TWI753144B - 硬化性組成物及構造物 - Google Patents

硬化性組成物及構造物 Download PDF

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Publication number
TWI753144B
TWI753144B TW107110650A TW107110650A TWI753144B TW I753144 B TWI753144 B TW I753144B TW 107110650 A TW107110650 A TW 107110650A TW 107110650 A TW107110650 A TW 107110650A TW I753144 B TWI753144 B TW I753144B
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TW
Taiwan
Prior art keywords
component
group
meth
curable composition
compound
Prior art date
Application number
TW107110650A
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English (en)
Chinese (zh)
Other versions
TW201900733A (zh
Inventor
田村賢
Original Assignee
日商味之素股份有限公司
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Publication of TW201900733A publication Critical patent/TW201900733A/zh
Application granted granted Critical
Publication of TWI753144B publication Critical patent/TWI753144B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/40—Introducing phosphorus atoms or phosphorus-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
    • C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41—Compounds containing sulfur bound to oxygen
    • C08K5/42—Sulfonic acids; Derivatives thereof
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Epoxy Resins (AREA)
TW107110650A 2017-03-29 2018-03-28 硬化性組成物及構造物 TWI753144B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017066048 2017-03-29
JP2017-066048 2017-03-29

Publications (2)

Publication Number Publication Date
TW201900733A TW201900733A (zh) 2019-01-01
TWI753144B true TWI753144B (zh) 2022-01-21

Family

ID=63676216

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107110650A TWI753144B (zh) 2017-03-29 2018-03-28 硬化性組成物及構造物

Country Status (5)

Country Link
JP (1) JP7070552B2 (ja)
KR (1) KR102511665B1 (ja)
CN (1) CN110431168B (ja)
TW (1) TWI753144B (ja)
WO (1) WO2018181421A1 (ja)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7146409B2 (ja) * 2018-02-20 2022-10-04 ヘンケルジャパン株式会社 Ｕｖ熱硬化型接着剤組成物
CN113490725A (zh) * 2019-03-18 2021-10-08 三键有限公司 粘接剂组合物、固化物以及复合体
JPWO2020196819A1 (ja) 2019-03-27 2020-10-01
JP7345107B2 (ja) * 2019-04-15 2023-09-15 パナソニックＩｐマネジメント株式会社 光硬化性組成物
CN112745793A (zh) * 2019-10-31 2021-05-04 味之素株式会社 固化性组合物
JP7552221B2 (ja) 2019-10-31 2024-09-18 味の素株式会社 硬化性組成物
CN115003709B (zh) 2020-03-31 2023-09-29 株式会社艾迪科 化合物、化合物的制造方法及固化性组合物
CN112979867B (zh) * 2021-02-07 2023-07-21 中铝环保生态技术(湖南)有限公司 一种重金属巯基吸附材料及其制备方法
CN117616061A (zh) 2021-07-14 2024-02-27 纳美仕有限公司 固化性树脂组合物
JPWO2023286699A1 (ja) 2021-07-14 2023-01-19
JPWO2023286700A1 (ja) 2021-07-14 2023-01-19
WO2023167067A1 (ja) * 2022-03-01 2023-09-07 パナソニックＩｐマネジメント株式会社 硬化性組成物
CN117025102B (zh) * 2023-09-15 2024-10-18 广东德聚技术股份有限公司 一种用于摄像头模组的光热双重固化胶粘剂及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200914486A (en) * 2007-08-28 2009-04-01 Three Bond Co Ltd Photo-and heat-curable composition, cured product and curing method thereof
TW201514241A (zh) * 2013-09-05 2015-04-16 Sekisui Chemical Co Ltd 硬化性組合物及連接構造體

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JP3200481B2 (ja) * 1992-11-18 2001-08-20 ナミックス株式会社 液晶表示パネル用シール材及びそれを用いた液晶表示パネル
JP4652235B2 (ja) * 2003-11-26 2011-03-16 三井化学株式会社 １液型の光及び熱併用硬化性樹脂組成物及びその用途
US20070014018A1 (en) * 2004-12-30 2007-01-18 Wheatley John A Internal components of optical device comprising hardcoat
CN101379132B (zh) * 2006-03-10 2011-07-27 三菱化学株式会社 固化性组合物、滤色器以及液晶显示装置
US20090076180A1 (en) 2007-09-03 2009-03-19 Kazuki Iwaya Epoxy resin composition using latent curing agent and curable by photo and heat in combination
JP5121374B2 (ja) * 2007-09-28 2013-01-16 三井化学株式会社 液晶シール剤、それを用いた液晶表示パネルの製造方法、および液晶表示パネル
JP2009155589A (ja) * 2007-12-28 2009-07-16 Three Bond Co Ltd 硬化性組成物
JP2010039481A (ja) * 2008-07-11 2010-02-18 Sumitomo Chemical Co Ltd 感光性樹脂組成物
CN101625525B (zh) * 2008-07-11 2013-06-12 住友化学株式会社 感光性树脂组合物
JP4976575B1 (ja) * 2011-07-07 2012-07-18 ナミックス株式会社 樹脂組成物
JP6036703B2 (ja) * 2011-12-16 2016-11-30 株式会社スリーボンド 硬化性樹脂組成物
EP3130626B1 (en) * 2014-04-07 2019-03-06 Bridgestone Corporation Composition, adhesive, and laminate
JP6373181B2 (ja) * 2014-12-10 2018-08-15 日本化薬株式会社 液晶シール剤及びそれを用いた液晶表示セル
JP6447868B2 (ja) * 2014-12-22 2019-01-09 株式会社スリーボンド 嫌気硬化性接着剤
JP2016147962A (ja) * 2015-02-12 2016-08-18 三井化学株式会社 カメラモジュール用ポリエステル樹脂組成物、及びカメラモジュール
JP6774033B2 (ja) * 2015-08-18 2020-10-21 日産化学株式会社 反応性シルセスキオキサン化合物及び芳香族ビニル化合物を含む重合性組成物

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TW200914486A (en) * 2007-08-28 2009-04-01 Three Bond Co Ltd Photo-and heat-curable composition, cured product and curing method thereof
TW201514241A (zh) * 2013-09-05 2015-04-16 Sekisui Chemical Co Ltd 硬化性組合物及連接構造體

Also Published As

Publication number Publication date
TW201900733A (zh) 2019-01-01
KR20190130013A (ko) 2019-11-20
JPWO2018181421A1 (ja) 2020-02-06
WO2018181421A1 (ja) 2018-10-04
CN110431168B (zh) 2022-04-29
CN110431168A (zh) 2019-11-08
JP7070552B2 (ja) 2022-05-18
KR102511665B1 (ko) 2023-03-20

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