TWI726728B - 晶圓清洗裝置 - Google Patents

晶圓清洗裝置 Download PDF

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TWI726728B
TWI726728B TW109117172A TW109117172A TWI726728B TW I726728 B TWI726728 B TW I726728B TW 109117172 A TW109117172 A TW 109117172A TW 109117172 A TW109117172 A TW 109117172A TW I726728 B TWI726728 B TW I726728B
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wafer
wafer cleaning
cleaning device
water tank
clamp
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TW109117172A
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TW202144089A (zh
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馮傳彰
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辛耘企業股份有限公司
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Priority to CN202010526521.6A priority patent/CN113707571A/zh
Priority to KR1020200072874A priority patent/KR102379439B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

本發明提供一種晶圓清洗裝置，用於清洗一載具上的一晶圓，晶圓清洗裝置包含一水槽、一吊架、一夾具、一開閉機構、一旋轉機構、一升降機構及至少一沖洗噴嘴。吊架的至少一部分懸設在水槽上方。夾具設置在吊架而懸設在水槽上方，夾具包含用於承載載具的一遮罩及用於將載具壓制於遮罩的一壓蓋，遮罩開設有供晶圓露出的一通口，通口向下朝向水槽配置。開閉機構連接在遮罩及壓蓋之間以相對移動遮罩及壓蓋而開啟或閉合夾具。旋轉機構連動夾具而能夠驅動夾具水平旋轉。升降機構連動夾具而能夠驅動夾具升降。沖洗噴嘴設置在水槽內且向上朝向通口配置。

Description

晶圓清洗裝置
本發明係有關於，尤其是一種用於晶圓後端製程的晶圓清洗裝置。
現今的晶圓蝕刻製程中需以化學藥液處理晶圓表面，在完成蝕刻製程後需將化學藥液清洗乾淨後才能接續進行後續製程。現今常使用的清洗方式係將晶圓黏貼於一膠膜上，此膠膜張緊固定於一外框，故可以藉由機械手臂移動清洗。一般而言，清洗時晶圓固定且向上配置，晶圓上方設置有一活動噴嘴以向下對晶圓噴灑清洗液，然而此清洗方式不易控制活動噴嘴的噴灑範圍且清洗液逸流也難以控制。
有鑑於此，本發明人遂針對上述現有技術，特潛心研究並配合學理的運用，盡力解決上述之問題點，即成為本發明人改良之目標。
本發明提供一種用於晶圓後端製程的晶圓清洗裝置。
本發明提供一種晶圓清洗裝置，用於清洗一載具上的一晶圓，載具包含一環框以及張緊設置在環框的一膠膜，且晶圓貼附在膠膜上，晶圓清洗 裝置包含一水槽一吊架一夾具一開閉機構一旋轉機構一升降機構及至少一沖洗噴嘴。吊架的至少一部分懸設在水槽上方。夾具設置在吊架而懸設在水槽上方，夾具包含用於承載載具的一遮罩及用於將載具壓制於遮罩的一壓蓋，遮罩開設有供晶圓露出的一通口，通口向下朝向水槽配置。開閉機構連接在遮罩及壓蓋之間以相對移動遮罩及壓蓋而開啟或閉合夾具。旋轉機構連動夾具而能夠驅動夾具水平旋轉。升降機構連動夾具而能夠驅動夾具升降。沖洗噴嘴設置在水槽內且向上朝向通口配置。
本發明的晶圓清洗裝置，其壓蓋具有一壓制平面，且壓制平面朝向遮罩配置。遮罩與水槽之間具有一間隙。通口的口緣設有一密封圈。密封圈嵌固遮罩。通口外圍設有一錐面，且錐面向下朝向水槽配置。
本發明的晶圓清洗裝置，其水槽內設置有一噴氣嘴。水槽設有一排氣道，排氣道的至少一部分形成上下轉折的擋水彎。排氣道連通水槽內側壁之底部。水槽的底面開設有一排水孔。
本發明的晶圓清洗裝置，其開閉機構包含至少一氣壓缸，氣壓缸連接在遮罩及壓蓋之間。旋轉機構被升降機構驅動而隨夾具升降移動。旋轉機構包含一旋轉軸桿及一馬達，旋轉軸桿連接壓蓋且馬達連動旋轉軸桿。旋轉軸桿與馬達之間以一傳動皮帶連接而連動。升降機構包含連動夾具的一氣壓缸。
本發明的晶圓清洗裝置，其沖洗噴嘴為複數，且各沖洗噴嘴分別用於噴灑不同的清洗液
本發明的晶圓清洗裝置，藉由其夾具將晶圓的待清洗面向下配置並且以遮罩罩蓋於載具，再者，沖洗噴嘴固定設置定向噴灑。因此能夠精確控制噴灑範圍，藉此使得清洗液只接觸晶圓，且清洗液沖洗晶圓後即向下排除而不會逸流接觸晶圓載具。
10:載具
11:環框
12:膠膜
20:晶圓
100:水槽
101:排水孔
110:排氣道
111:擋水彎
200:吊架
210:懸臂
300:夾具
301:通口
310:遮罩
311:密封圈
312:錐面
320:壓蓋
321:壓制平面
400:開閉機構
500:旋轉機構
510:旋轉軸桿
520:馬達
600:升降機構
710:沖洗噴嘴
720:噴氣嘴
圖1係本發明較佳實施例之晶圓清洗裝置之示意圖。
圖2係本發明較佳實施例之晶圓清洗裝置之示意圖。
圖3係本發明較佳實施例之晶圓清洗裝置之示意圖。
圖4係本發明較佳實施例之晶圓清洗裝置之示意圖。
圖5係本發明較佳實施例之晶圓清洗裝置之示意圖。
參閱圖1，本發明的較佳實施例提供一種晶圓清洗裝置，其用於清洗一晶圓20。晶圓20承載於一載具10上，載具10包含一環框11以及一膠膜12。環框11較佳地為金屬製的環片，具體而言，環框11為不鏽鋼制，但本發明不以此為限。膠膜12張緊設置在環框11上，且晶圓20可被固定在膠膜12上環框11環繞的區域內。具體而言，環框11與晶圓20貼附膠膜12的同一面，晶圓20置於環框11內且與環框11間隔配置。本發明的晶圓清洗裝置較佳地使用於4吋薄化晶圓20，其厚度約100μm，但本發明不以此為限。
於本實施例中，本發明的晶圓清洗裝置至少包含一水槽100、一吊架200、一夾具300、一開閉機構400、一旋轉機構500、一升降機構600及至少一沖洗噴嘴710。
於本實施例中，吊架200設置在水槽100的一側且吊架200延伸出一懸臂210，且懸臂210懸設在水槽100上方。
夾具300懸吊設置在懸臂210下方而懸設在水槽100上方，但本發明不限於此，吊架200也可以跨越水槽100配置而使其至少一部分懸設在水槽100 上方以供懸吊夾具300。於本實施例中，夾具300包含一遮罩310及一壓蓋320。遮罩310用於承載載具10，則配置在遮罩310上方以用於將載具10壓制於遮罩310。遮罩310開設有一通口301以供晶圓20露出，通口301向下朝向水槽100配置。通口301的口緣設有一密封圈311，且密封圈311較佳地可以嵌固遮罩310。通口301的外圍設有一錐面312，且此錐面312向下朝向水槽100配置。壓蓋320具有一壓制平面321，且壓制平面321朝向遮罩310配置。
開閉機構400連接在遮罩310及壓蓋320之間以相對移動遮罩310及壓蓋320而開啟或閉合夾具300。開閉機構400包含至少一氣壓缸，氣壓缸連接在遮罩310及壓蓋320之間，於本實施例中，氣壓缸能夠驅動遮罩310上升向壓蓋320靠攏而夾固載具10，但本發明不以此為限。例如升降機構600也可以包含連動夾具300的一電動缸(線性致動器)或是其他具有特定行程的致動機構，藉此能夠避免夾具300過度擠壓晶圓20而損壞晶圓20。當夾具300開啟時，遮罩310與壓蓋320分離，載具10及晶圓20可被放置到遮罩310上且晶圓20對齊遮罩310通口301而向下露出於通口301內。
參閱圖2，當遮罩310與壓蓋320靠攏閉合時，載具10被夾固在遮罩310與壓蓋320之間，壓制平面321平貼於膠膜12的另一面而支撐晶圓20，藉此確保膠膜12平整，其使得晶圓20略微擠壓密封圈311而使晶圓20與遮罩310的通口301密合。
旋轉機構500連動夾具300而能夠驅動夾具300水平旋轉。具體而言，旋轉機構500可以包含一旋轉軸桿510及一馬達520，旋轉軸桿510連接壓蓋320且旋轉軸桿510與馬達520之間以一傳動皮帶連接而馬達520使連動旋轉軸桿510。於本實施例中，馬達520，旋轉軸桿510及傳動皮帶皆設置在吊架200內， 但本發明不以此為限，例如馬達520也可以不設置在吊架200，旋轉軸桿510與馬達520之間也可以藉由齒輪連動。
參閱圖3，升降機構600連動夾具300而能夠驅動夾具300升降，升降機構600較佳地連接於吊架200，升降機構600可以連接在可活動的吊架200與固定物之間，藉由驅動吊架200升降而帶動夾具300升降；升降機構600也可以連接在固定的吊架200與夾具300之而帶動夾具300升降。因此，前述的旋轉機構500可以固定設置，也可以被升降機構600驅動而隨夾具300升降移動。於本實施例中，升降機構600也可以包含連動夾具300的至少一氣壓缸，但本發明不以此為限。例如升降機構600包含連動夾具300的電動缸(線性致動器)或是其他具有特定行程的致動機構。
升降機構600驅動夾具300降下後能夠使遮罩310閉合水槽100，且遮罩310與水槽100之間具有微小間隙而使遮罩310能夠旋轉。
參閱圖4，沖洗噴嘴710設置在水槽100內且向上朝向通口301配置，沖洗噴嘴710用於噴灑清洗液，清洗液可以是水或是其他化學藥液。本發明不限定沖洗噴嘴710之數量。
當旋轉機構500驅動夾具300水平旋轉時，沖洗噴嘴710朝向通口301對露出在通口301的晶圓20噴灑清洗液以沖洗晶圓20，清洗液沖洗晶圓20後即沿錐面312向下滙流入水槽100內而不會逸流接觸載具10，且水槽100的底面開設有一排水孔101供排除使用過的清洗液。
參閱圖5，水槽100內可以更設置有一噴氣嘴720，晶圓20沖洗後可以藉由噴氣嘴720向水槽100內送入氣體而吹乾晶圓20。於本實施例中，噴氣嘴720較佳地向水槽100內送入氮氣，但本發明不以此為限，例如氣體也可以是 空氣。相對應地，水槽100設有一排氣道110以供排除濕氣體。濕氣體可以藉由噴氣嘴720的正壓驅動而向排氣道110排出，也可以藉由在排氣道110提供負壓而排出。於本實施例中，排氣道110為環繞水槽100內部空間的一環形管道，排氣道110連通水槽100內側壁之底部的至少一處，且排氣道110另連通至水槽100外。排氣道110的至少一部分形成上下轉折的擋水彎111，擋水彎111能夠阻擋使用過的清洗液通過排氣道110排出水槽100。因此，通過排水孔101及排氣道110能夠將使用過的清洗液及氣體分別收集以利後續廢棄處理或回收再利用。
本發明的晶圓清洗裝置，藉由其夾具300將晶圓20的待清洗面向下配置並且以遮罩310罩蓋於載具10，再者，沖洗噴嘴710固定設置定向噴灑。因此能夠精確控制噴灑範圍，藉此使得清洗液只接觸晶圓20，且清洗液沖洗晶圓20後即向下排除而不會逸流接觸載具10。
以上所述僅為本發明之較佳實施例，非用以限定本發明之專利範圍，其他運用本發明之專利精神之等效變化，均應俱屬本發明之專利範圍。
10:載具
11:環框
12:膠膜
20:晶圓
100:水槽
101:排水孔
110:排氣道
111:擋水彎
200:吊架
210:懸臂
300:夾具
301:通口
310:遮罩
311:密封圈
312:錐面
320:壓蓋
321:壓制平面
400:開閉機構
500:旋轉機構
510:旋轉軸桿
520:馬達
600:升降機構
710:沖洗噴嘴
720:噴氣嘴

Claims (16)

  1. 一種晶圓清洗裝置，用於清洗一載具上的一晶圓，所述載具包含一環框以及張緊設置在所述環框的一膠膜，且所述晶圓貼附在所述膠膜上，該晶圓清洗裝置包含：一水槽；一吊架，該吊架的至少一部分懸設在該水槽上方；一夾具，設置在該吊架而懸設在該水槽上方，該夾具包含用於承載所述載具的一遮罩及用於將所述載具壓制於該遮罩的一壓蓋，該遮罩開設有供所述晶圓露出的一通口，該通口向下朝向該水槽配置；一開閉機構，連接在該遮罩及該壓蓋之間以相對移動該遮罩及該壓蓋而開啟或閉合該夾具；一旋轉機構，連動該夾具而能夠驅動該夾具水平旋轉；一升降機構，連動該夾具而能夠驅動該夾具升降；及至少一沖洗噴嘴，設置在該水槽內且向上朝向該通口配置。
  2. 如請求項1所述的晶圓清洗裝置，其中該壓蓋具有一壓制平面，且該壓制平面朝向該遮罩配置。
  3. 如請求項1所述的晶圓清洗裝置，其中該遮罩與該水槽之間具有一間隙。
  4. 如請求項1所述的晶圓清洗裝置，其中該通口的口緣設有一密封圈。
  5. 如請求項4所述的晶圓清洗裝置，其中該密封圈嵌固該遮罩。
  6. 如請求項1所述的晶圓清洗裝置，其中該通口外圍設有一錐面，且該錐面向下朝向該水槽配置。
  7. 如請求項1所述的晶圓清洗裝置，其中該水槽內設置有一噴氣嘴。
  8. 如請求項7所述的晶圓清洗裝置，其中該水槽設有一排氣道，該排氣道的至少一部分形成上下轉折的擋水彎。
  9. 如請求項8所述的晶圓清洗裝置，其中該排氣道連通該水槽內側壁之底部。
  10. 如請求項1所述的晶圓清洗裝置，其中該水槽的底面開設有一排水孔。
  11. 如請求項1所述的晶圓清洗裝置，其中該開閉機構包含至少一氣壓缸，該氣壓缸連接在該遮罩及該壓蓋之間。
  12. 如請求項1所述的晶圓清洗裝置，其中該旋轉機構被該升降機構驅動而該隨夾具升降移動。
  13. 如請求項1所述的晶圓清洗裝置，其中該旋轉機構包含一旋轉軸桿及一馬達，該旋轉軸桿連接該壓蓋且該馬達連動該旋轉軸桿。
  14. 如請求項13所述的晶圓清洗裝置，其中該旋轉軸桿與該馬達之間以一傳動皮帶連接而連動。
  15. 如請求項1所述的晶圓清洗裝置，其中該升降機構包含連動該夾具的一氣壓缸。
  16. 如請求項1所述的晶圓清洗裝置，其中沖洗噴嘴為複數，且各該沖洗噴嘴分別用於噴灑不同的清洗液。
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