TWI714815B - 物品、物品之製造方法及空隙之填充方法 - Google Patents

物品、物品之製造方法及空隙之填充方法 Download PDF

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Publication number
TWI714815B
TWI714815B TW106143433A TW106143433A TWI714815B TW I714815 B TWI714815 B TW I714815B TW 106143433 A TW106143433 A TW 106143433A TW 106143433 A TW106143433 A TW 106143433A TW I714815 B TWI714815 B TW I714815B
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TW
Taiwan
Prior art keywords
adhesive layer
thermoplastic
expandable
heat
adherend
Prior art date
Application number
TW106143433A
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English (en)
Chinese (zh)
Other versions
TW201829684A (zh
Inventor
唐澤久美子
秋山誠二
森野彰規
Original Assignee
日商迪愛生股份有限公司
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Application filed by 日商迪愛生股份有限公司 filed Critical 日商迪愛生股份有限公司
Publication of TW201829684A publication Critical patent/TW201829684A/zh
Application granted granted Critical
Publication of TWI714815B publication Critical patent/TWI714815B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/10—Interconnection of layers at least one layer having inter-reactive properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW106143433A 2016-12-26 2017-12-12 物品、物品之製造方法及空隙之填充方法 TWI714815B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016-251162 2016-12-26
JP2016251162 2016-12-26
JP2017-087168 2017-04-26
JP2017087168 2017-04-26

Publications (2)

Publication Number Publication Date
TW201829684A TW201829684A (zh) 2018-08-16
TWI714815B true TWI714815B (zh) 2021-01-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW106143433A TWI714815B (zh) 2016-12-26 2017-12-12 物品、物品之製造方法及空隙之填充方法

Country Status (4)

Country Link
JP (1) JP6555563B2 (ja)
CN (1) CN110099978B (ja)
TW (1) TWI714815B (ja)
WO (1) WO2018123615A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114286847A (zh) * 2019-09-10 2022-04-05 Dic株式会社 热敏粘接片和贴合有热敏粘接片的物品的制造方法
JP6977835B1 (ja) * 2020-08-28 2021-12-08 王子ホールディングス株式会社 加飾フィルム及び加飾成形体
WO2022131111A1 (ja) * 2020-12-15 2022-06-23 Dic株式会社 接着シート、並びに物品及び物品の製造方法
WO2022131110A1 (ja) * 2020-12-15 2022-06-23 Dic株式会社 接着シート、並びに物品及び物品の製造方法
JP2022178658A (ja) * 2021-05-20 2022-12-02 ニッカン工業株式会社 加熱膨張シート
CN113386428A (zh) * 2021-06-23 2021-09-14 天津辰弘新材料科技有限公司 一种树脂膨胀胶及其制备方法
WO2023204005A1 (ja) * 2022-04-18 2023-10-26 デンカ株式会社 粘着テープ及びその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201638263A (zh) * 2015-02-24 2016-11-01 Nitto Denko Corp 熱剝離型黏著片

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58204075A (ja) * 1982-05-25 1983-11-28 Aica Kogyo Co Ltd 発泡性ホツトメルト接着剤の製造法
JPH05311134A (ja) * 1992-05-07 1993-11-22 Nitto Denko Corp 高周波加熱型接着剤
JP2670728B2 (ja) * 1992-08-21 1997-10-29 積水化学工業株式会社 粘着性熱可塑性樹脂発泡シートの製造方法
EP1953184B1 (en) * 2005-09-16 2018-08-01 Matsumoto Yushi-Seiyaku Co., Ltd. Thermally expanded microsphere and process for production thereof
JP5701508B2 (ja) * 2009-03-04 2015-04-15 日東電工株式会社 導電性を有する樹脂発泡体
CA2827189A1 (en) * 2011-02-14 2012-08-23 Lintec Corporation Hot-melt adhesion composition, hot-melt adhesive sheet and adhesion method
JP5662866B2 (ja) * 2011-03-31 2015-02-04 積水化学工業株式会社 粘着シート
JP2014005423A (ja) * 2012-06-27 2014-01-16 Sika Technology Ag 粘着性組成物及び粘着性発泡シート
BR112015017383A2 (pt) * 2013-01-24 2017-07-11 Henkel Ag & Co Kgaa composições de adesivo de fusão a quente espumável e uso das mesmas
EP3116965A2 (en) * 2014-03-13 2017-01-18 Avery Dennison Corporation Shock absorbing expanded adhesvie and articles therefrom
WO2015152222A1 (ja) * 2014-03-31 2015-10-08 積水化学工業株式会社 ポリオレフィン系発泡シート及び粘着テープ

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201638263A (zh) * 2015-02-24 2016-11-01 Nitto Denko Corp 熱剝離型黏著片

Also Published As

Publication number Publication date
CN110099978B (zh) 2021-10-08
JPWO2018123615A1 (ja) 2019-10-31
JP6555563B2 (ja) 2019-08-07
WO2018123615A1 (ja) 2018-07-05
TW201829684A (zh) 2018-08-16
CN110099978A (zh) 2019-08-06

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