TWI710294B - 安裝方法 - Google Patents

安裝方法 Download PDF

Info

Publication number
TWI710294B
TWI710294B TW106121898A TW106121898A TWI710294B TW I710294 B TWI710294 B TW I710294B TW 106121898 A TW106121898 A TW 106121898A TW 106121898 A TW106121898 A TW 106121898A TW I710294 B TWI710294 B TW I710294B
Authority
TW
Taiwan
Prior art keywords
paste
sheet
electronic component
installation
electronic
Prior art date
Application number
TW106121898A
Other languages
English (en)
Chinese (zh)
Other versions
TW201803436A (zh
Inventor
片塩勉
薄井照幸
平木和雄
立岩剛
Original Assignee
日商鈴木股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商鈴木股份有限公司 filed Critical 日商鈴木股份有限公司
Publication of TW201803436A publication Critical patent/TW201803436A/zh
Application granted granted Critical
Publication of TWI710294B publication Critical patent/TWI710294B/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
TW106121898A 2016-07-04 2017-06-30 安裝方法 TWI710294B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/JP2016/069808 WO2018008066A1 (ja) 2016-07-04 2016-07-04 転写方法および実装方法
??PCT/JP2016/069808 2016-07-04
WOPCT/JP2016/069808 2016-07-04

Publications (2)

Publication Number Publication Date
TW201803436A TW201803436A (zh) 2018-01-16
TWI710294B true TWI710294B (zh) 2020-11-11

Family

ID=60912619

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106121898A TWI710294B (zh) 2016-07-04 2017-06-30 安裝方法

Country Status (6)

Country Link
JP (1) JP6543421B2 (ko)
KR (1) KR102019298B1 (ko)
CN (1) CN109315067B (ko)
SG (1) SG11201807190XA (ko)
TW (1) TWI710294B (ko)
WO (1) WO2018008066A1 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7023740B2 (ja) * 2018-02-22 2022-02-22 東レエンジニアリング株式会社 実装装置
KR102436955B1 (ko) * 2020-03-11 2022-08-26 넥스타테크놀로지 주식회사 실장 헤드 및 이를 포함하는 부품 실장 장치
KR102391169B1 (ko) * 2020-03-11 2022-05-03 넥스타테크놀로지 주식회사 실장 헤드 및 이를 포함하는 부품 실장 장치
KR102182856B1 (ko) * 2020-03-11 2020-11-25 넥스타테크놀로지 주식회사 부품 실장 장치
KR102271499B1 (ko) * 2020-10-16 2021-07-01 넥스타테크놀로지 주식회사 실장 헤드 및 이를 포함하는 부품 실장 장치

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09181491A (ja) * 1995-12-27 1997-07-11 Toshiba Corp 半導体装置の実装方法及び実装構造
TWI350720B (en) * 2007-01-18 2011-10-11 Fujitsu Ltd Electronic device and method of manufacturing the same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03120790A (ja) * 1989-10-03 1991-05-22 Toshiba Corp 配線基板の接続装置
JP2002226822A (ja) * 2001-01-30 2002-08-14 Three M Innovative Properties Co 光線活性化型接着フィルムを用いた基材接着方法
JP3914732B2 (ja) * 2001-10-02 2007-05-16 鹿児島日本電気株式会社 回路基板の接続構造及び該接続構造を備えた液晶表示装置並びに液晶表示装置の実装方法
JP2004235442A (ja) * 2003-01-30 2004-08-19 Sharp Corp 表面実装電子部品の実装方法および接着剤供給装置
JP2009158791A (ja) * 2007-12-27 2009-07-16 Ohashi Seisakusho:Kk 緩衝材テープ供給装置の連装装置
JP2011082242A (ja) 2009-10-05 2011-04-21 Panasonic Corp 電子部品実装装置及び電子部品実装方法
JP5370278B2 (ja) * 2010-06-09 2013-12-18 パナソニック株式会社 テープ貼付け装置およびテープ貼付け方法
JP5630639B2 (ja) * 2010-07-07 2014-11-26 住友電気工業株式会社 フィルム状導電性接着剤
JP5025825B2 (ja) * 2010-07-28 2012-09-12 積水化学工業株式会社 絶縁性粒子付き導電性粒子、異方性導電材料及び接続構造体
JP5873972B2 (ja) * 2012-02-23 2016-03-01 パナソニックＩｐマネジメント株式会社 電子部品搭載方法
JP5861040B2 (ja) * 2012-12-27 2016-02-16 パナソニックＩｐマネジメント株式会社 ペースト転写ユニットおよび電子部品実装装置ならびに転写膜厚測定方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09181491A (ja) * 1995-12-27 1997-07-11 Toshiba Corp 半導体装置の実装方法及び実装構造
TWI350720B (en) * 2007-01-18 2011-10-11 Fujitsu Ltd Electronic device and method of manufacturing the same

Also Published As

Publication number Publication date
TW201803436A (zh) 2018-01-16
KR20190024869A (ko) 2019-03-08
JPWO2018008066A1 (ja) 2019-04-18
WO2018008066A1 (ja) 2018-01-11
KR102019298B1 (ko) 2019-09-06
CN109315067A (zh) 2019-02-05
CN109315067B (zh) 2019-12-24
JP6543421B2 (ja) 2019-07-10
SG11201807190XA (en) 2019-01-30

Similar Documents

Publication Publication Date Title
TWI710294B (zh) 安裝方法
TWI575670B (zh) 包括一用於嵌入及／或間隔半導體晶粒之獨立薄膜層之半導體裝置
JP5198265B2 (ja) 薄型可撓性基板の平坦な表面を形成する装置及び方法
JP6267176B2 (ja) 基板アダプタを有する半導体素子、固体基板アダプタを有する半導体素子を製造するための方法および半導体素子を接触させるための方法
US8286340B2 (en) Method of manufacturing and warpage correcting of printed circuit board assembly
KR102015995B1 (ko) 기판 어댑터를 제조하기 위한 방법, 기판 어댑터 및 반도체 소자와 접촉시키기 위한 방법
JP2001308146A (ja) チップキャリアに半導体チップを取り付けるための装置
CN104282609A (zh) 用于装配电路载体的方法
JP5100715B2 (ja) 半導体装置及び半導体装置の製造方法
US8900926B2 (en) Chip package method
JP4325816B2 (ja) Ｉｃチップの接続方法
JP6209799B2 (ja) フリップチップ実装用チップ保持ツール及びフリップチップ実装方法
JP4045674B2 (ja) Ｉｃチップの接続方法
JP3759305B2 (ja) 導電ぺースト印刷回路へのｉｃベアチップ実装方法
JP2000216299A (ja) 半導体パッケ―ジ、半導体装置、及び半導体パッケ―ジの製造方法
JP2005159231A (ja) フリップチップボンディング装置
JP2002237548A (ja) 混成集積回路装置の製造方法
JP2012160501A (ja) 半導体製造装置、半導体製造方法及び半導体装置
JPH03286592A (ja) バーンイン試験用電子回路基板とその製造方法