KR102455403B1 - 점착 테이프 접합 방법, 점착 테이프 접합 장치 및 점착 테이프 반송 방법 - Google Patents

점착 테이프 접합 방법, 점착 테이프 접합 장치 및 점착 테이프 반송 방법 Download PDF

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Publication number
KR102455403B1
KR102455403B1 KR1020170165140A KR20170165140A KR102455403B1 KR 102455403 B1 KR102455403 B1 KR 102455403B1 KR 1020170165140 A KR1020170165140 A KR 1020170165140A KR 20170165140 A KR20170165140 A KR 20170165140A KR 102455403 B1 KR102455403 B1 KR 102455403B1
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KR
South Korea
Prior art keywords
adhesive tape
tape
separator
holding
bonding
Prior art date
Application number
KR1020170165140A
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English (en)
Korean (ko)
Other versions
KR20180092264A (ko
Inventor
쵸헤이 오쿠노
Original Assignee
닛토덴코 가부시키가이샤
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Publication of KR20180092264A publication Critical patent/KR20180092264A/ko
Application granted granted Critical
Publication of KR102455403B1 publication Critical patent/KR102455403B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Replacement Of Web Rolls (AREA)
  • Adhesive Tapes (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020170165140A 2017-02-08 2017-12-04 점착 테이프 접합 방법, 점착 테이프 접합 장치 및 점착 테이프 반송 방법 KR102455403B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017021200A JP6833541B2 (ja) 2017-02-08 2017-02-08 粘着テープ接合方法および粘着テープ接合装置
JPJP-P-2017-021200 2017-02-08

Publications (2)

Publication Number Publication Date
KR20180092264A KR20180092264A (ko) 2018-08-17
KR102455403B1 true KR102455403B1 (ko) 2022-10-14

Family

ID=63096391

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170165140A KR102455403B1 (ko) 2017-02-08 2017-12-04 점착 테이프 접합 방법, 점착 테이프 접합 장치 및 점착 테이프 반송 방법

Country Status (4)

Country Link
JP (1) JP6833541B2 (ja)
KR (1) KR102455403B1 (ja)
CN (1) CN108400104A (ja)
TW (1) TWI735685B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7344647B2 (ja) * 2019-02-18 2023-09-14 株式会社ディスコ テープ貼着装置
JP6769689B1 (ja) * 2019-06-28 2020-10-14 東芝三菱電機産業システム株式会社 剥離把持装置、剥離検査装置及び超音波振動接合システム
WO2023013723A1 (ja) * 2021-08-06 2023-02-09 株式会社タカトリ シート接続装置、シート接続方法及びシート交換システム
CN114275585A (zh) * 2021-12-30 2022-04-05 潍坊路加精工有限公司 一种料卷自动供料设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002096952A (ja) 2000-09-21 2002-04-02 Ikeda Kikai Sangyo Kk 粘着テープの接続装置及びその方法
JP2004010211A (ja) 2002-06-04 2004-01-15 Fuji Seal Inc 筒状フィルム送出装置
JP2007331861A (ja) * 2006-06-13 2007-12-27 Iinuma Gauge Seisakusho:Kk テープ作業自動化装置、テープを貼り付ける方法及びテープを剥がす方法
JP2015174745A (ja) 2014-03-17 2015-10-05 Ｊｘ日鉱日石エネルギー株式会社 フィルム搬送装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2716482B2 (ja) * 1988-10-31 1998-02-18 川崎油工株式会社 Ｓｍｃシート連続自動供給装置及びその構成装置
JP2750321B2 (ja) * 1992-09-22 1998-05-13 ソマール株式会社 ラミネータ用フィルムの交換時接続方法
JP3690830B2 (ja) * 1995-02-14 2005-08-31 株式会社東京自働機械製作所 開封テープ交換装置
JP2001233514A (ja) * 2000-02-23 2001-08-28 Shikoku Kakoki Co Ltd ロールフィルム接続装置およびその方法
JP5437771B2 (ja) * 2009-10-20 2014-03-12 富士フイルム株式会社 ウェブの接合装置、ウェブの接合方法、および機能性フィルムの製造方法
WO2011070820A1 (ja) * 2009-12-09 2011-06-16 住友化学株式会社 光学表示装置の製造システムおよび当該光学表示装置の製造方法
EP2928802A1 (de) * 2012-12-04 2015-10-14 DIEFFENBACHER GMBH Maschinen- und Anlagenbau Verfahren und system zum zuführen von material zu einer auflegemaschine mit einem spleissmechanismus
JP2014133616A (ja) 2013-01-09 2014-07-24 Nitto Denko Corp 粘着テープ接合方法および粘着テープ接合装置
JP6247075B2 (ja) * 2013-10-30 2017-12-13 日東電工株式会社 保護テープ剥離方法および保護テープ剥離装置
CN105198236B (zh) * 2014-06-26 2019-04-02 日东电工株式会社 光学膜连续供给装置及光学膜连续供给方法
JP6225890B2 (ja) * 2014-12-05 2017-11-08 トヨタ自動車株式会社 熱転写方法およびシートロール交換方法
CN205739631U (zh) * 2016-06-30 2016-11-30 珠海华冠科技股份有限公司 隔膜自动换卷装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002096952A (ja) 2000-09-21 2002-04-02 Ikeda Kikai Sangyo Kk 粘着テープの接続装置及びその方法
JP2004010211A (ja) 2002-06-04 2004-01-15 Fuji Seal Inc 筒状フィルム送出装置
JP2007331861A (ja) * 2006-06-13 2007-12-27 Iinuma Gauge Seisakusho:Kk テープ作業自動化装置、テープを貼り付ける方法及びテープを剥がす方法
JP2015174745A (ja) 2014-03-17 2015-10-05 Ｊｘ日鉱日石エネルギー株式会社 フィルム搬送装置

Also Published As

Publication number Publication date
CN108400104A (zh) 2018-08-14
JP6833541B2 (ja) 2021-02-24
TWI735685B (zh) 2021-08-11
KR20180092264A (ko) 2018-08-17
JP2018127323A (ja) 2018-08-16
TW201829277A (zh) 2018-08-16

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