TWI752116B - 學習用支持裝置 - Google Patents

學習用支持裝置 Download PDF

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Publication number
TWI752116B
TWI752116B TW106139698A TW106139698A TWI752116B TW I752116 B TWI752116 B TW I752116B TW 106139698 A TW106139698 A TW 106139698A TW 106139698 A TW106139698 A TW 106139698A TW I752116 B TWI752116 B TW I752116B
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TW
Taiwan
Prior art keywords
posture
support portion
article
reference support
folded
Prior art date
Application number
TW106139698A
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English (en)
Chinese (zh)
Other versions
TW201825378A (zh
Inventor
堀井高宏
松尾研介
櫻井武司
Original Assignee
日商大福股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商大福股份有限公司 filed Critical 日商大福股份有限公司
Publication of TW201825378A publication Critical patent/TW201825378A/zh
Application granted granted Critical
Publication of TWI752116B publication Critical patent/TWI752116B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67733—Overhead conveying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Control And Safety Of Cranes (AREA)
TW106139698A 2016-12-27 2017-11-16 學習用支持裝置 TWI752116B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016253538A JP6601385B2 (ja) 2016-12-27 2016-12-27 学習用支持装置
JP2016-253538 2016-12-27

Publications (2)

Publication Number Publication Date
TW201825378A TW201825378A (zh) 2018-07-16
TWI752116B true TWI752116B (zh) 2022-01-11

Family

ID=62700487

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106139698A TWI752116B (zh) 2016-12-27 2017-11-16 學習用支持裝置

Country Status (4)

Country Link
JP (1) JP6601385B2 (ja)
KR (1) KR102378775B1 (ja)
CN (1) CN108242422B (ja)
TW (1) TWI752116B (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006290599A (ja) * 2005-04-14 2006-10-26 Murata Mach Ltd 天井走行車システム
CN101209774A (zh) * 2006-12-28 2008-07-02 日本阿西斯特技术株式会社 用于被输送物体的存储设备
JP2009225937A (ja) * 2008-03-21 2009-10-08 Yazaki Ind Chem Co Ltd 棚部を跳ね上げ可能なパイプ構造物
TW201233617A (en) * 2010-12-17 2012-08-16 Daifuku Kk Transport facility
JP2016172607A (ja) * 2015-03-16 2016-09-29 株式会社ダイフク 物品搬送設備及び検査用治具

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5132600Y2 (ja) * 1971-02-18 1976-08-13
JPS6216707A (ja) * 1985-07-17 1987-01-24 中村　一郎 壁面収納テ−ブル
JP3000190U (ja) * 1994-01-17 1994-08-02 曾 春 賢 折畳みブラケット
JP2000243693A (ja) * 1999-02-23 2000-09-08 Nikon Corp ステージ装置及び露光装置
JP4151002B2 (ja) * 2001-10-19 2008-09-17 株式会社ダイフク 吊下搬送設備とその学習装置
JP4277100B2 (ja) * 2002-11-14 2009-06-10 東京エレクトロン株式会社 搬送機構の基準位置補正装置及び基準位置補正方法
JP2005230047A (ja) * 2004-02-17 2005-09-02 Yamaha Corp 作業台
JP4688004B2 (ja) * 2008-04-22 2011-05-25 株式会社ダイフク 物品搬送装置
EP2305594B1 (en) * 2008-07-23 2015-04-08 Daifuku Co., Ltd. Learning device and learning method in article conveyance facility
JP5403358B2 (ja) * 2009-12-10 2014-01-29 株式会社ダイフク 物品保管設備
JP5429570B2 (ja) * 2010-03-08 2014-02-26 株式会社ダイフク 物品搬送設備
JP5590420B2 (ja) * 2011-12-21 2014-09-17 株式会社ダイフク 物品搬送設備
JP2014010018A (ja) * 2012-06-28 2014-01-20 Seiko Epson Corp ハンドラーおよび検査装置
JP6487266B2 (ja) * 2015-04-27 2019-03-20 日本電産サンキョー株式会社 製造システム

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006290599A (ja) * 2005-04-14 2006-10-26 Murata Mach Ltd 天井走行車システム
CN101209774A (zh) * 2006-12-28 2008-07-02 日本阿西斯特技术株式会社 用于被输送物体的存储设备
JP2009225937A (ja) * 2008-03-21 2009-10-08 Yazaki Ind Chem Co Ltd 棚部を跳ね上げ可能なパイプ構造物
TW201233617A (en) * 2010-12-17 2012-08-16 Daifuku Kk Transport facility
JP2016172607A (ja) * 2015-03-16 2016-09-29 株式会社ダイフク 物品搬送設備及び検査用治具

Also Published As

Publication number Publication date
TW201825378A (zh) 2018-07-16
KR102378775B1 (ko) 2022-03-24
CN108242422B (zh) 2023-04-11
KR20180076300A (ko) 2018-07-05
JP6601385B2 (ja) 2019-11-06
CN108242422A (zh) 2018-07-03
JP2018104150A (ja) 2018-07-05

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