WO2023013723A1 - シート接続装置、シート接続方法及びシート交換システム - Google Patents
シート接続装置、シート接続方法及びシート交換システム Download PDFInfo
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- WO2023013723A1 WO2023013723A1 PCT/JP2022/029904 JP2022029904W WO2023013723A1 WO 2023013723 A1 WO2023013723 A1 WO 2023013723A1 JP 2022029904 W JP2022029904 W JP 2022029904W WO 2023013723 A1 WO2023013723 A1 WO 2023013723A1
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- Prior art keywords
- sheet
- adhesive
- end portion
- adhesive sheet
- supply direction
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- 238000000034 method Methods 0.000 title claims description 30
- 239000000853 adhesive Substances 0.000 claims abstract description 254
- 230000001070 adhesive effect Effects 0.000 claims abstract description 254
- 238000005520 cutting process Methods 0.000 claims abstract description 32
- 238000003466 welding Methods 0.000 claims abstract description 10
- 230000001681 protective effect Effects 0.000 claims description 39
- 238000011144 upstream manufacturing Methods 0.000 claims description 36
- 239000004065 semiconductor Substances 0.000 claims description 35
- 238000000926 separation method Methods 0.000 claims description 22
- 239000003463 adsorbent Substances 0.000 claims description 10
- 239000004744 fabric Substances 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 9
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 39
- 239000000463 material Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 6
- 238000001179 sorption measurement Methods 0.000 description 6
- 239000002390 adhesive tape Substances 0.000 description 5
- 239000010410 layer Substances 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000012840 feeding operation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H19/00—Changing the web roll
- B65H19/10—Changing the web roll in unwinding mechanisms or in connection with unwinding operations
- B65H19/18—Attaching, e.g. pasting, the replacement web to the expiring web
Definitions
- the present invention relates to a seat connecting device, a seat connecting method, and a seat changing system. More particularly, the present invention relates to a sheet connecting device and a sheet connecting method for connecting a sticking sheet such as a protective sheet stuck to a semiconductor wafer or the like to another sticking sheet. The present invention also relates to a sheet exchange system for exchanging one patch sheet for another patch sheet.
- a protective sheet also called B/G tape
- a dicing tape is attached to the dicing frame and the semiconductor wafer when chipping the semiconductor wafer.
- a dry film resist may be applied to the back surface of a semiconductor wafer.
- Various sheet sticking apparatuses are used for sticking the protective sheet, the dicing tape, the dry film resist, and the like.
- the protective sheet, the dicing tape, and the dry film resist are supplied, for example, as a roll-shaped raw material. Therefore, after the sheets are used up, the operator must remove the old roll of raw material and replace it with a new roll of raw material.
- the exchanging work takes time.
- it is necessary to stop the production of semiconductor wafers during the replacement work which causes a problem of cost.
- the replacement work time varies depending on whether the worker is a skilled worker or an unskilled worker who is not accustomed to the work, and the replacement work time varies depending on the worker.
- a sheet wider than the outer diameter of the semiconductor wafer is used. Therefore, it is considered that a relatively large tensile force is required to pull out the sheet from the raw material. In other words, unless the sheets are securely connected, there is a risk that the connected sheets may come off in the middle and be separated. In particular, recently, the diameter of semiconductor wafers has increased (for example, 300 mm or more), and the above problem has become conspicuous.
- a sheet connecting device provided to solve the above-described problems is a sticking sheet formed by superposing a release sheet on at least the sticking surface side of a sticking sheet, and a second sticking sheet arranged on the upstream side in the supply direction.
- the cut portion can form a connected end portion by cutting the second adhesive sheet in the width direction that intersects with the supply direction, and the pair of
- connection end portion can be inserted into the separating portion by feeding the connecting portion, and the connecting portion is configured to connect the connecting end portion and the connected end portion in a state in which the connected end portion is inserted into the connecting end portion. It is characterized by connecting the connection ends by adhesion or welding.
- the above-described sheet connecting device is configured such that the connection end portion of the first patch sheet and the connected end portion of the second patch sheet are connected in a state in which the second patch sheet is temporarily connected and held by the first patch sheet by temporary connection.
- the parts can be welded and connected by heating.
- the sheet connecting device described above can accurately and reliably connect the connecting end portion and the connected end portion.
- the sheet connecting device described above can be connected by adhering to the connected end portion of the second sticking sheet with an adhesive. In this manner, the sheet connecting device described above can accurately and reliably connect the connecting end portion and the connected end portion.
- the connecting portion connects the release sheet at the connecting end portion and the release sheet at the connected end portion by heating and welding each of them. Good.
- the release sheet at the connecting end and the release sheet at the connected end can be reliably connected. Therefore, it is possible to prevent the first patch sheet and the second patch sheet that are connected from coming off during supply. In addition, since there is no need to separately prepare an attachment member for connection, an increase in cost can be suppressed.
- the connecting portion connects the release sheet at the connecting end portion and the release sheet at the connected end portion by applying an adhesive to each of the release sheets.
- the release sheet at the connecting end and the release sheet at the connected end can be reliably connected. Therefore, it is possible to prevent the first patch sheet and the second patch sheet that are connected from coming off during supply.
- the pair of adhesive rollers feeds the first sticking sheet and the second sticking sheet from the downstream side in the supply direction to the upstream side, thereby It is preferable that the connection end into which the portion is inserted can be press-contacted.
- the cutting portion is arranged on the side of the release sheet and on the side of the adhesive sheet, and is arranged to face the cutter.
- the adsorber is capable of adsorbing and holding the second patch sheet along the width direction, and forms a cutter groove along the width direction at a position facing the cutter. Good to have.
- the second patch sheet can be cut along the width direction while the second patch sheet is held by suction with the adsorbent. Therefore, the end to be connected formed at the end of the second patch sheet can be formed with high accuracy, and the connection with the connection end can be performed with high accuracy. Therefore, it is possible to expect the effect of suppressing the disconnection of the connection end and the connected end after connection.
- the adhesive sheet may be a protective sheet for protecting the surface of a semiconductor wafer, a dicing tape used for dicing a semiconductor wafer, or a dry film resist.
- a protective sheet (also referred to as protective tape or BG tape) for protecting the surface of a semiconductor wafer, a dicing tape used for dicing a conductor wafer, or a sheet connecting device suitable for connecting dry film resist is provided.
- BG tape protective tape
- a dicing tape used for dicing a conductor wafer or a sheet connecting device suitable for connecting dry film resist.
- the concave-convex roller rolls on the surface of the first adhesive sheet to facilitate separation into the adhesive sheet and the release sheet.
- the above-described sheet connecting method of the present invention includes a first adhesive sheet, which is an adhesive sheet in which a release sheet is superimposed on at least the adhesive surface side of the adhesive sheet, and which is disposed on the upstream side in the supply direction; A sheet connecting method for connecting a second patching sheet arranged downstream in the supply direction with respect to the patching sheet along the supply direction, wherein the second patching sheet is cut in the width direction to form a raw sheet and a downstream side in the supply direction, and forming a connected end portion on one end side of the downstream side in the supply direction; A step of supplying a first patch sheet, and feeding the first patch sheet from the upstream side in the supply direction to the downstream side while sandwiching the connection end portion of the first patch sheet with a pair of adhesive rollers, whereby the connection end portion of the adhesive sheet is fed.
- the second attached sheet cutting step can divide the second attached sheet into two to form the connected end on the downstream side in the supply direction. Therefore, it is not necessary for the operator to cut the second sticking sheet directly, and it is possible to form the connected ends with high precision regardless of the skill level of the operator.
- the separating portion can be formed at the connecting end portion of the first attaching sheet by the first attaching sheet supplying step and the separating portion forming step. Therefore, the first patch sheet can be supplied to the subsequent sheet connecting step by a simple operation of supplying the connecting end portion, which is the front end side of the first patch sheet, between the pair of adhesive rollers.
- the connected end portion of the second attached sheet in the sheet inserting step, can be inserted into the separation portion formed at the connecting end portion of the first attached sheet.
- the adhesive surface of the release sheet of the separation portion is attached to the non-adhesive surface of the release sheet at the connected end portion of the second attachment sheet. That is, the connecting end and the connected end are temporarily connected.
- the temporarily connected connecting end portion and the connected end portion are sandwiched by a pair of adhesive rollers. As a result, the connected end portion is reliably held by the connecting end portion.
- the connection cost since there is no need to separately prepare an attaching member for connection or the like, and the connection cost can be reduced, the cost can be reduced. Therefore, with the above arrangement, it is possible to provide a sheet connecting method that is particularly suitable for replacing the adhesive sheet.
- the connecting end portion and the connected end portion can be reliably connected by thermocompression. Therefore, it is possible to prevent the first patch sheet and the second patch sheet that are connected from coming off during supply. In addition, since there is no need to separately prepare an attachment member for connection, an increase in cost can be suppressed.
- an adhesive applying step is performed in which an adhesive is applied by an adhesive applying section arranged along the supply path of the adhesive sheet. do it.
- the used second patch sheet and the first patch sheet before use can be easily exchanged.
- the rear end (connected end) of the second patch whose remaining amount has decreased due to use and the leading end of the new first patch The ends (connection ends) can be connected.
- the time required to replace the adhesive sheet can be greatly shortened, and the cost can be reduced.
- the adhesive sheet may be a protective sheet for protecting the surface of a semiconductor wafer, a dicing tape used for dicing semiconductor wafers, or a dry film resist.
- a protective sheet for protecting the surface of a semiconductor wafer, a dicing tape used for dicing a semiconductor wafer, or a wide adhesive sheet such as a dry film resist can be replaced without cost.
- a sheet change system can be provided.
- the present invention it is possible to provide a sheet connecting device and a sheet connecting method capable of reliably connecting a plurality of adhesive sheets. Further, according to the present invention, it is possible to provide a sheet exchange system that enables one patch sheet and another patch sheet to be exchanged by connecting one patch sheet and another patch sheet. .
- FIG. 1 is a schematic explanatory view of a protective sheet sticking device to which a sheet connecting device of the present invention is applied;
- FIG. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partially omitted external perspective view showing an embodiment of a seat connecting device of the present invention;
- BRIEF DESCRIPTION OF THE DRAWINGS It is a front direction schematic sectional drawing which shows one Embodiment of the sheet
- FIG. 4 is an enlarged perspective view with partial omission of a cutting portion in the sheet connecting device of the present invention;
- (a) and (b) are explanatory diagrams of the operation of the sheet connecting device of the present invention.
- (c) and (d) are diagrams for explaining the operation of the sheet connecting device of the present invention.
- (e) is an operation explanatory diagram of the sheet connecting device of the present invention.
- (f) is an operation explanatory diagram of the sheet connecting device of the present invention.
- (g) and (h) are explanatory diagrams of the operation of the sheet connecting device of the present invention.
- (i) is an operation explanatory diagram of the sheet connecting device of the present invention.
- (a) is a plan view of a semiconductor wafer to which a protective sheet is attached
- (b) is a cross-sectional view of the semiconductor wafer taken along the line aa.
- 4(a) to 4(c) are diagrams for explaining the operation of the trigger for peeling according to the sheet connecting device of the present invention.
- FIG. 1 An embodiment of the seat connecting device 1 according to the present invention will be described in detail with reference to FIGS. 1 to 12.
- FIG. 1 is a schematic explanatory diagram of a protective sheet sticking device 2 to which the sheet connecting device 1 of the present invention is applied.
- the protective sheet sticking device 2 is, for example, a device for sticking a protective sheet S (also called affixed sheet S) to a semiconductor wafer W (also called a wafer W) shown in FIGS. 11(a) and 11(b). be.
- the wafer W is formed with a notch N indicating the crystal orientation in the outer peripheral portion, and a circuit pattern is formed on the surface.
- the details of attaching the protective sheet S in the protective sheet attaching apparatus 2 are omitted from the illustration.
- the original fabric 3 of the protective sheet S is arranged on the upstream side of the sheet connecting device 1 .
- the raw fabric 3 is rotatably supported by a support frame (not shown) (a rotation driving mechanism and a stopper may be provided as appropriate).
- the pasting sheet S drawn out from the raw sheet 3 is guided by appropriate guide rollers 4 and supplied to the sheet connecting device 1 .
- a protective sheet sticking device 2 is arranged downstream of the sheet connecting device 1 and the protective sheet S is supplied via the sheet connecting device 1 .
- the protective sheet attaching device 2 is connected to the sheet connecting device 1, but the sheet connecting device 1 is incorporated into the protective sheet attaching device 2 and formed integrally. may have been
- FIG. 2 is a partially omitted external perspective view of the seat connecting device 1 viewed from the upper rear side
- FIG. 3 is a schematic cross-sectional view of the seat connecting device 1 viewed from the front direction
- FIG. 4 is an enlarged perspective view in which a main part in FIG. 2 is enlarged.
- the adhesive sheet S and the connecting portion 20 are omitted in FIGS. 2 and 4 .
- the sheet connecting device 1 includes a pair of adhesive rollers 10, 10, a connecting portion 20 and a cutting portion 30 arranged along the supply path of the attached sheet S, and a pair of feed rollers 40, 40. etc.
- the seat connecting device 1 also has a drive unit 60 that supports the connecting portion 20 and the cutting portion 30 .
- the attachment sheet S is passed through the sheet connecting device 1 .
- the patch sheets S one patch sheet S before use that has not yet been attached is referred to as a first patch sheet S1, and a patch sheet S in use that has already been passed through the sheet connecting device 1 is referred to as a second patch sheet.
- S2 a patch sheet S in use that has already been passed through the sheet connecting device 1
- S1 is arranged on the upstream side in the supply direction
- the second patch sheet S2 is arranged on the downstream side with respect to the first patch sheet S1.
- the protective sheet S as the sticking sheet S used in this embodiment is stuck to protect the circuit pattern surface formed on the wafer W, for example, when the backside of the wafer W is ground.
- the protective sheet S includes, for example, an adhesive sheet SA that is attached to the circuit pattern surface, and a release sheet SP that is superimposed on the adhesive layer A of the adhesive sheet SA.
- the adhesive sheet SA is made by laminating an adhesive layer A on a substrate such as EVA (ethylene-vinyl acetate copolymer) or PET (polyethylene terephthalate).
- EVA ethylene-vinyl acetate copolymer
- PET polyethylene terephthalate
- the protective sheet S may be applied to the circuit pattern surface of the wafer W depending on whether the protective sheet S is pasted after being cut into the shape of the wafer W in advance or is cut into the shape of the semiconductor wafer W after being pasted on the semiconductor wafer W. affixed.
- the adhesive rollers 10, 10 are arranged on the upstream side of the sheet connecting device 1 in the supply direction. As shown in FIGS. 2 and 4 , the adhesive rollers 10 , 10 are provided along the width direction of the adhesive sheet S and formed wider than the adhesive sheet S. As shown in FIGS. Both end sides of the adhesive rollers 10, 10 are rotatably supported by support frames 5, 5. As shown in FIG.
- the adhesive rollers 10, 10 are provided so as to move toward and away from each other through the adhesive sheet S by an appropriate drive source (not shown) such as a cylinder.
- the adhesive rollers 10, 10 can be moved toward and away from each other by relative movement. may approach and separate from the adhesive roller 10.
- both of the adhesive rollers 10, 10 are provided so as to be capable of approaching and separating.
- the adhesive rollers 10, 10 can sandwich the adhesive sheet S passed between the adhesive rollers 10, 10 by moving closer to each other.
- the adhesive rollers 10, 10 can feed the adhesive sheet S from the upstream side to the downstream side by rotating in the supply direction while holding the adhesive sheet S therebetween. Further, the adhesive rollers 10, 10 can be rotated in the direction opposite to the above-described direction to rewind and feed the adhesive sheet S from the downstream side to the upstream side. Further, the adhesive rollers 10, 10 are formed of a material having adhesiveness on the surface side.
- the adhesive rollers 10, 10 may be formed by coating an adhesive on the surface or winding an adhesive sheet on the surface.
- the adhesive rollers 10, 10 sandwich the connection end SE1 on the one end side of the first attachment sheet S1 (attachment sheet S) (see FIG. 6(c)), By feeding the first sticking sheet S1 from the upstream side toward the downstream side, it is possible to separate the first sticking sheet S1 into the adhesive sheet SA1 and the release sheet SP1 at the connection end SE1 to form the separating portion 50. It is possible (see FIG. 6(d)).
- the drive unit 60 supports a heater 21 and a cutter 31, which will be described later.
- a support frame 6 (see FIGS. 2 and 4) is formed horizontally along the width direction of the adhesive sheet S behind the drive unit 60 .
- the drive unit 60 is supported via a guide 61 on a guide shaft 6A provided along the width direction of the support frame 6 . Thereby, the drive unit 60 is allowed to move in the width direction with respect to the adhesive sheet S. As shown in FIG. Further, the drive unit 60 can be freely moved in the width direction by an appropriate drive source (automatic or manual).
- the drive unit 60 has a rail 62 laid on the upper end side (upstream side) toward the surface on which the adhesive sheet S is formed.
- a rail 63 is laid on the lower end side (downstream side) of the drive unit 60 so as to be parallel to the rail 62 at an interval.
- the connecting part 20 is arranged on the downstream side of the adhesive rollers 10, 10 in the supply direction.
- the connection part 20 is formed of a heater 21 having a sharp tip like a soldering iron and a backup 22 provided via a sticking sheet S.
- the heater 21 can adjust the heating temperature by performing appropriate current control.
- the heater 21 is supported by the driving unit 60 and is movably supported by the rail 62 via the guide 23 . As a result, the heater 21 is allowed to move forward and backward toward the surface on which the adhesive sheet S is formed.
- the advance and retreat of the heater 21 is performed by an appropriate driving source (not shown).
- the backup 22 is fixed to an appropriate support frame (not shown) and can support the adhesive sheet S from the back side.
- the cutting section 30 is arranged downstream of the connecting section 20 in the supply direction.
- the cutting unit 30 is supported by the drive unit 60 and includes a cutter 31 arranged on the side of the release sheet SP and an attracting body 35 arranged on the side of the adhesive sheet SA and provided so as to face the cutter 31. and have
- the cutter 31 is movably supported by the rail 63 of the drive unit 60 via the guide 32 . As a result, the cutter 31 is allowed to move forward and backward toward the surface on which the adhesive sheet S is formed. The forward and backward movement of the cutter 31 is performed by an appropriate drive source (not shown). Further, the cutter 31 can move toward the attracting body 35 and move in the width direction along the guide shaft 6A. Thereby, the adhesive sheet S can be cut in the width direction crossing the supply direction.
- the adhesive roller 10, the connecting portion 20, the cutting portion 30, and the feed roller 40 are arranged in order from the upstream side to the downstream side in the supply direction. It can be changed as appropriate according to the feed direction.
- the heater 21 having a sharp tip like a soldering iron is exemplified as the connecting portion 20.
- Various materials can be used as long as they can be used.
- various types of heaters such as a heater formed over the entire width direction of the adhesive sheet S and a heater formed in an uneven shape along the width direction, are used. Any shape or size of heating means can be used.
- the heating temperature at the connecting portion 20 may be changed according to the material of the patch S as appropriate.
Abstract
Description
図12に示すように、変形例に係るシート接続装置1に搭載される剥離きっかけ機構70は、凹凸ローラ71と、凹凸ローラ71を回転可能に支持する支持部72等を備えている。なお、図12(a)~図12(c)においては、各図における右側を原反側(上流側)として説明する。
A :粘着層
S1 :第一貼付シート
S2 :第二貼付シート
SE1:接続端部
SE2:被接続端部
SA :粘着シート
SP :離型シート
W :半導体ウエハ(ウエハ)
1 :シート接続装置
2 :保護シート貼り付け装置
10 :粘着ローラ
20 :連結部
21 :ヒータ
22 :バックアップ
30 :切断部
35 :吸着体
36 :カッター溝
37 :吸着孔
31 :カッター
40 :送りローラ
50 :分離部
Claims (12)
- 粘着シートの少なくとも粘着面側に離型シートを重ね合わせて形成された貼付シートであって供給方向上流側に配される第一貼付シートと、前記第一貼付シートに対して供給方向下流側に配される第二貼付シートと、を供給方向に沿って接続するシート接続装置であって、
供給方向上流側において、前記貼付シートを介して互いに接近離反可能に設けられ、互いに接近することにより前記貼付シートを挟持可能な一対の粘着ローラと、
前記貼付シートの供給経路に沿って配される連結部及び切断部と、
前記連結部及び前記切断部に対して供給方向下流側において、前記貼付シートを介して互いに接近離反可能に設けられ、互いに接近することにより前記貼付シートを挟持可能な一対の送りローラと、を備え、
前記切断部は、前記第二貼付シートを前記供給方向と交差する幅方向に切断することにより、被接続端部を形成可能であり、
一対の前記粘着ローラは、それぞれ表面が粘着性を有すると共に、前記第一貼付シートの接続端部を一対の前記粘着ローラで挟持しながら当該第一貼付シートを上流側から下流側に向けて送り込むことにより、前記接続端部において前記第一貼付シートを前記粘着シートと前記離型シートとに分離させて分離部を形成することが可能であり、
前記送りローラは、前記第二貼付シートを挟持しながら前記接続端部に向けて前記第二貼付シートを送り込むことにより、前記被接続端部を前記分離部に挿入可能なものであり、
前記連結部は、前記接続端部に前記被接続端部が挿入され、前記接続端部及び前記被接続端部を接着又は溶着により接続すること、を特徴とするシート接続装置。 - 前記連結部が、前記接続端部における離型シート、及び前記被接続端部における離型シートのそれぞれを加熱により溶着させて接続するものであること、を特徴とする請求項1に記載のシート接続装置。
- 前記連結部が、前記接続端部における離型シート、および前記被接続端部における離型シートのそれぞれを接着剤塗布により接着させて接続するものであること、を特徴とする請求項1に記載のシート接続装置。
- 一対の前記粘着ローラは、供給方向下流側から上流側に向けて前記第一貼付シート及び前記第二貼付シートを送り込むことにより、前記被接続端部が挿入された前記接続端部を圧接可能であること、を特徴とする請求項1~3のいずれか1項に記載のシート接続装置。
- 前記切断部が、
前記離型シート側に配されたカッターと、
前記粘着シート側に配されると共に、前記カッターと対向して設けられた吸着体と、を有しており、
前記吸着体は、前記第二貼付シートを幅方向に沿って吸着保持することが可能であると共に、前記カッターと対向する位置において幅方向に沿ったカッター溝を有すること、を特徴とする請求項4に記載のシート接続装置。 - 前記貼付シートが、半導体ウエハの表面を保護する保護シート、半導体ウエハのダイシングに用いられるダイシングテープ、又はドライフィルムレジストであること、を特徴とする請求項5に記載のシート接続装置。
- 前記第一貼付シートの面上で凹凸ローラを転動させて、粘着シートと離型シートとに分離しやすくすることを特徴とする請求項5に記載のシート接続装置。
- 粘着シートの少なくとも粘着面側に離型シートが重ね合わされた貼付シートであって供給方向上流側に配される第一貼付シートと、前記第一貼付シートに対して供給方向下流側に配される第二貼付シートと、を供給方向に沿って接続するシート接続方法であって、
前記第二貼付シートを、幅方向に切断することにより原反側と供給方向下流側とに二分すると共に、供給方向下流側の一端側に被接続端部を形成する第二貼付シート切断工程と、
前記第二貼付シートにおける上流側から前記第一貼付シートを供給する第一貼付シート供給工程と、
供給方向上流側から下流側に向けて前記第一貼付シートの接続端部を一対の粘着ローラで挟持しながら送り込むことにより、前記接続端部を前記粘着シートと前記離型シートとに分離させて分離部を形成する分離部形成工程と、
前記第二貼付シートを供給方向下流側から上流側に向けて送り込むことにより、前記分離部に向けて前記被接続端部を挿入するシート挿入工程と、
前記分離部に前記被接続端部が挿入された状態で、前記第一貼付シート及び前記第二貼付シートを供給方向下流側から上流側に向けて送り込みながら、一対の前記粘着ローラによって前記接続端部及び前記被接続端部を挟持するシート接続工程と、を実行すること、を特徴とするシート接続方法。 - 前記シート接続工程を実行後に、前記粘着ローラによる挟持を解放した状態で、前記接続端部及び前記被接続端部を前記貼付シートの供給経路に沿って配された連結部により加熱圧着する加熱圧着工程を実行すること、を特徴とする請求項8に記載のシート接続方法。
- 前記シート接続工程を実行前に、前記貼付シートの供給経路に沿って配された接着剤塗布部により接着剤を塗布する接着剤塗布工程を実行すること、を特徴とする請求項8に記載のシート接続方法。
- 請求項1~3のいずれか1項に記載のシート接続装置を用い、
前記第一貼付シートにおける端部と、前記第二貼付シートにおける端部と、を接続することにより、供給先に供給する貼付シートを交換すること、を特徴とするシート交換システム。 - 前記貼付シートが、半導体ウエハの表面を保護する保護シート、半導体ウエハのダイシングに用いられるダイシングテープ、又はドライフィルムレジストであること、を特徴とする請求項11に記載のシート交換システム。
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