noble metal as the basic material
    • H01H1/0237—Composite material having a noble metal as the basic material and containing oxides
    • H01H2001/02378—Composite material having a noble metal as the basic material and containing oxides containing iron-oxide as major component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2300/00—Orthogonal indexing scheme relating to electric switches, relays, selectors or emergency protective devices covered by H01H
    • H01H2300/014—Application surgical instrument
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Composite Materials (AREA)
  • Contacts (AREA)
  • Powder Metallurgy (AREA)
TW109118060A 2019-05-31 2020-05-29 以Ag合金為主要成分的接點用材料， 使用該接點用材料的接點以及電子機器 TWI755745B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-102625 2019-05-31
JP2019102625 2019-05-31

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TW202046355A TW202046355A (zh) 2020-12-16
TWI755745B true TWI755745B (zh) 2022-02-21

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TW109118060A TWI755745B (zh) 2019-05-31 2020-05-29 以Ag合金為主要成分的接點用材料， 使用該接點用材料的接點以及電子機器

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US (1) US20220220580A1 (https=)
EP (1) EP3978638A4 (https=)
JP (1) JP7327476B2 (https=)
CN (1) CN113767182B (https=)
TW (1) TWI755745B (https=)
WO (1) WO2020241854A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022077654A (ja) * 2020-11-12 2022-05-24 オムロン株式会社 Ａｇ合金を主成分とする接点用材料、該接点用材料を用いた接点、及び電気機器
CN115216665B (zh) * 2022-06-29 2023-11-17 重庆科技学院 一种晶体振荡器合金电极及工艺
CN115565631B (zh) * 2022-10-27 2023-06-20 哈尔滨工业大学 一种基于第一性原理设计合金化改善铜抗氧化性的方法
CN115537594B (zh) * 2022-10-28 2023-04-25 台州慧模科技有限公司 一种银基电触头材料及其制备方法
CN115870498B (zh) * 2022-12-06 2024-08-06 浙江福达合金材料科技有限公司 一种提高片状银氧化锡电触头材料结合强度的制备方法
CN117004843B (zh) * 2023-08-08 2025-07-25 桂林金格电工电子材料科技有限公司 一种片状银碳化钨石墨覆铜触头材料的制备方法
CN118712067B (zh) * 2024-05-10 2025-05-06 深圳中宝新材科技有限公司 一种封装用银键合丝及其制备方法和应用
JP2026002119A (ja) * 2024-06-20 2026-01-08 オムロン株式会社 接点材料およびこれを用いたリレー

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JPH0257649A (ja) * 1989-06-21 1990-02-27 Chugai Electric Ind Co Ltd ビスマスを含む選択内部酸化した銀一錫系合金の電気接点材料
JPH03215638A (ja) * 1990-01-22 1991-09-20 Tokuriki Honten Co Ltd 銀―酸化物系の接点材料
JPH06136472A (ja) * 1992-10-21 1994-05-17 Chugai Electric Ind Co Ltd Ａｇ−Ｓｎ−Ｉｎ系合金の内部酸化電気接点材料
KR20110054625A (ko) * 2009-11-18 2011-05-25 희성금속 주식회사 마그네트 스위치 및 저압 차단기용 전기접점소재 및 그의 제조방법
JP2015125936A (ja) * 2013-12-26 2015-07-06 株式会社徳力本店 電気接点
CN108411135A (zh) * 2018-02-02 2018-08-17 东北大学 一种银镁镍合金带（片）、丝材的制备方法

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CA1020375A (en) * 1973-07-20 1977-11-08 Chugai Denki Kogyo Kabushiki-Kaisha Electrical contact material
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JPS598010B2 (ja) 1977-06-01 1984-02-22 住友電気工業株式会社 電気接点材料および製造方法
JPS5521561A (en) * 1978-08-02 1980-02-15 Tanaka Kikinzoku Kogyo Kk Electric contact material
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CN102294485B (zh) * 2011-08-25 2013-01-30 哈尔滨东大高新材料股份有限公司 复合电接触材料及其制备方法
JP6343447B2 (ja) * 2013-12-26 2018-06-13 株式会社徳力本店 電気接点材料およびその製造方法
CN107385254B (zh) * 2017-06-28 2019-09-24 刘艺飞 一种纤维丝型银基电接触材料的制备方法
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Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0257649A (ja) * 1989-06-21 1990-02-27 Chugai Electric Ind Co Ltd ビスマスを含む選択内部酸化した銀一錫系合金の電気接点材料
JPH03215638A (ja) * 1990-01-22 1991-09-20 Tokuriki Honten Co Ltd 銀―酸化物系の接点材料
JPH06136472A (ja) * 1992-10-21 1994-05-17 Chugai Electric Ind Co Ltd Ａｇ−Ｓｎ−Ｉｎ系合金の内部酸化電気接点材料
KR20110054625A (ko) * 2009-11-18 2011-05-25 희성금속 주식회사 마그네트 스위치 및 저압 차단기용 전기접점소재 및 그의 제조방법
JP2015125936A (ja) * 2013-12-26 2015-07-06 株式会社徳力本店 電気接点
CN108411135A (zh) * 2018-02-02 2018-08-17 东北大学 一种银镁镍合金带（片）、丝材的制备方法

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Publication number Publication date
TW202046355A (zh) 2020-12-16
JP7327476B2 (ja) 2023-08-16
US20220220580A1 (en) 2022-07-14
JPWO2020241854A1 (https=) 2020-12-03
EP3978638A1 (en) 2022-04-06
WO2020241854A1 (ja) 2020-12-03
CN113767182A (zh) 2021-12-07
CN113767182B (zh) 2023-03-24
EP3978638A4 (en) 2023-09-06

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