TWI712670B - 保護膜形成用片以及附有保護膜的晶片的製造方法 - Google Patents

保護膜形成用片以及附有保護膜的晶片的製造方法 Download PDF

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Publication number
TWI712670B
TWI712670B TW108128902A TW108128902A TWI712670B TW I712670 B TWI712670 B TW I712670B TW 108128902 A TW108128902 A TW 108128902A TW 108128902 A TW108128902 A TW 108128902A TW I712670 B TWI712670 B TW I712670B
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TW
Taiwan
Prior art keywords
protective film
sheet
film forming
laminate
forming
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TW108128902A
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English (en)
Chinese (zh)
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TW201940622A (zh
Inventor
山本大輔
佐伯尚哉
米山裕之
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日商琳得科股份有限公司
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Publication of TW201940622A publication Critical patent/TW201940622A/zh
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Publication of TWI712670B publication Critical patent/TWI712670B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Formation Of Insulating Films (AREA)
  • Paints Or Removers (AREA)
  • Adhesive Tapes (AREA)
  • Laser Beam Processing (AREA)
  • Laminated Bodies (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW108128902A 2014-08-22 2015-08-21 保護膜形成用片以及附有保護膜的晶片的製造方法 TWI712670B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014-169267 2014-08-22
JP2014169266 2014-08-22
JP2014-169266 2014-08-22
JP2014169267 2014-08-22

Publications (2)

Publication Number Publication Date
TW201940622A TW201940622A (zh) 2019-10-16
TWI712670B true TWI712670B (zh) 2020-12-11

Family

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Family Applications (4)

Application Number Title Priority Date Filing Date
TW108128902A TWI712670B (zh) 2014-08-22 2015-08-21 保護膜形成用片以及附有保護膜的晶片的製造方法
TW108122914A TWI706023B (zh) 2014-08-22 2015-08-21 保護膜形成用片以及附有保護膜的晶片的製造方法
TW104127316A TWI672354B (zh) 2014-08-22 2015-08-21 保護膜形成用片以及附有保護膜的半導體晶片的製造方法
TW104127314A TWI668290B (zh) 2014-08-22 2015-08-21 保護膜形成用片以及附有保護膜的半導體晶片的製造方法

Family Applications After (3)

Application Number Title Priority Date Filing Date
TW108122914A TWI706023B (zh) 2014-08-22 2015-08-21 保護膜形成用片以及附有保護膜的晶片的製造方法
TW104127316A TWI672354B (zh) 2014-08-22 2015-08-21 保護膜形成用片以及附有保護膜的半導體晶片的製造方法
TW104127314A TWI668290B (zh) 2014-08-22 2015-08-21 保護膜形成用片以及附有保護膜的半導體晶片的製造方法

Country Status (8)

Country Link
JP (2) JP6589209B2 (ja)
KR (2) KR102376017B1 (ja)
CN (2) CN106660332B (ja)
MY (2) MY186759A (ja)
PH (2) PH12017500284A1 (ja)
SG (2) SG11201701270QA (ja)
TW (4) TWI712670B (ja)
WO (2) WO2016027883A1 (ja)

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SG11201803325QA (en) * 2015-10-29 2018-05-30 Lintec Corp Film for protective film formation and composite sheet for protective film formation
CN108271381B (zh) * 2016-03-04 2022-06-07 琳得科株式会社 半导体加工用片
JP6573841B2 (ja) * 2016-03-04 2019-09-11 リンテック株式会社 半導体加工用シート
CN108243616B (zh) * 2016-03-04 2022-10-28 琳得科株式会社 半导体加工用片
SG11201805895XA (en) * 2016-03-04 2018-09-27 Lintec Corp Protective film-forming composite sheet
KR102516392B1 (ko) * 2016-03-04 2023-03-30 린텍 가부시키가이샤 보호막 형성용 복합 시트
JP6617056B2 (ja) * 2016-03-04 2019-12-04 リンテック株式会社 半導体加工用シート、その巻取体および当該巻取体の製造方法
TWI721158B (zh) * 2016-04-28 2021-03-11 日商琳得科股份有限公司 保護膜形成用膜及保護膜形成用複合片
TWI731964B (zh) * 2016-04-28 2021-07-01 日商琳得科股份有限公司 保護膜形成用複合片
TWI796297B (zh) * 2016-04-28 2023-03-21 日商琳得科股份有限公司 保護膜形成用複合片
TWI778960B (zh) * 2016-04-28 2022-10-01 日商琳得科股份有限公司 保護膜形成用膜、保護膜形成用複合片、以及附有保護膜的半導體晶片之製造方法
CN109071845A (zh) * 2016-04-28 2018-12-21 琳得科株式会社 保护膜形成用膜以及保护膜形成用复合片
JP6278164B1 (ja) * 2016-05-12 2018-02-14 住友ベークライト株式会社 半導体基板加工用粘着テープ
JP6776081B2 (ja) * 2016-09-28 2020-10-28 リンテック株式会社 保護膜付き半導体チップの製造方法及び半導体装置の製造方法
CN110622302B (zh) * 2017-05-17 2022-11-22 琳得科株式会社 半导体装置及其制造方法
SG11202001719RA (en) * 2017-08-28 2020-03-30 Lintec Corp Film-like transparent adhesive and infrared sensor module
WO2019146607A1 (ja) * 2018-01-24 2019-08-01 リンテック株式会社 長尺積層シートおよびその巻収体
KR102487552B1 (ko) 2018-02-05 2023-01-11 삼성전자주식회사 보호막 조성물 및 이를 이용한 반도체 패키지 제조 방법
CN111670231B (zh) * 2018-03-23 2022-06-03 琳得科株式会社 膜状粘合剂及半导体加工用片
WO2019187014A1 (ja) * 2018-03-30 2019-10-03 リンテック株式会社 支持シート及び保護膜形成用複合シート
WO2019187010A1 (ja) * 2018-03-30 2019-10-03 リンテック株式会社 保護膜形成用複合シート及びその製造方法
JP6854983B1 (ja) * 2019-04-26 2021-04-07 リンテック株式会社 第三積層体の製造方法、第四積層体の製造方法及び裏面保護膜付き半導体装置の製造方法、並びに、第三積層体
JP7453879B2 (ja) 2020-08-12 2024-03-21 リンテック株式会社 保護膜形成用シートロールおよび保護膜形成用シートロールの製造方法
JP7484557B2 (ja) 2020-08-18 2024-05-16 三菱ケミカル株式会社 粘接着剤組成物、粘接着シート及び積層体
JP7084972B2 (ja) * 2020-10-06 2022-06-15 リンテック株式会社 保護膜形成用複合シート

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JP3857953B2 (ja) * 2002-05-16 2006-12-13 株式会社巴川製紙所 半導体装置製造用接着シート
TW200507193A (en) * 2003-07-08 2005-02-16 Lintec Corp Adhesive sheet for dicing and die bonding and method of manufacturing semiconductor device
US20090053518A1 (en) * 2006-03-28 2009-02-26 Lintec Corporation Sheet for Forming a Protective Film for Chips
CN101817250A (zh) * 2009-02-27 2010-09-01 琳得科株式会社 光学用保护膜及其制造方法以及偏光片及其制造方法

Also Published As

Publication number Publication date
JP6589209B2 (ja) 2019-10-16
PH12017500284B1 (en) 2017-07-03
TW201938728A (zh) 2019-10-01
PH12017500284A1 (en) 2017-07-03
SG11201701272UA (en) 2017-04-27
TW201614023A (en) 2016-04-16
KR102368140B1 (ko) 2022-02-25
TWI706023B (zh) 2020-10-01
TW201940622A (zh) 2019-10-16
CN106660333A (zh) 2017-05-10
TWI672354B (zh) 2019-09-21
WO2016027883A1 (ja) 2016-02-25
MY186759A (en) 2021-08-18
KR20170044652A (ko) 2017-04-25
JPWO2016027883A1 (ja) 2017-06-01
MY182846A (en) 2021-02-05
SG11201701270QA (en) 2017-03-30
WO2016027888A1 (ja) 2016-02-25
TWI668290B (zh) 2019-08-11
JPWO2016027888A1 (ja) 2017-06-01
PH12017500285A1 (en) 2017-06-28
KR20170044108A (ko) 2017-04-24
CN106660332B (zh) 2020-08-07
CN106660333B (zh) 2018-11-06
TW201614024A (en) 2016-04-16
CN106660332A (zh) 2017-05-10
KR102376017B1 (ko) 2022-03-17
PH12017500285B1 (en) 2017-06-28

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