TWI740367B - 多銷構造探針體及探針卡 - Google Patents

多銷構造探針體及探針卡 Download PDF

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Publication number
TWI740367B
TWI740367B TW109103448A TW109103448A TWI740367B TW I740367 B TWI740367 B TW I740367B TW 109103448 A TW109103448 A TW 109103448A TW 109103448 A TW109103448 A TW 109103448A TW I740367 B TWI740367 B TW I740367B
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TW
Taiwan
Prior art keywords
probe
substrate
contact
pin structure
electrical contact
Prior art date
Application number
TW109103448A
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English (en)
Chinese (zh)
Other versions
TW202043778A (zh
Inventor
水谷正吾
Original Assignee
日商日本麥克隆尼股份有限公司
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Application filed by 日商日本麥克隆尼股份有限公司 filed Critical 日商日本麥克隆尼股份有限公司
Publication of TW202043778A publication Critical patent/TW202043778A/zh
Application granted granted Critical
Publication of TWI740367B publication Critical patent/TWI740367B/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06744—Microprobes, i.e. having dimensions as IC details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW109103448A 2019-03-29 2020-02-05 多銷構造探針體及探針卡 TWI740367B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-065830 2019-03-29
JP2019065830A JP7292921B2 (ja) 2019-03-29 2019-03-29 多ピン構造プローブ体及びプローブカード

Publications (2)

Publication Number Publication Date
TW202043778A TW202043778A (zh) 2020-12-01
TWI740367B true TWI740367B (zh) 2021-09-21

Family

ID=72673132

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109103448A TWI740367B (zh) 2019-03-29 2020-02-05 多銷構造探針體及探針卡

Country Status (4)

Country Link
JP (1) JP7292921B2 (enrdf_load_stackoverflow)
KR (1) KR102241018B1 (enrdf_load_stackoverflow)
CN (1) CN111751586B (enrdf_load_stackoverflow)
TW (1) TWI740367B (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022187216A (ja) * 2021-06-07 2022-12-19 株式会社日本マイクロニクス プローブ
CN116008618B (zh) * 2021-10-22 2025-08-26 台湾中华精测科技股份有限公司 悬臂式探针结构
TWI792995B (zh) * 2022-04-29 2023-02-11 中華精測科技股份有限公司 懸臂式探針卡裝置及其對焦型探針
JP2024061087A (ja) * 2022-10-21 2024-05-07 株式会社日本マイクロニクス 電気的接触子、電気的接続構造及び電気的接続装置
KR102791729B1 (ko) * 2022-12-26 2025-04-08 주식회사 코리아 인스트루먼트 본딩 안정성이 개선된 프로브

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW312826B (en) * 1996-02-21 1997-08-11 Formfactor Inc Contact carriers (tiles) for populating larger substrates with spring contacts
TW558856B (en) * 2000-11-09 2003-10-21 Formfactor Inc Lithographic type microelectronic spring structures with improved contours
TW200530592A (en) * 2004-01-16 2005-09-16 Nihon Micronics Kk Electric connecting device and contactor
JP2009063395A (ja) * 2007-09-06 2009-03-26 Japan Electronic Materials Corp プローブの交換方法及びプローブカード
TW201324983A (zh) * 2011-10-21 2013-06-16 Dai Ichi Seiko Co Ltd 附開關之同軸連接器
TW201333479A (zh) * 2011-12-20 2013-08-16 Nihon Micronics Kk 探針組合體及含有該探針組合體之探針卡以及其製造方法

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JP3675989B2 (ja) * 1995-11-17 2005-07-27 株式会社テセック 電子部品用コネクタ
JP3307823B2 (ja) * 1996-02-23 2002-07-24 松下電器産業株式会社 電子部品検査用接触体の製造方法
TW364060B (en) * 1996-06-28 1999-07-11 Mitsubishi Materials Corp Contact probe for liquid crystal display test and liquid crystal display test device having the same
US6121058A (en) 1998-01-02 2000-09-19 Intel Corporation Method for removing accumulated solder from probe card probing features
US6535003B2 (en) * 1999-01-29 2003-03-18 Advantest, Corp. Contact structure having silicon finger contactor
KR200217760Y1 (ko) * 1999-03-11 2001-03-15 이채윤 칩 테스트용 컨넥터
JP2006064676A (ja) * 2004-08-30 2006-03-09 Tokyo Electron Ltd プローブ針、プローブ針の製造方法および三次元立体構造の製造方法
KR20060124562A (ko) * 2005-05-31 2006-12-05 가부시키가이샤 니혼 마이크로닉스 통전시험용 프로브
JP4936275B2 (ja) * 2006-04-06 2012-05-23 軍生 木本 接触子組立体
KR100753555B1 (ko) 2006-05-29 2007-08-31 (주)엠투엔 프로브 카드의 프로브
JP4522975B2 (ja) * 2006-06-19 2010-08-11 東京エレクトロン株式会社 プローブカード
JP5077735B2 (ja) * 2006-08-07 2012-11-21 軍生 木本 複数梁合成型接触子組立
JP5113392B2 (ja) * 2007-01-22 2013-01-09 株式会社日本マイクロニクス プローブおよびそれを用いた電気的接続装置
JP2008203036A (ja) * 2007-02-19 2008-09-04 Micronics Japan Co Ltd 電気的接続装置
KR101369406B1 (ko) * 2008-01-21 2014-03-04 (주) 미코에스앤피 탐침 구조물 및 이를 갖는 전기적 검사 장치
KR100825266B1 (ko) * 2008-02-15 2008-04-25 주식회사 파이컴 초소형 프로브 구조체
KR100980369B1 (ko) * 2008-06-10 2010-09-06 (주) 마이크로프랜드 프로브 카드의 프로브 니들 구조체와 그 제조 방법
JP2009300170A (ja) 2008-06-11 2009-12-24 Japan Electronic Materials Corp プローブ、及びプローブカード
JP2010054487A (ja) * 2008-08-26 2010-03-11 Isao Kimoto プローバ装置
JP2010266248A (ja) 2009-05-12 2010-11-25 Japan Electronic Materials Corp プローブカードに実装されるプローブおよびプローブを複数実装したプローブカード
KR200454211Y1 (ko) * 2009-06-22 2011-06-21 (주)티에스이 가이드 구조물을 갖는 프로브 조립체
WO2011024303A1 (ja) 2009-08-31 2011-03-03 株式会社アドバンテスト プローブ、プローブカード及び電子部品試験装置
JP5968158B2 (ja) * 2012-08-10 2016-08-10 株式会社日本マイクロニクス コンタクトプローブ及びプローブカード
JP2014191960A (ja) 2013-03-27 2014-10-06 Kaga Electronics Co Ltd コンタクトピン、コンタクト組立体、カメラボディ、および交換レンズ
US10908182B2 (en) * 2016-06-28 2021-02-02 Kabushiki Kaisha Nihon Micronics Electrical connecting apparatus and contact

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW312826B (en) * 1996-02-21 1997-08-11 Formfactor Inc Contact carriers (tiles) for populating larger substrates with spring contacts
TW558856B (en) * 2000-11-09 2003-10-21 Formfactor Inc Lithographic type microelectronic spring structures with improved contours
TW200530592A (en) * 2004-01-16 2005-09-16 Nihon Micronics Kk Electric connecting device and contactor
JP2009063395A (ja) * 2007-09-06 2009-03-26 Japan Electronic Materials Corp プローブの交換方法及びプローブカード
TW201324983A (zh) * 2011-10-21 2013-06-16 Dai Ichi Seiko Co Ltd 附開關之同軸連接器
TW201333479A (zh) * 2011-12-20 2013-08-16 Nihon Micronics Kk 探針組合體及含有該探針組合體之探針卡以及其製造方法

Also Published As

Publication number Publication date
KR20200115132A (ko) 2020-10-07
TW202043778A (zh) 2020-12-01
JP7292921B2 (ja) 2023-06-19
KR102241018B1 (ko) 2021-04-16
CN111751586A (zh) 2020-10-09
JP2020165774A (ja) 2020-10-08
CN111751586B (zh) 2023-11-03

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