KR102376017B1 - 보호막 형성용 시트 및 보호막이 형성된 반도체 칩의 제조 방법 - Google Patents

보호막 형성용 시트 및 보호막이 형성된 반도체 칩의 제조 방법 Download PDF

Info

Publication number
KR102376017B1
KR102376017B1 KR1020177004494A KR20177004494A KR102376017B1 KR 102376017 B1 KR102376017 B1 KR 102376017B1 KR 1020177004494 A KR1020177004494 A KR 1020177004494A KR 20177004494 A KR20177004494 A KR 20177004494A KR 102376017 B1 KR102376017 B1 KR 102376017B1
Authority
KR
South Korea
Prior art keywords
protective film
sheet
forming
film
laminate
Prior art date
Application number
KR1020177004494A
Other languages
English (en)
Korean (ko)
Other versions
KR20170044108A (ko
Inventor
다이스케 야마모토
나오야 사이키
히로유키 요네야마
Original Assignee
린텍 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20170044108A publication Critical patent/KR20170044108A/ko
Application granted granted Critical
Publication of KR102376017B1 publication Critical patent/KR102376017B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Formation Of Insulating Films (AREA)
  • Paints Or Removers (AREA)
  • Adhesive Tapes (AREA)
  • Laser Beam Processing (AREA)
  • Laminated Bodies (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020177004494A 2014-08-22 2015-08-21 보호막 형성용 시트 및 보호막이 형성된 반도체 칩의 제조 방법 KR102376017B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2014-169266 2014-08-22
JPJP-P-2014-169267 2014-08-22
JP2014169266 2014-08-22
JP2014169267 2014-08-22
PCT/JP2015/073503 WO2016027883A1 (ja) 2014-08-22 2015-08-21 保護膜形成用シートおよび保護膜付き半導体チップの製造方法

Publications (2)

Publication Number Publication Date
KR20170044108A KR20170044108A (ko) 2017-04-24
KR102376017B1 true KR102376017B1 (ko) 2022-03-17

Family

ID=55350823

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020177004494A KR102376017B1 (ko) 2014-08-22 2015-08-21 보호막 형성용 시트 및 보호막이 형성된 반도체 칩의 제조 방법
KR1020177004497A KR102368140B1 (ko) 2014-08-22 2015-08-21 보호막 형성용 시트 및 보호막이 형성된 반도체 칩의 제조 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020177004497A KR102368140B1 (ko) 2014-08-22 2015-08-21 보호막 형성용 시트 및 보호막이 형성된 반도체 칩의 제조 방법

Country Status (8)

Country Link
JP (2) JP6589209B2 (ja)
KR (2) KR102376017B1 (ja)
CN (2) CN106660332B (ja)
MY (2) MY186759A (ja)
PH (2) PH12017500284A1 (ja)
SG (2) SG11201701270QA (ja)
TW (4) TWI712670B (ja)
WO (2) WO2016027883A1 (ja)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201803325QA (en) * 2015-10-29 2018-05-30 Lintec Corp Film for protective film formation and composite sheet for protective film formation
CN108271381B (zh) * 2016-03-04 2022-06-07 琳得科株式会社 半导体加工用片
JP6573841B2 (ja) * 2016-03-04 2019-09-11 リンテック株式会社 半導体加工用シート
CN108243616B (zh) * 2016-03-04 2022-10-28 琳得科株式会社 半导体加工用片
SG11201805895XA (en) * 2016-03-04 2018-09-27 Lintec Corp Protective film-forming composite sheet
KR102516392B1 (ko) * 2016-03-04 2023-03-30 린텍 가부시키가이샤 보호막 형성용 복합 시트
JP6617056B2 (ja) * 2016-03-04 2019-12-04 リンテック株式会社 半導体加工用シート、その巻取体および当該巻取体の製造方法
TWI721158B (zh) * 2016-04-28 2021-03-11 日商琳得科股份有限公司 保護膜形成用膜及保護膜形成用複合片
TWI731964B (zh) * 2016-04-28 2021-07-01 日商琳得科股份有限公司 保護膜形成用複合片
TWI796297B (zh) * 2016-04-28 2023-03-21 日商琳得科股份有限公司 保護膜形成用複合片
TWI778960B (zh) * 2016-04-28 2022-10-01 日商琳得科股份有限公司 保護膜形成用膜、保護膜形成用複合片、以及附有保護膜的半導體晶片之製造方法
CN109071845A (zh) * 2016-04-28 2018-12-21 琳得科株式会社 保护膜形成用膜以及保护膜形成用复合片
JP6278164B1 (ja) * 2016-05-12 2018-02-14 住友ベークライト株式会社 半導体基板加工用粘着テープ
JP6776081B2 (ja) * 2016-09-28 2020-10-28 リンテック株式会社 保護膜付き半導体チップの製造方法及び半導体装置の製造方法
CN110622302B (zh) * 2017-05-17 2022-11-22 琳得科株式会社 半导体装置及其制造方法
SG11202001719RA (en) * 2017-08-28 2020-03-30 Lintec Corp Film-like transparent adhesive and infrared sensor module
WO2019146607A1 (ja) * 2018-01-24 2019-08-01 リンテック株式会社 長尺積層シートおよびその巻収体
KR102487552B1 (ko) 2018-02-05 2023-01-11 삼성전자주식회사 보호막 조성물 및 이를 이용한 반도체 패키지 제조 방법
CN111670231B (zh) * 2018-03-23 2022-06-03 琳得科株式会社 膜状粘合剂及半导体加工用片
WO2019187014A1 (ja) * 2018-03-30 2019-10-03 リンテック株式会社 支持シート及び保護膜形成用複合シート
WO2019187010A1 (ja) * 2018-03-30 2019-10-03 リンテック株式会社 保護膜形成用複合シート及びその製造方法
JP6854983B1 (ja) * 2019-04-26 2021-04-07 リンテック株式会社 第三積層体の製造方法、第四積層体の製造方法及び裏面保護膜付き半導体装置の製造方法、並びに、第三積層体
JP7453879B2 (ja) 2020-08-12 2024-03-21 リンテック株式会社 保護膜形成用シートロールおよび保護膜形成用シートロールの製造方法
JP7484557B2 (ja) 2020-08-18 2024-05-16 三菱ケミカル株式会社 粘接着剤組成物、粘接着シート及び積層体
JP7084972B2 (ja) * 2020-10-06 2022-06-15 リンテック株式会社 保護膜形成用複合シート

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004214288A (ja) * 2002-12-27 2004-07-29 Lintec Corp チップ用保護膜形成用シート
JP2013120841A (ja) * 2011-12-07 2013-06-17 Lintec Corp 保護膜形成層付ダイシングシートおよびチップの製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3252806B1 (en) 2002-03-12 2019-10-09 Hamamatsu Photonics K.K. Substrate dividing method
KR100633849B1 (ko) * 2002-04-03 2006-10-13 가부시키가이샤 도모에가와 세이시쇼 반도체 장치 제조용 접착 시트
JP3857953B2 (ja) * 2002-05-16 2006-12-13 株式会社巴川製紙所 半導体装置製造用接着シート
KR101177250B1 (ko) * 2003-06-06 2012-08-24 히다치 가세고교 가부시끼가이샤 접착시트, 다이싱 테이프 일체형 접착시트 및 반도체 장치의 제조방법
EP1650790B1 (en) * 2003-07-08 2010-04-28 LINTEC Corporation Hardenable pressure sensitive adhesive sheet for dicing/die-bonding and method for manufacturing semiconductor device
JP4846406B2 (ja) * 2006-03-28 2011-12-28 リンテック株式会社 チップ用保護膜形成用シート
US20110220728A1 (en) * 2008-11-27 2011-09-15 Du Pont-Mitsui Polychemicals Co., Ltd. Protective film for electronic component, method for manufacturing the same, and use thereof
JP5335483B2 (ja) * 2009-02-27 2013-11-06 リンテック株式会社 粘着剤層付き偏光板の製造方法
JP5603757B2 (ja) * 2009-12-04 2014-10-08 リンテック株式会社 レーザーダイシング用粘着シート及び半導体装置の製造方法
JP2011151362A (ja) 2009-12-24 2011-08-04 Nitto Denko Corp ダイシングテープ一体型半導体裏面用フィルム
JP2012033637A (ja) 2010-07-29 2012-02-16 Nitto Denko Corp ダイシングテープ一体型半導体裏面用フィルム及び半導体装置の製造方法
JP5580701B2 (ja) * 2010-09-13 2014-08-27 日東電工株式会社 ダイシング・ダイボンドフィルム
CN103620742B (zh) * 2011-07-01 2016-05-25 古河电气工业株式会社 粘接膜、切割芯片接合膜及使用该切割芯片接合膜的半导体加工方法
JP6001273B2 (ja) * 2012-02-13 2016-10-05 信越化学工業株式会社 半導体ウエハ用保護フィルム及び半導体チップの製造方法
WO2013172328A1 (ja) * 2012-05-14 2013-11-21 リンテック株式会社 接着性樹脂層付シートおよび半導体装置の製造方法
CN104871310B (zh) * 2012-11-30 2018-03-09 琳得科株式会社 芯片用树脂膜形成用片及半导体装置的制造方法
CN111180380B (zh) * 2014-03-24 2023-11-10 琳得科株式会社 保护膜形成膜、保护膜形成用片及加工物的制造方法
WO2015146936A1 (ja) * 2014-03-24 2015-10-01 リンテック株式会社 保護膜形成フィルム、保護膜形成用シート、ワークまたは加工物の製造方法、検査方法、良品と判断されたワーク、および良品と判断された加工物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004214288A (ja) * 2002-12-27 2004-07-29 Lintec Corp チップ用保護膜形成用シート
JP2013120841A (ja) * 2011-12-07 2013-06-17 Lintec Corp 保護膜形成層付ダイシングシートおよびチップの製造方法

Also Published As

Publication number Publication date
JP6589209B2 (ja) 2019-10-16
PH12017500284B1 (en) 2017-07-03
TW201938728A (zh) 2019-10-01
TWI712670B (zh) 2020-12-11
PH12017500284A1 (en) 2017-07-03
SG11201701272UA (en) 2017-04-27
TW201614023A (en) 2016-04-16
KR102368140B1 (ko) 2022-02-25
TWI706023B (zh) 2020-10-01
TW201940622A (zh) 2019-10-16
CN106660333A (zh) 2017-05-10
TWI672354B (zh) 2019-09-21
WO2016027883A1 (ja) 2016-02-25
MY186759A (en) 2021-08-18
KR20170044652A (ko) 2017-04-25
JPWO2016027883A1 (ja) 2017-06-01
MY182846A (en) 2021-02-05
SG11201701270QA (en) 2017-03-30
WO2016027888A1 (ja) 2016-02-25
TWI668290B (zh) 2019-08-11
JPWO2016027888A1 (ja) 2017-06-01
PH12017500285A1 (en) 2017-06-28
KR20170044108A (ko) 2017-04-24
CN106660332B (zh) 2020-08-07
CN106660333B (zh) 2018-11-06
TW201614024A (en) 2016-04-16
CN106660332A (zh) 2017-05-10
PH12017500285B1 (en) 2017-06-28

Similar Documents

Publication Publication Date Title
KR102376017B1 (ko) 보호막 형성용 시트 및 보호막이 형성된 반도체 칩의 제조 방법
JP6591652B2 (ja) 保護膜形成フィルム、保護膜形成用シート、保護膜形成用複合シートおよび加工物の製造方法
JP6670362B2 (ja) 保護膜形成フィルム
KR102378063B1 (ko) 보호막 형성용 복합 시트
KR102365253B1 (ko) 보호막 형성 필름, 보호막 형성용 시트 및 검사 방법
JP6554738B2 (ja) 保護膜形成フィルム、保護膜形成用シート、ワークまたは加工物の製造方法、検査方法、良品と判断されたワーク、および良品と判断された加工物
KR102258918B1 (ko) 보호막 형성용 복합 시트
KR102398753B1 (ko) 보호막 형성용 복합 시트
JP7008620B2 (ja) 半導体加工用シート
JP7042211B2 (ja) 半導体加工用シート
JP6838018B2 (ja) 保護膜形成フィルム、保護膜形成用シートおよび検査方法
WO2016002975A1 (ja) 保護膜形成用複合シート
KR20230085855A (ko) 보호막 형성 필름, 보호막 형성용 시트, 보호막 형성용 복합 시트 및 장치의 제조 방법

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant