TWI729884B - 磨光墊 - Google Patents

磨光墊 Download PDF

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Publication number
TWI729884B
TWI729884B TW109124274A TW109124274A TWI729884B TW I729884 B TWI729884 B TW I729884B TW 109124274 A TW109124274 A TW 109124274A TW 109124274 A TW109124274 A TW 109124274A TW I729884 B TWI729884 B TW I729884B
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TW
Taiwan
Prior art keywords
substrate
optical head
polishing
light
film thickness
Prior art date
Application number
TW109124274A
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English (en)
Chinese (zh)
Other versions
TW202042322A (zh
Inventor
小畠嚴貴
小林洋一
大野勝俊
木下將毅
金馬利文
Original Assignee
日商荏原製作所股份有限公司
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Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW202042322A publication Critical patent/TW202042322A/zh
Application granted granted Critical
Publication of TWI729884B publication Critical patent/TWI729884B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • H10P52/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H10P50/00—
    • H10P72/0422—
    • H10P72/0428—
    • H10P72/0604—
    • H10P72/7606—
    • H10P74/238—
    • H10P90/123—
    • H10P95/062—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
TW109124274A 2010-12-27 2011-12-23 磨光墊 TWI729884B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-289209 2010-12-27
JP2010289209A JP5980476B2 (ja) 2010-12-27 2010-12-27 ポリッシング装置およびポリッシング方法

Publications (2)

Publication Number Publication Date
TW202042322A TW202042322A (zh) 2020-11-16
TWI729884B true TWI729884B (zh) 2021-06-01

Family

ID=46317752

Family Applications (5)

Application Number Title Priority Date Filing Date
TW109124274A TWI729884B (zh) 2010-12-27 2011-12-23 磨光墊
TW107118720A TWI702668B (zh) 2010-12-27 2011-12-23 磨光裝置
TW105113929A TWI629735B (zh) 2010-12-27 2011-12-23 磨光裝置
TW100148258A TWI538076B (zh) 2010-12-27 2011-12-23 磨光裝置、磨光方法及磨光墊
TW109124275A TWI724945B (zh) 2010-12-27 2011-12-23 磨光裝置

Family Applications After (4)

Application Number Title Priority Date Filing Date
TW107118720A TWI702668B (zh) 2010-12-27 2011-12-23 磨光裝置
TW105113929A TWI629735B (zh) 2010-12-27 2011-12-23 磨光裝置
TW100148258A TWI538076B (zh) 2010-12-27 2011-12-23 磨光裝置、磨光方法及磨光墊
TW109124275A TWI724945B (zh) 2010-12-27 2011-12-23 磨光裝置

Country Status (4)

Country Link
US (4) US9401293B2 (enExample)
JP (2) JP5980476B2 (enExample)
KR (5) KR101739074B1 (enExample)
TW (5) TWI729884B (enExample)

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JP6730124B2 (ja) * 2016-08-01 2020-07-29 株式会社ディスコ 厚み計測装置
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JP6902452B2 (ja) * 2017-10-19 2021-07-14 株式会社荏原製作所 研磨装置
JP6847811B2 (ja) 2017-10-24 2021-03-24 株式会社荏原製作所 研磨方法および研磨装置
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JP7179586B2 (ja) * 2018-11-08 2022-11-29 株式会社荏原製作所 渦電流検出装置及び研磨装置
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JP7145084B2 (ja) * 2019-01-11 2022-09-30 株式会社荏原製作所 基板処理装置および基板処理装置において部分研磨されるべき領域を特定する方法
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Also Published As

Publication number Publication date
US20150332943A1 (en) 2015-11-19
TW201236098A (en) 2012-09-01
KR101739074B1 (ko) 2017-05-23
KR20170058893A (ko) 2017-05-29
TWI702668B (zh) 2020-08-21
TW201631681A (zh) 2016-09-01
KR20190038772A (ko) 2019-04-09
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