TWI735685B - 黏著帶接合方法及黏著帶接合裝置 - Google Patents

黏著帶接合方法及黏著帶接合裝置 Download PDF

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Publication number
TWI735685B
TWI735685B TW106135605A TW106135605A TWI735685B TW I735685 B TWI735685 B TW I735685B TW 106135605 A TW106135605 A TW 106135605A TW 106135605 A TW106135605 A TW 106135605A TW I735685 B TWI735685 B TW I735685B
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TW
Taiwan
Prior art keywords
tape
adhesive tape
separation
adhesive
raw material
Prior art date
Application number
TW106135605A
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English (en)
Chinese (zh)
Other versions
TW201829277A (zh
Inventor
奧野長平
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW201829277A publication Critical patent/TW201829277A/zh
Application granted granted Critical
Publication of TWI735685B publication Critical patent/TWI735685B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Replacement Of Web Rolls (AREA)
  • Adhesive Tapes (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW106135605A 2017-02-08 2017-10-18 黏著帶接合方法及黏著帶接合裝置 TWI735685B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017021200A JP6833541B2 (ja) 2017-02-08 2017-02-08 粘着テープ接合方法および粘着テープ接合装置
JP2017-021200 2017-02-08

Publications (2)

Publication Number Publication Date
TW201829277A TW201829277A (zh) 2018-08-16
TWI735685B true TWI735685B (zh) 2021-08-11

Family

ID=63096391

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106135605A TWI735685B (zh) 2017-02-08 2017-10-18 黏著帶接合方法及黏著帶接合裝置

Country Status (4)

Country Link
JP (1) JP6833541B2 (ja)
KR (1) KR102455403B1 (ja)
CN (1) CN108400104A (ja)
TW (1) TWI735685B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7344647B2 (ja) * 2019-02-18 2023-09-14 株式会社ディスコ テープ貼着装置
JP6769689B1 (ja) * 2019-06-28 2020-10-14 東芝三菱電機産業システム株式会社 剥離把持装置、剥離検査装置及び超音波振動接合システム
WO2023013723A1 (ja) * 2021-08-06 2023-02-09 株式会社タカトリ シート接続装置、シート接続方法及びシート交換システム
CN114275585A (zh) * 2021-12-30 2022-04-05 潍坊路加精工有限公司 一种料卷自动供料设备

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0819610B1 (en) * 1995-02-14 1999-11-10 Tokyo Automatic Machinery Works Limited Tear tape changer
EP1127821B1 (en) * 2000-02-23 2005-05-11 Shikoku Kakoki Co., Ltd. Film roll connecting device and method
JP2007331861A (ja) * 2006-06-13 2007-12-27 Iinuma Gauge Seisakusho:Kk テープ作業自動化装置、テープを貼り付ける方法及びテープを剥がす方法
TW201114673A (en) * 2009-10-20 2011-05-01 Fujifilm Corp Web joint device, web joint method and manufacturing method of functional films
WO2014086891A1 (de) * 2012-12-04 2014-06-12 Dieffenbacher GmbH Maschinen- und Anlagenbau Verfahren und system zum zuführen von material zu einem auflegemaschine
JP2016108083A (ja) * 2014-12-05 2016-06-20 トヨタ自動車株式会社 熱転写方法およびシートロール交換方法
CN205739631U (zh) * 2016-06-30 2016-11-30 珠海华冠科技股份有限公司 隔膜自动换卷装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2716482B2 (ja) * 1988-10-31 1998-02-18 川崎油工株式会社 Ｓｍｃシート連続自動供給装置及びその構成装置
JP2750321B2 (ja) * 1992-09-22 1998-05-13 ソマール株式会社 ラミネータ用フィルムの交換時接続方法
JP3517195B2 (ja) * 2000-09-21 2004-04-05 池田機械産業株式会社 粘着テープの接続装置及びその方法
JP4073257B2 (ja) * 2002-06-04 2008-04-09 株式会社フジシールインターナショナル 筒状フィルム送出装置
WO2011070820A1 (ja) * 2009-12-09 2011-06-16 住友化学株式会社 光学表示装置の製造システムおよび当該光学表示装置の製造方法
JP2014133616A (ja) 2013-01-09 2014-07-24 Nitto Denko Corp 粘着テープ接合方法および粘着テープ接合装置
JP6247075B2 (ja) * 2013-10-30 2017-12-13 日東電工株式会社 保護テープ剥離方法および保護テープ剥離装置
JP6063408B2 (ja) * 2014-03-17 2017-01-18 Ｊｘエネルギー株式会社 フィルム搬送装置
CN105198236B (zh) * 2014-06-26 2019-04-02 日东电工株式会社 光学膜连续供给装置及光学膜连续供给方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0819610B1 (en) * 1995-02-14 1999-11-10 Tokyo Automatic Machinery Works Limited Tear tape changer
EP1127821B1 (en) * 2000-02-23 2005-05-11 Shikoku Kakoki Co., Ltd. Film roll connecting device and method
JP2007331861A (ja) * 2006-06-13 2007-12-27 Iinuma Gauge Seisakusho:Kk テープ作業自動化装置、テープを貼り付ける方法及びテープを剥がす方法
TW201114673A (en) * 2009-10-20 2011-05-01 Fujifilm Corp Web joint device, web joint method and manufacturing method of functional films
WO2014086891A1 (de) * 2012-12-04 2014-06-12 Dieffenbacher GmbH Maschinen- und Anlagenbau Verfahren und system zum zuführen von material zu einem auflegemaschine
JP2016108083A (ja) * 2014-12-05 2016-06-20 トヨタ自動車株式会社 熱転写方法およびシートロール交換方法
CN205739631U (zh) * 2016-06-30 2016-11-30 珠海华冠科技股份有限公司 隔膜自动换卷装置

Also Published As

Publication number Publication date
CN108400104A (zh) 2018-08-14
JP6833541B2 (ja) 2021-02-24
KR20180092264A (ko) 2018-08-17
JP2018127323A (ja) 2018-08-16
TW201829277A (zh) 2018-08-16
KR102455403B1 (ko) 2022-10-14

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