TWI725473B - 旋塗裝置內基板材料底面和/或其邊緣清潔的優化暴露 - Google Patents
旋塗裝置內基板材料底面和/或其邊緣清潔的優化暴露 Download PDFInfo
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Abstract
旋塗裝置包括底板、旋轉夾頭及致動器機構,旋轉夾頭配置用於在其上放置基板材料,致動器機構配置用於使底板與旋轉夾頭接合,從而該底板隨旋轉夾頭同步旋轉。基板材料包括塗有成膜物質的頂面和底面。該清潔機構位於底板下方,當底板接合時,未優化暴露於基板材料底面及其邊緣。對配置為隨底板同時旋轉的蓋與底板分離做出回應,致動器機構進一步配置為使底板與旋轉夾頭分離,從而使清潔機構優化暴露於基板材料底面及其邊緣。
Description
優先權要求
本申請是2018年7月9日提交的美國臨時專利申請案第62/695,826的美國實用新型轉換專利申請,臨時專利申請的名稱為「METHOD AND SYSTEM FOR PHOTORESIST COATING OF A SEMICONDUCTOR WAFER WITH BACKSIDE EDGE BEAD REMOVAL USING AN EBR NOZZLE」。上述申請的內容透過引用整體併入本申请中。
本公開一般涉及旋塗裝置,更特定言之,涉及旋塗裝置內基板材料底面和/或其邊緣清潔的優化暴露。
基板材料(例如,半導體晶圓)可以在其頂面上塗佈成膜物質(例如,光刻膠材料),並且放置在旋塗裝置的旋轉夾頭上。旋轉夾頭與基板材料一起旋轉,使成膜物質均勻地分佈在基板材料的頂面上。然而,所述旋轉也可能導致一些成膜物質在基板材料的邊緣積聚;這種溢出可能延伸到基板材料的底面。
邊緣積聚和溢出的清潔涉及採用獨立的分配臂或類似元件來清潔基板材料底面和/或其邊緣。該過程可能導致涉及已塗佈基板材料的化學/顆粒污染。
公開了一種旋塗裝置內基板材料底面和/或其邊緣清潔優化暴露的方法、裝置和/或系統。
一態樣中,旋塗裝置包括底板、旋轉夾頭及致動器機構,旋轉夾頭配置用於在其上放置基板材料,致動器機構配置用於使底板與旋轉夾頭接合,從而所述底板配置為隨旋轉夾頭同步旋轉。基板材料包括頂面和底面,頂面是配置為塗佈成膜物質的表面。清潔機構位於底板下方,當底板與旋轉夾頭接合時,未優化暴露於基板材料底面及其邊緣。
對配置為當底板隨旋轉夾頭同步旋轉時而隨底板同時旋轉的蓋與底板的分離做出回應,致動器機構進一步配置為使底板與旋轉夾頭分離,從而使旋轉夾頭脫離底板。底板與旋轉夾頭的分離配置用於降低底板,從而根據清潔機構穿過底板的出露,清潔機構被優化暴露於基板材料底面及其邊緣。
另一態樣中,一種方法包括採用清潔機構,當底板與旋塗裝置的旋轉夾頭接合時,所述清潔機構位於旋塗裝置底板下方,且未優化暴露於基板材料底面及其邊緣。旋轉夾頭配置成用於在其上面放置具有頂面和底面的基板材料。頂面是塗佈成膜物質的表面。底板配置為在接合狀態時隨旋轉夾頭同步旋轉,其中旋轉夾頭上面放置有已塗佈的基底材料。
對配置為當底板隨旋轉夾頭同步旋轉時而隨底板同時旋轉的蓋與底板分離做出回應,所述方法還包括使底板與旋轉夾頭分離,從而使旋轉夾頭脫離底板,並根據底板與旋轉夾頭的脫離,降低底板,從而根據清潔機構穿過底板的出露,所述清潔機構被優化暴露於基板材料底面及其邊緣。此外,所述方法包括根據優化暴露,利用清潔機構清潔基板材料的底面和/或其邊緣。
另一態樣中,一種非暫時性介質,透過資料處理裝置可讀並且包括可透過資料處理裝置執行的指令,所述非暫時性介質包括控制旋塗裝置的指令。控制指令包括採用清潔機構的指令,當底板與旋塗裝置的旋轉夾頭接合時,所述清潔機構位於旋塗裝置底板下方,且其未優化暴露於基板材料底面及其邊緣。旋轉夾頭配置成在其上面放置具有頂面和底面的基板材料,頂面是塗有成膜物質的表面。
底板配置為在接合狀態時隨旋轉夾頭同步旋轉,其中旋轉夾頭上面放置有已塗佈的基底材料。對配置為當底板隨旋轉夾頭同步旋轉時而隨底板同時旋轉的蓋與底板的分離做出回應,所述控制指令還包括使底板與旋轉夾頭分離,從而使旋轉夾頭脫離底板的指令,及根據底板與旋轉夾頭的脫離,降低底板,從而根據清潔機構穿過底板的出露,清潔機構被優化暴露於基板材料底面及其邊緣的指令。
此外,控制指令包括根據優化暴露,啟動採用清潔機構清潔基板材料底面和/或其邊緣的指令。
根據附圖和隨後的詳細描述,其他特徵將是顯而易見的。
如下所述,示例實施例可用於提供旋塗裝置中基板材料底面和/或其邊緣清潔優化暴露的方法、裝置和/或系統。儘管已經參考特定示例實施例描述了本發明的實施例,但是顯而易見的是,在不背離各種實施例更廣泛的精神和範圍的情況下,可以對這些實施例進行各種修改和改變。
圖 1
顯示了根據一個或多個實施例的光刻膠塗佈系統100。如所暗示的那樣,在一個或多個實施例中,光刻膠塗佈系統100能夠在表面(例如,半導體晶圓的基板)上塗佈光刻膠(例如,光敏材料);所述光刻膠可以將圖像轉移到表面上。光刻膠是本領域技術人員所熟知的。為了方便和清楚起見,已經省略了與其相關的詳細討論。
在一個或多個實施例中,光刻膠塗佈系統100可包括光刻膠塗佈裝置102,其配置用於透過旋塗製程將光刻膠塗佈到上述表面上。雖然在一些實施例中,作為光刻膠塗佈系統100的一部分,光刻膠塗佈裝置102可以採用機械、電子和/或電氣手段控制,但是,光刻膠塗佈裝置102的至少一些控制可以透過與其通信耦合的資料處理裝置104來實現,如圖 1
所示。在這些實施例中,資料處理裝置104可以包括與存儲器154(例如,易失性和/或非易失性存儲器)通信耦合的處理器152(例如,微處理器);存儲器154可包括可透過處理器152尋址的存儲位置;此處處理器152可以執行與光刻膠塗佈裝置102的部件預先定義/預先配置的移動有關的操作。
在一個或多個實施例中,光刻膠塗佈裝置102可包括外殼114,旋轉夾頭108和底板112在外殼114內操作。在一個或多個實施例中,旋轉夾頭108可以是平台(例如,圓形),半導體晶圓(將在下面討論)被配置為放置在該平台上。在一個或多個實施例中,旋轉夾頭108可以被配置為將半導體晶圓牢固地固定在其上面,並且以高速旋轉。在一個或多個實施例中,在半導體晶圓表面上塗佈光刻膠材料之後,旋轉夾頭108的旋轉可以將光刻膠材料均勻地分佈在整個表面上。
在一個或多個實施例中,底板112可以是位於外殼114內旋轉夾頭108下方的金屬板。在一個或多個實施例中,光刻膠塗佈裝置102可包括蓋110,蓋110被配置為使底板112能夠與旋轉夾頭108接合。在一個或多個實施例中,蓋110可以透過適當的機構(將在下面討論;例如,基於透過資料處理裝置104的自動控制)操作,從初始位置降低以與底板112牢固地接合,底板112可以接著與旋轉夾頭108接合,半導體晶圓被配置為放在旋轉夾頭108上。在一個或多個實施例中,蓋110也可以透過同一適當機構抬高(例如,自動地)回到初始位置。
圖 2
示出了根據一個或多個實施例被配置為放置在旋轉夾頭108上的半導體晶圓202;在一個或多個實施例中,根據對直接與旋轉夾頭108接觸的半導體晶圓202的表面(例如,如圖 2
所示的底面294)施加吸力,所述半導體晶圓202可以牢固地放置在旋轉夾頭108上。一旦半導體晶圓202牢固地放置在旋轉夾頭108上,光刻膠材料可以塗佈在半導體晶圓202的頂部(例如,頂面292上),如圖 2
所示。光刻膠材料的手動和自動塗佈方法都設想屬於本文討論的示例性實施方案的範圍。在一個或多個實施例中,旋轉夾頭108可以被配置為高速旋轉,如上所述,從而使光刻膠材料(例如,圖 2
中所示的光刻膠材料242)在半導體晶圓202的頂面292上均勻分散。圖 2
還示出了根據一個或多個實施例的半導體晶圓202的邊緣252。
在一個或多個實施例中,在透過光刻膠塗佈裝置102實現的同步旋轉製程中,包括塗有光刻膠材料242的半導體晶圓202的旋轉夾頭108與底板112可以同步旋轉。在一個或多個實施例中,為了替半導體晶圓202頂面292上光刻膠材料242的分佈提供低湍流環境,可以降低光刻膠塗佈裝置102的蓋110,從而牢固地鎖定底板112,並與其同步共轉。在一個或多個實施例中,所述牢固地鎖定可以導致共轉底板112和蓋110與其上放置塗佈半導體晶圓202的旋轉夾頭108同步旋轉。
圖 3
示出了根據一個或多個實施例的光刻膠塗佈裝置102,其中蓋110降低以與底板112接合。應注意的是,圖 3
是光刻膠塗佈裝置102的前視圖,用於揭示本文所討論的操作中固有的機制。在一個或多個實施例中,如上所述,蓋110可從其初始位置350下降,以鎖定底板112的轉動。在一個或多個實施例中,光刻膠塗佈裝置102可具有蓋機構302,以操作蓋110,將蓋110從初始位置350移動到其與底板112的鎖定位置。圖 3
中公開的蓋機構302僅用於說明目的。能夠實現蓋110上述移動的任何蓋機構302都屬於本文所討論的示例性實施例的範圍。
而且,如上所述,在一個或多個實施例中,蓋機構302可以將蓋110抬起,從鎖定位置回到初始位置350。在一個或多個實施例中,光刻膠塗佈裝置102可包括與其相關聯的氣缸機構306,透過該氣缸機構306,氣缸308被加壓到足以使底板112朝旋轉夾頭108升高。在一個或多個實施例中,蓋110與底板112的鎖定可以自動觸發氣缸308加壓,從而使底板112朝旋轉夾頭108升高。
在一個或多個實施例中,光刻膠塗佈裝置102可包括軸管310,軸管310被配置成作為旋轉夾頭108的旋轉軸。在一些實施例中,軸管310可以是外殼114中旋轉夾頭108的部件。在一個或多個實施例中,軸管310可以與套筒312相關聯,套筒312配置成環繞軸管310(例如,圓柱形)。在一個或多個實施例中,在蓋110與底板112鎖定之後(例如,對蓋110與底板112的鎖定進行回應;或於此獨立),氣缸308的加壓可根據氣缸機構306、套筒312和底板112之間的通信耦合,使套筒312將底板112朝旋轉夾頭108抬高。
圖 4
示出了根據一個或多個實施例的旋轉夾頭108上的鍵槽402。返回參照圖 3
,根據一個或多個實施例,底板112可以是底板組件314的一部分,底板組件314上包括多個鎖定銷316。為了說明方便,圖 3
示出了兩個鎖定銷316。在一個或多個實施例中,底板112透過套筒312朝旋轉夾頭108的升高可以使鎖定銷316與旋轉夾頭108中的鍵槽402接合。在一個或多個實施例中,所述接合還可以鎖定底板112與旋轉夾頭108的運動,從而實現其同步旋轉。應注意的是,一個或多個鎖定銷316和旋轉夾頭108中的一個或多個相關聯鍵槽402足夠被與本文所討論的示例性實施例有關的概念覆蓋。
此外,應該注意的是,在一些實施例中,類似於鍵槽402的鍵槽可以在底板112 /底板組件314上而不是在旋轉夾頭108上,並且類似於鎖定銷316的鎖定銷可以在旋轉夾頭108上,而不是在底板組件314上。鑑於上面討論的其他實施例,此處鎖定銷316在鍵槽402內的接合/脫離可能是顯而易見的。
在光刻膠塗佈的典型實施方式中,半導體晶圓202上光刻膠材料242的旋轉可能導致在半導體晶圓202的邊緣252處積聚一些光刻膠材料242。所述積聚可能溢出到半導體晶圓202的底面294上。由於人們希望半導體晶圓202與光掩模(未示出)之間充分接觸,且半導體晶圓202背面(例如,底面294)無污染,因此,可能需要在圖案曝光之前去除邊緣光刻膠材料242和/或清潔底面294。
典型的解決方案包括利用單獨的分配臂或類似元件來清潔半導體晶圓202的底面294和/或其邊緣252。這些方案可能存在與粗糙相關的問題及缺乏用於所述清潔的受控環境。在一個或多個實施例中,光刻膠塗佈裝置102可包括清潔噴嘴318(例如,光刻膠去除(EBR)噴嘴),在底板112與旋轉夾頭108接合時,位於底板112下方,如圖3所示。在一個或多個實施例中,清潔噴嘴318可以配置成注入適當的溶劑或流體,用於清潔半導體晶圓202的底面294和/或半導體晶圓202的邊緣252。
然而,在一個或多個實施例中,在底板112與蓋110接合的狀態下,清潔噴嘴318可以在底板112下方,如圖3所示,且未優化暴露於半導體晶圓202的底面294和其邊緣252。在一個或多個實施例中,底板112與旋轉夾頭108的接合可使旋轉夾頭108控制底板112的運動。在一個或多個實施例中,當底板112靠在蓋110上
時,蓋110和底板112可以一起與旋轉夾頭108同步旋轉。
圖5示出了根據一個或多個實施例的蓋110與底板112脫離。圖5是其前視圖。在一個或多個實施例中,所述脫離可以作為存儲在其中的指令的一部分,透過資料處理裝置104觸發,从而清潔半導體晶圓202的底面294和/或其邊緣252。在一個或多個其他實施例中,所述脫離可以由光刻膠塗佈裝置102的手動或自動干預實現。在一個或多個實施例中,作為脫離的一部分,蓋機構302可以將蓋110從鎖定位置抬起,以使蓋110與底板112脫離。在一個或多個實施例中,所述脫離可導致蓋110返回到初始位置350。
在一個或多個實施例中,然後,氣缸機構306可透過氣缸308降低(例如,釋放)壓力,以放開与軸管310連接的機構。換句話說,在一個或多個實施例中,透過氣缸308降低壓力可導致圍繞軸管310的套筒312降低,從而使底板112與旋轉夾頭108脫離。在一個或多個實施例中,作為底板112與旋轉夾頭108脫離的一部分,底板組件314的鎖定銷316可以與旋轉夾頭108的相應鍵槽402脫離。在一個或多個實施例中,這樣可以導致旋轉夾頭108脫離底板112自由地移動和旋轉。
在一個或多個實施例中,底板112與旋轉夾頭108的脫離可以使底板112降低。在一些實施例中,底板112可以繼續降低到其鎖定點(圖5示出了底板112移動直到鎖定點550);所述鎖定可能是由於清潔噴嘴318透過底板112中的暴露孔502伸出。應當注意的是,在一個或多個實施例中,清潔噴嘴318因此能夠在底板112降低(例如,到鎖定點550)之後,清潔和/或清洗半導體晶圓202的底面294和/或其邊緣252。雖然暴露孔502可以是將清潔噴嘴318優化暴露於半導體晶圓202的底面294和/或其邊緣252以進行清洗/清潔的一種手段,但是其它手段也屬於本文所討論的示例性實施例的範圍。
雖然圖 3
僅示出了一個清潔噴嘴318,但應注意的是,在適當位置處設置一個以上清潔噴嘴318屬於本文所討論的示例性實施例的範圍。概括地說,為了進行清洗和/或清潔,底板112的下降可以將「清潔機構」(例如,清潔噴嘴318;用於清洗和/或清潔的其他形式和手段在本文所討論的示例性實施例的範圍內)優化暴露於半導體晶圓202的底面294和/或其邊緣252。如上所述,在一個或多個實施例中,脫離的底板112可獨立於旋轉夾頭108的旋轉。相反,在一個或多個實施例中,旋轉夾頭108現在能夠獨立於包括底板112的底板組件314旋轉。
在一個或多個實施例中,在底板112的鎖定點550處,清潔噴嘴318可以配置成噴射適當溶劑流,用於清潔/清洗半導體晶圓202的底面294和/或其邊緣252。在一些其他實施例中,通用的「清潔機構」可以採用適當的刷子(未示出)來清潔和/或清洗半導體晶圓202的底面294和/或其邊緣252。
因此,這裡討論的示例性實施例不需要引入一個或多個外部分配臂來清潔半導體晶圓202的底面294和/或其邊緣252,從而避免了額外的缺陷和/或化學/顆粒污染。此外,示例性實施例構成底板112相對於光刻膠塗佈裝置(例如,光刻膠塗佈裝置102)中旋轉夾頭108的第一接合/脫離機構,從而使清潔機構能夠優化暴露於半導體晶圓202的底面294和/或其邊緣252。更進一步地,示例性實施例提供一種低湍流環境,適用於半導體晶圓202的旋轉、半導體晶圓202頂面292的平坦化以及減少化學品(例如,光刻膠材料242、一種或多種清潔溶劑)的使用。
應該注意的是,上面討論的氣缸機構306一般可以稱為「致動器機構」,用於啟動及升高/降低圍繞軸管310的套筒312,從而使底板112與旋轉夾頭108接合/脫離;光刻膠塗佈裝置102一般可稱為「旋塗裝置」。而且,應當注意的是,與本文討論的示例性實施例相關的概念可適用於其底面(例如,底面294)和/或邊緣(例如,252)需要清洗和/或清潔的的任何「基板材料」 (其中半導體晶圓202僅僅是一個示例)。同樣,光刻膠材料242可以僅僅是被配置為塗佈在基板材料頂面(例如,頂面292)上的「成膜物質」的一個示例。其清潔和/或清洗在本文討論的示例性實施方案的範圍內。
圖 6
總結了根據一個或多個實施例底板112與光刻膠塗佈裝置102的旋轉夾頭108的接合,如圖 3
所討論的那樣,以及底板112與光刻膠塗佈裝置102的旋轉夾頭108的脫離,如圖 5
所討論的那樣。同樣,在一些替代實施例中(為了顯而易見的目的未示出),類似於鍵槽402的鍵槽可以在底板112 /底板組件314上而不是在旋轉夾頭108上,並且類似於鎖定銷316的鎖定銷可以在旋轉夾頭108上而不是底板組件314上。如上所述,與光刻膠塗佈裝置102的部件移動相關的所有操作可以透過資料處理裝置104自動觸發,該資料處理裝置104被配置為讀取和執行非暫時性機器可讀介質(例如,硬盤/驅動器、數字視訊光盤(DVD)、光盤(CD)和藍光光盤TM
中的指令。所有合理的變化都在本文討論的示例性實施方案的範圍內。
圖 7
示出了根據一個或多個實施例的製程流程圖,詳細描述了在旋塗裝置(例如,光刻膠塗佈裝置102)中清潔基板材料(例如,半導體晶圓202)的底面(例如,底面294)和/或其邊緣(例如,邊緣252)所涉及的操作。在一個或多個實施例中,操作702可能涉及利用清潔機構(例如,清潔噴嘴318),在底板與旋塗裝置的旋轉夾頭(例如旋轉夾頭108)處於接合狀態時,該清潔機構位於旋塗裝置底板(例如,底板112)下方,且未優化暴露於基板材料的底面和/或其邊緣。在一個或多個實施例中,旋轉夾頭可以配置成其上放置具有頂面(例如,頂面292)和底面的基板材料。
在一個或多個實施例中,頂面可以是被配置為塗有成膜物質(例如,光刻膠材料242)的表面。在一個或多個實施例中,底板配置為在接合狀態時隨旋轉夾頭同步旋轉,其中旋轉夾頭上面放置有塗佈基板材料。在一個或多個實施例中,對配置成在底板與旋轉夾頭同步旋轉期間與底板同步共轉的旋轉塗佈裝置的蓋(例如,蓋110)與底板的脫離做出回應,操作704可以包括使底板與旋轉夾頭脫離,以使旋轉夾頭脫離底板。
在一個或多個實施例中,操作706可以包括根據底板與旋轉夾頭的脫離而降低底板,從而根據清潔機構穿過底板的出露,清潔機構被優化暴露於基板材料的底面和/或其邊緣。在一個或多個實施例中,然後,操作708可以包括根據優化暴露,利用清潔機構清潔基板材料的底面和/或其邊緣。
儘管已經參考特定示例實施例描述了本發明的實施例,但是顯而易見的是,在不背離各種實施例更廣泛的精神和範圍的情況下,可以對這些實施例進行各種修改和改變。因此,說明書和附圖應被視為說明性的而非限制性的。
100:光刻膠塗佈系統
102:光刻膠塗佈裝置
104:資料處理裝置
108:旋轉夾頭
110:蓋
112:底板
114:外殼
152:處理器
154:存儲器
202:半導體晶圓
242:光刻膠材料
252:邊緣
292:頂面
294:底面
302:蓋機構
306:氣缸機構
308:氣缸
310:軸管
312:套筒
316:鎖定銷
318:清潔噴嘴
350:初始位置
402:鍵槽
502:暴露孔
550:鎖定點
702-708:操作
本發明的實施例透過示例的方式示出,並且不受附圖的限制,在附圖中,相同的附圖標記表示類似的元件,並且其中:
圖 1
是根據一個或多個實施例的光刻膠塗佈系統示意圖。
圖 2
是根據一個或多個實施例的半導體晶圓示意圖,該半導體晶圓配置為放置在圖 1
光刻膠塗佈系統的光刻膠塗佈裝置的旋轉夾頭上。
圖 3
是根據一個或多個實施例的圖 1
光刻膠塗佈裝置的示意性前視圖,其中蓋下降以與其底板接合。
圖 4
是根據一個或多個實施例的圖 1
光刻膠塗佈裝置旋轉夾頭上的鍵槽的示意圖。
圖 5
是根據一個或多個實施例的蓋與圖 1
光刻膠塗佈裝置底板脫離的示意性前視圖。
圖 6
是根據一個或多個實施例的圖 3
和圖 5
所示操作的具體總結的示意圖。
圖 7
是根據一個或多個實施例的製程流程圖,詳細說明了旋塗裝置中清潔基板材料底面和/或其邊緣所涉及的操作。
根據附圖和隨後的詳細描述,其他特徵將是顯而易見的。
國內寄存資訊 (請依寄存機構、日期、號碼順序註記)
無
國外寄存資訊 (請依寄存國家、機構、日期、號碼順序註記)
無
102:光刻膠塗佈裝置
108:旋轉夾頭
110:蓋
112:底板
114:外殼
202:半導體晶圓
242:光刻膠材料
302:蓋機構
306:氣缸機構
308:氣缸
310:軸管
312:套筒
316:鎖定銷
318:清潔噴嘴
Claims (7)
- 一種旋塗裝置,包括:一底板組件,包含一底板和複數個鎖定銷;一旋轉夾頭,該旋轉夾頭配置為在其上放置一基板材料,該基板材料包括一頂面和一底面,該頂面是塗有一成膜物質的一表面,該旋轉夾頭包含與該底板組件的該複數個鎖定銷相對應的複數個鍵槽;一致動器機構,其配置成藉由使該底板組件的該複數個鎖定銷與該旋轉夾頭的該複數個鍵槽接合而使該底板與該旋轉夾頭接合,從而使該底板被配置為與旋轉夾頭同步旋轉,即使在該底板與該旋轉夾頭接合的一狀態下,該底板也完全位於該旋轉夾頭的下方;一清潔噴嘴,位於底板下方,在該底板與該旋轉夾頭接合的該狀態下,未優化暴露於該基板材料的該底面及其邊緣;和一蓋,配置成與該底板接合以在該底板與該旋轉夾頭的該同步旋轉期間與該底板同步地共同旋轉,該蓋與該底板的接合及其同步共同旋轉能夠達成一低湍流環境,用於將該成膜物質分佈在該基板材料的該頂面上,其中,該致動器機構還被配置為:對該蓋與該底板的脫離做出回應,使該底板的該複 數個鎖定銷與該旋轉夾頭的該複數個鍵槽脫離,以降低該底板,使得該底板與該旋轉夾頭分離,從而使該旋轉夾頭脫離該底板,並且其中,降低該底板到一個鎖定點,在該鎖定點上,在該底板下方的該清潔噴嘴的一部分通過該底板中的一孔並完全地露出於該底板且在該底板之上方,使得該清潔噴嘴被優化暴露於該基板材料的該底面及其邊緣。
- 如請求項1所述的旋塗裝置,其中:該基板材料是一半導體晶圓。
- 如請求項1所述的旋塗裝置,其中該致動器機構與一氣缸相關聯,該氣缸被配置為:根據該底板向上朝該旋轉夾頭運動而加壓,從而使該底板與該旋轉夾頭接合,及釋放壓力以使該底板與該旋轉夾頭脫離。
- 如請求項3所述的旋塗裝置,其中:該旋轉夾頭與一軸管相關聯,該軸管被配置成作為其一旋轉軸。
- 如請求項4所述的旋塗裝置,其中該成膜物質是一光刻膠材料。
- 如請求項1所述的旋塗裝置,其中該清潔噴嘴是一邊緣光刻膠去除(EBR)噴嘴。
- 如請求項4所述的旋塗裝置,其中圍繞該軸管的一套筒被配置成基於通過該氣缸的加壓而升高,以使得該底板能夠朝著該旋轉夾頭向上移動。
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